CN119217259B - Cleaning solution feeding device for wafer and feeding method thereof - Google Patents
Cleaning solution feeding device for wafer and feeding method thereof Download PDFInfo
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- CN119217259B CN119217259B CN202411744710.5A CN202411744710A CN119217259B CN 119217259 B CN119217259 B CN 119217259B CN 202411744710 A CN202411744710 A CN 202411744710A CN 119217259 B CN119217259 B CN 119217259B
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 238000004140 cleaning Methods 0.000 title claims abstract description 21
- 239000002245 particle Substances 0.000 claims abstract description 45
- 239000007788 liquid Substances 0.000 claims abstract description 43
- 239000000463 material Substances 0.000 claims abstract description 13
- 238000000429 assembly Methods 0.000 claims abstract description 10
- 230000000712 assembly Effects 0.000 claims abstract description 10
- 238000007790 scraping Methods 0.000 claims description 117
- 238000010408 sweeping Methods 0.000 claims description 84
- 235000012431 wafers Nutrition 0.000 claims description 38
- 238000007789 sealing Methods 0.000 claims description 25
- 238000007599 discharging Methods 0.000 claims description 16
- 239000013618 particulate matter Substances 0.000 claims description 15
- 239000012530 fluid Substances 0.000 claims description 13
- 239000002002 slurry Substances 0.000 claims description 7
- 229910003460 diamond Inorganic materials 0.000 abstract description 24
- 239000010432 diamond Substances 0.000 abstract description 24
- 241001417527 Pempheridae Species 0.000 abstract 5
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 16
- 229910010271 silicon carbide Inorganic materials 0.000 description 16
- 230000000694 effects Effects 0.000 description 6
- 238000005498 polishing Methods 0.000 description 4
- 239000003082 abrasive agent Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000014509 gene expression Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 206010040925 Skin striae Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 210000003437 trachea Anatomy 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
本发明属于输送技术领域，尤其涉及晶元用清洁液供料装置及其供料方法；本发明提供了一种晶元用清洁液供料装置，包括：定位盘，其上等间距开设有若干下料孔；输送环，且各下料孔均布在内外圈之间；若干刮片组件，环绕所述输送环周向设置，且各刮片组件均分别对应相应下料孔，且包括适于在输送环内滑动的刮扫件；其中，所述刮扫件的底部包括收料槽，且所述收料槽与刮扫件内的下料气管连通；所述刮扫件滑动使输送环底壁沉积的颗粒物进入收料槽且向下料孔聚拢，在刮扫件移动至下料孔上方时，将收料槽内颗粒物推入下料孔;通过刮片组件的设置，避免了研磨液中的颗粒物沉积在输送环内，提高了研磨效率和钻石液的利用率。
The present invention belongs to the field of conveying technology, and in particular to a wafer cleaning liquid feeding device and a feeding method thereof; the present invention provides a wafer cleaning liquid feeding device, comprising: a positioning plate, on which a plurality of discharge holes are opened at equal intervals; a conveying ring, and each discharge hole is evenly distributed between an inner and outer ring; a plurality of scraper blade assemblies are circumferentially arranged around the conveying ring, and each scraper blade assembly corresponds to a corresponding discharge hole, and comprises a scraper and sweeper member suitable for sliding in the conveying ring; wherein the bottom of the scraper and sweeper member comprises a material receiving groove, and the material receiving groove is connected with a discharge air pipe in the scraper and sweeper member; the sliding of the scraper and sweeper member causes particles deposited on the bottom wall of the conveying ring to enter the material receiving groove and gather toward the discharge hole, and when the scraper and sweeper member moves above the discharge hole, the particles in the material receiving groove are pushed into the discharge hole; through the arrangement of the scraper blade assembly, particles in the grinding liquid are prevented from being deposited in the conveying ring, thereby improving the grinding efficiency and the utilization rate of the diamond liquid.
Description
Technical Field
The invention belongs to the technical field of conveying, and particularly relates to liquid distribution, in particular to a cleaning liquid feeding device for a wafer and a feeding method thereof.
Background
In the semiconductor silicon carbide substrate industry, the traditional wafer grinding method is coarse grinding to remove surface striae and a surface damage layer of a silicon carbide wafer caused in the cutting process, and repair deformation generated by cutting. Due to the high hardness of SiC (silicon carbide), the crystal surface of SiC chips must be ground using a high-hardness abrasive during the grinding process. The surface of the silicon carbide wafer is ground by using micron-sized diamond particles in the diamond liquid, so that the rapid thinning can be realized.
In the related art, holes are uniformly drilled in a conveying ring and are connected with a positioning disc through pipelines, diamond liquid is dripped on the positioning disc along uniformly distributed pipelines in the conveying ring, the diamond liquid is uniformly distributed on the positioning disc through the rotation of a free wheel, then a silicon carbide wafer is fixed in the middle of the free wheel, certain pressure and rotation speed are applied to the silicon carbide wafer, so that the silicon carbide wafer and the positioning disc have relative speed difference and pressure, the silicon carbide wafer is ground, and the rapid thinning of the silicon carbide wafer is realized.
However, the conventional conveying ring flows diamond liquid to the positioning disk through the pipeline only by virtue of the rotating inertia, so that diamond particles in the diamond liquid are easy to deposit, the diamond particles are unevenly distributed, the use efficiency of diamond abrasive materials is reduced, the loss of the diamond liquid is increased, and the wafer removal amount is unstable.
Therefore, how to avoid the problem of unstable wafer removal caused by the reduced use efficiency and high usage of the polishing slurry is a technical problem in the art.
It should be noted that the above information disclosed in this background section is only for understanding the background of the inventive concept and therefore the above description is not to be construed as constituting prior art information.
Disclosure of Invention
The embodiment of the disclosure at least provides a cleaning solution feeding device for a wafer and a working method thereof.
In a first aspect, an embodiment of the present disclosure provides a cleaning solution feeding device for a wafer, including:
the positioning disc is provided with a plurality of blanking holes at equal intervals;
The conveying ring comprises an inner ring and an outer ring, is arranged on the positioning disc, and is uniformly distributed between the inner ring and the outer ring;
The scraping blade assemblies are circumferentially arranged around the conveying ring, correspond to the corresponding blanking holes respectively and comprise scraping and sweeping pieces which are suitable for sliding in the conveying ring;
the bottom of the scraping and sweeping piece comprises a receiving groove which is communicated with a discharging air pipe in the scraping and sweeping piece;
The scraping and sweeping piece slides to enable particles deposited on the bottom wall of the conveying ring to enter the receiving groove and to be discharged Kong Julong, and the scraping and sweeping piece moves to the position above the discharging hole so as to push the particles in the receiving groove into the discharging hole.
In an alternative embodiment, the wiper blade assembly includes a stopper, which is hollow in the interior and is disposed on the outer wall of the delivery ring;
the connecting air pipe is arranged on the outer wall of one end of the limiting block and is communicated with the air pump;
one end of the scraping and sweeping piece is in sliding fit with the conveying ring, and the other end of the scraping and sweeping piece is in sliding fit with the inner wall of the limiting block;
the connecting air pipe conveys compressed air into the limiting block so as to push the scraping and sweeping piece to slide towards the direction of the blanking hole;
when the negative pressure suction limiting block of the air pipe is connected, the negative pressure suction scraping and sweeping piece is reset and slides.
In an alternative embodiment, the scraping and sweeping member is in an L shape, and is provided with an air hole therein, one end of the air hole faces the bottom wall of the conveying ring, and the other end faces the connecting air pipe.
In an alternative embodiment, a sealing plate is hinged to the inner wall of one end of the air hole, which is close to the connecting air pipe, and the sealing plate is suitable for opening and closing the air hole;
When the air pipe negative pressure suction limiting block is connected, the sealing plate is suitable for closing the air hole.
In an alternative embodiment, the opening of the material receiving groove gradually increases outwards from one end close to the air hole;
when the scraping and sweeping piece moves towards the direction of the blanking hole, the collecting groove is suitable for guiding particulate matters to gather towards the air hole.
In an alternative embodiment, a plurality of liquid inlet pipes are arranged above the conveying ring, one liquid inlet pipe corresponds to one blanking hole, and the liquid inlet pipes are suitable for conveying grinding liquid into the conveying ring.
In an alternative embodiment, the positioning plate is provided with a plurality of blanking holes at equal intervals;
the conveying ring is arranged on the positioning disc, and the blanking hole is arranged between the inner ring and the outer ring of the conveying ring;
the scraping blade assemblies are circumferentially arranged around the conveying ring, and one scraping blade assembly corresponds to one blanking hole;
The scraping blade assembly comprises a limiting block, a scraping plate and a scraping plate, wherein the inside of the limiting block is hollow and is arranged on the outer wall of the conveying ring;
the connecting air pipe is arranged on the outer wall of one end of the limiting block and is communicated with the air pump;
one end of the scraping and sweeping piece is in sliding fit with the conveying ring, and the other end of the scraping and sweeping piece is in sliding fit with the inner wall of the limiting block;
compressed air is conveyed into the scraping blade assembly so as to push the scraping and sweeping piece to slide towards the discharging hole;
The scraping and sweeping piece is suitable for gathering particles deposited on the bottom wall of the conveying ring in the moving process;
The compressed air is adapted to push the particulate matter so that the particulate matter is uniformly mixed within the slurry.
In an alternative embodiment, an air hole is formed in the scraping and sweeping piece, one end of the air hole faces to the bottom wall of the conveying ring, and the other end of the air hole faces to the connecting air pipe.
In an alternative embodiment, a sealing plate is hinged to the inner wall of one end of the air hole, which is close to the connecting air pipe, and the sealing plate is suitable for opening and closing the air hole;
When the air pipe negative pressure suction limiting block is connected, the sealing plate is suitable for closing the air hole.
In an alternative embodiment, the scraping and sweeping member is provided with a receiving groove near the bottom wall of the conveying ring, the receiving groove is communicated with the air hole, and the opening of the receiving groove faces to the blanking hole;
the opening of the material collecting groove is gradually increased outwards from one end close to the air hole.
In a second aspect, embodiments of the present disclosure also provide a feeding method comprising:
the grinding fluid is conveyed into the conveying ring, and the grinding fluid is suitable for flowing to the positioning disc along the blanking hole;
compressed air is conveyed into the scraping blade assembly so as to push the scraping and sweeping piece to slide towards the direction of the blanking hole;
The scraping and sweeping piece is suitable for gathering particles deposited on the bottom wall of the conveying ring in the moving process;
The compressed air is adapted to push the particulate matter so that the particulate matter is uniformly mixed within the slurry.
The cleaning solution feeding device and the feeding method for the wafer have the beneficial effects that the compressed air is conveyed into the limiting block through the connecting air pipe by the cooperation of the scraping blade component and the conveying ring, and the compressed air can push the scraping piece to slide in the conveying ring so as to gather particles deposited on the bottom wall of the conveying ring and jet the particles to the grinding liquid again, so that the mixing effect of the particles and the grinding liquid is improved, the waste caused by the deposition of the particles in the grinding liquid is avoided, and the utilization rate of the grinding material is improved.
Additional features and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
In order to make the above objects, features and advantages of the present invention more comprehensible, preferred embodiments accompanied with figures are described in detail below.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described, and it is obvious that the drawings in the description below are some embodiments of the present invention, and other drawings can be obtained according to the drawings without inventive effort for a person skilled in the art.
Fig. 1 is a perspective view of a cleaning solution supply device for a wafer according to an embodiment of the disclosure;
FIG. 2 is a longitudinal cross-sectional perspective view of a transfer ring and wiper assembly provided by an embodiment of the present disclosure;
FIG. 3 is a cross-sectional perspective view of a wiper blade assembly provided by an embodiment of the present disclosure;
Fig. 4 is a schematic view of a sliding state of the wiper in the stopper according to the embodiment of the present disclosure;
FIG. 5 is a perspective view of a wiper provided by an embodiment of the present disclosure;
fig. 6 is a cross-sectional perspective view of a wiper provided by an embodiment of the present disclosure.
In the figure:
1. A positioning plate; 10 parts of blanking holes, 2 parts of conveying rings, 20 parts of liquid inlet pipes, 3 parts of scraping blade assemblies, 30 parts of scraping and sweeping parts, 31 parts of limiting blocks, 32 parts of connecting air pipes, 33 parts of air holes, 34 parts of air holes, sealing plates and 35 parts of material collecting tanks.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present invention more apparent, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings, and it is apparent that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
In this context, when it is mentioned that a first component is located on a second component, this may mean that the first component may be formed directly on the second component, or that a third component may be interposed between the first component and the second component. In addition, in the drawings, the thickness of the parts may be exaggerated or reduced for effective description of technical contents.
Example embodiments of the present disclosure will be described in more detail herein with reference to the accompanying drawings. As used herein, expressions such as "at least one of a..once more, modify an entire list of elements when following a list of elements, rather than modifying individual elements in the list. For example, the expression "at least one of a, b and c" should be understood to include a only a, b only, c only, both a and b, both a and c, both b and c, or all of a, b and c.
The terminology used herein is for the purpose of describing particular example configurations only and is not intended to be limiting. As used herein, the singular articles "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. The terms "comprises," "comprising," and "having" are inclusive and therefore specify the presence of stated features, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and/or groups thereof. The method steps, processes, and operations described herein should not be construed as necessarily requiring their performance in the particular order discussed or illustrated, unless specifically identified as an order of performance. Additional or alternative steps may be employed.
As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that a particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Thus, a particular feature, structure, or characteristic may be included within more than one embodiment of the disclosure, such that the phrases are not necessarily referring to the same embodiment. As used herein, the terms "exemplary," "exemplary," and the like are used for purposes of illustration, example, or description. Any embodiment, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or advantageous over other embodiments, aspects, or designs. Rather, use of the terms "example," "exemplary," and the like are intended to present concepts in a concrete fashion.
According to research, the defects of the prior art are found that in the related art, holes are uniformly drilled in a conveying ring and are connected with a positioning disc through pipelines, diamond liquid is dripped on the positioning disc along uniformly distributed pipelines in the conveying ring, the diamond liquid is uniformly distributed on the positioning disc through the rotation of a free star wheel, then a silicon carbide wafer is fixed in the middle of the free star wheel, certain pressure and rotation speed are applied to the silicon carbide wafer, so that the silicon carbide wafer and the positioning disc have relative speed difference and pressure, the silicon carbide wafer is ground, and the rapid thinning of the silicon carbide wafer is realized.
However, the conventional conveying ring flows diamond liquid to the positioning disk through the pipeline only by virtue of the rotating inertia, so that diamond particles in the diamond liquid are easy to deposit, uneven distribution of the diamond particles is caused, the use efficiency of diamond abrasive materials is reduced, the loss of the diamond liquid is increased, and the wafer removal amount is unstable.
Therefore, how to avoid the problem of depositing diamond particles in diamond liquid is a technical problem that needs to be solved in the art.
The defects of the scheme are all results obtained by the inventor after practice and careful study, and therefore, the discovery process of the above problems, and the solutions proposed herein by the present disclosure for the above problems, should be all the contribution of the inventors to the present disclosure in the process of the present disclosure.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
Some embodiments of the invention are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.
As shown in fig. 1 to 6, some embodiments provide a cleaning solution feeding device for a wafer, including:
The positioning disc 1 is provided with a plurality of blanking holes 10 at equal intervals, the lower end of the positioning disc 1 is provided with a grinding disc, and grinding fluid flowing downwards through the blanking holes 10 is suitable for flowing to the grinding surface of the grinding disc.
Further, in order to improve the polishing efficiency, the polishing liquid is diamond liquid, i.e. liquid mixed with diamond particles in the polishing liquid, so as to realize rapid wafer thinning processing. The conveying ring 2 comprises an inner ring and an outer ring, is arranged on the positioning disk 1, and is uniformly distributed among the inner ring and the outer ring, round holes corresponding to the blanking holes 10 are formed in the bottom wall of the conveying ring 2, and after the grinding fluid in the conveying ring 2 flows to the blanking holes 10, the grinding fluid is suitable for flowing between the grinding surface of the grinding disk and the wafer. The scraping blade assemblies 3 are circumferentially arranged around the conveying ring 2, each scraping blade assembly 3 corresponds to a corresponding blanking hole 10 and comprises a scraping and sweeping piece 30 suitable for sliding in the conveying ring 2, a plurality of scraping blade assemblies 3 are circumferentially arranged around the conveying ring 2, one scraping blade assembly 3 corresponds to one blanking hole 10, the scraping and sweeping pieces 30 of the scraping blade assemblies 3 are suitable for sliding back and forth in the conveying ring 2, grinding fluid flows to the grinding surface of the grinding disc below the positioning disc 1 through the blanking holes 10, the positioning disc 1 rotates to grind wafers, compressed air is conveyed into the scraping and sweeping pieces 30 are pushed to slide in the direction of the blanking holes 10, the scraping and sweeping pieces 30 are suitable for gathering particles deposited on the bottom wall of the conveying ring 2 in the moving process, and the compressed air is suitable for pushing the particles to be uniformly mixed in the grinding fluid. The bottom of the scraping and sweeping piece 30 comprises a receiving groove 35, the receiving groove 35 is communicated with a discharging air pipe in the scraping and sweeping piece 30, the scraping and sweeping piece 30 slides to enable particles deposited on the bottom wall of the conveying ring 2 to enter the receiving groove 35 and gather towards the discharging hole 10, and the scraping and sweeping piece 30 moves to the position above the discharging hole 10 to push the particles in the receiving groove 35 into the discharging hole 10. Through the cooperation of doctor-bar subassembly 3 and conveying ring 2, connecting trachea 32 carries compressed air in to stopper 31, and compressed air can promote and scrape and sweep piece 30, makes it slide in conveying ring 2 to gather together the particulate matter of conveying ring 2 interior bottom deposit and spout the lapping liquid once more, improved the mixed effect of particulate matter and lapping liquid, avoided the waste that the particulate matter deposit in the lapping liquid leads to, improved the utilization ratio of abrasive.
Referring to fig. 2, the scraping blade assembly 3 includes a limiting block 31, the inside of which is hollow and is disposed on the outer wall of the conveying ring 2, one limiting block 31 corresponds to one blanking hole 10, the limiting block 31 is arc-shaped, and two ends of the limiting blocks 31 are respectively abutted with adjacent limiting blocks 31. The connecting air pipe 32 is arranged on the outer wall of one end of the limiting block 31 and is communicated with the air pump, the connecting air pipe is arranged at one end of the limiting block 31 far away from the blanking hole 10, the connecting air pipe 32 conveys compressed air into the limiting block 31, the compressed air is suitable for pushing the scraping and sweeping piece 30 to enable the scraping and sweeping piece 30 to move towards the blanking hole 10, the scraping and sweeping piece 30 slides in the conveying ring 2 and is suitable for gathering and scraping particles deposited on the inner bottom wall of the conveying ring 2, and the particles are diamond particles in grinding liquid. Meanwhile, part of compressed air flows into the conveying ring 2 through the air holes 33, and the particles gathered to the position of the blanking hole 10 are collected by the collecting groove 35 and meet the compressed air, so that the compressed air is suitable for spraying water to the particles to enable the particles to move to the outside of the scraping and sweeping piece 30, the mixing effect of the particles and grinding fluid is improved, and the particles are prevented from being deposited on the inner bottom wall of the conveying ring 2. When the scraping and sweeping piece 30 is reset and moved, the air pump sucks the limiting block 31 under negative pressure, and the negative pressure in the limiting block 31 is suitable for sucking the scraping and sweeping piece 30 so as to enable the scraping and sweeping piece 30 to move towards the direction of the connecting air pipe 32. One end of the scraping and sweeping piece 30 is in sliding fit with the conveying ring 2, and the other end of the scraping and sweeping piece is in sliding fit with the inner wall of the limiting block 31, wherein a connecting air pipe 32 conveys compressed air into the limiting block 31 to push the scraping and sweeping piece 30 to slide towards the blanking hole 10, and when the connecting air pipe 32 sucks the limiting block 31 in a negative pressure mode, the scraping and sweeping piece 30 is sucked in a negative pressure mode to reset and slide. One side of the blanking hole 10 away from the corresponding scraping and sweeping piece 30 is provided with a stop block, and when the scraping and sweeping piece 30 moves towards the blanking hole 10, the stop block is suitable for blocking particles so that the particles fall into the blanking hole 10.
Referring to fig. 6, the scraping and sweeping member 30 is in an "L" shape, and has an air hole 33 formed therein, one end of the air hole 33 faces the bottom wall of the conveying ring 2, and the other end faces the connecting air pipe 32. When the connecting air pipe 32 conveys compressed air into the scraping and sweeping piece 30, the compressed air is suitable for pushing the scraping and sweeping piece 30 to move away from the connecting air pipe 32, and part of the compressed air flows to the conveying ring 2 along the air holes 33. In order to enable the scraping and sweeping member 30 to reset in the limiting block 31, a sealing plate 34 is hinged to the inner wall of one end, close to the connecting air pipe 32, of the air hole 33, the sealing plate 34 is suitable for opening and closing the air hole 33, and when compressed air is conveyed into the limiting block 31, the compressed air is suitable for pushing the sealing plate 34 to open the air hole 33, and the compressed air flows to the conveying ring 2 through the air hole 33. And the sealing plate 34 is adapted to close the air hole 33 when the air pipe 32 is connected to the negative pressure suction stopper 31. At this time, the connecting air pipe 32 sucks the stopper 31 under negative pressure, and after negative pressure is formed in the stopper 31, the wiper 30 can slide in the stopper 31 in the direction of the connecting air pipe 32.
In order to improve the air tightness between the scraping and sweeping part 30 and the limiting block 31, a chute is formed in the side wall, close to the conveying ring 2, of the limiting block 31, the scraping and sweeping part 30 is slidably arranged in the chute, sealing strips are respectively arranged on the upper wall and the lower wall of the chute, the two sealing strips are staggered with each other, the side walls are abutted, the scraping and sweeping part 30 slides between the two sealing strips, and the arrangement of the sealing strips prevents air in the limiting block 31 from leaking outwards.
Referring to fig. 5, in order to improve the gathering effect on the granular materials on the bottom wall of the conveying ring 2, the scraping and sweeping member 30 is provided with a receiving groove 35 near the bottom wall of the conveying ring 2, the receiving groove 35 is communicated with the air hole 33, and the opening of the receiving groove 35 faces the discharging hole 10. The opening of the material collecting groove 35 gradually increases from one end close to the air hole 33 to the outside, wherein the material collecting groove 35 is suitable for guiding the particles to gather towards the air hole 33 when the scraping and sweeping piece 30 moves towards the blanking hole 10. When the connecting air pipe 32 conveys compressed air into the limiting block 31, the compressed air is suitable for pushing the scraping and sweeping piece 30 to move in the direction away from the connecting air pipe 32, at the moment, the collecting groove 35 is suitable for gathering particles deposited on the inner bottom wall of the conveying ring 2, the collecting groove guides the particles to move towards the air hole 33, further, part of compressed air flows towards the conveying ring 2 through the air hole 33, the gathered particles are blown by the compressed air to move in the direction away from the scraping and sweeping piece 30, the mixing effect of the particles and grinding liquid is improved, the scraping and sweeping piece 30 gradually moves towards the blanking hole 10, and the scraping and sweeping piece 30 is suitable for pushing the particles to pass through the blanking hole 10 and flow between the grinding surface of the grinding disc below the positioning disc 1 and the wafer. Referring to fig. 4, when the scraping and sweeping member 30 moves to the position right above the discharging hole 10, the air hole 33 overlaps the discharging hole 10, the compressed air in the discharging hole 10 is suitable for being blown to the discharging hole 10 to avoid the blockage of the discharging hole 10 by the particulate matters, and when the scraping and sweeping member 30 is reset, the air pump negative pressure suction limiting block 31 and the sealing plate 34 seal the air hole 33 under the negative pressure effect, and the scraping and sweeping member 30 is sucked by the negative pressure and moves towards the direction of the connecting air pipe 32.
Referring to fig. 1, a plurality of liquid inlet pipes 20 are arranged above the conveying ring 2, and the liquid inlet pipes 20 are suspended, i.e. a space is arranged between the lower ends of the liquid inlet pipes 20 and the conveying ring 2. One feed pipe 20 corresponds to one blanking hole 10, and the feed pipe 20 is suitable for conveying grinding fluid into the conveying ring 2.
Some embodiments provide a cleaning solution feeding device for a wafer, including:
the positioning disk 1 is provided with a plurality of blanking holes 10 at equal intervals;
The conveying ring 2 is arranged on the positioning disc 1, and the blanking holes 10 are arranged between the inner ring and the outer ring of the conveying ring 2;
the scraping blade assemblies 3 are circumferentially arranged around the conveying ring 2, and one scraping blade assembly 3 corresponds to one blanking hole 10;
the scraping blade assembly 3 comprises a limiting block 31, a scraping blade and a scraping blade, wherein the inside of the limiting block is hollow and is arranged on the outer wall of the conveying ring 2;
the connecting air pipe 32 is arranged on the outer wall of one end of the limiting block 31 and is communicated with the air pump;
the scraping and sweeping piece 30 has one end slidingly matched with the conveying ring 2 and the other end slidingly matched with the inner wall of the limiting block 31;
wherein, compressed air is conveyed into the scraping blade assembly 3 to push the scraping and sweeping piece 30 to slide towards the blanking hole 10;
The scraping and sweeping piece 30 is suitable for gathering particles deposited on the bottom wall of the conveying ring 2 in the moving process;
The compressed air is adapted to push the particulate matter so that the particulate matter is uniformly mixed within the slurry.
Further, an air hole 33 is formed in the scraping and sweeping member 30, one end of the air hole 33 faces the bottom wall of the conveying ring 2, and the other end faces the connecting air pipe 32.
Further, a sealing plate 34 is hinged to the inner wall of the air hole 33 near one end of the connecting air pipe 32, and the sealing plate 34 is suitable for opening and closing the air hole 33;
Wherein, when the air pipe 32 is connected with the negative pressure suction limiting block 31, the sealing plate 34 is suitable for closing the air hole 33.
Further, the scraping and sweeping member 30 is provided with a receiving groove 35 near the bottom wall of the conveying ring 2, the receiving groove 35 is communicated with the air hole 33, and the opening of the receiving groove 35 faces the discharging hole 10;
the opening of the material receiving groove 35 gradually increases from one end close to the air hole 33.
Some embodiments provide a method of feeding, the feeding method comprises the following steps:
The grinding fluid is conveyed into the conveying ring 2, and the grinding fluid is suitable for flowing to the positioning disc 1 along the blanking hole 10;
compressed air is conveyed into the scraping blade assembly 3 so as to push the scraping and sweeping piece 30 to slide towards the blanking hole 10;
The scraping and sweeping piece 30 is suitable for gathering particles deposited on the bottom wall of the conveying ring 2 in the moving process;
The compressed air is adapted to push the particulate matter so that the particulate matter is uniformly mixed within the slurry.
