CN110017942A - A kind of packaging method for fuel pressure transmitter - Google Patents
A kind of packaging method for fuel pressure transmitter Download PDFInfo
- Publication number
- CN110017942A CN110017942A CN201910427442.7A CN201910427442A CN110017942A CN 110017942 A CN110017942 A CN 110017942A CN 201910427442 A CN201910427442 A CN 201910427442A CN 110017942 A CN110017942 A CN 110017942A
- Authority
- CN
- China
- Prior art keywords
- ceramic substrate
- pressure sensor
- ceramic
- sintering
- glass paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
- G01L19/14—Housings
- G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Fluid Pressure (AREA)
Abstract
The invention discloses a kind of packaging methods for fuel pressure transmitter, belong to field of semiconductor processing.This method is by obtaining MESM pressure sensor chip and ceramic package shell, glass paste is drawn onto ceramic substrate using glue mode is drawn, MEMS pressure sensor chip is placed on the glass paste of ceramic substrate using loading device, the ceramic substrate that load is completed is placed into sintering furnace, glass paste sintering is carried out by sintering temperature, using gold thread bonding apparatus routing on ceramic substrate after the completion of sintering, ceramic cover plate is being set on ceramic substrate；It solves that existing pressure sensor is not corrosion-resistant, is not used to that there is the problem of pressure test of corrosive medium；Corrosion resistance, air-tightness, the long-time stability for improving pressure sensor are reached, the pressure test for enabling pressure sensor can be used for having the media such as corrosive gas, liquid increases the effect of the usage scenario of pressure sensor.
Description
Technical field
The present embodiments relate to field of semiconductor processing, in particular to a kind of encapsulation side for fuel pressure transmitter
Method.
Background technique
Pressure sensor is to experience pressure, and provide the device for the voltage output signal being directly proportional to the pressure.
Traditional pressure sensor is usually completed by ceramics plus thick film screen printing, but measuring accuracy is poor, and cost is relatively
Height, MEMS pressure sensor become the mainstream product in the market since process consistency is high, precision is high, at low cost.
However, traditional MEMS pressure sensor connects pressure sensor chip by silica type or epoxy resin glue
And encapsulating package, encapsulating package are injection molding or ceramics or metal, the medium of pressure test is guided by shell, with encapsulate glue and
The silicon structure of pressure sensor chip bottom contacts, and is only used for the pressure test of conventional gas or water.When fuel oil is as survey
When trying medium, there is fuel oil that there is corrosivity, silica type or epoxy resin glue easily fail, conventional MEMS pressure sensor
The stability under fuel oil is not all can guarantee with encapsulation glue.
Summary of the invention
In order to solve problems in the prior art, the embodiment of the invention provides a kind of encapsulation for fuel pressure transmitter
Method.The technical solution is as follows:
In a first aspect, a kind of packaging method for fuel pressure transmitter is provided, this method comprises:
It obtains MEMS pressure sensor chip and ceramic package shell, ceramic package shell includes ceramic substrate and ceramic cap
Plate；
Glass paste is drawn onto ceramic substrate using glue mode is drawn, and utilizes loading device by MEMS pressure sensor core
Piece is placed on the glass paste of ceramic substrate；
The ceramic substrate that load is completed is placed into sintering furnace, carries out glass paste sintering by sintering temperature curve；
Using gold thread bonding apparatus routing on ceramic substrate after the completion of sintering, ceramic cap is set on ceramic substrate
Plate.
Optionally, the fuel oil test mouth on ceramic substrate is directed at MEMS pressure sensor chip.
Optionally, venthole is provided on ceramic cover plate.
Technical solution provided in an embodiment of the present invention has the benefit that
By obtaining MESM pressure sensor chip and ceramic package shell, glass paste is drawn to pottery using glue mode is drawn
On porcelain substrate, MEMS pressure sensor chip is placed on the glass paste of ceramic substrate using loading device, load is complete
At ceramic substrate be placed into sintering furnace, by sintering temperature carry out glass paste sintering, be sintered using gold thread bonding apparatus
Ceramic cover plate is being arranged in routing on ceramic substrate after the completion on ceramic substrate；Solve existing pressure sensor intolerant to
Corrosion, is not used to have the problem of pressure test of corrosive medium；Reached improve pressure sensor corrosion resistance,
Air-tightness, long-time stability, the pressure test for enabling pressure sensor can be used for that there are the media such as corrosive gas, liquid,
Increase the effect of the usage scenario of pressure sensor.
Detailed description of the invention
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing.
Fig. 1 is a kind of schematic diagram of sintering temperature curve；
Fig. 2 is a kind of encapsulating structure of fuel pressure transmitter shown according to an exemplary embodiment.
Specific embodiment
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to embodiment party of the present invention
Formula is described in further detail.
The embodiment of the invention provides a kind of packaging method for fuel pressure transmitter, this method includes following technique
Step:
1, MEMS pressure sensor chip and ceramic package shell are obtained.
According to the test request of fuel pressure, the MEMS pressure sensor chip of suitable range and type is selected.
Ceramic package shell is selected, ceramic package shell includes ceramic substrate and ceramic cover plate, using the envelope of ceramic material
Tubulature shell can prevent fuel pressure test process intermediate fuel oil from corroding encapsulating package.
2, glass paste is drawn on ceramic substrate using drawing glue mode, and with loading device by MEMS pressure sensor core
Piece is placed on the glass paste of ceramic substrate.
Optionally, glass paste selects the 3600P type low temperature glass slurry of Henkel Corp., this glass paste has glass
The features such as body is fine and close, anticorrosive strong, encapsulation stress is small.
Glass paste smoothing regulation is drawn onto ceramic substrate using glue mode is drawn, is grabbed using DIE BONDIND equipment
MEMS pressure sensor chip to be packaged is taken, and MEMS pressure sensor chip is placed into the glass paste on ceramic substrate
On；Check whether placement location and depth meet design requirement after placing MEMS pressure sensor chip.
3, the ceramic substrate that load is completed is placed into sintering furnace, carries out glass paste sintering by sintering temperature curve.
In glass paste sintering, there is air participation, the sintering temperature curve of glass paste is as shown in Figure 1, i.e. first by furnace
Temperature is increased to 200 DEG C from room temperature, stops 45 minutes at 200 DEG C, is then increased to 300 DEG C from 200 DEG C, stops 30 points at 300 DEG C
Then clock naturally cools to room temperature from 300 DEG C, complete the sintering of glass paste.After the completion of glass paste sintering, MEMS pressure is passed
Sensor chip is fixed on ceramic substrate.
4, routing on the ceramic substrate using gold thread bonding apparatus after the completion of sintering, is arranged ceramic cap on ceramic substrate
Plate.
After the product in sintering furnace is fully cooled, product is taken out, is completed using WIRE BONDIND equipment in sintering
MEMS pressure sensor chip connect with lead, and ceramic cover plate is arranged on ceramic substrate by routing on ceramic substrate afterwards；
Then it tests test, completes the encapsulation of fuel pressure transmitter.
Fuel pressure transmitter after encapsulation is as shown in Fig. 2, be provided with MEMS pressure sensor chip on ceramic substrate 12
13, MEMS pressure sensor chip 13 is fixed on ceramic substrate 12 by glass paste 14, the pin 15 on ceramic substrate 12
It being connected with MEMS pressure sensor chip 13 by lead 17, ceramic cover plate 11 covers on ceramic substrate 12, and one of pin 15
Divide in ceramic cover plate 11.Venthole 16 is provided on ceramic cover plate 11, the fuel oil test mouth 17 on ceramic substrate is directed at ceramics
MEMS pressure sensor chip in encapsulating package.
In conclusion the embodiment of the present invention is by obtaining MESM pressure sensor chip and ceramic package shell, using drawing
Glue mode draws glass paste onto ceramic substrate, and MEMS pressure sensor chip is placed into ceramic substrate using loading device
Glass paste on, the ceramic substrate that load is completed is placed into sintering furnace, carries out glass paste sintering by sintering temperature, it is sharp
With gold thread bonding apparatus routing on ceramic substrate after the completion of sintering, ceramic cover plate is being set on ceramic substrate；It solves
Existing pressure sensor is not corrosion-resistant, is not used to have the problem of pressure test of corrosive medium；Raising is reached
Corrosion resistance, air-tightness, the long-time stability of pressure sensor, enable pressure sensor can be used for having corrosive gas,
The pressure test of the media such as liquid increases the effect of the usage scenario of pressure sensor.
It should be understood that the serial number of the above embodiments of the invention is only for description, do not represent the advantages or disadvantages of the embodiments.
The foregoing is merely presently preferred embodiments of the present invention, is not intended to limit the invention, it is all in spirit of the invention and
Within principle, any modification, equivalent replacement, improvement and so on be should all be included in the protection scope of the present invention.
Claims (3)
1. a kind of packaging method for fuel pressure transmitter, which is characterized in that the described method includes:
MEMS pressure sensor chip and ceramic package shell are obtained, the ceramic package shell includes ceramic substrate and ceramic cap
Plate；
Glass paste is drawn onto the ceramic substrate using glue mode is drawn, and utilizes loading device by MEMS pressure sensor core
Piece is placed on the glass paste of the ceramic substrate；
The ceramic substrate that load is completed is placed into sintering furnace, carries out glass paste sintering by sintering temperature curve；
Using gold thread bonding apparatus routing on ceramic substrate after the completion of sintering, ceramic cover plate is set on ceramic substrate.
2. packaging method according to claim 1, which is characterized in that the fuel oil test mouth alignment on the ceramic substrate
MEMS pressure sensor chip.
3. packaging method according to claim 1, which is characterized in that be provided with venthole on the ceramic cover plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910427442.7A CN110017942A (en) | 2019-05-22 | 2019-05-22 | A kind of packaging method for fuel pressure transmitter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910427442.7A CN110017942A (en) | 2019-05-22 | 2019-05-22 | A kind of packaging method for fuel pressure transmitter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110017942A true CN110017942A (en) | 2019-07-16 |
Family
ID=67194231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910427442.7A Pending CN110017942A (en) | 2019-05-22 | 2019-05-22 | A kind of packaging method for fuel pressure transmitter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110017942A (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110672259A (en) * | 2019-11-11 | 2020-01-10 | 昆山灵科传感技术有限公司 | Packaging module and pressure sensor adopting same |
| CN110749394A (en) * | 2019-11-21 | 2020-02-04 | 龙微科技无锡有限公司 | High-reliability pressure sensor |
| CN110824181A (en) * | 2019-10-18 | 2020-02-21 | 中国航空工业集团公司西安飞行自动控制研究所 | Signal connection method for low-resistance sensitive device |
| CN111855076A (en) * | 2020-07-24 | 2020-10-30 | 深圳信息职业技术学院 | Packaging mechanism and packaging method for packaging and testing pressure sensor chips |
| CN112556897A (en) * | 2020-12-10 | 2021-03-26 | 龙微科技无锡有限公司 | Corrosion-resistant pressure sensor chip assembly structure and method |
| CN112665775A (en) * | 2020-12-18 | 2021-04-16 | 深圳安培龙科技股份有限公司 | Novel differential pressure sensor and packaging method thereof |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533818A (en) * | 2008-03-12 | 2009-09-16 | 先进开发光电股份有限公司 | Package structure of integrated circuit element and manufacturing method thereof |
| CN101867024A (en) * | 2010-06-01 | 2010-10-20 | 友达光电股份有限公司 | Encapsulation method |
| WO2011092137A2 (en) * | 2010-01-29 | 2011-08-04 | Epcos Ag | Miniaturized electrical component comprising an mems and an asic and production method |
| CN202614454U (en) * | 2012-04-28 | 2012-12-19 | 无锡永阳电子科技有限公司 | So8 plastic package sensor |
| CN103487176A (en) * | 2013-09-24 | 2014-01-01 | 中国科学院微电子研究所 | Packaging structure and method of pressure sensor |
| CN103616123A (en) * | 2013-11-22 | 2014-03-05 | 中航（重庆）微电子有限公司 | Pressure sensor and manufacturing method thereof |
| US20170191892A1 (en) * | 2016-01-05 | 2017-07-06 | DunAn Sensing, LLC | Methods and apparatus for packaging a mems device |
| CN208588488U (en) * | 2018-08-31 | 2019-03-08 | 歌尔科技有限公司 | a pressure sensor |
-
2019
- 2019-05-22 CN CN201910427442.7A patent/CN110017942A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101533818A (en) * | 2008-03-12 | 2009-09-16 | 先进开发光电股份有限公司 | Package structure of integrated circuit element and manufacturing method thereof |
| WO2011092137A2 (en) * | 2010-01-29 | 2011-08-04 | Epcos Ag | Miniaturized electrical component comprising an mems and an asic and production method |
| CN101867024A (en) * | 2010-06-01 | 2010-10-20 | 友达光电股份有限公司 | Encapsulation method |
| CN202614454U (en) * | 2012-04-28 | 2012-12-19 | 无锡永阳电子科技有限公司 | So8 plastic package sensor |
| CN103487176A (en) * | 2013-09-24 | 2014-01-01 | 中国科学院微电子研究所 | Packaging structure and method of pressure sensor |
| CN103616123A (en) * | 2013-11-22 | 2014-03-05 | 中航（重庆）微电子有限公司 | Pressure sensor and manufacturing method thereof |
| US20170191892A1 (en) * | 2016-01-05 | 2017-07-06 | DunAn Sensing, LLC | Methods and apparatus for packaging a mems device |
| CN208588488U (en) * | 2018-08-31 | 2019-03-08 | 歌尔科技有限公司 | a pressure sensor |
Non-Patent Citations (1)
| Title |
|---|
| 喻兰芳等: "玻璃浆料键合气密性研究", 《传感器与微系统》 * |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110824181A (en) * | 2019-10-18 | 2020-02-21 | 中国航空工业集团公司西安飞行自动控制研究所 | Signal connection method for low-resistance sensitive device |
| CN110824181B (en) * | 2019-10-18 | 2021-10-15 | 中国航空工业集团公司西安飞行自动控制研究所 | Signal connection method for low-resistance sensitive device |
| CN110672259A (en) * | 2019-11-11 | 2020-01-10 | 昆山灵科传感技术有限公司 | Packaging module and pressure sensor adopting same |
| CN110749394A (en) * | 2019-11-21 | 2020-02-04 | 龙微科技无锡有限公司 | High-reliability pressure sensor |
| CN111855076A (en) * | 2020-07-24 | 2020-10-30 | 深圳信息职业技术学院 | Packaging mechanism and packaging method for packaging and testing pressure sensor chips |
| CN111855076B (en) * | 2020-07-24 | 2021-10-08 | 深圳信息职业技术学院 | Packaging mechanism and packaging method for packaging and testing pressure sensor chips |
| CN112556897A (en) * | 2020-12-10 | 2021-03-26 | 龙微科技无锡有限公司 | Corrosion-resistant pressure sensor chip assembly structure and method |
| CN112665775A (en) * | 2020-12-18 | 2021-04-16 | 深圳安培龙科技股份有限公司 | Novel differential pressure sensor and packaging method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110017942A (en) | A kind of packaging method for fuel pressure transmitter | |
| CN101832830B (en) | Flush packaged pressure sensor with high temperature resistance and high frequency response | |
| CN104282698B (en) | Two-stage packaging method for image sensor | |
| CN103257007B (en) | Pressure sensor dielectric medium isolation packaging structure and packaging method of same | |
| CN111638002A (en) | MEMS pressure sensor oil-filled core and packaging method thereof | |
| CN109534282B (en) | Production process of dielectric isolation type pressure sensor based on flip chip | |
| CN107664555A (en) | Media isolation type pressure sensor packaging structure and its method for packing | |
| CN110207885A (en) | Pressure sensor core, core manufacture and packaging method and pressure sensor based on upside-down mounting welding core | |
| CN200989838Y (en) | Pressure sensor | |
| CN203178006U (en) | Pressure Sensor Package Structure | |
| CN105527454B (en) | A kind of highly sensitive hot type air velocity transducer and its packaging method | |
| CN209013920U (en) | A kind of micro-foil resistance strain gauge for circular plate type sensor | |
| US10928263B2 (en) | Sensor device having adhesive between sensor portion and casing portion | |
| CN111024303B (en) | Waterproof air pressure sensor and method of making the same | |
| CN202631163U (en) | Inner hole sealing structure of ceramic pressure sensor | |
| CN205580662U (en) | Pressure sensor integration gauge pressure base | |
| CN208984269U (en) | Based on upside-down mounting welding core media isolation type pressure sensor | |
| JP5665197B2 (en) | Pressure sensor | |
| CN109387225A (en) | A kind of MEMS inertia device and its unstressed Denso method | |
| CN104465790A (en) | MEMS pressure sensor and packaging method thereof | |
| CN106644185A (en) | High precision resonance pressure sensor chip body base | |
| CN105784251B (en) | Corrosion-resistant differential pressure core and manufacturing method thereof | |
| CN116705817B (en) | Packaging process and packaging structure of a high-reliability image sensor | |
| JP2008275357A (en) | Semiconductor pressure sensor device | |
| CN105115659A (en) | Multi-redundancy pressure-sensitive core body |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190716 |