CN119495512A - High temperature resistant capacitors - Google Patents
High temperature resistant capacitors Download PDFInfo
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- CN119495512A CN119495512A CN202311036887.5A CN202311036887A CN119495512A CN 119495512 A CN119495512 A CN 119495512A CN 202311036887 A CN202311036887 A CN 202311036887A CN 119495512 A CN119495512 A CN 119495512A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/07—Dielectric layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G9/00—Electrolytic capacitors, rectifiers, detectors, switching devices, light-sensitive or temperature-sensitive devices; Processes of their manufacture
- H01G9/004—Details
- H01G9/08—Housing; Encapsulation
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Abstract
本申请提供一种耐高温电容器，包括：芯子，其包括第一正极部和第一负极部；密封组件，其包括陶瓷本体和盖组件，陶瓷本体具有一开口，盖组件覆盖于陶瓷本体的开口并在盖组件与陶瓷本体之间限定出腔体，其中，芯子设置在腔体内，陶瓷本体的内侧分别设有第二正极部和第二负极部且陶瓷本体的一外表面上分别设有正极焊盘与负极焊盘，正极焊盘的引脚穿过陶瓷本体与第二正极部电连接，负极焊盘的引脚穿过陶瓷本体与第二负极部电连接，第二正极部与第一正极部电连接且第二负极部与第一负极部电连接，腔体整体上处于气密封状态。根据本申请的耐高温电容器，相对于使用全金属构成的密封组件而言，可以进一步压缩整体高度。
The present application provides a high temperature resistant capacitor, comprising: a core, which comprises a first positive electrode part and a first negative electrode part; a sealing assembly, which comprises a ceramic body and a cover assembly, the ceramic body having an opening, the cover assembly covering the opening of the ceramic body and defining a cavity between the cover assembly and the ceramic body, wherein the core is arranged in the cavity, the inner side of the ceramic body is provided with a second positive electrode part and a second negative electrode part respectively, and an outer surface of the ceramic body is provided with a positive electrode pad and a negative electrode pad respectively, the pin of the positive electrode pad passes through the ceramic body and is electrically connected to the second positive electrode part, the pin of the negative electrode pad passes through the ceramic body and is electrically connected to the second negative electrode part, the second positive electrode part is electrically connected to the first positive electrode part and the second negative electrode part is electrically connected to the first negative electrode part, and the cavity is in an airtight state as a whole. According to the high temperature resistant capacitor of the present application, the overall height can be further compressed compared to the sealing assembly made of all metal.
Description
Technical Field
The invention relates to the technical field of capacitors, in particular to a high-temperature-resistant capacitor.
Background
With the rapid development of science and technology in recent years, electronic products are rapidly developed toward thin, light and small surface mounting modes. With the development of high-density design, the capacity requirement of the capacitor is continuously increased, and meanwhile, the single-plate temperature of the product is continuously increased.
The traditional plastic package chip type laminated aluminum electrolytic capacitor (SP-CAP) can realize the requirement of high specific volume. However, in the conventional SP-CAP capacitor, the external encapsulation material is epoxy resin, but the high temperature resistance of the epoxy resin is poor, the structure is not airtight, and air can continuously enter the package, so that the cathode material (conductive polymer) undergoes a cracking reaction, and therefore, the Equivalent Series Resistance (ESR) can be greatly increased when the SP-CAP capacitor is used at a temperature of above 60 ℃. The protection function is easy to be reduced under the long-term high-temperature condition operation, and the device is invalid. For this reason, the plastic-encapsulated laminated aluminum electrolytic capacitor is prohibited from being used in a high-temperature scenario.
For this reason, it is highly desirable to provide a high temperature resistant capacitor capable of meeting the increasing miniaturization demands of current electronic devices.
Disclosure of Invention
Accordingly, the present invention is directed to a high temperature resistant capacitor that is both high temperature resistant and miniaturized.
In order to solve the technical problems, the invention adopts the following technical scheme:
according to an embodiment of the present application, a high temperature resistant capacitor includes:
a core including a first positive electrode portion and a first negative electrode portion;
A seal assembly including a ceramic body having an opening and a cap assembly covering the opening of the ceramic body and defining a cavity between the cap assembly and the ceramic body,
The core is arranged in the cavity, a second positive electrode part and a second negative electrode part are respectively arranged on the inner side of the ceramic body, a positive electrode bonding pad and a negative electrode bonding pad are respectively arranged on one outer surface of the ceramic body, a pin of the positive electrode bonding pad penetrates through the ceramic body to be electrically connected with the second positive electrode part, a pin of the negative electrode bonding pad penetrates through the ceramic body to be electrically connected with the second negative electrode part, the second positive electrode part is electrically connected with the first positive electrode part, the second negative electrode part is electrically connected with the first negative electrode part, and the cavity is in an airtight state on the whole.
That is, according to the high temperature resistant capacitor of the present application, the ceramic body and the cap assembly are used as the sealing assembly, and since the ceramic body itself has insulation property without providing an insulation gasket between the ceramic body and the core, the overall height can be further compressed, and in addition, the ceramic body itself has a certain mechanical strength and rigidity, which can be made thinner than the ductile metal, thereby further reducing the overall height, and in addition, the process of the electrical connection portion between the ceramic body and the core becomes simpler and easier to handle than the sealing assembly of all metals.
Here, the "the cavity is in a hermetically sealed state as a whole" means that the ceramic body and the cap assembly are hermetically sealed, and the positive electrode pad and the negative electrode pad pass through the ceramic body and are not hermetically sealed, so that the sealing assembly can realize hermetic protection for the core disposed inside the sealing assembly, and cracking reaction of the cathode material of the core caused by gas entering inside the sealing assembly is avoided. In other words, the high-temperature-resistant capacitor not only realizes high temperature resistance by adopting the high-temperature-resistant sealing assembly, but also can resist severe use environments such as high humidity and the like because the cavity is in a gas-tight state on the whole.
According to some embodiments of the application, the cap assembly is a ceramic or metal part.
That is, the entire seal assembly may be made of all ceramic or a combination of a ceramic body and a metal cover. The method can be properly selected according to the setting space condition of the application scene and the like.
According to some embodiments of the application, the core further comprises a laminate comprising a plurality of stacked individual sheets, each of the individual sheets comprising a substrate having a positive electrode at one end and a negative electrode at the other end, silver layers being provided on upper and lower surfaces of the negative electrodes of the individual sheets, and a shielding layer being provided on upper and lower surfaces of the positive electrode of the individual sheet and adjacent to the silver layers.
That is, the high temperature resistant capacitor of the present application can be applied to a multilayer capacitor. In the laminated capacitor, the core adopts a laminated structure, and each single piece in the laminated structure includes a base body, namely an aluminum base body in the case of an aluminum electrolytic capacitor, a tantalum base body in the case of a tantalum capacitor, and the like.
According to some embodiments of the application, a plurality of the monolithic positive electrodes are connected in parallel and electrically connected to the first positive electrode portion, the first positive electrode portion protruding from the laminate, the silver layer of one surface of the laminate constituting the first negative electrode portion.
That is, in the multilayer capacitor, the core does not need to be provided with the first negative electrode portion for electrical connection with the sealing member, and electrical connection can be directly achieved by the silver layer provided on the surface of the laminate, whereby further miniaturization can be achieved.
Further, the second positive electrode part is a first conductor arranged on the inner side of the ceramic body, the height and the position of the first conductor correspond to those of the first positive electrode part, and the second negative electrode part is a second conductor arranged on the inner side of the ceramic body.
That is, in the case where the first negative electrode portion is constituted by the surface silver layer and the first positive electrode portion of the core is directly projected from the positive electrode of the laminate, accordingly, the second positive electrode portion inside the ceramic body corresponds in height to the first positive electrode portion, in other words, the first positive electrode portion is projected from the laminate and then can be directly electrically connected to the second positive electrode portion matched in height without any process such as bending, whereby the overall height can be further compressed.
Further, the first conductor is a metal boss, and the second conductor is a metal sheet.
The metal boss is used as the second positive electrode part, and the metal sheet is used as the second negative electrode part, so that the whole capacitor is simple to process, simple to assemble, stable in structure and long in service life.
According to other embodiments of the present application, the core further includes an insulating layer encapsulated outside the laminate body, and the first positive electrode part and the first negative electrode part respectively penetrate through the insulating layer from both ends of the laminate body and are folded and attached to one surface of the insulating layer.
That is, instead of directly disposing the core in the ceramic body, the core may be packaged first and then disposed in the ceramic body. In this case, the first positive electrode portion and the first negative electrode portion need to pass through the insulating layer from the laminated body, and in order to control the volume of the core as a whole to accommodate the miniaturization requirement, the first positive electrode portion and the first negative electrode portion may be folded and attached to the surface of the insulating layer after passing through the insulating layer.
Further, a first groove and a second groove are formed on a surface of the insulating layer, corresponding to the first positive electrode portion and the first negative electrode portion, respectively, the depths of the first groove and the second groove are matched with the first positive electrode portion and the first negative electrode portion, and one ends, far away from the laminated body, of the first positive electrode portion and the first negative electrode portion are arranged in the first groove and the second groove, respectively.
That is, although the first positive electrode portion and the first negative electrode portion are attached to the surface of the insulating layer, the first groove and the second groove are provided on the insulating layer, respectively, without increasing the overall height of the core.
Further, the second positive electrode portion and the second negative electrode portion are respectively a third conductor and a fourth conductor attached to the inner surface of the ceramic body.
Further, the third conductor and the fourth conductor are metal sheets respectively. That is, in this case, a metal sheet is provided on the inner surface of the ceramic body as the corresponding second positive electrode portion and second negative electrode portion.
According to some embodiments of the application, through holes are formed on the ceramic body corresponding to the positive electrode bonding pad and the negative electrode bonding pad respectively, pins of the positive electrode bonding pad are connected with the second positive electrode portion through the through holes, pins of the negative electrode bonding pad are connected with the second negative electrode portion through the through holes, and the through holes and the pins are sealed through solder. That is, in the case of preparing a ceramic body, it is possible to punch holes at the green body molding stage and then form the ceramic body having the through holes by sintering, but it is also possible to punch holes after sintering but with relatively higher processing difficulty and higher cost. On the other hand, when the positive electrode pad and the negative electrode pad pass through the through hole to connect the second positive electrode portion and the second negative electrode portion inside the ceramic body, the through hole can be filled with solder, which can withstand a higher temperature than a material such as rubber, in order to achieve air tightness.
According to some embodiments of the application, a valve ring is welded to the upper edge of the ceramic body, and the ceramic body is connected to the cover assembly through the valve ring.
By providing a valve ring and then connecting the cap assembly through the valve ring, a gas-tight connection between the ceramic body and the cap assembly can be positively achieved. And the process is relatively simple.
Further, a tungsten gold layer and a nickel layer are sequentially laminated between the upper edge of the ceramic body and the valve ring from the ceramic body upwards. Through setting up tungsten gold layer and nickel layer as the transition layer, can make the ceramic body and be connected between the lid subassembly more firm.
According to some embodiments of the application, the material of the ceramic body is alumina. As a material of the ceramic body, common ceramics such as alumina ceramics, zirconia ceramics, silicon carbide ceramics, and the like can be used, and among them, alumina ceramics are preferable because of advantages such as low cost of raw materials, low sintering temperature, and the like.
According to some embodiments of the application, the surface of the ceramic body is provided with a hydrophobic layer. This can further improve the high humidity resistance of the capacitor.
According to some embodiments of the application, the overall height of the high temperature resistant capacitor is 2.5mm or less. According to the high-temperature-resistant capacitor, the overall height can be controlled below 2.5mm, which is far superior to the laminated capacitor on the market at present, and the high-temperature-resistant capacitor can further meet the requirements of miniaturization and thinning of electronic products.
Drawings
FIG. 1 is a schematic diagram of a core in a high temperature resistant capacitor according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a ceramic body in a high temperature resistant capacitor according to an embodiment of the present invention, wherein (a) is a schematic side view, (b) is a top view, and (c) is a cross-sectional side view;
FIG. 3a is a schematic view of a partial perspective view of a high temperature resistant capacitor according to an embodiment of the present invention;
FIG. 3b is a schematic side cross-sectional view of a high temperature resistant capacitor according to an embodiment of the present invention;
fig. 4 is a schematic structural view of a core in a high temperature resistant capacitor according to another embodiment of the present invention, wherein (a) is a side sectional view and (b) is a top view;
Fig. 5 is a schematic structural view of a body in a high temperature resistant capacitor according to another embodiment of the present invention, wherein (a) is a top view and (b) is a side sectional view;
fig. 6 is a schematic structural view of a high temperature resistant capacitor according to another embodiment of the present invention;
FIG. 7 is an SEM image of the weld between a ceramic body and a valveable ring in a high temperature resistant capacitor according to an embodiment of the invention;
FIG. 8 is a schematic diagram of a core structure according to an embodiment;
fig. 9 is a schematic structural diagram of an all-metal packaged capacitor according to another embodiment.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention.
The high temperature resistant capacitor (hereinafter also referred to as capacitor) of the present application includes a core and a sealing assembly. The seal assembly includes a ceramic body and a cap assembly covering an opening of the ceramic body to define a cavity configuration within the seal assembly. The core is arranged in the cavity, and the electrodes of the core are electrically connected with the outside through the electrodes arranged on the ceramic body. The cavity of the sealing assembly is in a gas-tight state as a whole.
Fig. 8 shows a stacked aluminum capacitor. As shown in fig. 8, an insulating layer 16 made of epoxy resin is encapsulated outside the core 1. The capacitor is to be further improved in high temperature resistance and is to be further compressed in height/size.
In some implementations, a scheme of modifying an epoxy resin material to serve as a shell of the capacitor is proposed, and the bonding capability of the resin material and the positive and negative lead frames is improved to improve the high temperature resistance. However, even so, the capacitor can only meet the use requirement of 10 years below 75 ℃, and the temperature above 75 ℃ cannot meet the service life of 10 years.
Referring to fig. 9, based on a similar overall structure, in other embodiments, a high humidity resistant laminated aluminum electrolytic capacitor is proposed, which uses an all-metal material to replace epoxy resin for packaging design, thereby realizing the improvement of the humidity resistance and heat resistance of the capacitor so as to meet the requirements of specifications such as 85 ℃ and 85%RH-1000 h. However, the metal shell 200 itself should have a certain plate thickness, which limits the decrease of the overall height thereof, depending on the processing process and material characteristics thereof. Furthermore, in order to avoid short circuits caused by the direct contact of the core with the metal saddle, an insulating gasket 300 must be provided between the metal saddle and the core, which results in a further limitation of the compression space of the capacitor in height.
By adopting the ceramic body 2, the capacitor provided by the embodiment of the application can have better high temperature resistance relative to the capacitor made of epoxy resin material by utilizing the high temperature resistance, the insulativity and the mechanical properties of the material, and can be further compressed in height relative to the capacitor made of metal body. In addition, through airtight encapsulation between the ceramic body and the cover component (such as a metal plate or a ceramic plate), the problem of ESR increase caused by the decrease of the conductivity of the high polymer material in the core under the hot oxygen environment can be solved.
Hereinafter, a high temperature resistant capacitor (hereinafter, sometimes simply referred to as a capacitor) according to the present application will be described in detail with reference to the drawings, taking a stacked capacitor as an example. Fig. 1 to 3 show a schematic structural view of a ceramic body 2 of one of a core 1 and a seal assembly in a high temperature resistant capacitor of a first embodiment, and fig. 4 to 6 show a schematic structural view of a ceramic body 2 of one of a core 1 and a seal assembly in a high temperature resistant capacitor of a second embodiment.
The high temperature resistant capacitor according to the present application may be any one of a stacked aluminum electrolytic capacitor, a cylindrical aluminum electrolytic capacitor, and a tantalum capacitor, for example. That is, the high temperature resistant capacitor of the present application can be applied not only to a laminated aluminum electrolytic capacitor but also to a cylindrical aluminum electrolytic capacitor and a tantalum capacitor, and has a wide application range.
Substantially the same features as in the two embodiments will be described with reference to the drawings.
As shown in fig. 3 and 6, the capacitor according to the present application includes a core 1 and a sealing assembly, wherein the sealing assembly includes a ceramic body 2 and a cap assembly. The ceramic body 2 has an opening therein, the cover assembly 3 covers the opening of the ceramic body 2 defining a cavity between the cover assembly 3 and the ceramic body 2, and the core 1 is disposed in the cavity.
As shown in fig. 1 and 4, the core 1 includes a core positive electrode portion 11 (as an example of a first positive electrode portion) and a core negative electrode portion 12 (as an example of a first negative electrode portion).
According to some embodiments of the present application, taking a laminated aluminum electrolytic capacitor as an example, as shown in fig. 1 and 4, the core 1 may employ a single sheet formed by growing a polymer material on one end (i.e., the end near the negative electrode) of an aluminum foil (i.e., a base), thereafter impregnating carbon on the polymer, and growing a silver material to form a silver layer 13, and thereafter disposing an insulating layer as a shielding layer 14 at the end 15 of the silver material near the positive electrode to isolate the positive and negative electrodes. Then, a plurality of individual sheets are laminated to form a laminate. As the electrode of the core 1, for example, a metal conductor such as a copper sheet or the like led out from the laminate may be mentioned.
As shown in fig. 2 (b) and 5 (b), the ceramic body 2 is provided with a ceramic body positive electrode portion 21 (as an example of a second positive electrode portion) and a ceramic body negative electrode portion 22 (as an example of a second negative electrode portion) on the inner side thereof, respectively. An outer surface of the ceramic body 2 is provided with a positive electrode pad 23 and a negative electrode pad 24, respectively. The pins of the positive electrode pads 23 pass through the ceramic body 2 and are electrically connected with the second ceramic body positive electrode part 21. The pins of the negative electrode pads 24 are electrically connected to the second ceramic body negative electrode portion 22 through the ceramic body 2. Meanwhile, the ceramic body positive electrode portion 21 inside the ceramic body 2 is electrically connected with the core positive electrode portion 11 of the core 1, and the ceramic body negative electrode portion 22 is electrically connected with the core negative electrode portion 12 of the core 1. In other words, the positive electrode of the core 1 is electrically connected to the positive electrode pad 23 located outside the ceramic body 2 through the core positive electrode portion 11 via the ceramic body positive electrode portion 21, and the negative electrode of the core 1 is electrically connected to the negative electrode pad 24 located outside the ceramic body 2 through the core negative electrode portion 12 via the ceramic body negative electrode portion 22.
