CN118989492A - Multi-station adhesive welding equipment and processing method thereof - Google Patents
Multi-station adhesive welding equipment and processing method thereof Download PDFInfo
- Publication number
- CN118989492A CN118989492A CN202411488448.2A CN202411488448A CN118989492A CN 118989492 A CN118989492 A CN 118989492A CN 202411488448 A CN202411488448 A CN 202411488448A CN 118989492 A CN118989492 A CN 118989492A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- dispensing
- linear module
- glue
- station
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1002—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves
- B05C11/1015—Means for controlling supply, i.e. flow or pressure, of liquid or other fluent material to the applying apparatus, e.g. valves responsive to a conditions of ambient medium or target, e.g. humidity, temperature ; responsive to position or movement of the coating head relative to the target
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
- B05C13/02—Means for manipulating or holding work, e.g. for separate articles for particular articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C5/00—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work
- B05C5/02—Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work the liquid or other fluent material being discharged through an outlet orifice by pressure, e.g. from an outlet device in contact or almost in contact, with the work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
- B23K3/087—Soldering or brazing jigs, fixtures or clamping means
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K31/00—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups
- B23K31/12—Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by only one of the preceding main groups relating to investigating the properties, e.g. the weldability, of materials
- B23K31/125—Weld quality monitoring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J15/00—Gripping heads and other end effectors
- B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
- B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
- B25J9/00—Programme-controlled manipulators
- B25J9/02—Programme-controlled manipulators characterised by movement of the arms, e.g. cartesian coordinate type
- B25J9/023—Cartesian coordinate type
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Robotics (AREA)
- Quality & Reliability (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
本发明公开了一种多工位点胶焊接设备及其加工控制方法，涉及加工设备技术领域，多工位点胶焊接设备包括底座、至少一个上料治具、至少一个点胶组件、至少一个取料机械手及至少一个焊锡组件；上料治具滑动连接于底座，上料治具用于放置电路板；点胶组件活动连接于底座，并位于上料治具的上方；取料机械手活动连接于底座上，并位于上料治具的上方，且取料机械手与点胶组件间隔排布设置；焊锡组件活动连接于底座上，并与点胶组件间隔排布设置；点胶组件用于在与上料治具对准时对电路板进行点胶；取料机械手用于抓取电子元器件与点胶后的电路板贴装；本发明提供的技术方案采用了一种创新的固定方式适应不同的电子元器件，提高加工效率，保证焊接质量。
The invention discloses a multi-station glue spot welding equipment and a processing control method thereof, and relates to the technical field of processing equipment. The multi-station glue spot welding equipment comprises a base, at least one feeding jig, at least one glue spot assembly, at least one material picking robot and at least one solder assembly; the feeding jig is slidably connected to the base, and the feeding jig is used to place a circuit board; the glue spot assembly is movably connected to the base and is located above the feeding jig; the material picking robot is movably connected to the base and is located above the feeding jig, and the material picking robot and the glue spot assembly are arranged at intervals; the solder assembly is movably connected to the base and is arranged at intervals with the glue spot assembly; the glue spot assembly is used to perform glue spotting on the circuit board when aligned with the feeding jig; the material picking robot is used to grab electronic components and mount the circuit board after glue spotting; the technical solution provided by the invention adopts an innovative fixing method to adapt to different electronic components, improve processing efficiency, and ensure welding quality.
Description
Technical Field
The invention relates to the technical field of processing equipment, in particular to multi-station dispensing welding equipment and a processing method thereof.
Background
In the traditional circuit board manufacturing process, aiming at a part of the circuit board which is special-shaped and not suitable for the patch, a laser welding technology is generally adopted to realize the welding connection between the electronic component and the circuit board. However, when the electronic component is small in size, the existing fixing method often cannot effectively fix the component, so that the component is easy to fall off in the process of placement or welding. This not only affects the processing efficiency, but also may cause damage to components and parts, and increases the production cost.
Disclosure of Invention
The invention mainly aims to provide multi-station dispensing welding equipment and a processing method thereof, and aims to adapt to different electronic components by adopting an innovative fixing mode, improve the processing efficiency and ensure the welding quality.
In order to achieve the above object, the present invention provides a multi-station dispensing welding apparatus, which includes:
a base;
the feeding jig is connected to the base in a sliding manner and is used for placing a circuit board;
the dispensing assembly is movably connected to the base and is positioned above the feeding jig;
the material taking mechanical arm is movably connected to the base and is positioned above the feeding jig, and the material taking mechanical arm and the dispensing assembly are arranged at intervals;
The soldering tin component is movably connected to the base and is arranged at intervals with the dispensing component;
the dispensing assembly is used for dispensing the circuit board when being aligned with the feeding jig; the material taking manipulator is used for grabbing the electronic components and mounting the circuit board after dispensing.
In an embodiment, the feeding jig includes:
The jig plate is provided with a plurality of mounting clamping positions, and the mounting clamping positions are used for placing the circuit board;
and each elastic clamping piece is arranged at one mounting clamping position and used for clamping the circuit board.
In an embodiment, the multi-station dispensing welding apparatus further includes:
The first rack is arranged on the base and is positioned above the feeding jig; the first rack and the material taking manipulator are arranged at intervals;
The first motion linear module is arranged on the first rack;
The second motion linear module is arranged at the output end of the first motion linear module, and the motion direction of the second motion linear module is different from that of the first motion linear module; the dispensing component is arranged at the output end of the second motion linear module.
In one embodiment, the dispensing assembly includes:
The dispensing frame is arranged at the output end of the second motion linear module;
The dispensing needle cylinder is arranged on the dispensing frame and is used for dispensing the circuit board;
The first detection camera is arranged on the dispensing frame and is arranged at intervals with the dispensing needle cylinder; the first detection camera is used for detecting the dispensing position of the circuit board.
In an embodiment, the multi-station dispensing welding apparatus further includes:
the second rack is arranged on the base and is positioned above the feeding jig; the second rack and the dispensing assembly are arranged at intervals;
the third motion linear module is arranged on the second rack;
the fourth motion linear module is arranged at the output end of the third motion linear module; and the material taking manipulator is arranged at the output end of the fourth motion linear module.
In one embodiment, the reclaiming robot includes:
the material taking frame is arranged at the output end of the fourth motion linear module;
the suction nozzles are movably connected to the material taking frame and are communicated with a negative pressure source; the suction nozzles are used for adsorbing a plurality of circuit boards on the feeding jig;
The second detection camera is arranged on the material taking frame and is arranged at intervals with the suction nozzles; the second detection camera is used for detecting the position of the electronic component on the material taking station.
In an embodiment, the multi-station dispensing welding device further includes at least one third detection camera, where the third detection camera is disposed on the base and is disposed adjacent to the material taking manipulator; the third detection camera is used for detecting positions of a plurality of circuit boards on the feeding jig.
In an embodiment, the multi-station glue dispensing welding device further includes a fifth moving linear module, where the fifth moving linear module is disposed at an output end of the third moving linear module and is disposed opposite to the fourth moving linear module; the soldering tin component is arranged at the output end of the fifth motion linear module.
In one embodiment, the solder assembly includes:
The soldering frame is arranged at the output end of the fifth motion linear module;
A tin soldering nozzle, which is arranged on the tin soldering frame;
the fourth detection camera is arranged on the soldering rack and is arranged at intervals with the soldering nozzle; the fourth detection camera is used for detecting the welding condition of the circuit board and the electronic component on the feeding jig.
In an embodiment, the multi-station dispensing welding device further comprises two servo modules, two flying components and two feeding jigs, wherein the two servo modules are arranged on the base at intervals and positioned below the dispensing components, the material taking mechanical arm and the soldering tin components; each feeding jig is connected with the output end of one servo module, and the two flying components are arranged on the base and are respectively positioned at the outer sides of the two servo modules; the servo module is used for driving the feeding jig to move on the base, and the flying component is used for conveying electronic components to the material taking position of the material taking manipulator.
The invention also provides a processing method of the multi-station glue dispensing welding equipment, which comprises the following steps of:
Manually placing a circuit board to be processed in a feeding jig, and controlling the feeding jig to move to the lower part of the dispensing assembly;
controlling the dispensing assembly to dispense the circuit board in the feeding jig;
Controlling a material taking manipulator to clamp an electronic component to be mounted and drive the electronic component to be placed on the feeding jig so as to enable the circuit board and the electronic component to be mounted integrally;
Controlling the feeding jig to move to a position aligned with the soldering tin component so that the electronic components and the circuit board which are attached are opposite to the soldering tin component;
And controlling the soldering tin assembly to solder the electronic component and the circuit board so as to finish the welding of the electronic component and the circuit board.
In an embodiment, after the step of controlling the solder assembly to solder the electronic component and the circuit board so as to complete soldering of the electronic component and the circuit board, the method further includes:
and controlling a fourth detection camera to detect the welding condition of the circuit board and the electronic component on the feeding jig so as to confirm whether the circuit board and the electronic component are completely welded.
The multi-station dispensing welding equipment comprises a base, at least one feeding jig, at least one dispensing assembly, at least one material taking manipulator and at least one soldering tin assembly; the feeding jig is connected to the base in a sliding manner and is used for placing the circuit board; the dispensing component is movably connected to the base and is positioned above the feeding jig; the material taking manipulator is movably connected to the base and is positioned above the feeding jig, and the material taking manipulator and the dispensing assembly are arranged at intervals; the soldering tin component is movably connected to the base and is arranged at intervals with the dispensing component; the dispensing assembly is used for dispensing the circuit board when being aligned with the feeding jig; the material taking manipulator is used for grabbing the electronic components and the circuit board after dispensing for mounting; therefore, the electronic components are mounted on the circuit board on the feeding jig in advance through the adhesive dispensing assembly, so that the electronic components and the circuit board can be stably fixed together, then the electronic components and the circuit board are welded through the soldering tin assembly, namely, the electronic components can be fixed in different sizes and shapes by adopting an innovative fixing mode of adhesive dispensing and mounting, the fixing difficulty of the electronic components and the circuit board is reduced, the processing efficiency is further improved, and the welding quality is guaranteed.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic structural view of a multi-station dispensing welding device according to an embodiment of the present invention;
fig. 2 is a schematic structural view of another view angle of the multi-station dispensing welding device provided by the invention;
Fig. 3 is a schematic structural diagram of a further view angle of the multi-station dispensing welding apparatus provided by the present invention;
fig. 4 is a schematic structural diagram of a feeding jig of a multi-station dispensing welding device provided by the invention;
fig. 5 is a schematic structural diagram of a dispensing assembly of the multi-station dispensing welding device provided by the invention;
Fig. 6 is a schematic structural diagram of a solder component of the multi-station dispensing and welding device provided by the invention;
fig. 7 is a schematic structural diagram of a material taking manipulator of the multi-station dispensing welding device provided by the invention;
fig. 8 is a flow chart of a processing method of the multi-station dispensing welding equipment provided by the invention.
Reference numerals illustrate:
10. A base; 20. feeding jig; 21. a jig plate; 22. an elastic clamping piece; 30. dispensing assembly; 31. a dispensing frame; 32. dispensing needle cylinder; 33. a first detection camera; 40. a material taking manipulator; 41. a material taking frame; 42. a suction nozzle; 43. a second detection camera; 50. a solder assembly; 51. a soldering rack; 52. a tin welding nozzle; 53. a fourth detection camera; 60. a first frame; 70. a first motion straight line module; 80. a second motion straight line module; 90. a second frame; 100. a third motion straight line module; 110. a fourth motion straight line module; 130. a fifth motion straight line module; 140. a servo module; 150. and the flying component.
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear … …) are included in the embodiments of the present invention, the directional indications are merely used to explain the relative positional relationship, movement conditions, etc. between the components in a specific posture, and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, if "and/or" and/or "are used throughout, the meaning includes three parallel schemes, for example," a and/or B "including a scheme, or B scheme, or a scheme where a and B are satisfied simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
The invention provides multi-station dispensing welding equipment.
Referring to fig. 1 to 7, in an embodiment of the present invention, the multi-station dispensing and welding apparatus includes a base 10, at least one feeding jig 20, at least one dispensing assembly 30, at least one pick-up manipulator 40 and at least one soldering tin assembly 50; the feeding jig 20 is slidably connected to the base 10, and the feeding jig 20 is used for placing a circuit board; the dispensing assembly 30 is movably connected to the base 10 and is positioned above the feeding jig 20; the material taking manipulator 40 is movably connected to the base 10 and is positioned above the feeding jig 20, and the material taking manipulator 40 and the dispensing assembly 30 are arranged at intervals; the soldering tin assembly 50 is movably connected to the base 10 and is arranged at intervals with the dispensing assembly 30; the dispensing assembly 30 is used for dispensing the circuit board when aligned with the feeding jig 20; the pick-up robot 40 is used for picking up the electronic components and mounting the circuit board after dispensing.
The circuit board is placed on the loading jig 20. The control system is started to align the dispensing assembly 30 with the feeding jig 20, and the dispensing operation is performed. The pick-up robot 40 picks up the electronic components and places them onto the dispensed circuit board. The solder assembly 50 bonds electronic components on the circuit board. After the welding is finished, the circuit board is taken out for the next procedure.
According to the embodiment, the electronic components are mounted on the circuit board on the feeding jig 20 in advance through the glue dispensing assembly 30, so that the electronic components and the circuit board can be stably fixed together, then the electronic components and the circuit board are welded through the soldering tin assembly 50, namely, the electronic components with different sizes and shapes can be fixed through adopting an innovative fixing mode of glue dispensing mounting, the fixing difficulty of the electronic components and the circuit board is reduced, the processing efficiency is further improved, and meanwhile, the welding quality is guaranteed.
Through the structures of the integrated base 10, the feeding jig 20, the dispensing assembly 30, the material taking manipulator 40, the soldering tin assembly 50 and the like, a compact and efficient automatic operation unit is formed. Compared with the prior art, the equipment is more reasonable in space layout, and the occupied area of the equipment is effectively reduced. The feeding jig 20 is slidably connected to the base 10, so that the circuit board can be conveniently placed and taken down, and the feeding efficiency is greatly improved. The dispensing assembly 30 is movably connected to the base 10 and located above the feeding jig 20, so that the circuit board can be precisely dispensed when aligned with the feeding jig 20. The design not only improves the precision of dispensing, but also ensures the synchronism of the dispensing process and the circuit board placing process. In addition, the material taking manipulator 40 is movably connected to the base 10 and is arranged at intervals with the dispensing assembly 30, so that the electronic components can be quickly grasped after dispensing is completed, and the electronic components can be attached to the circuit board after dispensing. The design greatly shortens the mounting time of the electronic components and the circuit board and improves the production efficiency. The flexible connection design of the soldering tin assembly 50 makes the soldering process more flexible, and can precisely solder the circuit board according to actual needs. This not only improves the quality of the weld but also reduces the repair rate due to poor welding.
The base 10 is the basic part of the device for supporting the whole device. The base 10 is made of a high-strength metal material, and ensures stability and durability of the apparatus. The feeding jig 20 is slidably connected to the base 10, and is used for placing a circuit board. The jig is made of wear-resistant materials, and the sliding connection part is provided with a guide rail and a roller, so that the jig can slide stably on the base 10. The dispensing assembly 30 is movably connected to the base 10 and located above the feeding jig 20. The control system is responsible for controlling the accurate position and the glue amount of the dispensing. The material taking manipulator 40 is movably connected to the base 10 and is located above the material loading jig 20. The pick out robot 40 includes a gripper and a drive system. The tongs are used for grabbing electronic components, and the driving system is responsible for controlling opening, closing and moving of the tongs. The solder component 50 is movably connected to the base 10 and is arranged at a distance from the dispensing component 30. The solder assembly 50 includes a solder pot, a solder head, and a control system. The solder pot is used for heating solder, and the solder head is used for smearing the solder to a preset position of the circuit board.
In an embodiment, referring to fig. 1 to 7, a feeding jig 20 includes a jig plate 21 and a plurality of elastic clamping members 22, wherein the jig plate 21 is provided with a plurality of mounting clamping positions for placing a circuit board; each elastic clamping piece 22 is arranged at a mounting clamping position and is used for clamping the circuit board.
The feeding jig 20 is combined with a plurality of elastic clamping pieces 22 through the jig plate 21, so that efficient fixing of the circuit board is realized. The jig plate 21 is provided with a plurality of mounting clamping positions, each mounting clamping position corresponds to one elastic clamping piece 22, and the design ensures stable placement of the circuit board on the jig, and avoids damage to the circuit board caused by vibration, collision and other reasons in the production and transportation processes. The use of the resilient clip 22 provides a more flexible and secure manner of attachment. Compared with the traditional fixing method, the elastic clamping piece 22 can automatically adapt to the size change of the circuit board, and ensure that circuit boards with different specifications can be effectively fixed. The self-adaptive capacity greatly reduces the problem of unstable fixation caused by unmatched sizes of the circuit boards, thereby improving the production efficiency.
The jig plate 21 is made of high-strength wear-resistant material, and has good stability and durability. The surface of the jig plate 21 is provided with a plurality of mounting clamping positions which are uniformly distributed on the surface of the jig plate 21. Each elastic clamping piece 22 is arranged on one mounting clamping position and used for clamping the circuit board. The elastic clamping member 22 is made of a material with good elasticity and wear resistance so as to ensure the stability and safety of the circuit board on the jig.
The circuit board is placed on the mounting clamping position of the jig board 21, so that the correct corresponding relation between the circuit board and the mounting clamping position is ensured. The elastic clamping member 22 is mounted on the mounting fixture, and the circuit board is firmly clamped on the jig plate 21 by elastic deformation of the elastic clamping member 22. After the loading operation is completed, the jig plate 21 and the circuit board are moved to the loading equipment together by manual or automatic equipment, and a subsequent processing or detection process is performed. After the processing or inspection is completed, the elastic clamping member 22 is removed, and the circuit board is taken out, thereby completing the whole feeding process.
In an embodiment, referring to fig. 1 to 7, the multi-station glue welding apparatus further includes a first frame 60, a first moving linear module 70, and a second moving linear module 80, where the first frame 60 is disposed on the base 10 and above the feeding jig 20; the first rack 60 is arranged at intervals with the material taking manipulator 40; the first motion linear module 70 is arranged on the first frame 60; the second motion linear module 80 is disposed at the output end of the first motion linear module 70, and the motion direction of the second motion linear module 80 is different from the motion direction of the first motion linear module 70; the dispensing assembly 30 is disposed at an output end of the second moving linear module 80.
The adoption of the multi-station adhesive welding equipment enables a plurality of working positions to simultaneously carry out adhesive dispensing welding operation, and greatly improves production efficiency. Compared with the traditional simplex position adhesive welding equipment, more welding tasks can be completed in the same time, the production period is effectively shortened, and the production cost is reduced. The first frame 60 is disposed above the feeding jig 20 and spaced from the material taking manipulator 40, so that the material flows more smoothly, the time consumption of the material in the conveying process is reduced, and the whole operation flow is optimized. The application of the first moving linear module 70 and the second moving linear module 80 enables the dispensing assembly 30 to realize movement in two different directions, and improves the control precision of the movement. The design not only ensures the accuracy of the spot gluing welding position, but also reduces the welding quality problem caused by position deviation.
In an embodiment, referring to fig. 1 to 7, the dispensing assembly 30 includes a dispensing frame 31, a dispensing syringe 32, and a first detection camera 33, wherein the dispensing frame 31 is disposed at an output end of the second moving linear module 80; the dispensing syringe 32 is arranged on the dispensing frame 31 and is used for dispensing the circuit board; the first detection camera 33 is arranged on the dispensing frame 31 and is spaced from the dispensing syringe 32; the first detecting camera 33 is used for detecting the dispensing position of the circuit board.
The dispensing syringe 32 is disposed on the dispensing frame 31, and is used for dispensing the circuit board, and the dispensing process is more accurate and stable due to the design. Compared with the prior art, the dispensing needle cylinder 32 can ensure uniform distribution of glue on the circuit board, effectively prevent the problems of short circuit, open circuit and the like of the circuit board caused by uneven dispensing, and further remarkably improve the quality of products. The first detecting camera 33 is arranged on the dispensing frame 31 and is arranged at intervals with the dispensing syringe 32, and the design enables the detecting camera to monitor the dispensing position in real time, so that the accuracy of the dispensing process is ensured. Specifically, the first detecting camera 33 is configured to detect a dispensing position of the circuit board, and can timely find a deviation in a dispensing process, and adjust a position of the dispensing syringe 32 through the control system, so as to ensure accuracy of dispensing.
In an embodiment, referring to fig. 1 to 7, the multi-station glue welding apparatus further includes a second frame 90, a third moving linear module 100, and a fourth moving linear module 110, where the second frame 90 is disposed on the base 10 and above the feeding jig 20; and the second frame 90 is spaced from the dispensing assembly 30; the third motion straight line module 100 is arranged on the second rack 90; the fourth motion straight line module 110 is arranged at the output end of the third motion straight line module 100; the material taking manipulator 40 is disposed at an output end of the fourth motion straight line module 110.
The device adopts the structural design of the second frame 90, the third motion linear module 100 and the fourth motion linear module 110, so that the space layout of the whole device is more compact and reasonable. The second frame 90 and the dispensing assembly 30 are arranged at intervals, so that the dispensing assembly 30 is more flexible in the operation process due to the innovative design, and multi-station dispensing welding operation is facilitated. At the same time, this arrangement also helps to improve the stability and service life of the dispensing assembly 30, reducing maintenance costs.
The third moving linear module 100 is disposed on the second frame 90, and the fourth moving linear module 110 is disposed at an output end of the third moving linear module 100, so that the precise positioning of the material taking manipulator 40 is realized by adopting the structural design. The material taking manipulator 40 is disposed at the output end of the fourth moving linear module 110, so that the material taking manipulator has higher stability and accuracy in the material taking and welding processes, and the quality and the production efficiency of the product are effectively improved.
In an embodiment, referring to fig. 1 to 7, the material taking manipulator 40 includes a material taking frame 41, a plurality of suction nozzles 42 and a second detection camera 43, where the material taking frame 41 is disposed at an output end of the fourth moving linear module 110; the suction nozzles 42 are movably connected to the material taking frame 41 and are communicated with a negative pressure source; the suction nozzles 42 are used for adsorbing a plurality of circuit boards on the feeding jig 20; the second detecting camera 43 is arranged on the material taking frame 41 and is arranged at intervals with the plurality of suction nozzles 42; the second detecting camera 43 is used for detecting the position of the electronic component on the material taking station.
The material taking manipulator 40 includes a material taking frame 41, a plurality of suction nozzles 42 and a second detecting camera 43, where the material taking frame 41 is disposed at an output end of the fourth moving linear module 110, so as to ensure stability and accuracy of material taking. Compared with the prior art, the manual material taking device effectively overcomes the possible human error in the manual material taking process, and greatly improves the accuracy and efficiency of material taking. The suction nozzles 42 are movably connected to the material taking frame 41 and are communicated with a negative pressure source for adsorbing a plurality of circuit boards on the material loading jig 20. The design enables the suction nozzle 42 to be flexibly adjusted according to actual needs and adapt to circuit boards with different sizes and shapes, so that the application range and flexibility of material taking are improved. Meanwhile, the suction nozzle 42 is communicated with a negative pressure source, so that the circuit board is prevented from falling off due to external factors in the material taking process, and the reliability of material taking is improved. The second detecting camera 43 is disposed on the material taking frame 41 and spaced from the plurality of suction nozzles 42, for detecting the position of the electronic component on the material taking station. This design allows the pick-out robot 40 to monitor the position of the electronic components in real time, thereby accurately controlling the pick-out motion and avoiding the risk of pick-out failure or damage to the circuit board due to inaccurate positions.
In an embodiment, referring to fig. 1 to 7, the multi-station glue welding apparatus further includes at least one third detection camera, where the third detection camera is disposed on the base 10 and is disposed adjacent to the material taking manipulator 40; the third detection camera is used for detecting positions of a plurality of circuit boards on the feeding jig 20.
The third detection camera is arranged on the base 10 and adjacent to the material taking manipulator 40, and the design enables the device to accurately detect the positions of a plurality of circuit boards on the material loading jig 20 in real time. Compared with the prior art, the technical characteristics directly bring about improvement of detection precision and speed, and remarkably reduce the frequency and necessity of manual intervention, thereby greatly improving production efficiency.
The third detection camera is used for accurately positioning the circuit board on the feeding jig 20, so that the accuracy and consistency in the welding process can be ensured, welding defects caused by inaccurate positioning are avoided, and the product quality is improved.
In an embodiment, referring to fig. 1 to 7, the multi-station glue welding apparatus further includes a fifth moving linear module 130, where the fifth moving linear module 130 is disposed at an output end of the third moving linear module 100 and is disposed opposite to the fourth moving linear module 110; the solder component 50 is disposed at an output end of the fifth moving linear module 130.
The fifth moving linear module 130 is added to the output end of the third moving linear module 100, and this innovative design makes the whole spot welding process more flexible and efficient. The fifth moving straight line module 130 is disposed opposite to the fourth moving straight line module 110, so that the welding apparatus can achieve more accurate position adjustment and faster operation speed when performing the spot welding task. This not only greatly improves the production efficiency, but also ensures the welding quality. The solder component 50 is arranged at the output end of the fifth motion straight line module 130, and the design optimizes the welding path and reduces the problem of uneven welding caused by overlong or bending of the welding path. The position of the solder assembly 50 is optimized so that the welding process is smoother and the heat affected zone is more concentrated, thereby significantly improving the weld strength and weld quality.
In an embodiment, referring to fig. 1 to 7, the solder assembly 50 includes a solder frame 51, a solder nozzle 52 and a fourth detecting camera 53, and the solder frame 51 is disposed at an output end of the fifth moving linear module 130; the solder nozzle 52 is arranged on the solder frame 51; the fourth detecting camera 53 is arranged on the soldering rack 51 and is arranged at intervals with the soldering nozzle 52; the fourth detecting camera 53 is used for detecting the welding condition of the circuit board and the electronic component on the feeding jig 20.
By providing the soldering frame 51 at the output end of the fifth moving straight line module 130, automation of the soldering process is achieved. The design greatly shortens the welding time and improves the production efficiency.
The solder nozzle 52 is disposed on the solder frame 51 and spaced from the fourth detecting camera 53, so that the distance between the solder nozzle 52 and the circuit board is precisely controlled during the soldering process. This design helps to achieve accuracy and consistency of the welding position, avoiding welding quality problems due to inaccurate welding positions.
The fourth detecting camera 53 is used for detecting the welding condition of the circuit board and the electronic component on the feeding jig 20 in real time. Through the image recognition technology, the system can rapidly recognize welding defects such as cold joint, missing welding and the like, so that adjustment and repair can be performed in time. The function obviously improves the welding quality and reduces the defective rate.
In an embodiment, referring to fig. 1 to 7, the multi-station glue welding apparatus further includes two servo modules 140, two flying components 150 and two feeding jigs 20, where the two servo modules 140 are disposed at intervals on the base 10 and are located below the glue dispensing component 30, the material taking manipulator 40 and the soldering tin component 50; each feeding jig 20 is connected with the output end of one servo module 140, and two flying components 150 are arranged on the base 10 and are respectively positioned at the outer sides of the two servo modules 140; the servo module 140 is used for driving the feeding jig 20 to move on the base 10, and the femto-cell assembly 150 is used for conveying the electronic components to the material taking position of the material taking manipulator 40.
Each feeding jig 20 is connected with the output end of one servo module 140, and two flying components 150 are arranged on the base 10 and are respectively positioned at the outer sides of the two servo modules 140. The servo module 140 is used for driving the feeding jig 20 to move on the base 10, so that the moving precision and speed of the feeding jig 20 are improved, and the production efficiency is greatly improved. The flyer assembly 150 is used for conveying the electronic components to the material taking position of the material taking manipulator 40, and the servo module 140 and the flyer assembly 150 work cooperatively, so that the electronic components are conveyed rapidly and accurately, and the production efficiency is effectively improved.
The invention also provides a processing method of the multi-station glue dispensing welding equipment, and referring to fig. 1 and 8, the processing method of the multi-station glue dispensing welding equipment comprises the following steps:
s10: manually placing a circuit board to be processed in the feeding jig 20, and controlling the feeding jig 20 to move to the lower part of the dispensing assembly 30;
The manual operation places the circuit board to be processed in the feeding jig 20. The feeding jig 20 is designed with a specific shape and size to ensure stable placement of the circuit board. Subsequently, the operation control device controls the feeding jig 20 to move along the guide rail to the position right below the dispensing assembly 30. At this time, the position of the feeding jig 20 should be aligned with the nozzle of the dispensing assembly 30 for performing the subsequent dispensing operation.
The circuit board to be processed is placed in the feeding jig 20 manually, and the feeding jig 20 is controlled to move to the lower side of the dispensing assembly 30, so that complex circuit board positioning procedures and equipment in traditional automatic equipment are avoided, the operation flow is simplified, and the equipment cost is reduced. The improvement of the step obviously improves the production efficiency, and simultaneously reduces the failure rate caused by inaccurate positioning, thereby improving the overall quality of the circuit board.
S20: controlling the dispensing assembly 30 to dispense the circuit board in the feeding jig 20;
after the step S10 is completed, the control device sends a signal to the dispensing assembly 30 to start the operation. The dispensing assembly 30 includes one or more nozzles that allow precise control of the flow and shape of the glue. The dispensing assembly 30 dispenses the circuit board in the feeding jig 20 to ensure that the glue is uniformly coated at a predetermined position.
The control dispensing assembly 30 is used for dispensing the circuit board in the feeding jig 20, the dispensing technology adopted by the invention improves the dispensing precision and consistency, ensures the proper amount of uniform coating of the glue, and avoids the mounting problem caused by too much or too little glue, thereby greatly improving the production efficiency and the product quality.
S30: the material taking manipulator 40 is controlled to clamp the electronic components to be mounted and drive the electronic components to be placed on the material loading jig 20 so as to enable the circuit board and the electronic components to be mounted integrally;
Next, the control device directs the pick-up robot 40 to pick up the electronic component to be mounted. The material taking manipulator 40 has a high-precision positioning function, can accurately grasp components and drive the electronic components to move onto the material loading jig 20. In the process, the relative positions of the electronic components and the circuit board are precisely controlled so as to ensure the mounting quality.
The manipulator adopted by the invention has high mounting precision and high speed, reduces manual participation, reduces labor cost and human error, and improves mounting quality and production efficiency.
S40: controlling the feeding jig 20 to move to a position aligned with the soldering tin assembly 50, so that the mounted electronic components and the circuit board are opposite to the soldering tin assembly 50;
after the mounting is completed, the control device controls the feeding jig 20 to move to the alignment position of the solder component 50 again. The solder assembly 50 is designed with an automatic alignment function, so that the circuit board and the electronic component on the feeding jig 20 can be ensured to be opposite to the solder assembly 50, and conditions are provided for subsequent welding operation.
The alignment technique of the invention ensures the accurate butt joint of the circuit board and the soldering tin component 50, avoids the problems of dislocation and short circuit in the welding process, and improves the welding quality.
S50: and controlling the soldering tin assembly 50 to solder the electronic component and the circuit board so as to finish the soldering of the electronic component and the circuit board.
Finally, the control device starts the soldering tin assembly 50 to solder the electronic components and the circuit board in the feeding jig 20. The solder assembly 50 can precisely control the temperature and time of solder and ensure the quality of soldering between the electronic component and the circuit board.
The soldering tin assembly 50 is controlled to solder the electronic components and the circuit board, and the soldering tin technology used by the invention has excellent soldering effect, ensures reliable connection of the electronic components and the circuit board, and reduces the possibility of subsequent maintenance and reworking.
In one embodiment, referring to fig. 1 and 8, S50: the step of controlling the solder assembly 50 to solder the electronic component and the circuit board so as to complete the soldering of the electronic component and the circuit board further comprises:
s60: the fourth detecting camera 53 is controlled to detect the welding condition of the circuit board and the electronic component on the feeding jig 20, so as to confirm whether the circuit board and the electronic component are completely welded.
The circuit board is placed on the loading jig 20. The fourth detection camera 53 is started to perform automatic focusing on the circuit board. The image on the circuit board is acquired and transmitted to an image processing system. The image processing system analyzes the image to identify the location and status of the weld. And judging whether the circuit board and the electronic component are completely welded according to the analysis result. If the welding is problematic, the system gives an alarm to prompt the operator to make corrections.
By introducing the fourth detection camera 53, the welding condition of the circuit board and the electronic components is monitored in an omnibearing and multi-angle manner, so that blind areas and misjudgment possibly occurring in the traditional detection method are effectively avoided. The introduction of the technical characteristics obviously improves the accuracy and the reliability of detection.
The detection period is greatly shortened by an automatic detection means, and the requirement of manual intervention is reduced. This not only improves the overall operating efficiency of the production line, but also reduces errors and delays due to improper manual operation. In addition, the real-time feedback mechanism of the detection data enables the problems in the production process to be found in time and solved rapidly, and production efficiency is further improved.
The foregoing description is only exemplary embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the present invention.
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411488448.2A CN118989492A (en) | 2024-10-24 | 2024-10-24 | Multi-station adhesive welding equipment and processing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202411488448.2A CN118989492A (en) | 2024-10-24 | 2024-10-24 | Multi-station adhesive welding equipment and processing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN118989492A true CN118989492A (en) | 2024-11-22 |
Family
ID=93487739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202411488448.2A Pending CN118989492A (en) | 2024-10-24 | 2024-10-24 | Multi-station adhesive welding equipment and processing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN118989492A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119952491A (en) * | 2025-04-10 | 2025-05-09 | 苏州元脑智能科技有限公司 | For components flip mechanism and assembly line |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210444144U (en) * | 2019-06-27 | 2020-05-01 | 苏州欧康信智能装备有限公司 | Motor stator assembly quality |
| CN216491330U (en) * | 2022-01-04 | 2022-05-10 | 深圳市宏玉鑫科技有限公司 | Chip mounter |
| CN117608112A (en) * | 2023-12-29 | 2024-02-27 | 江西联益光学有限公司 | LCM equipment |
| CN118338560A (en) * | 2024-05-14 | 2024-07-12 | 东莞市司姆特电子科技有限公司 | PCBA paster dispensing equipment |
-
2024
- 2024-10-24 CN CN202411488448.2A patent/CN118989492A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN210444144U (en) * | 2019-06-27 | 2020-05-01 | 苏州欧康信智能装备有限公司 | Motor stator assembly quality |
| CN216491330U (en) * | 2022-01-04 | 2022-05-10 | 深圳市宏玉鑫科技有限公司 | Chip mounter |
| CN117608112A (en) * | 2023-12-29 | 2024-02-27 | 江西联益光学有限公司 | LCM equipment |
| CN118338560A (en) * | 2024-05-14 | 2024-07-12 | 东莞市司姆特电子科技有限公司 | PCBA paster dispensing equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119952491A (en) * | 2025-04-10 | 2025-05-09 | 苏州元脑智能科技有限公司 | For components flip mechanism and assembly line |
| CN119952491B (en) * | 2025-04-10 | 2025-08-26 | 苏州元脑智能科技有限公司 | For component flipping mechanisms and assembly lines |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6346364B2 (en) | How to automatically adjust the dispenser supply unit | |
| CN118989492A (en) | Multi-station adhesive welding equipment and processing method thereof | |
| US10285316B2 (en) | Electronic component mounting device | |
| KR20120080537A (en) | Part-mounting system and part-mounting method | |
| JP5392303B2 (en) | Electronic component mounting system and mounting board manufacturing method in electronic component mounting system | |
| WO2014196081A1 (en) | Electronic apparatus assembling machine and similar assembling machines | |
| US10251282B2 (en) | Electronic component mounting device | |
| CN112822860B (en) | A groove solder paste spraying device for groove circuit board | |
| TW201417931A (en) | Soldering machine and method of soldering | |
| JP6075932B2 (en) | Substrate inspection management method and apparatus | |
| KR20190034839A (en) | The apparatus of smart laser | |
| CN116727797A (en) | Semiconductor element welding equipment and welding method thereof | |
| CN114122863B (en) | Automatic tinning equipment for connectors | |
| CN114147310A (en) | Automatic tin-coating and gold-removing mechanism and automatic tin-coating and gold-removing method thereof | |
| CN112453619A (en) | Automatic chip laser welding dispensing equipment | |
| CN113695776B (en) | Ultrasonic motor multipoint positioning assembly mechanism based on machine vision and method thereof | |
| CN114367715A (en) | PCB welding equipment and welding process based on machine vision | |
| CN217859690U (en) | Medical biopsy puncture needle welding tool | |
| JPH0685447A (en) | Mount connecting method and device of electronic part | |
| KR100235455B1 (en) | Electronic component mounting unit | |
| CN210524314U (en) | Automatic tool system | |
| CN112638058B (en) | Component mounting device and component mounting method | |
| KR20060103595A (en) | Multipoint Brazing Welding Machine | |
| CN117680787A (en) | Automatic welding method and welding equipment for soft and hard plates | |
| KR19990011424A (en) | Solder ball bumping system for BGA semiconductor package |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20241122 |