CN118867633B - Phased array antenna and micro-channel heat radiation structure thereof - Google Patents
Phased array antenna and micro-channel heat radiation structure thereofInfo
- Publication number
- CN118867633B CN118867633B CN202411007769.6A CN202411007769A CN118867633B CN 118867633 B CN118867633 B CN 118867633B CN 202411007769 A CN202411007769 A CN 202411007769A CN 118867633 B CN118867633 B CN 118867633B
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- channel
- micro
- radio frequency
- cold plate
- root channel
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/02—Arrangements for de-icing; Arrangements for drying-out ; Arrangements for cooling; Arrangements for preventing corrosion
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/42—Housings not intimately mechanically associated with radiating elements, e.g. radome
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/08—Radiating ends of two-conductor microwave transmission lines, e.g. of coaxial lines, of microstrip lines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
Landscapes
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The invention relates to a phased array antenna and a micro-channel heat dissipation structure thereof, wherein the micro-channel heat dissipation structure comprises a micro-channel cold plate, a connector installation cavity, a fluid interface and a control circuit installation cavity, wherein a micro-channel network is arranged in the micro-channel cold plate, the micro-channel network comprises a main root channel and a secondary side root channel communicated with the main root channel, the main root channel is arranged along the length direction of the micro-channel cold plate, the secondary side root channel is arranged on two sides of the main root channel, the radio frequency circuit installation cavity and the control circuit installation cavity are arranged on the top surface and the bottom surface of the micro-channel cold plate and are arranged on two sides of the micro-channel network, the connector installation cavity penetrates through the top surface and the bottom surface of the micro-channel cold plate and is communicated with the radio frequency circuit installation cavity and the control circuit installation cavity, and the fluid interface is arranged on the outer side surface of the micro-channel cold plate and is communicated with the main root channel. The invention adopts a micro-channel bionic structure, can realize high-efficiency heat dissipation and heat supplementation under the condition of limited space while meeting the requirement of the temperature uniformity of the array surface multi-chip of the antenna, and meets the requirement of the electrical performance of the phased array antenna.
Description
Technical Field
The invention relates to the technical field of microwave emission, in particular to a phased array antenna and a micro-channel heat dissipation structure thereof.
Background
Current 5G communications and satellite internet communications are evolving rapidly, with unprecedented tremendous advances in millimeter wave active phased array antennas. The tile type phased array antenna adopts parallel layout of the high-integration chip and the antenna array surface, has the characteristics of low section, light weight, easy integration and conformal of a load platform and the like, and is widely applied to application scenes such as satellite communication terminals, 5G antennas and the like. Meanwhile, the transceiver chip and various circuits have extremely high density, so that the temperature of the antenna array surface is increased sharply, and the electrical performance of the antenna is affected.
Phased array antennas employ a stacked tile-type overall architecture that becomes very sensitive to structural configuration, thermal distortion and temperature drift resulting in reduced antenna electrical performance. In addition, when the antenna is in a working space environment, the space size and the thermal control condition of the antenna are extremely limited due to the high heat flux density of the array surface and the vacuum heat dissipation environment, and the problems of heat preservation of the antenna and the control of the local high heat flux of the array surface of the antenna and the consistency of the temperature of multiple chips in a large-temperature-range cold-hot alternating environment, a satellite limited thermal control space and a thermal control condition are required to be solved.
Disclosure of Invention
In order to solve the technical problems in the prior art, the invention aims to provide a phased array antenna and a micro-channel heat dissipation structure thereof, which can realize efficient heat dissipation and heat supplement under the limited space condition and meet the electrical performance requirement of the phased array antenna while meeting the temperature uniformity requirement of the array surface multi-chip of the antenna.
In order to achieve the above object, the present invention provides a micro-channel heat dissipation structure of a phased array antenna, including:
the micro-channel cold plate is internally provided with a micro-channel network, the micro-channel network comprises a main root channel and secondary side root channels communicated with the main root channel, the main root channel is arranged along the length direction of the micro-channel cold plate, and the secondary side root channels are arranged on two sides of the main root channel;
The radio frequency circuit installation cavity and the control circuit installation cavity are arranged on the top surface and the bottom surface of the micro-channel cold plate and are arranged on two sides of the micro-channel network;
the connector installation cavity penetrates through the top surface and the bottom surface of the micro-channel cold plate and is communicated with the radio frequency circuit installation cavity and the control circuit installation cavity;
And the fluid interface is arranged on the outer side surface of the micro-channel cold plate and is communicated with the main root channel.
