Disclosure of Invention
The present disclosure is directed to an antenna assembly that is small in size, thin in thickness, simple in structure, and good in performance. In order to achieve the above object, at least the following technical solutions are provided.
In one aspect, an antenna assembly is provided. The antenna assembly includes an antenna radiator, wherein the antenna radiator includes a ground element configured to be electrically connected to a ground plane at a ground point, a feed element configured to be electrically connected to a radio signal circuit at a feed point, and an additional element.
The ground element, feed element and additional element are physically separated and physically disconnected from each other, at least a first portion of the additional element extending substantially parallel to at least a portion of the ground element to provide capacitive coupling between the additional element and the ground element during operation of the antenna assembly.
In one embodiment, at least a second portion of the additional element extends substantially parallel to at least a portion of the feed element to provide capacitive coupling between the additional element and the feed element during operation of the antenna assembly.
In one embodiment, the antenna assembly further includes a first matching element configured to connect the ground element with the ground plane at the ground point, and a second matching element configured to connect the feed element with the radio signal circuit at the feed point.
In one embodiment, the first mating element extends substantially parallel to the second mating element, and the length of the first mating element is substantially the same as the length of the second mating element.
In one embodiment, the first mating element extends substantially parallel to the second mating element, and the length of the first mating element is shorter than the length of the second mating element.
In one embodiment, the first mating element and the second mating element form an angle therebetween that is greater than 0 degrees and less than 30 degrees.
In one embodiment, the antenna assembly further comprises a dielectric carrier for supporting the antenna radiator.
In one embodiment, the antenna radiator is planar.
In one embodiment, the planar antenna radiator is arranged in the same plane as the ground plane.
In one embodiment, the planar antenna radiator is disposed in a plane spaced apart from and substantially parallel to the ground plane.
In one embodiment, the first matching element and the second matching element are arranged in a plane perpendicular to the ground plane.
In one embodiment, the ground point is located in a central portion of the ground plane, the antenna radiator protrudes outwardly relative to the ground point, and at least a portion of the antenna radiator faces the ground plane.
In one embodiment, the ground point is located at an edge of the ground plane and the antenna radiator protrudes inside the ground plane relative to the ground point, at least a portion of the antenna radiator facing the ground plane.
In one embodiment the ground point is located at an edge of the ground plane and the antenna radiator protrudes outside the ground plane with respect to the ground point, no part of the antenna radiator facing the ground plane.
In one embodiment, the ground plane and the antenna radiator are formed in different layers of the printed circuit board.
In one embodiment, the feed element is electrically connected to the radio signal circuit via an inner conductor of the coaxial cable and the ground element is electrically connected to the ground plane via a conductive shield of the coaxial cable, wherein the conductive shield is concentric with and surrounds the inner conductor, and the inner conductor and the conductive shield are separated from each other by a dielectric insulator.
In a second aspect, an electronic device is provided, comprising an antenna assembly according to any of the embodiments described above.
In one embodiment, the electronic device further comprises a housing as a ground plane to be connected to the ground element of the antenna assembly.
In the present disclosure, an antenna assembly includes a ground element configured to be electrically connected to a ground plane at a ground point, a feed element configured to be electrically connected to radio signal circuitry at a feed point, and an additional element. The ground element, the feed element, and the additional element are physically separated and physically disconnected from each other, at least a first portion of the additional element extending substantially parallel to at least a portion of the ground element to provide capacitive coupling between the additional element and the ground element during operation of the antenna assembly. The overall physical length of the antenna assembly may be reduced due to the physical separation and physical disconnection between the ground element and the feed element, while the capacitive coupling between the feed element and the ground element during operation of the antenna assembly helps the antenna assembly to function and ensures good performance of the antenna assembly. Accordingly, the antenna assembly according to the present disclosure can be manufactured to have a small size and a thin thickness while ensuring performance and antenna efficiency of the antenna assembly. Thus, the antenna assembly according to the present disclosure can provide good wireless connectivity for a device mounted with the antenna assembly, and facilitate miniaturization of the device. For example, in a mobile device such as a game device having bluetooth technology for communicating with a wireless controller, if the antenna performance is good, even in a poor environment of high noise floor, for example, in the case where there are a plurality of wireless devices using the same frequency (such as bluetooth, wireless LAN, microwave oven, etc.), these game devices do not have any connection problem between the master device and the controller.
Detailed Description
The technical solutions in the embodiments of the present disclosure are described below with reference to the drawings in the embodiments of the present disclosure. It will be apparent that the described embodiments are merely some, but not all, of the embodiments of the present disclosure. Any other embodiments obtained based on embodiments of the present disclosure by those skilled in the art without making inventive efforts fall within the scope of this disclosure.
It should be noted that only terms such as "first," "second," "third," "fourth," and the like are used herein to distinguish one entity or operation from another entity or operation, and do not necessarily require such or implying any actual such relationship or order between such entities or operations. Furthermore, terms such as "comprise," "include," or any other variation thereof, are intended to be non-exclusive. Thus, a process, method, article, or apparatus that comprises a list of elements does not include only those elements disclosed, but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Unless expressly limited otherwise, the term "comprises/comprising" does not exclude the presence of other similar elements in a process, method, article or apparatus that may exist other than the listed elements.
In addition, the invention is described in connection with schematic drawings. When describing embodiments of the present invention in detail, cross-sectional views showing the structure of the apparatus are partially enlarged and not drawn to scale for convenience of explanation. The drawings are exemplary and are not intended to limit the scope of the invention. In addition, in the actual manufacturing process, three dimensional dimensions, i.e., length, width, and depth should be considered.
It should be noted that references in a structure or step where a first feature is "on" or "over" a second feature include cases where the first feature and the second feature are in direct contact as well as cases where additional features are present between the first feature and the second feature, i.e., the first feature and the second feature may not be in direct contact.
Fig. 1 is a schematic diagram of a pattern of an antenna assembly according to an embodiment of the present disclosure. As shown in fig. 1, the antenna assembly 1 includes an antenna radiator 101. Specifically, the antenna radiator 101 includes a ground element 111, a feed element 121, and an additional element 131. The ground element 111 is configured to be electrically connected to a ground plane (not shown) at the ground point 104. The feeding element 121 is configured to be electrically connected to a radio signal (RF) circuit at a feeding point 105. The feeding point 105 is located adjacent to the ground point 104.
As shown in fig. 1, the ground element 111, the feeding element 121, and the additional element 131 are physically separated from each other and physically disconnected. In other words, there is no direct electrical connection between the ground element 111 and the additional element 131, and the additional element 131 is physically disconnected from the ground plane. Similarly, there is no direct electrical connection between the feeding element 121 and the additional element 131, and the additional element 131 is physically disconnected from the RF circuitry. Furthermore, there is no direct electrical connection between the feeding element 121 and the grounding element 111.
As shown in fig. 1, at least a portion 1111 of the grounding element 111 extends in the same direction substantially parallel to a portion 1311 of the additional element 131. As shown in fig. 1, the portion 1111 of the grounding element 111 is arranged in the vicinity of the portion 1311 of the additional element 131, with a slit or gap formed between the two portions 1111 and 1311. In this configuration, the portion 1311 of the additional element 131 is arranged to form a capacitive slot/gap that provides capacitive coupling between the additional element 131 and the ground element 111 during operation of the antenna assembly. For this purpose, the width of the slit or gap between the portion 1111 and the portion 1311 is appropriately selected. In a preferred embodiment, the width of the slit or gap between the portion 1111 and the portion 1211 ranges from 0.1mm to 5mm.
In a preferred embodiment, the portion 1311 of the additional element 131 has a length sufficient to provide a usable coupling capacitance. In some embodiments, in addition to requiring that the portion 1311 of the additional element 131 be long enough to ensure effective coupling capacitance, the overall length of the additional element 131 is also required to be preferably shorter than the shortest resonant length at the lowest operating frequency of the antenna assembly.
