CN119511050B - Diode chip photoelectric performance testing device and use method - Google Patents
Diode chip photoelectric performance testing device and use method Download PDFInfo
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- CN119511050B CN119511050B CN202510080442.XA CN202510080442A CN119511050B CN 119511050 B CN119511050 B CN 119511050B CN 202510080442 A CN202510080442 A CN 202510080442A CN 119511050 B CN119511050 B CN 119511050B
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- 238000012360 testing method Methods 0.000 title claims abstract description 50
- 238000000034 method Methods 0.000 title claims abstract description 19
- 238000001514 detection method Methods 0.000 claims abstract description 8
- 238000003780 insertion Methods 0.000 claims description 4
- 238000011056 performance test Methods 0.000 claims 3
- 238000005452 bending Methods 0.000 claims 1
- 230000005693 optoelectronics Effects 0.000 claims 1
- 230000035939 shock Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0416—Connectors, terminals
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to the technical field of diode chip testing, in particular to a device for testing the photoelectric performance of a diode chip and a use method thereof, comprising a detection seat, the inside of detecting seat has seted up the chip groove, and be provided with a plurality of and chip pin matched with connecting pin on the inside wall in chip groove, a plurality of the connecting pin divide into four groups equally. According to the diode chip photoelectric performance testing device and the use method, the pin is pulled to slide to the positioning groove through the guide slope, at the moment, the pin can be connected in the middle along the connecting pin, compared with the fact that the pin is inserted into the gap of the contact piece in the prior art, the guide slope formed by the adjacent convex edges can pull the pin of the chip, the pin actively enters the positioning groove, so that after the chip is mounted, the pin can be always connected in the middle with the connecting pin, on one hand, a user does not need to control the pin to accurately align with a testing component, the operation convenience is good, and on the other hand, the contact between the connecting pin and the pin is more stable.
Description
Technical Field
The invention relates to the technical field of diode chip testing, in particular to a diode chip photoelectric performance testing device and a using method thereof.
Background
The diode chip mainly comprises a plurality of diodes, resistors, metal wires and other devices, and the devices are connected with each other by engraving circuit patterns on the chip so as to realize various circuit functions. Common diode chips include rectifier diode chips, zener diode chips, switching diode chips, and amplifier diode chips, among others. After chip production, various tests are typically performed to test and evaluate various performances of the chip to verify whether the chip meets its design requirements and specifications, such as photoelectric tests.
The prior patent (bulletin number: CN 118348394B) discloses a chip socket for testing a semiconductor chip, which comprises a base and a vertical rod, and also comprises a connecting seat, a frame component and a pin contact component, wherein a chip placing table and a mounting seat are arranged on the base, a limiting component is arranged on the connecting seat, a plugging groove is arranged on the mounting seat, and the connecting seat is in plugging fit with the plugging groove. In the invention, the frame component and the pin contact component are arranged, the pin connection of the direct-insert chip and the patch chip can be realized through overturning the frame component and the pin contact component, and the pin quantity of the chip is adapted through adjusting the quantity of the pin contact component. When the prior art is used for testing different chips, the link component needs to be manually adjusted, the use convenience is poor, and after the test is finished, a user is required to pick up the chips, so that the test efficiency is affected.
In view of this, we propose a diode chip photoelectric performance testing device and a method of use.
Disclosure of Invention
The invention aims to provide a device for testing the photoelectric performance of a diode chip and a use method thereof, which are used for solving the problems that when different chips are tested in the prior art, the link component needs to be manually adjusted, the use convenience is poor, and after the test is finished, a user is required to pick up the chip, so that the test efficiency is affected. In order to achieve the purpose, the technical scheme is that the diode chip photoelectric performance testing device comprises a detection seat, wherein a chip groove is formed in the detection seat, a plurality of connecting pins matched with chip pins are arranged on the inner side wall of the chip groove, the connecting pins are equally divided into four groups, the four groups of connecting pins are respectively located on four sides of the chip groove, and positioning components matched with the chip pins are arranged on the connecting pins.
