CN119677072B - Radiator with micro needle column - Google Patents
Radiator with micro needle column Download PDFInfo
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- CN119677072B CN119677072B CN202510193639.4A CN202510193639A CN119677072B CN 119677072 B CN119677072 B CN 119677072B CN 202510193639 A CN202510193639 A CN 202510193639A CN 119677072 B CN119677072 B CN 119677072B
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Abstract
本发明公开了一种具有微针柱的散热器包括至少一导热板及复数个微针柱。导热板具有相背对的第一表面与第二表面。导热板的第一表面与复数个微针柱连接，导热板的第二表面用以与热源连接。导热板形成有小晶粒正常区及位于小晶粒正常区之中的复数个大晶粒导热通道，且每个大晶粒导热通道由导热板的第二表面形成至导热板的第一表面，并与每个对应的微针柱形成连接。该散热器在导热板上设置大晶粒导热通道并且与微针柱连接，大晶粒导热通道相对于小晶粒正常区具有更好的导热效果，微针柱导热热阻低且能提供更大的散热面积进行散热，这样就能将热源的热量快速带走，从而起到更好的散热效果。
The present invention discloses a heat sink with microneedle columns, including at least one heat conducting plate and a plurality of microneedle columns. The heat conducting plate has a first surface and a second surface facing each other. The first surface of the heat conducting plate is connected to a plurality of microneedle columns, and the second surface of the heat conducting plate is used to connect to a heat source. The heat conducting plate is formed with a normal area for small grains and a plurality of large grain heat conducting channels located in the normal area for small grains, and each large grain heat conducting channel is formed from the second surface of the heat conducting plate to the first surface of the heat conducting plate, and is connected to each corresponding microneedle column. The heat sink is provided with a large grain heat conducting channel on the heat conducting plate and is connected to the microneedle columns. The large grain heat conducting channel has a better heat conducting effect than the normal area for small grains. The microneedle columns have a low thermal resistance and can provide a larger heat dissipation area for heat dissipation, so that the heat of the heat source can be quickly taken away, thereby achieving a better heat dissipation effect.
Description
Technical Field
The present invention relates to a heat sink, and more particularly, to a heat sink with micro-needle posts.
Background
The requirements on the radiator in the market are higher and higher at present, especially on the heat radiation performance, so that the radiator at present often cannot meet the requirements.
Disclosure of Invention
The invention aims to solve the technical problem of providing a radiator with micro-needle columns aiming at the defects of the prior art.
An embodiment of the invention provides a heat radiator with micro-needle posts, which comprises at least one heat conducting plate and a plurality of micro-needle posts, wherein the at least one heat conducting plate is provided with a first surface and a second surface which are opposite to each other, the first surface of the at least one heat conducting plate is connected with the plurality of micro-needle posts, the second surface of the at least one heat conducting plate is used for being connected with a heat source, the at least one heat conducting plate is provided with a small-grain normal region and a plurality of large-grain heat conducting channels positioned in the small-grain normal region, the average grain size of the large-grain heat conducting channels is larger than the average grain size of the small-grain normal region, and each large-grain heat conducting channel is formed from the second surface of the at least one heat conducting plate to the first surface of the at least one heat conducting plate and is connected with each corresponding micro-needle post
In a preferred embodiment, the cross section of each of the plurality of micro-needle pillars is at least one of round, oval, square, diamond, and drop, and the distance between the two farthest end points on the cross section of each of the plurality of micro-needle pillars is less than 0.5mm.
In a preferred embodiment, the height of the microneedle pillars is greater than 3mm.
In a preferred embodiment, the microneedle pillars are made of copper, copper alloy, aluminum alloy, or copper-aluminum composite.
In a preferred embodiment, the thickness of the thermally conductive plate is less than 0.5mm.
In a preferred embodiment, the thermally conductive plate is made of copper, copper alloy, aluminum alloy, or copper aluminum composite.
In a preferred embodiment, the large-grain heat conduction channel is a non-uniform cross-sectional area channel, and the large-grain heat conduction channel is formed with a maximum cross-sectional area portion at the second surface position of the heat conduction plate.
In a preferred embodiment, the large-grain heat conduction path is laser melted or resistance welded to form a structure that resolidifies after melting.
In a preferred embodiment, there are at least two or more of said thermally conductive plates, each of said thermally conductive plates having a first surface connected to said plurality of microneedle pillars.
The heat radiator has the advantages that the large-grain heat conduction channel is arranged on the heat conduction plate and is connected with the micro-needle column, the large-grain heat conduction channel has better heat conduction effect relative to a small-grain normal area, the micro-needle column has low heat conduction thermal resistance and can provide larger heat dissipation area for heat dissipation, so that heat of a heat source can be taken away rapidly, and better heat dissipation effect is achieved.
