CN119369283B

CN119369283B - Automatic polishing device for semiconductor chemical machinery

Info

Publication number: CN119369283B
Application number: CN202411750508.3A
Authority: CN
Inventors: 吴启祥
Original assignee: Wuxi Tx Semicon Co ltd
Current assignee: Wuxi Tx Semicon Co ltd
Priority date: 2024-12-02
Filing date: 2024-12-02
Publication date: 2025-06-10
Anticipated expiration: 2044-12-02
Also published as: CN119369283A

Abstract

The invention relates to the technical field of chemical mechanical polishing, in particular to a semiconductor chemical mechanical automatic polishing device which comprises a polishing table arranged in CMP equipment, wherein the polishing table comprises a polishing belt, the polishing belt is in a closed-loop equilateral triangle layout, the top surface of the polishing belt is horizontally arranged, and three corners of the polishing belt are respectively sleeved with a roller I. This chemical mechanical polishing equipment has adopted the grinding table of equilateral triangle outward appearance, its equilateral triangle's conveyer belt structural layout of grinding belt has replaced the circular grinding pad that traditional tiling set up, other two sides of grinding belt can clear up in step at the in-process of grinding, the volume of having reduced by a wide margin, the cleaning time shortens greatly, in time provide clean abrasive surface for the grinding table, saved traditional washing latency, the wafer surface residue of getting rid of that still can be quick safe has brought the powerful work efficiency that traditional level pavement list Zhang Yanmo pad did not possess for grinding and the cleanness of wafer.

Description

Automatic polishing device for semiconductor chemical machinery

Technical Field

The invention relates to the technical field of chemical mechanical polishing, in particular to a semiconductor chemical mechanical automatic polishing device.

Background

The chemical mechanical rough grinding equipment for the wafer generally comprises a mechanical arm for picking up and driving the wafer to rotationally grind on a grinding pad, a platform for supporting the grinding pad, a spraying device for providing grinding agent and a cleaning device for cleaning the grinding pad and the wafer.

The polishing process of the wafer needs to be carried out for a plurality of times, the polishing process is carried out from rough polishing to fine polishing, components polished from the wafer in the polishing process can become impurities to fill gaps of a polishing pad to reduce the rough polishing efficiency of polishing, so cleaning work among different polishing stages is very important, the cleaning mode is generally flushing or flushing and carrying out light polishing action on the wafer, so that the wafer is cleaned and sticky tiny impurity particles are removed at the same time, but in practice, the flushing effect of the conventional chemical mechanical polishing equipment is not ideal due to the physical characteristics of the wafer, such as thin and fragile wafer and the porous polishing pad, a long flushing time is required and a large amount of water resources are consumed, so that the cleaning time in the wafer polishing process of the conventional chemical mechanical polishing equipment is shortened, the production efficiency is improved, and the consumption of water is reduced, so that the equipment is more energy-saving and environment-friendly.

Disclosure of Invention

The present invention has been made in view of the above-mentioned problems or problems of long flushing time and large water consumption of the existing chemical mechanical polishing apparatus in the prior art.

It is, therefore, an object of the present invention to provide a semiconductor chemical mechanical polishing apparatus.

The technical scheme includes that the semiconductor chemical mechanical automatic polishing device comprises a polishing table arranged in CMP equipment, the polishing table comprises a polishing belt, the polishing belt is in a closed-loop equilateral triangle layout, the top end surface of the polishing belt is horizontally arranged, rollers I are sleeved in three corners of the polishing belt, two sides of the polishing belt are provided with equilateral triangle side frames in a matching mode, the rollers I are parallel to each other, two ends of the rollers I are rotationally connected with corners of the side frames, the bottom end of the polishing belt is provided with a roller II, the roller II is clamped with the polishing belt in parallel with the adjacent roller I, two ends of the roller II are provided with brackets, the top ends of the brackets are in sliding connection with the bottom ends of the adjacent side frames, the brackets are in oblique upward direction, the brackets are symmetrically arranged about the roller II, the side edges of the two side frames are located at diagonal positions, the side edges of the belts are parallel to the side edges of the side frames, the lowest side frames are respectively connected with the two side frames, two side frames are connected with two spindle shafts of the two spindle windings, two spindle carriers are connected with two spindle carriers and two spindle carriers are connected with two spindle carriers in parallel to the spindle, and two spindle carriers are connected with two spindle carriers in a sliding mode, and two spindle carriers are connected with two spindle carriers are respectively.

