CN119542223A - Wafer positioning device and method - Google Patents
Wafer positioning device and method Download PDFInfo
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- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
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Abstract
本发明提供一种晶圆定位装置，其控制器接收晶圆的外缘的影像数据，并透过影像数据的一阶导数及二阶导数配合多项式回归运算来算出晶圆的外缘的定位特征的精确位置，将影像数据中的定位特征排除后，根据排除定位特征的影像数据计算出晶圆的中心偏移量，以及接着计算出补正角度与X‑Y补正量。控制器接着依据补正角度控制驱动装置控制旋转平台模块旋转以使定位特征转动到指定角度，以及依据X‑Y补正量控制晶圆定位装置的驱动装置使晶圆于晶圆定位装置的旋转平台模块的水平平面进行移动使晶圆的圆心对准旋转平台模块的指定位置。
The present invention provides a wafer positioning device, wherein a controller receives image data of the outer edge of a wafer, and calculates the precise position of the positioning feature of the outer edge of the wafer through the first-order derivative and the second-order derivative of the image data in combination with a polynomial regression operation, and after excluding the positioning feature in the image data, calculates the center offset of the wafer according to the image data excluding the positioning feature, and then calculates the correction angle and the X-Y correction amount. The controller then controls the driving device to control the rotation of the rotating platform module according to the correction angle so that the positioning feature rotates to a specified angle, and controls the driving device of the wafer positioning device according to the X-Y correction amount so that the wafer moves in the horizontal plane of the rotating platform module of the wafer positioning device so that the center of the wafer is aligned with the specified position of the rotating platform module.
Description
Technical Field
The present invention relates to a wafer positioning device and method, and more particularly, to a wafer positioning device and method capable of detecting non-transparent silicon wafers and translucent special wafers and supporting different positioning feature judgment.
Background
The wafer needs to be positioned before entering the semiconductor manufacturing equipment, and therefore, the outer edge of the wafer may be designed with positioning features, such as notch (notch) type positioning features. The wafer positioning device for positioning the wafer is also called a wafer edge finder, and is mainly used for finding the position of the positioning feature (which is the angle of the positioning feature) at the outer edge of the wafer, and performing eccentric correction (including correction of X-Y correction amount (X-Y axis) and correction of correction angle (theta axis)). After the wafer is calibrated, its center is aligned to a designated position of a rotating platen carrying the wafer, and the wafer is rotated to a designated angle, and then the rotating platen carrying the wafer delivers the wafer to a semiconductor fabrication facility for subsequent processing, wherein the designated position is typically referred to as a home position of the rotating platen, which is a constant position, and the positioning feature needs to be rotated to the designated angle when the wafer is scheduled to enter the next process.
The taiwan patent No. TW 735315 provides a method and system for detecting a position of a wafer, which is described by first rotating a rotating table at a faster rotation speed in one direction to drive the wafer placed on the rotating table and having a positioning feature at an outer edge thereof to rotate, while detecting the outer edge of the wafer by a detector to generate detection results to a controller, each detection result corresponding to a rotation angle of the rotating table, reversely rotating the rotating table at a slower rotation speed to drive the wafer to reversely rotate after the positioning feature passes the detector, while detecting the outer edge of the reversely rotated wafer by the detector to generate detection results to the controller, and stopping the rotation of the rotating table when the positioning feature of the wafer passes the detector again, and estimating the eccentric position of the wafer and the position of the positioning feature by the controller according to the accumulated detection results and the corresponding rotation angle.
However, the detection method of the above-mentioned approved patent requires that the rotating platform is rotated more than twice, and according to the detailed description of the above-mentioned approved patent, the wafer in the above-mentioned approved patent cannot be a wafer of semitransparent material, and the positioning feature is a notch type positioning feature. Therefore, there is a need for a wafer positioning apparatus and method that can rotate a rotating platen less frequently and can support various types of wafers and various types of positioning features.