For a further understanding of the nature and the technical aspects of the present invention, reference should be made to the following detailed description of the invention and to the accompanying drawings, which are provided for purposes of reference only and are not intended to limit the invention.
Drawings
Fig. 1 is a schematic side view of a first embodiment of a heat sink having micro-needle posts.
FIG. 2 is the illustration of FIG. 1An enlarged schematic view of a portion.
FIG. 3 is the illustration of FIG. 1An enlarged schematic view of a portion.
FIG. 4 is a schematic diagram of one embodiment of a microneedle column.
FIG. 5 is a schematic diagram of one embodiment of a microneedle column.
FIG. 6 is a schematic diagram of one embodiment of a microneedle column.
FIG. 7 is a schematic diagram of one embodiment of a microneedle column.
FIG. 8 is a schematic diagram of one embodiment of a microneedle column.
Fig. 9 is a schematic side view of a second embodiment of a heat sink with micro-needle posts.
Fig. 10 is a schematic side view of a third embodiment of a heat sink having micro-needle posts.
Fig. 11 is a schematic side view of a fourth embodiment of a heat sink having micro-needle posts.
Detailed Description
The following description of the embodiments of the present invention is provided with reference to specific examples, and those skilled in the art will appreciate the advantages and effects of the present invention from the disclosure herein. The invention is capable of other and different embodiments and its several details are capable of modification and variation in various respects, all from the point of view and application, all without departing from the spirit of the present invention. The drawings of the present invention are merely schematic illustrations, and are not intended to be drawn to actual dimensions. Also, the same or similar parts in the drawings are denoted by the same reference numerals. The following embodiments will further illustrate the related art content of the present invention in detail, but the disclosure is not intended to limit the scope of the present invention. In addition, the term "or" as used herein shall include any one or combination of more of the associated listed items as the case may be.
First embodiment
Referring to fig. 1 to 8, a first embodiment of the present invention provides a heat sink with micro-needle pillars. The heat sink with micro-pins according to the present invention includes a heat conducting plate 10 and a plurality of micro-pins 20.
In this embodiment, the heat conducting plate 10 is a metal heat conducting plate, and may be made of copper, copper alloy, aluminum alloy, or copper-aluminum composite material, so that the heat conducting plate 10 is a bottom plate with high heat conductivity. Further, the thickness of the heat conducting plate 10 is less than 0.5mm, so that the heat conducting plate 10 is a very thin and highly heat conductive bottom plate.
Furthermore, the heat conducting plate 10 has a first surface 11 and a second surface 12 opposite to each other. The first surface 11 of the heat conducting plate 10 is connected to a plurality of micro-needle pillars 20, and the second surface 12 of the heat conducting plate 10 is used for contacting with a heat source 900 (e.g. a power chip).
In this embodiment, the plurality of micro-pillars 20 may be integrally connected with the first surface 11 of the heat conductive plate 10, and the micro-pillars 20 may be made of copper, copper alloy, aluminum alloy, or copper-aluminum composite material, so that the micro-pillars 20 are pillars with high thermal conductivity. Further, the cross section of the microneedle cartridge 20 may be circular (as shown in fig. 4), elliptical (as shown in fig. 5), square (as shown in fig. 6), diamond (as shown in fig. 7), or drop-shaped (as shown in fig. 8). And, the distance between the farthest two end points a, B on the cross section of the microneedle column 20 needs to be less than 0.5mm to meet the requirement of microneedle, as illustrated in fig. 5 and 7, regardless of any one or more of the shapes of the cross section of the microneedle column 20. Alternatively, the height of the microneedle pillars 20 may be greater than 3mm and up to 6mm, so that the microneedle pillars 20 are high needle-like heat dissipation pillars.
In order to increase the thermal conductivity of the thermal conductive plate 10, the thermal conductive plate 10 of the present embodiment is formed with a small-grain normal region 101 and a plurality of large-grain thermal conductive channels 102 located in the small-grain normal region 101, wherein the grains are irregularly shaped crystals formed after metal crystallization, and the average size of the grains 1020 (as illustrated in fig. 3) of the large-grain thermal conductive channels 102 is larger than the average size of the grains 1010 (as illustrated in fig. 2) of the small-grain normal region 101. And, each large-grain heat conduction path 102 is formed from the second surface 12 of the heat conduction plate 10 to the first surface 11 of the heat conduction plate 10, and forms a connection with each corresponding microneedle column 20. In this way, the small-grain normal region 101 and the plurality of large-grain heat conduction channels 102 are formed through the heat conduction plate 10, and each large-grain heat conduction channel 102 is formed from the second surface 12 of the heat conduction plate 10 to the first surface 11 and is connected with each corresponding micro-needle column 20, so that the heat source 900 located on the second surface 12 of the heat conduction plate 10 can conduct high heat to the micro-needle column 20 located on the first surface 11 of the heat conduction plate 10 through the large-grain heat conduction channel 102, thereby carrying away the high heat.
