CN118973115A - A product design method for wafer device - Google Patents

Abstract

The invention provides a product design method of a wafer device, which relates to the technical field of chip packaging, and comprises the following steps: acquiring specification information of a wafer device and a printed circuit board; determining a bonding area of the wafer device on the printed circuit board according to the specification information; fixing the wafer device at the central position of the bonding area, and conducting wire bonding on the wafer device and the printed circuit board to obtain the bonded printed circuit board; and carrying out electric packaging treatment on the bonded printed circuit board to obtain the packaged printed circuit board. The scheme provided by the invention can improve the yield of the products of the wafer devices in the production and manufacturing process, so as to reduce the failure rate of the chip products, improve the quality of the chip packaging products and reduce the cost of sealing and testing the wafers in the development stage.

Description

A product design method for wafer device

Technical Field

The present invention relates to the technical field of chip packaging, and in particular to a product design method for a wafer device.

Background Art

The chip design and manufacturing process includes hardware design, physical design, wafer manufacturing, packaging and testing process, chip protection, finished product testing, etc. As far as the entire production process is concerned, each process will mean huge personnel investment and financial expenditure. In this context, a new set of process flows has been developed, namely hardware design, physical design, wafer manufacturing, packaging and testing process (wire bonding process), chip protection, and finished product testing. After changing the process route, it saves companies huge expenses in chip design and research and development.

However, although the above process is theoretically feasible, the packaging and testing process in the actual manufacturing process faces the risk of yield rate; in addition, the chip produced by the packaging and testing process in this process is a wafer, which is directly bonded to the printed circuit board through wire bonding, and then protected by other means. For most PCB design engineers and most companies, if they do not understand the production process of products that require wire bonding, it may cause the production equipment to fail to produce normally in the PCB wire bonding process or fail to produce normally in the PCBA electrical assembly process, resulting in the risk of semi-finished products or raw materials being scrapped.

In addition, there is the issue of how to protect the wires after they are bonded in the process. To address this issue, the bonded wafers may be accidentally touched during production and use, which may cause the gold wires to break and fail to meet the expected functions and performance. Moreover, for PCBAs where the wafers are optical devices, the light transmittance issue also needs to be resolved in terms of raw materials.

Therefore, for optical devices, the design and protection of printed circuit board optical devices are the main factors that directly determine the product yield rate. The present invention conducts research on this in the hope of improving the yield rate in the production process.

Summary of the invention

The technical problem to be solved by the present invention is to provide a product design method for wafer devices, improve the yield rate in the production process, reduce the failure rate of chip products, improve the quality of chip packaging products, and reduce the cost of wafer packaging and testing in the development stage.

In order to solve the above technical problems, an embodiment of the present invention provides a product design method for a wafer device, comprising:

Obtain specification information of wafer devices and printed circuit boards;

Determining a bonding area of the wafer device on the printed circuit board according to the specification information;

Fixing the wafer device at the center position of the bonding area, and performing wire bonding on the wafer device and the printed circuit board to obtain a bonded printed circuit board;

The bonded printed circuit board is subjected to electrical processing to obtain a packaged printed circuit board.

Optionally, obtain a printed circuit board, including:

The surface of a preset printed circuit board is plated by a coating process to obtain the plated printed circuit board.

Optionally, coating the surface of a preset printed circuit board by a coating process to obtain the coated printed circuit board, comprising:

According to the order of nickel plating, palladium plating and gold plating, nickel plating, palladium plating and gold plating are performed on the surface of the preset printed circuit board in turn to obtain the printed circuit board after the coating treatment.

Optionally, the specification information includes: wafer size information of the wafer device and wafer pad information of the wafer device.

Optionally, determining a bonding area of the wafer device on the printed circuit board according to the specification information includes:

Determining the size information of the bonding area according to the size information of the wafer device;

The bonding pad information on the bonding area is determined according to the wafer pad information on the wafer device.

Optionally, determining the bonding pad information on the bonding area according to the wafer pad information on the wafer device includes:

Determining a second number of bonding pads on the bonding area according to a first number of wafer pads on the wafer device;

Determining a second distribution position of each bonding pad on the bonding area according to the first distribution position of each wafer pad on the wafer device; the bonding pads on the bonding area correspond one-to-one to the wafer pads on the wafer device;

The size of each bonding pad on the bonding area and the second distance between two adjacent bonding pads are determined according to the size of each wafer pad on the wafer device and the first distance between two adjacent wafer pads.

Optionally, the wafer device is fixed at the center of the bonding area, and the wafer device and the printed circuit board are wire-bonded to obtain a bonded printed circuit board, including:

Using non-conductive glue to fix the wafer device at the center of the bonding area;

The bonding pads on the bonding area are connected to the wafer pads corresponding to the wafer device by gold wires through bonding equipment to obtain the bonded printed circuit board.

Optionally, after obtaining the bonded printed circuit board, the method further includes:

A protective material is installed on the bonding area of the printed circuit board after bonding to obtain a printed circuit board after protection treatment.

Optionally, installing a protective material on the bonding area of the printed circuit board after bonding to obtain a printed circuit board after protection treatment, comprising:

According to the bonding area, the size of the protection area on the printed circuit board is determined, wherein the protection area is arranged outside the bonding area, and the area of the protection area is larger than the area of the bonding area;

Installing a protection frame on the protection area;

Protective material is installed in the protective frame to obtain the printed circuit board after protection treatment.

Optionally, installing protective materials in the protective frame includes:

For common wafer devices, epoxy resin glue is used to fill the area in the protection frame until the connecting gold wires between the common wafer device and the printed circuit board are completely covered;

For optical wafer devices, high-transmittance glass is installed on the protection frame to cover the optical wafer devices.

The above solution of the present invention includes at least the following beneficial effects:

1. According to the wafer device size and wafer pad, determine the bonding area of the printed circuit board and the bonding pad on the bonding area, so as to avoid in advance the situation where the printed circuit board assembled by PCBA is scrapped or cannot meet the expected functions and performance due to incomplete design considerations from the perspective of PCB printed circuit board design, effectively shorten the R&D cycle, improve product quality, reduce the cost of wafer packaging and testing in the development stage, and reduce R&D cost investment.

2. Strictly follow the order of coating, wire bonding and electrical assembly to optimize the packaging process and prevent semi-finished products or raw materials from being unable to be processed and produced due to unclear or disordered product packaging.

3. When designing PCB printed circuit boards, fully consider the protection plan of wafer devices to ensure that the gold wire will not break due to abnormal reasons after the PCB printed circuit board leads are bonded, effectively improving the yield rate of the printed circuit boards assembled by PCBA; and select protective materials according to the type of wafer devices to avoid the failure to achieve the expected functions and performance due to improper selection of protective materials.

It should be understood that the implementation of any embodiment of the present invention does not mean that multiple or all of the above-mentioned beneficial effects must be possessed or achieved at the same time.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment in size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

FIG1 is a flow chart of a product design method for a wafer device provided by an embodiment of the present invention;

FIG2 is a schematic structural diagram of a wafer device provided by an optional embodiment of the present invention;

3 is a schematic diagram of the distribution of bonding areas and bonding pads on the bonding areas on a printed circuit board corresponding to the wafer device in FIG. 2 provided by an optional embodiment of the present invention;

4 is a schematic diagram of the distribution of protection frames of wafer devices, bonding areas and protection areas on a printed circuit board provided by an optional embodiment of the present invention;

5 is a schematic diagram of bonding a wafer device to a printed circuit board according to an optional embodiment of the present invention;

FIG6 is a schematic diagram of installing a protective frame on a printed circuit board after bonding according to an optional embodiment of the present invention;

FIG7 is a schematic diagram showing the installation of protective materials on the protective frame in FIG6;

FIG8 is a schematic diagram of epoxy resin glue installed on a protective frame according to an optional embodiment of the present invention;

FIG. 9 is a schematic diagram of a protective frame after high-transmittance glass is installed according to an optional embodiment of the present invention.

Description of Figure Numbers:

10. Wafer devices;

1. Wafer pad; 2. Bonding area boundary; 3. Bonding pad; 4. Protective frame.

DETAILED DESCRIPTION

The exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the exemplary embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to enable a more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art.

It should be understood that the terms "include/comprise", "consist of..." or any other variations are intended to cover non-exclusive inclusion, so that a product, device, process or method that includes a series of elements includes not only those elements, but also may include other elements not explicitly listed when necessary, or also includes elements inherent to such product, device, process or method. In the absence of more restrictions, the elements defined by the sentence "include/comprise...", "consist of..." do not exclude the presence of other identical elements in the product, device, process or method that includes the elements.

In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

Glossary:

Wafer: A silicon chip used to make silicon semiconductor circuits;

PCB: printed circuit board;

PCBA: Assembled printed circuit board.

In view of the objective and real problems in the existing work mentioned in the background technology, the present invention considers and makes targeted improvements and designs from the following aspects:

(1) PCB design for wafer devices:

For most PCB design engineers and most companies, the wire bonding and protection process of wafers is something they have never come into contact with. If they are not investigated or have no rich design experience, the PCBA will be scrapped and the expected function or performance will not be achieved.

(2) PCBA manufacturing process with wafer device wire bonding process:

Based on the background that most PCB design engineers and most companies do not understand the wire bonding and protection process of wafers, if they do not understand the production process of products that require wire bonding, it may cause the production equipment to fail to produce normally in the PCB wire bonding process, or fail to produce normally in the PCBA electrical assembly process. After the PCB electrical assembly is completed, it cannot be installed on the COB machine for wire bonding, resulting in the risk of semi-finished products or raw materials being scrapped.

(3) For printed circuit boards with optical devices, protection scheme after wire bonding:

There is a fatal flaw in the new process engineering, which is how to protect the wires even after bonding. In order to solve this problem, the bonded wafers may be accidentally touched during production and use, which may cause the gold wires to break and fail to meet the expected functions and performance. Moreover, for PCBAs where the wafers are optical devices, the light transmittance problem needs to be solved in terms of raw materials.

In view of this, an embodiment of the present invention provides a product design method for a wafer device, comprising:

Step 11, obtaining specification information of wafer devices and printed circuit boards;

Step 12, determining the bonding area of the wafer device on the printed circuit board according to the specification information;

Step 13, fixing the wafer device at the center position of the bonding area, and performing wire bonding on the wafer device and the printed circuit board to obtain a bonded printed circuit board;

Step 14, performing electrical processing on the bonded printed circuit board to obtain a packaged printed circuit board.

In this embodiment, since the specification information of different wafer devices is different, the requirements for wire bonding different wafer devices to the printed circuit board are also different; the accurate bonding area on the printed circuit board can be determined by the specification information corresponding to different wafer devices, and then the wafer device is wire bonded to the corresponding bonding area on the printed circuit board to avoid the problems of high process difficulty and low accuracy caused by blind wire bonding, thereby improving the packaging efficiency and quality of the wafer device;

Here, the wafer device and the printed circuit board can be wire-bonded through bonding equipment, and then the bonded printed circuit board can be electrically installed to ensure that there is no interference from other components during the wire bonding process; at the same time, it can be ensured that the printed circuit board can adapt to all types of bonding equipment during the wire bonding process, thereby effectively reducing the manufacturing risk of wafer device products.

In an optional embodiment of the present invention, obtaining the printed circuit board in step 11 may include:

Step 111, coating the surface of a preset printed circuit board through a coating process to obtain a printed circuit board.

In this embodiment, a coating process is performed on the surface of a pre-prepared preset printed circuit board to reduce the difficulty of a subsequent wire bonding process and improve the quality and reliability of the wire bonding product.

Specifically, the above step 111 may include:

Step 1111, in the order of nickel plating, palladium plating and gold plating, nickel plating, palladium plating and gold plating are performed on the surface of a preset printed circuit board to obtain a printed circuit board.

In this embodiment, the nickel-palladium-gold plating process on the surface of a preset printed circuit board needs to be performed on the preset printed circuit board in the order of first nickel plating, then palladium plating and finally gold plating; the printed circuit board obtained after plating has excellent corrosion resistance, hardness and wear resistance, and can fully ensure that the function and performance of the printed circuit board after wire bonding obtained after the wire bonding is completed do not change, so as to ensure the quality and function of the printed circuit board after the final package.

In addition, before packaging begins, the prepared preset printed circuit board is plated using a nickel-palladium-gold plating process to avoid in advance the situation where the final packaged product is scrapped or fails to achieve the expected functions and performance due to incomplete considerations from the perspective of preparing the printed circuit board; at the same time, it also reduces the difficulty of subsequent wire bonding and improves the quality and reliability of the final packaged product.

In an optional embodiment of the present invention, the specification information of the wafer device may include wafer size information and wafer pad information of the wafer device.

Here, the size information of the wafer device specifically refers to the area size of the wafer device, and the wafer pad information of the wafer device specifically refers to the number, size, spacing and distribution of the pads on the wafer device.

Further, determining the bonding area of the wafer device on the printed circuit board according to the specification information of the wafer device may include:

Step 121, determining the size information of the bonding area according to the size information of the wafer device;

Step 122, determining bonding pad information on the bonding area according to wafer pad information on the wafer device.

In this embodiment, the size information of the bonding area represents the area size of the bonding area, the shape of the bonding area is the same as or similar to the shape of the wafer device, and the size information of the bonding area is larger than the size information of the wafer device (here, the specific value of the area size of the bonding area can be set according to the requirements of actual operation, the size of the printed circuit board and the area size of the wafer device, as long as the area size of the bonding area is larger than the area size of the wafer device), so that the entire wafer device can be completely placed in the bonding area during wire bonding (when packaging, the boundary of the bonding area is located at the periphery of the wafer device); further, the relevant information of the bonding pad on the bonding area can be determined based on the relevant information of the wafer pad to ensure the accuracy of subsequent wire bonding, thereby ensuring the quality and performance of the packaged product.

In an optional embodiment of the present invention, the above step 122 may include:

Step 1221, determining a second number of bonding pads on the bonding area according to a first number of wafer pads on the wafer device;

Step 1222, determining a second distribution position of each bonding pad on the bonding area according to the first distribution position of each wafer pad on the wafer device, wherein the bonding pads on the bonding area correspond one-to-one to the wafer pads on the wafer device;

Step 1223, determining the size of each bonding pad on the bonding area and the second spacing between two adjacent bonding pads according to the size of each wafer pad on the wafer device and the first spacing between two adjacent wafer pads.

In this embodiment, since the wafer pads are welding points of the pins at the corresponding positions on the wafer device (if it is determined that the pins on the wafer device have no function in actual application, the pins may not be used as pads), the first number of wafer pads and the second number of bonding pads should be the same;

Since the arrangement of wafer pads on wafer devices of different specifications or different forms is different, in order to ensure the functional performance of the product after wire bonding, the second division position of the bonding pad on the bonding area should be one-to-one corresponding to the first distribution position of the wafer pad; at the same time, in order to ensure the accuracy of wire bonding and the quality of the product after wire bonding, the size of the bonding pad should be slightly larger than the size of the corresponding wafer pad, and the second spacing between two adjacent bonding pads should also be slightly larger than the first spacing between two adjacent wafer pads; preferably, the distance between the bonding pad and the corresponding wafer pad can be set according to the distance between the wafer pads, and the smaller the distance between the wafer pads, the larger the distance between the bonding pad and the corresponding wafer pad; in an achievable example of the present invention, the distance between the bonding pad and the corresponding wafer pad can be set to 2mm.

It should be noted that if the wafer device is round or square, the corresponding spacing sizes are the same; for the case where the wafer device is rectangular as shown in the figure, the spacing sizes are different. At this time, if the wafer pad spacing sizes are individually inconsistent, the bonding pads do not need to be adjusted. If the difference in wafer pad spacing sizes is too large, for example, more than 20%, it is necessary to synchronize the bonding pads according to the wafer pads.

As shown in FIG2, the size information of the wafer device is 5.4 mm × 7 mm, the number of wafer pads is 124 pins, the distance between two adjacent wafer pads is 140 um, the size of the wafer pad is 80 um × 80 um, and the wafer pads are distributed all around. As an example, the number of bonding pads on the bonding area of the PCB printed circuit board should also be 124 pins, the distance between two adjacent bonding pads is 200 um (8 mil), and the size of the bonding pad is 101.6 um × 266.7 um (which can be determined based on the conventional manufacturing process accuracy in the industry). Accordingly, when designing the bonding pads on the bonding area of the PCB printed circuit board, they should also be distributed all around, and try to ensure that the direction of the bonding pads on the bonding area is consistent with the direction of the wafer pads. The corresponding distribution of the bonding pads on the bonding area of the PCB printed circuit board is shown in FIG3.

In an optional embodiment of the present invention, the above step 13 may include:

Step 131, using non-conductive adhesive to fix the wafer device at the center of the bonding area;

Step 132, using a bonding device to connect the bonding pads on the bonding area to the wafer pads corresponding to the wafer device with gold wires to obtain a bonded printed circuit board.

In this embodiment, after the bonding area and the corresponding bonding pad are determined, the wafer device can be fixed at the center of the bonding area by non-conductive adhesive to prevent the wafer device from moving during wire bonding, which may cause incorrect wire bonding or damage to the wafer device. Here, non-conductive adhesive is used for fixing to ensure the function and performance of the product after wire bonding. At the same time, the non-conductive adhesive needs to be applied evenly and in an appropriate amount, and should not be applied too much.

