[go: up one dir, main page]

CN119890075A - Treatment liquid supply device, substrate treatment device, and treatment liquid supply method - Google Patents

Treatment liquid supply device, substrate treatment device, and treatment liquid supply method Download PDF

Info

Publication number
CN119890075A
CN119890075A CN202411481542.5A CN202411481542A CN119890075A CN 119890075 A CN119890075 A CN 119890075A CN 202411481542 A CN202411481542 A CN 202411481542A CN 119890075 A CN119890075 A CN 119890075A
Authority
CN
China
Prior art keywords
liquid
circulation
circulation system
liquid supply
mixing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202411481542.5A
Other languages
Chinese (zh)
Inventor
滩和成
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Screen Holdings Co Ltd
Original Assignee
Screen Holdings Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Screen Holdings Co Ltd filed Critical Screen Holdings Co Ltd
Publication of CN119890075A publication Critical patent/CN119890075A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67023—Apparatus for fluid treatment for general liquid treatment, e.g. etching followed by cleaning
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67253—Process monitoring, e.g. flow or thickness monitoring

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Weting (AREA)

Abstract

本发明提供一种处理液供给装置、基板处理装置及处理液供给方法。处理液供给装置包含第1循环装置、第2循环装置、混合导出部及液体供给部。第1循环装置具有与第1液体供给源连接的第1循环系统，将在该第1循环系统的至少一部分流动的第1液体向混合导出部供给。第2循环装置具有与第2液体供给源连接的第2循环系统，将在该第2循环系统的至少一部分流动的第2液体向混合导出部供给。混合导出部将第1液体和第2液体混合，并向设于液体供给部的主蓄留槽引导。液体供给部将主蓄留槽中蓄留的混合液作为处理液向基板处理部供给。

The present invention provides a processing liquid supply device, a substrate processing device and a processing liquid supply method. The processing liquid supply device includes a first circulation device, a second circulation device, a mixing outlet and a liquid supply unit. The first circulation device has a first circulation system connected to a first liquid supply source, and supplies a first liquid flowing in at least a part of the first circulation system to the mixing outlet. The second circulation device has a second circulation system connected to a second liquid supply source, and supplies a second liquid flowing in at least a part of the second circulation system to the mixing outlet. The mixing outlet mixes the first liquid and the second liquid and guides them to a main storage tank provided in the liquid supply unit. The liquid supply unit supplies the mixed liquid stored in the main storage tank to the substrate processing unit as a processing liquid.