Further, the large-grain heat conduction channel 102 in the present embodiment is a non-uniform cross-sectional area channel, and the large-grain heat conduction channel 102 is formed with a maximum cross-sectional area portion 1021 at the second surface 12 of the heat conduction plate 10, that is, a maximum contact area with the heat source 900 is formed at the second surface 12 of the heat conduction plate 10 in comparison with a minimum cross-sectional area portion 1022 formed at the first surface 11 of the heat conduction plate 10, so that the heat source 900 located at the second surface 12 of the heat conduction plate 10 can better conduct high heat to the micro needle pillars 20 located at the first surface 11 of the heat conduction plate 10 through the large-grain heat conduction channel 102, thereby carrying away the high heat.
Furthermore, the large-grain heat conduction path 102 and the small-grain normal region 101 of the heat conduction plate 10 are made of homogeneous materials, so that the heat conduction plate 10 has material continuity, and no heterogeneous material interface exists between the large-grain heat conduction path 102 and the small-grain normal region 101 of the heat conduction plate 10, so that the thermal interface resistance is not generated to affect the overall heat conduction.
Furthermore, in order to better form the large-grain heat conduction path 102 in the heat conduction plate 10, the large-grain heat conduction path 102 of the present embodiment may be a structure formed by laser processing. Further, the large-grain heat conduction channel 102 of the present embodiment is a structure that is melted and then solidified by laser melting, and can be said to be a solid channel structure that is melted and then solidified by laser melting. In addition, the large-grain heat conduction path 102 of the present embodiment may be a solid path structure formed by electric resistance welding and solidified after melting.
Second embodiment
Please refer to fig. 9, which is a second embodiment of the present invention, the present invention is substantially the same as the first embodiment, and the differences are described below.
The heat sink with micro-needle pillars provided in this embodiment includes two heat conductive plates 10. And, the first surface 11 of each heat conductive plate 10 is connected to a plurality of micro-needle pillars 20. Further, the first surface 11 of one heat conducting plate 10 is connected to the lower ends of the plurality of micro-needle pillars 20, and the first surface 11 of the other heat conducting plate 10 is connected to the upper ends of the plurality of micro-needle pillars 20. And, the second surface 12 of one heat conductive plate 10 is connected with one heat source 900, and the second surface 12 of the other heat conductive plate 10 is connected with the other heat source 900, so that the two heat sources 900 can respectively conduct high heat to the micro needle columns 20 through the two heat conductive plates 10, thereby carrying away the high heat.
Third embodiment
Referring to fig. 10, a third embodiment of the present invention is shown, and the difference between the present embodiment and the second embodiment is as follows.
The heat sink with micro-pins provided in this embodiment includes two heat conductive plates 10, wherein the first surface 11 of one heat conductive plate 10 is connected to the lower ends of the plurality of micro-pins 20, and the first surface 11 of the other heat conductive plate 10 is connected to the upper ends of the plurality of micro-pins 20. And, the second surface 12 of one heat conducting plate 10 is connected with one heat source 900, and the second surface 12 of the other heat conducting plate 10 is not connected with any heat source, so as to simply improve the heat dissipation capability.
Fourth embodiment
Please refer to fig. 11, which illustrates a fourth embodiment of the present invention, the present invention is substantially the same as the second embodiment, and the differences are described below.
The heat sink with micro-pins provided in this embodiment includes three heat conductive plates 10, wherein the first surface 11 of one heat conductive plate 10 is connected to the lower ends of the plurality of micro-pins 20, and the first surfaces 11 of the other two heat conductive plates 10 are connected to the upper ends of the plurality of micro-pins 20. And, the second surface 12 of one heat conducting plate 10 is connected with one heat source 900, and the second surfaces 12 of the other two heat conducting plates 10 are respectively connected with the other two heat sources 900, so that heat conduction can be well conducted to three heat sources 900 at the same time, and the three heat sources 900 can respectively conduct high heat to the micro-needle columns 20 through the three heat conducting plates 10, so that the high heat is taken away.