According to one technical scheme of the invention, the main root channel comprises a first main root channel and a second main root channel which are symmetrically arranged along the length direction of the micro-channel cold plate, the diameters of the first main root channel and the second main root channel gradually decrease from one end of the first main root channel, which is communicated with the fluid interface, to one end of the second main root channel, which is close to the middle part of the micro-channel cold plate, and the first main root channel and the second main root channel are communicated through the secondary side root channel.
According to one embodiment of the present invention, the diameter of the secondary side root canal is 100 μm.
According to the technical scheme of the invention, the radio frequency circuit mounting cavity is internally provided with the radio frequency circuit mounting table and the chip mounting groove, the control circuit mounting cavity is internally provided with the control circuit mounting table and the device mounting groove, and the depth of the device mounting groove is larger than the maximum height of a device.
According to one technical scheme of the invention, the secondary side root channel comprises a transverse side root channel parallel to the length direction of the micro-channel cold plate and a longitudinal side root channel perpendicular to the transverse side root channel, and the intersection point of the transverse side root channel and the longitudinal side root channel is arranged below the chip mounting groove.
According to one aspect of the present invention, heat transfer surfaces are provided in the chip mounting groove and the device mounting groove.
According to one technical scheme of the invention, the heat transfer surface is provided with a heat conducting rubber pad.
According to an aspect of the present invention, there is provided a phased array antenna including the above-mentioned micro-channel heat dissipation structure, further comprising:
The antenna housing is arranged at the top of the micro-channel cold plate;
the radio frequency circuit is fixedly arranged in the radio frequency circuit mounting cavity;
the control circuit is fixedly arranged in the control circuit mounting cavity;
The antenna array surface is arranged at the top of the radio frequency circuit and is electrically connected with the radio frequency circuit;
The radio frequency chip and the power device are respectively fixed on the radio frequency circuit and the control circuit and are respectively electrically connected with the radio frequency circuit and the control circuit;
And the connector is arranged in the connector mounting cavity and is electrically connected with the radio frequency circuit and the control circuit.
According to one technical scheme of the invention, the radome is made of a honeycomb sandwich structure transparent material.
According to one technical scheme of the invention, the antenna array surface comprises a plurality of spliced microstrip antenna units, and the microstrip antenna units are manufactured by adopting a standard modularized borderless process.
Compared with the prior art, the invention has the following beneficial effects:
The invention provides a phased array antenna and a micro-channel heat radiation structure thereof, wherein the micro-channel heat radiation structure comprises a micro-channel cold plate, a micro-channel network consisting of a main root channel and a secondary side root channel is arranged on the micro-channel cold plate, the micro-channel network forms a two-phase fluid loop, the micro-channel structure can be designed based on the structures of plant leaf veins and root system networks, the typical characteristics of the root system structure are simulated, the main root of the root system micro-channel is transversely arranged, the secondary side root branches of the root system micro-channel are uniformly distributed below each radio frequency chip, the heat transfer and heat radiation capacity of the chip heat is enhanced, the heat is circularly and rapidly conducted out through the two-phase fluid loop, the temperature difference of an array surface is reduced, and the temperature consistency of the array surface is ensured. The invention is designed based on the structures of plant vein and root system networks, and the micro-channel cold plate can be used as an evaporator and a heater through the integrated integration with the mounting platform, thereby meeting the requirements of integration and miniaturization of the phased array antenna.
The diameter of the secondary side root channel is 100 mu m, the flowing requirement of two-phase fluid is met, the micro-channel cold plate can play the role of a radiator or a heater by changing the type of fluid medium in the micro-channel network, and the rapid heat dissipation or heat supplement under the limited space condition can be realized while the temperature uniformity of the antenna array surface multi-chip is improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required to be used in the embodiments will be briefly described below. It is apparent that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained from these drawings without inventive effort for a person of ordinary skill in the art.
Fig. 1 schematically illustrates a top structural diagram of a heat dissipating structure of a phased array antenna provided in accordance with one embodiment of the present invention;
fig. 2 schematically illustrates a bottom structural diagram of a heat dissipating structure of a phased array antenna provided in accordance with one embodiment of the present invention;
FIG. 3 schematically illustrates a schematic diagram of a chip mounting slot and a network of micro-channels provided in accordance with one embodiment of the present invention;
fig. 4 schematically shows a schematic structure of a phased array antenna provided in accordance with one embodiment of the invention.
Wherein, the correspondence between the part names and the reference numerals is as follows:
1. A microchannel cold plate; 2, a radio frequency circuit mounting table; 3, a control circuit mounting table, 4, a connector mounting cavity, 5, a fluid interface, 6, a micro-channel network, 7, a chip mounting groove, 8, a device mounting groove, 9, a heat transfer surface, 10, an antenna housing, 11, a radio frequency circuit, 12, a control circuit, 13, an antenna array surface, 14 and a radio frequency chip.
Detailed Description
The description of the embodiments of this specification should be taken in conjunction with the accompanying drawings, which are a complete description of the embodiments. In the drawings, the shape or thickness of the embodiments may be enlarged and indicated simply or conveniently. Furthermore, portions of the structures in the drawings will be described in terms of separate descriptions, and it should be noted that elements not shown or described in the drawings are in a form known to those of ordinary skill in the art.
Any references to directions and orientations in the description of the embodiments herein are for convenience only and should not be construed as limiting the scope of the invention in any way. The following description of the preferred embodiments will refer to combinations of features, which may be present alone or in combination, and the invention is not particularly limited to the preferred embodiments. The scope of the invention is defined by the claims.
As shown in fig. 1 to 3, the present invention provides a micro-channel heat dissipation structure of a phased array antenna, which is applied to the phased array antenna and comprises a micro-channel cold plate 1, a radio frequency circuit mounting cavity, a control circuit mounting cavity, a connector mounting cavity 4 and a fluid interface 5.
The micro-channel cold plate 1 is internally provided with a micro-channel network 6, the micro-channel network 6 comprises a main root channel and secondary side root channels communicated with the main root channel, the main root channel is arranged along the length direction of the micro-channel cold plate 1, the secondary side root channels are arranged on two sides of the main root channel, and the micro-channel cold plate 1 can be processed by adopting aluminum materials. The microchannel network 6 adopts the design thought of a bionic structure, simulates the typical characteristics of a root network structure, improves the dispersion degree of the fluid medium in the microchannel network 6, and further improves the heat dissipation efficiency of the microchannel cold plate 1.
The radio frequency circuit installation cavity and the control circuit installation cavity are respectively arranged on the top surface and the bottom surface of the micro-channel cold plate 1 and are respectively used for installing the radio frequency circuit 11 and the control circuit 12.
The connector installation cavity 4 penetrates through the top surface and the bottom surface of the micro-channel cold plate 1, is communicated with the radio frequency circuit installation cavity and the control circuit installation cavity, and is used for installing a connector for vertically interconnecting the radio frequency circuit 11 and the control circuit 12.
The fluid interface 5 is arranged on the outer side surface of the micro-channel cold plate 1 and is communicated with the main root channel, so as to realize exchange of two-phase fluid of the micro-channel cold plate 1.
Preferably, the primary root canal includes a first primary root canal and a second primary root canal symmetrically arranged along the length direction of the micro canal cold plate 1, and the diameters of the first primary root canal and the second primary root canal gradually decrease from the end thereof communicating with the fluid interface 5 to the end near the middle part of the micro canal cold plate 1, and the first primary root canal and the second primary root canal communicate through the secondary side root canal. The pressure distribution in the main root channel is adjusted by adjusting the shape of the main root channel, so that the influence of the difference between the internal pressures of the main root channel and the secondary side root channel on the free flow of a fluid medium in a micro-channel network is avoided, the flow efficiency of the medium in the micro-channel network is improved, and the heat dissipation effect of the heat dissipation structure is further improved.
Preferably, the radio frequency circuit installation cavity is internally provided with the radio frequency circuit installation table 2 and the chip installation groove 7, the control circuit installation cavity is internally provided with the control circuit installation table 3 and the device installation groove 8, the depth of the device installation groove 8 is larger than the maximum height of a device, and interference between the micro-channel cold plate 1 and the device on the control circuit 12 is avoided.
Preferably, the secondary side root channels include a lateral side root channel parallel to the length direction of the microchannel cold plate 1 and a longitudinal side root channel perpendicular to the lateral side root channel, and the intersection of the lateral side root channel and the longitudinal side root channel is disposed below the chip mounting groove 7.
The antenna unit radio frequency chip and the control circuit power device can generate a large amount of heat in the operation process, the micro-channel cold plate adopts a two-phase fluid loop heat control technology, wherein the micro-channel structure is formed based on the structural design of plant veins and root system networks, the typical characteristics of the root system structure are simulated, the root system micro-channel main roots are transversely arranged, two-stage side root branches of the root system micro-channels are distributed below each chip, the heat transfer and heat dissipation capacity of the chip heat is enhanced, the heat is conducted out rapidly through the circulation of the two-phase fluid loop, the temperature difference of the array surface is reduced, and the temperature consistency of the array surface is ensured.
The natural structures such as plant leaf vein and root system network have the characteristics of developed guide tissue, small water movement resistance, large absorption area and high transmission performance, have important reference significance for heat dissipation of electronic devices, and the bionic micro-channel structure designed based on the plant leaf vein and root system network can effectively improve and enhance the heat dissipation performance of the micro-channel cold plate.
Preferably, the chip mounting groove 7 and the device mounting groove 8 are internally provided with a heat transfer surface 9, and the heat transfer surface 9 is provided with a heat conducting rubber pad. The heat of the radio frequency chip 14 and the power device is transferred to the micro-channel cold plate 1 through the heat conducting rubber pads in the chip mounting groove 7 and the device mounting groove 8 respectively, so that the heat dissipation effect of the micro-channel cold plate 1 is further improved, and meanwhile, the heat conducting rubber pads can play a role in damping, and the protection of the radio frequency chip 14 and the power device is realized.
As shown in fig. 4, the present invention provides a phased array antenna, which includes a radome 11, a radio frequency circuit 11, a control circuit 12, an antenna array plane 13, a radio frequency chip 14, a power device and a connector.
The antenna housing 10 is arranged at the top of the micro-channel cold plate 1, is made of transparent materials with honeycomb sandwich structures, has good wave permeability and high strength, is resistant to high and low temperature impact, and effectively protects the antenna array surface from being damaged.
The radio frequency circuit 11 is fixedly arranged in the radio frequency circuit mounting cavity and fixedly arranged on the radio frequency circuit mounting table 2 of the heat dissipation structure.
The control circuit 12 is fixedly arranged in the control circuit mounting cavity and fixedly arranged on the control circuit mounting table 3 of the heat dissipation structure.
The antenna array 13 is disposed on top of the rf circuit 11 and electrically connected to the rf circuit 11. The antenna array surface 13 is connected to the top of the radio frequency circuit 11 through BGA solder balls, the antenna array surface 13 comprises a plurality of spliced microstrip antenna units, the microstrip antenna units are manufactured by adopting a standard modularized borderless process, and can be spliced according to practical application requirements, so that the use requirements of the antenna array surface under different use scenes are met.
The radio frequency chip 14 and the power device are respectively fixed on the radio frequency circuit 11 and the control circuit 12 and are respectively electrically connected with the radio frequency circuit 11 and the control circuit 12, and the radio frequency chip 14 and the power device can be respectively fixed with the radio frequency circuit 11 and the control circuit 12 through BGA solder ball connection.
The connector is arranged in the connector mounting cavity 4 and is electrically connected with the radio frequency circuit 11 and the control circuit 12.