As a preferable scheme of the semiconductor chemical mechanical automatic polishing device, the top ends of the two frames are fixedly connected with flat plates, the edges of the flat plates are embedded with the top ends of the frames, and the flat plates are horizontally attached to the inner side of the top end face of the grinding belt.

As a preferable scheme of the semiconductor chemical mechanical automatic polishing device, the first roller and the rotating shaft thereof rotate freely, the second roller and the rotating shaft thereof are fixedly sleeved, the rotating shaft of the first roller and the frame, the rotating shaft of the second roller and the bracket are connected through bearings, belt wheels are arranged at two ends of the belt and are connected with the rotating shaft of the first roller, and the belt wheels are fixedly sleeved with the rotating shaft of the first roller.

As a preferable scheme of the semiconductor chemical mechanical automatic polishing device, the rotary shaft of the first roller, the frame and the bearing between the rotary shaft and the frame are relatively fixed, the rotary shaft of the second roller and the corresponding bearing are in sliding connection, cover plates are arranged on the sides, far away from each other, of the two brackets, nuts are arranged on the sides, far away from the brackets, of the cover plates, and the nuts are in threaded fastening with the rotary shaft of the second roller.

As a preferable scheme of the semiconductor chemical mechanical automatic polishing device, the top end of the support is integrally provided with the sliding block, the bottom end of the frame is provided with the dovetail chute, and the sliding block is matched with the dovetail chute in sliding connection.

As a preferable scheme of the semiconductor chemical mechanical automatic polishing device, the bottom of one side of the frame far away from the grinding belt is fixedly connected with a mounting seat, the side surface shape of the mounting seat is F-shaped, two motors are arranged on one side of the mounting seat far away from the frame in a high-low level difference mode, an output shaft of the motor positioned at a high level is coaxially connected with a rotating shaft of a first roller adjacent to the motor, and an output shaft of the motor positioned at a low level is connected with a rotating shaft of a second roller adjacent to the motor.

As a preferable scheme of the semiconductor chemical mechanical automatic polishing device, the rotating shaft of the first roller is connected with the motor output shaft through a rigid coupling, and the rotating shaft of the second roller is connected with the motor output shaft through a flexible coupling.

As a preferable scheme of the semiconductor chemical mechanical automatic polishing device, two ends of the sliding frame are both connected with sliding rails in a sliding manner, the sliding rails are fixedly connected with edges of adjacent frames of the sliding rails, two contact positions are arranged between the end parts of the sliding frame and the sliding rails, and when one of the two sliding frames is at a stroke top dead center, the other sliding frame is at a stroke bottom dead center.

As a preferable scheme of the semiconductor chemical mechanical automatic polishing device, an equilateral triangle inner frame is arranged in the frame, the triangles of the inner frame are fixedly connected with the middle points of the three sides of the frame respectively, and a cross beam is fixedly connected between the two inner frames.

As a preferable scheme of the semiconductor chemical mechanical automatic polishing device, two ends of one inner wall of the inner frame are hinged with guide pipes, two ends of each guide pipe are in a horn shape, two guide pipes are respectively sleeved with connecting pipes of a flushing spray head and an air drying spray head, and the flushing spray head and the air drying spray head are perpendicular to the belt walls of adjacent grinding belts.

The chemical mechanical polishing device has the beneficial effects that the chemical mechanical polishing device adopts the polishing table with the equilateral triangle appearance, the structure layout of the equilateral triangle conveyer belt of the polishing belt replaces the traditional circular polishing pad which is horizontally paved, besides the conventional polishing operation is realized, the other two side surfaces of the polishing belt can be cleaned synchronously in the polishing process, the flexible spray head arrangement and the back surface reciprocating sweeping flushing mode greatly reduce the water consumption, the cleaning time is greatly shortened, the clean polishing surface is provided for the polishing table in time, the traditional flushing waiting time is saved, the polishing belt continuously runs in the same direction and is matched with the flushing operation, the wafer surface residues can be rapidly and safely removed, and the powerful working efficiency which is not possessed by the traditional horizontal paving single Zhang Yanmo pad is brought for the polishing and cleaning of the wafer.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic view showing the overall structure of a semiconductor chemical mechanical polishing apparatus.