Disclosure of Invention
In order to solve the above-mentioned technical problems, the present invention provides a wafer positioning device and method, which mainly uses the first derivative and the second derivative of the image data of the outer edge of the wafer to find the outline position of the positioning feature of the outer edge of the wafer, then uses the polynomial regression calculation to find the exact position (i.e. exact angle) of the positioning feature, then excludes the positioning feature from the image data, calculates the center offset of the wafer according to the image data excluding the positioning feature, calculates the correction angle according to the exact position and the center offset of the positioning feature, and calculates the X-Y correction amount according to the correction angle and the center offset, finally controls the X-axis moving mechanism, Y-axis moving mechanism and theta-axis rotating mechanism of the rotating platform according to the calculated correction angle and X-Y correction amount to make the center of the wafer align to the specified position of the rotating platform and make the positioning feature of the wafer rotate to the specified angle.
In accordance with at least one aspect of the present invention, a wafer positioning apparatus is provided and includes a rotation stage module, a light source, an image capturing device, a controller and a driving device. The rotating platform module is used for bearing the wafer and rotating to rotate the wafer. The light source is arranged on the outer side of the rotary platform module and used for emitting light rays to irradiate the outer edge of the wafer. The image capturing device is arranged on the outer side of the rotating platform module and faces the light source and is used for acquiring image data of the outer edge of the wafer. The controller is electrically connected with the light source and the image capturing device and is used for receiving the image data, calculating the accurate position of the positioning feature of the outer edge of the wafer through the first derivative and the second derivative of the image data and the polynomial regression operation, calculating the center offset of the wafer according to the image data excluding the positioning feature after the positioning feature in the image data is excluded, calculating the correction angle according to the accurate position and the center offset of the positioning feature, and calculating the X-Y correction according to the correction angle and the center offset. The driving device is electrically connected with the controller and is connected with the rotary platform module. The controller controls the driving device to drive the rotating platform module to rotate according to the correction angle so as to enable the positioning feature to rotate to a specified angle (the positioning feature needs to rotate to the specified angle when the wafer is reserved for entering the next process), and controls the driving device to drive the rotating platform module to enable the wafer to move on the horizontal plane of the rotating platform module according to the X-Y correction amount so as to enable the circle center of the wafer to be aligned with the specified position of the rotating platform module (the specified position refers to the home position of the rotating platform module).
Optionally, in an embodiment of the wafer positioning apparatus, the controller calculates a rough position of the positioning feature according to a first derivative and a second derivative of the image data, and then performs iterative calculation for a plurality of times according to the rough position by using a polynomial regression operation to calculate an accurate position of the positioning feature, wherein the accurate position is an accurate angle of the positioning feature.
Optionally, in the embodiment of the wafer positioning apparatus, the controller excludes the positioning feature of the accurate position in the image data, and finds the corresponding circle equation according to the image data excluding the positioning feature, so as to obtain the center offset.
Optionally, in the embodiment of the wafer positioning apparatus, the Wafer (WF) is a non-transparent silicon wafer or a wafer made of semitransparent material.
Optionally, in an embodiment of the wafer positioning device described above, the positioning feature of the Wafer (WF) is a notch-type positioning feature, a double-flat-edge type positioning feature or a single-flat-edge type positioning feature.
Optionally, in an embodiment of the wafer positioning apparatus, the controller controls the driving device to drive the rotating platform module to rotate at least 360 degrees, and the image data captured by the image capturing device is image data of at least 360 degrees of rotation of an outer edge of the wafer.
Optionally, in the embodiment of the wafer positioning apparatus, the controller sets the brightness of the light source and the sensitivity of the image capturing device according to the instructions input by the operator, wherein the operator determines the input instructions according to the type of the wafer.
Optionally, in an embodiment of the wafer positioning apparatus, the rotating platform module includes a θ axis rotating mechanism, a Y axis moving mechanism and an X axis moving mechanism, wherein the θ axis rotating mechanism is driven by the driving device to rotate the rotating platform module, and the Y axis moving mechanism and the X axis moving mechanism are driven by the driving device to move the wafer on a horizontal plane of the rotating platform module.