In describing embodiments of the present invention, unless explicitly stated or limited otherwise, the terms "mounted," "connected," "coupled," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements. The specific meaning of the above terms in the present invention will be understood in specific cases by those of ordinary skill in the art.
In the description of the present invention, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention. Moreover, terms such as "first," "second," and other numerical terms when used herein do not imply a sequence or order unless clearly indicated by the context. Thus, a first element, component, region, layer or section discussed above could be termed a second element, component, region, layer or section without departing from the teachings of the example embodiments.
With the above-described preferred embodiments according to the present invention as an illustration, the above-described descriptions can be used by persons skilled in the relevant art to make various changes and modifications without departing from the scope of the technical idea of the present invention. The technical scope of the present invention is not limited to the description, but must be determined according to the scope of claims.
Claims (10)
1. A cleaning solution feeding device for a wafer, comprising:
the positioning disc (1) is provided with a plurality of blanking holes (10) at equal intervals;
The conveying ring (2) comprises an inner ring and an outer ring, is arranged on the positioning disc (1), and the blanking holes (10) are uniformly distributed between the inner ring and the outer ring;
The scraping blade assemblies (3) are circumferentially arranged around the conveying ring (2), and each scraping blade assembly (3) corresponds to a corresponding blanking hole (10) and comprises a scraping and sweeping piece (30) which is suitable for sliding in the conveying ring (2);
The bottom of the scraping and sweeping piece (30) comprises a receiving groove (35), and the receiving groove (35) is communicated with a discharging air pipe in the scraping and sweeping piece (30);
The scraping and sweeping piece (30) slides to enable particles deposited on the bottom wall of the conveying ring (2) to enter the receiving groove (35) and gather towards the blanking hole (10), and the scraping and sweeping piece (30) moves to the position above the blanking hole (10) so as to push the particles in the receiving groove (35) into the blanking hole (10);
the scraping blade assembly (3) comprises a limiting block (31), wherein the inside of the limiting block is hollow and is arranged on the outer wall of the conveying ring (2);
The connecting air pipe (32) is arranged on the outer wall of one end of the limiting block (31) and is communicated with the air pump;
one end of the scraping and sweeping piece (30) is in sliding fit with the conveying ring (2), and the other end of the scraping and sweeping piece is in sliding fit with the inner wall of the limiting block (31);
The connecting air pipe (32) conveys compressed air into the limiting block (31) so as to push the scraping and sweeping piece (30) to slide towards the blanking hole (10);
when the negative pressure suction limiting block (31) of the air pipe (32) is connected, the negative pressure suction scraping and sweeping piece (30) is reset and slides.
2. The cleaning solution supply device for a wafer according to claim 1, wherein,
The scraping and sweeping piece (30) is L-shaped, an air hole (33) is formed in the scraping and sweeping piece, one end of the air hole (33) faces to the bottom wall of the conveying ring (2), and the other end of the air hole faces to the connecting air pipe (32).
3. The cleaning solution supply device for a wafer according to claim 2, wherein,
A sealing plate (34) is hinged to the inner wall of one end, close to the connecting air pipe (32), of the air hole (33), and the sealing plate (34) is suitable for opening and closing the air hole (33);
Wherein, when the air pipe (32) is connected with the negative pressure suction limiting block (31), the sealing plate (34) is suitable for closing the air hole (33).
4. The cleaning solution supply device for a wafer according to claim 2, wherein,
The opening of the material receiving groove (35) is gradually increased outwards from one end close to the air hole (33);
Wherein, when the scraping and sweeping piece (30) moves towards the blanking hole (10), the collecting groove (35) is suitable for guiding the particles to gather towards the air hole (33).
5. The cleaning solution supply device for a wafer according to claim 1, wherein,
A plurality of liquid inlet pipes (20) are arranged above the conveying ring (2), one liquid inlet pipe (20) corresponds to one blanking hole (10), and the liquid inlet pipe (20) is suitable for conveying grinding liquid into the conveying ring (2).
