CN119780581A

CN119780581A - Test circuit board, test device and test method

Info

Publication number: CN119780581A
Application number: CN202510185860.5A
Authority: CN
Inventors: 王晓伟
Original assignee: Yungu Guan Technology Co Ltd
Current assignee: Yungu Guan Technology Co Ltd
Priority date: 2025-02-19
Filing date: 2025-02-19
Publication date: 2025-04-08

Abstract

The application provides a test circuit board, a test device and a test method, wherein the test circuit board comprises a plurality of first test terminals, a plurality of second test terminals and a plurality of first test terminals, wherein the first test terminals are used for being connected with a target position and are arranged at intervals along a first direction after being connected; the first test terminal is provided with a first test signal for testing whether the target area is provided with conductive substances, wherein the target area is at least partially positioned between the laser cutting position and the bonding area. According to the test circuit board provided by the application, the target area between the laser cutting position and the bonding area is tested, so that whether the conductive substance exists in the target area can be tested, reworking can be performed after the conductive substance is tested, the problem that when an electrical test or module bonding is performed on a display panel, the conductive substance causes short circuit among terminals, burn of the panel terminals or poor electrical property of a product is caused, and the product yield is remarkably improved.

Description

Test circuit board, test device and test method

Technical Field

The present application relates to the field of display technologies, and in particular, to a test circuit board, a test device, and a test method.

Background

With the development of display technology, the application of display panels is also becoming more and more widespread, and accordingly, the requirements on the display panels are also becoming higher and higher. The existing display panel needs to be electrically tested before leaving the factory to ensure the performance of the display panel.

However, the existing display panel has burn-in problem during electrical test or module bonding.

Disclosure of Invention

Therefore, the present application is directed to a testing circuit board capable of reducing burn-in risk of the display panel during electrical testing and module bonding.

In view of the above object, the present application provides a test circuit board, wherein the display panel includes a display area and a non-display area located on at least one side of the display area, at least one of the non-display areas includes a bonding area and a laser cutting position, the display panel further includes a plurality of panel terminals located in the bonding area, the laser cutting position extends along a first direction, and the plurality of panel terminals are arranged at intervals along the first direction, the test circuit board includes:

The first test terminals are used for being connected with the target area and are arranged at intervals along the first direction after being connected;

the first test terminal is provided with a first test signal for testing whether the target area contains conductive substances or not;

wherein the target area is at least partially located between the laser cut location and the bonding region.

In one embodiment, the test circuit board further comprises:

The second test terminals are used for being connected with the panel terminals one by one, and second test signals are configured on the second test terminals and are used for carrying out electrical test on the display panel;

Preferably, the second test terminal is used for being connected with the panel terminal by crimping or

The second test terminal is used for being connected with the panel terminal through the anisotropic conductive film;

Preferably, the second test signal comprises a voltage and/or current signal.

In one embodiment, the test circuit board further comprises:

The substrate, first test terminal with the second test terminal is located the one side of substrate, first test terminal with the second test terminal all extends along the second direction, just first test terminal with the second test terminal is in the second direction interval sets up, the second direction with first direction is perpendicular.

In one embodiment, the test circuit board further comprises:

The metal wires are positioned on one side, far away from the first test terminal, of the substrate, a plurality of through holes are formed in the substrate, each metal wire is electrically connected with the corresponding second test terminal through the corresponding through hole, and the second test signal enters the second test terminal through the metal wire;

preferably, each metal wire is electrically connected with the corresponding second test terminal through a plurality of through holes;

Preferably, the orthographic projection of the via hole on the substrate is positioned in the orthographic projection of the second test terminal on the substrate;

preferably, orthographic projections of the plurality of first test terminals on the substrate and orthographic projections of the plurality of metal wires on the substrate are arranged at intervals along the first direction.

In one embodiment, the first test terminal is connected to the target area by crimping, or

The first test terminal is used for being connected with the target area through the anisotropic conductive film;

Preferably, the first test signal comprises a voltage and/or current signal.

In one embodiment, a plurality of the first test terminals are arranged at equal intervals;

preferably, the target area portion is located between adjacent ones of the panel terminals.

Based on the same inventive concept, the application also discloses a display panel testing device which comprises the testing circuit board.