The positioning assembly comprises a convex edge fixedly arranged at the top of the connecting leg, the convex edge is arranged into a triangular block structure, the convex edges are symmetrically distributed on the connecting leg in a group of two ways, and a positioning groove with an inverted triangular structure is arranged between the two convex edges.
And a guiding slope with a regular triangle structure is arranged between two adjacent groups of convex edges.
And pin fixing devices are arranged on the connecting pins and the chip grooves.
Preferably, the pin fixer comprises a sliding groove arranged on the inner side wall of the chip groove, the number and the positions of the sliding groove correspond to those of the connecting pins, the sliding groove is slidably connected with a sliding seat, and the connecting pins are connected with the sliding seat.
And spring clamping teeth are arranged on the inner side wall of the sliding groove.
The sliding seat is characterized in that a column groove is formed in one side, opposite to the spring latch, of the surface of the sliding seat, a rotary column is rotationally connected in the column groove, a tooth slot matched with the spring latch is formed in the side surface of the rotary column, and a release notch matched with the spring latch is cut in the side surface of the rotary column.
Spiral bevel edges are formed at the upper end and the lower end of the rotary column, and ejector pins matched with the bevel edges on the same side are fixedly connected to the inner bottom wall and the inner top wall of the chute.
The slide seat is characterized in that a notch is formed in one side of the surface of the slide seat opposite to the connecting pin, a spring piece capable of being bent under pressure is arranged in the notch, the top of the spring piece is rotationally connected in the notch, the bottom of the spring piece is rotationally connected in the sliding groove, and a through groove for the spring piece to pass through is formed in the connecting pin.
And the connecting pins, the sliding seat and the chip groove are provided with chip release assemblies.
Preferably, the chip release assembly comprises two wall grooves which are respectively formed along the side surfaces of two sides of the connecting pin, the connecting pin is fixedly arranged in the wall grooves, two buckling plates are fixedly arranged on the side surfaces of the sliding seat, and the connecting pin is rotatably inserted on the buckling plates.
The outer surface of the buckle plate is provided with an embedded groove, an embedded block is connected in the embedded groove in a sliding mode, a top spring is arranged in the embedded groove and pushes the embedded block to slide outwards, and the outer end of the connecting pin is fixedly connected with a limiting strip limited by the embedded block.
The side surface of the embedded block is provided with an inclined opening, and the lower side of the chip groove is fixedly provided with a supporting block matched with the inclined opening.
The side surface of the embedded block is provided with an arc chute matched with the limit strip.
Preferably, the end part of the thimble, which is contacted with the bevel edge, is embedded with a ball in a rolling way.
Preferably, a shock pad matched with the slide seat is arranged on the inner bottom wall of the slide seat.
Preferably, a poking plate matched with the tooth slot is fixedly arranged on the inner side wall of the sliding groove, and the poking plate is positioned on the upper side of the abutting block.
Preferably, the limit strip and the connecting pin are installed through screws.
The application method of the diode chip photoelectric performance testing device comprises the following steps:
s1, when testing a direct-insert chip, placing the direct-insert chip into a chip groove, wherein pins on four sides of the chip are contacted with connecting pins in the process, and then carrying out photoelectric test on the chip by utilizing the connection pins and pin links;
s2, when the contact pin falls between the two connecting pins, the contact pin slides to the positioning groove under the traction of the guide slope, and at the moment, the contact pin can be connected in the middle along the connecting pins;
S3, loading the chip into a chip groove, continuously pressing the chip to enable the chip to drive the sliding seat to move downwards along the connecting pin, and locking the sliding seat by utilizing the spring clamping tooth to clamp into the tooth groove, wherein in the process, the sliding seat extrudes the elastic sheet to bend, the bent elastic sheet extends out along the through groove, and the chip attaching pin or the contact pin is pressed and fixed;
S4, after the chip testing is completed, the chip and the sliding seat are pressed down, the sliding seat moves downwards to the bottom, the abutting blocks contact the inclined opening, the embedded blocks are pressed into the embedded grooves, the locking of the embedded blocks to the connecting pins along the limiting strips is released, the connecting pins are turned downwards through the connecting pins, the bearing of the chip is canceled, the chip after the testing is released from the falling of the chip groove, and then all parts are reset by utilizing the return of the elastic sheets and the embedded blocks, so that the chip can be loaded into the chip again from the upper side of the chip groove for testing.