The invention provides a wafer positioning method, which comprises the following steps of starting a light source and an image capturing module, wherein the light source and the image capturing module are arranged opposite to each other and face the outer edge of a wafer borne by a rotating platform module and are positioned on the outer side of the rotating platform module, controlling a driving device to drive the rotating platform module to rotate at least 360 degrees by using a controller to drive the wafer borne by the rotating platform module to rotate at least 360 degrees, acquiring image data of the outer edge of the wafer by using an image capturing device, calculating the outline position of a positioning feature by using the controller according to the first derivative and the second derivative of the image data, and then performing iterative computation for a plurality of times according to the outline position by using a polynomial regression computation to calculate the precise position of the positioning feature, wherein the precise position is the precise angle of the positioning feature, using the controller to exclude the positioning feature of the precise position in the image data, finding a corresponding wafer according to the image data excluding the positioning feature, calculating a correction angle by using the controller according to the precise position of the positioning feature and the center offset of the wafer, and correcting the center offset of the wafer by using the controller to calculate the correction angle of the wafer by using the controller and the center offset of the rotating platform module to the rotating device and the driving device to enable the wafer to be corrected by using the rotating platform to move to the rotating platform module to move to the control module to the direction by using the driving device to the correction device and the center offset to the wafer to be aligned with the wafer to the rotating platform to the designated rotating module.
Optionally, in an embodiment of the above wafer positioning method, the wafer is a non-transparent silicon wafer or a semitransparent wafer, and the positioning feature of the wafer is a notch type positioning feature, a double flat edge type positioning feature or a single flat edge type positioning feature.
In summary, compared with the prior art, the wafer positioning device and method of the present invention can make the rotation number of the rotation platform smaller and support various types of wafers and various types of positioning features.
Drawings
FIG. 1 is a schematic view of a wafer positioning apparatus according to an embodiment of the invention.
Fig. 2 is a flow chart of a wafer positioning method according to an embodiment of the invention.
Fig. 3 is a detailed flowchart of the step of finding the positioning feature of the wafer and the step of calculating the precise position and the center offset of the wafer in the wafer positioning method according to the embodiment of the invention.
Fig. 4 is a schematic diagram of a correction angle of a wafer in the wafer positioning method according to an embodiment of the invention.
Fig. 5 is another schematic diagram of a correction angle of a wafer in the wafer positioning method according to the embodiment of the invention.
FIG. 6 is a schematic diagram of the middle X-Y correction of a wafer in a wafer positioning method according to an embodiment of the present invention.
FIG. 7 is a schematic diagram of an alternative X-Y correction of a wafer in a wafer positioning method according to an embodiment of the present invention.
Description of the figure:
1 wafer positioning device
11 Rotating platform Module
111 Theta axis rotation mechanism
112Y-axis moving mechanism
113X-axis moving mechanism
12 Light source
13 Image capturing apparatus
14 Controller
15 Drive device
S21-S27, S251-S256 steps
Theta correction angle
Angle of theta a、θe、θb
D triangle height
Center offset
Radius R
Θ O precise position
Θ t target angle
Θ n direction angle
WF is the wafer.
Detailed Description
Referring to fig. 1, fig. 1 is a schematic diagram of a wafer positioning apparatus according to an embodiment of the invention. The wafer positioning apparatus 1 includes a rotary stage module 11, a light source 12, an image capturing device 13, a controller 14 and a driving apparatus 15. The rotary stage module 11 includes a θ -axis rotation mechanism 111, a Y-axis movement mechanism 112, and an X-axis movement mechanism 113 in addition to a stage that is rotatable and that is used to carry the wafer WF. The controller 14 is electrically connected to the light source 12, the image capturing device 13 and the driving device 15, and the θ -axis rotating mechanism 111, the Y-axis moving mechanism 112 and the X-axis moving mechanism 113 are connected to the driving device 15.
The light source 12 is disposed below the outside of the rotary table module 11, the image capturing apparatus 13 is disposed above the outside of the rotary table module 11, and the light source 12 and the image capturing apparatus 13 are disposed corresponding to each other. When the wafer WF is placed on the rotary platform module 11, the light emitted by the light source 12 is directed to the outer edge of the wafer WF, and the image capturing device 13 captures the image data of the outer edge of the wafer WF. The light source 12 may be a laser diode or other directional light source, such as a directional light source formed by a light emitting diode and a convex lens. The image capturing device 13 may be a Charge Coupled Device (CCD) image capturing device or other type of image capturing device. In addition, the invention is not limited to the type of light source 12 and image capture device 13.
