CN119009490A - Patch antenna - Google Patents

Abstract

The present application discloses a patch antenna, which is applied to the field of wireless technology. In the patch antenna, a plurality of metal patches are respectively arranged around a microstrip patch, and are respectively connected to a metal floor through metal vias. The intervals between the metal patches are equivalent to capacitance, and the metal floor can be equivalent to inductance. Therefore, the metal floor, metal vias, metal patches and other structures mentioned in the embodiments of the present application are equivalent to a resonant circuit around the microstrip patch. By adjusting the frequency bands of the resonant circuit and the antenna surface wave to be the same, the propagation of the surface wave can be suppressed, and energy convergence can be achieved; thereby increasing the gain in a specified direction. This solution has a simple structure, and each metal patch is respectively connected to the metal floor through a metal via. The inductance value of the equivalent circuit is no longer limited by the patch size, so that the final antenna gain can meet the requirements.

Description

Patch antenna

Technical Field

The application belongs to the technical field of wireless technology, and particularly relates to a patch antenna.

Background

Gain is an important performance index of an antenna, and under the same transmitting system, the higher the gain is, the longer the distance of electromagnetic wave propagation is, and the wider the signal coverage range is. The method for improving the antenna gain is an important subject in the field of antennas, has wide practical value and has bright development prospect.

In the current antenna design, 9 square patches and a metal ground are adopted to form a high-impedance surface as a bottom layer, two pairs of orthogonal dipoles are adopted in a middle-layer dielectric plate, and 4 rectangular parasitic patches are arranged in an upper-layer dielectric plate. 2 coaxial lines are adopted to connect the horizontal microstrip bridge and the vertical microstrip bridge, and two pairs of orthogonal dipoles are fed. However, the structure of the mode is complex, the inductance value of the formed equivalent circuit is limited by the size of the patch, and the gain effect cannot meet the requirement.

Disclosure of Invention

The embodiment of the application provides a patch antenna which can improve the gain effect of signals.

In one aspect, an embodiment of the present application provides a patch antenna, including:

The metal floor is provided with a feed port;

The first surface of the dielectric substrate is attached to the metal floor, and the second surface of the dielectric substrate is provided with microstrip patches and a plurality of metal patches; a plurality of metal vias are arranged on the dielectric substrate;

The metal patches are arranged around the microstrip patches and are connected with the metal floor through the metal via holes respectively.

On the other hand, the size of each metal patch and the distance between adjacent metal patches are determined according to the required resonant frequency and the relative permittivity, dielectric permeability and dielectric thickness of the dielectric substrate.

On the other hand, the microstrip patch is arranged in the central area of the dielectric substrate, and a plurality of metal patches are arranged around the microstrip patch at intervals.

In another aspect, the method further comprises:

at least one layer of guiding structure, each layer of guiding structure comprises a medium layer and a guiding patch; in the guiding structure, a first surface of the medium layer is attached to a second surface of the medium substrate; the guiding patch is arranged at a position corresponding to the microstrip patch on the second surface of the corresponding dielectric layer.

On the other hand, the guiding structure comprises a plurality of layers of guiding structures which are sequentially attached.

In another aspect, the method further comprises: an open-pore metal plate attached to the side edge of the guiding structure; the open-cell metal plate includes a plurality of open cells.

On the other hand, the size of each opening and the spacing between adjacent openings of the open-pore metal plate are determined according to the required resonant frequency and resonant bandwidth.

On the other hand, each side edge of the guiding structure is attached to one open-pore metal plate, and the open-pore metal plates on each side edge are connected with each other;

and openings are formed in all positions of the open-pore metal plate.

In another aspect, the shape of each of the metal patches and the openings in the open-cell metal plate includes any one or any combination of the following: round, rectangular, diamond, triangular, regular polygon, and fractal curve.

On the other hand, each metal patch is circular;

The radius of each metal patch and the distance between adjacent metal patches are determined according to the required resonant frequency, the relative dielectric constant of the dielectric substrate, the dielectric permeability and the dielectric thickness.

On the other hand, the openings of the open-pore metal plates are all round;

the aperture radius of the open-pore metal plate is determined by the required resonance frequency;

The ratio of the opening radius of the open-pore metal plate to the distance between the centers of two adjacent open-pore centers is determined by the required resonance bandwidth.