In view of the above, the heat sink with micro-needle pillars provided by the present invention includes a heat conductive plate 10 and a plurality of micro-needle pillars 20. The heat-conducting plate 10 has a first surface 11 and a second surface 12 opposite to each other. The first surface 11 of the heat conducting plate 10 is connected to the plurality of micro-needle pillars 20, and the second surface 12 of the heat conducting plate 10 is connected to the heat source 900. The heat conductive plate 10 is formed with a small-grain normal region 101 and a plurality of large-grain heat conductive channels 102 located in the small-grain normal region 101, and each large-grain heat conductive channel 102 is formed from the second surface 12 of the heat conductive plate 10 to the first surface 11 of the heat conductive plate 10 and is connected with each corresponding micro-needle pillar 20. In this way, the small-grain normal region 101 and the plurality of large-grain heat conduction channels 102 are formed through the heat conduction plate 10, and each large-grain heat conduction channel 102 is formed from the second surface 12 of the heat conduction plate 10 to the first surface 11 and is connected with each corresponding micro-needle column 20, so that the heat source 900 located on the second surface 12 of the heat conduction plate 10 can conduct high heat to the micro-needle column 20 located on the first surface 11 of the heat conduction plate 10 through the large-grain heat conduction channel 102, thereby carrying away the high heat.
The above disclosure is only a preferred embodiment of the present invention and is not intended to limit the scope of the present invention, so that all equivalent technical changes made by the specification and drawings of the present invention are included in the scope of the present invention.
Claims (8)
1. A radiator with micro-needle columns is characterized by comprising at least one heat conducting plate and a plurality of micro-needle columns, wherein the at least one heat conducting plate is provided with a first surface and a second surface which are opposite to each other, the first surface of the at least one heat conducting plate is connected with the micro-needle columns, the second surface of the at least one heat conducting plate is used for being connected with a heat source, a small-grain normal area and a plurality of large-grain heat conducting channels positioned in the small-grain normal area are formed on the at least one heat conducting plate, the average grain size of the large-grain heat conducting channels is larger than the average grain size of the small-grain normal area, each large-grain heat conducting channel is formed from the second surface of the at least one heat conducting plate to the first surface of the at least one heat conducting plate, and is connected with each corresponding micro-needle column, and the large-grain heat conducting channels are non-uniform-section area channels and have maximum section area parts at the second surface positions of the heat conducting plate.
2. The heat sink with micro-needle pillars according to claim 1, wherein the cross section of the plurality of micro-needle pillars is at least one of round, oval, square, diamond, and drop-shaped, and the distance between the two farthest end points on the cross section of each micro-needle pillar is less than 0.5mm.
3. The heat sink with micro-needle pillars of claim 1, wherein the height of the micro-needle pillars is greater than 3mm.
4. The heat sink with micro-needle pillars of claim 1, wherein the micro-needle pillars are made of copper, copper alloy, aluminum alloy, or copper-aluminum composite material.
5. The heat sink with micro-needle pillars of claim 1, wherein the thickness of the thermally conductive plate is less than 0.5mm.
6. The heat sink with micro-needle pillars of claim 1, wherein the thermally conductive plate is made of copper, copper alloy, aluminum alloy, or copper-aluminum composite.
7. The heat spreader with micro-needle pillars of claim 1, wherein the large-grain thermally conductive vias are laser melted or resistance welded to form a post-melting resolidified structure.
8. The heat sink with micro-needle pillars of claim 1, wherein there are at least more than two of the thermally conductive plates, each of the thermally conductive plates having a first surface connected to the plurality of micro-needle pillars.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202510193639.4A CN119677072B (en) | 2025-02-21 | 2025-02-21 | Radiator with micro needle column |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202510193639.4A CN119677072B (en) | 2025-02-21 | 2025-02-21 | Radiator with micro needle column |
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| Publication Number | Publication Date |
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| CN119677072A CN119677072A (en) | 2025-03-21 |
| CN119677072B true CN119677072B (en) | 2025-05-27 |
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| CN202510193639.4A Active CN119677072B (en) | 2025-02-21 | 2025-02-21 | Radiator with micro needle column |
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| CN120089187B (en) * | 2025-04-28 | 2025-07-29 | 昆山维肯恩电子科技有限公司 | Micro-needle column radiator with bending connection structure |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200734655A (en) * | 2005-09-19 | 2007-09-16 | Formfactor Inc | Apparatus and method of testing singulated dies |
| CN206859576U (en) * | 2017-06-20 | 2018-01-09 | 温州海蓝工业设计有限公司 | The uniform ground heating floor of one kind radiating |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5028147B2 (en) * | 2007-05-29 | 2012-09-19 | 株式会社アライドマテリアル | Heat spreader for semiconductor device and manufacturing method thereof |
| TW200941698A (en) * | 2008-03-28 | 2009-10-01 | Shih-Chi Chen | Structure of chip package stacked |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200734655A (en) * | 2005-09-19 | 2007-09-16 | Formfactor Inc | Apparatus and method of testing singulated dies |
| CN206859576U (en) * | 2017-06-20 | 2018-01-09 | 温州海蓝工业设计有限公司 | The uniform ground heating floor of one kind radiating |
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| CN119677072A (en) | 2025-03-21 |
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