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CN110029376A - Alloy layer, workpiece and electroplate liquid - Google Patents

Alloy layer, workpiece and electroplate liquid Download PDF

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Publication number
CN110029376A
CN110029376A CN201810026430.9A CN201810026430A CN110029376A CN 110029376 A CN110029376 A CN 110029376A CN 201810026430 A CN201810026430 A CN 201810026430A CN 110029376 A CN110029376 A CN 110029376A
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Prior art keywords
plating layer
nickel
workpiece
cobalt
alloy
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张代琼
朱振宇
黄忠喜
周建坤
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Tyco Electronics Shanghai Co Ltd
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Tyco Electronics Shanghai Co Ltd
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    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00Electroplating: Baths therefor
    • C25D3/02Electroplating: Baths therefor from solutions
    • C25D3/56Electroplating: Baths therefor from solutions of alloys
    • C25D3/562Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of iron or nickel or cobalt
    • CCHEMISTRY; METALLURGY
    • C25ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25DPROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/10Electroplating with more than one layer of the same or of different metals
    • C25D5/12Electroplating with more than one layer of the same or of different metals at least one layer being of nickel or chromium

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemically Coating (AREA)

Abstract

本发明公开一种合金镀层、形成有该合金镀层的工件以及用于形成该合金镀层的电镀液。前述合金镀层至少包含镍、钴和磷。在本发明中,合金镀层既具有镍或钴的较低应力,缓解了接合力差的问题,又有Ni‑Co的耐磨性,同时兼备Ni‑P的耐蚀性、高温焊锡不变色等优点,从而提高了合金镀层的综合性能。

The invention discloses an alloy plating layer, a workpiece formed with the alloy plating layer and an electroplating solution for forming the alloy plating layer. The aforementioned alloy plating layer contains at least nickel, cobalt and phosphorus. In the present invention, the alloy plating layer not only has the lower stress of nickel or cobalt, which alleviates the problem of poor bonding force, but also has the wear resistance of Ni-Co, and also has the corrosion resistance of Ni-P, and the high temperature solder does not change color, etc. Advantages, thereby improving the overall performance of the alloy coating.

Description

合金镀层、工件和电镀液Alloy Coatings, Workpieces and Electroplating Solutions

技术领域technical field

本发明涉及一种合金镀层、形成有该合金镀层的工件以及用于形成该合金镀层的电镀液。The invention relates to an alloy plating layer, a workpiece formed with the alloy plating layer and an electroplating solution for forming the alloy plating layer.

背景技术Background technique

目前业界一直用镍镀层,用于接插件端子和外壳的防护与耐磨等,但随着近年手机等通讯产品使用频次高,更新换代加速,对耐汗水、防护性、耐磨性等要求也越来越高,镍镀层已没法满足部分性能要求。At present, nickel plating has been used in the industry for the protection and wear resistance of connector terminals and shells. However, with the high frequency of use of communication products such as mobile phones in recent years, the upgrading has accelerated, and the requirements for sweat resistance, protection and wear resistance are also increasing. Getting higher and higher, nickel plating can no longer meet some performance requirements.

目前业界普遍用1um金、钯等贵重金属作为接插件端子的最外层来降低接触阻抗,而作为导电层,0.5um金已足够,但因贵金属之下的镍镀层作为中间镀层不耐腐蚀,往往通过增加贵重金属镀层的厚度来起到部分防护作用。为了节省成本,目前业界已有用Ni-P或Ni-W来部分取代镍,降低贵重金属镀层厚度,但因Ni-P或Ni-W内应力高、接合力差、导磁性下降等缺点,此项应用并不广泛。At present, the industry generally uses 1um gold, palladium and other precious metals as the outermost layer of the connector terminal to reduce the contact resistance, and as a conductive layer, 0.5um gold is enough, but because the nickel coating under the precious metal is not resistant to corrosion as an intermediate coating, Partial protection is often achieved by increasing the thickness of the precious metal coating. In order to save costs, Ni-P or Ni-W has been used to partially replace nickel in the industry to reduce the thickness of precious metal plating. Items are not widely used.

目前业界有部分企业在镀锡层之下镀一薄层Ni-P,来解决高温焊锡变色(Reflow)、氧化、焊接力不够等焊锡不良问题。但因Ni-P操作范围窄、应力高等特性,耐高温性能并不稳定,同时与锡层之间的结合力差,也让很多企业打消了使用Ni-P的念头,或只用在回流焊(Reflow)温度高的、结构复杂的产品上,其它镀锡产品仍用普通镍镀层作为中间层。At present, some companies in the industry are plating a thin layer of Ni-P under the tin plating layer to solve the problems of poor soldering such as high temperature solder discoloration (Reflow), oxidation, and insufficient welding force. However, due to the narrow operating range and high stress of Ni-P, the high temperature resistance performance is not stable, and at the same time, the bonding force between the Ni-P and the tin layer is poor, which also makes many companies give up the idea of using Ni-P, or only use it in reflow soldering. (Reflow) On products with high temperature and complex structure, other tin-plated products still use ordinary nickel plating as the intermediate layer.

铬镀层作为最外镀层,常用在汽车轮毂和刹车件等易磨损的零件,目前业界一直用铬镀层作为最外镀层来增加表面硬度,但铬镀层对环境的冲击很大,Ni-Co镀层作为代铬镀层的首选,曾在欧美应用较多,但因耐蚀性不及铬镀层及其鈍化层,不适用于汽车轮毂和刹车件等要求耐磨与耐蚀兼顾的零件。As the outermost coating, chrome plating is often used in parts that are easy to wear such as automobile wheels and brake parts. At present, the industry has always used chrome plating as the outermost coating to increase the surface hardness, but the chrome plating has a great impact on the environment. The first choice for replacing chrome plating has been widely used in Europe and the United States, but because the corrosion resistance is not as good as that of chrome plating and its passivation layer, it is not suitable for parts that require both wear and corrosion resistance such as automobile wheels and brakes.

发明内容SUMMARY OF THE INVENTION

本发明的目的旨在解决现有技术中存在的上述问题和缺陷的至少一个方面。The purpose of the present invention is to solve at least one aspect of the above-mentioned problems and deficiencies in the prior art.

根据本发明的一个方面,提供一种合金镀层,所述合金镀层至少包含镍(Ni)、钴(Co)和磷(P)。According to one aspect of the present invention, there is provided an alloy plating layer including at least nickel (Ni), cobalt (Co) and phosphorus (P).

根据本发明的一个实例性的实施例,所述合金镀层包含10~40wt%的钴、1~12wt%的磷和40~89wt%的镍。According to an exemplary embodiment of the present invention, the alloy plating layer includes 10-40 wt % of cobalt, 1-12 wt % of phosphorus and 40-89 wt % of nickel.

根据本发明的另一个实例性的实施例,所述合金镀层除了包含镍、钴和磷之外,还包含至少一种其他金属元素。According to another exemplary embodiment of the present invention, in addition to nickel, cobalt and phosphorus, the alloy plating layer further includes at least one other metal element.

根据本发明的另一个实例性的实施例,所述合金镀层还包含钨。According to another exemplary embodiment of the present invention, the alloy plating layer further includes tungsten.

根据本发明的另一个实例性的实施例,所述合金镀层为仅包含镍、钴和磷的三元合金镀层。According to another exemplary embodiment of the present invention, the alloy coating is a ternary alloy coating containing only nickel, cobalt and phosphorus.

根据本发明的另一个实例性的实施例,所述合金镀层包含10~40wt%的钴、1~12wt%的磷和48~89wt%的镍。According to another exemplary embodiment of the present invention, the alloy plating layer includes 10-40 wt % of cobalt, 1-12 wt % of phosphorus and 48-89 wt % of nickel.

根据本发明的另一个方面,提供一种工件,在所述工件上形成有前述合金镀层。According to another aspect of the present invention, there is provided a workpiece on which the aforementioned alloy plating layer is formed.

根据本发明的一个实例性的实施例,所述合金镀层为形成在所述工件上的底层镀层、中间镀层或最外镀层。According to an exemplary embodiment of the present invention, the alloy plating layer is a bottom plating layer, an intermediate plating layer or an outermost plating layer formed on the workpiece.

根据本发明的另一个实例性的实施例,所述工件的基材为金属部件或非金属部件。According to another exemplary embodiment of the present invention, the base material of the workpiece is a metal part or a non-metal part.

根据本发明的另一个方面,提供一种电镀液,适于在工件上电镀形成前述合金镀层。According to another aspect of the present invention, an electroplating solution is provided, which is suitable for electroplating the aforementioned alloy plating layer on a workpiece.

根据本发明的一个实例性的实施例,所述电镀液至少包含以下成分:250~500g/l的氨基磺酸镍、5~50g/l的氨基磺酸钴、5~50g/l的次磷酸钠、15~60g/l的氯化镍、30~50g/l的硼酸、1~5g/l的氟化钠、0.5~1g/l的邻苯甲酰磺酰亚胺钠、0.2~0.3g/l的1-4丁炔二醇、0.01~0.1g/l的十二烷基磺酸钠和0.5~6g/l的氨基磺酸。According to an exemplary embodiment of the present invention, the electroplating solution at least comprises the following components: 250-500 g/l nickel sulfamate, 5-50 g/l cobalt sulfamate, 5-50 g/l hypophosphorous acid Sodium, 15~60g/l nickel chloride, 30~50g/l boric acid, 1~5g/l sodium fluoride, 0.5~1g/l sodium phthaloylsulfonimide, 0.2~0.3g /l of 1-4 butynediol, 0.01 to 0.1 g/l of sodium dodecyl sulfonate and 0.5 to 6 g/l of sulfamic acid.

根据本发明的另一个实例性的实施例,所述电镀液至少包含以下成分:100~300g/l的硫酸镍、5~50g/l的氨基磺酸钴、5~50g/l的次磷酸钠、15~60g/l的氯化镍、30~50g/l的硼酸、1~5g/l的氟化钠、0.5~1g/l的邻苯甲酰磺酰亚胺钠、0.2~0.3g/l的1-4丁炔二醇、0.01~0.1g/l的十二烷基磺酸钠和1~10ml/l的硫酸。According to another exemplary embodiment of the present invention, the electroplating solution at least comprises the following components: 100-300 g/l nickel sulfate, 5-50 g/l cobalt sulfamate, 5-50 g/l sodium hypophosphite , 15~60g/l nickel chloride, 30~50g/l boric acid, 1~5g/l sodium fluoride, 0.5~1g/l sodium phthaloyl sulfonimide, 0.2~0.3g/l l 1-4 butynediol, 0.01~0.1g/l sodium dodecyl sulfonate and 1~10ml/l sulfuric acid.

在根据本发明的前述各个实例性的实施例中,合金镀层包含有镍、钴和磷,因此,其既具有镍或钴的较低应力,缓解了接合力差的问题,又有Ni-Co的耐磨性,同时兼备Ni-P的耐蚀性、高温焊锡不变色等优点,从而提高了合金镀层的综合性能。In each of the foregoing exemplary embodiments according to the present invention, the alloy plating layer contains nickel, cobalt and phosphorus, so it has both the lower stress of nickel or cobalt, which alleviates the problem of poor bonding force, and the Ni-Co It also has the advantages of Ni-P corrosion resistance and no discoloration of high temperature solder, thereby improving the comprehensive performance of the alloy coating.

通过下文中参照附图对本发明所作的描述,本发明的其它目的和优点将显而易见,并可帮助对本发明有全面的理解。Other objects and advantages of the present invention will be apparent from the following description of the present invention with reference to the accompanying drawings, and may assist in a comprehensive understanding of the present invention.

附图说明Description of drawings

图1显示根据本发明的一个实例性的实施例的用于在工件上电镀形成一层合金镀层的电镀池的示意图;Fig. 1 shows the schematic diagram of the electroplating bath for electroplating to form a layer of alloy coating on the workpiece according to an exemplary embodiment of the present invention;

图2显示金属镀层作为工件的底层镀层的示意图;Fig. 2 shows the schematic diagram of metal coating as the bottom coating of workpiece;

图3显示金属镀层作为工件的中间镀层的示意图;Figure 3 shows a schematic diagram of a metal coating as an intermediate coating for a workpiece;

图4显示金属镀层作为工件的最外镀层的示意图。Figure 4 shows a schematic diagram of a metal coating as the outermost coating of a workpiece.

具体实施方式Detailed ways

下面通过实施例,并结合附图,对本发明的技术方案作进一步具体的说明。在说明书中,相同或相似的附图标号指示相同或相似的部件。下述参照附图对本发明实施方式的说明旨在对本发明的总体发明构思进行解释,而不应当理解为对本发明的一种限制。The technical solutions of the present invention will be further described in detail below through embodiments and in conjunction with the accompanying drawings. In the specification, the same or similar reference numerals refer to the same or similar parts. The following description of the embodiments of the present invention with reference to the accompanying drawings is intended to explain the general inventive concept of the present invention, and should not be construed as a limitation of the present invention.

另外,在下面的详细描述中,为便于解释,阐述了许多具体的细节以提供对本披露实施例的全面理解。然而明显地,一个或多个实施例在没有这些具体细节的情况下也可以被实施。在其他情况下,公知的结构和装置以图示的方式体现以简化附图。Furthermore, in the following detailed description, for convenience of explanation, numerous specific details are set forth in order to provide a thorough understanding of the embodiments of the present disclosure. Obviously, however, one or more embodiments may be practiced without these specific details. In other instances, well-known structures and devices are shown in diagram form in order to simplify the drawings.

根据本发明的一个总体技术构思,提供一种合金镀层,所述合金镀层至少包含镍(Ni)、钴(Co)和磷(P)。According to a general technical concept of the present invention, an alloy plating layer is provided, and the alloy plating layer contains at least nickel (Ni), cobalt (Co) and phosphorus (P).

图1显示根据本发明的一个实例性的实施例的用于在工件20上电镀形成一层合金镀层20a(参见图2至图4)的电镀池的示意图。1 shows a schematic diagram of an electroplating bath for electroplating an alloy plating layer 20a (see FIGS. 2 to 4 ) on a workpiece 20 according to an exemplary embodiment of the present invention.

如图1所示,在图示的实施例中,在电镀池中容纳有电镀液100。工件20作为电镀池的阴极,电镀池的阳极10采用含硫镍板或镍珠。阳极10和阴极分别连接至电源的正极、负极。当通电时,电镀液中的镍(Ni)、钴(Co)和磷(P)等金属就会沉积在工件20的表面上,形成一层合金镀层20a(参见图2至图4)。As shown in FIG. 1, in the illustrated embodiment, an electroplating bath 100 is contained in the electroplating bath. The workpiece 20 is used as the cathode of the electroplating cell, and the anode 10 of the electroplating cell is made of sulfur-containing nickel plates or nickel beads. The anode 10 and the cathode are connected to the positive and negative electrodes of the power supply, respectively. When electrified, metals such as nickel (Ni), cobalt (Co) and phosphorus (P) in the electroplating solution are deposited on the surface of the workpiece 20 to form an alloy plating layer 20a (see FIGS. 2 to 4 ).

在本发明的一个实例性的实施例中,前述合金镀层20a至少包含镍、钴和磷。In an exemplary embodiment of the present invention, the aforementioned alloy plating layer 20a contains at least nickel, cobalt and phosphorus.

在本发明的一个实例性的实施例中,前述合金镀层20a可以包含10~40wt%的钴、1~12wt%的磷和40~89wt%的镍。In an exemplary embodiment of the present invention, the aforementioned alloy plating layer 20a may contain 10-40 wt % of cobalt, 1-12 wt % of phosphorus, and 40-89 wt % of nickel.

在本发明的另一个实例性的实施例中,前述合金镀层20a除了包含镍、钴和磷之外,还包含至少一种其他金属元素,例如,还可以包含金属钨。In another exemplary embodiment of the present invention, in addition to nickel, cobalt and phosphorus, the aforementioned alloy plating layer 20a also includes at least one other metal element, for example, metal tungsten.

在本发明的另一个实例性的实施例中,前述合金镀层20a可以为仅包含镍、钴和磷的三元合金镀层。此时,该合金镀层可以包含10~40wt%的钴、1~12wt%的磷和48~89wt%的镍。In another exemplary embodiment of the present invention, the aforementioned alloy plating layer 20a may be a ternary alloy plating layer containing only nickel, cobalt and phosphorus. At this time, the alloy plating layer may contain 10-40 wt % of cobalt, 1-12 wt % of phosphorus, and 48-89 wt % of nickel.

在本发明的一个实例性的实施例中,前述电镀液至少包含以下成分:250~500g/l的氨基磺酸镍、5~50g/l的氨基磺酸钴、5~50g/l的次磷酸钠、15~60g/l的氯化镍、30~50g/l的硼酸、1~5g/l的氟化钠、0.5~1g/l的邻苯甲酰磺酰亚胺钠、0.2~0.3g/l的1-4丁炔二醇、0.01~0.1g/l的十二烷基磺酸钠和0.5~6g/l的氨基磺酸。In an exemplary embodiment of the present invention, the aforementioned electroplating solution at least comprises the following components: 250-500 g/l nickel sulfamate, 5-50 g/l cobalt sulfamate, 5-50 g/l hypophosphorous acid Sodium, 15~60g/l nickel chloride, 30~50g/l boric acid, 1~5g/l sodium fluoride, 0.5~1g/l sodium phthaloylsulfonimide, 0.2~0.3g /l of 1-4 butynediol, 0.01 to 0.1 g/l of sodium dodecyl sulfonate and 0.5 to 6 g/l of sulfamic acid.

在本发明的另一个实例性的实施例中,前述电镀液至少包含以下成分:100~300g/l的硫酸镍、5~50g/l的氨基磺酸钴、5~50g/l的次磷酸钠、15~60g/l的氯化镍、30~50g/l的硼酸、1~5g/l的氟化钠、0.5~1g/l的邻苯甲酰磺酰亚胺钠、0.2~0.3g/l的1-4丁炔二醇、0.01~0.1g/l的十二烷基磺酸钠和1~10ml/l的硫酸。In another exemplary embodiment of the present invention, the aforementioned electroplating solution at least comprises the following components: 100-300 g/l nickel sulfate, 5-50 g/l cobalt sulfamate, 5-50 g/l sodium hypophosphite , 15~60g/l nickel chloride, 30~50g/l boric acid, 1~5g/l sodium fluoride, 0.5~1g/l sodium phthaloyl sulfonimide, 0.2~0.3g/l l 1-4 butynediol, 0.01~0.1g/l sodium dodecyl sulfonate and 1~10ml/l sulfuric acid.

请注意,适于形成前述合金镀层20a的电镀液的配方不局限于前述实施例,还可以是其他配方,只要改电镀液能够形成前述合金镀层20a即可。Please note that the formulation of the electroplating solution suitable for forming the aforementioned alloy plating layer 20a is not limited to the aforementioned embodiments, and may be other formulations, as long as the plating solution can be modified to form the aforementioned alloy plating layer 20a.

下表一详细地说明根据本发明的前述实施例的电镀液的配方以及电镀时的操作条件。Table 1 below describes in detail the formulations of the electroplating solutions and the operating conditions during electroplating according to the foregoing embodiments of the present invention.

表一Table I

图2显示金属镀层20a作为工件20的底层镀层的示意图。FIG. 2 shows a schematic view of the metal coating 20 a as the bottom coating of the workpiece 20 .

如图1和图2所示,在图示的实施例中,合金镀层20a直接电镀在工件20的基材21的表面上,并在合金镀层20a的表面上电镀有一层锡镀层211。As shown in FIG. 1 and FIG. 2, in the illustrated embodiment, the alloy plating layer 20a is directly electroplated on the surface of the base material 21 of the workpiece 20, and a tin plating layer 211 is electroplated on the surface of the alloy plating layer 20a.

图3显示金属镀层20a作为工件20的中间镀层的示意图。FIG. 3 shows a schematic view of the metal coating 20 a as an intermediate coating of the workpiece 20 .

如图1和图3所示,在图示的实施例中,先在工件20的基材21的表面上直接电镀一层,例如,镍镀层221,然后在镍镀层221的表面上电镀一层合金镀层20a,最后在合金镀层20a的表面上电镀一层贵金属镀层222。As shown in FIG. 1 and FIG. 3 , in the illustrated embodiment, a layer of nickel plating layer 221 is directly electroplated on the surface of the base material 21 of the workpiece 20 first, and then a layer of nickel plating layer 221 is electroplated on the surface For the alloy plating layer 20a, finally, a precious metal plating layer 222 is electroplated on the surface of the alloy plating layer 20a.

图4显示金属镀层20a作为工件20的最外镀层的示意图。FIG. 4 shows a schematic diagram of the metal coating 20 a as the outermost coating of the workpiece 20 .

如图1和图4所示,在图示的实施例中,先在工件20的基材21的表面上直接电镀一层,例如,镍镀层221,然后在镍镀层221的表面上电镀一层合金镀层20a。合金镀层20a直接暴露在外,构成工件20的最外镀层。As shown in FIG. 1 and FIG. 4 , in the illustrated embodiment, a layer, for example, a nickel plating layer 221 , is directly electroplated on the surface of the base material 21 of the workpiece 20 first, and then a layer of nickel plating layer 221 is electroplated on the surface Alloy plating layer 20a. The alloy plating layer 20 a is directly exposed to the outside and constitutes the outermost plating layer of the workpiece 20 .

在前述实施例中,工件20的基材21可以为金属部件或非金属部件。In the foregoing embodiments, the base material 21 of the workpiece 20 may be a metal part or a non-metal part.

下面的表二显示本发明的合金镀层与目前常用的几种镀层的性能比较。The following table 2 shows the performance comparison between the alloy coating of the present invention and several commonly used coatings at present.

表二Table II

从表二中可以看出,本发明的包含镍(Ni)、钴(Co)和磷(P)的合金镀层的在各项性能指标上均比较优良。It can be seen from Table 2 that the alloy coating layer comprising nickel (Ni), cobalt (Co) and phosphorus (P) of the present invention is excellent in various performance indicators.

下面的表三显示了根据六西格玛管理标准计算出的本发明的合金镀层与目前常用的几种镀层的平均风险优先序数(RPN,Risk Priority Number)。The following Table 3 shows the average Risk Priority Number (RPN, Risk Priority Number) of the alloy coating of the present invention and several types of coatings commonly used at present, calculated according to the Six Sigma management standard.

表三Table 3

从表三中可以看出,本发明的包含镍(Ni)、钴(Co)和磷(P)的合金镀层的平均风险优先序数(PRN,Risk Priority Number)最小,因此,其综合性能指标最优。As can be seen from Table 3, the average risk priority number (PRN, Risk Priority Number) of the alloy coating containing nickel (Ni), cobalt (Co) and phosphorus (P) of the present invention is the smallest, so its comprehensive performance index is the highest excellent.

本领域的技术人员可以理解,上面所描述的实施例都是示例性的,并且本领域的技术人员可以对其进行改进,各种实施例中所描述的结构在不发生结构或者原理方面的冲突的情况下可以进行自由组合。Those skilled in the art can understand that the above-described embodiments are all exemplary, and those skilled in the art can make improvements thereto, and the structures described in the various embodiments do not conflict in terms of structures or principles can be freely combined.

虽然结合附图对本发明进行了说明,但是附图中公开的实施例旨在对本发明优选实施方式进行示例性说明,而不能理解为对本发明的一种限制。Although the present invention has been described with reference to the accompanying drawings, the embodiments disclosed in the accompanying drawings are intended to illustrate the preferred embodiments of the present invention and should not be construed as a limitation of the present invention.

虽然本总体发明构思的一些实施例已被显示和说明,本领域普通技术人员将理解,在不背离本总体发明构思的原则和精神的情况下,可对这些实施例做出改变,本发明的范围以权利要求和它们的等同物限定。Although some embodiments of the present general inventive concept have been shown and described, those of ordinary skill in the art will understand that The scope is defined by the claims and their equivalents.

应注意,措词“包括”不排除其它元件或步骤,措词“一”或“一个”不排除多个。另外,权利要求的任何元件标号不应理解为限制本发明的范围。It should be noted that the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. Furthermore, any element numbers in the claims should not be construed as limiting the scope of the invention.

Claims (12)

1.一种合金镀层,其特征在于:所述合金镀层至少包含镍、钴和磷。1. An alloy coating, characterized in that: the alloy coating at least comprises nickel, cobalt and phosphorus. 2.根据权利要求1所述的合金镀层,其特征在于:所述合金镀层包含10~40wt%的钴、1~12wt%的磷和40~89wt%的镍。2 . The alloy coating according to claim 1 , wherein the alloy coating comprises 10-40 wt % of cobalt, 1-12 wt % of phosphorus and 40-89 wt % of nickel. 3 . 3.根据权利要求1或2所述的合金镀层,其特征在于:3. alloy coating according to claim 1 and 2 is characterized in that: 所述合金镀层除了包含镍、钴和磷之外,还包含至少一种其他金属元素。In addition to nickel, cobalt and phosphorus, the alloy plating layer also contains at least one other metal element. 4.根据权利要求3所述的合金镀层,其特征在于:所述合金镀层还包含钨。4. The alloy coating according to claim 3, wherein the alloy coating further comprises tungsten. 5.根据权利要求1所述的合金镀层,其特征在于:所述合金镀层为仅包含镍、钴和磷的三元合金镀层。5 . The alloy coating according to claim 1 , wherein the alloy coating is a ternary alloy coating containing only nickel, cobalt and phosphorus. 6 . 6.根据权利要求5所述的合金镀层,其特征在于:所述合金镀层包含10~40wt%的钴、1~12wt%的磷和48~89wt%的镍。6 . The alloy coating according to claim 5 , wherein the alloy coating comprises 10-40 wt % of cobalt, 1-12 wt % of phosphorus and 48-89 wt % of nickel. 7 . 7.一种工件,其特征在于:7. A workpiece is characterized in that: 在所述工件(20)上形成有权利要求1-6中任一项所述的合金镀层(20a)。The alloy plating layer (20a) according to any one of claims 1-6 is formed on the workpiece (20). 8.根据权利要求7所述的工件,其特征在于:8. workpiece according to claim 7, is characterized in that: 所述合金镀层(20a)为形成在所述工件(20)上的底层镀层、中间镀层或最外镀层。The alloy plating layer (20a) is a bottom plating layer, an intermediate plating layer or an outermost plating layer formed on the workpiece (20). 9.根据权利要求7所述的工件,其特征在于:所述工件(20)的基材(21)为金属部件或非金属部件。9 . The workpiece according to claim 7 , wherein the base material ( 21 ) of the workpiece ( 20 ) is a metal part or a non-metal part. 10 . 10.一种电镀液,适于在工件(20)上电镀形成权利要求1-6中任一项所述的合金镀层(20a)。10. An electroplating solution, suitable for electroplating on a workpiece (20) to form the alloy plating layer (20a) according to any one of claims 1-6. 11.根据权利要求10所述的电镀液,其特征在于:11. electroplating solution according to claim 10, is characterized in that: 所述电镀液至少包含以下成分:250~500g/l的氨基磺酸镍、5~50g/l的氨基磺酸钴、5~50g/l的次磷酸钠、15~60g/l的氯化镍、30~50g/l的硼酸、1~5g/l的氟化钠、0.5~1g/l的邻苯甲酰磺酰亚胺钠、0.2~0.3g/l的1-4丁炔二醇、0.01~0.1g/l的十二烷基磺酸钠和0.5~6g/l的氨基磺酸。The electroplating solution contains at least the following components: 250-500g/l nickel sulfamate, 5-50g/l cobalt sulfamate, 5-50g/l sodium hypophosphite, 15-60g/l nickel chloride , 30~50g/l boric acid, 1~5g/l sodium fluoride, 0.5~1g/l sodium phthaloyl sulfonimide, 0.2~0.3g/l 1-4 butynediol, 0.01-0.1 g/l sodium dodecyl sulfonate and 0.5-6 g/l sulfamic acid. 12.根据权利要求10所述的电镀液,其特征在于:12. electroplating solution according to claim 10, is characterized in that: 所述电镀液至少包含以下成分:100~300g/l的硫酸镍、5~50g/l的氨基磺酸钴、5~50g/l的次磷酸钠、15~60g/l的氯化镍、30~50g/l的硼酸、1~5g/l的氟化钠、0.5~1g/l的邻苯甲酰磺酰亚胺钠、0.2~0.3g/l的1-4丁炔二醇、0.01~0.1g/l的十二烷基磺酸钠和1~10ml/l的硫酸。The electroplating solution at least contains the following components: 100-300 g/l nickel sulfate, 5-50 g/l cobalt sulfamate, 5-50 g/l sodium hypophosphite, 15-60 g/l nickel chloride, 30 ~50g/l of boric acid, 1~5g/l of sodium fluoride, 0.5~1g/l of sodium o-benzoylsulfonimide, 0.2~0.3g/l of 1-4 butynediol, 0.01~ 0.1 g/l of sodium dodecyl sulfonate and 1 to 10 ml/l of sulfuric acid.
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