Disclosure of Invention
The invention provides an optical image processing system and method based on terahertz diffraction, which can solve the technical problems of higher system complexity and cost and larger volume and power consumption caused by optical-electric-optical conversion of an optical diffraction network model in optical image processing in the prior art.
According to an aspect of the present invention, there is provided an optical image processing system based on terahertz diffraction, the system comprising:
A terahertz source for emitting terahertz waves;
the terahertz lens is used for transmitting terahertz waves to the terahertz modulation diffraction plate;
an optical imaging device for imaging an object to be imaged onto a terahertz modulation diffraction plate;
the terahertz modulation diffraction plate is used for modulating and diffracting the transmitted terahertz waves according to the target imaging light field to obtain n Shu Tai hertz waves with unequal powers;
The terahertz detection device is used for respectively converting n beams of terahertz waves into n electrical signals and is also used for realizing identification and classification of targets to be imaged according to the n electrical signals.
Preferably, the center of the terahertz source, the terahertz lens and the terahertz modulation diffraction plate are located on the same optical axis.
Preferably, the terahertz modulation diffraction plate comprises a modulation plate, a first diffraction plate and a second diffraction plate which are sequentially arranged at intervals along the terahertz wave optical path direction, wherein the modulation plate is used for modulating the transmitted terahertz wave according to the target imaging optical field, the first diffraction plate is used for carrying out primary diffraction on the modulated terahertz wave, and the second diffraction plate is used for carrying out secondary diffraction on the terahertz wave after primary diffraction to obtain n Shu Tai Hz waves with unequal powers.
Preferably, the centers of the modulation plate, the first diffraction plate and the second diffraction plate are located on the same optical axis.
Preferably, the modulating plate adopts a semiconductor silicon chip for visible light imaging and adopts a semiconductor tellurium-cadmium-mercury material for infrared light imaging.
Preferably, the first diffraction plate has a specific thickness pattern thereon, and the second diffraction plate has a specific thickness pattern thereon.
Preferably, the first diffraction plate and the second diffraction plate are both made of plastic materials.
Preferably, the terahertz detection device comprises n terahertz detectors and a processing unit, the n terahertz detectors are in one-to-one correspondence with the n terahertz waves, each terahertz detector is used for converting one terahertz wave into one electric signal, and the processing unit is used for realizing identification and classification of the target to be imaged according to the n electric signals.
Preferably, the center of each terahertz detector is respectively coincident with the optical axis of the corresponding terahertz wave.
Preferably, the light spot of the terahertz wave completely covers the light spot of the object to be imaged.
Preferably, the terahertz source adopts a terahertz source based on electronic frequency multiplication.
Preferably, the terahertz lens adopts a plano-convex or biconvex structure.
According to another aspect of the present invention, there is provided an optical image processing method based on terahertz diffraction, the method performing image processing using any one of the systems described above, the method comprising:
The terahertz source emits terahertz waves;
the terahertz lens transmits terahertz waves to the terahertz modulation diffraction plate;
the optical imaging device images an object to be imaged on the terahertz modulation diffraction plate;
the terahertz modulation diffraction plate modulates and diffracts the transmitted terahertz waves according to the target imaging light field to obtain n Shu Tai hertz waves with unequal powers;
the terahertz detection device converts n beams of terahertz waves into n electrical signals respectively, and realizes identification and classification of the target to be imaged according to the n electrical signals.
According to the technical scheme, according to the optical diffraction principle, the terahertz modulation principle and the artificial neural network mechanism, the target to be imaged is directly modulated on terahertz waves and is split through the diffraction plate, so that the diffracted terahertz waves are converged at different positions, full-optical operation of image classification processing is realized, the complexity, cost, volume and power consumption of the system are greatly reduced while the identification accuracy of the system is maintained, and the overall performance of the system is improved.
Detailed Description
It should be noted that, without conflict, the embodiments of the present application and features of the embodiments may be combined with each other. The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. The following description of at least one exemplary embodiment is merely exemplary in nature and is in no way intended to limit the application, its application, or uses. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.
The relative arrangement of the components and steps, numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless it is specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective parts shown in the drawings are not drawn in actual scale for convenience of description. Techniques, methods, and apparatus known to one of ordinary skill in the relevant art may not be discussed in detail, but should be considered part of the specification where appropriate. In all examples shown and discussed herein, any specific values should be construed as merely illustrative, and not a limitation. Thus, other examples of the exemplary embodiments may have different values. It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further discussion thereof is necessary in subsequent figures.
As shown in fig. 1, the present invention provides an optical image processing system based on terahertz diffraction, the system comprising:
a terahertz source 1 for emitting terahertz waves;
A terahertz lens 2 for transmitting terahertz waves onto a terahertz modulation diffraction plate 3;
An optical imaging device 4 for imaging an object to be imaged onto the terahertz modulation diffraction plate 3;
The terahertz modulation diffraction plate 3 is used for modulating and diffracting the transmitted terahertz waves according to the target imaging light field to obtain n Shu Tai hertz waves with unequal powers;
The terahertz detection device 5 is used for respectively converting n beams of terahertz waves into n electrical signals and is also used for realizing identification and classification of targets to be imaged according to the n electrical signals.
According to the invention, the object to be imaged is directly modulated onto the terahertz waves according to the optical diffraction principle, the terahertz modulation principle and the artificial neural network mechanism, and the diffracted terahertz waves are converged at different positions by the diffraction plate, so that the full-light operation of image classification processing is realized, the complexity, the cost, the volume and the power consumption of the system are greatly reduced while the identification accuracy of the system is maintained, and the overall performance of the system is improved.
In the invention, the center of the terahertz source 1, the terahertz lens 2 and the terahertz modulation diffraction plate 3 are positioned on the same optical axis.
According to one embodiment of the invention, the terahertz modulation diffraction plate 3 comprises a modulation plate 3-1, a first diffraction plate 3-2 and a second diffraction plate 3-3 which are sequentially arranged at intervals along the terahertz wave optical path direction, at the moment, an object to be imaged is imaged on the surface of the modulation plate 3-1, terahertz waves are irradiated on the surface of the modulation plate 3-1 through a terahertz lens 2, the modulation plate 3-1 is used for modulating transmitted terahertz waves according to an imaging optical field of the object, the first diffraction plate 3-2 is used for performing primary diffraction on the modulated terahertz waves, the first diffraction plate 3-2 is provided with a specific thickness pattern, the thickness pattern is obtained through training, the terahertz waves after primary diffraction are transmitted for a certain distance in a free space, then are incident on the second diffraction plate 3-3, the second diffraction plate 3-3 is used for performing secondary diffraction on the terahertz waves after primary diffraction, and n Shu Tai waves with different powers are obtained, the second diffraction plate 3-3 is provided with a specific thickness pattern, and the first diffraction plate 3-2 is located on the same optical axis, the first diffraction plate 3-3 and the second diffraction plate 3-3 is located on the same optical axis.
Specifically, the modulation board 3-1 adopts a semiconductor silicon chip for visible light imaging and adopts a semiconductor tellurium-cadmium-mercury material for infrared light imaging. The modulation principle of the modulation plate 3-1 is that when the modulation plate 3-1 is irradiated by a target imaging light field, valence electrons of semiconductor materials in corresponding illumination areas are excited to conduction bands to become photogenerated carriers, so that corresponding areas are converted from an insulating state to a metal state, and the semiconductor materials in the metal state reduce the transmittance of the corresponding areas to terahertz waves. When the modulation plate 3-1 is irradiated by the target imaging light field, the concentrations of photo-generated carriers generated at different light intensities are different, and the terahertz transmittance is also different. The space modulation of the terahertz wave by the target imaging light field is realized through the modulation plate 3-1.
Specifically, the first diffraction plate 3-2 and the second diffraction plate 3-3 are made of plastic materials. The first diffraction plate 3-2 and the second diffraction plate 3-3 have similar structures, as shown in fig. 2, and may be divided into n×m regions, each region (i, j) has the same thickness d i,j therein, and the thicknesses of the different regions are different, so that the terahertz wave phase transmitted through each region is modulated by the different thickness d i,j. Any point (area) on the diffraction plate can be regarded as a secondary wave source according to the Huygens principle, and the wave front after the terahertz wave transmits the diffraction plate is the envelope surface of the wave emitted by the secondary wave sources. The terahertz waves modulated by the modulation plate 3-1 are converged at different positions after being diffracted by the first diffraction plate 3-2 and the second diffraction plate 3-3, wherein the number n of the converged positions is set to be larger than the number of the types of the target images to be imaged.
According to one embodiment of the present invention, the terahertz detection apparatus 5 includes n terahertz detectors, where the n terahertz detectors are in one-to-one correspondence with the n terahertz waves, each of the terahertz detectors is configured to convert one of the terahertz waves into one electrical signal, and a processing unit configured to implement identification and classification of the object to be imaged according to the n electrical signals.
Specifically, the n terahertz detectors may be terahertz detectors at normal temperature, such as Gao Lai detectors, and one terahertz detector is placed at each possible terahertz convergence position behind the diffraction plate to detect the terahertz waves at the position, and finally image recognition is realized according to the detection result.
According to an embodiment of the present invention, the center of each terahertz detector coincides with the optical axis of the corresponding terahertz wave, respectively.
According to one embodiment of the invention, the light spot of the terahertz wave completely covers the light spot of the object to be imaged. The imaging is centered on the modulation panel 3-1 by setting the system parameters of the optical imaging device 4, wherein the optical imaging device 4 employs existing mature devices.
According to one embodiment of the invention, the terahertz source 1 adopts a terahertz source 1 based on electronic frequency multiplication. The frequency of the terahertz source 1 based on the electronic frequency multiplication can be selected to be 0.3THz-1THz so as to have better monochromaticity and certain power.
According to an embodiment of the present invention, the terahertz lens 2 is used for adjusting the divergence angle of the terahertz wave, and the terahertz lens 2 adopts a plano-convex or biconvex structure, so that the terahertz wave is irradiated onto the modulation plate 3-1 at a smaller emission angle.
The invention also provides an optical image processing method based on terahertz diffraction, which adopts any one of the systems to process images, and comprises the following steps:
The terahertz source 1 emits terahertz waves;
the terahertz lens 2 transmits terahertz waves to the terahertz modulation diffraction plate 3;
the optical imaging device 4 images an object to be imaged on the terahertz modulation diffraction plate 3;
The terahertz modulation diffraction plate 3 modulates and diffracts the transmitted terahertz waves according to the target imaging light field to obtain n Shu Tai hertz waves with unequal powers;
the terahertz detection device 5 converts n beams of terahertz waves into n electrical signals respectively, and realizes identification and classification of the target to be imaged according to the n electrical signals.
In summary, the invention provides an optical image processing system and method based on terahertz diffraction, which directly modulates an object to be imaged onto terahertz waves according to an optical diffraction principle, a terahertz modulation principle and an artificial neural network mechanism, and splits the beams through a diffraction plate, so that the diffracted terahertz waves are converged at different positions, full-optical operation of image classification processing is realized, the complexity, cost, volume and power consumption of the system are greatly reduced while the identification accuracy of the system is maintained, and the overall performance of the system is improved.
The invention is not described in detail in a manner known to those skilled in the art.
In the description of the present invention, it should be understood that the azimuth or positional relationships indicated by the azimuth terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal", and "top, bottom", etc., are generally based on the azimuth or positional relationships shown in the drawings, and are merely for convenience of describing the present invention and simplifying the description, and these azimuth terms do not indicate and imply that the apparatus or elements referred to must have a specific azimuth or be constructed and operated in a specific azimuth, and thus should not be construed as limiting the scope of the present invention, and the azimuth terms "inside and outside" refer to inside and outside with respect to the outline of each component itself.
Spatially relative terms, such as "above," "upper" and "upper surface," "above" and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations in use or operation in addition to the orientation depicted in the figures. For example, if the device in the figures is turned over, elements described as "above" or "over" other devices or structures would then be oriented "below" or "beneath" the other devices or structures. Thus, the process is carried out, the exemplary term "above" may be included. Upper and lower. Two orientations below. The device may also be positioned in other different ways (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
In addition, the terms "first", "second", etc. are used to define the components, and are only for convenience of distinguishing the corresponding components, and the terms have no special meaning unless otherwise stated, and therefore should not be construed as limiting the scope of the present invention.
The above description is only of the preferred embodiments of the present invention and is not intended to limit the present invention, but various modifications and variations can be made to the present invention by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.