As shown in fig. 1, the additional element 131 may further comprise a portion 1312 extending in the same direction substantially parallel to a portion of the feeding element 121. In an alternative embodiment, the portion 1312 of the additional element 131 is arranged in the vicinity of the portion of the feeding element 121, forming a slit or gap between the two portions. In this configuration, the portion 1312 of the additional element 131 is arranged to form a capacitive slot/gap that provides capacitive coupling between the additional element 131 and the feeding element 121 during operation of the antenna assembly. For this purpose, the width of the slit or gap between this portion 1312 of the additional element 131 and the feeding element 121 is suitably selected, for example less than 5mm.
However, it should be noted that the present disclosure is not limited in this respect, and that the additional element 131 may be spaced a greater distance from the feeding element 121 such that no capacitive coupling occurs between the feeding element 121 and the additional element 131.
The grounding element 111 may be of various shapes. In an embodiment, the ground element 111 may be an elongated strip and may have multiple portions connected end-to-end. For example, the grounding element 111 may be L-shaped including at least a first portion extending in a first direction and a second portion extending in a second direction perpendicular to the first direction, as shown in fig. 1. In other examples, the ground element 111 may further include a third portion extending in a third direction substantially parallel to and opposite to the first direction, and the resulting U-shape retains a long antenna element, thus maintaining the lowest resonant frequency available for the antenna assembly.
Although the grounding element 111 is shown in fig. 1 as including portions connected end-to-end, it should be noted that the structure of the grounding element 111 is not limited thereto, and the grounding element 111 may include more than two open ends, i.e., the grounding element 111 may include one or more branches extending from a main portion of the grounding element 111. Further, although the grounding element 111 is shown in fig. 1 as having portions of substantially the same width, the portions of the grounding element 111 may have different widths as desired.
Similarly, the feeding element 121 may be of various shapes. For example, the feeding element 121 may be formed as a strip, as shown in fig. 1. As another example, the feeding element 121 may be a conductive elongate strip folded at one or more points. The feeding element 121 may be provided with one or more branches protruding from a main portion of the feeding element 121.
The additional element 131 may be formed in various shapes, as will be discussed below in connection with fig. 4 a-4 f.
The ground element 111, the feed element 121 and the additional element 131 may be made of sheet metal, metal tracks on a carrier, or may be made of a flexible or rigid substrate, a metallized interconnect device (MID: metalized interconnect device), etc. The ground element 111, the feeding element 121, and the additional element 131 may be made of various conductive materials including, but not limited to, silver, copper, etc., transparent conductive oxide (e.g., indium tin oxide ITO), carbon nanotubes, graphene, etc.
With the above arrangement of the antenna radiator 101 in the antenna assembly, the antenna assembly is more compact in size. For example, due to the physical separation and physical disconnection between the ground element and the additional element, the overall physical length of the antenna assembly may be reduced, and the capacitive coupling between the additional element and the ground element during operation of the antenna assembly helps the antenna assembly to function and ensures good performance of the antenna assembly. Accordingly, the antenna assembly according to the present disclosure can be manufactured to have a small size and a thin thickness while ensuring performance and antenna efficiency of the antenna assembly. Thus, the antenna assembly according to the present disclosure can provide good wireless connectivity for a device mounted with the antenna assembly, and facilitate miniaturization of the device.
In one embodiment, the antenna assembly may further comprise a first matching element 102 and a second matching element 103. The first matching element 102 is configured to connect the ground element 111 with a ground plane at the ground point 104. The second matching element 103 is configured to connect the feeding element 121 with the RF circuit at the feeding point 105.
The first matching element 102 and the second matching element 103 may be parallel to each other as shown in fig. 1. In other embodiments, the first matching element 102 and the second matching element 103 may have an included angle, for example, an included angle greater than 0 degrees and less than 30 degrees. The lengths of the two matching elements 102 and 103 may be the same or different.
According to embodiments of the present disclosure, by adjusting the lengths of the matching elements 102 and 103, and the distance between the first matching element 102 and the second matching element 103, the input impedance of the antenna assembly may be changed.
By appropriate arrangement of the matching elements 102 and 103, the antenna assembly may be impedance matched when assembled for an end user environment in order to achieve maximum efficiency when operating at a desired frequency band. The result of the best efficiency is maximum range, minimum power consumption, reduced heating and reliable data throughput.
Fig. 2 is a schematic diagram illustrating one exemplary electrical arrangement of an antenna assembly according to an embodiment of the present disclosure. As shown in fig. 2, the antenna assembly includes an antenna radiator 202 and a dielectric carrier 203 for supporting the antenna radiator 202. The dielectric carrier 203 also serves to dielectrically separate the antenna radiator from the ground plane 201.
The antenna radiator 202 includes a ground element 212, a feed element 222, and an additional element 232. The ground element 212 of the antenna assembly is connected to the ground plane 201 at the ground point 204. Further, the feeding element 222 is connected to the RF circuit at the feeding point 205.
As shown in fig. 2, the ground element 212, the feeding element 222, and the additional element 232 are physically separated and physically disconnected from each other. At least a portion of the ground element 212 extends in the same direction substantially parallel to a portion of the additional element 232 and forms a capacitive coupling between the additional element 232 and the ground element 212 during operation of the antenna assembly.
As shown in fig. 2, the ground plane 201 and the antenna assembly are formed as a planar structure. The planar structure may be formed by etching a Printed Circuit Board (PCB), stamping metal, or by other means.
The dielectric carrier 203 may be formed as a frame, support platform, or the like. The dielectric carrier 203 may be made of plastic, resin, ceramic, or any other suitable material.
In some embodiments, the ground plane 201 and the antenna radiator 202 are formed in different layers of a Printed Circuit Board (PCB).
The ground element 212, the feeding element 222, and the additional element 232 may be implemented by a number of different manufacturing methods, such as stamping metal parts, etching on a flexible insulating layer (FPC: flexible insulating layer) and attaching to conductors of the dielectric carrier 203 using an adhesive layer, or laser direct Structuring (LDS: LASER DIRECT Structuring) techniques.
It is to be noted that the design parameters of the arrangement shown in fig. 2 may be appropriately determined as needed. For example, the lowest resonant frequency of the antenna assembly may be determined by the total length of the ground element 212, the widths of the portions of the ground element 212, and the distance from the ground plane 201. As an example, the antenna assembly depicted in fig. 3 may provide resonance at a frequency band of 2.4GHz-2.48 GHz. It should be noted that antenna assemblies may be designed to operate in other frequency bands or for other communication standards, as the disclosure is not limited in this respect. For example, the antenna assembly may operate according to a wireless communication standard (e.g., 2G, 3G, 4G, or 5G standard) for a cellular network. The antenna assembly may alternatively or additionally be in accordance with a method for use in a frequency band ranging from 2.4GHz to 2.48GHzOperates according to the wireless communication standard.
In addition, the lengths of the ground element 212, the feed element 222, and the additional element 232, and the width of the capacitive gap between the additional element 232 and the ground element 212 may be appropriately determined as needed to optimize the impedance value of the antenna assembly at the resonant frequency and relative bandwidth of the antenna assembly.
The antenna assembly may be connected in other ways within the inventive concepts presented in the present disclosure, all of which fall within the scope of the present disclosure. Fig. 3 is a schematic diagram illustrating another exemplary electrical arrangement of an antenna assembly according to an embodiment of the present disclosure.
Similar to the embodiment of fig. 2, the antenna assembly of fig. 3 comprises an antenna radiator 302 and a dielectric carrier 303 for supporting the antenna radiator 302. The antenna radiator 302 includes a ground element 312, a feed element 322, and an additional element 332 that are physically separated and physically disconnected from each other. At least a portion of the ground element 312 extends in the same direction substantially parallel to a portion of the additional element 332 and forms a capacitive coupling between the additional element 332 and the ground element 312 during operation of the antenna assembly. The dielectric carrier 303 may be formed as a frame, support platform, or the like. The dielectric carrier 303 may be made of plastic, resin, ceramic, or any other suitable material.
Unlike the embodiment of fig. 2, the antenna assembly shown in fig. 3 is connected to the ground plane and RF circuitry via transmission lines. In an embodiment, the antenna assembly may be manufactured as a stand-alone device and may be connected to the ground plane and RF circuitry via a single coaxial cable 301 in a manner that still implements physical separation of the ground element 312 from the feed element 322. Specifically, the coaxial cable 301 is composed of an inner conductor 305 surrounded by a concentric conductive shield 304, the inner conductor 305 and the concentric conductive shield 304 being separated by a dielectric insulator, and the coaxial cable 301 may further have a protective jacket or sheath. The ground element 312 is connected to the ground plane via the conductive shield 304 of the coaxial cable 301. Feed element 322 is connected to the RF circuitry via inner conductor 305. Several exemplary structures and configurations of antenna assemblies according to the present disclosure are shown above. It should be noted that several modifications may be made without departing from the essence of the present disclosure, and such modifications fall within the scope of the present disclosure. Fig. 4 a-4 f are schematic diagrams of exemplary patterns of multi-band antennas according to other embodiments of the present disclosure.
It should be noted that the ground element, the feeding element, and the additional element may be any shape or combination of different shapes including square, triangle, chamfered rectangle, chamfered square, L-shape, or T-shape, which is not limited herein.
In some embodiments, the ground element, the feed element, and the additional element may have different widths. As shown in fig. 4c, 4e and 4f, the additional element may comprise at least one portion that is wider than the other portions. The wider portion may be formed of sheet metal or the like. In the case of a plurality of wider portions, the wider portions may be symmetrically or asymmetrically arranged.
Fig. 5 is a graph illustrating simulated return loss of an antenna assembly provided in accordance with an embodiment of the present disclosure. Fig. 5 shows characteristic valleys representing a corresponding frequency range of about 2.4GHz to 2.48 GHz. It should be noted that although an exemplary frequency band is shown, the present disclosure is not limited in this respect. In other words, an antenna assembly according to the present disclosure may operate in other frequency bands and may operate in accordance with other communication standards.
Fig. 6 is a graph illustrating simulated antenna efficiency of an antenna assembly provided in accordance with an embodiment of the present disclosure. As shown in fig. 6, the antenna assembly proposed according to the present disclosure has good antenna efficiency.
The antenna assembly according to the present disclosure has a simple structure, a compact construction and good multi-band antenna performance. Thus, an antenna assembly according to the present disclosure may provide good wireless connectivity for a device. For example, in a mobile device such as a game device having bluetooth technology for communicating with a wireless controller, if the antenna performance is good, even in a bad environment with high noise and low, for example, in the case where there are a plurality of wireless devices using the same frequency (such as bluetooth, wireless LAN, microwave oven, etc.), these game devices do not have any connection problem between the master device and the controller.
Fig. 7 is a schematic diagram showing an arrangement of an antenna assembly according to an embodiment of the present disclosure. In this embodiment, the antenna radiator includes a ground element and a feed element, and is arranged on a plane different from the ground plane to form a three-dimensional structure. The ground element and the feed element may be supported by a dielectric carrier (not shown). It should be appreciated that the dielectric carrier may be made of plastic, resin, ceramic, or any other suitable material. The ground element and the feed element may be realized by a number of different manufacturing methods. The antenna radiator (including the ground element and the feed element) is formed together with the dielectric carrier (if any) as a planar structure lying in a plane parallel to the ground plane, and the matching element is arranged between the antenna radiator and the ground plane in a plane perpendicular to the ground plane. One of the matching elements connects the ground element of the antenna radiator to the ground plane at the ground point. In the structure shown in fig. 7, the ground point is located within the ground plane, i.e. away from the edge of the ground plane, and the antenna radiator protrudes outwards relative to the ground point, the edge of the antenna radiator being flush with the edge of the ground plane. In this configuration, the antenna radiator face of the antenna assembly is grounded to the ground plane. In the structure shown in fig. 7, the height h1 measured from the antenna radiator to the ground plane needs to have a predetermined value due to the antenna characteristics. Furthermore, the height h1 may further depend on the mechanical design of the device to which the antenna assembly is to be mounted. In a preferred embodiment, the height h1 is greater than 2mm, preferably in the range of 2mm to 10 mm.
Fig. 8 is a schematic diagram illustrating another arrangement of an antenna assembly provided in accordance with an embodiment of the present disclosure. In this embodiment, in the structure shown in fig. 8, the ground point is located at the edge of the ground plane, and the planar antenna radiator protrudes inside the ground plane with respect to the ground point. Furthermore, the edges of the antenna radiator are flush with the edges of the ground plane, and the matching element is connected to both edges. Furthermore, in this structure, the antenna radiator of the antenna assembly faces the ground plane. In the structure shown in fig. 8, the height h2 measured from the antenna radiator to the ground plane needs to have a predetermined value due to the antenna characteristics.
Fig. 9 is a schematic diagram illustrating yet another arrangement of an antenna assembly according to an embodiment of the present disclosure. In the structure shown in fig. 9, the ground point is located at an edge of the ground plane, and the antenna radiator protrudes outside the ground plane with respect to the ground point such that at least a large part of the antenna radiator does not face the ground plane. In the structure shown in fig. 9, the height h3 measured from the antenna radiator to the ground plane may be small. For example, the height h3 may be less than h1, and the height h3 may be less than h2. In an extreme case, by using the arrangement shown in fig. 9, the antenna radiator can be located at the same height as the ground plane, i.e. h2=0. Accordingly, when the antenna assembly is assembled in the housing of the mobile device, no constraint is imposed on the thickness of the housing of the mobile device due to the antenna assembly.
Referring to fig. 10, an electronic device including an antenna assembly according to an embodiment of the present disclosure is shown. The electronic device 1000 of FIG. 10 may be a portable computer, such as a laptop computer, a portable tablet computer, a mobile phone with media player capability, a handheld computer, a remote control, a gaming machine, a Global Positioning System (GPS) device, a desktop computer, a music player, a multi-touch electronic device, augmented Reality (AR) glasses, a head mounted display (HMD: head Mounted Display), a combination of these devices, or any other suitable electronic device. As shown in fig. 10, an electronic device 1000 may include an input-output circuit 1100, a processor 1200, and a memory 1300.
Processor 1200 may be a microprocessor and other suitable integrated circuits. The processor 1200 and the memory 1300 may be configured to control the operation of the electronic device 1000. In an exemplary embodiment, the processor 1200 may run software stored in the memory 1300 of the electronic device 1000, such as operating system functions, telephone call applications, internet browsing, email applications, media playback applications, control functions for controlling radio frequency power amplifiers and other radio frequency transceivers, and so forth.
Memory 1300 may include one or more different types of memory, such as hard drive memory, non-volatile memory (e.g., flash or other electrically programmable read-only memory), volatile memory (e.g., static or dynamic random access memory).
Communication protocols that may be implemented by processor 1200 include internet protocol, cellular telephone protocol, wireless local area network protocol (e.g., IEEE802.11 protocol, referred to as) Protocols for other short-range wireless communication links (e.g., bluetooth protocols), etc.
The input-output circuit 1100 is configured to implement input and output functions of the electronic device 1000. The input-output circuit 1100 may include an input-output device and a wireless communication circuit 1120. The input output 1111 may be a touch screen and other user input devices such as buttons, levers, click wheels, scroll wheels, touch pads, keypads, keyboards, microphones, cameras, and the like. In addition, the input output 1111 may include a display and an audio device such as a Liquid Crystal Display (LCD) screen, light Emitting Diodes (LEDs), organic Light Emitting Diodes (OLEDs), and other components that present visual information and status data.
The wireless communication circuit 1120 may include a Radio Frequency (RF) transceiver circuit 1121 formed of one or more integrated circuits, power amplifier circuits, low noise input amplifiers, passive RF components, and other circuits for processing RF wireless signals. For example, the RF transceiver circuitry 1121 may include cellular transceiver circuitry 1122 for handling wireless communications in cellular frequency bands (e.g., bands of 600MHz, 850MHz, 900MHz, 1800MHz, and 1900MHz, and 2100MHz data bands). The RF transceiver circuitry 1121 may further include WiFi and bluetooth transceiver circuitry 1123 that handles wireless communications for WiFi6E/7 communications in the 2.4GHz to 2.48GHz, 5.15GHz to 5.85GHz, and 5.925GHz to 7.125GHz frequency bands, and the 2.4GHz bluetooth communications band. The wireless communication circuitry 1120 may include circuitry for other short-range and long-range wireless links, if desired. For example, the wireless communication circuitry 1120 may include a Global Positioning System (GPS) receiver device, wireless circuitry for receiving radio and television signals, paging circuitry, and the like.
RF transceiver circuitry 1121 may be implemented using one or more integrated circuits and associated components (e.g., switching circuitry, matching network components (e.g., discrete inductors, capacitors, and resistors), and an integrated circuit filter network, etc.). These devices may be mounted on any suitable mounting structure. With one suitable arrangement, the transceiver integrated circuit may be mounted on a printed circuit board.
The wireless communication circuit 1120 may include an antenna assembly 1124, e.g., as described above by reference to fig. 1, 2, 3, 4 a-4 f, and 7-9, or variations thereof. As described above, the antenna assembly 1124 may be a multi-band antenna. For example, a multi-band antenna may be used to cover multiple cellular telephone communication bands, wiFi communication bands, bluetooth communication bands, etc.
In addition, the wireless communication circuit 1120 may further include other circuits for implementing different communication-related functions. For example, the wireless communication circuit 1120 may include a proximity sensing circuit (not shown). In addition, the wireless communication circuit 1120 may further include a power adjustment circuit (not shown) for adjusting the power of the RF transceiver circuit 1121 in response to a detection result from the proximity sensing circuit.
Connections within RF circuitry 1121 may include any suitable conductive paths over which radio frequency signals may be transmitted, including transmission line structures, such as coaxial cables, microstrip transmission lines, stripline transmission lines, and the like.
During data transfer operations, control signals from the processor 1200 may be transferred to the RF circuitry 1121 to adjust the output power in real time. For example, when data is being transmitted, the RF circuitry 1121 may be directed to increase or decrease the power level of the radio frequency signal provided to the antenna assembly 1124 over a transmission line, thereby ensuring that regulatory limits for electromagnetic radiation emissions are met.
If the proximity sensing circuit has not detected the presence of an external object, power may be provided at the level of normal power control. However, if the proximity measurement indicates that the user's finger or other body part or other external object is in close proximity to the antenna assembly (e.g., within 20mm or less, within 15mm or less, within 10mm or less, etc.), the processor 1200 may respond accordingly by directing the RF circuit 1121 to transmit a radio frequency signal via the transmission line at reduced power.
In addition to the components shown, the electronic device 1000 may include other components for different functions. For example, electronic device 1000 typically includes a housing that can be formed to serve as a ground plane for antenna assembly 1124.
For further details of the electronic device 1000, reference may be made to the foregoing description of the antenna assembly according to an embodiment of the disclosure, which is not repeated here.
Embodiments of the present disclosure are described in a progressive manner, and each embodiment emphasizes differences from the other embodiments. Thus, for the same or similar components, one embodiment may refer to other embodiments. Since the method disclosed in the embodiment corresponds to the apparatus disclosed in the embodiment, the description of the method is simple, and reference may be made to the relevant part of the apparatus.
Those skilled in the art may make or use the present disclosure in light of the description of the disclosed embodiments. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the disclosure. Thus, the present disclosure is not intended to be limited to the embodiments described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed in the present disclosure.