The controller 14 can rotate the θ -axis rotating mechanism 111 through controlling the driving device 15 (e.g., a driving motor or other type of actuator), so as to drive the platform of the rotating platform module 11 to rotate, so that the wafer WF carried by the rotating platform module 11 also rotates. The controller 14 may also move the wafer WF carried by the rotary stage module 11 in the stage horizontal plane (X-Y axis plane) by controlling the driving device 15 to move the Y-axis moving mechanism 112 and the X-axis moving mechanism 113. The Y-axis moving mechanism 112 and the X-axis moving mechanism 113 may be, for example, a mechanism for moving the stage and the wafer WF in a horizontal plane (X-Y axis plane), and the θ -axis rotating mechanism 111 may be a central rotating shaft provided below the stage and connected to the stage, but the implementation of the θ -axis rotating mechanism 111, the Y-axis moving mechanism 112, and the X-axis moving mechanism 113 is not limited by the present invention.
Furthermore, the controller 14 can also be used to set the intensity of the light source 12 and the sensitivity of the image capturing device 13. Thus, the wafer positioning apparatus 1 of the present invention can have a more accurate positioning accuracy for different types of wafers WF. It should be noted that, since the wafer positioning apparatus 1 of the present invention mainly calculates the accurate position of the positioning feature (i.e. the accurate angle of the positioning feature) of the wafer WF through the first derivative and the second derivative of the image data of the outer edge of the wafer in combination with the polynomial regression operation, the method of setting the intensity of the light source 12 and the sensitivity of the image capturing device 13 by the controller 14 is only used to further increase the positioning accuracy, and this method is not a necessary limitation of the present invention.
Referring to fig. 1 to 3, fig. 2 is a flow chart of a wafer positioning method according to an embodiment of the invention, and fig. 3 is a detailed flow chart of a step of searching for a wafer positioning feature and a step of calculating an accurate position and a center offset of the positioning feature of the wafer according to the embodiment of the invention. The controller 14 is typically a micro-controller unit capable of being written with firmware (but the invention is not limited thereto and may be implemented using pure hardware circuitry), and the wafer positioning method of the invention is mainly performed by the controller 14.
In step S21, the light source 12 and the image capturing device 13 are activated. The wafer positioning apparatus 1 of the present invention can support different types of wafers WF. The wafer WF may be a non-transparent silicon wafer made of a translucent special material, so that in order to improve the positioning accuracy, in step S21, the operator may also input a command to the controller 14 according to the type of the wafer WF, so as to set the intensity of the light source 12 and the sensitivity of the image capturing device 13. Next, in step S22, the jig will place the wafer WF on the stage of the rotating stage module 11, and at this time, the center of the wafer WF may deviate from the designated position (home position) of the rotating stage module 11, and the positioning feature is not turned to the designated angle when the next process is performed, so the positioning device 4 is required to detect the wafer WF to position the wafer WF.
In step S23, the controller 14 controls the driving device 15 to drive the θ -axis rotating mechanism 111 to rotate the stage of the rotary stage module 11 by 360 ° to 720 °, so that the image capturing apparatus 13 obtains the image data of the outer edge of the wafer WF in step S24. Next, in step S25, the controller 14 searches for the approximate position of the positioning feature of the wafer WF according to the obtained image data of the outer edge of the wafer WF, wherein the method of searching for the approximate position of the positioning feature of the wafer WF is to calculate the first derivative and the second derivative of the image data of the outer edge of the wafer WF to thereby exclude the center offset (i.e., the X-Y offset), and find the approximate position of the positioning feature of the outer edge of the wafer WF through the change rate of the first derivative and the second derivative, and then iterate for a plurality of iterations according to the approximate position to calculate the exact position of the positioning feature, wherein the exact position of the positioning feature is the angle of the positioning feature, wherein the positioning feature is not limited to the notch type positioning feature, but may be a single flat edge, a double flat edge or other type positioning feature. In step S25, the controller 14 excludes the positioning feature of the accurate position in the image data, and finds the center offset from the image data excluding the positioning feature.