The patch antenna of the embodiment of the application comprises the following structures: the dielectric substrate is provided with a feeding port metal floor, a first surface of the dielectric substrate is attached to the metal floor, and a second surface of the dielectric substrate is provided with microstrip patches and a plurality of metal patches; a plurality of metal vias are disposed on the dielectric substrate. The metal patches are respectively arranged around the microstrip patches and are respectively connected with the metal floor through metal vias. The space between each metal patch is equivalent to a capacitor, and the metal floor can be equivalent to an inductor, so that the structures of the metal floor, the metal via hole, the metal patch and the like provided by the embodiment of the application are equivalent to a resonant circuit around the microstrip patch, and a high-impedance surface with band-pass characteristic is formed. The frequency bands of the resonant circuit and the antenna surface wave are the same through adjustment, so that the propagation of the surface wave can be restrained, and the energy beam-receiving is realized; thereby improving the gain in the specified direction. The scheme has simple structure, each metal patch is connected with the metal floor through the metal via hole, and the inductance value of the equivalent circuit is not limited by the patch size any more, so that the final antenna gain can meet the requirement.

Drawings

In order to more clearly illustrate the technical solution of the embodiments of the present application, the drawings that are needed to be used in the embodiments of the present application will be briefly described, and it is possible for a person skilled in the art to obtain other drawings according to these drawings without inventive effort.

Fig. 1 is a schematic diagram showing a disassembled structure of a patch antenna according to an embodiment of the present application;

FIG. 2 shows a 3D block diagram of a patch antenna provided by one embodiment of the present application;

fig. 3 shows a disassembled view of a patch antenna according to an embodiment of the present application;

FIG. 4 illustrates a partial schematic view of a metal patch provided in accordance with one embodiment of the present application;

FIG. 5 illustrates an equivalent circuit diagram of a high impedance surface provided by one embodiment of the present application;

fig. 6 shows a top view of a patch antenna provided by an embodiment of the present application;

FIG. 7 is a schematic view showing the structure of an open-pore metal plate according to an embodiment of the present application;

fig. 8 is a schematic diagram showing characteristics of an antenna reflection coefficient S11 of a patch antenna according to an embodiment of the present application;

Fig. 9 shows a gain contrast plot of a patch antenna of an embodiment of the present application versus a conventional antenna;

Fig. 10 shows an antenna gain diagram of a patch antenna according to an embodiment of the present application;

Fig. 11 shows a far field pattern of a patch antenna of an embodiment of the present application.

Detailed Description

Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make the objects, technical solutions and advantages of the present application more apparent, the present application will be described in further detail below with reference to the accompanying drawings and the detailed embodiments. It should be understood that the particular embodiments described herein are meant to be illustrative of the application only and not limiting. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the application by showing examples of the application.

It is noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

In order to solve the problem of the conventional scheme, the embodiment of the application provides a patch antenna. The patch antenna provided by the embodiment of the application is first described below. Fig. 1 is a schematic diagram showing a disassembled structure of a patch antenna according to an embodiment of the present application; as shown in fig. 1, the patch antenna mainly includes the following structure: metal floor 101, dielectric substrate 102, metal patch 103, microstrip patch 104, metal via 105, dielectric layer 106, lead patch 107, perforated metal plate 108, and feed port 109.

The metal floor 101, the metal floor 101 is provided with a power supply port 109. The main function of the feed port 109 is to radiate the radio frequency power from the feed line in the form of electromagnetic waves to a reflecting surface or lens, etc., so that it produces a suitable field distribution at the aperture to form the desired sharp or shaped beam. At the same time, the design of the feed 109 also ensures that the power leaking out from the edge of the reflecting surface or lens etc. is as small as possible in order to achieve as high a gain as possible. The feed port is a key component in an antenna system, and the performance of the feed port directly affects the electrical characteristics and frequency bands of the antenna, so that the feed port is one of important factors for determining the performance of the antenna. The feed port 109 is provided in the center of the metal floor 101 in fig. 1 to better perform its function, but the actual position of the feed port 109 may be selected according to the need.

The dielectric substrate 102, the first surface of the dielectric substrate 102 is attached to the metal floor 101, and the second surface of the dielectric substrate 102 is provided with microstrip patches 104 and a plurality of metal patches 103; a plurality of metal vias 105 are disposed on the dielectric substrate 102. The metal via 105 is located in the center of the metal patch 103 in fig. 1; the metal vias 105 penetrate through the dielectric substrate 102 to connect the metal patches 103 with the metal floor 101. The main function of the dielectric substrate 102 is to support and fix the conductor elements of the antenna, and by selecting an appropriate material, the performance of the antenna can be improved.