Compared with the prior art, the invention has the beneficial effects that:
According to the invention, the pin is pulled to slide to the positioning groove through the guide slope, and then the pin can be connected in the middle along the connecting pin, compared with the prior art that the pin is inserted into the gap of the contact piece, the guide slope formed by the adjacent convex edges can pull the pin of the chip, so that the pin actively enters the positioning groove, the pin can be always connected in the middle with the connecting pin after the chip is mounted, on one hand, a user is not required to control the pin to be aligned with the test part accurately, the operation convenience is good, and on the other hand, the contact between the connecting pin and the pin can be more stable.
According to the invention, the elastic sheet is extruded and bent through the sliding seat to extend out along the through groove, the patch foot or the contact pin of the chip is pressed and fixed, compared with the traditional method that the patch foot or the contact pin is respectively fixed by utilizing the overturning of the contact sheet, the patch foot and the contact pin can be similarly supported by the connecting foot, and then the connecting foot and the contact pin are matched with the elastic sheet to carry out secondary fixed linking, so that on one hand, different chips can be installed and linked without adjusting a link component, the test adaptability is better, the operation convenience is high, and on the other hand, the elastic sheet is bent and fixed again after the chip is installed, and is not contacted with the patch foot or the contact pin during installation, so that the abrasion mark caused by the insertion of a chip link point can be avoided.
According to the invention, the butting block is contacted with the inclined opening, the embedding block is pressed into the embedding groove, the locking of the embedding block to the connecting pins along the limiting strips is released, at the moment, the connecting pins are turned downwards through the connecting pins, the bearing of chips is canceled, the tested chips fall from the chip groove and are released, then the components are reset by utilizing the return of the elastic sheets and the embedding block, the chips can be loaded from the upper side of the chip groove again for testing, compared with the existing test, the chips can be taken out from the equipment, the limiting strips and the connecting pins can be tested when the embedding block locks, and then the connecting pins are unlocked by the butting block when the sliding seat moves downwards, so that the connecting pins can be turned downwards to release the chips, the chips can be automatically separated from the testing equipment, a user is not required to pick up the chips one by one, and the convenience of testing operation is further improved.
Drawings
FIG. 1 is a schematic diagram of a test socket and a chip-mounted device according to the present invention;
FIG. 2 is a schematic diagram of the structure of the test socket and the pin chip according to the present invention;
FIG. 3 is a perspective sectional view of the detecting seat of the present invention;
FIG. 4 is an enlarged view of the invention at A in FIG. 3;
FIG. 5 is a schematic view of the structure of the chute and the connecting leg according to the present invention;
FIG. 6 is an exploded view of the chute and carriage of the present invention;
FIG. 7 is a schematic perspective view of a chute according to the present invention;
FIG. 8 is a schematic perspective view of a slider and a connecting pin according to the present invention;
FIG. 9 is an enlarged view of the invention at B in FIG. 8;
FIG. 10 is an exploded view of the slider, knob and spring of the present invention;
fig. 11 is an enlarged view of fig. 10C in accordance with the present invention.
1, A detection seat, 2, a chip groove, 3, a connecting pin, 4, a positioning component, 41, a convex edge, 42, a positioning groove, 43, a guiding slope, 44, a pin fixer, 441, a sliding groove, 442, a sliding seat, 443, a spring latch, 444, a column groove, 445, a rotary column, 446, a tooth groove, 447, a release notch, 448, a bevel edge, 449, a thimble, 4410, a notch, 4411, a spring plate, 4412, a through groove, 4413, a chip release component, 44131, a wall groove, 44132, a connecting pin, 44133, a buckle plate, 44134, an caulking groove, 44135, an caulking block, 44136, a top spring, 44137, a limiting strip, 44138, a bevel edge, 44139, a block, 441310 and an arc chute.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which are obtained by a worker of ordinary skill in the art without creative efforts, are within the protection scope of the present invention based on the embodiments of the present invention.