Then, in step S26, the controller 14 calculates a correction angle of the wafer WF based on the accurate position of the positioning feature and the center offset, and calculates an X-Y correction amount based on the correction angle and the center offset. Finally, in step S27, the controller 14 corrects the offset of the wafer via the X-axis moving mechanism 113, the Y-axis moving mechanism 112, and the θ -axis rotating mechanism 111. Specifically, the controller 14 controls the driving device 15 to drive the θ -axis rotating mechanism 111 to rotate the stage according to the calculated correction angle of the wafer WF, thereby rotating the positioning feature of the wafer WF to a specified angle, and the controller 14 controls the driving device 15 to drive the Y-axis moving mechanism 112 and the X-axis moving mechanism 113 to move the wafer WF in the horizontal plane according to the calculated X-Y correction amount, thereby aligning the center of the wafer WF with the specified position of the stage.
In step S24, the controller 14 also checks whether the index of the image data is continuous or not, and checks the angle difference between the wafer WF before and after rotation. If the index of the image data is not continuous (because the image data may be missing if the rotation speed is too fast, so that inspection is required) or the angular difference between the wafer WF before and after rotation is less than 360 degrees (because of possible operational errors or other factors, the stage of the rotating stage module 11 does not rotate more than 360 degrees), steps S23 and S24 need to be performed again to retrieve the image data of the outer edge of the effective wafer WF.
Further, as shown in fig. 3, step S25 includes steps S251 to S256. In step S251, the controller 14 performs a moving average operation (moving average process) on the image data to filter out most of the noise in the image data. Note that step S251 is not necessary, but in many cases, step S251 is performed to increase positioning accuracy. Next, in step S252, the controller 14 calculates a first derivative and a second derivative of the image data. The first derivative of the image data is the slope function of the image data, where the slope function is 0, and possibly where the extremum occurs, i.e. where the locating feature is likely. The second derivative of the image data can be used to determine where the slope change is greatest, typically where the location of the locating feature occurs. In addition, before proceeding to step S252, the controller 14 may check whether the brightness setting of the light source 12, the sensitivity setting of the image capturing device 13, and the angle difference between the stage rotation are correct, so as to avoid performing unnecessary calculation.
In step S253, the controller 14 finds the maximum and minimum values of the first derivative of the image data. In step S253, the controller 14 also determines whether the rotation angles of the maximum value and the minimum value of the first derivative are similar, i.e. whether the difference between the two occurrence positions where the maximum value and the minimum value of the first derivative occur is smaller than a specific threshold. If the rotation angles of the maximum value and the minimum value of the first derivative are close, the subsequent operation is further performed. In step S253, the controller 14 also checks whether the maximum value and the minimum value of the image data are out of range, and if so, does not perform subsequent operations.
Then, in step S254, the controller 14 finds the approximate location of the positioning feature using the second derivative and the first derivative of the image data. Further, the maximum value and the minimum value of the first derivative found in advance may be the maximum variation position of the image data, so the range of searching for the positioning feature can be narrowed by using the occurrence positions of the maximum value and the minimum value of the first derivative. Briefly, the controller 14 uses the first derivative of the image data to narrow the range in which the locating feature is found, and then uses the second derivative of the image data to find the approximate location of the locating feature within the narrow range.
Next, in step S255, the controller 14 performs a plurality of iterative computations using polynomial regression operations according to the approximate position of the positioning feature to calculate the accurate position (including the angle of the positioning feature) of the positioning feature. Then, in step S256, the controller 14 excludes the portion of the positioning feature of the precise position in the image data, and finds the corresponding circle equation according to the image data excluding the positioning feature, so as to obtain the center offset of the wafer WF.
The polynomial regression operation in step S255 is explained as follows. The first derivative and the second derivative of the image data are used to calculate the approximate position θ coarse of the positioning feature, the difference Diff between the maximum value and the minimum value near the approximate position in the image data can be calculated, and when the positioning feature falls at the approximate position θ coarse, the approximate center offset D coarse between the center point of the wafer WF and the designated position (home position) is known, the image value ccd of the approximate position θ coarse of the positioning feature is also known, and the radius R of the wafer WF is also known, so the following expression is introduced:
ccd＝Diff+Dcoarse*cos(θO)-[R2-Dcoarse 2*sin2(θO)]1/2, And the exact position of the locating feature, θ O, is found. In the present invention, the number of iterations is 1000, but the present invention is not limited thereto. Then, after calculating the accurate position θ O of the positioning feature, the controller 14 can exclude the positioning feature of the accurate position in the image data, find the corresponding circle equation according to the image data excluding the positioning feature, and calculate the center offset D.