The dielectric substrate 102 serves to support and separate the antenna conductors, which helps to maintain the structure and stability of the antenna. The dielectric substrate 102 also improves antenna performance, which may be improved by selecting appropriate materials, including frequency response, radiation directivity, gain, etc. For example, selecting a material with a higher dielectric constant as the dielectric plate can improve the gain of the antenna and improve the transmitting or receiving performance of the antenna. And materials with lower dielectric constants are selected, and a wider frequency band response can be achieved by appropriate dielectric plate structure designs.

The dielectric substrate 102 also affects the antenna radiation characteristics, for example, the size and shape of the dielectric substrate 102 can affect the performance of the antenna. The width and length of the dielectric substrate 102 determine the operating frequency of the patch antenna. By reasonably selecting the size of the dielectric plate, frequency tuning and bandwidth increase of the antenna can be achieved. In addition, parameters of the dielectric substrate, such as thickness, dielectric constant, tangent loss angle, etc., are also considered in designing the antenna, since these parameters directly affect the performance of the antenna.

The microstrip patch 104 is generally disposed in a central region of the dielectric substrate 102, and is used for implementing transmission of antenna signals.

The plurality of metal patches 103 are respectively arranged around the microstrip patches 104 and are respectively connected with the metal floor 101 through metal vias 105 to form an LC resonant circuit. The metal via 105 is typically disposed at a central location of the metal patch 103, and the actual location may be selected according to circumstances.

It should be noted that the structure shown in fig. 1 is only one example of the embodiment of the present application, and the shape, size, material, specific position, etc. of the metal floor 101, the dielectric substrate 102, the metal patch 103, the microstrip patch 104, the metal via 105, the dielectric layer 106, the guide patch 107, the open-pore metal plate 108, and the feed port 109 may be set according to practical situations.

FIG. 2 shows a 3D block diagram of a patch antenna provided by one embodiment of the present application; as shown in fig. 2, a practical 3D view of a patch antenna is provided, where the positions of the dielectric substrate 102, the metal patch 103, the dielectric layer 106, the lead patch 107 and the open-pore metal plate 108 can be visually observed; the metal patches 103 are distributed at the peripheral edge positions of the dielectric substrate 102; the dielectric layer 106 and the guiding patch 107 constitute a top guiding structure.

Fig. 3 shows a disassembled view of a patch antenna according to an embodiment of the present application; as shown in fig. 3, the patch antenna in fig. 2 is disassembled, the perforated metal plate 108 is located at a side of the guiding structure, the multi-layer guiding structure is sequentially attached, and the positions of the guiding patch 107 and the bottom microstrip patch 104 coincide in the vertical direction. It should be noted that fig. 2 and fig. 3 are only for facilitating a more visual understanding of the patch antenna of the present embodiment, and the specific structure of the patch antenna is set according to actual requirements.

The antenna gain may be further enhanced by the guiding structure and the open-pore metal plate 108 in fig. 1 to 3, and the dielectric layer 106 is used to support the open-pore metal plate 108, and after adding the dielectric layer 106, the direction of the antenna signal is maintained by the guiding patch 107. The open-cell metal plate 108 can be reused as the metal floor 101 to simplify the structure. The guiding structure in fig. 1 to 3 is provided with 3 layers in total, including a first guiding structure layer, a second guiding structure layer and a third guiding structure layer, respectively.

The high-impedance surface structure adopted by the embodiment of the application focuses on inhibiting the surface wave propagation of the antenna, and is different from a mode of being arranged between the floor and the antenna.

The high-impedance surface structure can form a band-stop characteristic, and basically the structure can be equivalent to a resonance circuit to generate resonance, and the two structures can be equivalent to the resonance circuit; namely, a structure formed by the metal patch 103, the metal via 105 and the metal floor 101, and a structure formed by the circular open-pore metal plate 108.

The patch antenna provided by the embodiment of the application has a simple structure, is easy to process, is a high-gain antenna, and can be used for scenes such as Bluetooth, mobile hot spots (WIRELESS FIDELITY, WIFI) and the like.