Based on the same inventive concept, the application also discloses a testing method for testing a display panel, wherein the display panel comprises a display area and a non-display area, at least one non-display area comprises a bonding area and a laser cutting position, the display panel further comprises a plurality of panel terminals positioned in the bonding area, the laser cutting position extends along a first direction, and the plurality of panel terminals are arranged at intervals along the first direction, and the testing method for the display panel comprises the following steps:

connecting a plurality of first test terminals on a test circuit board with a target area on the display panel, wherein the first test terminals are arranged at intervals along the first direction after connection, and the target area is at least partially positioned between the laser cutting position and the bonding area;

Configuring a first test signal on the first test terminal to test whether a conductive substance is present in the target area;

in response to the presence of a conductive substance in the target area, powering off the display panel without electrical testing;

and in response to the target area being free of conductive material, electrically testing the display panel.

In one embodiment, the electrical test of the display panel comprises:

Configuring a second test signal for a plurality of second test terminals connected with a plurality of panel terminals on the test circuit board one by one so as to electrically test the display panel;

Preferably, the second test signal comprises a voltage and/or current signal.

In one embodiment, the configuring a first test signal on the first test terminal to test whether the target area has conductive material, includes:

Configuring first test signals on the first test terminals, and detecting resistance values between two adjacent first test terminals;

When the resistance value is within a first threshold value range, judging that a conductive substance exists in the target area;

And when the resistance value is not in the first threshold range, judging that the target area is free of conductive substances.

Compared with the prior art, the test circuit board provided by the application has the advantages that whether the target area has the conductive substance can be tested by testing the target area between the laser cutting position and the bonding area, and reworking can be performed after the conductive substance is tested, so that the problem that when the display panel is subjected to electrical test or module bonding, the conductive substance causes short circuit between terminals, so that burn of the panel terminals or poor electrical property of products is caused is avoided, and the product yield is obviously improved.

Drawings

In order to more clearly illustrate the technical solutions of the present application or related art, the drawings that are required to be used in the description of the embodiments or related art will be briefly described below, and it is apparent that the drawings in the following description are only embodiments of the present application, and other drawings may be obtained according to the drawings without inventive effort to those of ordinary skill in the art.

FIG. 1 is a schematic diagram of a related display panel;

FIG. 2 is a schematic diagram showing a partial structure of a related display panel;

FIG. 3 is a schematic diagram of an associated test circuit board;

FIG. 4 is a schematic diagram showing the connection between a test circuit board and a display panel;

FIG. 5 is a schematic diagram of a test circuit board according to an embodiment of the application;

FIG. 6 is a schematic diagram illustrating connection between a test circuit board and a display panel according to an embodiment of the application;

FIG. 7 is a schematic diagram illustrating connection between a test circuit board and a display panel according to another embodiment of the application;

FIG. 8 is a schematic diagram of a test circuit board according to another embodiment of the application;

FIG. 9 is a schematic diagram of a layer structure of a test circuit board and a display panel according to another embodiment of the application;

FIG. 10 is a schematic diagram illustrating connection between a test circuit board and a display panel according to another embodiment of the present application;

FIG. 11 is a schematic diagram of a layer structure of a test circuit board and a display panel according to another embodiment of the application;

FIG. 12 is a schematic diagram illustrating connection between a test circuit board and a display panel according to another embodiment of the present application;

FIG. 13 is a schematic diagram of a layer structure of a test circuit board and a display panel according to another embodiment of the application;

FIG. 14 is a schematic diagram showing connection between a test circuit board and a display panel according to another embodiment of the application;

FIG. 15 is a flow chart of a testing method according to another embodiment of the application;

FIG. 16 is a flow chart of a testing method according to another embodiment of the application.

Marking:

1. display panel, 11, display area, 12, non-display area, 13, bonding area, 14, panel terminal, 15, laser cutting position, 16, target area;

2. Test circuit board, 21, test terminal, 22, first test terminal, 23, second test terminal, 24, substrate, 241, via hole, 25, metal wire.

Detailed Description

The present application will be further described in detail below with reference to specific embodiments and with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present application more apparent.

It should be noted that unless otherwise defined, technical or scientific terms used in the embodiments of the present application should be given the ordinary meaning as understood by one of ordinary skill in the art to which the present application belongs. The terms "first," "second," and the like, as used in embodiments of the present application, do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises", and the like, means that elements or items preceding the word are included in the element or item listed after the word and equivalents thereof, but does not exclude other elements or items. The terms "connected" or "connected," and the like, are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.

Referring to fig. 1 and 2, a related display panel 1 is shown, the display panel 1 includes a display area 11 and a non-display area 12, the non-display area 12 is disposed around the display area 11, wherein one non-display area 12 includes a bonding area 13, and a panel terminal 14 is disposed in the bonding area 13.

Referring to fig. 3 and 4, in performing an electrical test on the display panel 1, a test circuit board 2 is required, and the test circuit board 2 includes a test terminal 21. With continued reference to fig. 4, in the test, the test terminals 21 and the panel terminals 14 need to be connected one by one, and the test signals are arranged on the test terminals 21 to perform signal driving or signal detection on the display panel 1. Wherein test circuit board 2 at least partially covers bonding region 13, substrate 24 of test circuit board 2 is not shown in fig. 4 for purposes of showing test terminals 21 and face terminals 14.

The long-term study of the inventor shows that a large amount of carbonized foreign matters are remained near the laser cutting position 15, namely around the panel terminal 14, in the laser cutting process, when the display panel 1 is subjected to electrical test or module bonding, the carbonized conductive matters can cause burn of the panel terminal or poor electrical property of the product, so that the production yield is lost.

Based on this, the present application provides a test circuit board solution to solve the above-mentioned problems.

Referring to fig. 1, 5 and 6, an embodiment of the application provides a test circuit board 2 for testing a display panel 1, wherein the display panel 1 includes a display area 11 and a non-display area 12, at least one non-display area 12 includes a bonding area 13 and a laser cutting position 15, the display panel 1 further includes a plurality of panel terminals 14 located at the bonding area 13, the laser cutting position 15 extends along a first direction (X direction in the drawing), and the plurality of panel terminals 14 are arranged at intervals along the first direction.

The test circuit board 2 includes a plurality of first test terminals 22, and the plurality of first test terminals 22 are used for connecting with the target area 16, and are arranged at intervals along the first direction after connection. First test signal is configured on first test terminal 22 for testing whether target area 16 is present with a conductive substance, wherein target area 16 is at least partially located between laser cut location 15 and bonding region 13.

According to the test circuit board 2 provided by the embodiment, by testing the target area 16 between the laser cutting position 15 and the bonding area 13, whether the target area 16 contains conductive substances can be tested, reworking can be performed after the conductive substances are tested, short circuit among terminals caused by the conductive substances when the display panel 1 is electrically tested or the module is bonded is avoided, burn of the panel terminal 14 or poor electrical property of a product is caused, and the product yield is remarkably improved.

Since a large amount of carbonized foreign matter generated during the laser cutting process mainly remains near the laser cutting position 15, the target area 16 is selected between the laser cutting position 15 and the bonding region 13, and by measuring the conductive material at this position, it is possible to determine whether or not carbonized foreign matter exists around the panel terminal 14.

In one embodiment, the first test signal comprises a voltage or current signal. In another embodiment, the first test signal is a voltage signal and a current signal, which are combined to facilitate improving the accuracy of the test.

In one embodiment, the plurality of first test terminals 22 are disposed at equal intervals, which is beneficial to improving the accuracy of the detection. The number of the first test terminals 22 may be set according to needs, and when the number of the first test terminals 22 is greater, the distance between adjacent first test terminals 22 is smaller, which is beneficial to improving the test accuracy.

Referring to fig. 7, in one embodiment, the target area 16 is partially located between adjacent panel terminals 14. The detection of the conductive substance in the area between the adjacent panel terminals 14 can be realized, and the detection range is ensured to be larger, and the detection accuracy is higher.

Referring to fig. 8-10, in one embodiment, the test circuit board 2 further includes a plurality of second test terminals 23, where the plurality of second test terminals 23 are used for one-to-one connection with the plurality of panel terminals 14, and the second test terminals 23 are configured with second test signals for electrically testing the display panel 1.

In one embodiment, the first test terminal 22 and the second test terminal 23 are connected to the display panel 1 at the same time, and the first test signal is configured on the first test terminal 22 to test whether the conductive material exists in the target area 16. When the presence of the conductive substance in the target area 16 is detected, the display panel 1 is powered down without performing an electrical test in order to avoid a short circuit between terminals caused by the conductive substance. When it is detected that the target area 16 does not contain a conductive substance, a second test signal is provided to the second test terminal 23, and the display panel 1 is electrically tested.

In another embodiment, the first test terminal 22 and the second test terminal 23 may be connected to the display panel 1 sequentially, that is, the first test terminal 22 is connected to the target area 16 first, and the second test terminal 23 is connected to the panel terminal 14 when the target area 16 is detected to have no conductive material.

Specifically, the second test terminal 23 is used to connect with the panel terminal 14 by crimping, or the second test terminal 23 is used to connect with the panel terminal 14 by an anisotropic conductive film, which is not specifically limited.

In one embodiment, the second test signal is a voltage signal or a current signal. In another embodiment, the second test signal is a voltage signal and a current signal, which are combined to facilitate improving the accuracy of the test.

Referring to fig. 9, in one embodiment, the test circuit board 2 further includes a substrate 24, the first test terminal 22 and the second test terminal 23 are located on one side of the substrate 24, the first test terminal 22 and the second test terminal 23 extend along a second direction (e.g. Y direction in the drawing), and the first test terminal 22 and the second test terminal 23 are spaced apart in the second direction, and the second direction is perpendicular to the first direction. Wherein the first test terminal 22 and the second test terminal 23 are arranged at intervals in the second direction, so that the first test terminal 22 and the second test terminal 23 are prevented from being mutually influenced.

It should be noted that, the substrate 24 is a substrate of the test circuit board 2, and the display panel 1 also has a substrate, which is different from the substrate of the test circuit board 2.

Referring to fig. 9, the substrate 24 is located on the side of the panel terminal 14 away from the display panel 1 during testing.

Referring to fig. 11 and 12, in one embodiment, the test circuit board 2 further includes a plurality of metal traces 25, the plurality of metal traces 25 are located on a side of the substrate 24 away from the first test terminals 22, a plurality of vias 241 are disposed on the substrate 24, each metal trace 25 is electrically connected to a corresponding second test terminal 23 through a corresponding via 241, and the second test signal enters the second test terminal 23 through the metal trace 25. Wherein, the metal wire 25 on the other side of the substrate 24 is connected with the second test terminal 23, so as to avoid the mutual influence between the metal wire 25 and the first test terminal 22, and ensure that the first test signal and the second test signal are not affected.

Referring to fig. 13 and 14, in one embodiment, each metal trace 25 is electrically connected to the corresponding second test terminal 23 through a plurality of vias 241, which is beneficial to improving stability of electrical connection. Illustratively, each metal trace 25 is electrically connected to a corresponding second test terminal 23 through two, three, or four vias 241.

Preferably, the orthographic projection of the via 241 on the substrate 24 is located in the orthographic projection of the second test terminal 23 on the substrate 24, so as to ensure that the second test terminal 23 is connected with the metal wire 25 in the shortest path, and ensure the connection stability of the second test terminal 23 and the metal wire 25. Further, each metal trace 25 is connected to the corresponding second test terminal 23 through a plurality of vias 241, so as to ensure stability of electrical connection.

Preferably, the orthographic projections of the plurality of first test terminals 22 on the substrate 24 and the orthographic projections of the plurality of metal traces 25 on the substrate 24 are arranged at intervals along the first direction, so that the metal traces 25 are electrically connected with the second test terminals 23, and meanwhile, signal interference between the first test terminals 22 and the second test terminals 23 is reduced.

In one embodiment, the first test terminal 22 is used to connect with the target area 16 by crimping, or the first test terminal 22 is used to connect with the target area 16 by an anisotropic conductive film, which is not particularly limited.

Wherein test circuit board 2 at least partially covers bonding region 13, substrate 24 of test circuit board 2 is not shown in fig. 7, 10, 11, and 13 for purposes of showing test terminals 21 and face terminals 14.

Based on the same inventive concept, another embodiment of the present application also discloses a display panel testing device, which includes the testing circuit board 2 in the above embodiment. Further, the test device may include a signal generator for generating a test signal, a computer for calculating a target reference (e.g., a resistance value), and determining whether a conductive substance is present based on a target parameter.

Based on the same inventive concept, another embodiment of the present application further discloses a testing method for testing the display panel 1, referring to fig. 1, 5 and 6, the display panel 1 includes a display area 11 and a non-display area 12, at least one non-display area 12 includes a bonding area 13 and a laser cutting position 15, the display panel 1 further includes a plurality of panel terminals 14 located at the bonding area 13, the laser cutting position 15 extends along a first direction, and the plurality of panel terminals 14 are arranged at intervals along the first direction. Referring to fig. 15, the display panel testing method in the present embodiment includes the steps of:

in step S10, a plurality of first test terminals 22 on the test circuit board 2 are connected to the target area 16 on the display panel 1, and the plurality of first test terminals 22 are arranged at intervals along the first direction after the connection, wherein the target area 16 is at least partially located between the laser cutting position 15 and the bonding area 13.