In the case where the accurate position θ O and the center shift amount D of the positioning feature are calculated, details of calculating the correction angle θ and the X-Y correction amount D x、Dy in step S26 are described below, and D x is the X-axis correction component of the correction amount D, and D y is the Y-axis correction component of the correction amount D. Referring to fig. 4 and 5, a radius R, a center offset D, a precise position θ O (precise angle) of the positioning feature, a radius R, a center offset D, a center offset of the wafer WF, Since the target angle θ t of the positioning feature and the direction angle θ n of the positioning feature are known compared with the horizontal axis of the center point of the wafer WF, θ a＝θO-θn、d＝D*sin(θa) and θ e＝θb＝sin-1 (d/R) can be calculated, and the correction angle θ=θ t-θn+θe can be calculated without considering the error caused by the notch type positioning feature. next, referring to fig. 6, the X-Y correction amounts D x＝D*cos(θ+θO) and D y＝D*sin(θ+θO) can be calculated according to the correction angle θ and the center offset. The calculations of fig. 4-6 are for notch type positioning features, but the invention is not limited to the type of positioning features. Referring to fig. 7, the correction angle θ and the X-Y correction D x、Dy of the single-sided type positioning feature are calculated in the same manner as the correction angle θ and the X-Y correction D x、Dy of the notch type positioning feature, but θ e is equal to 0, so the correction angle θ=θ t-θn.
In summary, the method for locating the locating feature of the wafer locating device and the method provided by the invention mainly uses the first derivative and the second derivative of the image data of the outer edge of the wafer to cooperate with polynomial regression operation, so that the rotating platform does not need to have more than two times of rotation, and the type of the wafer and the type of the locating feature are not limited. In other words, compared with the prior art, the wafer positioning device and method of the present invention can make the rotation number of the rotation platform smaller and can support various types of wafers and various types of positioning features.
Claims (10)
1. A wafer positioning apparatus, comprising:
A rotation stage module (11) for carrying a Wafer (WF) and for rotating to rotate the Wafer (WF);
a light source (12) disposed outside the rotary stage module (11) for emitting a light to illuminate an outer edge of the Wafer (WF);
an image capturing device (13) disposed on the outer side of the rotary platform module (11) and facing the light source (12) for acquiring image data of the outer edge of the Wafer (WF);
A controller (14) electrically connected to the light source (12) and the image capturing device (13) for receiving the image data, calculating an accurate position of a positioning feature of the outer edge of the Wafer (WF) through a first derivative and a second derivative of the image data and a polynomial regression operation, calculating a center offset of the Wafer (WF) according to the image data excluding the positioning feature after excluding the positioning feature, and calculating a correction angle according to the accurate position and the center offset of the positioning feature, and calculating an X-Y correction according to the center offset and the correction angle, and
The driving device (15) is electrically connected with the controller (14) and the rotating platform module (11), wherein the controller (14) controls the driving device (15) to drive the rotating platform module (11) to rotate according to the correction angle so as to enable the positioning feature to rotate to a designated angle, and the controller (14) controls the driving device (15) to drive the rotating platform module (11) according to the X-Y correction amount so as to enable the Wafer (WF) to move on a horizontal plane of the rotating platform module (11) so as to enable a circle center of the Wafer (WF) to be aligned with a designated position of the rotating platform module (11).
2. The wafer positioning apparatus of claim 1, wherein the controller (14) calculates a schematic position of the positioning feature based on the first derivative and the second derivative of the image data, and then performs iterative computations based on the schematic position using the polynomial regression operation to calculate a precise position of the positioning feature, wherein the precise position is a precise angle of the positioning feature.
3. The wafer positioning apparatus of claim 2, wherein the controller (14) finds a corresponding wafer equation based on the exclusion of the positioning feature of the precise angle in the image data and based on the image data excluding the positioning feature, thereby the center offset.
4. The wafer positioning apparatus of claim 1, wherein the Wafer (WF) is a non-transparent silicon wafer or a semi-transparent wafer.
5. The wafer positioning apparatus of claim 1, wherein the positioning feature of the Wafer (WF) is a notch-type positioning feature, a double flat-side type positioning feature, or a single flat-side type positioning feature.