In the design of the capacitor, although the ceramic body 2 of the capacitor needs to be provided with a through hole to ensure the electrical connection between the external bonding pad and the internal positive and negative electrodes, the cavity needs to be in an airtight state as a whole. In other words, the ceramic body 2 with the bonding pad needs to satisfy the requirement of hermetic sealing. After the ceramic body is matched with the cover assembly, an airtight cavity is formed.
According to some embodiments of the present application, through holes (not shown) are formed in the ceramic body 2 corresponding to the positive electrode pad 23 and the negative electrode pad 24, respectively, pins of the positive electrode pad 23 are connected to the second ceramic body positive electrode portion 21 through the through holes, pins of the negative electrode pad 24 are connected to the second ceramic body negative electrode portion 22 through the through holes, and the through holes and the pins are sealed by solder.
The through holes for providing electrical connection between the positive and negative electrode pads and the positive and negative electrodes of the internal ceramic body are secured in air tightness by means of filling the through holes with solder by high temperature soldering or the like.
As is clear from this, according to the high temperature resistant capacitor of the present application, the ceramic body 2 and the lid assembly 3 are used as the sealing assembly, and the ceramic body 2 itself has insulation properties, and therefore, it is not necessary to provide an insulating spacer between the ceramic body 2 and the core 1, so that the entire height can be further compressed, compared to a sealing assembly using an all-metal structure. In addition, the ceramic body 2 itself has a certain mechanical strength and rigidity, which can be made thinner than ductile metals, thereby further reducing the overall height, and the process of manufacturing the electrical connection between the ceramic body 2 and the core 1 becomes simpler and easier to handle than an all-metal seal assembly.
As shown in fig. 3 and 6, the cover assembly 3 mated with the ceramic body 2 may be, for example, a ceramic or metal piece. In other words, the ceramic body 2 and the ceramic lid assembly 3 may be sealed to form a sealing assembly, or the ceramic body 2 and the metal lid assembly 3 may be sealed to form a sealing assembly. That is, the entire seal assembly may be made of all ceramic or a combination of a ceramic body and a metal cover. The method can be properly selected according to the setting space condition of the application scene and the like.
A plurality of through holes corresponding to the positive electrode pad 23 and the negative electrode pad 24 may be provided, for example. The porous connecting channel is designed at the bottom of the ceramic body, so that the low impedance requirement is ensured, the strength requirement of the ceramic cavity is met, and the problems of collapse and crack are avoided.
In some embodiments, as shown in fig. 2, a valveable ring 4 is welded to the upper edge of the ceramic body 2, and the ceramic body 2 is attached to the cap assembly 3 via the valveable ring 3.
Further, as shown in fig. 7, a tungsten gold layer and a nickel layer are laminated in this order from the ceramic body 2 upward between the upper edge of the ceramic body 2 and the valve ring 4. The tungsten gold layer has fine combination with the ceramic body, and the nickel layer is fine with the combination nature of valve ring, simultaneously, tungsten gold layer and nickel layer can combine well, from this, through tungsten gold layer and nickel layer as the transition layer, can firmly bond the valve ring on the ceramic body.
The material of the ceramic body 2 may be, for example, alumina. As a material of the ceramic body, common ceramics such as alumina ceramics, zirconia ceramics, silicon carbide ceramics, and the like can be used, and among them, alumina ceramics are preferable because of advantages such as low cost of raw materials, low sintering temperature, and the like.
Wherein the surface of the ceramic body 2 may be provided with a hydrophobic layer, for example. This can further improve the high humidity resistance of the capacitor.
According to the capacitor of the present application, the overall height can be controlled to 2.5mm or less, and the requirements for thickness reduction and miniaturization can be further satisfied.
The details of the implementation of the high temperature resistant capacitor according to the first embodiment will be further described below with reference to fig. 1 to 3.
As shown in fig. 1 to 3, in the present embodiment, a plurality of single positive electrodes are connected in parallel and electrically connected to metal conductors extending from the laminate to form the core positive electrode portion 11 of the core, and the silver layer on the surface of the laminate may be directly used to form the core negative electrode portion 12 of the core without providing an additional extending or other negative electrode.
Accordingly, as shown in fig. 2, in the present embodiment, the ceramic body positive electrode portion 21 for electrically connecting with the core positive electrode portion 11 of the core 1 inside the ceramic body 2 is constituted as a first electric conductor provided inside the ceramic body 2 in a height and a position corresponding to those of the core positive electrode portion 11 of the core 1, that is, when the core is assembled in the ceramic body 1, the core positive electrode portion 11 of the core can be brought into contact with and electrically connected with the first electric conductor inside the ceramic body 2, as shown in fig. 3 b. The ceramic body negative electrode portion 22 inside the ceramic body 2 for electrically connecting with the core negative electrode portion 12 of the core 1 is configured as a second electric conductor provided inside the ceramic body 2. That is, in the case where the core negative electrode portion 12 is constituted by the surface silver layer and the core positive electrode portion 11 is directly projected from the positive electrode of the laminate, the ceramic body positive electrode portion 21 inside the ceramic body 2 corresponds in height to the core positive electrode portion 11, in other words, the core positive electrode portion 11 is projected from the laminate and then can be directly electrically connected to the ceramic body positive electrode portion 21 matched in height without any process such as bending, whereby the entire height can be further compressed.
The ceramic body positive electrode portion 21 and the ceramic body negative electrode portion 22 are formed of a conductive medium such as a metal or a conductive composite material, and the application is not limited as long as the electrical connection between the core 1 and the ceramic body 2 can be achieved.
In one example, the first electrical conductor may be, for example, a metal boss, which may be a metal block having a corresponding height, a hollow metal table, an i-shaped metal structural member, or the like, as long as it has a height corresponding to the core positive electrode portion 11 and has a certain mechanical strength, and the present application is not particularly limited to the specific shape and structure thereof. Among them, a metal block is preferable in view of easy processing, stable structure, and the like.
Accordingly, since the first core negative electrode portion 12 of the corresponding core 1 is a silver layer formed on the surface, the second conductor may be a sheet-like conductor attached to the inner side of the ceramic body 2, for example, a metal sheet.
Fig. 3a and 3b show a perspective front view (in a cavity) and a cross-sectional view, respectively, of a capacitor according to a first embodiment. As shown in fig. 3a, the core positive electrode 11 may be a sheet with a width corresponding to the width of the cavity, and in other embodiments, may be a strip or tooth, which is not limited by the present application.
Next, a high temperature resistant capacitor of a second embodiment will be further described with reference to fig. 4 to 6. In the present embodiment, the core 1 is first encapsulated by the insulating layer 16, and thereafter the encapsulated core 1 is disposed in the ceramic body 2.
Specifically, as shown in fig. 4, in the present embodiment, the core 1 further includes an insulating layer 16 sealed outside the laminate, and the core positive electrode portion 11 and the core negative electrode portion 12 are respectively passed through the insulating layer 16 from both ends of the laminate and are folded and attached to one surface of the insulating layer 16. In the present embodiment, the core 1 is entirely covered with the insulating layer 16 (for example, an epoxy resin material or the like) except for the core positive electrode portion 11 and the core negative electrode portion 12, and thus, the problem of an increase in ESR due to the risk of cracking of the cathode material (conductive polymer) can be further reduced.
Further, as shown in fig. 4, a groove 161 for positive electrode (i.e., corresponding to the first groove) and a groove 162 for negative electrode (i.e., corresponding to the second groove) may be formed on one surface of the insulating layer 16 corresponding to the core positive electrode portion 11 and the core negative electrode portion 12, respectively, and the depths of the groove 161 for positive electrode and the groove 162 for negative electrode are matched with the depths of the groove 162 for negative electrode of the core positive electrode portion 11 and the core negative electrode portion 12, respectively, that is, after one ends of the core positive electrode portion 11 and the core negative electrode portion 12, which are away from the laminate, are folded and attached in the groove 161 for positive electrode and the groove 162 for negative electrode, respectively, the entire surface of the core 1 is flat. This can further reduce the mounting height when the core 1 is assembled inside the ceramic body 2.
Correspondingly, as shown in fig. 5, the ceramic body positive electrode portion 21 and the ceramic body negative electrode portion 22 in the ceramic body 2 are a third conductor and a fourth conductor respectively attached to the inner side of the ceramic body 2. Specifically, the third conductor and the fourth conductor may be metal sheets, or may be members of other shapes such as strips or teeth.
According to the present embodiment, the core 1 is packaged, so that the risk of cracking of the cathode material can be further reduced, the service life can be improved, and at the same time, the chip positive electrode portion 11 and the chip negative electrode portion 12 are folded and attached in the positive electrode groove 161 and the negative electrode groove 162, so that excessive sacrifice in height is not made.
In other words, the first embodiment is more suitable for capacitors used in a narrower space with high temperature and low humidity, and the second embodiment is more suitable for capacitors used in a less severe installation space with high Wen Gaogao humidity. Those skilled in the art may make appropriate selections depending on the particular use scenario.
The process for preparing the capacitor of the present application will be briefly described.
The core 1 in the capacitor of the present application may be manufactured by a manufacturing method of the core 1 for a stacked capacitor known to those skilled in the art, and will not be described herein.
In preparing the ceramic body 2, a ceramic slurry is first prepared, after which the ceramic slurry is formed into a sheet, for example, by a casting method, and thereafter a ceramic body is further laminated around the sheet to form a cavity in the middle, thereby obtaining a ceramic body.
Thereafter, a plurality of through holes are respectively opened in the ceramic body at positions corresponding to the positive electrode pad and the negative electrode pad. In addition, in order to improve the bonding strength between the ceramic body 2 and the lid assembly 1, for example, a tungsten-gold layer (which can be bonded to the ceramic better by sintering to form a transition layer) may be provided at the junction of the ceramic body and the lid assembly
And after the holes are formed, sintering the ceramic body to obtain the ceramic body.
Then, the pins of the positive electrode pad and the negative electrode pad are coated with solder, and then the pins pass through the through holes on the porcelain body so as to protrude out of the inner side of the porcelain body.
Then, the second positive electrode portion and the second negative electrode portion are connected to the pins of the positive electrode pad and the negative electrode pad, respectively, and soldered. Thereby obtaining the ceramic body 2.
After the core 1 and the ceramic body 2 are prepared separately, assembly can be performed as follows:
Firstly, a nickel layer (for example, may be disposed by electroplating) is disposed at the corresponding position of the connection cover assembly of the ceramic body 2 (for example, at the upper edge of the frame of the ceramic body), and the nickel layer can be better bonded with the solder as a second transition layer, thereby improving the overall bonding strength.
Thereafter, a valve ring (which may be, for example, an iron cobalt nickel alloy) is soldered onto the nickel layer by solder.
The SEM image of the welding position of the ceramic body 2 prepared in the above way is shown in fig. 7, and through atomic detection, a represents alumina ceramic, b represents a tungsten gold layer, c represents a nickel layer, d represents used Ag/Cu solder, and e represents a component iron-cobalt-nickel alloy layer of the valve ring.
Thereafter, the core 1 is disposed within the ceramic body 2 and the cap assembly 3 is further welded to the valve ring, thereby forming a hermetically sealed capacitor.
While the foregoing is directed to the preferred embodiments of the present invention, it will be appreciated by those skilled in the art that various modifications and adaptations can be made without departing from the principles of the present invention, and such modifications and adaptations are intended to be comprehended within the scope of the present invention.
Claims (17)
1. A high temperature resistant capacitor comprising:
a core including a first positive electrode portion and a first negative electrode portion, and
A seal assembly including a ceramic body having an opening and a cap assembly covering the opening of the ceramic body and defining a cavity between the cap assembly and the ceramic body,
Wherein the core is arranged in the cavity,
The inner side of the ceramic body is respectively provided with a second positive electrode part and a second negative electrode part, an outer surface of the ceramic body is respectively provided with a positive electrode bonding pad and a negative electrode bonding pad, a pin of the positive electrode bonding pad penetrates through the ceramic body to be electrically connected with the second positive electrode part, a pin of the negative electrode bonding pad penetrates through the ceramic body to be electrically connected with the second negative electrode part, the second positive electrode part is electrically connected with the first positive electrode part, the second negative electrode part is electrically connected with the first negative electrode part, and the cavity is in an airtight state as a whole.
2. The high temperature resistant capacitor of claim 1 wherein said cap assembly is a ceramic or metal part.
3. The high temperature resistant capacitor of claim 1 wherein said core further comprises a laminate comprising a plurality of stacked individual pieces, each of said individual pieces comprising a base body having a positive electrode at one end and a negative electrode at the other end, silver layers being provided on upper and lower surfaces of the negative electrode of said individual pieces, and a shielding layer being provided on upper and lower surfaces of the positive electrode of said individual pieces and adjacent to said silver layers.
4. A high temperature resistant capacitor according to claim 3, wherein a plurality of the single-piece positive electrodes are connected in parallel and electrically connected to the first positive electrode portion, the first positive electrode portion protrudes from the laminate, and the silver layer of one surface of the laminate constitutes the first negative electrode portion.
5. The high temperature resistant capacitor of claim 4, wherein the second positive electrode portion is a first conductor disposed inside the ceramic body, the first conductor having a height and a position corresponding to the first positive electrode portion, and the second negative electrode portion is a second conductor disposed inside the ceramic body.
6. The high temperature resistant capacitor of claim 5 wherein said first electrical conductor is a metal boss and said second electrical conductor is a metal sheet.
7. The high temperature capacitor of claim 3, wherein the core further comprises an insulating layer encapsulated outside the laminate body, and the first positive electrode portion and the first negative electrode portion are respectively passed through the insulating layer from both ends of the laminate body and are folded and attached to one surface of the insulating layer.
8. The high-temperature-resistant capacitor according to claim 7, wherein a first groove and a second groove are formed in a surface of the insulating layer corresponding to the first positive electrode portion and the first negative electrode portion, respectively, the depths of the first groove and the second groove are matched with the first positive electrode portion and the first negative electrode portion, respectively, and one ends of the first positive electrode portion and the first negative electrode portion, which are away from the laminated body, are disposed in the first groove and the second groove, respectively.
9. The high temperature capacitor of claim 7, wherein the second positive electrode portion and the second negative electrode portion are a third conductor and a fourth conductor respectively attached to an inner surface of the ceramic body.
10. The high temperature resistant capacitor of claim 9 wherein the third and fourth electrical conductors are each sheet metal.
11. The high temperature resistant capacitor according to claim 1, wherein through holes are formed in the ceramic body corresponding to the positive electrode pad and the negative electrode pad, respectively, pins of the positive electrode pad are connected to the second positive electrode portion through the through holes, pins of the negative electrode pad are connected to the second negative electrode portion through the through holes, and the through holes and the pins are sealed by solder.
12. The high temperature resistant capacitor of claim 1 wherein a valve ring is welded to an upper edge of the ceramic body, the ceramic body being connected to the cap assembly by the valve ring.
13. The high temperature resistant capacitor of claim 12 wherein a tungsten layer and a nickel layer are laminated between the upper edge of the ceramic body and the valve ring in order from the ceramic body.
14. The high temperature resistant capacitor of claim 1 wherein the material of the ceramic body is alumina.
15. The high temperature resistant capacitor of claim 1, wherein the surface of the ceramic body is provided with a hydrophobic layer.
16. The high temperature resistant capacitor of claim 1, wherein the overall height of the high temperature resistant capacitor is 2.5mm or less.
17. The high temperature resistant capacitor according to claim 1, wherein the high temperature resistant capacitor is any one of a stacked aluminum electrolytic capacitor, a cylindrical aluminum electrolytic capacitor, and a tantalum capacitor.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311036887.5A CN119495512A (en) | 2023-08-15 | 2023-08-15 | High temperature resistant capacitors |
| PCT/CN2024/094265 WO2025035873A1 (en) | 2023-08-15 | 2024-05-20 | High-temperature-resistant capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202311036887.5A CN119495512A (en) | 2023-08-15 | 2023-08-15 | High temperature resistant capacitors |
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| CN119495512A true CN119495512A (en) | 2025-02-21 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202311036887.5A Pending CN119495512A (en) | 2023-08-15 | 2023-08-15 | High temperature resistant capacitors |
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| Country | Link |
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| CN (1) | CN119495512A (en) |
| WO (1) | WO2025035873A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101983177B1 (en) * | 2014-07-18 | 2019-05-29 | 삼성전기주식회사 | Composite electronic component and board having the same mounted thereon |
| CN105140040A (en) * | 2015-09-25 | 2015-12-09 | 株洲宏达电子有限公司 | Chip solid tantalum capacitor with ceramic packaging structure and packaging method thereof |
| CN217280455U (en) * | 2021-09-01 | 2022-08-23 | 湖南艾华集团股份有限公司 | Moisture-proof laminated solid-state aluminum electrolytic capacitor |
| CN116364440B (en) * | 2023-03-20 | 2025-08-22 | 福建国光新业科技股份有限公司 | A moisture-resistant and heat-resistant laminated solid aluminum electrolytic capacitor and its preparation method |
| CN116313532B (en) * | 2023-03-30 | 2025-04-25 | 福建国光新业科技股份有限公司 | A hermetic packaged laminated solid aluminum electrolytic capacitor and preparation method thereof |
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2023
- 2023-08-15 CN CN202311036887.5A patent/CN119495512A/en active Pending
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- 2024-05-20 WO PCT/CN2024/094265 patent/WO2025035873A1/en active Pending
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| WO2025035873A1 (en) | 2025-02-20 |
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