According to the phased array antenna provided by the invention, the cuboid micro-channel cold plate structure is arranged as a main support, the top of the micro-channel cold plate is provided with the radio frequency circuit mounting table for mounting the radio frequency circuit, the bottom of the micro-channel cold plate is provided with the control circuit mounting table for mounting the control circuit, and the middle of the micro-channel cold plate is provided with the connector mounting cavity for mounting the radio frequency circuit and vertically interconnecting the control circuit. Fluid interfaces are provided on the sides of the microchannel cold plate, and the top and bottom portions are provided with a chip mounting cavity and a device mounting cavity. The phased array antenna radiating structure adopts a two-phase fluid loop thermal control technology of the micro-channel cold plate, wherein the micro-channel adopts a design thought of a bionic structure, is based on the structural design of plant leaf vein and root system networks, and is integrated with a satellite body integrally, so that the micro-channel cold plate is used as an evaporator and a heater, and the requirements of the temperature uniformity of the antenna array surface multi-chip are met, and meanwhile, the rapid heat radiation and heat supplement under the limited space condition are realized.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article or terminal device comprising the element.
It is finally pointed out that the above description of the preferred embodiments of the invention, it being understood that although preferred embodiments of the invention have been described, it will be obvious to those skilled in the art that, once the basic inventive concepts of the invention are known, several modifications and adaptations can be made without departing from the principles of the invention, and these modifications and adaptations are intended to be within the scope of the invention. It is therefore intended that the following claims be interpreted as including the preferred embodiment and all such alterations and modifications as fall within the scope of the embodiments of the invention.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411007769.6A CN118867633B (en) | 2024-07-25 | 2024-07-25 | Phased array antenna and micro-channel heat radiation structure thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202411007769.6A CN118867633B (en) | 2024-07-25 | 2024-07-25 | Phased array antenna and micro-channel heat radiation structure thereof |
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| CN118867633A CN118867633A (en) | 2024-10-29 |
| CN118867633B true CN118867633B (en) | 2025-08-08 |
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| CN202411007769.6A Active CN118867633B (en) | 2024-07-25 | 2024-07-25 | Phased array antenna and micro-channel heat radiation structure thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111132521A (en) * | 2020-01-08 | 2020-05-08 | 中国船舶重工集团公司第七二四研究所 | T-shaped longitudinal micro-channel cold plate with inclined channel |
| CN116387791A (en) * | 2023-03-17 | 2023-07-04 | 航天恒星科技有限公司 | Heat Dissipation Structure of Phased Array Antenna and Phased Array Antenna Using It |
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| US20100091447A1 (en) * | 2008-10-10 | 2010-04-15 | Dell Products, Lp | System and Method for Providing Liquid Cooling of Memory Devices |
| US8797741B2 (en) * | 2010-10-21 | 2014-08-05 | Raytheon Company | Maintaining thermal uniformity in micro-channel cold plates with two-phase flows |
| CN103996665B (en) * | 2014-06-09 | 2016-08-03 | 电子科技大学 | A kind of strengthening heat abstractor using pulsating flow and Bo Bi microchannel |
| CN106793689A (en) * | 2015-12-22 | 2017-05-31 | 中国电子科技集团公司第二十研究所 | A kind of high power component blindmate box body based on microchannel radiating |
| CN108598657B (en) * | 2018-04-18 | 2020-12-29 | 陕西黄河集团有限公司 | Design method and framework structure of environment control system of active phased array radar antenna |
| CN218632407U (en) * | 2022-12-09 | 2023-03-14 | 航天恒星空间技术应用有限公司 | Heat dissipation device of phased array antenna and phased array antenna |
| CN117199023A (en) * | 2023-09-06 | 2023-12-08 | 中国电子科技集团公司第十四研究所 | A phased array antenna three-dimensional parallel micro-channel cold plate and its use method |
| CN117476573A (en) * | 2023-11-13 | 2024-01-30 | 西安交通大学 | A manifold-microchannel cold plate for power chip heat dissipation and heat dissipation method |
| CN117937089A (en) * | 2023-12-25 | 2024-04-26 | 中国电子科技集团公司第十四研究所 | A three-dimensional high-efficiency cold plate for curved antenna |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111132521A (en) * | 2020-01-08 | 2020-05-08 | 中国船舶重工集团公司第七二四研究所 | T-shaped longitudinal micro-channel cold plate with inclined channel |
| CN116387791A (en) * | 2023-03-17 | 2023-07-04 | 航天恒星科技有限公司 | Heat Dissipation Structure of Phased Array Antenna and Phased Array Antenna Using It |
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| CN118867633A (en) | 2024-10-29 |
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