Step S20, a first test signal is configured on the first test terminal 22 to test whether the target area 16 has a conductive substance. In one embodiment, the first test signal comprises a voltage or current signal. In another embodiment, the first test signal is a voltage signal and a current signal, which are combined to facilitate improving the accuracy of the test.

Step S30, in response to the presence of the conductive substance in the target area 16, the display panel 1 is powered off and no electrical test is performed.

Step S40, in response to the target area 16 not having the conductive substance, electrically testing the display panel 1.

According to the testing method provided by the embodiment, by testing the target area 16 between the laser cutting position 15 and the bonding area 13, whether the target area 16 contains the conductive substance can be tested, reworking can be performed after the conductive substance is tested, short circuit among terminals caused by the conductive substance when the display panel 1 is subjected to electrical test or module bonding is avoided, burn of the panel terminal 14 or poor electrical property of a product is caused, and the product yield is remarkably improved.

In one embodiment, the step S40 of performing the electrical test on the display panel 1 includes:

The second test signals are configured to a plurality of second test terminals 23 connected one by one to the plurality of panel terminals 14 on the test circuit board 2 to electrically test the display panel 1. Wherein the test circuit board 2 is shown with reference to fig. 8-10.

Referring to fig. 16, in one embodiment, step S20, configuring a first test signal on the first test terminal 22 to test whether the target area 16 has a conductive substance, includes:

Step S21, configuring first test signals on the first test terminals 22, and detecting resistance values between two adjacent first test terminals 22;

Step S22, when the resistance value is within the first threshold value range, judging that the conductive substance exists in the target area 16;

Step S23, when the resistance value is not within the first threshold value range, it is determined that the target area 16 does not contain the conductive substance.

In which a large amount of carbonized foreign matter generated during laser cutting remains mainly near the laser cutting position 15, resulting in a decrease in resistance value between adjacent two first test terminals 22, and the first threshold range can be obtained by measuring and comparing the target area 16 before and after laser cutting, respectively. Further, a more accurate first threshold range may be obtained by multiple measurements.

In other embodiments, the resistance value in step S21 may be replaced by other parameters, such as current, voltage, etc., which are not limited in particular.

While the application has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations of those embodiments will be apparent to those skilled in the art in light of the foregoing description.

It should be noted that the foregoing describes some embodiments of the present application. Other embodiments are within the scope of the following claims. In some cases, the actions or steps recited in the claims may be performed in a different order than in the embodiments described above and still achieve desirable results. In addition, the processes depicted in the accompanying figures do not necessarily require the particular order shown, or sequential order, to achieve desirable results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

The present embodiments are intended to embrace all such alternatives, modifications and variances which fall within the broad scope of the appended claims. Therefore, any omissions, modifications, equivalent substitutions, improvements, and the like, which are within the spirit and principles of the embodiments of the application, are intended to be included within the scope of the application.

Claims

1. A test circuit board for testing a display panel, the display panel including a display area and a non-display area located on at least one side of the display area, at least one of the non-display areas including a bonding area and a laser cutting location, the display panel further including a plurality of panel terminals located in the bonding area, the laser cutting location extending along a first direction, the plurality of panel terminals being spaced apart along the first direction, the test circuit board comprising:

2. The test circuit board of claim 1, wherein the test circuit board further comprises:

Preferably, the second test signal comprises a voltage and/or current signal.

3. The test circuit board of claim 2, wherein the test circuit board further comprises:

4. The test circuit board of claim 3, wherein the test circuit board further comprises:

5. The test circuit board of claim 1, wherein said first test terminal is connected to said target area by crimping, or

Preferably, the first test signal comprises a voltage and/or current signal.

6. The test circuit board of claim 1, wherein a plurality of said first test terminals are disposed at equal intervals;

7. A display panel testing apparatus comprising the test circuit board according to any one of claims 1 to 6.

8. A testing method for testing a display panel, the display panel including a display area and a non-display area, at least one of the non-display areas including a bonding area and a laser cutting location, the display panel further including a plurality of panel terminals located at the bonding area, the laser cutting location extending along a first direction, the plurality of panel terminals being spaced apart along the first direction, the testing method comprising:

9. The method of testing of claim 8, wherein the electrically testing the display panel comprises:

Preferably, the second test signal comprises a voltage and/or current signal.

10. The method of testing of claim 8, wherein configuring a first test signal on the first test terminal to test whether the target area is in the presence of a conductive substance comprises: