Disclosure of Invention
The purpose of the present disclosure is to overcome the shortcomings in the prior art, and provide a satellite communication antenna device and a vehicle-mounted high-latitude satellite communication terminal that effectively reduce communication signal interference and production cost.
The aim of the disclosure is achieved by the following technical scheme:
The satellite communication antenna device comprises a shell and a communication assembly, wherein the communication assembly is arranged in the shell and comprises a communication main control circuit board, a communication top plate and a communication feed piece, the communication main control circuit board and the communication top plate are oppositely arranged to form a medium accommodating space between the communication main control circuit board and the communication top plate, the communication main control circuit board is connected with the shell, the communication feed piece comprises a double-frequency communication antenna and a communication feed column, the double-frequency communication antenna is arranged on one surface of the communication top plate, which is far away from the communication main control circuit board, a feed end of the double-frequency communication antenna is electrically connected with the communication feed column, and the communication feed column is also electrically connected with a feed receiving and transmitting end of the communication main control circuit board, wherein the double-frequency communication antenna is used for receiving and transmitting double-wave-band communication signals.
In one embodiment, the dual-frequency communication antenna includes a first communication sub-antenna and a second communication sub-antenna, where the frequency of the transceiving band of the first communication sub-antenna is different from the frequency of the transceiving band of the second communication sub-antenna.
In one embodiment, the first communication sub-antenna and the second communication sub-antenna are disposed parallel to each other.
In one embodiment, the first communication sub-antenna and the second communication sub-antenna have a spiral distribution structure.
In one embodiment, the communication feed column includes a first feed column and a second feed column, the first feed column is electrically connected with the first communication sub-antenna and the first feed receiving and transmitting end of the communication main control circuit board, and the second feed column is electrically connected with the second communication sub-antenna and the second feed receiving and transmitting end of the communication main control circuit board.
In one embodiment, the communication feed piece further comprises a communication feed PCB board, the communication feed PCB board is respectively connected with the communication main control circuit board and the communication top plate, and the communication feed column is formed on the communication feed PCB board.
In one embodiment, the communication top plate is provided with a avoidance area, the communication assembly further comprises a plurality of medium accommodating plates, the medium accommodating plates are respectively connected with the communication main control circuit board and the communication top plate, the avoidance area is located between the two medium accommodating plates, and the avoidance area corresponds to the installation position of the communication main control circuit board.
In one embodiment, the opening of the avoidance area is opposite to the side edge of the communication main control circuit board.
In one embodiment, the communication assembly further comprises at least one media securing plate disposed on the communication top plate, each of the media securing plates being connected to one of the media receiving plates.
A vehicle-mounted high latitude satellite communication terminal comprising a satellite communication antenna device according to any one of the preceding claims.
Compared with the prior art, the method has at least the following advantages:
the communication main control circuit board and the communication top plate are used for filling media so as to reduce signal interference between the communication main control circuit board and the dual-frequency communication antenna, in addition, the communication main control circuit board integrates a dual-band communication circuit, and the communication top plate integrates the dual-band communication antenna, namely the dual-frequency communication antenna, so that the communication circuit and the communication antenna are respectively integrated on an upper layer structure and a lower layer structure, and the production cost is effectively reduced.
Detailed Description
In order that the disclosure may be understood, a more complete description of the disclosure will be rendered by reference to the appended drawings. Preferred embodiments of the present disclosure are shown in the drawings. This disclosure may, however, be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiment.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. The terminology used in the description of the disclosure herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the disclosure. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
The present disclosure relates to a satellite communication antenna apparatus. In one embodiment, the satellite communication antenna device comprises a shell and a communication assembly, wherein the communication assembly is arranged in the shell and comprises a communication main control circuit board, a communication top plate and a communication feed piece, the communication main control circuit board and the communication top plate are oppositely arranged to form a medium accommodating space between the communication main control circuit board and the communication top plate, the communication main control circuit board is connected with the shell, the communication feed piece comprises a double-frequency communication antenna and a communication feed column, the double-frequency communication antenna is arranged on one surface of the communication top plate, which is far away from the communication main control circuit board, a feed end of the double-frequency communication antenna is electrically connected with the communication feed column, and the communication feed column is also electrically connected with a feed receiving and transmitting end of the communication main control circuit board, wherein the double-frequency communication antenna is used for receiving and transmitting double-band communication signals. The communication main control circuit board and the communication top plate are used for filling media so as to reduce signal interference between the communication main control circuit board and the dual-frequency communication antenna, in addition, the communication main control circuit board integrates a dual-band communication circuit, and the communication top plate integrates the dual-band communication antenna, namely the dual-frequency communication antenna, so that the communication circuit and the communication antenna are respectively integrated on an upper layer structure and a lower layer structure, and the production cost is effectively reduced.