Fig. 2 is a schematic view showing the structure of a polishing table of the semiconductor chemical mechanical polishing apparatus.

Fig. 3 is a schematic view of the abrasive belt of fig. 2 cut through.

Fig. 4 is an exploded view of the partial structure of fig. 3 after removal of the abrasive tape.

Fig. 5 is an enlarged view of the structure at a in fig. 4.

Fig. 6 is an enlarged view of the structure at B in fig. 4.

Fig. 7 is a cross-sectional view of the partial structure of fig. 3.

Fig. 8 is an enlarged view of the structure at C in fig. 7.

Fig. 9 is an enlarged view of the structure at D in fig. 7.

Fig. 10 is a sectional view showing an assembled structure between a shower head and a carriage of the semiconductor chemical mechanical polishing apparatus.

Fig. 11 is an enlarged view of the structure at E in fig. 2.

Fig. 12 is a cross-sectional view of the structure of fig. 11.

Fig. 13 is an exploded view of the structure of fig. 11.

Fig. 14 is a schematic view showing a gap adjusting structure between the second roller and the first roller of the semiconductor chemical mechanical polishing apparatus.

100 Parts of CMP equipment, 200 parts of grinding table, 201 parts of grinding belt, 202 parts of roller I, 203 parts of frame, 204 parts of roller II, 205 parts of bracket, 206 parts of belt, 207 parts of belt wheel, 208 parts of carriage, 209 parts of flushing nozzle, 210 parts of air drying nozzle, 211 parts of flat plate, 212 parts of cover plate, 213 parts of nut, 214 parts of sliding rail, 215 parts of inner frame, 216 parts of cross beam, 217 parts of guide pipe, 203a parts of dovetail chute, 205a parts of sliding block, 300 parts of motor, 301 parts of installation seat.

Detailed Description

In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.

Referring to fig. 1 to fig. 14, in a first embodiment of the present invention, a semiconductor chemical mechanical polishing apparatus is provided, in which a polishing belt 201 is circularly cleaned and pretreated to provide a clean polishing condition for the next stage of chemical mechanical polishing and a wafer is rapidly and safely cleaned after polishing is completed, as shown in fig. 1, the apparatus includes a polishing table 200 disposed in a CMP apparatus 100, as shown in fig. 2 and fig. 3, the polishing table 200 includes a polishing belt 201, the polishing belt 201 is in a closed-loop equilateral triangle layout, the top end of the polishing belt 201 is horizontally disposed, three corners of the polishing belt 201 are respectively sleeved with a first roller 202, two sides of the polishing belt 201 are respectively provided with a frame 203 in the shape of an equilateral triangle in a matching manner, the first roller 202 are parallel to each other, and two ends of the first roller 202 are rotatably connected to corners of the frame 203; as shown in fig. 2 and 11, the bottom end of the grinding belt 201 is provided with a second roller 204, the second roller 204 is clamped with the grinding belt 201 in parallel with an adjacent first roller 202, as shown in fig. 12 and 13, two ends of the second roller 204 are provided with brackets 205, the top ends of the brackets 205 are in sliding connection with the bottom ends of adjacent side frames 203, the sliding directions of the two brackets 205 are in opposite oblique upward directions, the two brackets 205 are symmetrically arranged about the second roller 204, as shown in fig. 7, the side edges of the two side frames 203 at the diagonal positions are provided with belts 206, the belts 206 are parallel with the side edges of the side frames 203 where the belts 206 are positioned, as shown in fig. 8 and 9, the bottom ends of the two belts 206 are respectively wound with two ends of the rotating shaft of the lowest roller 202, the top ends of the two belts 206 are wound with the rotating shaft of the corresponding high roller 202, a sliding frame 208 is connected between the two side frames 203 in a sliding manner, the two sliding frames 208 are distributed on two sides of the side frames 203, the sliding paths of the sliding carriages 208 are parallel to the adjacent belts 206, the sliding carriages 208 are fixedly connected with the belts 206, as shown in fig. 10, the two sliding carriages 208 are respectively clamped with a flushing nozzle 209 and a drying nozzle 210, and the flushing nozzle 209 and the drying nozzle 210 are perpendicular to the belt walls of the adjacent grinding belts 201.

Specifically, as shown in fig. 4 and fig. 5, the top ends of the two frames 203 are fixedly connected with a flat plate 211, the edges of the flat plate 211 are embedded with the top ends of the frames 203, as shown in fig. 3, the flat plate 211 is horizontally attached to the inner side of the top end surface of the grinding belt 201, as shown in fig. 13, the rotating shaft of the first roller 202 and the frames 203, the rotating shaft of the second roller 204 and the support 205 are all connected through bearings, the top ends of the supports 205 are integrally provided with a sliding block 205a, the bottom ends of the frames 203 are provided with dovetail grooves 203a, the sliding block 205a is matched and slidingly contacted with the dovetail grooves 203a, as shown in fig. 11, two ends of the belt 206 are respectively provided with a belt pulley 207 connected with the rotating shaft of the first roller 202, the belt pulley 207 is fixedly sleeved with the rotating shaft of the first roller 202, the first roller 202 rotates freely with the rotating shaft of the first roller 202, the frames 203 and bearings between the first roller 202, the second roller are relatively fixed in positions, the rotating shaft of the second roller 204 and the corresponding bearings are slidingly spliced, one side of the two supports 205 far away from each other is provided with a cover 212, and one side of the cover 212 far from the support 205 is provided with a nut 213, and the nut 213 is fastened by the screw thread of the nut 213 and the second roller 204.

As shown in fig. 11 and 13, a mounting seat 301 is fixedly connected to the bottom of one side of the frame 203 far away from the abrasive belt 201, the side surface shape of the mounting seat 301 is in an F shape, two motors 300 are arranged on one side of the mounting seat 301 far away from the frame 203 in a high-level and low-level difference mode, the output shaft of the motor 300 positioned at a high level is coaxially connected with the rotating shaft of the first roller 202 adjacent to the motor 300, the output shaft of the motor 300 positioned at a low level is connected with the rotating shaft of the second roller 204 adjacent to the motor 300, the rotating shaft of the first roller 202 is connected with the output shaft of the motor 300 through a rigid coupling, and the rotating shaft of the second roller 204 is connected with the output shaft of the motor 300 through a flexible coupling.

As shown in fig. 8 and 9, two ends of the sliding frame 208 are slidably connected with sliding rails 214, the sliding rails 214 are fixedly connected with edges of adjacent frames 203, two contact positions are arranged between the end portions of the sliding frame 208 and the sliding rails 214, when one of the two sliding frames 208 is at a stroke top dead center, the other sliding frame 208 is at a stroke bottom dead center, as shown in fig. 3, an equilateral triangle inner frame 215 is arranged in the frame 203, the cams of the inner frame 215 are fixedly connected with the middle points of three sides of the frame 203 respectively, a cross beam 216 is fixedly connected between the two inner frames 215, as shown in fig. 6, two ends of one inner wall of the inner frame 215 are hinged with guide pipes 217, two ends of the guide pipe 217 are in a horn shape, and the two guide pipes 217 are respectively sleeved with connecting pipes of the flushing nozzle 209 and the air drying nozzle 210.

The working principle and advantages of the device are further described with reference to the prior art, that the polishing tables 200 of the chemical mechanical polishing apparatus used in the prior art have a remarkable common point, the table surfaces of the polishing tables 200 are generally round, the round polishing pads are paved on the polishing tables 200 for use, the polishing pads, especially the rough polishing pads, have a large number of micro-holes, firstly, the polishing precision of the polishing pads is determined, secondly, the micro-holes after polishing can be absorbed and contained with abrasive, and are easily filled with ground impurity particles, so that the surface roughness of the polishing pads is changed, the working efficiency of re-polishing is reduced, and the like.

The present invention provides a chemical mechanical polishing apparatus for semiconductors, wherein a polishing table 200 is mainly provided, the polishing table 200 is similar to a structure of a conveyor belt, a polishing belt 201 is adopted instead of a conventional circular polishing pad, and the running route of the polishing belt 201 is equilateral triangle, and the top end surface is horizontally arranged, which enables the triangular top end surface of the polishing belt 201 to be used for conventional polishing operation, while the other two side surfaces of the polishing belt 201 can be cleaned synchronously during polishing, and unlike the conventional chemical mechanical polishing pad, the cleaning direction of the present invention is to flush the polishing surface of the polishing belt 201 back surface, impurities in the polishing belt 201 can be removed more quickly and thoroughly, therefore, the cleaning time is greatly shortened, the cleaning time is shortened further, the polishing table 200 is ready for a clean polishing surface to be used, in addition, the wafer surface residues after the polishing end can be cleaned by continuously running the polishing belt 201 in one direction, the wafer surface is cleaned by the conventional polishing pad of the wafer Zhang Yanmo, and the wafer is not paved with a clean work level.

To achieve the above objective function, the present invention further provides the following technical details:

firstly, in the driving mode of the polishing belt 201 and the cleaning structure of the chemical mechanical polishing apparatus, as shown in fig. 11, the first roller 202 of the apparatus can rotate freely relative to the rotating shaft thereof, and the rotating shafts of the first roller 202 and the second roller 204 can rotate freely relative to the frame 203 or the bracket 205 through bearing connection, so when the polishing table 200 drives the second roller 204 to rotate through the motor 300, the second roller 204 drives the polishing belt 201 to operate in a mode of extruding the first roller 202 to clamp the polishing belt 201, and meanwhile, the belt 206 connected with the rotating shaft of the first roller 202 and the cleaning function related components such as the carriage 208 connected with the belt 206 are not affected by the operation of the polishing belt 201, and operate independently;

When the other motor 300 drives the rotation shaft of the first roller 202 to rotate, the rotation shaft of the first roller 202 drives the belt wheels 207 and the belts 206 to run, the two belts 206 are in a V-shaped included angle layout, as shown in fig. 7, the running directions of the two belts 206 are opposite, so when the side (or the side away from each other) of the belts 206 is connected with the sliding frame 208, one sliding frame 208 ascends and the other sliding frame 208 descends, and the movement layout has the advantages that the sliding frame 208 and the spray heads on the sliding frame 208 always keep stable interval running against the inner wall of the grinding belt 201, stable flushing or air drying effect is brought, and the lifting directions of the two sliding frames 208 are opposite, so that the gravity effect can be offset, the difficulty of transmission and driving is reduced, and the energy consumption of the motor 300 is lower;

Secondly, the gap between the second roller 204 and the first roller 202 is very important, the gap between the second roller 204 and the first roller 202 needs to be adjusted to achieve two purposes, namely extrusion and rolling, so as to drive the operation of the grinding belt 201, and secondly, the grinding belt 201 is partially extruded, so that the grinding belt 201 is extruded to temporarily compact the internal pores, and the water remained after rinsing is extruded, thereby greatly reducing the difficulty of air drying at the later stage, and when the grinding belt 201 is continuously operated to wipe off the attachments on the surface of the wafer, the water is matched with the water to play a role of quickly extruding and discharging dirt (suitable for the grinding belt 201 using a flexible grinding material with lower hardness), as shown in figure 14, the brackets 205 of the rotating shafts at the two ends of the second roller 204 are uniformly provided with an inclined sliding block 205a, the included angle between the two sliding blocks 205a is in an inverted V shape, when the nut 213 is screwed by the opposite rotating shafts, the nut 213 can press the brackets 205 towards the second roller 204 through the cover plate 212 (because the nut 213 has smaller volume, in order to avoid damage caused by the fact that the nut 213 directly presses the side surface of the bearing), the distance between the two brackets 205 is reduced, the two sliding blocks 205a can slide and rise along the dovetail chute 203a at the bottom end of the frame 203, meanwhile, the brackets 205 and the second roller 204 are driven to rise, the distance between the two brackets 205 is continuously reduced until the second roller 204 rises to collide with the grinding belt 201 and is extruded to a proper pressure, and the adjusted position is fixed in a loose prevention mode pressed by the double nuts 213;

Because the sliding directions of the sliding blocks 205a and the dovetail grooves 203a are determined, the sleeving directions of the roller shafts of the bracket 205 and the roller two 204 are unique, so that under the condition that the machining and assembling precision of parts are in accordance with the requirement (the parallelism of the roller one 202 and the roller two 204), the actions of the two sliding blocks 205a must be synchronous to realize the lifting adjustment of the roller, the non-parallelism of the roller one 202 and the roller two 204 caused by the adjustment position difference of the two ends is avoided, and the condition that the pressure of the roller two 204 and the roller one 202 on the grinding belt 201 is uneven is avoided;

it should be noted that, since the position of the motor 300 is fixed relative to the frame 203, and the height of the second roller 204 is adjustable, the second roller 204 and the output shaft of the corresponding motor 300 should be connected by using a flexible coupling.

Thirdly, the grinding table 200 of the chemical mechanical grinding device is composed of two equilateral triangle frames 203, square flat plates 211 and cross beams 216, wherein a small equilateral triangle inner frame 215 is further connected to the interior of the frames 203, the inner frame 215 divides the area surrounded by the frames 203 into four equilateral triangles, so that the structural strength of the frames 203 is greatly increased, the platform and the cross beams 216 are responsible for the transverse connection between the two frames 203, and the edge width of the platform is larger than the width of the cross beams 216, so that a model similar to a trapezoid is constructed among the platform, the cross beams 216, the frames 203 and the inner frame 215, and the overall structure of the grinding table 200 has higher rigidity and stability;

Fourth, in fig. 7, taking an air-drying nozzle 210 as an example, a clamping assembly structure between the air-drying nozzle 210 and the carriage 208 is shown, the flushing nozzle 209 is assembled in the same manner, the number of the air-drying nozzle 210 and the flushing nozzle 209 can be increased or decreased as required within the range of the installation space allowed by the carriage 208, and the interval between the nozzles can be flexibly adjusted in a sliding manner;

Figure 6 shows a flared conduit 217, which conduit 217 can deflect to a small extent for threading an air or water tube during movement of the spray head with the carriage 208 for converging finishing and reducing scraping.

In summary, this chemical mechanical polishing equipment has adopted the grinding table 200 of equilateral triangle outward appearance, its grinding belt 201 equilateral triangle's conveyer belt structural layout has replaced the circular grinding pad of traditional tiling setting, outside the realization conventional grinding operation, other two sides of grinding belt 201 can be cleared up in step at the in-process of grinding, and nimble shower nozzle arrangement and back reciprocal flushing mode of sweeping, not only reduced the water consumption by a wide margin, still make the cleaning time shorten greatly, in time provide clean abrasive surface for grinding table 200, traditional washing latency has been saved, and grinding belt 201 moves to the direction in succession and cooperates the washing operation, still can be quick safe get rid of wafer surface residue, the powerful work efficiency that traditional horizontal laying single Zhang Yanmo pad does not possess has for the grinding and the cleaning of wafer.

It should be noted that the above embodiments are only for illustrating the technical solution of the present invention and not for limiting the same, and although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that the technical solution of the present invention may be modified or substituted without departing from the spirit and scope of the technical solution of the present invention, which is intended to be covered in the scope of the claims of the present invention.

Claims

1. The semiconductor chemical mechanical automatic polishing device is characterized by comprising a polishing table (200) arranged in CMP equipment (100), wherein the polishing table (200) comprises a polishing belt (201), the polishing belt (201) is in a closed-loop equilateral triangle layout, the top end surface of the polishing belt (201) is horizontally arranged, three corners of the polishing belt (201) are sleeved with first rollers (202), two sides of the polishing belt (201) are provided with equilateral triangle frames (203) in a matching manner, the first rollers (202) are parallel to each other, and two ends of the first rollers (202) are rotationally connected with corners of the frames (203);

The bottom end of the grinding belt (201) is provided with a second roller (204), the second roller (204) is clamped with the grinding belt (201) in parallel with an adjacent first roller (202), two ends of the second roller (204) are provided with brackets (205), the top ends of the brackets (205) are in sliding connection with the bottom ends of adjacent frames (203), the sliding directions of the two brackets (205) are in opposite oblique upward directions, and the two brackets (205) are symmetrically arranged relative to the second roller (204);

Two the side that frame (203) are located the diagonal position is provided with belt (206), belt (206) are parallel rather than frame (203) side that is located, two the bottom of belt (206) the both ends of the pivot of low level cylinder (202) are articulated respectively, two the top of belt (206) and the pivot of high level cylinder (202) that its position corresponds are articulated, two sliding connection has balladeur train (208) between frame (203), two balladeur train (208) distribute in the both sides of frame (203), just the slip route of balladeur train (208) is parallel rather than adjacent belt (206), balladeur train (208) and belt (206) fixed connection, two balladeur train (208) joint have rinse shower nozzle (209) and air dryer shower nozzle (210) respectively.

2. The semiconductor chemical mechanical polishing apparatus as recited in claim 1, wherein the top ends of the two frames (203) are fixedly connected with a flat plate (211), and edges of the flat plate (211) are embedded with the top ends of the frames (203), and the flat plate (211) is horizontally attached to the inner side of the top end surface of the polishing belt (201).

3. The semiconductor chemical mechanical polishing apparatus as recited in claim 2, wherein the first roller (202) and the rotating shaft thereof are freely rotated, the second roller (204) and the rotating shaft thereof are fixedly sleeved, the rotating shaft of the first roller (202) and the frame (203), the rotating shaft of the second roller (204) and the bracket (205) are all connected through bearings, two ends of the belt (206) are respectively provided with a belt wheel (207) connected with the rotating shaft of the first roller (202), and the belt wheels (207) are fixedly sleeved with the rotating shaft of the first roller (202).

4. The semiconductor chemical mechanical polishing device as recited in claim 3, wherein the first roller (202) has a shaft, a frame (203) and bearings therebetween, the shaft of the second roller (204) is slidably inserted into the corresponding bearings, cover plates (212) are disposed on the sides of the two brackets (205) away from each other, nuts (213) are disposed on the sides of the cover plates (212) away from the brackets (205), and the nuts (213) are screwed with the shaft of the second roller (204).

5. The semiconductor chemical mechanical polishing device according to claim 4, wherein a slider (205 a) is integrally provided at a top end of the frame (205), and a dovetail groove (203 a) is provided at a bottom end of the frame (203), and the slider (205 a) is slidably connected to the dovetail groove (203 a) in a matching manner.

6. The semiconductor chemical mechanical polishing device as recited in claim 5, wherein a mounting base (301) is fixedly connected to the bottom of one side of the frame (203) far away from the abrasive belt (201), the side surface of the mounting base (301) is in an F shape, two motors (300) are arranged on one side of the mounting base (301) far away from the frame (203) in a high-low level difference manner, an output shaft of the motor (300) at a high level is coaxially connected with a rotating shaft of a first roller (202) adjacent to the motor, and an output shaft of the motor (300) at a low level is connected with a rotating shaft of a second roller (204) adjacent to the motor.

7. The semiconductor chemical mechanical polishing device according to claim 6, wherein the rotating shaft of the first roller (202) is connected with the output shaft of the motor (300) through a rigid coupling, and the rotating shaft of the second roller (204) is connected with the output shaft of the motor (300) through a flexible coupling.

8. The semiconductor chemical mechanical polishing device according to claim 1, wherein two ends of the carriage (208) are slidably connected with a sliding rail (214), the sliding rail (214) is fixedly connected with the edge of the adjacent frame (203), two contact positions are arranged between the end of the carriage (208) and the sliding rail (214), and when one of the two carriages (208) is at the top dead center of the stroke, the other carriage (208) is at the bottom dead center of the stroke.

9. The semiconductor chemical mechanical polishing device according to claim 8, wherein an equilateral triangle inner frame (215) is arranged in the frame (203), the triangles of the inner frame (215) are respectively and fixedly connected with the middle points of the three sides of the frame (203), and a cross beam (216) is fixedly connected between the two inner frames (215).

10. The semiconductor chemical mechanical polishing apparatus as recited in claim 9, wherein two ends of an inner wall of the inner frame (215) are hinged with guide pipes (217), two ends of the guide pipes (217) are horn-shaped, and the two guide pipes (217) are respectively sleeved with connecting pipes of the flushing nozzle (209) and the air drying nozzle (210), and the flushing nozzle (209) and the air drying nozzle (210) are perpendicular to the belt walls of the adjacent grinding belts (201).