6. The wafer positioning apparatus according to claim 1, wherein the controller (14) controls the driving device (15) to drive the rotation platform module (11) to rotate at least 360 degrees, and the image data captured by the image capturing device (13) is image data of the outer edge of the Wafer (WF) rotated at least 360 degrees.
7. The wafer positioning apparatus according to claim 1, wherein the controller (14) sets a brightness of the light source (12) and a sensitivity of the image capturing device (13) according to a command input by an operator, wherein the operator decides the input command according to a type of the Wafer (WF).
8. The wafer positioning apparatus of claim 1, wherein the rotary stage module (11) includes a θ -axis rotation mechanism (111), a Y-axis movement mechanism (112), and an X-axis movement mechanism (113), wherein the θ -axis rotation mechanism (111) is configured to be driven by the driving device (15) to rotate the rotary stage module (11), and the Y-axis movement mechanism (112) and the X-axis movement mechanism (113) are configured to be driven by the driving device (15) to move the Wafer (WF) in the horizontal plane of the rotary stage module (11).
9. A wafer positioning method, comprising:
Starting a light source (12) and an image capturing module (13), wherein the light source (12) and the image capturing module (13) are arranged opposite to each other and face an outer edge of a Wafer (WF) carried by the rotary platform module (11) and are positioned at an outer side of the rotary platform module (11);
A controller (14) is used for controlling a driving device (15) to drive the rotary platform module (11) to rotate at least 360 degrees so as to drive the Wafer (WF) carried by the rotary platform module (11) to rotate at least 360 degrees;
acquiring image data of the outer edge of the Wafer (WF) by using the image capturing device (13);
calculating a schematic position of a positioning feature according to a first derivative and a second derivative of the image data by using the controller (14), and then performing iterative calculation for a plurality of times by using a polynomial regression operation according to the schematic position to calculate an accurate position of the positioning feature, wherein the accurate position is an accurate angle of the positioning feature;
removing the positioning feature of the precise angle in the image data by using the controller (14), and finding a corresponding wafer equation according to the image data from which the positioning feature is removed, so as to obtain a center offset of the Wafer (WF);
Calculating a correction angle based on the accurate position of the positioning feature and the center offset using the controller (14), and calculating an X-Y correction amount based on the correction angle and the center offset, and
The controller (14) is used for controlling the driving device (15) to drive the rotary platform module (11) to rotate according to the correction angle so as to enable the positioning feature to rotate to a designated angle, and the controller (14) is used for controlling the driving device (15) to drive the rotary platform module (11) according to the X-Y correction amount so as to enable the Wafer (WF) to move on a horizontal plane of the rotary platform module (11) so as to enable a circle center of the Wafer (WF) to be aligned with a designated position of the rotary platform module (11).
10. The wafer positioning method of claim 9, wherein the Wafer (WF) is a non-transparent silicon wafer or a semi-transparent material wafer, and the positioning feature of the Wafer (WF) is a notch type positioning feature, a double flat edge type positioning feature or a single flat edge type positioning feature.
Priority Applications (1)
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| US20150243018A1 (en) * | 2014-02-25 | 2015-08-27 | Kla-Tencor Corporation | Automated inline inspection and metrology using shadow-gram images |
| US20170018446A1 (en) * | 2015-07-13 | 2017-01-19 | Brooks Automation, Inc. | On the fly automatic wafer centering method and apparatus |
| CN113725108A (en) * | 2021-08-06 | 2021-11-30 | 广东工业大学 | Drift positioning measurement method and device for large-board fan-out type packaged chip |
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| US6868175B1 (en) * | 1999-08-26 | 2005-03-15 | Nanogeometry Research | Pattern inspection apparatus, pattern inspection method, and recording medium |
| US6836690B1 (en) * | 2002-07-19 | 2004-12-28 | Nanometrics Incorporated | High precision substrate prealigner |
| US20150243018A1 (en) * | 2014-02-25 | 2015-08-27 | Kla-Tencor Corporation | Automated inline inspection and metrology using shadow-gram images |
| US20170018446A1 (en) * | 2015-07-13 | 2017-01-19 | Brooks Automation, Inc. | On the fly automatic wafer centering method and apparatus |
| CN113725108A (en) * | 2021-08-06 | 2021-11-30 | 广东工业大学 | Drift positioning measurement method and device for large-board fan-out type packaged chip |
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