Furthermore, the bonding pads are connected to the corresponding wafer pads on the wafer device by gold wires through a bonding device to obtain a bonded printed circuit board, as shown in FIG4 .

In an optional embodiment of the present invention, based on steps 131 to 132, the following may also be included:

Step 133, installing a protective material on the bonding area of the bonded printed circuit board to obtain a printed circuit board after protection treatment.

In this embodiment, in order to avoid abnormal reasons causing the breakage of the gold wire after wire bonding, if the printed circuit board after wire bonding is accidentally touched, the gold wire will be broken, and the expected functions and performance of the final packaged product cannot be met. Therefore, it is necessary to install protective materials in the bonding area to prevent dust, touch and static electricity, so as to ensure the quality, function and performance requirements of the packaged product.

In an optional embodiment of the present invention, the above step 133 may include:

Step 1331, determining the size of the protection area on the printed circuit board according to the bonding area, the protection area is set outside the bonding area, and the area of the protection area is larger than the area of the bonding area;

Step 1332, installing a protection frame on the protection area;

Step 1333, installing protective material in the protective frame to obtain a printed circuit board after protective treatment.

In this embodiment, the shape and size of the protection area can be determined according to the shape and size of the bonding area, and the area of the protection area must be larger than the area of the bonding area; preferably, the protection area can be set at the periphery of the bonding pad on the bonding area and at a preset distance from the bonding pad; in an achievable example, the preset distance can be 2.5 mm (the distance between the boundary of the protection area and the bonding pad).

As shown in Figure 6, after determining the protection area and the corresponding boundary position, a protection frame can be installed at the boundary position of the protection area; preferably, the border width of the protection frame can be set to 2mm; here, non-conductive glue can be evenly applied at the boundary position of the protection area, and then the protection frame can be installed on the bonded printed circuit board; taking the wafer device shown in Figure 2 and the corresponding bonding area and bonding pad distribution diagram shown in Figure 3 as an example, the schematic diagram of installing the protection frame on the corresponding protection area is shown in Figure 5.

Furthermore, as shown in FIG. 7 , protective materials are installed in the protective frame; here, in order to ensure that wafer devices with different functions can still maintain corresponding functions after installing the protective materials, corresponding protective materials can be selectively installed, and the corresponding protective materials should completely cover the connecting gold wires between the wafer pads and the bonding pads to protect the connecting gold wires and avoid breakage caused by accidental contact.

In an achievable embodiment of the present invention, the protective material may include at least the following two types: a sealing protective material and a light-transmitting protective material; here, the sealing protective material is mainly used to protect ordinary wafer devices to avoid accidental contact that may cause the bonded gold wire to break; preferably, the sealing protective material may be epoxy resin glue; the light-transmitting protective material is mainly used to protect optical wafer devices to ensure the corresponding functions of the optical wafer devices (the sensor of the optical wafer device receives light energy and converts it into an electrical signal); preferably, the light-transmitting protective material may be high-transmittance glass to ensure that light can directly irradiate the sensor of the optical wafer device.

In an optional embodiment of the present invention, the above step 1333 may include:

Step 13331, for ordinary wafer devices, use epoxy resin glue to fill the area inside the protection frame until the connecting gold wires between the ordinary wafer device and the printed circuit board are completely covered;

Step 13332, for the optical wafer device, install high-transmittance glass on the protective frame to cover the optical wafer device.

In this embodiment, as shown in FIG8 , for common wafer devices, a glue dispenser can be used to control the amount of epoxy resin glue until the glue completely fills and covers the connecting gold wires between the common wafer device and the printed circuit board. Here, the setting of the protective frame can limit the epoxy resin glue within the protective area to prevent the epoxy resin glue from flowing into other areas of the printed circuit board. After the epoxy resin glue is filled, it is placed at room temperature to wait for the glue to solidify before subsequent electrical processing can be carried out.

As shown in FIG9 , for optical wafer devices, firstly, non-conductive glue is evenly applied on the protective frame, and then the high-transmittance glass is pasted on the protective frame to cover the entire wafer device and the bonding area. Here, the setting of the protective frame can provide support for the high-transmittance glass. After the high-transmittance glass is pasted, it is placed at room temperature and waits for the glue to solidify for subsequent electrical processing. It should be known that the protective materials are not limited to the above two types, and any protective materials that can meet the protective function (avoid accidental contact and breakage of the gold wire) and do not affect the corresponding functions of wafer devices with different functions are acceptable.