The patch antenna of the embodiment of the application comprises the following structures: the dielectric substrate is provided with a feeding port metal floor, a first surface of the dielectric substrate is attached to the metal floor, and a second surface of the dielectric substrate is provided with microstrip patches and a plurality of metal patches; a plurality of metal vias are disposed on the dielectric substrate. The metal patches are respectively arranged around the microstrip patches and are respectively connected with the metal floor through metal vias. The space between each metal patch is equivalent to a capacitor, and the metal floor can be equivalent to an inductor, so that the structures of the metal floor, the metal via hole, the metal patch and the like provided by the embodiment of the application are equivalent to a resonant circuit around the microstrip patch, and a high-impedance surface with band-pass characteristic is formed. The frequency bands of the resonant circuit and the antenna surface wave are the same through adjustment, so that the propagation of the surface wave can be restrained, and the energy beam-receiving is realized; thereby improving the gain in the specified direction. The scheme has simple structure, each metal patch is connected with the metal floor through the metal via hole, and the inductance value of the equivalent circuit is not limited by the patch size any more, so that the final antenna gain can meet the requirement.

In the specific structure of the patch antenna provided in the above embodiment, the high-impedance surface structure is mainly formed by the metal patches 103, but the shape and size of the metal patches 103 and the spacing between the metal patches 103 are not required, and the high-impedance surface structure can be determined according to the required resonant frequency and the like in practical application. In this embodiment, the size of each metal patch 103 and the pitch of adjacent metal patches 103 are determined according to the required resonant frequency and the relative permittivity, dielectric permeability and dielectric thickness of the dielectric substrate 102.

In this embodiment, the size of the metal patch 103 and the spacing between adjacent metal patches 103 can be determined by the required resonant frequency and the material coefficient of the dielectric substrate 102. In other words, the required resonant frequency can be obtained by adjusting the size of the metal patch 103 and the distance between the adjacent metal patches 103, the scheme is simple to implement, and the practical requirements can be rapidly met.

In practical applications, the shape of each metal patch 103 in the present application includes any one or any combination of the following: round, rectangular, diamond, triangular, regular polygon, and fractal curve. The shape of the metal patch 103 can be selected according to actual requirements, so as to meet the actual requirements.

For example, in the embodiment of the present application, if each metal patch 103 is circular, the radius of each metal patch 103 and the distance between adjacent metal patches 103 can be determined according to the required resonant frequency and the relative permittivity, dielectric permeability and dielectric thickness of the dielectric substrate 102, if each metal patch 103 is circular.

FIG. 4 illustrates a partial schematic view of a metal patch provided in accordance with one embodiment of the present application; as shown in fig. 4, two circular metal patches 103 are arranged at a predetermined radius and interval, metal vias 105 are arranged at the center of the metal patches 103, and the remaining metal patches 103 are arranged like this structure.

FIG. 5 illustrates an equivalent circuit diagram of a high impedance surface provided by one embodiment of the present application; as shown in fig. 5, in the partial structure of the metal patches shown in fig. 4, the interval between the two metal patches 103 is equivalent to a capacitance C, and the metal via 105 and the metal floor 101 are equivalent to an inductance L.

The capacitance C can be estimated by the empirical formula:

where r is the radius of the circular metal patch 103, epsilon _r is the dielectric relative permittivity, and g is the spacing between adjacent metal patches 103.

The inductance L can be estimated by the empirical formula:

l=μh where μ is the medium permeability and h is the medium thickness.

The resonant frequency of the loop is:

in the case where each metal patch 103 is circular, it can be rapidly adjusted to a desired resonance frequency in a provided manner; and the circular metal patch 103 is adopted, so that the obtained stopband bandwidth is wider.

The above embodiment is not limited to the specific position of the metal patch 103, and in practical application, the metal patch 103 may be designed according to the direction requirement of the antenna signal, so the metal patch 103 is not provided in the direction in which the signal transmission is required, and the metal patch 103 is provided in the other directions to shield the surface wave.

Typically, the metal patches 103 are spaced around the microstrip patch 104 to increase the signal gain in the vertical direction of the antenna. Fig. 6 shows a top view of a patch antenna provided by an embodiment of the present application; as shown in fig. 6, a high-impedance surface structure is formed by a circular metal patch 103, a metal floor 101 and a metal via 105, and the antenna gain is improved by suppressing the propagation of surface waves. The metal patch 103 is arranged at each position around the microstrip patch 104, and the metal patch 103 is uniformly distributed in four directions of the microstrip patch 104.

In the embodiment of the application, the metal patches 103 are arranged at all positions around the microstrip patch 104, so that the propagation of the surface wave of the antenna to the periphery is inhibited, and the electromagnetic wave gain right above the antenna is further improved.

As shown in fig. 1-3, in some embodiments, the patch antenna may further include an open-cell metal plate 108 leading to the structure and sides. The guiding structure is at least one layer, and one layer of guiding structure comprises a dielectric layer 106 and a guiding patch 107; a layer of guiding structure close to the dielectric substrate 102, wherein the first surface of the dielectric layer 106 is attached to the second surface of the dielectric substrate 102; the guide patch 107 is provided on the second surface of the corresponding dielectric layer 106 at a position corresponding to the microstrip patch 104. The perforated metal sheet 108 is then attached to the side of the lead structure; the perforated metal sheet 108 is provided with a plurality of perforations.

In the embodiment of the application, the guiding structure is arranged above the patch antenna, the side surface of the guiding structure is provided with the perforated metal plate 108, the perforated metal plate has capacitance characteristic and the metal plate has inductance characteristic, and a defective ground structure is formed, namely the guiding structure is equivalent to a resonant circuit, so that the inhibition effect on surface waves is enhanced, and the gain is further improved.

In practice, the size of each opening of the open-cell metal plate 108 and the spacing between adjacent openings are determined by the desired resonant frequency and resonant bandwidth. The size of the openings and the spacing between adjacent openings can be determined by the desired resonant frequency and resonant bandwidth. In other words, the required resonant frequency and resonant bandwidth can be obtained through the size of the holes and the distance between the adjacent holes, the scheme is simple to realize, and the actual requirements can be met rapidly.

In addition, the number of layers of the guiding structure is set according to actual requirements, and the multi-layer guiding structure is attached in sequence. As shown in fig. 1, the first guiding structure layer, the second guiding structure layer and the third guiding structure layer are sequentially attached, and the guiding patch 107 of each layer is disposed above the dielectric layer 106.

Through setting up the multilayer of required number of layers and guiding the structure for the guiding the structure of every layer laminates in proper order with the same structure, has guaranteed the direction of transmission of radio wave, and makes foretell trompil metal sheet 108 can perfect laminating in the side.

As mentioned above, the perforated metal sheet 108 is then attached to the side edge of the guide structure; the perforated metal sheet 108 is provided with a plurality of perforations. In practical applications, it is generally necessary to increase the signal gain in the vertical direction of the antenna, so embodiments of the present application provide a specific structure, where each side of the guiding structure is attached to one open-pore metal plate 108, and the open-pore metal plates 108 on each side are connected to each other; the open-cell metal plate 108 is provided with open cells at various locations.

In this embodiment, the open-pore metal plate 108 is disposed on each side of the guiding structure, and the open-pore metal plate 108 is disposed at each position, so that the propagation of the surface wave of the antenna to the periphery is suppressed, and the electromagnetic wave gain directly above the antenna is improved.

In practical applications, the shape of the openings in the open-pore metal plate 108 is set according to practical requirements, and may include any one or any combination of the following: round, rectangular, diamond, triangular, regular polygon, and fractal curve. The shape of the opening can be selected according to actual demands, so that the actual demands are met.

FIG. 7 is a schematic view showing the structure of an open-pore metal plate according to an embodiment of the present application; as shown in fig. 7, two layers of circular openings are uniformly distributed on the open-pore metal plate 108, the circular openings of the open-pore metal plate 108 form a band-stop characteristic structure, and in the case that the openings of the open-pore metal plate 108 are all circular, the opening radius d of the open-pore metal plate 108 is determined by the required resonance frequency; the ratio d/a between the aperture radius of the open cell metal plate 108 and the distance between the centers of two adjacent open cells is determined by the desired resonance bandwidth. The resonance frequency can be adjusted by changing the radius d of the opening, and the resonance bandwidth can be adjusted by changing the ratio d/a.

In this embodiment, in the case that each opening is circular, the ratio between the radius of the opening of the open-pore metal plate 108 and the distance between the centers of two adjacent openings can be adjusted to the required resonant frequency and resonant bandwidth according to the provided method.

In the solution provided in the foregoing embodiment, the microstrip patch 104 and the 3-layer guiding structure are adopted, and the metal patch 103 is disposed around the microstrip patch 104, where the metal patch 103 is connected to the floor through a metallized via hole, and may be equivalently a resonant circuit, so as to form a high-impedance surface with a bandpass characteristic, so as to inhibit propagation of a surface wave, and further implement energy beam-gathering. Meanwhile, the periphery of the 3-layer guiding structure is provided with a circular hole on the metal plate, so that electromagnetic wave energy leakage in the space is shielded, and the high-gain characteristic of the antenna is realized. The scheme provided by the embodiment of the application has the advantages of simple feed structure, easiness in processing and no influence on the radiation pattern and cross polarization characteristic of the antenna, and the structure is distributed around the antenna.

