CN118970423B - Millimeter wave packaged antenna array - Google Patents
Millimeter wave packaged antenna array Download PDFInfo
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- CN118970423B CN118970423B CN202411455265.0A CN202411455265A CN118970423B CN 118970423 B CN118970423 B CN 118970423B CN 202411455265 A CN202411455265 A CN 202411455265A CN 118970423 B CN118970423 B CN 118970423B
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- transmission line
- rectangular
- waveguide
- antenna array
- bare chip
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- 230000005540 biological transmission Effects 0.000 claims abstract description 102
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 230000005855 radiation Effects 0.000 claims abstract description 14
- 238000004806 packaging method and process Methods 0.000 claims abstract description 9
- 238000001465 metallisation Methods 0.000 claims abstract description 8
- 239000002184 metal Substances 0.000 claims description 6
- 230000007704 transition Effects 0.000 claims description 6
- 239000005022 packaging material Substances 0.000 claims description 2
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 4
- 230000010354 integration Effects 0.000 description 3
- 238000003754 machining Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000001627 detrimental effect Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
- H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
- H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/27—Adaptation for use in or on movable bodies
- H01Q1/32—Adaptation for use in or on road or rail vehicles
- H01Q1/3208—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used
- H01Q1/3233—Adaptation for use in or on road or rail vehicles characterised by the application wherein the antenna is used particular used as part of a sensor or in a security system, e.g. for automotive radar, navigation systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/02—Waveguide horns
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/0006—Particular feeding systems
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/064—Two dimensional planar arrays using horn or slot aerials
Landscapes
- Engineering & Computer Science (AREA)
- Computer Security & Cryptography (AREA)
- Radar, Positioning & Navigation (AREA)
- Remote Sensing (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
- Waveguide Aerials (AREA)
Abstract
本发明公开了天线领域的一种毫米波封装天线阵列，包括裸芯片引脚结构、印制电路板、波导传输线结构和矩形喇叭天线阵列，矩形喇叭天线阵列位于裸芯片正上方，印制电路板上设有连接裸芯片引脚结构和波导传输线结构的扩展传输线，扩展传输线包括共面波导CPW传输线段、基片集成波导SIW传输线段和矩形波导传输接口。该天线阵列采用2P2M封装和塑料金属化加工工艺，使裸芯片和天线一体化集成，传输路径短，实现了较高的传输效率和较低的功耗；该天线采用Z形矩形波导馈电，使得天线位于芯片的正上方，减小了天线在封装中的占比面积；该天线具有稳定的匹配与辐射性能，裸芯片与天线的一体化设计为毫米波车载雷达等应用提供了便捷。
The present invention discloses a millimeter wave packaged antenna array in the field of antennas, including a bare chip pin structure, a printed circuit board, a waveguide transmission line structure and a rectangular horn antenna array, wherein the rectangular horn antenna array is located directly above the bare chip, and an extended transmission line connecting the bare chip pin structure and the waveguide transmission line structure is provided on the printed circuit board, wherein the extended transmission line includes a coplanar waveguide CPW transmission line segment, a substrate integrated waveguide SIW transmission line segment and a rectangular waveguide transmission interface. The antenna array adopts 2P2M packaging and plastic metallization processing technology to integrate the bare chip and the antenna in an integrated manner, with a short transmission path, thus achieving higher transmission efficiency and lower power consumption; the antenna adopts Z-shaped rectangular waveguide feeding, so that the antenna is located directly above the chip, reducing the area occupied by the antenna in the package; the antenna has stable matching and radiation performance, and the integrated design of the bare chip and the antenna provides convenience for applications such as millimeter wave vehicle-mounted radar.
Description
Technical Field
The invention relates to the technical field of antennas, in particular to a millimeter wave packaging antenna array.
Background
The transmission and reception of conventional radar sensors is typically implemented on a PCB board, but to achieve high antenna performance, high frequency substrate materials, such as RO3003 from Rogers, are required, which requires antenna and chip integration designs, which are detrimental to antenna and chip widespread use. With the continuous development of millimeter wave technology, the integrated package of the antenna and the chip can reduce the size of the antenna and the chip, improve the overall efficiency, reduce the transmission loss, and is particularly convenient for the common application. Further, since the path from the chip to the antenna is shorter, higher transmission efficiency and lower power consumption can be achieved. Millimeter wave antennas are limited by machining accuracy and are prone to machining errors. The antenna and bare chip integrated antenna array provided by the invention has stable radiation performance and engineering application value.
Disclosure of Invention
The invention aims to provide a millimeter wave packaging antenna array, which solves the problems of low transmission efficiency and high power consumption of the traditional antenna and improves the stability of radiation performance.
The invention realizes the above purpose through the following technical scheme:
The millimeter wave package antenna array comprises a bare chip pin structure, a printed circuit board, a waveguide transmission line structure and a rectangular horn antenna array fed by the waveguide transmission line structure, wherein the rectangular horn antenna array is positioned right above the bare chip, an extension transmission line for connecting the bare chip pin structure and the waveguide transmission line structure is arranged on the printed circuit board, and the extension transmission line comprises a coplanar waveguide CPW transmission line section, a substrate integrated waveguide SIW transmission line section and a rectangular waveguide transmission interface which are sequentially connected.
The chip package of the printed circuit board adopts a 2P2M package structure, the 2P2M package structure comprises a first PI layer, an RDL layer and a second PI layer which are sequentially arranged from top to bottom, the bare chip pin structure is positioned above the printed circuit board, the bare chip pin structure is connected to the RDL layer through a metallized via hole of the first PI layer, the RDL layer is used as an expansion transmission line wiring layer, and the middle medium layer and the lower layer of the printed circuit board are respectively a second PI layer and a bottom metal layer.
The rectangular horn antenna array is further improved in that N antenna units are arranged in the rectangular horn antenna array, N is a positive integer, corresponding N bare chip pin structures are in one-to-one correspondence, N substrate integrated waveguide SIW transmission line segments are connected through N coplanar waveguide CPW transmission line segments, N rectangular waveguide transmission interfaces are connected through the N coplanar waveguide CPW transmission line segments, the lower parts of the N rectangular waveguide transmission line structures are connected with the rectangular waveguide transmission interfaces, and the upper parts of the N rectangular waveguide transmission line structures serve as feed ends of the rectangular horn antenna array.
The rectangular horn antenna array is composed of third-order rectangular horn antennas, the steps of the horn antennas are gradually expanded from bottom to top, and the horn antenna opening surfaces are alternately distributed in a sawtooth shape.
The waveguide transmission line structure and the rectangular horn antenna array are integrally formed by adopting the same plastic package material, and are subjected to surface metallization treatment.
The waveguide transmission line structure is a double-right-angle bent Z-shaped structure, and transition steps are arranged on the outer sides of right-angle bent parts.
The rectangular waveguide transmission interface is further improved in that the rectangular waveguide transmission interface is composed of a rectangular back cavity formed by surrounding a plurality of metallized through holes, a rectangular radiation port positioned in the rectangular back cavity and a rectangular patch positioned in the rectangular radiation port, and a notch is reserved on one side of the rectangular back cavity, which is close to a substrate integrated waveguide SIW transmission line section.
The millimeter wave package antenna array has the advantages that the processing technology of 2P2M package and plastic metallization is adopted, different transitional designs are adopted to integrate a bare chip and an antenna, a transmission path from a pin structure of the bare chip to the antenna is short, high transmission efficiency and low power consumption can be achieved, the antenna adopts Z-shaped rectangular waveguide feed, two 90-degree conversion is achieved through two steps, the antenna is located right above the bare chip, and the occupied area of the antenna in package is reduced. The millimeter wave packaging antenna has stable matching and radiation performance, and the integrated design of the bare chip and the antenna provides convenience for applications such as millimeter wave vehicle-mounted radars.
Drawings
Fig. 1 is a structural exploded perspective view of a millimeter wave package antenna array;
fig. 2 is a package stack side view of a millimeter wave package antenna array;
fig. 3 is a partial schematic diagram of an extended transmission line of a millimeter wave packaged antenna array;
fig. 4 is a side view of an antenna array of a millimeter wave package antenna array;
FIG. 5 is a standing wave diagram of four horns in a structure according to an embodiment of the present invention;
fig. 6 is a gain diagram of an antenna unit at 76GHz in the structure of an embodiment of the present invention;
fig. 7 is a gain diagram of an antenna unit at 78GHz in the structure of an embodiment of the present invention;
fig. 8 is a gain diagram of an antenna unit at 80GHz in the structure of an embodiment of the present invention;
In the figure, a bare chip pin structure, a printed circuit board, a waveguide transmission line structure, a rectangular horn antenna array, a coplanar waveguide CPW transmission line segment, a substrate integrated waveguide SIW transmission line segment, a rectangular waveguide transmission interface, a first PI layer, a RDL layer, a second PI layer, a metallization via hole, a bottom metal layer, a 13, a rectangular back cavity, a 14, a rectangular radiation port, a 15, a rectangular patch, a 16 and a transition step are arranged, wherein the first PI layer, the RDL layer, the 10, the second PI layer, the 11, the metallization via hole, the 12, the bottom metal layer, the 13, the rectangular back cavity, the 14, the rectangular radiation port, the 15, the rectangular patch and the 16.
Detailed Description
The present application will be described in further detail with reference to the accompanying drawings, wherein it is to be understood that the following detailed description is for the purpose of further illustrating the application only and is not to be construed as limiting the scope of the application, as various insubstantial modifications and adaptations of the application to those skilled in the art can be made in light of the foregoing disclosure.
Referring to fig. 1-4, a millimeter wave package antenna array includes a bare chip pin structure 1, a printed circuit board 2, a waveguide transmission line structure 3, and a rectangular horn antenna array 4 fed by the waveguide transmission line structure 3, the rectangular horn antenna array 4 is located right above the bare chip, an extended transmission line connecting the bare chip pin structure 1 and the waveguide transmission line structure 3 is disposed on the printed circuit board 2, and the extended transmission line includes a coplanar waveguide CPW transmission line segment 5 (Coplanar waveguide), a substrate integrated waveguide SIW transmission line segment 6 (Substrate integrated waveguide), and a rectangular waveguide transmission interface 7 which are sequentially connected.
Preferably, in the present invention, the chip package of the printed circuit board 2 adopts a 2P2M package structure (i.e. two passivation layers and two metal layers), the 2P2M package structure includes a first PI layer 8 (i.e. a dielectric insulation layer), an RDL layer 9 (i.e. a rewiring layer) and a second PI layer 10 sequentially disposed from top to bottom, the bare chip pin structure 1 is located above the printed circuit board 2, the bare chip pin structure 1 is connected to the RDL layer 9 through a metallized via 11 of the first PI layer 8, the RDL layer 9 is used as an extended transmission line wiring layer, and the middle dielectric layer and the lower layer of the printed circuit board 2 are respectively a second PI layer 10 and a bottom metal layer 12.
Preferably, in the present invention, N antenna units are provided in the rectangular horn antenna array 4, N is a positive integer, the number of N bare chip pin structures 1 may be increased or decreased, the corresponding N bare chip pin structures are correspondingly connected to N base chip integrated waveguide SIW transmission line segments 6 through N coplanar waveguide CPW transmission line segments 5, and then connected to N rectangular waveguide transmission interfaces 7, the lower part of the waveguide transmission line structure 3 is connected to the rectangular waveguide transmission interface 7, and the upper part of the waveguide transmission line structure is used as a feed end of the rectangular horn antenna array 4.
Preferably, in the present invention, the rectangular horn antenna array 4 is composed of third-order rectangular horn antennas, and the steps of the horn antennas are gradually enlarged from bottom to top, and the horn antenna mouth surfaces are alternately distributed in a zigzag manner.
Preferably, the waveguide transmission line structure 3 and the rectangular horn antenna array 4 are integrally formed by the same plastic package material, and are subjected to surface metallization treatment.
Preferably, the waveguide transmission line structure 3 in the present invention adopts a double-right-angle bent Z-shaped structure, and transition steps 16 are disposed outside the right-angle bent portions. The Z-shaped structure enables the vertically-propagating feed waveguide to be transited to horizontal propagation through the two steps, and then the vertically-propagating feed waveguide is transited to the vertical propagation through the two steps, so that the position of the antenna is located right above the chip.
Preferably, the rectangular waveguide transmission interface 7 in the present invention is formed by a rectangular back cavity 13 surrounded by a plurality of metallized vias, a rectangular radiation port 14 located inside the rectangular back cavity 13, and a rectangular patch 15 located inside the rectangular radiation port 14, where a gap is left on one side of the rectangular back cavity 13 near the substrate integrated waveguide SIW transmission line segment 6.
The following provides a specific embodiment structure:
The embodiment provides a millimeter wave packaging antenna array working at 73-82GHz, which comprises a bare chip pin structure 1, a printed circuit board 2, a waveguide transmission line structure 3 and a third-order rectangular horn antenna array 4 positioned above the bare chip, wherein an extended transmission line positioned on the printed circuit board 2 is connected with the bare chip pin structure 1 and the waveguide transmission line structure 3, and the extended transmission line on the printed circuit board 2 comprises a coplanar waveguide CPW transmission line segment 5, a substrate integrated waveguide SIW transmission line segment 6 and a rectangular waveguide transmission interface 7.
The antenna array is provided with four third-order rectangular horn antenna units, and correspondingly, one end of each of four coplanar waveguide CPW transmission line segments 5 is connected with four bare chip pin structures 1, and the other end of each of the four coplanar waveguide CPW transmission line segments is converted into a substrate integrated waveguide SIW transmission line segment 6 and then further converted into a rectangular waveguide transmission interface 7. The line width of the coplanar waveguide CPW transmission line section 5 is 0.07mm, the gap is 0.026mm, and the width of the substrate integrated waveguide SIW transmission line 6 is 1.6mm. The waveguide transmission line structure 3 and the third-order rectangular horn antenna array 4 are integrally formed by adopting the same plastic package material, the lower part of the waveguide transmission line structure 3 is connected to a rectangular waveguide transmission interface 7 positioned on the printed circuit board 2, the other end of the waveguide transmission line structure is used as a feed end of the third-order rectangular horn antenna array 4, and the size of the waveguide transmission line structure 3 is 2.4mm multiplied by 1.2mm. The rectangular waveguide transmission interface 7 is composed of a rectangular back cavity 13 surrounded by a plurality of metallized through holes, a rectangular radiation port 14 with the thickness of 1.914mm multiplied by 1.073mm and a rectangular patch 15 with the thickness of 1.067mm multiplied by 0.915mm inside the rectangular back cavity. A gap is reserved on one side of the rectangular back cavity 13 surrounded by the metallized through holes, which is close to the SIW transmission line section 6.