The method provided by the above-mentioned embodiment of the present invention can improve the hardness and corrosion resistance of the printed circuit board, reduce the difficulty of subsequent wire bonding, and improve the reliability of the final packaged product by coating the pre-prepared printed circuit board and strictly coating it in the order of nickel plating, palladium plating, and gold plating; further, according to the size information of the wafer device and the wafer pad information, the size information and bonding pad information of the bonding area on the printed circuit board after coating are determined, and the corresponding pads are connected with gold wires; further, the printed circuit board after bonding is protected, while being dust-proof, touch-proof, and anti-static, the corresponding functions of the wafer device can also be guaranteed, thereby improving the quality of the final packaged product, and the electrical equipment is further processed after the protection treatment to further ensure the quality of the packaged product.

The above is a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims (10)

1. A product design method for a wafer device, comprising: Obtain specification information of wafer devices and printed circuit boards; Determining a bonding area of the wafer device on the printed circuit board according to the specification information; Fixing the wafer device at the center position of the bonding area, and performing wire bonding on the wafer device and the printed circuit board to obtain a bonded printed circuit board; The bonded printed circuit board is subjected to electrical processing to obtain a packaged printed circuit board. 2. The product design method of wafer device according to claim 1, characterized in that obtaining a printed circuit board comprises: The surface of a preset printed circuit board is plated by a coating process to obtain the plated printed circuit board. 3. The product design method of wafer device according to claim 2, characterized in that the surface of a preset printed circuit board is subjected to coating treatment by a coating process to obtain the coated printed circuit board, comprising: According to the order of nickel plating, palladium plating and gold plating, nickel plating, palladium plating and gold plating are performed on the surface of the preset printed circuit board in turn to obtain the printed circuit board after the coating treatment. 4. The product design method of the wafer device according to claim 1 is characterized in that the specification information includes: wafer size information of the wafer device and wafer pad information of the wafer device. 5. The product design method of the wafer device according to claim 4, characterized in that determining the bonding area of the wafer device on the printed circuit board according to the specification information comprises: Determining the size information of the bonding area according to the size information of the wafer device; The bonding pad information on the bonding area is determined according to the wafer pad information on the wafer device. 6. The product design method of the wafer device according to claim 5, characterized in that determining the bonding pad information on the bonding area according to the wafer pad information on the wafer device comprises: Determining a second number of bonding pads on the bonding area according to a first number of wafer pads on the wafer device; Determining a second distribution position of each bonding pad on the bonding area according to the first distribution position of each wafer pad on the wafer device; the bonding pads on the bonding area correspond one-to-one to the wafer pads on the wafer device; The size of each bonding pad on the bonding area and the second distance between two adjacent bonding pads are determined according to the size of each wafer pad on the wafer device and the first distance between two adjacent wafer pads. 7. The product design method of the wafer device according to claim 6, characterized in that the wafer device is fixed at the center position of the bonding area, and the wafer device and the printed circuit board are wire-bonded to obtain the bonded printed circuit board, comprising: Using non-conductive glue to fix the wafer device at the center of the bonding area; The bonding pads on the bonding area are connected to the wafer pads corresponding to the wafer device by gold wires through bonding equipment to obtain a bonded printed circuit board. 8. The product design method of wafer device according to claim 7, characterized in that after obtaining the bonded printed circuit board, it also includes: A protective material is installed on the bonding area of the printed circuit board after bonding to obtain a printed circuit board after protection treatment. 9. The product design method of wafer device according to claim 8, characterized in that a protective material is installed on the bonding area of the printed circuit board after bonding to obtain a printed circuit board after protection treatment, comprising: According to the bonding area, the size of the protection area on the printed circuit board is determined, wherein the protection area is arranged outside the bonding area, and the area of the protection area is larger than the area of the bonding area; Installing a protection frame on the protection area; Protective material is installed in the protective frame to obtain the printed circuit board after protection treatment. 10. The product design method of wafer device according to claim 9, characterized in that installing protective material in the protective frame comprises: For common wafer devices, epoxy resin glue is used to fill the area in the protection frame until the connecting gold wires between the common wafer device and the printed circuit board are completely covered; For optical wafer devices, high-transmittance glass is installed on the protection frame to cover the optical wafer devices.