Fig. 8 is a schematic diagram showing characteristics of an antenna reflection coefficient S11 of a patch antenna according to an embodiment of the present application; as shown in FIG. 8, the patch antenna provided by the embodiment of the application works at 2.37-2.57GHz, and the reflection coefficient S11 is smaller than-10 dB, so that the patch antenna can be used for Bluetooth, wiFi and other scenes.

Fig. 9 shows a gain contrast plot of a patch antenna of an embodiment of the present application versus a conventional antenna; as shown in fig. 9, the dashed line represents the gain of the conventional antenna, and the solid line is the patch antenna with the high-impedance surface structure and the open-pore metal plate 108 added, and the gain is improved by 1.6dB after the metal open-pore, the metal via 105 and the open-pore metal plate 108 are added in the embodiment of the present application.

Fig. 10 shows an antenna gain diagram of a patch antenna according to an embodiment of the present application; as shown in FIG. 10, the gains in the working frequency band of the antenna are all above 8.5dBi, and the performance is good.

Fig. 11 shows a far field pattern of a patch antenna of an embodiment of the present application; as shown in fig. 11, the antenna far field pattern energy is concentrated and the high impedance surface structure and the open cell metal plate 108 are effective.

In the foregoing, only the specific embodiments of the present application are described, and it will be clearly understood by those skilled in the art that, for convenience and brevity of description, the specific working processes of the systems, modules and units described above may refer to the corresponding processes in the foregoing method embodiments, which are not repeated herein. It should be understood that the scope of the present application is not limited thereto, and any equivalent modifications or substitutions can be easily made by those skilled in the art within the technical scope of the present application, and they should be included in the scope of the present application.

Claims (11)

1. A patch antenna, comprising:

The metal floor is provided with a feed port;

The first surface of the dielectric substrate is attached to the metal floor, and the second surface of the dielectric substrate is provided with microstrip patches and a plurality of metal patches; a plurality of metal vias are arranged on the dielectric substrate;

The metal patches are arranged around the microstrip patches and are connected with the metal floor through the metal via holes respectively.

2. The patch antenna of claim 1 wherein the size of each of said metal patches and the spacing between adjacent ones of said metal patches is determined based on the desired resonant frequency and the relative permittivity, dielectric permeability and dielectric thickness of said dielectric substrate.

3. The patch antenna of claim 1, wherein the microstrip patch is disposed in a central region of the dielectric substrate, and the plurality of metal patches are disposed at intervals around the circumference of the microstrip patch.

4. A patch antenna as claimed in any one of claims 1 to 3, further comprising:

at least one layer of guiding structure, each layer of guiding structure comprises a medium layer and a guiding patch; in the guiding structure, a first surface of the medium layer is attached to a second surface of the medium substrate; the guiding patch is arranged at a position corresponding to the microstrip patch on the second surface of the corresponding dielectric layer.

5. The patch antenna of claim 4 wherein the steering structure comprises a plurality of layers of sequentially bonded steering structures.

6. The patch antenna of claim 4, further comprising: an open-pore metal plate attached to the side edge of the guiding structure; the open-cell metal plate includes a plurality of open cells.

7. The patch antenna of claim 6 wherein the size of each aperture and the spacing between adjacent apertures of said apertured metal plate is determined by the desired resonant frequency and resonant bandwidth.

8. The patch antenna of claim 6 wherein each side of said director structure is attached to one of said open cell metal plates, said open cell metal plates of each side being interconnected;

and openings are formed in all positions of the open-pore metal plate.

9. The patch antenna of claim 6, wherein the shape of each of the metal patches and the openings in the open-cell metal plate comprises any one or any combination of: round, rectangular, diamond, triangular, regular polygon, and fractal curve.

10. The patch antenna of claim 2 wherein each of said metal patches is circular;

The radius of each metal patch and the distance between adjacent metal patches are determined according to the required resonant frequency, the relative dielectric constant of the dielectric substrate, the dielectric permeability and the dielectric thickness.

11. The patch antenna of claim 6 wherein the openings of the open-cell metal plates are all circular;

the aperture radius of the open-pore metal plate is determined by the required resonance frequency;

The ratio of the opening radius of the open-pore metal plate to the distance between the centers of two adjacent open-pore centers is determined by the required resonance bandwidth.