6. A cleaning solution feeding device for a wafer, comprising:
the positioning disc (1) is provided with a plurality of blanking holes (10) at equal intervals;
The conveying ring (2) is arranged on the positioning disc (1), and the blanking hole (10) is arranged between the inner ring and the outer ring of the conveying ring (2);
The scraping blade assemblies (3) are circumferentially arranged around the conveying ring (2), and one scraping blade assembly (3) corresponds to one blanking hole (10);
the scraping blade assembly (3) comprises a limiting block (31), wherein the inside of the limiting block is hollow and is arranged on the outer wall of the conveying ring (2);
The connecting air pipe (32) is arranged on the outer wall of one end of the limiting block (31) and is communicated with the air pump;
one end of the scraping and sweeping piece (30) is in sliding fit with the conveying ring (2), and the other end of the scraping and sweeping piece is in sliding fit with the inner wall of the limiting block (31);
Wherein, compressed air is conveyed into the scraping blade component (3) to push the scraping and sweeping piece (30) to slide towards the blanking hole (10);
the scraping and sweeping piece (30) is suitable for gathering particles deposited on the bottom wall of the conveying ring (2) in the moving process;
The compressed air is adapted to push the particulate matter so that the particulate matter is uniformly mixed within the slurry.
7. The cleaning solution supply device for a wafer as claimed in claim 6, wherein,
An air hole (33) is formed in the scraping and sweeping piece (30), one end of the air hole (33) faces to the bottom wall of the conveying ring (2), and the other end of the air hole faces to the connecting air pipe (32).
8. The cleaning solution supply device for a wafer as claimed in claim 7, wherein,
A sealing plate (34) is hinged to the inner wall of one end, close to the connecting air pipe (32), of the air hole (33), and the sealing plate (34) is suitable for opening and closing the air hole (33);
Wherein, when the air pipe (32) is connected with the negative pressure suction limiting block (31), the sealing plate (34) is suitable for closing the air hole (33).
9. The cleaning solution supply device for a wafer as claimed in claim 8, wherein,
The scraping and sweeping piece (30) is provided with a receiving groove (35) close to the bottom wall of the conveying ring (2), the receiving groove (35) is communicated with the air hole (33), and an opening of the receiving groove (35) faces to the blanking hole (10);
the opening of the material collecting groove (35) is gradually increased outwards from one end close to the air hole (33).
10. A feeding method, characterized in that a cleaning liquid feeding device for wafers according to any one of claims 1 to 9 is used, comprising:
The grinding fluid is conveyed into the conveying ring (2), and the grinding fluid is suitable for flowing to the positioning disc (1) along the blanking hole (10);
compressed air is conveyed into the scraping blade assembly (3) so as to push the scraping and sweeping piece (30) to slide towards the blanking hole (10);
the scraping and sweeping piece (30) is suitable for gathering particles deposited on the bottom wall of the conveying ring (2) in the moving process;
The compressed air is adapted to push the particulate matter so that the particulate matter is uniformly mixed within the slurry.
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| CN202411744710.5A CN119217259B (en) | 2024-12-02 | 2024-12-02 | Cleaning solution feeding device for wafer and feeding method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN118073246A (en) * | 2024-04-09 | 2024-05-24 | 常熟市兆恒众力精密机械有限公司 | Automatic change semiconductor wafer and wash drying device |
| CN118238061A (en) * | 2024-04-16 | 2024-06-25 | 北京云汉星驰激光技术有限公司 | Optical lens grinding machine and grinding method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| WO1999051397A1 (en) * | 1998-04-06 | 1999-10-14 | Ebara Corporation | Polishing device |
| DE19900928C2 (en) * | 1999-01-13 | 2001-10-31 | Bosch Gmbh Robert | Dust cover for a grinding tool |
| EP1075898A3 (en) * | 1999-08-13 | 2003-11-05 | Mitsubishi Materials Corporation | Dresser and dressing apparatus |
| JP2003181756A (en) * | 2001-12-19 | 2003-07-02 | Tokyo Seimitsu Co Ltd | Conditioner for wafer processing apparatus |
| KR101248182B1 (en) * | 2004-02-26 | 2013-03-27 | 어플라이드 머티어리얼스, 인코포레이티드 | In-situ clean chamber for front end of line fabrication |
| US7972961B2 (en) * | 2008-10-09 | 2011-07-05 | Asm Japan K.K. | Purge step-controlled sequence of processing semiconductor wafers |
| CN218904932U (en) * | 2023-01-16 | 2023-04-25 | 新乡日升数控轴承装备股份有限公司 | Ball stacking detection device of steel ball grinder material tray |
| CN118848714B (en) * | 2024-09-27 | 2025-02-14 | 浙江丽水中欣晶圆半导体科技有限公司 | Epitaxial wafer back side flatness processing device and processing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN118073246A (en) * | 2024-04-09 | 2024-05-24 | 常熟市兆恒众力精密机械有限公司 | Automatic change semiconductor wafer and wash drying device |
| CN118238061A (en) * | 2024-04-16 | 2024-06-25 | 北京云汉星驰激光技术有限公司 | Optical lens grinding machine and grinding method |
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