Fig. 1 is a schematic structural diagram of a satellite communication antenna device according to an embodiment of the disclosure.
The satellite communications antenna apparatus 10 of one embodiment includes a housing 100. Referring to fig. 2, the satellite communication antenna device 10 further includes a communication assembly 200, the communication assembly 200 is disposed in the housing 100, referring to fig. 3, the communication assembly 200 includes a communication main control circuit board 210, a communication top board 220, and a communication feeding member 230, the communication main control circuit board 210 is disposed opposite to the communication top board 220, so as to form a medium accommodating space 202 between the communication main control circuit board 210 and the communication top board 220, the communication main control circuit board 210 is connected with the housing 100, the communication feeding member 230 includes a dual-frequency communication antenna 232 and a communication feeding member 234, the dual-frequency communication antenna 232 is disposed on a surface of the communication top board 220 facing away from the communication main control circuit board 210, a feeding end of the dual-frequency communication antenna 232 is electrically connected with the communication feeding member 234, and the communication feeding member 234 is also electrically connected with a feeding receiving end of the communication main control circuit board 210, wherein the dual-frequency communication antenna 232 is used for receiving and transmitting dual-band communication signals.
In this embodiment, a medium is filled between the communication main control circuit board 210 and the communication top board 220 to reduce signal interference between the communication main control circuit board 210 and the dual-frequency communication antenna 232, and the communication main control circuit board 210 integrates dual-band communication lines, and the communication top board 220 integrates dual-band communication antennas, that is, the dual-frequency communication antenna 232, so that the communication circuit and the communication antenna are respectively integrated on an upper layer structure and a lower layer structure, thereby effectively reducing production cost.
In one embodiment, referring to fig. 3, the dual-band communication antenna 232 includes a first communication sub-antenna 2322 and a second communication sub-antenna 2324, where a frequency of a transmit-receive band of the first communication sub-antenna 2322 is different from a frequency of a transmit-receive band of the second communication sub-antenna 2324. In this embodiment, the first communication sub-antenna 2322 and the second communication sub-antenna 2324 are both disposed on the communication top plate 220, and the first communication sub-antenna 2322 and the second communication sub-antenna 2324 respectively perform communication in different frequency bands, that is, the communication frequency band of the first communication sub-antenna 2322 is different from the communication frequency band of the second communication sub-antenna 2324, so that the satellite communication antenna device has two different communication frequency bands, thereby enabling the satellite communication antenna device to perform communication in multiple frequency bands, so as to improve the communication frequency band range of the satellite communication antenna device.
In another embodiment, the frequency of the transceiving band of the first communication sub-antenna 2322 is between 1980MHz and 2010MHz, for example, the first communication sub-antenna 2322 transmits communication signals in a frequency range between 1980MHz and 2010MHz, and meanwhile, the receiving frequency of the second communication sub-antenna 2324 is different from the transmitting frequency band of the first communication sub-antenna 2322.
In another embodiment, the transceiver band frequency of the second communication sub-antenna 2324 is 2170MHz to 2200MHz, for example, the second communication sub-antenna 2324 receives a communication signal in a frequency range of 2170MHz to 2200MHz, and at the same time, the transmission frequency of the first communication sub-antenna 2322 is different from the reception frequency of the second communication sub-antenna 2324.
In one embodiment, referring to fig. 3, the first communication sub-antenna 2322 and the second communication sub-antenna 2324 are disposed parallel to each other. In this embodiment, the first communication sub-antenna 2322 is used as a type of communication antenna in the satellite communication antenna device, the second communication sub-antenna 2324 is used as a type of communication antenna in the satellite communication antenna device, and among two types of communication antennas with different frequencies, adjacent communication frequencies are adopted for receiving and transmitting frequencies, and the first communication sub-antenna 2322 and the second communication sub-antenna 2324 are adjusted in structure, specifically, the first communication sub-antenna 2322 and the second communication sub-antenna 2324 are kept to be distributed in parallel, so that polarization modes of the first communication sub-antenna 2322 and the second communication sub-antenna 2324 are kept the same, and accordingly various antenna performances of the first communication sub-antenna 2322 and the second communication sub-antenna 2324 are kept synchronous, and antenna parameter adjustment is facilitated for the first communication sub-antenna 2322 and the second communication sub-antenna 2324.
In one embodiment, referring to fig. 3, the first communication sub-antenna 2322 and the second communication sub-antenna 2324 have a spiral distribution structure. In this embodiment, the first communication sub-antenna 2322 is distributed on the communication top plate 220 in a spiral manner, the second communication sub-antenna 2324 is distributed on the communication top plate 220 in the same spiral structure, and the second communication sub-antenna 2324 is kept parallel to each other in the spiral direction, so that the first communication sub-antenna 2322 and the second communication sub-antenna 2324 are distributed in a spiral manner in parallel to each other, so that the polarization manners of the first communication sub-antenna 2322 and the second communication sub-antenna 2324 are the same, and specifically, the polarization manners of the first communication sub-antenna 2322 and the second communication sub-antenna 2324 are in a left-hand circular polarization.
In another embodiment, the first communication sub-antenna 2322 and the second communication sub-antenna 2324 have different gains for different polarization angles, specifically, the polarization angle Theta of the satellite communication antenna device is within ±30 degrees, the corresponding gain is greater than or equal to 5dBi, the polarization angle Theta of the satellite communication antenna device is within ±50 degrees, the corresponding gain is greater than or equal to 2dBi, the polarization angle Theta of the satellite communication antenna device is within ±60 degrees, and the corresponding gain is greater than or equal to 0dBi, which is shown in fig. 5 in detail. The average left-handed gain of theta=60 is close to 0.7dbi, so that the design index of Theta 60=0 dbi can be met, the average left-handed gain of theta=30 is close to 4.3dbi, the index is Theta 30=5 dbi, the gap is 0.7, and the requirement of a high-latitude communication antenna is met. Thus, in high latitude areas, the satellite communication antenna device is suitable for high elevation communication.
In another embodiment, the MAX left-hand gain of the antenna of the satellite communication antenna device is used as a polarization gain index of another high-latitude communication antenna, as shown in fig. 6 in detail. Thus, the MAX left-hand gain is close to 1.8dbi when theta=60 degrees, and is close to 5.09dbi when theta=30 degrees, and the design index of the left-hand gain of the high-latitude communication antenna can be met.
In another embodiment, the antenna of the satellite communication antenna device has a corresponding average axial ratio in the polarization direction diagram of the left-hand circular polarization, specifically, as shown in fig. 7, the average axial ratio is smaller than 1, and the design index of the axial ratio of the high-latitude communication antenna is completely satisfied.
In another embodiment, the antenna of the satellite communication antenna device has a specified S11 parameter, namely, has a return loss meeting an index, under the left-hand circular polarization, and is specifically shown in fig. 8. Thus, S11 of the satellite communication antenna device is-10, and the design index that VSWR (voltage standing wave ratio) is smaller than 2 is met.
In another embodiment, the antenna of the satellite communication antenna device has different out-of-roundness indexes of polarization angles under the left-hand circular polarization, and is specifically shown in fig. 9. Thus, when theta=60 degrees, the out-of-roundness of the antenna of the satellite communication antenna device is 2.7, and when theta=30 degrees, the out-of-roundness of the antenna of the satellite communication antenna device is 1.5, thereby meeting the out-of-roundness design index of the high-latitude communication antenna.
In one embodiment, referring to fig. 2 and fig. 3, the communication feeding post 234 includes a first feeding post 2342 and a second feeding post 2344, the first feeding post 2342 is electrically connected to the first communication sub-antenna 2322 and the first feeding receiving end of the communication main circuit board 210, and the second feeding post 2344 is electrically connected to the second communication sub-antenna 2324 and the second feeding receiving end of the communication main circuit board 210. In this embodiment, the first feeding post 2342 and the second feeding post 2344 are feeding conductive posts for transmitting communication signals between the communication antenna and the communication main circuit board 210. One end of the first feeding post 2342 is connected to the feeding point of the first communication sub-antenna 2322, specifically, one end of the first feeding post 2342 is electrically connected to the spiral starting end of the first communication sub-antenna 2322, the other end of the first feeding post 2342 is electrically connected to the first feeding receiving end of the communication main control circuit board 210, and the first communication sub-antenna 2322 and the communication main control circuit board 210 are subjected to communication transmission through the first feeding post 2342. One end of the second feeding post 2344 is connected to the feeding point of the second communication sub-antenna 2324, specifically, one end of the second feeding post 2344 is electrically connected to the spiral starting end of the second communication sub-antenna 2324, the other end of the second feeding post 2344 is electrically connected to the second feeding receiving end of the communication main control circuit board 210, and the second communication sub-antenna 2324 and the communication main control circuit board 210 are subjected to communication transmission through the second feeding post 2344. The communication main control circuit board 210 is convenient to process communication signals of the first communication sub-antenna 2322 and the second communication sub-antenna 2324 under communication conduction of the first feeding post 2342 and the second feeding post 2344.
In one embodiment, referring to fig. 4, the communication feed 230 further includes a communication feed PCB 236, the communication feed PCB 236 is connected to the communication main control circuit board 210 and the communication top plate 220, and the communication feed post 234 is formed on the communication feed PCB 236. In this embodiment, the communication feeding post 234 is located on the communication feeding PCB 236, specifically, the communication feeding post 234 is formed on the communication feeding PCB 236 in a line manner, that is, the communication feeding PCB 236 is used as a feeding PCB of the communication feeding post, and the communication main control circuit board 210 may also be electrically conducted with the first communication sub-antenna 2322 and the second communication sub-antenna 2324 on the communication top board 220 through a line on the communication feeding PCB 236.
In one embodiment, referring to fig. 2, the communication assembly 200 further includes a communication support board 240, where the communication support board 240 is disposed between the communication main control circuit board 210 and the communication top board 220, and the communication support board 240 is connected to the communication main control circuit board 210 and the communication top board 220, respectively. In the present embodiment, the communication support plate 240 serves as a bottom support of the communication top plate 220, and in particular, the communication support plate 240 has a height of 16mm to 17.5mm. The communication support plate 240 is located in the medium accommodating space 202, and the air in the communication top plate 220, the communication support plate 240 and the medium accommodating space 202 is used as an insulating medium layer between the dual-frequency communication antenna 232 and the communication main control circuit board 210, so as to form a feeding electric field of the dual-frequency communication antenna 232, and improve polarization gain of the satellite communication antenna device.
In another embodiment, the medium accommodating space 202 may be filled with media having different dielectric constants, so that the characteristic impedance of the satellite communication antenna device meets the index requirement, for example, the characteristic impedance of the satellite communication antenna device is 50Ω.
In the process of transmitting satellite communication signals by the communication main control circuit board 210, the communication main control circuit board 210 performs signal transmission with the communication feeding piece 230 on the communication top board 220 through the communication feeding piece 230, the circuit on the communication main control circuit board 210 and the welded electronic components easily generate electromagnetic pulses during operation, the generated pulses can generate crosstalk on the satellite communication signals on the communication feeding piece 230, the communication signals are easily unstable, the satellite communication is seriously interrupted, and in high-latitude areas, the stability of the satellite communication signals directly affects normal use.
In order to improve the transmission stability of the satellite communication signal, referring to fig. 2, the communication assembly 200 further includes a communication circuit lifting board 250 connected to the housing, the communication circuit lifting board 250 is connected to the communication main control circuit board 210, the communication circuit lifting board 250 is located on a surface of the communication main control circuit board 210 facing away from the communication top board 220, and the communication circuit lifting board 250 further corresponds to a component soldering surface of the communication main control circuit board 210, so that each electronic component of the communication main control circuit board 210 faces to a surface of the communication main control circuit board 210 facing away from the communication top board 220.
In this embodiment, the communication circuit board 250 is located between the bottom of the housing 100 and the communication main control circuit board 210, and the communication circuit board 250 supports the communication main control circuit board 210 away from the bottom of the housing 100, so that a gap is formed between the communication main control circuit board 210 and the bottom of the housing 100. The electronic components of the communication main control circuit board 210 face the communication main control circuit board 210 away from the communication top plate 220, that is, the electronic components of the communication main control circuit board 210 are located in a gap between the communication main control circuit board 210 and the bottom of the housing 100, so that the electronic components of the communication main control circuit board 210 are conveniently contained in the gap, and the medium between the electronic components of the communication main control circuit board 210 and the communication feeding member 230 is increased, so that the pulse of the electronic components on the communication main control circuit board 210 to the communication feeding member 230 is weakened, the communication interference to the communication feeding member 230 is effectively reduced, and the transmission stability of satellite communication signals is improved.
Further, the communication circuit dragging plate 250 is provided with a heat dissipation communication hole 204, the housing 100 is provided with a threading hole 102, the threading hole 102 is opposite to the heat dissipation communication hole 204, the threading hole 102 and the heat dissipation communication hole 204 are both used for being threaded through a communication line electrically connected with the communication main control circuit board 210, and the aperture of the heat dissipation communication hole 204 is larger than that of the threading hole 102.
In this embodiment, the heat dissipation communication hole 204 is communicated with the gap between the communication main control circuit board 210 and the bottom of the housing 100, and the heat dissipation communication hole 204 not only penetrates out the communication line on the communication main control circuit board 210, but also dissipates a large amount of heat on the communication main control circuit board 210. The heat dissipation communication hole 204 is larger than the threading hole 102, so that more heat can be conveniently and quickly dissipated through the threading hole 102, and the communication line can be conveniently installed in a penetrating way.
Still further, referring to fig. 3, the communication top plate 220 has a avoidance area 206, the communication assembly 200 further includes a plurality of medium accommodating boards 260, the medium accommodating boards 260 are respectively connected to the communication main control circuit board 210 and the communication top plate 220, the avoidance area 206 is located between the two medium accommodating boards 260, and the avoidance area 206 corresponds to an installation position of the communication main control circuit board 210.
In this embodiment, the avoidance area 206 is located at a side edge of the communication top plate 220, the avoidance area 206 is a avoidance area on the side edge of the communication top plate 220, the avoidance area 206 is used as an installation avoidance area 206 area on the communication top plate 220, a fixed installation area on the communication main control circuit board 210 corresponds to the avoidance area 206, and the medium accommodating plate 260 is used for jacking up the communication top plate 220, so that a space for accommodating a medium is formed between the communication top plate 220 and the communication main control circuit board 210. The avoidance area 206 is located between the two medium accommodating boards 260, so that medium is conveniently injected into the medium accommodating space 202 through the gap between the medium accommodating boards 260, so as to further reduce communication interference between the communication feed 230 and the communication main control circuit board 210.
In another embodiment, a plurality of the medium accommodating boards 260 are added in the medium accommodating space 202 to form a medium between the communication main control circuit board 210 and the communication top board 220 together with the medium in the medium accommodating space 202, and when the medium accommodating space 202 is an air medium, the material of the medium accommodating boards 260 is used as an adding medium to reduce the FR-4 medium consumption added to the medium accommodating space 202. Wherein, the dielectric constant of FR-4 medium is 4.6, the dielectric loss is 0.025, the medium accommodating plate and the communication supporting plate are also used as supplementary medium, the adopted materials are all plastics, the dielectric constant is 2.9, and the dielectric loss is 0.025.
In another embodiment, referring to fig. 4, the opening of the avoidance area 206 is opposite to the side of the communication main circuit board 210, i.e. the opening of the avoidance area 206 faces to the side of the communication main circuit board 210 to adapt to different communication direction requirements.
In another embodiment, referring to fig. 4, the communication assembly 200 further includes at least one media securing plate 270 disposed on the communication top plate 220, each of the media securing plates 270 being coupled to one of the media receiving plates 260. In this embodiment, the medium fixing plate 270 is connected to the communication top plate 220 and the medium accommodating plate 260, respectively, and the medium fixing plate 270 serves as a fixing connection member of the medium accommodating plate 260 to the communication top plate 220, so as to improve the mounting stability of the medium accommodating plate 260 to the communication top plate 220.
Still further, referring to fig. 2, the housing 100 includes a bottom plate 110, a top cover 120, and a sealing ring 130, where the top cover 120 is covered on the bottom plate 110, specifically, the top cover 120 is screwed with the bottom plate 110, the bottom plate 110 is connected with the communication circuit dragging plate 250, the sealing ring 130 is respectively connected with the bottom plate 110 and the top cover 120, the sealing ring 130 is disposed around the outer side of the communication circuit dragging plate 250, and the sealing ring 130 is also abutted against one side of the communication main control circuit board 210 facing away from the communication top plate 220.
In this embodiment, the bottom plate 110 and the top cover 120 are fastened to each other, so as to form an internal space for accommodating the communication assembly 200. The sealing ring 130 is located at the periphery of the communication circuit dragging plate 250, and the sealing ring 130 not only seals the gap between the bottom plate 110 and the top cover 120, but also forms a sealing space between the communication main control circuit board 210 and the bottom plate 110, so as to seal each electronic component on the communication main control circuit board 210, so as to reduce the influence of the outside. Moreover, the sealing baffle ring 130 is located between the base plate 110 and the communication main control circuit board 210, and the sealing baffle ring 130 can effectively limit electromagnetic pulses on the communication main control circuit board 210 to the lower side, so as to further reduce communication interference to the communication feed 230.
In one embodiment, the disclosure further provides a vehicle-mounted high latitude satellite communication terminal, including the satellite communication antenna device according to any one of the above. In this embodiment, the satellite communication antenna device includes a housing and a communication assembly, where the communication assembly is disposed in the housing, the communication assembly includes a communication main control circuit board, a communication top board, and a communication feed member, where the communication main control circuit board is disposed opposite to the communication top board, so as to form a medium accommodating space between the communication main control circuit board and the communication top board, the communication main control circuit board is connected with the housing, the communication feed member includes a dual-frequency communication antenna and a communication feed column, the dual-frequency communication antenna is disposed on a surface of the communication top board facing away from the communication main control circuit board, a feed end of the dual-frequency communication antenna is electrically connected with the communication feed column, and the communication feed column is also electrically connected with a feed receiving and transmitting end of the communication main control circuit board, where the dual-frequency communication antenna is used to receive and transmit dual-band communication signals. The communication main control circuit board and the communication top plate are used for filling media so as to reduce signal interference between the communication main control circuit board and the dual-frequency communication antenna, in addition, the communication main control circuit board integrates a dual-band communication circuit, and the communication top plate integrates the dual-band communication antenna, namely the dual-frequency communication antenna, so that the communication circuit and the communication antenna are respectively integrated on an upper layer structure and a lower layer structure, and the production cost is effectively reduced.
The foregoing examples represent only a few embodiments of the present disclosure, which are described in more detail and are not to be construed as limiting the scope of the invention. It should be noted that variations and modifications can be made by those skilled in the art without departing from the spirit of the disclosure, which are within the scope of the disclosure. Accordingly, the scope of protection of the present disclosure should be determined by the following claims.