CN119525710A - High-speed copper wire welding method - Google Patents
High-speed copper wire welding method Download PDFInfo
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- CN119525710A CN119525710A CN202411784844.XA CN202411784844A CN119525710A CN 119525710 A CN119525710 A CN 119525710A CN 202411784844 A CN202411784844 A CN 202411784844A CN 119525710 A CN119525710 A CN 119525710A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/21—Bonding by welding
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/60—Preliminary treatment
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Abstract
本发明涉及激光焊接技术领域，具体地指一种高速铜导线焊接方法。包括以下步骤：对待焊接的高速铜导线进行整形；将完成整形的高速铜导线装配到铜端子上；调节蓝光半导体连续激光器的位置，使发射的蓝光激光聚焦到高速铜导线与铜端子连接处，对铜导线和铜端子进行焊接。本申请的高速铜导线焊接方式简单，采用蓝光激光对高速铜导线进行焊接，能够提升激光焊接铜导线的吸收率和焊接效果，解决了现有激光焊接铜导线存在的诸多问题，具有极大的推广价值。
The present invention relates to the field of laser welding technology, and specifically refers to a high-speed copper wire welding method. The method comprises the following steps: shaping the high-speed copper wire to be welded; assembling the shaped high-speed copper wire onto the copper terminal; adjusting the position of the blue light semiconductor continuous laser so that the emitted blue light laser is focused on the connection between the high-speed copper wire and the copper terminal, and welding the copper wire and the copper terminal. The high-speed copper wire welding method of the present application is simple, and the blue light laser is used to weld the high-speed copper wire, which can improve the absorption rate and welding effect of the laser welded copper wire, solves many problems existing in the existing laser welding of copper wires, and has great promotion value.
Description
Technical Field
The invention relates to the technical field of laser welding, in particular to a high-speed copper wire welding method.
Background
DAC high-speed cable (DAC for short) is a high-performance connection solution implemented using copper wire materials and high-speed signal transmission technology. The method is mainly used for connecting ports among data center equipment, servers, network switches and other equipment, and provides high-speed and low-delay data transmission. The device has the characteristics of low power consumption, easiness in installation and maintenance and the like. The DAC is composed of two copper conductor plugs, a high-speed signal transmission circuit and an external insulating shell. Connectors are bridges for communication in electronic circuits, and are widely used in various fields including data communications, computers and peripherals, consumer electronics, automotive, industrial, medical, aerospace, and military. While a high-speed connector is a connector designed to transmit high-frequency, high-speed data and signals. Are commonly used to connect between different electronic devices, modules or circuit boards to ensure reliable signal transmission.
The DAC is a cable assembly with fixed connectors at two ends, and is widely applied to connection of local area networks, data centers and high-performance computers. DACs have become the most cost effective high speed interconnect schemes by using copper cables rather than photoelectric conversion modules. In addition, the low power consumption characteristics of DAC copper cables mean that no additional power consumption is required, and finally, copper cables are lower in cost than optical cables by a factor of 2 to 5 compared with optical cables of the same length. These features are co-cast to uniquely place DAC direct connect copper cables in today's high speed interconnect schemes.
The greatest advantage of copper is its high electrical and thermal conductivity, which is also the greatest challenge for soldering. Copper is ten times more thermally conductive than conventional steels and requires a very strong energy input. Welding may be performed by laser, which may contribute high energy intensity over the interaction region. However, there is a problem in laser welding that, in general, highly conductive materials have high reflectivity, and after laser light transmits energy to a workpiece by means of optical conduction, the highly reflective materials emit most laser light, resulting in degradation of welding quality. More importantly, the lasers used in the current laser welding are all in the near infrared spectrum, and the reflective metals and most transparent materials can only absorb a small part of infrared lasers, so that the laser welding of the materials is greatly adjusted.
It has been found that only about 5% of the laser energy is currently available for heating the material in the braze process, the utilization of the laser energy is very low, and a high power laser output device is required because the material is heated from room temperature over a large temperature rise. Furthermore, copper surfaces at room temperature reflect almost all of the laser light, which can cause damage to surrounding electronic components. In addition, because of the need for rapid heating of the copper material being welded, if heat conduction welding is adopted, damage may occur due to overheating of the material, and the surface tension and viscosity of the copper material meet, so that the welding pool is very unstable. Therefore, the laser welding of copper materials is easy to cause a plurality of welding defects, and the welding quality and the welding efficiency are seriously affected.
Disclosure of Invention
The application aims to solve the defects of the background technology and provides a high-speed copper wire welding method.
The technical scheme of the application is that the high-speed copper wire welding method comprises the following steps:
Shaping a high-speed copper wire to be welded;
assembling the shaped high-speed copper wire onto the copper terminal;
And adjusting the position of the blue light semiconductor continuous laser to focus the emitted blue light laser to the joint of the high-speed copper wire and the copper terminal, and welding the copper wire and the copper terminal.
The method for shaping the high-speed copper wire to be welded comprises the steps of placing the high-speed copper wire into a jig, and processing the side surface, close to the end part, of the high-speed copper wire by using the jig to form a plane which can be tightly attached to a copper terminal.
The jig comprises an upper shaping block and a lower shaping block positioned right below the upper shaping block, wherein the upper end face of the lower shaping block is provided with a fixing groove for placing a high-speed copper wire, the lower end face of the upper shaping block is provided with a shaping protrusion corresponding to the lower fixing groove, and the shaping protrusion is of a vertical protrusion structure with a plane lower end face.
According to the high-speed copper wire welding method, the upper end face of the lower shaping block is provided with the plurality of fixing grooves which are arranged at intervals in the transverse direction, and the lower end face of the upper shaping block is provided with the plurality of shaping protrusions which are arranged at intervals in the transverse direction and correspond to the lower fixing grooves.
According to the high-speed copper wire welding method, the method for assembling the shaped high-speed copper wire on the copper terminal comprises the steps of attaching a plane processed by a jig of the high-speed copper wire on the copper terminal, and then installing the high-speed copper wire and the copper terminal which are attached together on a two-dimensional platform capable of horizontally moving.
The method for adjusting the position of the blue semiconductor continuous laser comprises the steps of mounting the blue semiconductor continuous laser on a vertically adjustable lifting platform, debugging the blue semiconductor continuous laser, adjusting the positive defocus of a laser focusing focus to be 0.2 mm-1 mm, and adjusting the light spot of the laser focusing focus to be 30 mu m-90 mu m.
According to the high-speed copper wire welding method provided by the application, the power of the blue semiconductor continuous laser is 100-500W, the collimation of the laser focusing head is 50-150 mm, and the laser focal length is 50-150 mm.
According to the method for welding the high-speed copper wire, the method for focusing the emitted blue laser to the joint of the high-speed copper wire and the copper terminal comprises the steps of adjusting a blue semiconductor continuous laser to emit laser with the power of 30W-280W and the laser pulse width of 1 ns-100 ns, and enabling the emitted laser to act on the joint of the high-speed copper wire and the copper terminal.
According to the high-speed copper wire welding method provided by the application, the two-dimensional platform is utilized to adjust the alignment of the position to be welded of the high-speed copper wire and the copper terminal and the laser focusing point.
The method for welding the copper wire and the copper terminal comprises the step of performing welding operation on the high-speed copper wire and the copper terminal by emitting laser from a blue semiconductor continuous laser, wherein the two-dimensional platform is kept in a static state in the laser emitting process.
The application has the advantages that 1, the application is used for welding the high-speed copper wire and the copper terminal, the application adopts blue laser to weld, the welding reflection of the blue laser to the high-speed copper wire is smaller, the blue laser can better act on the welding operation of the high-speed copper wire, the absorptivity of the high-speed copper wire to the blue laser is extremely high, the welding effect is greatly improved, the high-speed copper wire can be welded without splashing, the copper wire with even thickness and the small copper part with the thickness of 0.3mm can be repeatedly welded in the heat conduction welding mode, and the application shapes the copper wire, adjusts the welding structure thereof, and can form better welding effect;
2. The shaping operation of the high-speed copper wire is very simple, the high-speed copper wire is pressed and shaped by the jig by constructing the special jig, a plane can be formed at the joint of the high-speed copper wire and the copper terminal, the contact area of the joint of the high-speed copper wire and the copper terminal is increased, and the subsequent welding operation is convenient;
3. The shaping jig has a simple structure, can stably place the high-speed copper wire into the fixed groove, limits the high-speed copper wire through the fixed groove, forms a plane on the high-speed copper wire through the shaping bulge, and has a simple structure and very easy shaping operation;
4. According to the application, the jig is provided with the plurality of shaping bulges and the fixing grooves, and can perform one-time shaping according to the structures of the high-speed copper wires to be welded and the copper terminals, so that the plurality of high-speed copper wires can be shaped at one time, and the shaping efficiency is greatly improved;
5. according to the application, the high-speed copper wire shaping plane is attached to the copper terminal, so that the contact area of the high-speed copper wire and the copper terminal is greatly increased, the subsequent welding is convenient, the welding effect of the high-speed copper wire and the copper terminal is greatly increased, the high-speed copper wire and the copper terminal are placed on the two-dimensional platform, the welding position can be adjusted through the movement of the two-dimensional platform, and the operation is extremely convenient;
6. According to the application, the blue light semiconductor continuous laser is debugged before laser welding, so that the emitted blue light laser can well weld the high-speed copper wire, and meanwhile, the positive defocus of a focusing focus is set to be 0.2-1 mm in consideration of rapid temperature rise after the high-speed copper wire absorbs the blue light laser, so that the problem of high-temperature melting when the high-speed copper wire is directly positioned at the focusing point of the laser is avoided, the high-speed copper wire is welded in a proper state, and the welding effect is improved;
7. The blue semiconductor continuous laser selected by the application can be well applied to the welding operation of the high-speed copper wire and the copper terminal, is easy to obtain, and can be conveniently applied to the welding operation of the high-speed copper wire by summarizing and analyzing a large number of experiments to obtain corresponding control parameters;
8. According to the application, parameter setting is performed for the welding operation of the high-speed copper wire, and the optimal parameters of the blue laser for welding the high-speed copper wire are obtained through a large number of parameter summary analyses, and the illustrated blue laser can efficiently perform the welding operation on the high-speed copper wire, so that the excellent welding effect is ensured;
9. According to the application, the two-dimensional platform is adjusted to carry out plane adjustment on the high-speed copper wire and the copper terminal, so that the positions to be welded of the high-speed copper wire and the copper terminal are ensured to be accurately aligned with the laser focusing head, the focusing error problem caused by the fact that the adjusted focusing head moves again is avoided, and the problems of complex structure and high adjustment difficulty of the laser focusing head are avoided;
10. The application maintains a stable static state for the two-dimensional platform in the laser emission process, ensures that laser can accurately weld the copper wire and the copper terminal below, adopts a single-point welding mode, has simple operation, avoids the problem of complex structure of the laser caused by the need of adjusting the laser focusing head, and reduces the complexity of the whole laser welding equipment.
The high-speed copper wire welding method is simple, the blue laser is used for welding the high-speed copper wire, the absorptivity and the welding effect of the laser welding copper wire can be improved, a plurality of problems existing in the existing laser welding copper wire are solved, and the high-speed copper wire welding method has great popularization value.
Drawings
FIG. 1 is a schematic diagram of a jig according to the present application;
FIG. 2 is a schematic diagram of the high-speed copper wire after being shaped;
FIG. 3 is a schematic diagram of the connection of a high-speed copper wire to a copper terminal in accordance with the present application;
FIG. 4 is a schematic diagram of a high-speed copper wire bonding process according to the present application.
Wherein, the device comprises an upper shaping block 1, a lower shaping block 2, a 3-punching cylinder, a 4-high-speed copper wire and a 5-copper terminal.
Detailed Description
Embodiments of the present application are described in detail below, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present application and should not be construed as limiting the application.
In the description of the present application, it should be understood that the terms "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings, are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
The application will now be described in further detail with reference to the drawings and to specific examples.
The application relates to a high-speed copper wire welding method, which is used for welding the end part of a high-speed copper wire to a copper terminal of a connector, compared with the infrared laser welding mode in the traditional mode, the application adopts blue laser to carry out welding operation, and the high-speed copper wire has higher reflectivity to infrared laser, so that the welding effect to the high-speed copper wire is poor. The high-speed copper wire has low reflectivity to blue laser, the high-speed copper wire has high absorptivity to blue laser (wavelength is 455 nm) of 45% -55%, and can achieve good absorption effect and good welding effect under the action of blue laser. In the blue laser welding process, blue laser can be easily absorbed by the high-speed copper wire, after the high-speed copper wire is shaped, the blue laser can be easily welded to form a splash-free welding spot for conduction welding, and meanwhile, the continuous fiber blue laser can easily realize accurate control of laser radiation energy by controlling pulse width and laser power. In addition, due to the good absorption of the high-speed copper wire to the blue laser, even copper wires can be repeatedly welded in a heat conduction welding mode, and small copper parts with the thickness of 0.3mm can be efficiently welded. The blue laser beam welding can keep the process temperature constant between the melting temperature and the evaporation temperature, and the welding effect is greatly improved. Due to the stability and high absorption of the blue laser welding process, the blue wavelength can achieve a high feed rate, thereby reducing heat loss due to heat conduction and thermal expansion.
Specifically, the high-speed copper wire welding method of the application, as shown in fig. 4, comprises the following steps:
s1, shaping a high-speed copper wire 4 to be welded;
Because the high-speed copper wire 4 is in a cylindrical structure, if the high-speed copper wire 4 is directly welded to the copper terminal 5 of the connector, the contact area between the high-speed copper wire 4 and the copper terminal 5 is small (the high-speed copper wire 4 is in a cylindrical structure and directly contacts with the copper terminal 5, and the contact position between the high-speed copper wire 4 and the copper terminal 5 is one line), so that the subsequent welding effect is poor, and the problem of excessively small contact area can be solved by shaping the high-speed copper wire 4;
s2, assembling the shaped high-speed copper wire 4 on the copper terminal 5;
The shaped high-speed copper wire 4 and the copper terminal 5 are assembled and bonded together, so that the subsequent welding operation is convenient;
S3, adjusting the position of the blue light semiconductor continuous laser, focusing the emitted blue light laser to the connection position of the high-speed copper wire 4 and the copper terminal 5, and welding the high-speed copper wire 4 and the copper terminal 5;
the high-speed copper wire 4 has good absorptivity to blue laser, and after the blue laser acts on the high-speed copper wire 4, the high-speed copper wire 4 can be quickly heated, so that the purpose of quickly welding the high-speed copper wire 4 to the copper terminal 5 of the connector is achieved.
In some embodiments of the present application, the step S1 is optimized in this embodiment, specifically, as shown in fig. 1 to 3, the jig for shaping the high-speed copper wire 4 in this embodiment includes an upper shaping block 1 and a lower shaping block 2 located right below the upper shaping block 1, a fixing groove for placing the high-speed copper wire 4 is disposed on an upper end surface of the lower shaping block 2, a shaping protrusion corresponding to the lower fixing groove is disposed on a lower end surface of the upper shaping block 1, and the shaping protrusion is a vertical protrusion structure with a planar lower end surface. The punching cylinder 3 is installed to the upper end of last plastic piece 1, and punching cylinder 3 drive goes up plastic piece 1 and follows vertical removal, and the high-speed copper wire 4 of placing in the fixed slot below is punched, realizes carrying out the purpose of plastic to high-speed copper wire 4.
The specific shaping method comprises the steps of placing one end to be welded of a strip-shaped high-speed copper wire 4 into a fixed groove, wherein the fixed groove is of a circular arc-shaped groove structure, after the high-speed copper wire 4 is placed into the fixed groove, the lower half part of the outer circumferential side surface of the one end to be welded of the high-speed copper wire 4 is tightly attached to the fixed groove, driving an upper shaping block 1 to press downwards by a stamping cylinder 3 until the lower end surface of a shaping protrusion of the upper shaping block 1 abuts against the upper half part of the outer circumferential side surface of the one end to be welded of the high-speed copper wire 4, continuously stamping downwards by the stamping cylinder 3, and downwards extruding the high-speed copper wire 4 by the shaping protrusion.
The outer side of the circumference of the end to be welded of the high-speed copper wire 4 after shaping is a plane, which is the contact part with the copper terminal 5, and the section of the end to be welded of the high-speed copper wire 4 after shaping is in a structure that one side of the plane is circular arc, the other side of the plane is circular arc, or is in a trapezoid structure, and the high-speed copper wire is mainly formed according to the structure of a fixed slot, so long as a plane contacting with the copper terminal 5 is satisfied.
In practical application, the number of copper terminals 5 on one connector is large, and the number of high-speed copper wires 4 which may need to be shaped at one time is also large, so as to improve the shaping efficiency, in this embodiment, a plurality of fixing grooves arranged at intervals along the transverse direction are provided on the upper end surface of the lower shaping block 2, and a plurality of shaping protrusions arranged at intervals along the transverse direction and corresponding to the lower fixing grooves are provided on the lower end surface of the upper shaping block 1. Therefore, the high-speed copper wires 4 can be shaped at one time, the high-speed copper wires 4 are placed into the corresponding fixing grooves of the lower shaping block 2 at one time, and then the high-speed copper wires 4 can be punched and formed at one time.
In other embodiments of the present application, the step S2 is optimized, and when the shaping of the high-speed copper wire 4 is completed, the shaped high-speed copper wire 4 needs to be assembled to the copper terminal 5, and the plane of the high-speed copper wire 4 processed by the jig is attached to the copper terminal 5, and then the high-speed copper wire 4 and the copper terminal 5 attached together are mounted on a two-dimensional platform capable of moving horizontally.
The side of the end part to be welded of the high-speed copper wire 4 after shaping is provided with a plane, the plane is attached to the copper terminal 5, the contact area of the high-speed copper wire 4 and the copper terminal 5 is increased by the plane after shaping, and the heat conduction efficiency and the welding connection compactness can be improved during subsequent welding.
The high-speed copper wire 4 and the copper terminal 5 are tightly attached together and then transferred to a two-dimensional platform, the two-dimensional platform is a carrying platform for carrying the high-speed copper wire 4 and the copper terminal 5, and the high-speed copper wire 4 and the copper terminal 5 placed on the two-dimensional platform can be adjusted in the horizontal direction through the two-dimensional platform, so that the high-speed copper wire 4 and the copper terminal 5 can be conveniently adjusted to be aligned with the laser focusing head.
In a further embodiment of the present application, the step S3 is optimized in this embodiment, specifically, in this embodiment, after the high-speed copper wire 4 and the copper terminal 5 are assembled on the two-dimensional platform, the laser is debugged, the blue semiconductor continuous laser is adopted in this embodiment, and is installed on the lifting platform, the lifting platform is vertically adjustable, the horizontal direction is set to be the X direction and the Y direction, and the vertical direction is the Z direction, so that the two-dimensional platform in this embodiment can perform the adjustment in the X direction and the Y direction, the lifting platform in this embodiment can perform the adjustment in the Z direction, and the blue semiconductor continuous laser can perform the adjustment in the Z direction through the lifting platform, and only the vertical adjustment in this embodiment is performed.
The power of the blue semiconductor continuous laser is 100-500W, the collimation of the laser focusing head is 50-150 mm, and the laser focal length is 50-150 mm. When the laser is tested to be strongest through adjusting the two-dimensional platform and the lifting platform during debugging, the position with the smallest light spot is the focus, the focus is the position with the largest energy on the laser beam, if the focus is directly aligned to the high-speed copper wire 4, the high-speed copper wire 4 can be burnt out (huge energy of the laser is concentrated to the high-speed copper wire 4 in a short time, the high-speed copper wire 4 is rapidly heated, and damage to the high-speed copper wire 4 can be caused), in order to avoid the situation, in the debugging process, the focus of the embodiment is adjusted to be 0.2 mm-1 mm just out of focus of the laser, namely, the focus of the embodiment is positioned at 0.2 mm-1 mm right above a position to be welded of the high-speed copper wire 4, and the light spot of the focus of the laser is adjusted to be 30 mu m-90 mu m.
After the debugging is finished, the high-speed copper wire 4 can be formally welded, parameters of the blue semiconductor continuous laser are set according to the processing position coordinates of the sizes of the high-speed copper wire 4 and the copper terminal 5 in welding software, and the blue semiconductor continuous laser is adjusted to emit laser with the power of 30W-280W and the laser pulse width of 1 ns-100 ns.
The blue semiconductor continuous laser is triggered to emit laser light, so that the emitted laser light is applied to the connection part of the high-speed copper wire 4 and the copper terminal 5. Under the effect of blue laser radiation, the fluctuation of laser in the welding process can be avoided through the light spot size control of the small-size high-power density of the focusing head of the blue semiconductor continuous laser, the formation of welding spatter and cavities can be effectively inhibited, and the stability of welding quality is ensured.
After the welding is finished, the laser is turned off, the welding point is formed by cooling the welding position of the high-speed copper wire 4 and the copper terminal 5, and the two-dimensional platform is kept in a static state in the laser emission process. The surface of the welding spot is free from splashing, the welding spots are uniform in size.
If there are a plurality of welding spots on the high-speed copper wire 4 and the copper terminal 5, the two-dimensional platform can be adjusted to enable the position to be welded of the high-speed copper wire 4 and the copper terminal 5 to be moved to be aligned with the focusing head, and then the laser is triggered again to weld the next welding spot.
During the laser emission, the two-dimensional platform remains stationary.
During actual operation, the jig is used for shaping the high-speed copper wire 4, one end of the strip-shaped high-speed copper wire 4 to be welded is placed in the fixed groove, and after the high-speed copper wire 4 is placed in the fixed groove, the lower half part of the outer side surface of the circumference of the one end of the high-speed copper wire 4 to be welded is tightly attached to the fixed groove; the stamping cylinder 3 drives the upper shaping block 1 to press downwards, the upper shaping block 1 moves downwards until the lower end face of the shaping bulge of the upper shaping block 1 is abutted against the upper half part of the circumferential outer side face of one end to be welded of the high-speed copper wire 4, the stamping cylinder 3 continuously presses downwards, the shaping bulge presses downwards the high-speed copper wire 4, under the stamping of the stamping cylinder 3, the high-speed copper wire 4 can deform under the limitation of the shaping bulge and the fixing groove, and the upper end face of the part, placed in the fixing groove, of the high-speed copper wire 4 is stamped into a plane completely attached to the shaping bulge; after stamping, the stamping cylinder 3 is lifted, the stamped high-speed copper wire 4 is taken out from the fixed groove, the plane of the shaped high-speed copper wire 4 is attached to the copper terminal 5, the high-speed copper wire 4 and the copper terminal 5 are tightly attached to each other and then transferred to the two-dimensional platform, when the two-dimensional platform and the lifting platform are tested to have the strongest laser, the position with the smallest light spot is the focus, the positive defocus of the focusing focus of the laser is adjusted to be 0.2 mm-1 mm, the light spot of the focusing focus of the laser is adjusted to be 30 mu m-90 mu m, the parameters of the blue semiconductor continuous laser are set, the emitting power of the blue semiconductor continuous laser is adjusted to be 30W-280W, the laser pulse width of the blue semiconductor continuous laser is 1 ns-100 ns, the blue semiconductor continuous laser is triggered to emit laser, the laser is enabled to be applied to the joint of the high-speed copper wire 4 and the copper terminal 5, after the welding is finished, the laser is turned off, the welding joint of the high-speed copper wire 4 and the copper terminal 5 is cooled to form a welding spot, and if a plurality of welding spots or welding coordinates exist, the operation is carried out according to the flow, and the operation is carried out one by one until all welding procedures of the welding spots are completed.
The foregoing has shown and described the basic principles, principal features and advantages of the application. It will be understood by those skilled in the art that the present application is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present application, and various changes and modifications may be made without departing from the spirit and scope of the application, which is defined in the appended claims. The scope of the application is defined by the appended claims and equivalents thereof.
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