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CN110060983B - Antenna packaging structure and packaging method - Google Patents

Antenna packaging structure and packaging method Download PDF

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Publication number
CN110060983B
CN110060983B CN201910433159.5A CN201910433159A CN110060983B CN 110060983 B CN110060983 B CN 110060983B CN 201910433159 A CN201910433159 A CN 201910433159A CN 110060983 B CN110060983 B CN 110060983B
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Prior art keywords
layer
metal
antenna
packaging
rewiring
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CN201910433159.5A
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CN110060983A (en
Inventor
陈彦亨
林正忠
吴政达
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SJ Semiconductor Jiangyin Corp
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Shenghejing Micro Semiconductor Jiangyin Co Ltd
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Publication of CN110060983A publication Critical patent/CN110060983A/en
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
    • H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body (electrodes)
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/64—Impedance arrangements
    • H01L23/66—High-frequency adaptations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/03—Manufacturing methods
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/58—Structural electrical arrangements for semiconductor devices not otherwise provided for
    • H01L2223/64—Impedance arrangements
    • H01L2223/66—High-frequency adaptations
    • H01L2223/6661—High-frequency adaptations for passive devices
    • H01L2223/6677—High-frequency adaptations for passive devices for antenna, e.g. antenna included within housing of semiconductor device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0231—Manufacturing methods of the redistribution layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0233—Structure of the redistribution layers
    • H01L2224/02331—Multilayer structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02379—Fan-out arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/023—Redistribution layers [RDL] for bonding areas
    • H01L2224/0237—Disposition of the redistribution layers
    • H01L2224/02381—Side view
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Details Of Aerials (AREA)

Abstract

The invention provides an antenna packaging structure and a packaging method, wherein the structure comprises the following steps: rewiring layers; a metal feed line post formed on the second face of the rewiring layer; the first packaging layer is used for coating the metal wire feeding column; the first antenna metal layer is connected with the metal feeder post; a protective adhesion layer covering the first antenna metal layer; a second encapsulation layer; a second antenna metal layer; at least one antenna circuit chip connected to the first surface of the rewiring layer through a metal wire; a third encapsulation layer surrounding at least the peripheral side of the antenna circuit chip; and the metal bump is used for realizing the electrical extraction of the rewiring layer. The invention can integrate all active components or passive components into one packaging structure through the circuit arrangement of different rewiring layers, and can effectively reduce the packaging size. The structure of the invention is a vertical arrangement structure, which can effectively shorten the conduction path between components, has better electrical property and antenna efficiency, and has lower power consumption.

Description

Antenna packaging structure and packaging method
Technical Field
The invention belongs to the field of packaging and communication equipment, and particularly relates to an antenna packaging structure and a packaging method.
Background
As technology advances, various high-tech electronic products have been developed to facilitate life of people, including various electronic devices such as: notebook computers, cell phones, tablet computers (PADs), etc.
With the popularity of such high-tech electronic products and the increasing demand of people, in addition to the greatly increased functions and applications configured in such high-tech products, the function of wireless communication is increased in particular to match the mobile demands of people. Thus, people can use the high-tech electronic products at any place or any time through the high-tech electronic devices with the wireless communication function. Therefore, the flexibility and convenience of the use of the high-tech electronic products are greatly improved, and people are not limited in a fixed area, the limit of the use range is broken, and the application of the electronic products is really convenient for the life of people.
In the application of an antenna, such as in a mobile phone terminal, the antenna is required to be quickly combined by a plurality of functional chips, and the known method is to directly manufacture the antenna on the surface of a circuit board (PCB), which has the disadvantage that the antenna occupies extra circuit board area, and the transmission signal line is long, the efficiency is poor, the power consumption is high, the package volume is large, and especially the conventional PCB package has too large loss under 5G millimeter wave transmission.
Disclosure of Invention
In view of the above-mentioned drawbacks of the prior art, an object of the present invention is to provide an antenna packaging structure and a packaging method for solving the problems of large antenna packaging volume and large signal transmission loss in the prior art.
To achieve the above and other related objects, the present invention provides an antenna package structure, including: a rewiring layer comprising a first face and an opposing second face; a metal feed line post formed on a second face of the rewiring layer; the first packaging layer is used for coating the metal wire feeding column, and the top surface of the first packaging layer is exposed out of the metal wire feeding column; the first antenna metal layer is formed on the first packaging layer and is connected with the metal feeder post; a protective adhesion layer overlying the first antenna metal layer; the second packaging layer is covered on the protective adhesive layer; a second antenna metal layer formed on the second packaging layer; at least one antenna circuit chip adhered to the first face of the rewiring layer, an electrode of the antenna circuit chip facing away from the rewiring layer, a connection hole formed in the rewiring layer, a metal wiring layer in the rewiring layer connected Kong Xianlou, the electrode connecting the electrode to the metal wiring layer through a metal wire; the third packaging layer covers the antenna circuit chip, the metal connecting wires and the connecting holes, and openings are formed in the third packaging layer and the rewiring layer; and the metal bump is formed in the opening and is electrically connected with the rewiring layer so as to realize the electrical extraction of the rewiring layer.
Optionally, the material of the protective adhesion layer comprises polyimide.
Optionally, the connection portion of the metal feed-through post and the rewiring layer has a lower metal layer, the material of the metal feed-through post comprises one of Au, ag, cu, al, and the material of the lower metal layer comprises a stack of a Ni layer and an Au layer.
Optionally, the materials of the first, second and third encapsulation layers include one of silica gel and epoxy resin.
Optionally, the plurality of antenna circuit chips are provided, the antenna circuit chip includes one of an active component and a passive component, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.
Optionally, a sealing protection layer is further filled between the antenna circuit chip and the rewiring layer.
The invention also provides an antenna packaging method, which comprises the following steps: 1) Providing a support substrate, and forming a separation layer on the support substrate; 2) Forming a rewiring layer on the separation layer, the rewiring layer comprising a first face connected with the separation layer and an opposite second face; 3) Forming a metal feed-through stud on a second side of the rewiring layer; 4) Packaging the metal wire feeding column by adopting a first packaging layer, and thinning the first packaging layer so that the top surface of the metal wire feeding column is exposed out of the first packaging layer; 5) Forming a first antenna metal layer on the first packaging layer, wherein the first antenna metal layer is connected with the metal feeder post; 6) Forming a protective adhesion layer covering the first antenna metal layer; 7) Forming a second encapsulation layer on the protective adhesion layer; 8) Forming a second antenna metal layer on the second packaging layer; 9) Stripping the rewiring layer and the support substrate based on the separation layer to expose a first face of the rewiring layer; 10 Forming a connection hole in the re-wiring layer, the connection Kong Xianlou being a metal wiring layer in the re-wiring layer; 11 Providing an antenna circuit chip, adhering the antenna circuit chip to a first face of the rewiring layer, an electrode of the antenna circuit chip facing away from the rewiring layer, the electrode being connected to the metal wiring layer by a metal wire; 12 Packaging the antenna circuit chip, the metal wire and the connecting hole by adopting a third packaging layer; 13 Forming openings in the third packaging layer and the rewiring layer, and forming metal bumps in the openings to realize electrical extraction of the rewiring layer.
Optionally, the support base comprises one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate.
Optionally, the separation layer includes a light-heat conversion layer, and step 9) irradiates the light-heat conversion layer with a laser to separate the light-heat conversion layer from the rewiring layer and the support substrate, thereby peeling the rewiring layer and the support substrate.
Optionally, step 2) fabricating the rewiring layer includes the steps of: 2-1) forming a first dielectric layer on the surface of the separation layer; 2-2) forming a seed layer on the surface of the first dielectric layer by adopting a sputtering process, forming a first metal layer on the seed layer, and etching the first metal layer and the seed layer to form a patterned first metal wiring layer; 2-3) forming a second dielectric layer on the surface of the patterned first metal wiring layer, and etching the second dielectric layer to form a second dielectric layer with patterned through holes; 2-4) filling conductive plugs in the patterned through holes, then forming a second metal layer on the surface of the second dielectric layer by adopting a sputtering process, and etching the metal layer to form a patterned second metal wiring layer.
Optionally, the method further comprises the steps of: repeating steps 2-3) to 2-4) to form a rewiring layer having a multi-layered stacked structure.
Optionally, the material of the protective adhesion layer includes polyimide.
Optionally, forming a metal feed post on the second side of the rewiring layer comprises the steps of: forming a lower metal layer on the rewiring layer; and forming a metal feeder pillar on the lower metal layer by adopting a wire bonding process or an electroplating process or an electroless plating process.
Optionally, the lower metal layer includes a stack of a Ni layer and an Au layer.
Optionally, step 11) connects the electrode to the metal wiring layer using a wire bonding process.
Optionally, the material of the metal feed post comprises one of Au, ag, cu, al.
Optionally, the method for forming the first, second and third packaging layers includes one of compression molding, transfer molding, liquid sealing molding, vacuum lamination and spin coating, and the materials of the first, second and third packaging layers include one of silica gel and epoxy resin.
Optionally, the plurality of antenna circuit chips are provided, the antenna circuit chip includes one of an active component and a passive component, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor.
As described above, the antenna packaging structure and the packaging method of the present invention have the following beneficial effects:
The invention can integrate all active components or passive components into one packaging structure through the circuit arrangement of different rewiring layers, and can effectively reduce the packaging size.
The antenna circuit chip, the rewiring layer, the antenna metal and other structures are arranged in a vertical arrangement structure, so that the conduction path between components can be effectively shortened, better electrical property and antenna efficiency are achieved, and meanwhile, lower power consumption is achieved.
According to the invention, the protective adhesive layer is arranged between two adjacent antenna structures, so that on one hand, the antenna metal can be protected, and on the other hand, the adhesive performance between the two adjacent antenna structures can be improved, and the mechanical structural strength of the antenna can be improved.
The back of the invention adopts the packaging layer to protect the antenna circuit chip and the metal connecting wire, thereby effectively improving the stability of the packaging structure.
The invention adopts the fan-out packaging method to package the antenna structure, can effectively reduce the packaging volume, ensures that the antenna packaging structure has higher integration level and better packaging performance, and has wide application prospect in the field of semiconductor packaging.
Drawings
Fig. 1 to 19 are schematic structural views showing steps of an antenna packaging method according to the present invention, wherein fig. 19 is a schematic structural view showing an antenna packaging structure according to the present invention.
Description of element reference numerals
101. Support substrate
102. Separating layer
201. A first dielectric layer
202. First metal wiring layer
203. A second dielectric layer
204. Second metal wiring layer
301. Lower metal layer
302. Metal feed line post
303. First encapsulation layer
304. First antenna metal layer
305. Protective adhesive layer
306. Second packaging layer
307. Second antenna metal layer
308. Connecting hole
401. Antenna circuit chip
402. Metal wire
403. Third packaging layer
404. Perforating the hole
501. Metal bump
Detailed Description
Other advantages and effects of the present invention will become apparent to those skilled in the art from the following disclosure, which describes the embodiments of the present invention with reference to specific examples. The invention may be practiced or carried out in other embodiments that depart from the specific details, and the details of the present description may be modified or varied from the spirit and scope of the present invention.
As described in detail in the embodiments of the present invention, the cross-sectional view of the device structure is not partially enlarged to a general scale for convenience of explanation, and the schematic drawings are only examples, which should not limit the scope of the present invention. In addition, the three-dimensional dimensions of length, width and depth should be included in actual fabrication.
For ease of description, spatially relative terms such as "under", "below", "beneath", "above", "upper" and the like may be used herein to describe one element or feature's relationship to another element or feature as illustrated in the figures. It will be understood that these spatially relative terms are intended to encompass other orientations of the device in use or operation in addition to the orientation depicted in the figures. Furthermore, when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or one or more intervening layers may also be present.
In the context of the present application, a structure described as a first feature being "on" a second feature may include embodiments where the first and second features are formed in direct contact, as well as embodiments where additional features are formed between the first and second features, such that the first and second features may not be in direct contact.
It should be noted that, the illustrations provided in the present embodiment merely illustrate the basic concept of the present invention by way of illustration, and only the components related to the present invention are shown in the drawings rather than the number, shape and size of the components in actual implementation, and the form, number and proportion of each component in actual implementation may be arbitrarily changed, and the layout of the components may be more complex.
As shown in fig. 1 to 19, the present embodiment provides a packaging method of an antenna, the packaging method including the steps of:
As shown in fig. 1, step 1) is first performed, a support substrate 101 is provided, and a separation layer 102 is formed on the support substrate 101.
As an example, the support base 101 includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate. In this embodiment, the supporting substrate 101 is a glass substrate, which has low cost, is easy to form the separation layer 102 on the surface of the glass substrate, and can reduce the difficulty of the subsequent stripping process.
As an example, the separation layer 102 includes a light-heat conversion Layer (LTHC), which is formed on the support substrate 101 by a spin coating process and then cured and molded by a curing process. The light-heat conversion Layer (LTHC) has stable performance and a smoother surface, is favorable for the subsequent manufacture of a rewiring layer, and has lower stripping difficulty in the subsequent stripping process.
As shown in fig. 2 to 5, step 2) is then performed to form a rewiring layer on the separation layer 102, the rewiring layer including a first face connected to the separation layer 102 and an opposite second face.
Step 2) fabricating the rewiring layer includes the steps of:
As shown in fig. 2, step 2-1) is performed, and a chemical vapor deposition process or a physical vapor deposition process is adopted to form a first dielectric layer 201 on the surface of the separation layer 102, where the material of the first dielectric layer 201 includes one or more of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and fluorine-containing glass.
For example, PI (polyimide) is selected as the material of the first dielectric layer 201, so as to further reduce the process difficulty and the process cost.
As shown in fig. 3, step 2-2) is performed, a seed layer is formed on the surface of the first dielectric layer 201 by using a sputtering process, a first metal layer is formed on the seed layer, and the first metal layer and the seed layer are etched to form a patterned first metal wiring layer 202. The seed layer material comprises a stack of a titanium layer and a copper layer. The material of the first metal wiring layer 202 includes one or a combination of two or more of copper, aluminum, nickel, gold, silver, and titanium.
As shown in fig. 4, step 2-3) is performed, a second dielectric layer 203 is formed on the surface of the patterned first metal wiring layer 202 by using a chemical vapor deposition process or a physical vapor deposition process, and the second dielectric layer 203 is etched to form a second dielectric layer 203 with patterned through holes. The material of the second dielectric layer 203 includes one or more of epoxy resin, silica gel, PI, PBO, BCB, silicon oxide, phosphosilicate glass, and fluorine-containing glass.
For example, PI (polyimide) is selected as the material of the second dielectric layer 203, so as to further reduce the process difficulty and the process cost.
As shown in fig. 4, step 2-4) is performed, a conductive plug is filled in the patterned via hole, then a second metal layer is formed on the surface of the second dielectric layer 203 by adopting a sputtering process, and the metal layer is etched to form a patterned second metal wiring layer 204. The material of the second metal wiring layer 204 includes one or a combination of two or more of copper, aluminum, nickel, gold, silver, and titanium.
Next, as shown in fig. 5, the above steps 2-3) to 2-4) may be repeated to form a re-wiring layer having a multi-layered stacked structure to realize different wiring functions.
As shown in fig. 6 to 7, step 3) is performed to form a patterned lower metal layer 301 on the second surface of the re-wiring layer, and a wire bonding process, an electroplating process or an electroless plating process is used to form a metal feed post 302 on the lower metal layer 301, wherein the metal feed post 302 is electrically connected to the re-wiring layer, and the metal feed post 302 is approximately perpendicular to the surface of the re-wiring layer.
The lower metal layer 301 includes a stack of a Ni layer and an Au layer. In this embodiment, a wire bonding process (wire bonding) is used to form a metal pillar 302 on the lower metal layer 301, and the material of the metal pillar 302 includes one of Au, ag, cu, al. The lower metal layer 301 can effectively strengthen the bonding strength between the metal feed-through stud 302 and the rewiring layer, and reduce the contact resistance.
As shown in fig. 8 to 9, step 4) is performed, the metal feed-through stud 302 is encapsulated by using the first encapsulation layer 303, and the first encapsulation layer 303 is thinned so that the top surface of the metal feed-through stud 302 is exposed from the first encapsulation layer 303.
As an example, the method of packaging the metal feed-line stud 302 with the first packaging layer 303 includes one of compression molding, transfer molding, liquid sealing molding, vacuum lamination and spin coating, and the material of the first packaging layer 303 includes one of silicone and epoxy.
As shown in fig. 10, step 5) is performed, and a first antenna metal layer 304 is formed on the surface of the first encapsulation layer 303, where the first antenna metal layer 304 is connected to the metal feed-through post 302.
The material of the first antenna metal layer 304 may be copper or the like.
As shown in fig. 11, step 6) is then performed to form a protective adhesion layer 305 covering the first antenna metal layer 304.
For example, the material of the protective adhesion layer 305 includes polyimide. Since two adjacent antenna structures are separated by one antenna metal layer, the adhesion strength between the two antenna structures is easily reduced to cause displacement or breakage. According to the invention, the protective adhesive layer 305 is arranged between two adjacent antenna structures, so that on one hand, antenna metal can be protected, and on the other hand, the adhesive performance between the two adjacent antenna structures can be improved, and the mechanical structural strength of the antenna can be improved.
As shown in fig. 12, step 7) is performed, and a second encapsulation layer 306 is formed on the protective adhesion layer 305.
As an example, the method of forming the second encapsulation layer 306 includes one of compression molding, transfer molding, liquid sealing molding, vacuum lamination, and spin coating, and the material of the second encapsulation layer 306 includes one of silicone and epoxy.
As shown in fig. 13, step 8) is performed, and a second antenna metal layer 307 is formed on the second encapsulation layer 306.
The material of the second antenna metal layer 307 may be copper, etc., and the second antenna metal layer 307 may be electrically connected to the first antenna metal layer 304 or the rewiring layer.
The invention can obtain the antenna structure layer with a multilayer structure, the multilayer antenna structure has certain loss, the conduction path between components can be effectively shortened, better electrical property and antenna efficiency are realized, and meanwhile, the power consumption is lower.
As shown in fig. 14, step 9) is performed next, and the rewiring layer and the support substrate 101 are peeled off based on the separation layer 102, exposing the first surface of the rewiring layer.
Specifically, the separation layer 102 includes a light-heat conversion layer, which is irradiated with laser light here to separate the light-heat conversion layer from the rewiring layer and the support substrate 101, thereby peeling the rewiring layer and the support substrate 101.
As shown in fig. 15, step 10) is then performed to form a connection hole 308 in the re-wiring layer, and the connection hole 308 exposes the metal wiring layer in the re-wiring layer.
As shown in fig. 16, step 11) is performed next, an antenna circuit chip 401 is provided, the antenna circuit chip 401 is electrically adhered to the first surface of the rewiring layer, the electrode of the antenna circuit chip 401 faces away from the rewiring layer, and the electrode is connected to the metal wiring layer through a metal wire 402, so that the antenna circuit chip 401 is electrically connected to the first antenna metal layer 304 through the rewiring layer and the metal feed-through post 302. For example, the antenna circuit chip 401 may be connected to the first side of the rewiring layer by a wire bonding process (wire bonding).
For example, the antenna circuit chips 401 are plural, and the antenna circuit chips 401 include one or two of active components and passive components, wherein the active components include one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive components include one of a resistor, a capacitor and an inductor. The invention can integrate all active components or passive components into one packaging structure through the circuit arrangement of different rewiring layers, and can effectively reduce the packaging size.
As shown in fig. 17, step 12) is performed, and the antenna circuit chip 401, the metal wire 402 and the connection hole 308 are encapsulated by using a third encapsulation layer 403. To further protect the antenna circuit chip 401 and the metal wiring 402. The back of the invention adopts the packaging layer to protect the antenna circuit chip and the metal connecting wire, thereby effectively improving the stability of the packaging structure.
For example, the method of forming the third encapsulation layer 403 includes one of compression molding, transfer molding, liquid sealing molding, vacuum lamination, and spin coating, and the material of the third encapsulation layer 403 includes one of silicone and epoxy.
As shown in fig. 18 to 19, step 13) is performed, an opening 404 is formed in the third package layer 403 and the rewiring layer, and a metal bump 501 is formed in the opening 404 to realize electrical extraction of the rewiring layer. The metal bump 501 may be one of tin solder, silver solder and gold-tin alloy solder.
As shown in fig. 19, the present embodiment further provides an antenna packaging structure, where the antenna packaging structure may be applied to, for example, an electronic device including a 5G network, and the packaging structure includes: a rewiring layer comprising a first face and an opposing second face; a metal feed post 302 formed on a second side of the rewiring layer; a first encapsulation layer 303, which encapsulates the metal feed-through stud 302, and the top surface of which exposes the metal feed-through stud 302; a first antenna metal layer 304 formed on the first package layer, the antenna metal layer being connected to the metal feed post 302; a protective adhesion layer 305 overlying the first antenna metal layer 304; a second encapsulation layer 306 covering the protective adhesion layer 305; a second antenna metal layer 307 formed on the second encapsulation layer 306; at least one antenna circuit chip 401 adhered to the first face of the rewiring layer, wherein an electrode of the antenna circuit chip 401 faces away from the rewiring layer, a connection hole 308 is formed in the rewiring layer, the connection hole 308 exposes a metal wiring layer in the rewiring layer, and the electrode connects the electrode to the metal wiring layer through a metal wire 402; a third packaging layer 403 covering the antenna circuit chip 401, the metal connection line 402 and the connection hole 308, wherein the third packaging layer 403 and the rewiring layer have an opening 404 therein; and a metal bump 501 formed in the opening 404 and electrically connected to the re-wiring layer to realize electrical extraction of the re-wiring layer.
The material of the protective adhesion layer 305 comprises polyimide. According to the invention, the protective adhesive layer 305 is arranged between two adjacent antenna structures, so that on one hand, antenna metal can be protected, and on the other hand, the adhesive performance between the two adjacent antenna structures can be improved, and the mechanical structural strength of the antenna can be improved.
The connection part of the metal feed-through post 302 and the rewiring layer is provided with a lower metal layer 301, the material of the metal feed-through post 302 comprises one of Au, ag, cu, al, and the material of the lower metal layer 301 comprises a lamination layer formed by a Ni layer and an Au layer. The lower metal layer 301 can effectively strengthen the bonding strength between the metal feed-through stud 302 and the rewiring layer, and reduce the contact resistance.
The materials of the first encapsulation layer 303, the second encapsulation layer 306 and the third encapsulation layer 403 include one of silica gel and epoxy resin.
The antenna circuit chips 401 are plural, the antenna circuit chips 401 include one of an active component and a passive component, wherein the active component includes one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component includes one of a resistor, a capacitor and an inductor. A seal protection layer 402 is also filled between the antenna circuit chip 401 and the rewiring layer.
As described above, the antenna packaging structure and the packaging method of the present invention have the following beneficial effects:
The invention can integrate all active components or passive components into one packaging structure through the circuit arrangement of different rewiring layers, and can effectively reduce the packaging size.
The antenna circuit chip, the rewiring layer, the antenna metal and other structures are arranged in a vertical arrangement structure, so that the conduction path between components can be effectively shortened, better electrical property and antenna efficiency are achieved, and meanwhile, lower power consumption is achieved.
According to the invention, the protective adhesive layer is arranged between two adjacent antenna structures, so that on one hand, the antenna metal can be protected, and on the other hand, the adhesive performance between the two adjacent antenna structures can be improved, and the mechanical structural strength of the antenna can be improved.
The back of the invention adopts the packaging layer to protect the antenna circuit chip and the metal connecting wire, thereby effectively improving the stability of the packaging structure.
The invention adopts the fan-out packaging method to package the antenna structure, can effectively reduce the packaging volume, ensures that the antenna packaging structure has higher integration level and better packaging performance, and has wide application prospect in the field of semiconductor packaging.
Therefore, the invention effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles of the present invention and its effectiveness, and are not intended to limit the invention. Modifications and variations may be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the invention. Accordingly, it is intended that all equivalent modifications and variations of the invention be covered by the claims, which are within the ordinary skill of the art, be within the spirit and scope of the present disclosure.

Claims (15)

1. An antenna package structure, the package structure comprising:
A rewiring layer comprising a first face and an opposing second face;
A metal feed line post formed on a second face of the rewiring layer; the connection part of the metal feed line post and the rewiring layer is provided with a lower metal layer, and the material of the lower metal layer comprises a lamination layer consisting of a Ni layer and an Au layer;
the first packaging layer is used for coating the metal wire feeding column, and the top surface of the first packaging layer is exposed out of the metal wire feeding column;
the first antenna metal layer is formed on the first packaging layer and is connected with the metal feeder post;
a protective adhesion layer overlying the first antenna metal layer;
the second packaging layer is covered on the protective adhesive layer;
a second antenna metal layer formed on the second packaging layer;
At least one antenna circuit chip adhered to the first face of the rewiring layer, an electrode of the antenna circuit chip facing away from the rewiring layer, a connection hole formed in the rewiring layer, a metal wiring layer in the rewiring layer connected Kong Xianlou, the electrode connecting the electrode to the metal wiring layer through a metal wire;
the third packaging layer covers the antenna circuit chip, the metal connecting wires and the connecting holes, and openings are formed in the third packaging layer and the rewiring layer;
And the metal bump is formed in the opening and is electrically connected with the rewiring layer so as to realize the electrical extraction of the rewiring layer.
2. The antenna package of claim 1, wherein: the material of the protective adhesion layer comprises polyimide.
3. The antenna package of claim 1, wherein: the metal feed-through post comprises one of Au, ag, cu, al, and the materials of the first packaging layer, the second packaging layer and the third packaging layer comprise one of silica gel and epoxy resin.
4. The antenna package of claim 1, wherein: the antenna circuit chip is a plurality of, the antenna circuit chip comprises one of an active component and a passive component, wherein the active component comprises one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component comprises one of a resistor, a capacitor and an inductor.
5. The antenna package of claim 1, wherein: and a sealing protection layer is filled between the antenna circuit chip and the rewiring layer.
6. A method of packaging an antenna, the method comprising the steps of:
1) Providing a support substrate, and forming a separation layer on the support substrate;
2) Forming a rewiring layer on the separation layer, the rewiring layer comprising a first face connected with the separation layer and an opposite second face;
3) Forming a metal feed-through stud on a second side of the rewiring layer; forming a metal feed post on the second side of the rewiring layer comprises the steps of: forming a lower metal layer on the rewiring layer; forming a metal wire feeding column on the lower metal layer by adopting a wire bonding process or an electroplating process or an electroless plating process, wherein the lower metal layer comprises a lamination layer consisting of a Ni layer and an Au layer;
4) Packaging the metal wire feeding column by adopting a first packaging layer, and thinning the first packaging layer so that the top surface of the metal wire feeding column is exposed out of the first packaging layer;
5) Forming a first antenna metal layer on the first packaging layer, wherein the first antenna metal layer is connected with the metal feeder post;
6) Forming a protective adhesion layer covering the first antenna metal layer;
7) Forming a second encapsulation layer on the protective adhesion layer;
8) Forming a second antenna metal layer on the second packaging layer;
9) Stripping the rewiring layer and the support substrate based on the separation layer to expose a first face of the rewiring layer;
10 Forming a connection hole in the re-wiring layer, the connection Kong Xianlou being a metal wiring layer in the re-wiring layer;
11 Providing an antenna circuit chip, adhering the antenna circuit chip to a first face of the rewiring layer, an electrode of the antenna circuit chip facing away from the rewiring layer, the electrode being connected to the metal wiring layer by a metal wire;
12 Packaging the antenna circuit chip, the metal wire and the connecting hole by adopting a third packaging layer;
13 Forming openings in the third packaging layer and the rewiring layer, and forming metal bumps in the openings to realize electrical extraction of the rewiring layer.
7. The method of packaging an antenna of claim 6, wherein: the support base includes one of a glass substrate, a metal substrate, a semiconductor substrate, a polymer substrate, and a ceramic substrate.
8. The method of packaging an antenna of claim 6, wherein: the separation layer includes a light-heat conversion layer, and step 9) irradiates the light-heat conversion layer with laser light to separate the light-heat conversion layer from the rewiring layer and the support substrate, thereby peeling the rewiring layer and the support substrate.
9. The method of packaging an antenna of claim 6, wherein: step 2) fabricating the rewiring layer includes the steps of:
2-1) forming a first dielectric layer on the surface of the separation layer;
2-2) forming a seed layer on the surface of the first dielectric layer by adopting a sputtering process, forming a first metal layer on the seed layer, and etching the first metal layer and the seed layer to form a patterned first metal wiring layer;
2-3) forming a second dielectric layer on the surface of the patterned first metal wiring layer, and etching the second dielectric layer to form a second dielectric layer with patterned through holes;
2-4) filling conductive plugs in the patterned through holes, then forming a second metal layer on the surface of the second dielectric layer by adopting a sputtering process, and etching the metal layer to form a patterned second metal wiring layer.
10. The method of packaging an antenna of claim 9, wherein: the method also comprises the steps of: repeating steps 2-3) to 2-4) to form a rewiring layer having a multi-layered stacked structure.
11. The method of packaging an antenna of claim 6, wherein: the material of the protective adhesive layer comprises polyimide.
12. The method of packaging an antenna of claim 6, wherein: step 11) connecting the electrode to the metal wiring layer using a wire bonding process.
13. The method of packaging an antenna of claim 6, wherein: the material of the metal feed post includes one of Au, ag, cu, al.
14. The method of packaging an antenna of claim 6, wherein: the method for forming the first packaging layer, the second packaging layer and the third packaging layer comprises one of compression molding, transfer molding, liquid seal molding, vacuum lamination and spin coating, and the materials of the first packaging layer, the second packaging layer and the third packaging layer comprise one of silica gel and epoxy resin.
15. The method of packaging an antenna of claim 6, wherein: the antenna circuit chip is a plurality of, the antenna circuit chip comprises one of an active component and a passive component, wherein the active component comprises one of a power management circuit, a transmitting circuit and a receiving circuit, and the passive component comprises one of a resistor, a capacitor and an inductor.
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