Referring to fig. 1 to 11, the invention provides a technical scheme that a diode chip photoelectric performance testing device comprises a detection seat 1, wherein a chip groove 2 is formed in the detection seat 1, a plurality of connecting pins 3 matched with chip pins are arranged on the inner side wall of the chip groove 2, the plurality of connecting pins 3 are equally divided into four groups, the four groups of connecting pins 3 are respectively positioned on four sides of the chip groove 2, when a direct-insertion chip is tested, the direct-insertion chip is placed into the chip groove 2, pins on four sides of the chip are contacted with the connecting pins 3, then photoelectric testing is carried out on the chip by utilizing the connection pins 3 and pin links, and a positioning component 4 matched with the chip pins is arranged on the connecting pins 3.
The positioning component 4 comprises a convex edge 41 fixedly arranged at the top of the connecting leg 3, the convex edge 41 is of a triangular block structure, the convex edges 41 are symmetrically distributed on the connecting leg 3 in a group of two ways, and a positioning groove 42 of an inverted triangular structure is arranged between the two convex edges 41.
When the contact pin falls between the two connecting pins 3, the contact pin slides to the positioning groove 42 under the traction of the guiding slope 43, and at the moment, the contact pin can be connected centrally along the connecting pins 3.
The pin holder 44 is provided on the connection pins 3 and the chip slot 2.
In this embodiment, as shown in fig. 1, 2, 3, 4, and 5 to 11, the pin holder 44 includes sliding grooves 441 formed on the inner sidewall of the chip slot 2, the number and positions of the sliding grooves 441 correspond to those of the connecting pins 3, the sliding seats 442 are slidably connected in the sliding grooves 441, and the connecting pins 3 are connected with the sliding seats 442.
The inner side wall of the sliding chute 441 is provided with spring clamping teeth 443, the chip is loaded into the chip slot 2, the chip is continuously pressed down, the sliding seat 442 is driven to move downwards along the connecting pin 3, and the sliding seat 442 is locked by the spring clamping teeth 443 clamped into the tooth slots 446.
A column groove 444 is formed on the surface of the sliding seat 442 opposite to one side of the spring latch 443, a rotary column 445 is connected in a rotary mode in the column groove 444, a tooth groove 446 matched with the spring latch 443 is formed on the side surface of the rotary column 445, and a release notch 447 matched with the spring latch 443 is cut on the side surface of the rotary column 445.
Spiral bevel edges 448 are formed at the upper end and the lower end of the rotary column 445, ejector pins 449 matched with the bevel edges 448 on the same side are fixedly connected to the inner bottom wall and the inner top wall of the sliding chute 441, when the sliding seat 442 drives the rotary column 445 to move downwards to the bottom, the lower ejector pins 449 push the rotary column 445 to rotate along the lower bevel edges 448, so that the release notches 447 are aligned with the spring latches 443, the tooth grooves 446 are separated from the spring latches 443, the sliding seat 442 is not locked and can move upwards freely, and when the sliding seat 442 drives the rotary column 445 to move upwards and push the rotary column 445 and the tooth grooves 446 to reset along the upper bevel edges 448, so that the sliding seat 442 can be locked by the spring latches 443 when moving downwards again.
The surface of the sliding seat 442 is provided with a notch 4410 on one side opposite to the connecting pin 3, the notch 4410 is internally provided with a spring piece 4411 capable of being bent under pressure, the top of the spring piece 4411 is rotationally connected in the notch 4410, the bottom of the spring piece 4411 is rotationally connected in the sliding groove 441, the connecting pin 3 is provided with a through groove 4412 for the spring piece 4411 to pass through, the sliding seat 442 moves downwards, the spring piece 4411 is extruded to be bent, the bent spring piece 4411 extends out along the through groove 4412, and the chip bonding pin or the contact pin of the chip is pressed and fixed.
The connecting pin 3, the sliding seat 442 and the chip slot 2 are provided with a chip release component 4413.
In this embodiment, as shown in fig. 1,2, 3, 4, and 5 to 11, the chip release assembly 4413 includes two wall slots 44131 formed along two side surfaces of the connection pin 3, a connection pin 44132 is fixedly disposed in the wall slot 44131, two fastening plates 44133 are fixedly disposed on the side surfaces of the sliding seat 442, and the connection pin 3 is rotatably inserted into the fastening plates 44133.
The caulking groove 44134 is formed in the outer surface of the button disc 44133, the caulking block 44135 is connected in a sliding mode in the caulking groove 44134, the top spring 44136 is arranged in the caulking groove 44134, the top spring 44136 pushes the caulking block 44135 to slide outwards, and the outer end of the connecting pin 44132 is fixedly connected with the limiting strip 44137 limited by the caulking block 44135.
The side surface of the embedding block 44135 is provided with an inclined opening 44138, the lower side of the chip groove 2 is fixedly provided with a supporting block 44139 matched with the inclined opening 44138, after the chip test is finished, the chip and the sliding seat 442 are pressed down, the sliding seat 442 moves down to the bottom, the supporting block 44139 contacts with the inclined opening 44138, the embedding block 44135 is pressed into the embedding groove 44134, the locking of the embedding block 44135 on the connecting pin 3 along the limit strip 44137 is released, at the moment, the connecting pin 3 is turned down through the connecting pin 44132, the bearing of the chip is canceled, and the tested chip falls down and is released from the chip groove 2.
The side surface of the insert 44135 is provided with an arc chute 441310 matched with the limit bar 44137, after the insert 44135 is extruded by the abutting block 44139 along the inclined opening 44138 to enter the insert 44134, the limit bar 44137 can be driven by the connecting pin 44132 to rotate downwards, and after the abutting block 44139 leaves the inclined opening 44138, the reset insert 44135 can push the limit bar 44137 and the connecting pin 44132 to synchronously rotate by utilizing the arc chute 441310.
In this embodiment, as shown in fig. 1,2, 3,4, and 5 to 11, the end of the thimble 449 contacting the inclined edge 448 is rolled and embedded with a ball, and when the pillar 445 moves down to the bottom along with the slide 442, the contact process of the thimble 449 and the inclined edge 448 uses the ball to perform rolling friction, so as to avoid excessive wear caused by the hard friction between the thimble 449 and the inclined edge 448.
In this embodiment, as shown in fig. 1,2,3,4, and 5 to 11, a shock pad is disposed on the inner bottom wall of the sliding seat 442 and is matched with the sliding seat 442, and when the sliding seat 442 moves down to the bottom along the sliding slot 441, the sliding seat 442 can perform shock absorption by using the shock pad, so as to reduce damage to the test structure and the chip caused by the sliding seat 442 moving down to collide with the sliding slot 441.
In this embodiment, as shown in fig. 1,2,3, 4, and 5 to 11, a paddle matching with the slot 446 is fixedly disposed on the inner sidewall of the sliding slot 441, and the paddle is located on the upper side of the abutment 44139, and when the rotary column 445 and the sliding seat 442 move down to the upper side of the abutment 44139 during the chip loading process, the paddle is dialed by the slot 446 to prompt the user to stop pressing down the chip, and the chip is released downward after continuing to be pressed down.
In this embodiment, as shown in fig. 1,2, 3,4, and 5 to 11, the limit bar 44137 and the connecting pin 44132 are mounted by a screw, and the limit bar 44137 and the connecting pin 44132 can be separated after the screw is removed, so that a user can replace the worn limit bar 44137.
The application method of the diode chip photoelectric performance testing device comprises the following steps:
S1, when the direct-insert type chip is tested, the direct-insert type chip is placed in the chip groove 2, pins on four sides of the chip are contacted with the connecting pins 3 in the process, and then the photoelectric test is carried out on the chip by utilizing the connection pins 3 and pin connection.