Description

Treatment liquid supply device, substrate treatment device, and treatment liquid supply method
Technical Field
The present invention relates to a processing liquid supply apparatus, a substrate processing apparatus, and a processing liquid supply method for supplying a processing liquid to one or more substrate processing units.
Background
Substrate processing apparatuses are used for various processes on substrates such as FPD (Flat Panel Display) substrates, optical disk substrates, magnetic disk substrates, magneto-optical disk substrates, photomask substrates, ceramic substrates, and solar cell substrates, such as semiconductor substrates, liquid crystal display devices, and organic EL (Electro Luminescence) display devices.
As an example of the substrate processing apparatus, japanese patent application laid-open No. 2020-198357 discloses a substrate processing apparatus for processing a substrate using a processing liquid. The substrate processing apparatus includes a substrate processing section and a chemical solution generating section. The chemical liquid generating unit generates a treatment liquid by diluting the chemical liquid. In the substrate processing section, a predetermined process is performed on the substrate using the processing liquid generated by the liquid chemical generating section. In the following description, for convenience of explanation, the chemical liquid generating section described in japanese patent application laid-open No. 2020-198357 is referred to as a treatment liquid supply device.
When the treatment liquid is generated in the treatment liquid supply device, the raw liquid of the chemical liquid supplied from the chemical liquid supply source is sent to the mixing pipe. The dilution liquid supplied from the dilution liquid supply source is supplied to the mixing pipe. The chemical solution and the diluting liquid supplied to the mixing pipe are mixed with each other, and are stored in the mixing vessel as a treatment liquid. The processing liquid stored in the mixing container is supplied to the substrate processing section.
Disclosure of Invention
When the chemical solution and the diluting solution are mixed in the mixing pipe, if the flow rate of the chemical solution supplied to the mixing pipe and the flow rate of the diluting solution supplied to the mixing pipe are not accurately adjusted, the chemical solution and the diluting solution cannot be mixed at a predetermined ratio. In this case, the quality of the processing liquid stored in the mixing vessel is lowered, and the high-quality processing liquid cannot be supplied to the substrate processing section.
The flow rate of the chemical supplied to the mixing pipe is adjusted by a flow rate adjustment mechanism such as an electric needle valve, and the chemical becomes unstable for a certain period from the start of the supply of the chemical to the mixing pipe. The flow rate of the dilution liquid supplied to the mixing pipe is also adjusted by the flow rate adjusting mechanism, and becomes unstable for a certain period from the supply start time of the dilution liquid to the mixing pipe. Therefore, immediately after the start of the generation of the treatment liquid, the high-quality treatment liquid cannot be generated.
In the treatment liquid supply device of japanese patent application laid-open No. 2020-198357, the mixed liquid mixed in the mixing pipe is discarded (pre-drained) within a predetermined period from the time point of start of generation of the treatment liquid. However, discarding a mixed liquid (low-quality processing liquid) which is not produced under predetermined conditions as a drain (industrial waste) is a major cause of increasing the cost of consumables for producing the processing liquid.
The invention aims to provide a processing liquid supply device, a substrate processing device and a processing liquid supply method, wherein the processing liquid supply device can stably supply high-quality processing liquid to a substrate processing part without discarding low-quality processing liquid.
The processing liquid supply device according to one aspect of the present invention is a processing liquid supply device for supplying a mixed liquid containing a 1 st liquid and a 2 nd liquid as a processing liquid to one or more substrate processing units, and includes a liquid supply unit including a main tank for storing the mixed liquid, the mixed liquid stored in the main tank being supplied as the processing liquid to the one or more substrate processing units, a mixing/discharging unit for guiding the mixed liquid to the main tank, a 1 st circulation device having a 1 st circulation system connected to a 1 st liquid supply source, the 1 st liquid flowing in at least a part of the 1 st circulation system being supplied to the mixing/discharging unit, and a 2 nd circulation device having a 2 nd circulation system connected to a 2 nd liquid supply source, the 2 nd liquid flowing in at least a part of the 2 nd circulation system being supplied to the mixing/discharging unit.
The processing liquid supply device according to another aspect of the present invention is a processing liquid supply device for supplying a mixed liquid containing a1 st liquid and a 2 nd liquid as a processing liquid to one or more substrate processing units, and includes a liquid supply unit for supplying the 1 st liquid stored in the 1 st auxiliary storage unit to the mixing and discharging unit, a 2 nd auxiliary storage unit for supplying the 2 nd liquid supplied from the 2 nd liquid supply unit to the one or more substrate processing units, a mixing and discharging unit for guiding the mixed liquid to the main storage unit, a1 st auxiliary storage unit for connecting the 1 st liquid supply unit to the 1 st liquid supply unit, a1 st supply unit for supplying the 1 st liquid stored in the 1 st auxiliary storage unit to the mixing and discharging unit, a 2 nd auxiliary storage unit for connecting the 2 nd liquid supply unit to the 2 nd liquid supply unit, and a 2 nd auxiliary storage unit for discharging the 2 nd liquid stored in the 2 nd liquid supply unit to the mixing and discharging unit.
A substrate processing apparatus according to another aspect of the present invention includes the processing liquid supply device and the one or more substrate processing units.
According to another aspect of the present invention, a process liquid supply method for supplying a mixed liquid including a 1 st liquid and a 2 nd liquid as a process liquid to one or more substrate processing units includes a step of supplying the 1 st liquid and the 2 nd liquid to a mixing/discharging unit using a 1 st circulation device and a 2 nd circulation device, a step of mixing the 1 st liquid and the 2 nd liquid supplied by the 1 st circulation device and the 2 nd circulation device in the mixing/discharging unit and guiding the mixed liquid to a main storage tank, and a step of supplying the mixed liquid stored in the main storage tank as the process liquid to the one or more substrate processing units, wherein the 1 st circulation device has a 1 st circulation system connected to a 1 st liquid supply source, and the 2 nd circulation device has a 2 nd circulation system connected to a 2 nd liquid supply source.
According to another aspect of the present invention, a process liquid supply method for supplying a mixed liquid including a1 st liquid and a2 nd liquid as a process liquid to one or more substrate processing units includes a step of mixing the 1 st liquid and the 2 nd liquid in the mixed lead-out unit and guiding the mixed liquid to a main tank from a1 st sub-tank connected to a1 st liquid supply source and storing the 1 st liquid supplied from the 1 st liquid supply source in a predetermined amount, a step of supplying the 2 nd liquid and the 1 st liquid to a mixed lead-out unit as the process liquid to the one or more substrate processing units from a2 nd sub-tank connected to a2 nd liquid supply source and storing the 2 nd liquid supplied from the 2 nd liquid supply source in a predetermined amount, and a step of mixing the 1 st liquid and the 2 nd liquid in the mixed lead-out unit and guiding the mixed liquid to the main tank.
According to the present invention, the high-quality processing liquid generated under predetermined conditions without discarding the low-quality processing liquid can be stably supplied to one or more substrate processing units.
Drawings
Fig. 1 is a schematic configuration diagram of a substrate processing apparatus according to embodiment 1.
Fig. 2 is a timing chart for explaining an example of the operation of the substrate processing apparatus of fig. 1.
Fig. 3 is a block diagram showing the configuration of a control system of the substrate processing apparatus of fig. 1.
Fig. 4 is a flowchart of the processing liquid generation processing performed by the control unit.
Fig. 5 is a schematic configuration diagram of a substrate processing apparatus according to embodiment 2.
Fig. 6 is a schematic configuration diagram of a substrate processing apparatus according to embodiment 3.
Fig. 7 is a block diagram showing an example of the structure of a substrate processing apparatus according to another embodiment.
Detailed Description
A processing liquid supply device, a substrate processing apparatus, and a substrate processing method according to an embodiment of the present invention will be described below with reference to the accompanying drawings. In the following description, the substrate refers to a substrate for FPD (Flat Panel Display), a semiconductor substrate, a substrate for an optical disk, a substrate for a magnetic disk, a substrate for a magneto-optical disk, a substrate for a photomask, a substrate for a ceramic substrate, a substrate for a solar cell, or the like used in a liquid crystal display device, an organic EL (Electro Luminescence) display device, or the like.
1. Embodiment 1
<1> Outline of structure of substrate processing apparatus
Fig. 1 is a schematic configuration diagram of a substrate processing apparatus according to embodiment 1. The substrate processing apparatus 1 mainly includes a processing liquid supply device 2, a substrate processing unit 3, and a control unit 9, and is installed in, for example, a factory. In this factory, a1 st liquid supply source 5 and a2 nd liquid supply source 6 are provided as resource energy devices used in the substrate processing apparatus 1. The 2 nd liquid supply source 6 is a supply source of chemical liquid, and the chemical liquid of the 2 nd liquid supply source 6 of the present embodiment is fluoric acid. The 1 st liquid supply source 5 is a supply source of a diluting liquid for diluting the chemical solution, and the diluting liquid of the 1 st liquid supply source 5 of the present embodiment is deionized water (Deionized Water). In the following description, fluoric acid is expressed as HF and deionized water is expressed as DIW.
The chemical liquid of the 2 nd liquid supply source 6 may be an aqueous solution such as buffered hydrofluoric acid (BHF), diluted hydrofluoric acid (DHF), hydrochloric acid, sulfuric acid, nitric acid, phosphoric acid, acetic acid, oxalic acid, or ammonia water, or a mixed solution thereof, instead of HF. The diluting liquid of the 1 st liquid supply source 5 may be carbonated water, ozone water, magnetic water, functional water, ion water, an organic solvent, or the like instead of DIW.
The 1 st liquid supply source 5 and the 2 nd liquid supply source 6 are connected to the treatment liquid supply device 2. The treatment liquid supply device 2 mixes the DIW supplied from the 1 st liquid supply source 5 and the HF supplied from the 2 nd liquid supply source 6 at a predetermined ratio. In this embodiment, the predetermined mixing ratio between DIW and HF is 100:1. Thus, a mixed solution (diluent) in which HF is diluted with a large amount of DIW is produced. The resultant mixed solution is stored in a main storage tank 30 as a treatment solution. The processing liquid stored in the main storage tank 30 is supplied to the substrate processing section 3.
The treatment liquid supply apparatus 2 according to the present embodiment has a plurality of structures for generating a high-quality treatment liquid without discarding a low-quality treatment liquid. Details of the structure and operation of the treatment liquid supply device 2 will be described later.
The substrate processing section 3 includes a plurality of processing units 4. Each processing unit 4 is provided with a spin chuck 4a, a nozzle 4b, and a cup holder 4c. The spin chuck 4a is configured to hold a substrate W to be processed. The spin chuck 4a is driven to rotate by a driving device (e.g., an electric motor), not shown, while holding the substrate W. Thereby, the substrate W held by the spin chuck 4a rotates.
The nozzle 4b ejects the processing liquid supplied from the processing liquid supply device 2 to the substrate processing apparatus 1 onto the substrate W held and rotated by the spin chuck 4 a. Thereby, the surface (upper surface in this example) of the substrate W is processed. The cup 4c is configured to surround the substrate W held by the spin chuck 4a, and to receive the processing liquid thrown out of the substrate W during processing of the substrate W. A part of the treatment liquid received by the receiving cup 4c is returned to the treatment liquid supply device 2 through a recovery pipe p33 described later.
The control unit 9 controls the operations of the processing liquid supply device 2 and the substrate processing unit 3. Details of the control unit 9 will be described later.
<2> Structure of treatment liquid supply device 2
As shown in fig. 1, the treatment liquid supply device 2 mainly includes a1 st circulation device 110, a2 nd circulation device 120, a mixing and discharging unit 130, and a liquid supply unit 140. The 1 st circulation device 110 includes a1 st sub tank 10, a plurality of (three in this example) valves 11, 15, 16, a pump 12, a flow meter 13, an adjusting unit 14, a supply source pipe p11, a pressurization and transportation pipe p12, and a circulation pipe p13.
The upstream end of the supply pipe p11 is connected to the 1 st liquid supply source 5. The downstream end of the supply pipe p11 is disposed in the 1 st sub tank 10. The supply source pipe p11 is provided with a valve 11.
As described above, the 1 st liquid supply source 5 is a resource energy device, and holds DIW to which a predetermined pressure is applied. The valve 11 is opened and closed under the control of the control unit 9. When the valve 11 is closed, the flow of DIW in the supply pipe p11 is shut off. On the other hand, when the valve 11 is in the open state, DIW is supplied from the 1 st liquid supply source 5 to the 1 st sub tank 10 through the supply source pipe p 11. The supplied DIW is stored in the 1 st sub-tank 10.
The capacity of the 1 st auxiliary reservoir 10 is smaller than that of the main reservoir 30 described later, for example, about 20l to 50 l. A liquid level sensor LS1 is attached to the 1 st sub tank 10. The liquid level sensor LS1 detects the liquid level (liquid level) of DIW stored in the 1 st sub tank 10.
An upstream end of the pressurized transport pipe p12 is connected to the bottom of the 1 st sub tank 10. The pump 12, the flowmeter 13, and the regulator 14 are disposed in this order on the pressurized delivery pipe p12 from the upstream end toward the downstream end.
The pump 12 sucks the DIW stored in the 1 st sub tank 10, and pressurizes and feeds the sucked DIW to the downstream end of the pressurizing and feeding pipe p 12. The flowmeter 13 detects the amount of DIW flowing through the pressurized delivery pipe p12 per unit time as a flow rate. The adjusting unit 14 includes a flow rate adjuster such as a regulator (regulator) or an electric needle valve, and adjusts the flow rate of DIW flowing through the pressurized delivery pipe p12 based on the detection result of the flowmeter 13.
The flow rate adjuster provided in the adjusting unit 14 is selected according to, for example, the flow rate level of DIW to be supplied to the mixing/deriving unit 130 at the time of generating the processing liquid and the accuracy of the flow rate required. In this example, when the processing liquid is generated, it is necessary to supply DIW to the mixing/discharging unit 130 at a relatively large flow rate, and a regulator is used.
A circulation pipe p13 is provided so as to connect the 1 st sub tank 10 to the downstream end of the pressurization and transportation pipe p 12. The circulation pipe p13 is provided with a valve 15. The downstream end of the pressurization/delivery pipe p12 is further connected to the upstream end of the supply pipe p 14. The supply pipe p14 extends from the downstream end of the pressurization/delivery pipe p12 to the mixing/delivery unit 130. The supply pipe p14 is provided with a valve 16.
The valve 15 allows the circulation of DIW in the circulation pipe p13 when in the open state, and cuts off the circulation of DIW in the circulation pipe p13 when in the closed state. The valve 16 allows the flow of DIW in the supply pipe p14 when in the open state, and cuts off the flow of DIW in the supply pipe p14 when in the closed state.
In the 1 st circulation device 110, for example, in a state where a predetermined amount of DIW is stored in the 1 st sub-tank 10, the valve 15 is opened and the valve 16 is closed. The pump 12 is operated, and the adjusting unit 14 adjusts the flow rate of DIW flowing through the pressurized delivery pipe p 12. Thus, the DIW stored in the 1 st sub tank 10 circulates through the pressurization and transportation pipe p12 and the circulation pipe p13 (see an arrow a11 of a thick single-dot chain line in fig. 1).
As described above, in the 1 st circulation device 110, the 1 st sub tank 10, the pressurized transport pipe p12, the pump 12, the flow meter 13, the adjusting unit 14, the circulation pipe p13, and the valve 15 form a 1 st circulation system for circulating DIW. The operation mode of the 1 st circulation device 110 at this time is referred to as a 1 st liquid circulation mode.
In the 1 st circulation device 110, for example, in a state where a predetermined amount of DIW is stored in the 1 st sub-tank 10, the valve 15 is closed and the valve 16 is opened. The pump 12 is operated, and the adjusting unit 14 adjusts the flow rate of DIW flowing through the pressurized delivery pipe p 12. Thus, the DIW stored in the 1 st sub tank 10 is transported to the mixing/discharging unit 130 through the supply pipe p14 at the flow rate adjusted by the adjusting unit 14 (see arrow a12 of the thick broken line in fig. 1). The operation mode of the 1 st circulation device 110 at this time is referred to as a1 st liquid supply mode.
The 2 nd circulation device 120 includes a2 nd sub-tank 20, a plurality of (three in this example) valves 21, 25, 26, a pump 22, a flow meter 23, an adjusting portion 24, a supply source pipe p21, a pressurization and transportation pipe p22, and a circulation pipe p23.
The upstream end of the supply pipe p21 is connected to the 2 nd liquid supply source 6. The downstream end of the supply pipe p21 is disposed in the 2 nd sub-tank 20. The supply source pipe p21 is provided with a valve 21.
As described above, the 2 nd liquid supply source 6 is a resource energy device, and holds HF to which a predetermined pressure is applied. The valve 21 is opened and closed under the control of the control unit 9. When the valve 21 is closed, the flow of HF in the supply pipe p21 is shut off. On the other hand, when the valve 21 is in the open state, HF is supplied from the 2 nd liquid supply source 6 to the 2 nd sub-tank 20 through the supply source pipe p 21. The supplied HF is stored in the sub-tank 20 of the 2 nd order.
The capacity of the 2 nd sub-tank 20 is smaller than the capacity of the 1 st sub-tank 10, which is, for example, about 5l to 20l, as with the main tank 30 described later. A liquid level sensor LS2 is attached to the sub tank 20 of the 2 nd stage. The liquid level sensor LS2 detects the liquid level (liquid level) of HF stored in the 2 nd sub-tank 20.
An upstream end of the pressurized transport pipe p22 is connected to the bottom of the 2 nd sub-tank 20. The pump 22, the flowmeter 23, and the adjusting unit 24 are disposed in this order on the pressurized delivery pipe p22 from the upstream end toward the downstream end.
The pump 22 sucks the HF stored in the 2 nd sub-tank 20, and pressurizes and feeds the sucked HF to the downstream end of the pressurized feed pipe p 22. The flow meter 23 detects the amount of HF flowing through the pressurized transport pipe p22 per unit time as a flow rate. The adjusting unit 24 includes a flow rate adjuster such as an electric needle valve or a regulator, for example, and adjusts the flow rate of HF flowing through the pressurized delivery pipe p22 based on the detection result of the flowmeter 23.
The flow rate adjuster provided in the adjusting unit 24 is selected according to, for example, the flow rate level of HF to be supplied to the mixing/deriving unit 130 at the time of generating the processing liquid and the accuracy of the required flow rate. In this example, when the processing liquid is generated, it is necessary to supply HF to the mixing/discharging unit 130 at a relatively small flow rate and with high accuracy, and an electric needle valve is used.
A circulation pipe p23 is provided so as to connect the 2 nd sub-tank 20 to the downstream end of the pressurization and transportation pipe p 22. The circulation pipe p23 is provided with a valve 25. The downstream end of the pressurization/delivery pipe p22 is further connected to the upstream end of the supply pipe p 24. The supply pipe p24 extends from the downstream end of the pressurization/delivery pipe p22 to the mixing/delivery unit 130. The supply pipe p24 is provided with a valve 26.
The valve 25 allows the flow of HF in the circulation pipe p23 when in the open state, and cuts off the flow of HF in the circulation pipe p23 when in the closed state. The valve 26 allows the flow of HF in the supply pipe p24 when in the open state, and cuts off the flow of HF in the supply pipe p24 when in the closed state.
In the 2 nd circulation device 120, for example, in a state where a predetermined amount of HF is stored in the 2 nd sub-tank 20, the valve 25 is set to an open state and the valve 26 is set to a closed state. The pump 22 is operated, and the adjusting unit 24 adjusts the flow rate of HF flowing through the pressurized delivery pipe p 22. Thereby, the HF stored in the 2 nd sub-tank 20 circulates through the pressurizing and transporting pipe p22 and the circulating pipe p23 (see an arrow a21 of a thick one-dot chain line in fig. 1).
As described above, in the 2 nd circulation device 120, the 2 nd sub-tank 20, the pressurized transport pipe p22, the pump 22, the flow meter 23, the adjustment unit 24, the circulation pipe p23, and the valve 25 form a2 nd circulation system for circulating HF. The operation mode of the 2 nd circulation device 120 at this time is referred to as a2 nd liquid circulation mode.
In the 2 nd circulation device 120, for example, in a state where a predetermined amount of HF is stored in the 2 nd sub-tank 20, the valve 25 is set to a closed state and the valve 26 is set to an open state. The pump 22 is operated, and the adjusting unit 24 adjusts the flow rate of HF flowing through the pressurized delivery pipe p 22. Thereby, the HF stored in the 2 nd sub-tank 20 is supplied to the mixing/discharging unit 130 through the supply pipe p24 at the flow rate adjusted by the adjusting unit 24 (see an arrow a22 of a thick broken line in fig. 1). The operation mode of the 2 nd circulation device 120 at this time is referred to as a2 nd liquid supply mode.
The mixing derivation section 130 includes a mixing pipe p31. The mixing pipe p31 in this example is a single pipe. The upstream end of the mixing pipe p31 is connected to the downstream end of the supply pipe p14 of the 1 st circulation device 110 and the downstream end of the supply pipe p24 of the 2 nd circulation device 120. The downstream end of the mixing pipe p31 is disposed in a main reservoir 30 of the liquid supply portion 140, which will be described later. Thus, when the 1 st circulation device 110 is in the 1 st liquid supply mode and the 2 nd circulation device 120 is in the 2 nd liquid supply mode, DIW and HF are mixed in the mixing pipe p31 and guided to the main tank 30 of the liquid supply unit 140.
At this time, in the mixing pipe p31, DIW and HF are mixed at a ratio of a flow rate of DIW supplied to the mixing pipe p31 to a flow rate of HF supplied to the mixing pipe p 31. In order to more uniformly mix the DIW and HF supplied from the 1 st circulation device 110 and the 2 nd circulation device 120, a member for stirring the liquid flowing through the mixing pipe p31 may be provided inside the mixing pipe p 31.
The liquid supply unit 140 includes a main reservoir 30, a pump 31, a heater 32, a filter 33, a supply pipe p32, and a recovery pipe p33. As described above, the downstream end of the mixing pipe p31 of the 1 st sub tank 10 is disposed in the main tank 30. Thus, the mixed liquid of DIW and HF flowing through the mixing pipe p31 is guided into the main storage tank 30, and is stored as a processing liquid for processing the substrate W in the substrate processing section 3. The capacity of the main storage tank 30 is, for example, about 20l to 100 l. A liquid level sensor LS3 is attached to the main reservoir 30. The liquid level sensor LS3 detects the liquid level (liquid level) of the processing liquid stored in the main storage tank 30.
An upstream end of the supply pipe p32 is connected to the bottom of the main reservoir 30. The pump 31, the heater 32, and the filter 33 are disposed in this order on the supply pipe p32 from the upstream end toward the downstream end. The downstream end of the supply pipe p32 is connected to the substrate processing unit 3.
The pump 31 sucks the treatment liquid stored in the main storage tank 30, and pressurizes and feeds the sucked treatment liquid to the downstream end of the supply pipe p 32. The heater 32 heats the processing liquid flowing through the supply pipe p32 so as to approach a predetermined temperature. The filter 33 filters the treatment liquid to remove impurities, precipitates, and the like from the treatment liquid. Thereby, the processing liquid stored in the main storage tank 30 is heated, filtered, and supplied to the substrate processing section 3. In the substrate processing section 3, the processing liquid supplied from the processing liquid supply device 2 is supplied to the nozzles 4b of the plurality of processing units 4, respectively.
The upstream end of the recovery pipe p33 is connected to the substrate processing unit 3. The downstream end of the recovery pipe p33 is disposed in the main storage tank 30. In the substrate processing section 3, a part of the processing liquid received by the respective receiving cups 4c of the plurality of processing units 4 is guided to the upstream end of the recovery pipe p 33. As a result, as described above, a part of the processing liquid used in the plurality of processing units 4 is recovered into the main storage tank 30 through the recovery pipe p 33.
The remaining processing liquid, which is not collected in the main storage tank 30, out of the processing liquid supplied from the main storage tank 30 to the substrate processing section 3 is sent to a liquid discharge device, not shown. Therefore, if the state in which the new processing liquid is not supplied to the main tank 30 continues, the liquid level of the processing liquid stored in the main tank 30 drops every time the substrate processing is performed in each portion of the substrate processing section 3.
In the present embodiment, whether or not to replenish the main tank 30 with new processing liquid is determined based on the liquid level of the processing liquid detected by the liquid level sensor LS3 and two liquid levels preset for the main tank 30.
The two liquid surface levels preset for the main reservoir 30 are the lower limit level L1 and the predetermined level L2. The lower limit level L1 is a liquid surface level corresponding to the minimum required amount of the processing liquid in order to supply the processing liquid to the substrate processing unit 3. On the other hand, the predetermined level L2 is a liquid surface level higher than the lower limit level L1. More specifically, the predetermined level L2 is a liquid surface level corresponding to an amount of the processing liquid which is considered to be sufficient for supplying the processing liquid to the substrate processing section 3, and to an amount of the processing liquid which is considered not to overflow from the main tank 30.
<3> Operation of substrate processing apparatus 1
Fig. 2 is a timing chart for explaining an example of the operation of the substrate processing apparatus 1 of fig. 1. Here, the operation of generating the treatment liquid in the treatment liquid supply device 2 and replenishing the treatment liquid to the main reservoir tank 30 will be mainly described.
At the left end of fig. 2, 11 items relating to the states of the respective parts of the substrate processing apparatus 1 are shown. The 11 items are "substrate processing", "main tank liquid level", "pump 12 for DIW", "pump 22 for HF", "flow rate of DIW", "flow rate of HF", "circulation side valve 15 of DIW", "supply side valve 16 of DIW", "circulation side valve 25 of HF" and "supply side valve 26 of HF", which are arranged in this order in the longitudinal direction from the uppermost layer (layer 1) toward the lowermost layer (layer 11).
To the right of the above 11 items, changes in states corresponding to these items are shown in time series using a common time axis. To the right of the item "substrate processing" in layer 1, it is shown whether the substrate processing section 3 is in an operating state, that is, whether the substrate processing section 3 is performing substrate processing. To the right of item "main reservoir liquid level" in layer 2, it is shown whether the liquid level detected by the liquid level sensor LS3 in fig. 1 is higher than the lower limit level L1 or lower than the lower limit level L1. To the right of item "main tank liquid level" in layer 3, it is shown whether the liquid level detected by the liquid level sensor LS3 in fig. 1 is equal to or higher than the predetermined level L2 or lower than the predetermined level L2.
To the right of item "pump 12 for DIW" in layer 4, it is shown whether the pump 12 of fig. 1 is in an active state or in a stopped state. To the right of item "pump 22 for HF" in layer 5, it is shown whether the pump 22 of fig. 1 is in an active state or in a stopped state.
In the treatment liquid supply apparatus 2 of the present embodiment, in order to mix DIW and HF at a predetermined ratio, the range of the ideal flow rate of DIW to be flowed in the 1 st circulation system of the 1 st circulation apparatus 110 is determined as the 1 st flow rate range. In addition, the range of the ideal flow rate of HF that should flow in the 2 nd circulation system of the 2 nd circulation device 120 is determined as the 2 nd flow rate range.
To the right of the item "flow rate of DIW" in layer 6, it is shown whether the flow rate of DIW (flow rate of DIW flowing in the 1 st circulation system) detected by the flow meter 13 is within the 1 st flow rate range. To the right of item "flow rate of HF" of layer 7, it is shown whether the flow rate of HF (flow rate of HF flowing in the 2 nd circulation system) detected by the flow meter 23 is within the 2 nd flow rate range
To the right of the "circulation side valve 15 of DIW" of layer 8, it is shown whether the valve 15 of fig. 1 is in an open state or in a closed state. To the right of the "supply side valve 16 of DIW" of layer 9, it is shown whether the valve 16 of fig. 1 is in an open state or in a closed state. To the right of the "HF circulation side valve 25" of layer 10, it is shown whether the valve 25 of fig. 1 is in an open state or in a closed state. To the right of the "HF supply side valve 26" of layer 11, it is shown whether the valve 26 of fig. 1 is in an open state or in a closed state.
In this example, the valve 11 of the 1 st circulation device 110 is set to be switched between an open state and a closed state based on the detection result of the liquid level sensor LS1, so that a predetermined amount of DIW is always stored in the 1 st sub storage tank 10. The valve 21 of the 2 nd circulation device 120 is switched between an open state and a closed state based on the detection result of the liquid level sensor LS2, so that a predetermined amount of HF is always stored in the 2 nd sub-storage tank 20.
First, in the initial state (time point t 0), the substrate processing section 3 is in a stopped state. The liquid surface level of the processing liquid stored in the main storage tank 30 is higher than the lower limit level L1 and lower than the predetermined level L2. In addition, the pumps 12 and 22 in fig. 1 are stopped, and the flow rate of DIW flowing through the 1 st circulation system is out of the 1 st flow rate range (specifically, 0), and the flow rate of HF flowing through the 2 nd circulation system is out of the 2 nd flow rate range (specifically, 0). The valves 15 and 25 in fig. 1 are opened, and the valves 16 and 26 in fig. 1 are closed.
At time t1, the substrate processing section 3 is switched from the stopped state to the operating state, and the substrate processing is started in the plurality of processing units 4 of the substrate processing section 3. Thereby, the processing liquid stored in the main storage tank 30 of the processing liquid supply device 2 is supplied to the substrate processing section 3. By continuing the processing of the substrate W in the substrate processing section 3, the liquid level of the processing liquid in the main storage tank 30 is lowered.
At time t2, the liquid surface level of the treatment liquid in the main tank 30 is equal to or lower than the lower limit level L1. Thus, at time t3, pumps 12 and 22 in fig. 1 are switched from the stopped state to the operating state. At this time, in the 1 st circulation device 110, the valve 15 is in an open state and the valve 16 is in a closed state. Thus, the DIW pressure-fed by the pump 12 in the pressure-feed pipe p12 is returned to the 1 st sub tank 10 through the circulation pipe p 13. That is, in the 1 st circulation device 110, DIW circulates in the 1 st circulation system.
In the 2 nd circulation device 120, the valve 25 is in an open state and the valve 26 is in a closed state. Thereby, the HF pressurized and fed by the pump 22 in the pressurized feed pipe p22 is returned to the 2 nd sub-tank 20 through the circulation pipe p 23. That is, in the 2 nd circulation device 120, HF circulates in the 2 nd circulation system.
Immediately after the time point t3, the operation state of the pumps 12, 22 is unstable. In addition, in the 1 st circulation system, the flow rate of DIW passing through the adjusting unit 14 is also unstable. In addition, the flow rate of HF passing through the regulator 24 in the 2 nd circulation system is also unstable.
At time t4 when a certain time has elapsed from time t3, the operation states of pumps 12 and 22 are stabilized, and the flow rate of DIW through adjustment unit 14 and the flow rate of HF through adjustment unit 24 are stabilized. Thus, the flow rate of DIW flowing through the 1 st circulation system falls within the 1 st flow rate range, and the flow rate of HF flowing through the 2 nd circulation system falls within the 2 nd flow rate range.
Thereafter, at time t5, valve 15 of the 1 st circulation device 110 is closed and valve 16 is opened. Thus, DIW in the 1 st sub tank 10 is fed to the mixing and guiding unit 130 at a predetermined flow rate (flow rate within the 1 st flow rate range). In addition, the valve 25 of the 2 nd circulation device 120 is closed, and the valve 26 is opened. Thereby, the HF in the 2 nd sub-tank 20 is supplied to the mixing and leading-out unit 130 at a predetermined flow rate (flow rate within the 2 nd flow rate range).
In the mixing/discharging unit 130, DIW and HF supplied from the 1 st circulation device 110 and the 2 nd circulation device 120 are mixed, and the resultant mixed solution is guided as a treatment solution to the main tank 30 of the liquid supply unit 140. In this way, new treatment liquid is sequentially added to the main reservoir 30. Thus, the liquid level of the treatment liquid in the main reservoir 30 increases, and exceeds the lower limit level at time t 6.
At time t7, the substrate processing unit 3 is switched from the active state to the inactive state in a state where a new processing liquid is added to the main tank 30. Thereby, the supply of the processing liquid from the main reservoir 30 of the processing liquid supply device 2 to the substrate processing section 3 is stopped.
Then, by further adding a new treatment liquid to the main tank 30, the liquid surface level of the treatment liquid in the main tank 30 reaches a predetermined level at time t 8. Then, in order to prevent the treatment liquid from leaking from the main reservoir 30, the pumps 12 and 22 are switched from the active state to the inactive state at time t 9. This stops the supply of DIW and HF from the 1 st circulation device 110 and the 2 nd circulation device 120 to the mixing/discharging unit 130. At time t10, the flow rate of DIW flowing through the 1 st circulation system is out of the 1 st flow rate range (specifically, 0), and the flow rate of HF flowing through the 2 nd circulation system is out of the 2 nd flow rate range (specifically, 0). In this way, the replenishment of the main tank 30 with the new treatment liquid is stopped.
Thereafter, in preparation for replenishing the main tank 30 with a new treatment liquid again, at time t11, the valve 15 of the 1 st circulation device 110 is opened and the valve 16 is closed. In addition, the valve 25 of the 2 nd circulation device 120 is opened, and the valve 26 is closed.
<4> Control System for substrate processing apparatus
The control system of the substrate processing apparatus 1 will be described together with the configuration of the control unit 9 in fig. 1. Fig. 3 is a block diagram showing the configuration of a control system of the substrate processing apparatus 1 shown in fig. 1. As shown in fig. 3, the control unit 9 includes a CPU (central processing unit) 91, a RAM (random access memory) 92, a ROM (read only memory) 93, and a storage device 94.
The RAM92 serves as a work area of the CPU 91. A system program is stored in the ROM 93. The storage device 94 includes a storage medium such as a hard disk or a semiconductor memory, and stores a substrate processing program for performing substrate processing and a processing liquid generating program for generating a processing liquid. The storage device 94 stores the processing liquid conditions set in association with the generation of the processing liquid and the replenishment of the main tank 30 with the processing liquid. The treatment liquid conditions include the liquid production conditions described below in addition to the lower limit level L1, the predetermined level L2, the 1 st flow rate range, and the 2 nd flow rate range.
The substrate processing program and the processing liquid generating program are provided in a state of being stored in a recording medium such as a CD-ROM95, and may be mounted on the ROM93 or the storage device 94. Alternatively, the substrate processing program and the processing liquid generating program may be transmitted from an external server of the substrate processing apparatus 1 via a communication network and installed in the ROM93 or the storage device 94.
The CPU91 executes a substrate processing program to supply a necessary amount of processing liquid from the processing liquid supply device 2 to the substrate processing section 3. The operations of the respective parts of the substrate processing section 3 are controlled, and the substrate processing is performed in the plurality of processing units 4.
On the other hand, the CPU91 executes the processing liquid generating program, and the operations of the respective parts of the substrate processing apparatus 1, mainly the processing liquid supply apparatus 2, are controlled. Specifically, the control unit 9 controls the open/close state of the valve 11 based on the detection result of the liquid level sensor LS1 so that a certain amount of DIW is stored in the 1 st sub storage tank 10. The control unit 9 determines the flow state of DIW in the 1 st circulation system based on the detection result of the flowmeter 13. In the present embodiment, the flow state includes the flow rate of DIW flowing through the 1 st circulation system. At this time, the control unit 9 may control the adjustment unit 14 based on the detection result of the flowmeter 13.
When circulating DIW in the 1 st circulation device 110, the control unit 9 operates the pump 12, sets the valve 15 to an open state, and sets the valve 16 to a closed state (1 st liquid circulation mode). When DIW is supplied from the 1 st circulation device 110 to the mixing and discharging unit 130, the control unit 9 operates the pump 12, closes the valve 15, and opens the valve 16 (1 st liquid supply mode).
The control unit 9 controls the open/close state of the valve 21 based on the detection result of the liquid level sensor LS2 so that a certain amount of HF is stored in the sub-tank 20 No. 2. The control unit 9 determines the flow state of HF in the 2 nd circulation system based on the detection result of the flowmeter 23. In the present embodiment, the flow state includes the magnitude of the flow rate of HF flowing in the 2 nd circulation system. At this time, the control unit 9 may control the adjustment unit 24 based on the detection result of the flowmeter 23.
When HF is circulated in the 2 nd circulation device 120, the control unit 9 operates the pump 22, sets the valve 25 to an open state, and sets the valve 26 to a closed state (2 nd liquid circulation mode). When HF is supplied from the 2 nd circulation device 120 to the mixing/discharging unit 130, the control unit 9 operates the pump 22, closes the valve 25, and opens the valve 26 (2 nd liquid supply mode).
The control unit 9 determines the amount of the treatment liquid stored in the main storage tank 30 based on the detection result of the liquid level sensor LS 3. The control unit 9 controls the pump 31 to supply a necessary amount of the processing liquid from the processing liquid supply device 2 to the substrate processing unit 3. The control unit 9 controls the heater 32 so that the processing liquid supplied to the substrate processing unit 3 approaches a temperature suitable for substrate processing.
<5> Treatment liquid production treatment
Fig. 4 is a flowchart of the processing liquid generation process performed by the control unit 9. The processing liquid generation processing described below is performed by the CPU91 of the control unit 9 executing the processing liquid generation program stored in the storage device 94 on the RAM 92.
The processing liquid generation process is started by turning on the power supply of the substrate processing apparatus 1, and is repeated every time a predetermined time elapses. When the processing liquid generation process starts, the CPU91 determines whether or not the processing liquid needs to be replenished to the main tank 30 based on the detection result of the liquid level sensor LS3 (step S11).
Specifically, when the liquid level detected by the liquid level sensor LS3 is equal to or lower than the lower limit level L1, the CPU91 determines that the process liquid needs to be replenished to the main tank 30. On the other hand, when the liquid level detected by the liquid level sensor LS3 is higher than the lower limit level L1, the CPU91 determines that the replenishment of the processing liquid to the main tank 30 is not necessary. In the example of fig. 2, CPU91 determines that the treatment liquid needs to be replenished to main tank 30 at time t 2.
When it is determined that the replenishment of the processing liquid is not necessary for the main tank 30, the CPU91 repeats the processing in step S11. On the other hand, when it is determined that the process liquid needs to be replenished to the main tank 30, the CPU91 starts the operations of the 1 st and 2 nd circulation devices 110 and 120 in the 1 st and 2 nd liquid circulation modes, respectively (step S12). In the example of fig. 2, CPU91 starts the operation of the 1 st liquid circulation mode of 1 st circulation device 110 and starts the operation of the 2 nd liquid circulation mode of 2 nd circulation device 120 at time t 3.
Next, the CPU91 judges whether or not a predetermined liquid generation condition is satisfied (step S13). Here, the liquid generating condition is a condition for judging whether or not the flow state of DIW circulating in the 1 st circulation system in the 1 st circulation device 110 and the flow state of HF circulating in the 2 nd circulation system in the 2 nd circulation device 120 are both stable.
In the present embodiment, the liquid generation conditions include that the flow rate of DIW flowing in the 1 st circulation system is within the 1 st flow rate range, and the flow rate of HF flowing in the 2 nd circulation system is within the 2 nd flow rate range. In this case, the CPU91 can determine whether or not the liquid generation condition is satisfied based on the detection results of the flow meters 13, 23. In the example of fig. 2, the CPU91 determines that the liquid generation condition is satisfied at time point t 4.
The liquid generation conditions are not limited to the above examples, and may include a predetermined fixed time (for example, about 5sec to 10 sec) from the start of the operations of the 1 st circulation device 110 and the 2 nd circulation device 120 in the process of step S12. In this case, in the example of fig. 2, CPU91 determines that the liquid generation condition is satisfied when a predetermined time elapses from the start of operation of pumps 12 and 22 at time t 3.
When it is determined that the liquid generation condition is not satisfied, the CPU91 repeats the processing of step S13. On the other hand, when it is determined that the liquid generation condition is satisfied, CPU91 switches the operation modes of 1 st circulation device 110 and 2 nd circulation device 120 to 1 st liquid supply mode and 2 nd liquid supply mode (step S14). In the example of fig. 2, CPU91 switches the operation mode of 1 st circulation device 110 to the 1 st liquid supply mode and switches the operation mode of 2 nd circulation device 120 to the 2 nd liquid supply mode at time t 5.
Next, the CPU91 determines whether or not the liquid level of the processing liquid in the main tank 30 is equal to or higher than a predetermined level L2 based on the detection result of the liquid level sensor LS3 (step S15). When determining that the liquid level is not equal to or higher than the predetermined level L2, the CPU91 repeats the processing of step S15. On the other hand, when the CPU91 determines that the liquid level is equal to or higher than the predetermined level L2, it stops the operations of the 1 st circulation device 110 and the 2 nd circulation device 120 (step S16).
In the example of fig. 2, CPU91 determines that the liquid surface level of the processing liquid in main tank 30 is equal to or higher than predetermined level L2 at time point t 8. Further, at time t9, CPU91 stops the operation of 1 st circulation device 110 and stops the operation of 2 nd circulation device 120 by bringing pumps 12 and 22 into a stopped state.
Thereafter, the CPU91 performs operation preparation in the 1 st liquid circulation mode and the 2 nd liquid circulation mode assuming that new processing liquid is again supplied to the main tank 30 (step S17). Specifically, CPU91 sets valve 15 of fig. 1 to an open state and sets valve 16 of fig. 1 to a closed state, so that DIW circulates in the 1 st circulation system of 1 st circulation device 110 when pump 12 starts to operate. Further, CPU91 sets valve 25 in fig. 1 to an open state and valve 26 in fig. 1 to a closed state, so that HF circulates in the 2 nd circulation system of 2 nd circulation device 120 when pump 22 is operated. In the example of fig. 2, CPU91 switches the open/closed states of valves 15, 16, 25, 26 at time t 11. Thereby, the treatment liquid generation process is ended.
<6> Shell
In the substrate processing apparatus 1 described above, the 1 st circulation device 110, the 2 nd circulation device 120, and the liquid supply portion 140 may be housed in separate housings as indicated by single-dot chain lines in fig. 1. In this case, the mixing and discharging unit 130 may be housed in one housing together with the liquid supply unit 140. By housing the plurality of components constituting the treatment liquid supply device 2 in the plurality of cases in this manner, the degree of freedom in layout is improved when the treatment liquid supply device 2 is installed in a factory.
The treatment liquid supply device 2 may have a structure in which all the components including the 1 st circulation device 110, the 2 nd circulation device 120, the mixing/discharging unit 130, and the liquid supply unit 140 are housed in a common housing.
<7> Effect
(A) In the above-described treatment liquid supply device 2, when the liquid surface level of the treatment liquid stored in the main storage tank 30 becomes equal to or lower than the lower limit level L1, the replenishment of the treatment liquid with respect to the main storage tank 30 is started. When replenishment of the treatment liquid is started, the 1 st circulation device 110 operates in the 1 st liquid circulation mode, and the 2 nd circulation device 120 operates in the 2 nd liquid circulation mode. Thus, the DIW supplied from the 1 st liquid supply source 5 and accumulated in the 1 st sub-accumulation tank 10 flows in the 1 st circulation system. The HF supplied from the 2 nd liquid supply source 6 and accumulated in the 2 nd sub-accumulator 20 flows in the 2 nd circulation system.
The 1 st circulation system of the 1 st circulation device 110 receives the DIW supplied from the 1 st liquid supply source 5 and functions as a buffer flow path for buffering the flow rate, pressure, and other fluctuations of the DIW. Thus, the flow state of DIW in the 1 st circulation system is suppressed from being greatly disturbed.
The 2 nd circulation system of the 2 nd circulation device 120 receives the HF supplied from the 2 nd liquid supply source 6, and functions as a buffer flow path for buffering the fluctuation of the flow rate, pressure, and the like of the HF. Thereby, the flow state of HF in the 2 nd circulation system is suppressed from being greatly disturbed.
Then, when the liquid generation condition is satisfied, the operation mode of the 1 st circulation device 110 is switched to the 1 st liquid supply mode, and the operation mode of the 2 nd circulation device 120 is switched to the 2 nd liquid supply mode. Thus, DIW and HF are properly mixed in a relatively stable state in the mixing/discharging unit 130, and a high-quality processing liquid is produced.
In this case, since the generation of the treatment liquid under unstable conditions is suppressed, a treatment for eliminating the low-quality treatment liquid such as pre-leak is not required. As a result, the high-quality processing liquid generated under predetermined conditions without discarding the low-quality processing liquid can be stably supplied to the substrate processing section 3.
(B) As described above, the liquid generation conditions include that the flow rate of DIW flowing in the 1 st circulation system is within the 1 st flow rate range, and the flow rate of HF flowing in the 2 nd circulation system is within the 2 nd flow rate range. In this case, the flow rate of DIW and the flow rate of HF supplied to the mixing derivation unit 130 are adjusted with high accuracy. Therefore, DIW and HF constituting the processing liquid can be mixed with high accuracy at a predetermined mixing ratio.
(C) In the treatment liquid supply apparatus 2 of the present embodiment, the 1 st circulation device 110 and the 2 nd circulation device 120 are provided with adjustment portions 14 and 24 for adjusting the flow rate of the treatment liquid flowing through the circulation systems, respectively. Therefore, DIW and HF constituting the processing liquid can be mixed with high accuracy at a predetermined mixing ratio.
(D) In the treatment liquid supply apparatus 2 of the present embodiment, the 1 st circulation device 110 and the 2 nd circulation device 120 are provided with flow meters 13 and 23 for detecting the flow rate of the treatment liquid flowing through the respective circulation systems, respectively.
This enables the flow rate of DIW flowing through the 1 st circulation system to be adjusted based on the detection result of the flowmeter 13. In addition, the flow rate of HF flowing in the 2 nd circulation system can be adjusted based on the detection result of the flow meter 23. The timing of supplying DIW and HF from the 1 st circulation device 110 and the 2 nd circulation device 120 to the mixing/discharging unit 130 can be appropriately determined based on the flow states of the liquids flowing in the 1 st circulation system and the 2 nd circulation system, respectively.
(E) The 1 st circulation device 110 and the 2 nd circulation device 120 described above are provided with the 1 st sub tank 10 and the 2 nd sub tank 20, respectively. In this case, the 1 st sub tank 10 functions as a buffer tank (buffer vessel) for buffering fluctuations in the flow rate, pressure, and the like of DIW supplied from the 1 st liquid supply source 5 to the 1 st circulation system. This suppresses occurrence of a large disturbance in the state of DIW flowing in the 1 st circulation system due to supply of DIW from the 1 st liquid supply source 5 to the 1 st circulation system.
The 2 nd sub-tank 20 functions as a buffer tank (buffer vessel) for buffering the fluctuation of the flow rate, pressure, and the like of HF supplied from the 2 nd liquid supply source 6 to the 2 nd circulation system. This suppresses occurrence of a large disturbance in the state of HF flowing through the 2 nd circulation system due to the supply of HF from the 2 nd liquid supply source 6 to the 2 nd circulation system.
2. Embodiment 2
The substrate processing apparatus according to embodiment 2 is different from the substrate processing apparatus 1 according to embodiment 1 in the following description. Fig. 5 is a schematic configuration diagram of a substrate processing apparatus according to embodiment 2.
As shown in fig. 5, in the 1 st circulation device 110 of the present embodiment, a heater 17 and a filter 18 are provided in addition to the pump 12, the flowmeter 13, and the adjusting unit 14 in the pressurized conveyance pipe p 12. The 1 st sub tank 10 is provided with a temperature sensor TS1 for detecting the temperature of the DIW stored in the 1 st sub tank 10.
According to this configuration, when the 1 st circulation device 110 operates in the 1 st liquid circulation mode, the temperature of the DIW flowing through the 1 st circulation system can be adjusted to a desired temperature by controlling the heater 17 based on the detection result of the temperature sensor TS 1.
In addition, the 2 nd circulation device 120 of the present embodiment is provided with a heater 27 and a filter 28 in addition to the pump 22, the flowmeter 23, and the adjusting unit 24 in the pressurized conveyance pipe p 22. The 2 nd sub-tank 20 is provided with a temperature sensor TS2 for detecting the temperature of HF stored in the 2 nd sub-tank 20.
According to this configuration, when the 2 nd circulation device 120 operates in the 2 nd liquid circulation mode, the temperature of HF flowing through the 2 nd circulation system can be adjusted to a desired temperature by controlling the heater 27 based on the detection result of the temperature sensor TS 2.
In the present embodiment, the flow state includes the flow rate and the temperature of DIW flowing in the 1 st circulation system and the flow rate and the temperature of HF flowing in the 2 nd circulation system. In the present embodiment, the liquid generating conditions include that the flow rate of DIW flowing in the 1 st circulation system is within the 1 st flow rate range, the temperature of DIW flowing in the 1 st circulation system is within the 1 st temperature range, the flow rate of HF flowing in the 2 nd circulation system is within the 2 nd flow rate range, and the temperature of HF flowing in the 2 nd circulation system is within the 2 nd temperature range.
In this case, the CPU91 can determine whether or not the liquid generation condition is satisfied based on the detection results of the flow meters 13, 23 and the detection results of the temperature sensors TS1, TS 2. Specifically, the CPU91 can determine whether or not the flow rate of DIW flowing in the 1 st circulation system is within the 1 st flow rate range and the flow rate of HF flowing in the 2 nd circulation system is within the 2 nd flow rate range based on the detection results of the flow meters 13, 23. Further, the CPU91 can determine whether or not the temperature of DIW flowing in the 1 st circulation system is within the 1 st temperature range and the temperature of HF flowing in the 2 nd circulation system is within the 2 nd temperature range based on the detection results of the temperature sensors TS1, TS 2. Thus, the processing liquid having a desired temperature can be generated in the mixing/discharging unit 130 under a stable temperature condition.
3. Embodiment 3
Regarding the substrate processing apparatus according to embodiment 3, the differences from the substrate processing apparatus 1 according to embodiment 1 will be described. Fig. 6 is a schematic configuration diagram of a substrate processing apparatus according to embodiment 3.
As shown in fig. 6, the substrate processing apparatus 1 of the present embodiment includes a 1 st supply apparatus 150 and a2 nd supply apparatus 160 in place of the 1 st circulation apparatus 110 and the 2 nd circulation apparatus 120 of fig. 1.
The 1 st supply device 150 has a structure in which the circulation pipe p13 and the valve 15 in the 1 st circulation device 110 in fig. 1 are removed. Therefore, the 1 st supply device 150 of fig. 6 does not have a 1 st circulation system for circulating DIW.
The 2 nd supply device 160 has a structure in which the circulation pipe p23 and the valve 25 in the 2 nd circulation device 120 in fig. 1 are removed. Therefore, the 2 nd supply device 160 of fig. 6 does not have a 2 nd circulation system for circulating HF.
In this case as well, the 1 st supply device 150 of the substrate processing apparatus 1 of the present embodiment includes the 1 st sub-tank 10. In this case, the 1 st sub tank 10 functions as a buffer tank (buffer vessel) for buffering fluctuations in the flow rate, pressure, and the like of the DIW supplied from the 1 st liquid supply source 5. As a result, the DIW supplied to the mixing/discharging unit 130 is prevented from being greatly disturbed, compared with the case where the DIW is directly supplied from the 1 st liquid supply source 5 to the mixing/discharging unit 130.
The 2 nd supply device 160 of the substrate processing apparatus 1 according to the present embodiment includes the 2 nd sub-tank 20. In this case, the 2 nd sub-tank 20 functions as a buffer tank (buffer vessel) for buffering the fluctuation of the flow rate, pressure, and the like of the HF supplied from the 2 nd liquid supply source 6. This suppresses occurrence of a large disturbance in the state of HF fed to the mixing/discharging unit 130, as compared with the case where HF is fed directly from the 2 nd liquid supply source 6 to the mixing/discharging unit 130.
As described above, in the present embodiment, the 1 st sub tank 10 is included in the DIW flow path connecting the 1 st liquid supply source 5 and the mixing and discharging unit 130. The 2 nd secondary reservoir tank 20 is included in the flow path of HF connecting the 2 nd liquid supply source 6 to the mixing/discharging unit 130. Thus, since the generation of the treatment liquid under unstable conditions is suppressed, a treatment for eliminating a low-quality treatment liquid such as pre-bleeding is not required. As a result, the high-quality processing liquid generated under predetermined conditions without discarding the low-quality processing liquid can be stably supplied to the one or more substrate processing units 3.
The 1 st supply device 150 and the 2 nd supply device 160 are not configured to be operable in a plurality of operation modes as the 1 st circulation device 110 and the 2 nd circulation device 120 in fig. 1. Therefore, in this embodiment, unlike embodiment 1 and embodiment 2, the treatment liquid is not generated based on the liquid generation conditions.
4. Other embodiments
(A) Fig. 7 is a block diagram showing an example of the structure of the substrate processing apparatus 1 according to another embodiment. As shown in fig. 7, the substrate processing apparatus 1 may have a plurality of substrate processing units 3. In this case, the processing liquid supply device 2 may supply the processing liquid to the plurality of substrate processing units 3.
The processing liquid supply device 2 may be configured to supply the processing liquid to the substrate processing unit 3 of the other substrate processing apparatus 1 in addition to the substrate processing unit 3 in the substrate processing apparatus 1 including the processing liquid supply device 2.
(B) In the substrate processing apparatus 1 according to embodiment 1 and embodiment 2, the 1 st sub-tank 10 may not be provided in the 1 st circulation device 110. In this case, the 1 st circulation system is formed in the 1 st circulation device 110, and the 1 st circulation system functions as a buffer flow path for buffering the variation in flow rate and pressure from the 1 st liquid supply source 5. Therefore, the flow state of DIW in the 1 st circulation system is suppressed from being greatly disturbed.
(C) In the substrate processing apparatus 1 according to embodiment 1 and embodiment 2, the 2 nd sub-tank 20 may not be provided in the 2 nd circulation device 120. In this case, the 2 nd circulation system is formed in the 2 nd circulation device 120, and the 2 nd circulation system functions as a buffer flow path for buffering the variation in flow rate and pressure from the 2 nd liquid supply source 6. Therefore, the flow state of HF in the 2 nd circulation system is suppressed to generate a large disturbance.
(D) In the substrate processing apparatus 1 according to embodiment 1 and embodiment 2, the liquid generating conditions may include that only the flow rate of DIW flowing through the 1 st circulation system is within the 1 st flow rate range and the flow rate of HF flowing through the 2 nd circulation system is within the 2 nd flow rate range. Alternatively, the liquid generation condition may include only a predetermined fixed time (for example, about 5sec to 10 sec) from the start of the operations of the 1 st circulation device 110 and the 2 nd circulation device 120 in the process of step S12 in fig. 4.
(E) In the substrate processing apparatus 1 according to embodiment 1 and embodiment 2, the pumps 12 and 22 may be configured to adjust the flow rate of the liquid flowing therein to some extent. In this case, the control unit 9 can adjust the flow rates of the respective liquids flowing through the 1 st and 2 nd circulation systems by adjusting the pumps 12 and 22.
(F) In the substrate processing apparatus 1 according to embodiment 1 and embodiment 2, the pumps 12 and 22 are maintained in a stopped state without generating the processing liquid, but the present invention is not limited thereto. The pumps 12 and 22 may be maintained in an operating state at all times during the power-on period of the substrate processing apparatus 1.
In this case, the DIW flows through the 1 st circulation system in a state where the power supply of the substrate processing apparatus 1 is turned on. HF was circulated through the 2 nd circulation system. Therefore, as in embodiment 2, when each circulation system has a heating unit such as a heater, it is possible to always store the temperature-adjusted DIW and HF in a fixed amount in the sub-storage tank.
(G) In the substrate processing apparatus 1 according to embodiments 1 to 3, the substrate processing unit 3 includes a plurality of processing units 4, and the substrate processing unit 3 may include only one processing unit 4.
(H) In the substrate processing apparatus 1 of the above embodiment, the DIW stored in the 1 st sub-tank 10 is sucked by the pump 12 and is pressure-fed in the pressure-feed pipe p12, but the present invention is not limited thereto. A pressurizing device for supplying an inert gas into the 1 st sub-tank 10 may be attached to the 1 st sub-tank 10. In this case, the pressure in the 1 st sub tank 10 is increased by the pressurizing device, and the DIW in the 1 st sub tank 10 can be circulated in the pressurizing and transporting pipe p 12.
(I) In the substrate processing apparatus 1 of the above embodiment, HF stored in the 2 nd sub-tank 20 is sucked by the pump 22 and is pressurized and conveyed in the pressurized conveying pipe p22, but the present invention is not limited thereto. A pressurizing device for supplying an inert gas into the 2 nd sub-tank 20 may be attached to the 2 nd sub-tank 20. In this case, the pressure in the 2 nd sub-tank 20 is increased by the pressurizing device, and the HF in the 2 nd sub-tank 20 can be circulated in the pressurizing and transporting pipe p 22.
(J) In the substrate processing apparatus 1 of the above embodiment, the processing liquid is generated by mixing two liquids (DIW and HF), but the present invention is not limited thereto. The substrate processing apparatus 1 may be configured to mix three or more liquids. For example, the substrate processing apparatus 1 may include three circulation apparatuses or supply apparatuses having substantially the same configuration as the 1 st circulation apparatus 110, and a mixing/discharging unit for mixing three liquids flowing through the three circulation apparatuses.
5. Correspondence between each constituent element of the claims and each part of the embodiment
The following describes corresponding examples of the respective constituent elements of the claims and the respective elements of the embodiments, but the present invention is not limited to the following examples. As the constituent elements of the claims, other various elements having the structures and functions described in the claims may be used.
In the above embodiment, the diluting liquid such as DIW is the 1 st liquid, the chemical liquid such as HF is the 2 nd liquid, the substrate processing unit 3 is one or more substrate processing units, the processing liquid supply device 2 is the processing liquid supply device, the main reservoir 30 is the main reservoir, the liquid supply unit 140 is the liquid supply unit, and the mixing/deriving unit 130 is the mixing/deriving unit.
The 1 st liquid supply source 5 is an example of the 1 st liquid supply source, the 1 st circulation device 110 is an example of the 1 st circulation device, the 2 nd liquid supply source 6 is an example of the 2 nd liquid supply source, the 2 nd circulation device 120 is an example of the 2 nd circulation device, the pump 12, the adjustment unit 14, the heater 17 and the filter 18 are examples of the 1 st state adjustment unit, the pump 22, the adjustment unit 24, the heater 27 and the filter 28 are examples of the 2 nd state adjustment unit, and the control unit 9 is an example of the control unit.
The 1 st condition is exemplified by the 1 st flow rate of DIW flowing through the 1 st circulation system being within the 1 st flow rate range, a predetermined fixed time being elapsed from the start of operation of the 1 st circulation device 110, and the 1 st temperature of DIW flowing through the 1 st circulation system being within the 1 st temperature range, the 2 nd condition is exemplified by the 2 nd flow rate of HF flowing through the 2 nd circulation system being within the 2 nd flow rate range, a predetermined fixed time being elapsed from the start of operation of the 2 nd circulation device 120, and the 2 nd temperature of HF flowing through the 2 nd circulation system being within the 2 nd temperature range.
The pump 12 is the 1 st pump, the pump 22 is the 2 nd pump, the regulator of the regulator unit 14 is the 1 st regulator valve, the electric needle valve of the regulator unit 24 is the 2 nd regulator valve, the flow meter 13 is the 1 st flow meter, the flow meter 23 is the 2 nd flow meter, the heater 17 is the 1 st heating unit, and the heater 27 is the 2 nd heating unit.
The 1 st sub-tank 10 is an example of a 1 st sub-tank, the 2 nd sub-tank 20 is an example of a 2 nd sub-tank, the 1 st supply device 150 is an example of a 1 st supply device, the 2 nd supply device 160 is an example of a 2 nd supply device, and the substrate processing apparatus 1 is an example of a substrate processing apparatus.
6. Summary of the embodiments
The treatment liquid supply device according to item 1 (1) is a treatment liquid supply device for supplying a mixed liquid containing the 1 st liquid and the 2 nd liquid as a treatment liquid to one or more substrate treatment sections, comprising:
A liquid supply unit including a main tank for storing the mixed liquid, the liquid supply unit supplying the mixed liquid stored in the main tank as the processing liquid to the one or more substrate processing units;
A mixing and guiding unit for guiding the mixed liquid to the main storage tank;
A 1 st circulation device having a 1 st circulation system connected to a 1 st liquid supply source, for supplying the 1 st liquid flowing in at least a part of the 1 st circulation system to the mixing/leading-out portion, and
And a2 nd circulation device having a2 nd circulation system connected to a2 nd liquid supply source, the 2 nd circulation device supplying the 2 nd liquid flowing through at least a part of the 2 nd circulation system to the mixing/discharging unit.
In this treatment liquid supply device, the 1 st liquid supplied from the 1 st liquid supply source circulates in the 1 st circulation system. The 2 nd liquid supplied from the 2 nd liquid supply source circulates in the 2 nd circulation system. The 1 st liquid circulated in the 1 st circulation system and the 2 nd liquid circulated in the 2 nd circulation system are supplied to the mixing and discharging unit. Thus, the 1 st liquid and the 2 nd liquid are mixed in the mixing/discharging unit.
A mixed liquid containing the 1 st liquid and the 2 nd liquid is generated and stored in the main storage tank. The mixed liquid stored in the main storage tank is supplied as a processing liquid to one or more substrate processing units.
In the above configuration, the 1 st circulation system receives the 1 st liquid supplied from the 1 st liquid supply source, and functions as a buffer flow path for buffering the variation in the flow rate, pressure, and the like of the 1 st liquid. Thus, the occurrence of a large disturbance in the flow state of the 1 st liquid flowing from the 1 st circulation system to the mixing and leading-out portion is suppressed. The 2 nd circulation system receives the 2 nd liquid supplied from the 2 nd liquid supply source and functions as a buffer flow path for buffering the variation in the flow rate, pressure, and the like of the 2 nd liquid. Thus, the flow state of the 2 nd liquid flowing from the 2 nd circulation system to the mixing and leading-out part is inhibited from being greatly disturbed.
In this case, the 1 st liquid and the 2 nd liquid can be mixed in a relatively stable state in the mixing/discharging unit. Therefore, the processing liquid is generated with relatively high accuracy. Further, since the generation of the treatment liquid under unstable conditions is suppressed, a treatment for eliminating a low-quality treatment liquid such as pre-bleeding is not required. As a result, the high-quality processing liquid generated under predetermined conditions without discarding the low-quality processing liquid can be stably supplied to the one or more substrate processing units.
The treatment liquid supply device according to item (2) of item 1, wherein the treatment liquid supply device may further include,
The 1 st circulation system includes a 1 st state adjusting unit for adjusting a state of the 1 st liquid flowing through the 1 st circulation system,
The 2 nd circulation system includes a 2 nd state adjusting unit that adjusts a state of the 2 nd liquid flowing through the 2 nd circulation system.
In this case, the state of the 1 st liquid flowing from the 1 st circulation system to the mixing and leading portion can be adjusted to an appropriate state. In addition, the state of the 2 nd liquid flowing from the 2 nd circulation system to the mixing and leading portion can be adjusted to an appropriate state. Thus, the 1 st liquid and the 2 nd liquid can be mixed with high accuracy under predetermined conditions.
(3) In the treatment liquid supply device according to 2, the treatment liquid may be,
The 1 st circulation device is configured to be operable in a1 st liquid circulation mode in which the 1 st liquid is circulated in the 1 st circulation system and in a1 st liquid supply mode in which the 1 st liquid flowing in at least a part of the 1 st circulation system is supplied to the mixing and leading portion,
The 2 nd circulation device is configured to be operable in a2 nd liquid circulation mode in which the 2 nd liquid is circulated in the 2 nd circulation system and in a2 nd liquid supply mode in which the 2 nd liquid flowing in at least a part of the 2 nd circulation system is supplied to the mixing/leading portion,
The treatment liquid supply apparatus further includes a control unit that switches an operation mode of the 1 st circulation device from the 1 st liquid circulation mode to the 1 st liquid supply mode and switches an operation mode of the 2 nd circulation device from the 2 nd liquid circulation mode to the 2 nd liquid supply mode when a state of the 1 st liquid flowing through the 1 st circulation system satisfies a predetermined 1 st condition and a state of the 2 nd liquid flowing through the 2 nd circulation system satisfies a predetermined 2 nd condition when the 1 st circulation device is operated in the 1 st liquid circulation mode and the 2 nd circulation device is operated in the 2 nd liquid circulation mode.
In this case, in the 1 st circulation device in the 1 st liquid circulation mode, the 1 st state adjustment unit can adjust the state of the 1 st liquid flowing through the 1 st circulation system so as to satisfy the 1 st condition. In the 2 nd circulation device in the 2 nd liquid circulation mode, the 2 nd state adjusting unit can adjust the state of the 2 nd liquid flowing through the 2 nd circulation system so as to satisfy the 2 nd condition.
When the 1 st condition is satisfied in the 1 st circulation device in the 1 st liquid circulation mode and the 2 nd condition is satisfied in the 2 nd circulation device in the 2 nd liquid circulation mode, the operation mode of each circulation device is switched. Thus, the 1 st liquid is supplied to the mixing/discharging unit in a state where the 1 st condition is satisfied, and the 2 nd liquid is supplied to the mixing/discharging unit in a state where the 2 nd condition is satisfied. Therefore, the 1 st liquid and the 2 nd liquid are properly mixed in the mixing/discharging unit.
According to the above configuration, the 1 st liquid and the 2 nd liquid are prevented from being mixed in an unintended state to generate the treatment liquid. In addition, the 1 st liquid and the 2 nd liquid can be mixed with high accuracy under predetermined conditions.
(4) In the treatment liquid supply device according to 3, the treatment liquid may be,
The 1 st state adjusting section includes a1 st pump for pressurizing and conveying the 1 st liquid in the 1 st circulation system when the 1 st liquid circulation mode is set, pressurizing and conveying the 1 st liquid flowing in the 1 st circulation system to the mixing and guiding section when the 1 st liquid supply mode is set,
The 2 nd state adjusting section includes a 2 nd pump for pressurizing and conveying the 2 nd liquid in the 2 nd circulation system when the 2 nd liquid circulation mode is set, pressurizing and conveying the 2 nd liquid flowing in the 2 nd circulation system to the mixing and leading section when the 2 nd liquid supply mode is set,
The 1 st condition includes that the amount per unit time of the 1 st liquid flowing in the 1 st circulation system is within a predetermined 1 st flow rate range,
The condition 2 includes that the amount per unit time of the 2 nd liquid flowing in the 2 nd circulation system is within a predetermined 2 nd flow rate range.
In this case, the flow rate of the 1 st liquid flowing through the 1 st circulation system can be adjusted with high accuracy. In addition, the flow rate of the 2 nd liquid flowing through the 2 nd circulation system can be adjusted with high accuracy. Thus, the flow rate of the 1 st liquid and the flow rate of the 2 nd liquid supplied to the mixing and leading portion are accurately adjusted. As a result, the 1 st liquid and the 2 nd liquid can be mixed with high accuracy at a predetermined ratio.
(5) In the treatment liquid supply device according to 4, the treatment liquid may be,
The 1 st state adjusting section further includes a 1 st adjusting valve for adjusting a flow rate of the 1 st liquid flowing through the 1 st circulation system,
The 2 nd state adjusting unit further includes a 2 nd adjusting valve for adjusting a flow rate of the 2 nd liquid flowing through the 2 nd circulation system.
In this case, the flow rate of the 1 st liquid flowing through the 1 st circulation system can be adjusted with higher accuracy. In addition, the flow rate of the 2 nd liquid flowing through the 2 nd circulation system can be adjusted with higher accuracy. This makes it possible to adjust the flow rate of the 1 st liquid and the flow rate of the 2 nd liquid supplied to the mixing/guiding unit with higher accuracy. As a result, the 1 st liquid and the 2 nd liquid can be mixed with higher accuracy at a predetermined ratio.
(6) In the treatment liquid supply device according to any one of 1 to 5, the treatment liquid may be,
The 1 st circulation system includes a1 st flow meter for detecting a flow rate of the 1 st liquid flowing in the 1 st circulation system,
The 2 nd circulation system includes a2 nd flow meter that detects a flow rate of the 2 nd liquid flowing in the 2 nd circulation system.
In this case, the state of the 1 st liquid can be adjusted by controlling each part of the 1 st circulation system based on the detection result of the 1 st flow meter. In addition, by controlling each part of the 2 nd circulation system based on the detection result of the 2 nd flow meter, the state of the 2 nd liquid can be adjusted.
Further, it is also possible to determine whether the 1 st liquid state satisfies the 1 st condition or not and whether the 2 nd liquid state satisfies the 2 nd condition or not based on the detection result of the 1 st flowmeter and the detection result of the 2 nd flowmeter.
(7) In the treatment liquid supply device according to any one of the 3 rd to 5 th items, the treatment liquid supply device may be,
The 1 st state adjustment section includes a1 st heating section for heating the 1 st liquid flowing through the 1 st circulation system,
The 2 nd state adjusting section includes a2 nd heating section for heating the 2 nd liquid flowing through the 2 nd circulation system,
The condition 1 includes that the temperature of the 1 st liquid flowing in the 1 st circulation system is within a predetermined 1 st temperature range,
The condition 2 includes that the temperature of the 2 nd liquid flowing in the 2 nd circulation system is within a predetermined 2 nd temperature range.
In this case, the 1 st liquid in the 1 st temperature range and the 2 nd liquid in the 2 nd temperature range are mixed to generate the treatment liquid. This can produce a mixed solution under stable temperature conditions.
(8) The treatment liquid supply device according to any one of 1 to 7, wherein the treatment liquid supply device may further include,
The 1 st circulation system includes a 1 st sub-tank for storing the 1 st liquid supplied from the 1 st liquid supply source in a predetermined amount,
The 2 nd circulation system includes a 2 nd sub-tank for storing the 2 nd liquid supplied from the 2 nd liquid supply source in a predetermined amount.
In this case, the 1 st sub-tank functions as a buffer tank (buffer vessel) for buffering the variation in the flow rate, pressure, and the like of the 1 st liquid supplied from the 1 st liquid supply source to the 1 st circulation system. Thus, the 1 st liquid is supplied from the 1 st liquid supply source to the 1 st circulation system, and the 1 st liquid flowing in the 1 st circulation system is prevented from being greatly disturbed.
The 2 nd sub-tank functions as a buffer tank (buffer vessel) for buffering the variation in the flow rate, pressure, and the like of the 2 nd liquid supplied from the 2 nd liquid supply source to the 2 nd circulation system. Thus, the 2 nd liquid is supplied from the 2 nd liquid supply source to the 2 nd circulation system, and the 2 nd liquid flowing in the 2 nd circulation system is prevented from being greatly disturbed.
The treatment liquid supply device according to item 9 (9) is a treatment liquid supply device for supplying a mixed liquid containing the 1 st liquid and the 2 nd liquid as a treatment liquid to one or more substrate treatment sections, comprising:
A liquid supply unit including a main tank for storing the mixed liquid, the liquid supply unit supplying the mixed liquid stored in the main tank as the processing liquid to the one or more substrate processing units;
A mixing and guiding unit for guiding the mixed liquid to the main storage tank;
A1 st sub-tank connected to a1 st liquid supply source for storing the 1 st liquid supplied from the 1 st liquid supply source in a predetermined amount;
A1 st supply device configured to supply the 1 st liquid stored in the 1 st sub-storage tank to the mixing/discharging unit;
A2 nd sub-tank connected to a2 nd liquid supply source for storing the 2 nd liquid supplied from the 2 nd liquid supply source in a predetermined amount, and
And a 2 nd supply device configured to supply the 2 nd liquid stored in the 2 nd sub-storage tank to the mixing/discharging unit.
In this treatment liquid supply device, the 1 st liquid supplied from the 1 st liquid supply source is stored in the 1 st sub-storage tank. The 2 nd liquid supplied from the 2 nd liquid supply source is stored in the 2 nd sub-storage tank. The 1 st liquid stored in the 1 st sub-tank is supplied to the mixing and leading-out portion, and the 2 nd liquid stored in the 2 nd sub-tank is supplied to the mixing and leading-out portion. Thus, the 1 st liquid and the 2 nd liquid are mixed in the mixing/guiding section.
The mixed liquid of the 1 st liquid and the 2 nd liquid is generated and stored in the main storage tank. The mixed liquid stored in the main storage tank is supplied as a processing liquid to one or more substrate processing units.
In the above configuration, the 1 st sub-tank receives the 1 st liquid supplied from the 1 st liquid supply source, and functions as a buffer tank (buffer vessel) that buffers the variation in the flow rate, pressure, and the like of the 1 st liquid. Thus, the occurrence of a large disturbance in the flow state of the 1 st liquid flowing from the 1 st sub-tank to the mixing and leading-out portion is suppressed. The 2 nd sub-tank receives the 2 nd liquid supplied from the 2 nd liquid supply source, and functions as a buffer tank (buffer vessel) for buffering the variation in the flow rate, pressure, and the like of the 2 nd liquid. Thus, the flow state of the 2 nd liquid flowing from the 2 nd secondary storage tank to the mixing and leading-out portion is inhibited from being greatly disturbed.
In this case, the 1 st liquid and the 2 nd liquid can be mixed in a relatively stable state in the mixing/discharging unit. Therefore, the processing liquid is generated with relatively high accuracy. Further, since the generation of the treatment liquid under unstable conditions is suppressed, a treatment for eliminating a low-quality treatment liquid such as pre-bleeding is not required. As a result, the high-quality processing liquid generated under predetermined conditions without discarding the low-quality processing liquid can be stably supplied to the one or more substrate processing units.
The substrate processing apparatus according to item 10 (10) includes:
the treatment liquid supply device according to any one of items 1 to 9, and
The one or more substrate processing sections.
The substrate processing apparatus includes the processing liquid supply apparatus. Therefore, the consumption amount of each liquid used for generating the processing liquid can be reduced, and the substrate can be processed with the high-quality processing liquid.
The treatment liquid supply method according to item 11 (11) is a treatment liquid supply method for supplying a mixed liquid containing the 1 st liquid and the 2 nd liquid as a treatment liquid to one or more substrate treatment sections, comprising:
A step of supplying the 1 st liquid and the 2 nd liquid to a mixing/discharging unit by using a 1 st circulation device and a2 nd circulation device;
A step of mixing the 1 st liquid and the 2 nd liquid supplied by the 1 st circulation device and the 2 nd circulation device in the mixing/discharging unit and guiding the mixed liquid to the main storage tank, and
A step of supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units,
The 1 st circulation device has a 1 st circulation system connected to a 1 st liquid supply source,
The 2 nd circulation device has a 2 nd circulation system connected to a 2 nd liquid supply source.
In this treatment liquid supply method, the 1 st liquid supplied from the 1 st liquid supply source is circulated in the 1 st circulation system. The 2 nd liquid supplied from the 2 nd liquid supply source circulates in the 2 nd circulation system. The 1 st liquid circulating in the 1 st circulation system and the 2 nd liquid circulating in the 2 nd circulation system are supplied to the mixing and leading-out unit. Thus, the 1 st liquid and the 2 nd liquid are mixed in the mixing/discharging unit.
A mixed liquid containing the 1 st liquid and the 2 nd liquid is generated and stored in the main storage tank. The mixed liquid stored in the main storage tank is supplied as a processing liquid to one or more substrate processing units.
In the above configuration, the 1 st circulation system receives the 1 st liquid supplied from the 1 st liquid supply source, and functions as a buffer flow path for buffering the variation in the flow rate, pressure, and the like of the 1 st liquid. Thus, the occurrence of a large disturbance in the flow state of the 1 st liquid flowing from the 1 st circulation system to the mixing and leading-out portion is suppressed. The 2 nd circulation system receives the 2 nd liquid supplied from the 2 nd liquid supply source and functions as a buffer flow path for buffering the variation in the flow rate, pressure, and the like of the 2 nd liquid. Thus, the flow state of the 2 nd liquid flowing from the 2 nd circulation system to the mixing and leading-out part is inhibited from being greatly disturbed.
In this case, the 1 st liquid and the 2 nd liquid can be mixed in a relatively stable state in the mixing/discharging unit. Therefore, the processing liquid is generated with relatively high accuracy. Further, since the generation of the treatment liquid under unstable conditions is suppressed, a treatment for eliminating a low-quality treatment liquid such as pre-bleeding is not required. As a result, the high-quality processing liquid generated under predetermined conditions without discarding the low-quality processing liquid can be stably supplied to the one or more substrate processing units.
The treatment liquid supply method according to item 12 (12) is a treatment liquid supply method for supplying a mixed liquid containing the 1 st liquid and the 2 nd liquid as a treatment liquid to one or more substrate treatment sections, comprising:
A step of supplying the 1 st liquid and the 2 nd liquid to a mixing/discharging unit from a1 st sub-tank connected to a1 st liquid supply source and storing the 1 st liquid supplied from the 1 st liquid supply source by a predetermined amount, and a2 nd sub-tank connected to a2 nd liquid supply source and storing the 2 nd liquid supplied from the 2 nd liquid supply source by a predetermined amount;
A step of mixing the 1 st liquid with the 2 nd liquid in the mixing/discharging unit and guiding the mixed liquid to the main storage tank, and
And supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units.
In this treatment liquid supply method, the 1 st liquid supplied from the 1 st liquid supply source is stored in the 1 st sub-storage tank. The 2 nd liquid supplied from the 2 nd liquid supply source is stored in the 2 nd sub-storage tank. The 1 st liquid stored in the 1 st sub-tank is supplied to the mixing outlet portion, and the 2 nd liquid stored in the 2 nd sub-tank is supplied to the mixing outlet portion. Thus, the 1 st liquid and the 2 nd liquid are mixed in the mixing/discharging unit.
The mixed liquid of the 1 st liquid and the 2 nd liquid is generated and stored in the main storage tank. The mixed liquid stored in the main storage tank is supplied as a processing liquid to one or more substrate processing units.
In the above configuration, the 1 st sub-tank receives the 1 st liquid supplied from the 1 st liquid supply source, and functions as a buffer tank (buffer vessel) that buffers the variation in the flow rate, pressure, and the like of the 1 st liquid. Thus, the occurrence of a large disturbance in the flow state of the 1 st liquid flowing from the 1 st sub-tank to the mixing and leading-out portion is suppressed. The 2 nd sub-tank receives the 2 nd liquid supplied from the 2 nd liquid supply source, and functions as a buffer tank (buffer vessel) for buffering the variation in the flow rate, pressure, and the like of the 2 nd liquid. Thus, the flow state of the 2 nd liquid flowing from the 2 nd secondary storage tank to the mixing and leading-out portion is inhibited from being greatly disturbed.
In this case, the 1 st liquid and the 2 nd liquid can be mixed in a relatively stable state in the mixing/discharging unit. Therefore, the processing liquid is generated with relatively high accuracy. Further, since the generation of the treatment liquid under unstable conditions is suppressed, a treatment for eliminating a low-quality treatment liquid such as pre-bleeding is not required. As a result, the high-quality processing liquid generated under predetermined conditions without discarding the low-quality processing liquid can be stably supplied to the one or more substrate processing units.
According to the processing liquid supply apparatus, the substrate processing apparatus, and the substrate processing method of the above-described embodiments, unnecessary consumption of the raw liquid for generating the processing liquid is suppressed. Therefore, the reduction of the global environmental pollution caused by the treatment liquid can be facilitated.