The waveguide transmission line structure 3 is a Z-shaped rectangular wave band transmission structure, and a transition step 16 is arranged at a right angle turning part, the transition step 16 is a second-order step, and the step heights are 0.49mm and 0.4mm from top to bottom in sequence. The steps of the third-order rectangular horn antenna unit are gradually enlarged from bottom to top, the sizes of the third-order rectangular horn antenna unit are sequentially 2.4mm multiplied by 1.2mm,3.4mm multiplied by 1.8mm,3.8mm multiplied by 2.5mm, the heights of adjacent steps are all 0.5mm, the horn antenna port surfaces are alternately distributed in a saw-tooth shape, the horizontal distance of the adjacent units is 4mm, and the vertical distance of the adjacent units is 3mm. The waveguide transmission line structure 3 and the third-order rectangular horn antenna unit are integrally processed by plastic packaging materials, and the surfaces of the waveguide transmission line structure 3 and the rectangular horn antenna unit are subjected to metallization treatment.
The millimeter wave packaging antenna array in the embodiment realizes the integrated integration of the bare chip and the antenna. Through simulation calculation, standing waves of the antenna units are shown as fig. 5, the standing waves of the four antenna units are smaller than 2 in 73-82GHz, gain diagrams of the antenna units at 76, 78 and 80GHz are shown as fig. 6-8 in sequence, and peak gains are larger than 8.5dBi.
In summary, the millimeter wave package antenna array of the embodiment adopts the integrated integration of the bare chip and the antenna array, the antenna array is positioned right above the chip, the package area is reduced, the antenna adopts a third-order horn antenna, the units adopt a saw-tooth array mode, the working bandwidth of the antenna reaches 73-82GHz, the stable matching and radiation performance are achieved, and the integrated design of the bare chip and the antenna provides convenience for the application of millimeter wave vehicle-mounted radars and the like.
The foregoing examples illustrate only a few embodiments of the invention and are described in detail herein without thereby limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411455265.0A CN118970423B (en) | 2024-10-18 | 2024-10-18 | Millimeter wave packaged antenna array |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411455265.0A CN118970423B (en) | 2024-10-18 | 2024-10-18 | Millimeter wave packaged antenna array |
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| CN118970423A CN118970423A (en) | 2024-11-15 |
| CN118970423B true CN118970423B (en) | 2024-12-31 |
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| CN202411455265.0A Active CN118970423B (en) | 2024-10-18 | 2024-10-18 | Millimeter wave packaged antenna array |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103762416A (en) * | 2014-02-25 | 2014-04-30 | 中国工程物理研究院电子工程研究所 | Terahertz wave chip-mounted-waveguide-loudspeaker conversion antenna |
| CN115332766A (en) * | 2022-08-03 | 2022-11-11 | 安徽大学 | Millimeter wave radar phased array antenna |
| CN116053763A (en) * | 2023-02-06 | 2023-05-02 | 中国科学院空天信息创新研究院 | A 77GHz single-layer microstrip-fed pyramid horn antenna |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8256685B2 (en) * | 2009-06-30 | 2012-09-04 | International Business Machines Corporation | Compact millimeter wave packages with integrated antennas |
| US10109604B2 (en) * | 2015-03-30 | 2018-10-23 | Sony Corporation | Package with embedded electronic components and a waveguide cavity through the package cover, antenna apparatus including package, and method of manufacturing the same |
| CN113328264A (en) * | 2021-06-18 | 2021-08-31 | 盛纬伦(深圳)通信技术有限公司 | Planar integrated array antenna |
| CN113823901A (en) * | 2021-09-27 | 2021-12-21 | 南京濠暻通讯科技有限公司 | An integrated integrated antenna device applied to 5G micro base station |
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2024
- 2024-10-18 CN CN202411455265.0A patent/CN118970423B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103762416A (en) * | 2014-02-25 | 2014-04-30 | 中国工程物理研究院电子工程研究所 | Terahertz wave chip-mounted-waveguide-loudspeaker conversion antenna |
| CN115332766A (en) * | 2022-08-03 | 2022-11-11 | 安徽大学 | Millimeter wave radar phased array antenna |
| CN116053763A (en) * | 2023-02-06 | 2023-05-02 | 中国科学院空天信息创新研究院 | A 77GHz single-layer microstrip-fed pyramid horn antenna |
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