S2, when the contact pin falls between the two connecting pins 3, the contact pin slides to the positioning groove 42 under the traction of the guiding slope 43, and at the moment, the contact pin can be connected centrally along the connecting pins 3.
S3, the chip is placed into the chip groove 2, the chip is continuously pressed down, the sliding seat 442 is driven to move downwards along the connecting pin 3, the sliding seat 442 is locked by the spring clamping teeth 443 clamped into the tooth grooves 446, in the process, the sliding seat 442 extrudes the elastic sheet 4411 to bend, the bent elastic sheet 4411 stretches out along the through groove 4412, and the chip attaching pin or the contact pin is pressed and fixed.
S4, after the chip test is completed, the chip and the sliding seat 442 are pressed down, after the sliding seat 442 moves down to the bottom, the abutting block 44139 contacts the inclined opening 44138, the embedded block 44135 is pressed into the embedded groove 44134, the locking of the embedded block 44135 to the connecting pin 3 along the limit bar 44137 is released, at the moment, the connecting pin 3 turns down through the connecting pin 44132, the bearing of the chip is canceled, the tested chip falls and is released from the chip groove 2, and then all parts are reset by utilizing the return of the elastic piece 4411 and the embedded block 44135, so that the chip can be loaded into the chip from the upper side of the chip groove 2 again for test.
The foregoing has shown and described the basic principles, principal features and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present invention, and are not intended to limit the invention, and that various changes and modifications may be made therein without departing from the spirit and scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510080442.XA CN119511050B (en) | 2025-01-20 | 2025-01-20 | Diode chip photoelectric performance testing device and use method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202510080442.XA CN119511050B (en) | 2025-01-20 | 2025-01-20 | Diode chip photoelectric performance testing device and use method |
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| Publication Number | Publication Date |
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| CN119511050A CN119511050A (en) | 2025-02-25 |
| CN119511050B true CN119511050B (en) | 2025-04-25 |
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| CN202510080442.XA Active CN119511050B (en) | 2025-01-20 | 2025-01-20 | Diode chip photoelectric performance testing device and use method |
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Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN216560879U (en) * | 2021-11-02 | 2022-05-17 | 苏州派富特智能制造科技有限公司 | High-precision chip function automatic test equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4019441B2 (en) * | 1996-07-26 | 2007-12-12 | 株式会社エンプラス | IC socket |
| KR200163193Y1 (en) * | 1999-07-01 | 2000-02-15 | 리노공업주식회사 | Separate socket device for probing chip |
| KR200316883Y1 (en) * | 2003-03-19 | 2003-06-19 | 리노공업주식회사 | test socket |
| KR100795491B1 (en) * | 2006-07-14 | 2008-01-16 | 미래산업 주식회사 | Carrier Module for Card Packages |
| KR101014208B1 (en) * | 2008-05-20 | 2011-02-14 | 광전자 주식회사 | Semiconductor device, combination structure and manufacturing method thereof |
| TWM368910U (en) * | 2009-02-23 | 2009-11-11 | Hon Hai Prec Ind Co Ltd | Electrical connector |
| CN111060725A (en) * | 2020-01-08 | 2020-04-24 | 张利霞 | Semiconductor chip testing device |
| CN218888766U (en) * | 2022-10-18 | 2023-04-18 | 江西天漪半导体有限公司 | Hybrid packaging structure of integrated circuit chip |
| CN220189618U (en) * | 2023-07-06 | 2023-12-15 | 苏州尚芯信息科技有限公司 | An operating device that replaces traditional embedded encryption chips |
| CN222365016U (en) * | 2023-12-19 | 2025-01-17 | 珠海格力电器股份有限公司 | A testing device |
| CN118348394B (en) * | 2024-04-30 | 2024-11-01 | 弘润半导体(苏州)有限公司 | Chip socket for testing semiconductor chip |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN216560879U (en) * | 2021-11-02 | 2022-05-17 | 苏州派富特智能制造科技有限公司 | High-precision chip function automatic test equipment |
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