Claims (12)

1. A processing liquid supply device for supplying a mixed liquid containing a1 st liquid and a2 nd liquid as a processing liquid to one or more substrate processing units, the device comprising:
a liquid supply unit including a main tank for storing the mixed liquid, the liquid supply unit supplying the mixed liquid stored in the main tank as the processing liquid to the one or more substrate processing units;
a mixing and guiding unit that guides the mixed liquid to the main storage tank;
A 1 st circulation device having a 1 st circulation system connected to a 1 st liquid supply source, for supplying the 1 st liquid flowing through at least a part of the 1 st circulation system to the mixing/discharging unit, and
And a2 nd circulation device having a2 nd circulation system connected to a2 nd liquid supply source, the 2 nd circulation device supplying the 2 nd liquid flowing through at least a part of the 2 nd circulation system to the mixing/discharging unit.
2. The treatment liquid supply apparatus according to claim 1, wherein,
The 1 st circulation system includes a 1 st state adjusting section that adjusts a state of the 1 st liquid flowing in the 1 st circulation system,
The 2 nd circulation system includes a 2 nd state adjustment unit that adjusts a state of the 2 nd liquid flowing in the 2 nd circulation system.
3. The treatment liquid supply apparatus according to claim 2, wherein,
The 1 st circulation device is configured to be operable in a 1 st liquid circulation mode in which the 1 st liquid is circulated in the 1 st circulation system and in a 1 st liquid supply mode in which the 1 st liquid flowing through at least a part of the 1 st circulation system is supplied to the mixing and leading-out unit,
The 2 nd circulation device is configured to be operable in a2 nd liquid circulation mode in which the 2 nd liquid is circulated in the 2 nd circulation system and in a2 nd liquid supply mode in which the 2 nd liquid flowing through at least a part of the 2 nd circulation system is supplied to the mixing/discharging unit,
The treatment liquid supply device further includes a control unit that, when the 1 st circulation device is operated in the 1 st liquid circulation mode and the 2 nd circulation device is operated in the 2 nd liquid circulation mode, switches the operation mode of the 1 st circulation device from the 1 st liquid circulation mode to the 1 st liquid supply mode and switches the operation mode of the 2 nd circulation device from the 2 nd liquid circulation mode to the 2 nd liquid supply mode when the 1 st liquid flowing through the 1 st circulation system satisfies a predetermined 1 st condition and the 2 nd liquid flowing through the 2 nd circulation system satisfies a predetermined 2 nd condition.
4. The treatment liquid supply apparatus according to claim 3, wherein,
The 1 st state adjustment unit includes a 1 st pump for pressurizing and feeding the 1 st liquid to the 1 st circulation system when the 1 st liquid circulation mode is set, and pressurizing and feeding the 1 st liquid flowing through the 1 st circulation system to the mixing and guiding unit when the 1 st liquid supply mode is set,
The 2 nd state adjusting section includes a 2 nd pump for pressurizing and conveying the 2 nd liquid in the 2 nd circulation system when the 2 nd liquid circulation mode is set, pressurizing and conveying the 2 nd liquid flowing in the 2 nd circulation system to the mixing and leading section when the 2 nd liquid supply mode is set,
The condition 1 includes that the amount per unit time of the 1 st liquid flowing in the 1 st circulation system is within a predetermined 1 st flow rate range,
The condition 2 includes that the amount per unit time of the 2 nd liquid flowing in the 2 nd circulation system is within a predetermined 2 nd flow rate range.
5. The treatment liquid supply apparatus according to claim 4, wherein,
The 1 st state adjusting section further includes a 1 st adjusting valve for adjusting a flow rate of the 1 st liquid flowing in the 1 st circulation system,
The 2 nd state adjustment unit further includes a 2 nd adjustment valve that adjusts the flow rate of the 2 nd liquid flowing through the 2 nd circulation system.
6. The treatment liquid supply apparatus according to any one of claims 1 to 5, wherein,
The 1 st circulation system includes a1 st flow meter that detects a flow rate of the 1 st liquid flowing in the 1 st circulation system,
The 2 nd circulation system includes a2 nd flow meter that detects a flow rate of the 2 nd liquid flowing in the 2 nd circulation system.
7. The treatment liquid supply apparatus according to any one of claims 3 to 5, wherein,
The 1 st state adjustment section includes a 1 st heating section for heating the 1 st liquid flowing in the 1 st circulation system,
The 2 nd state adjusting section includes a2 nd heating section for heating the 2 nd liquid flowing in the 2 nd circulation system,
The condition 1 includes that the temperature of the 1 st liquid flowing in the 1 st circulation system is within a predetermined 1 st temperature range,
The condition 2 includes that the temperature of the 2 nd liquid flowing in the 2 nd circulation system is within a predetermined 2 nd temperature range.
8. The treatment liquid supply apparatus according to any one of claims 1 to 7, wherein,
The 1 st circulation system includes a 1 st sub-tank that accumulates the 1 st liquid supplied from the 1 st liquid supply source in a predetermined amount,
The 2 nd circulation system includes a 2 nd sub-tank that accumulates the 2 nd liquid supplied from the 2 nd liquid supply source in a predetermined amount.
9. A processing liquid supply device for supplying a mixed liquid containing a1 st liquid and a2 nd liquid as a processing liquid to one or more substrate processing units, the device comprising:
a liquid supply unit including a main tank for storing the mixed liquid, the liquid supply unit supplying the mixed liquid stored in the main tank as the processing liquid to the one or more substrate processing units;
a mixing and guiding unit that guides the mixed liquid to the main storage tank;
a1 st sub-tank connected to a1 st liquid supply source for storing the 1 st liquid supplied from the 1 st liquid supply source in a predetermined amount;
a1 st supply device that supplies the 1 st liquid stored in the 1 st sub-storage tank to the mixing/discharging unit;
a2 nd sub-tank connected to a2 nd liquid supply source for storing the 2 nd liquid supplied from the 2 nd liquid supply source in a predetermined amount, and
And a 2 nd supply device configured to supply the 2 nd liquid stored in the 2 nd sub-storage tank to the mixing/discharging unit.
10. A substrate processing apparatus is characterized by comprising:
a treatment liquid supply apparatus according to any one of claims 1 to 9, and
The one or more substrate processing sections.
11. A process liquid supply method for supplying a mixed liquid containing a1 st liquid and a2 nd liquid as a process liquid to one or more substrate processing units, the method comprising:
A step of supplying the 1 st liquid and the 2 nd liquid to a mixing and leading-out unit by using a 1 st circulation device and a2 nd circulation device;
a step of mixing the 1 st liquid and the 2 nd liquid supplied by using the 1 st circulation device and the 2 nd circulation device in the mixing and leading-out part and guiding the mixed liquid to a main storage tank, and
A step of supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units,
The 1 st circulation device is provided with a 1 st circulation system connected with a 1 st liquid supply source,
The 2 nd circulation device has a 2 nd circulation system connected to a 2 nd liquid supply source.
12. A process liquid supply method for supplying a mixed liquid containing a1 st liquid and a2 nd liquid as a process liquid to one or more substrate processing units, the method comprising:
A step of supplying the 1 st liquid and the 2 nd liquid to a mixing/discharging unit from a1 st sub-tank connected to a1 st liquid supply source and storing the 1 st liquid supplied from the 1 st liquid supply source by a predetermined amount and a2 nd sub-tank connected to a2 nd liquid supply source and storing the 2 nd liquid supplied from the 2 nd liquid supply source by a predetermined amount;
A step of mixing the 1 st liquid and the 2 nd liquid in the mixing/leading-out portion and guiding the mixed liquid to a main storage tank, and
And supplying the mixed liquid stored in the main storage tank as the processing liquid to the one or more substrate processing units.
CN202411481542.5A 2023-10-25 2024-10-23 Treatment liquid supply device, substrate treatment device, and treatment liquid supply method Pending CN119890075A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023183296A JP2025072871A (en) 2023-10-25 2023-10-25 Processing liquid supplying apparatus, substrate processing apparatus, and processing liquid supplying method
JP2023-183296 2023-10-25

