CN110114868A - Embedded protection circuit module - Google Patents

Abstract

A solution for embedding a battery protection module is provided herein. In one aspect, an apparatus includes a substrate, a plurality of protective members formed on the substrate, and a core shell surrounding the plurality of protective members. The apparatus also includes an encapsulation layer positioned within the core shell and covering the first side of the substrate, a first bonding layer formed over the encapsulation layer, and a second bonding layer formed over the second side of the substrate. The apparatus also includes a surface terminal coupled to at least one of the first bonding layer and the second bonding layer. The outer surface of the first and/or second bonding layer is provided with terminals or pads. The device may be connected to external circuitry or external equipment by terminal connection, reflow soldering, or other methods.

Description

Embedded protection circuit module

technical field

The present disclosure relates generally to battery protection devices, and more particularly, to embedded and/or packaged protection circuit modules (PCMs).

Background technique

With the rapid development of the electronics, communication and computer industries, the use of portable electronic devices is increasing. Many portable electronic devices use auxiliary (eg, rechargeable) batteries as a power source.

Pack-type auxiliary batteries have been widely used. A typical package-type auxiliary battery has a structure in which one or more bare cells serving as an electric energy source and a protection circuit module (PCM) controlling charging/discharging of the bare cells are combined into one in the unit. Auxiliary batteries such as Ni-HM and Lithium batteries are rechargeable, especially those made of Lithium-ion and Lithium-polymer cells that have higher energy densities and higher voltages than conventional batteries.

PCM generally provides overcharge/discharge protection, short circuit protection and thermal/overtemperature protection to the battery by controlling the voltage, current and temperature of the battery. A conventional PCM is a protection circuit formed by mounting various electrical components on a printed circuit board (PCB), including active protection components such as ICs or sensors, and passive components such as PTCs, NTCs or fuses. Various components are connected with copper rails or vias to form protection circuits.

Although PCMs subscribe to an increasing trend of small size and high integration density, as the size of PCMs is decreasing, the area for mounting electrical devices is also decreasing. Therefore, how to increase the utilization area of the printed circuit board is a key issue to be solved, and similarly, the ease of completing the client assembly and installation is also a key issue to be solved, all of which also need to provide high reliability performance to meet the harsh application environment. in demand.

SUMMARY OF THE INVENTION

In view of the foregoing, there is a need for a PCM in which protection circuits including active protection components (eg, integrated circuits or sensors) and passive protection components (eg, PTC, negative temperature coefficient (NTC), fuses) are embedded and packaged into in the PCB. Active and/or passive components are connected with conductive layers and/or vias to form an integrated PCM.

In one aspect, an apparatus includes a substrate, a plurality of protective components formed on the substrate, and a core housing surrounding the plurality of protective components. The device also includes an encapsulation layer within the core shell and covering the first side of the substrate, a first bonding layer formed over the encapsulation layer, and a second bonding layer formed over the second side of the substrate. The device also includes a surface terminal coupled to at least one of the first bonding layer and the second bonding layer.

In another approach, a protective circuit module (PCM) includes a plurality of protective components formed on a substrate, and a core case completely surrounding the substrate. The PCM also includes an encapsulation layer within the core shell and covering the first side of the substrate, a first bond layer formed over the encapsulation layer, a second bond layer formed over the second side of the substrate, and coupled to the first bond layer and surface terminals of at least one of the second bonding layers.

In yet another aspect, a method includes providing a plurality of protective components on a substrate, surrounding the plurality of protective components inside a core case, and forming an encapsulation layer over the plurality of protective components, the encapsulation layer being disposed on the core case internal. The method may also include forming a first bonding layer over the encapsulation layer, and coupling the surface terminal to at least one of the first bonding layer and the second bonding layer.

Description of drawings

The accompanying drawings illustrate exemplary aspects of the embodiments disclosed so far, designed for practical application of their principles, and wherein:

1 is an isometric view of a device, such as a packaged PCM, according to an exemplary aspect of the present disclosure;

2 is a side cross-sectional view of the device of FIG. 1 according to an exemplary aspect of the present disclosure;

3 is an exploded view of the apparatus of FIG. 1 according to an exemplary aspect of the present disclosure;

4 depicts a process for forming the apparatus of FIG. 1 in accordance with an exemplary aspect of the present disclosure;

5 is a perspective view of an apparatus according to another exemplary aspect of the present disclosure;

6 is a side cross-sectional view of the device of FIG. 5 according to an exemplary aspect of the present disclosure.

7 depicts a process for forming the apparatus of FIG. 5 in accordance with an exemplary aspect of the present disclosure.

The drawings are not necessarily drawn to scale. The drawings are representational only, and are not intended to depict specific parameters of the present disclosure. The drawings are intended to depict typical embodiments of the disclosure, and therefore should not be regarded as limiting in scope. In the drawings, the same numbers refer to the same elements.

Furthermore, for clarity of illustration, certain elements in some of the figures may be omitted or not shown to scale. Furthermore, some reference numerals may be omitted in some figures for clarity.

Detailed ways

Embodiments in accordance with the present disclosure will now be described more fully hereinafter with reference to the accompanying drawings. The system/circuit may be implemented in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the system and method to those skilled in the art.

For convenience and clarity, terms such as "top," "bottom," "upper," "lower," "vertical," "horizontal," "lateral," and "longitudinal" will be used herein to describe various components and their The relative position and orientation of the components. The term shall include the specifically mentioned words, their derivatives, and similarly introduced words.

As used herein, elements or acts recited in the singular and preceded by the word "a" or "an" should be understood as not excluding a plurality of elements or acts, unless such exclusion is explicitly recited. Furthermore, references to "one embodiment" of the present disclosure are not intended to be interpreted as excluding the existence of additional embodiments that also incorporate the recited features.

As mentioned above, described herein are embedded/packaged battery protection modules that include protection from active protection components (eg, integrated circuits or sensors) and passive protection components (eg, PTC, negative temperature coefficient (NTC), or fuses) The circuit is embedded in a core case made of PCB FR-4 material or a molded case and encapsulated with a coating such as epoxy or encapsulation. Active and passive components are connected with conductive layers and/or vias to form protection circuits.

In some embodiments, the device is divided into three layers, namely, a top layer, a middle layer, and a bottom layer. The top layer includes the top wiring layer and top solder mask, the middle layer embeds and encapsulates protective components and devices, and contains copper foil and vias to form the main circuit, and the bottom layer includes the bottom wiring layer and bottom solder mask. One or more surfaces of the device are provided with terminals or lands so that by terminal connection, reflow soldering, swaging or other methods, the device can be connected to external circuits or external equipment to protect the battery cells.

Accordingly, embodiments of the present disclosure may eliminate subsequent client surface mount solutions for components and equipment, thereby simplifying client assembly and installation techniques and processes, which reduces costs. In addition, all components and equipment are encapsulated in a core case and a protective coating is applied, improving the performance of current existing products and enhancing product reliability.

Turning now to FIGS. 1-3, an exemplary embodiment of an apparatus 100 according to the present disclosure is illustrated. As shown, a device 100, such as an encapsulated battery protection module, includes a substrate 102 (eg, a PCB) that includes an insulating layer 102-A forming a solder mask coupled to a conductive layer 102-B made of copper foil . A plurality of protection devices 104A-F may be formed on the substrate 102, eg, on the first side 106 (FIG. 3) of the substrate 102, ie, on the upper surface of the insulating layer 102-A. Conductive layer 102-B may be coupled to underside 109 of insulating layer 102-A. Although not limiting, in the embodiment shown in FIGS. 1-3, the first side 106 corresponds to the top surface of the substrate 102 and the second side 108 corresponds to the bottom surface of the substrate 102, ie, the conductive layer 102- the lower surface of B.

In some embodiments, the plurality of protection components 104A-F are selected from the non-limiting group consisting of: fuses, PTCs, NTCs, ICs, sensors, MOSFETs, resistors, and capacitors. Among these protection components, ICs and sensors are considered active protection components, while PTCs, NTCs, and fuses are considered passive components. In the illustrated embodiment, protection components 104-A may be PTCs, protection components 104-B may be IC+MOSFETs, protection components 104-C and 104-E may be resistors, and protection components 104-D and 104 -F is the capacitor. It should be appreciated, however, that this arrangement is non-limiting and that the number and configuration of protective components may vary depending on the application.

The PTC material of the protective member 104-A may be made of a positive temperature coefficient conductive composition comprising a polymer and a conductive filler. The polymer of the PTC material may be a crystalline polymer selected from the group consisting of polyethylene, polypropylene, polyoctene, polyvinylidene chloride, and mixtures thereof. The conductive filler may be dispersed in the polymer and selected from the group consisting of carbon black, metal powder, conductive ceramic powder, and mixtures thereof. In addition, in order to improve the sensitivity and physical properties of the PTC material, the PTC conductive composition may also include additives such as photoinitiators, crosslinking agents, coupling agents, dispersants, stabilizers, antioxidants and/or non-conductive arc-resistant fillers .

As shown, the device 100 may also include a core shell 110 surrounding the plurality of protective components 104A-F. In some embodiments, the core shell 110 extends completely around the outer perimeter of the substrate 102 . For example, the core shell 110 may have a frame 112 and a central opening 114 for receiving the substrate 102 therein. Although not limited to any particular shape or configuration, the core shell 110 may have a generally rectangular shape. In some embodiments, the core shell 110 is made of FR-4 glass reinforced epoxy laminate. In other embodiments, the core shell 110 is made of a ceramic or moldable material.

As best shown in FIG. 3 , an encapsulation layer 120 may be located or formed within the core shell 110 so as to cover the first side 106 of the substrate 102 including the plurality of protective features 104A-F formed on the substrate 102 . In some embodiments, the encapsulation layer 120 may be an injectable epoxy that is deposited within the central opening 114 so as to completely fill the central opening 114 . As shown, the encapsulation layer 120 may include a plurality of vias 121 disposed therethrough for connection with the substrate 102, as will be described in more detail below. In some embodiments, the encapsulation layer 120 may be a multi-layer structure, wherein different layers provide different functions. For example, one exemplary 3-layer structure of encapsulation layer 120 may include a first layer as an oxidation resistant epoxy, a second layer as a moisture resistant epoxy, and a third layer as a corrosion resistant epoxy. However, it should be appreciated that this three-layer arrangement is non-limiting and that the number and layers of encapsulation layers 120 may vary depending on the application.

A first bonding layer 122 may be formed over the encapsulation layer 120 and a second bonding layer 124 may be formed over the second side 108 of the substrate 102 . In some embodiments, the first and second bonding layers 122 , 124 are directly coupled to opposite sides of the frame 112 of the core shell 110 to fully encapsulate the encapsulation layer 120 and the plurality of protective components 104A-F housed within the frame 112 . In some embodiments, the first and second bonding layers 122, 124 are epoxy layers, which may be provided with vias 128 and 130 formed therein, respectively. Vias 128 and 130 may be formed by mechanical drilling followed by electroplating or electroless plating. In other embodiments, the vias 128, 130 may be filled with conductive paste. In some embodiments, the first and second bonding layers 122, 124 are coupled to the core shell 110, such as by injection molding.

Device 100 may also include one or more surface terminals 134A-D coupled to at least one of first bonding layer 122 and second bonding layer 124, and one or more leads 140A-B connected to surface terminals 134A-B . In one non-limiting example, the surface terminals 134A-D may be the leads 140A-B connected using a plurality of vias 128 formed through the first bonding layer 122 and a plurality of vias 121 formed through the encapsulation layer 120 to the copper foil of the substrate 102 . As shown, the surface terminals 134A-B may include a planar portion 142 configured to sit atop the first bonding layer 122 and a plurality of extension members configured to extend through the first bonding layer 122 and the encapsulation layer 120 144.

Turning now to FIG. 4, an exemplary process for assembling the device 100 shown in FIGS. 1-3 will be described in greater detail. First, as shown at processing point 150, the substrate 102 is provided with a plurality of protective features 104A-F formed thereon. Next, as shown at processing point 151 , the substrate 102 is inserted into the central opening 114 of the core shell 110 such that the core shell completely surrounds the outer perimeter 148 of the substrate 102 and the protective features 104A-F are recessed into the core shell 110 Below the top surface 149 of the frame 112 . In some embodiments, the second bonding layer 124 may have been attached to the bottom side of the core shell 110 .

Next, at processing point 152, encapsulation layer 120 is formed over protective features 104A-F. In some embodiments, the encapsulation layer 120 is injected into the core shell 110 and assumes the shape generally defined by the frame 112 . As shown, the encapsulation layer 120 has an upper surface 123 that is substantially planar or flush with the top surface 149 of the frame. The first bonding layer 122 is then secured to the frame 112 of the core shell 110 as shown at processing point 153 and terminals 134A-B are formed on top of the first bonding layer 122 as shown at processing point 154 . Finally, leads 140A-B are secured to the device atop terminals 134A-B.

Turning now to FIGS. 5-7, an exemplary embodiment of an apparatus 170 in accordance with the present disclosure will be described in greater detail. As shown, the device 170 includes a substrate 172, which may be a conductive component, such as a lead frame. The plurality of protective features 174A-H may be formed directly on the substrate 172 , eg, on the first side 176 of the substrate 172 . Although not limiting, in the embodiment depicted in FIGS. 5-7 , the first side 176 corresponds to the top surface of the substrate 172 and the second side 178 corresponds to the bottom surface of the substrate 172 .

In some embodiments, the plurality of protection components 174A-H are selected from the non-limiting group consisting of: fuses, PTCs, NTCs, ICs, sensors, MOSFETs, resistors, and capacitors. Among these protection components, ICs and sensors are considered active protection components, while PTCs, NTCs, and fuses are considered passive components. In the embodiment shown, protection component 174-A may be a PTC, protection component 174-C may be an IC+MOSFET, and protection components 174-B and 174D-H may be a combination of resistors and capacitors. It should be appreciated, however, that this arrangement is non-limiting and that the number and configuration of protective components may vary depending on the application.

The PTC material of the protective member 174-A may be made of a positive temperature coefficient conductive composition comprising a polymer and a conductive filler. The polymer of the PTC material may be a crystalline polymer selected from the group consisting of polyethylene, polypropylene, polyoctene, polyvinylidene chloride, and mixtures thereof. The conductive filler may be dispersed in the polymer and selected from the group consisting of carbon black, metal powder, conductive ceramic powder, and mixtures thereof. In addition, in order to improve the sensitivity and physical properties of the PTC material, the PTC conductive composition may also include additives such as photoinitiators, crosslinking agents, coupling agents, dispersants, stabilizers, antioxidants and/or non-conductive arc-resistant fillers .

The device 170 may also include a core shell 180 surrounding the plurality of protective components 174 . As shown, the core shell 180 may extend partially around the base plate 172 such that the first and second ends 181, 183 extend from opposite sides of the core shell 180, as shown. Although not limited to any particular shape or configuration, the core shell 180 may have a generally rectangular shape. In some embodiments, the core shell 180 is made of epoxy that is injection molded around the substrate 172 . In this embodiment, the first and second ends 181 and 183 represent terminals of the device 170 . Additional terminal connections 188 and 189 for protection components 174-A and 174-C may also be provided through the underside 190 of the core housing for connection to external circuitry or external equipment, as best shown in FIG. 6 .

The core shell 180 may cover the first side 176 of the substrate 172 and the second side 178 of the substrate 172, including a plurality of protective features 174 formed thereon. In some embodiments, the core shell 180 may be an injectable epoxy formed into a desired shape.

Turning now to FIG. 7, an exemplary process for assembling the device 170 shown in FIGS. 5-6 will be described in greater detail. First, as shown at processing point 191, a substrate 172 having multiple sections is provided. Next, as shown at processing point 192 , a plurality of protective features 174A-H are formed on the first side 176 of the substrate 172 . Next, as shown at processing point 193 , core shell 180 is formed over protective features 174A-F and partially over substrate 172 . As shown, first and second ends 181 and 183 representing terminals of device 170 extend from each side of the core housing.

Disclosed herein are apparatus and methods for packaging battery protection components and devices within a PCB board. The first advantage includes a device that simplifies client assembly and installation techniques and processes. The second advantage includes enhanced reliability in practical applications of battery protection circuits due to the encapsulated core case surrounding the substrate.

Although the present disclosure has been described with reference to certain methods, many modifications, changes and variations can be made in the described methods without departing from the scope and scope of the present disclosure as defined in the appended claims. Therefore, it is intended that this disclosure not be limited to the methods described, but that it has the full scope defined by the language of the appended claims and their equivalents. Although the present disclosure has been described with reference to certain methods, various modifications, changes and changes may be made to the described methods without departing from the spirit and scope of the present disclosure as defined in the appended claims. Therefore, it is intended that this disclosure not be limited to the methods described, but that it has the full scope defined by the language of the appended claims and their equivalents.

Claims (20)

1. a kind of device, comprising:

Substrate；

Multiple guard blocks are formed on the substrate；

Core shell surrounds the multiple guard block；

Encapsulated layer is arranged in the core shell and covers the first side of the substrate；

First bonding layer is formed in above the encapsulated layer；

Second bonding layer is formed in above second side of the substrate；And

Surface terminal is coupled at least one of first bonding layer and second bonding layer.

2. device as described in claim 1, the substrate include:

Printed circuit board；And

Conductive layer, wherein the multiple guard block is coupled to the first side of the printed circuit board, and the conductive layer coupling Close second side of the printed circuit board.

3. device as described in claim 1, further includes: be connected to one or more leads of the surface terminal.

4. device as described in claim 1, further includes: formed across the encapsulated layer and first bonding layer multiple logical Hole.

5. device as claimed in claim 4, the surface terminal includes being connected to the substrate by the multiple through-hole Copper foil.

6. device as described in claim 1, wherein the substrate is lead frame, and wherein the lead frame from described The opposite side of core shell extends.

7. device as described in claim 1, wherein the multiple guard block is selected from including in below group: fuse, just Temperature coefficient equipment, integrated circuit, MOSFET, resistor, capacitor and/or sensor.

8. device as described in claim 1, wherein the encapsulated layer is the epoxy resin of injectable.

9. device as described in claim 1, wherein first bonding layer and second bonding layer are coupled to the core shell.

10. a kind of protection circuit module, comprising:

Multiple guard blocks, are formed on substrate；

Core shell, entirely around the substrate；

Encapsulated layer in the core shell and covers the first side of the substrate；

First bonding layer is formed in above the encapsulated layer；

Second bonding layer is formed in above second side of the substrate；And

Surface terminal is coupled at least one of first bonding layer and second bonding layer.

11. protection circuit module, the substrate include: as claimed in claim 10

Printed circuit board；And

Conductive material, wherein the multiple guard block is coupled to the first side of the printed circuit board, and the conduction material Material is coupled to second side of the printed circuit board.

12. protection circuit module as claimed in claim 10, further includes: the one or more for being connected to the surface terminal is drawn Line.

13. protection circuit module as claimed in claim 10, further includes: pass through the encapsulated layer and the first bonding layer shape At multiple through-holes, wherein the surface terminal includes the copper foil for being connected to the substrate by the multiple through-hole.

14. protection circuit module as claimed in claim 10, wherein the multiple guard block is selected from including in below group: Fuse, positive temperature coefficient equipment, integrated circuit, MOSFET, resistor and capacitor.

15. protection circuit module as claimed in claim 10, wherein the encapsulated layer is to be injected at the center of the core shell to open Epoxy resin in mouthful, and wherein the top surface of the encapsulated layer and the top surface of the core shell are substantially plane.

16. protection circuit module as claimed in claim 10, wherein first bonding layer and second bonding layer coupling To the frame of the core shell.

17. a kind of method, comprising:

Multiple guard blocks are provided on substrate；

The multiple guard block is enclosed in the inside of core shell；

Encapsulated layer is formed above the multiple guard block, the inside of the core shell is arranged in the encapsulated layer；

The first bonding layer is formed above the encapsulated layer；And

Surface terminal is coupled at least one of first bonding layer and second bonding layer.

18. method as claimed in claim 17, further includes: one or more leads are connected to the surface terminal.

19. method as claimed in claim 17, further includes:

The multiple through-holes for passing through the encapsulated layer and first bonding layer are provided；And

The surface terminal is connected to the substrate by the multiple through-hole.

20. method as claimed in claim 17, wherein forming the encapsulated layer includes: by epoxy resin injection to the core shell The inside in.