Publications (1)

Publication Number Publication Date
CN119890075A true CN119890075A (en) 2025-04-25

Family

ID=95436962

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202411481542.5A Pending CN119890075A (en) 2023-10-25 2024-10-23 Treatment liquid supply device, substrate treatment device, and treatment liquid supply method

Country Status (4)

Country Link
JP (1) JP2025072871A (en)
KR (1) KR20250060114A (en)
CN (1) CN119890075A (en)
TW (1) TW202522649A (en)

Also Published As

Publication number Publication date
KR20250060114A (en) 2025-05-07
TW202522649A (en) 2025-06-01
JP2025072871A (en) 2025-05-12

Similar Documents

Publication Publication Date Title
KR102253286B1 (en) Wet etching apparatus
KR101505266B1 (en) Chemical liquid preparation method of preparing a chemical liquid for substrate processing, chemical liquid preparation unit preparing a chemical liquid for substrate processing, and substrate processing system
KR101213375B1 (en) Apparatus for mixing a processing solution, apparatus for processing a substrate, method for mixing a processing solution, and computer readable storage medium
US9415356B1 (en) Chemical-liquid mixing method and chemical-liquid mixing apparatus
US11373886B2 (en) Substrate processing apparatus and substrate processing method
JP2009172459A5 (en)
JP7264729B2 (en) SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
KR20170104399A (en) Substrate treatment device and substrate treatment method
CN111696889A (en) Mixing device, mixing method, and substrate processing system
CN119890075A (en) Treatment liquid supply device, substrate treatment device, and treatment liquid supply method
KR100898049B1 (en) Apparatus and method of supplying treating liquid
JP2018019089A (en) Chemical solution-producing method for processing substrate, chemical solution-producing unit for processing substrate, substrate processing method, and substrate processing system
TWI742266B (en) Washing water supply device
JPWO2004113023A1 (en) Chemical supply device
JP2002273314A (en) Substrate treating apparatus
JP2003197575A (en) Abrasive supply apparatus and abrasive supply method
JP2018110261A (en) Wet etching equipment
CN114365269A (en) Dilute liquid supply device
KR100723586B1 (en) Chemical supply
JP2004288681A (en) Device and method for high-pressure treatment
JP7687063B2 (en) Wafer cleaning water supply device
CN114127908B (en) Substrate processing device and substrate processing method
TW201836004A (en) Substrate processing method and substrate processing apparatus
US20230335417A1 (en) Wafer cleaning water supply system and wafer cleaning water supply method
JP2024170984A (en) SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination