CN110148618A - A kind of display base plate and preparation method thereof, display device - Google Patents

Abstract

The present invention discloses a kind of display base plate and preparation method thereof, display device, is related to field of display technology, abnormal for display device display caused by solving the problems, such as the edge missing due to anode pattern or crimping.The production side of the display base plate includes the steps that production conductive pattern, which specifically includes: forming conductive material film layer；Fixed structure is formed in the conductive material film layer；The conductive material film layer is patterned, form multiple conductive patterns, each conductive pattern includes intermediate region and the fringe region around the intermediate region, and orthographic projection of the fixed structure on the conductive pattern and the fringe region are least partially overlapped.The production method of display base plate provided by the invention is for making display base plate.

Description

Display substrate, manufacturing method thereof, and display device

technical field

The invention relates to the field of display technology, in particular to a display substrate, a manufacturing method thereof, and a display device.

Background technique

Active-matrix organic light emitting diode (English: Active-matrix organic light emitting diode, hereinafter referred to as: AMOLED) display device has attracted widespread attention due to its advantages such as self-illumination, wide viewing angle, higher refresh rate and thinner size. The light-emitting unit inside the AMOLED display device includes an anode pattern and a cathode pattern arranged oppositely, and an organic light-emitting material layer arranged between the two. During operation, holes and electrons are respectively provided through the anode pattern and the cathode pattern, so that holes and The electrons recombine in the luminescent material layer, so that the organic luminescent material layer emits light, and realizes the display function of the AMOLED display device.

However, when making the anode pattern in the related art, it is easy to make the edge part of the anode pattern missing or curled, causing the edge part of the anode pattern to easily damage the organic light-emitting material layer, and then causing a short circuit between the anode pattern and the cathode pattern, causing the display device to display bad.

Contents of the invention

The object of the present invention is to provide a display substrate and its manufacturing method, and a display device, which are used to solve the problem of abnormal display of the display device caused by missing or curling edges of the anode pattern.

In order to achieve the above object, the present invention provides the following technical solutions:

The first aspect of the present invention provides a method for manufacturing a display substrate, including the step of making a conductive pattern, which specifically includes:

Form a film layer of conductive material;

forming a fixed structure on the conductive material film layer;

Patterning the conductive material film layer to form a plurality of conductive patterns, each of the conductive patterns includes a middle area and an edge area surrounding the middle area, and the fixed structure is positively positioned on the conductive pattern The projection at least partially overlaps the edge region.

Optionally, the step of forming a fixed structure on the conductive material film layer specifically includes:

forming a fixed film layer on the conductive material film layer;

Patterning the fixed film layer to form the fixed structure.

Optionally, the step of forming a fixed film layer on the conductive material film layer specifically includes:

forming the fixed film layer on the conductive material film layer by using a photosensitive resin material;

The step of patterning the fixed film layer to form the fixed structure specifically includes:

Utilize the mask plate that comprises light-transmitting area and light-shielding area to expose described fixed film layer, form fixed film layer reserved area and fixed film layer removal area, wherein described fixed film layer reserved area and the area where described fixed structure are located Correspondingly, the region where the fixed film layer is removed corresponds to other regions except the region where the fixed structure is located;

developing the exposed fixed film layer with a developing solution, and removing the fixed film layer located in the fixed film layer removal region to form the fixed structure.

Optionally, the step of forming a fixed film layer on the conductive material film layer specifically includes:

forming the fixed film layer on the conductive material film layer by using an inorganic insulating material;

The step of patterning the fixed film layer to form the fixed structure specifically includes:

forming a photoresist on the fixed film layer;

Expose the photoresist by using a mask plate including a light-transmitting area and a light-shielding area to form a photoresist reserved area and a photoresist removed area, wherein the photoresist reserved area and the area where the fixed structure is located Correspondingly, the photoresist removal area corresponds to other areas except the area where the fixed structure is located;

Developing the exposed photoresist with a developer to remove the photoresist located in the photoresist removal region;

Using the photoresist located in the photoresist reserved area as a mask, etching the fixed film layer located in the photoresist removed area, so as to remove the fixed film layer located in the photoresist removed area;

The photoresist located in the photoresist reserved area is stripped to form the fixed structure.

Optionally, the step of patterning the conductive material film layer to form a plurality of conductive patterns specifically includes:

forming a photoresist that completely covers the conductive material film layer and the fixed structure;

Expose the photoresist by using a mask plate including a light-transmitting area and a light-shielding area to form a photoresist retention area and a photoresist removal area, wherein the photoresist retention area and the area where the conductive pattern is located Correspondingly, the photoresist removal area corresponds to other areas except the area where the conductive pattern is located;

removing the photoresist located in the photoresist removal region by using a developing solution;

Using the photoresist located in the photoresist reserved area as a mask, etching the conductive material film layer located in the photoresist removed area, so that the conductive material located in the photoresist removed area film removal;

The photoresist located in the photoresist reserved area is stripped to form the conductive pattern.

Optionally, the conductive pattern includes an anode pattern of the display substrate, and the manufacturing method further includes:

Before the step of making a conductive pattern, a pixel circuit layer is made on the provided substrate, and the pixel circuit layer includes a plurality of pixel circuits;

The step of making the conductive pattern specifically includes:

On the side of the pixel circuit layer facing away from the substrate, the anode patterns corresponding to the pixel circuits are formed one by one, and the anode patterns are electrically connected to the output electrodes of the driving transistors in the corresponding pixel circuits ;

The preparation method also includes:

After the step of making a conductive pattern, a pixel defining layer for defining a plurality of pixel opening regions is formed on the side of the fixed structure facing away from the anode pattern, and the pixel opening regions expose the pixel opening regions one by one. at least part of the anode pattern;

A spacer is formed on the surface of the pixel defining layer facing away from the substrate.

Based on the technical solution of the above-mentioned manufacturing method of the display substrate, the second aspect of the present invention provides a display substrate, which is manufactured by the above-mentioned manufacturing method of the display substrate, and the display substrate includes:

a plurality of conductive patterns, each of which includes a middle region and an edge region surrounding the middle region;

A fixing structure disposed on the conductive pattern, the orthographic projection of the fixing structure on the conductive pattern at least partially overlaps with the edge region.

Optionally, the orthographic projection of the fixing structure on the conductive pattern coincides with the edge area.

Optionally, the fixing structure adopts photosensitive resin material or inorganic insulating material.

Optionally, the conductive pattern includes an anode pattern;

The display substrate also includes:

base,

a pixel circuit layer disposed on the substrate, the pixel circuit layer including a plurality of pixel circuits;

The anode electrical pattern is located on the side of the pixel circuit layer facing away from the substrate, and the anode pattern is electrically connected to the output electrodes of the driving transistors in the plurality of pixel circuits in one-to-one correspondence;

A pixel defining layer disposed on the side of the fixed structure facing away from the substrate, the pixel defining layer defines a plurality of pixel opening regions, and the pixel opening regions expose at least part of the anode pattern in one-to-one correspondence;

A spacer disposed on the surface of the pixel defining layer facing away from the substrate.

Based on the above-mentioned technical solution of the display substrate, a third aspect of the present invention provides a display device, including the above-mentioned display substrate.

In the technical solution provided by the present invention, a conductive material film layer for making a conductive pattern is first formed, and then a fixed structure is formed on the conductive material film layer corresponding to the edge area of the conductive pattern, and then the conductive material film layer is patterned In this way, in the process of patterning and forming conductive patterns, the pre-formed fixed structure can cover the edge areas of conductive patterns, thereby forming protection for the edge areas of conductive patterns, so that even in the process of making conductive patterns , Rinsing the conductive pattern with high-pressure water will not cause the edge part of the conductive pattern to be missing or curled, so that the production yield of the conductive pattern is well guaranteed.

Therefore, when the technical scheme provided by the present invention is used to manufacture the display substrate, when the fabricated conductive pattern is used for the anode pattern, it can be ensured that the edge area of the anode pattern will not be missing or curled, thereby ensuring that the anode pattern made on the anode pattern The yield rate of the organic light-emitting material layer is very good, and the probability of short circuit between the anode pattern and the cathode pattern is greatly reduced.

In addition, the technical solution provided by the present invention achieves the above-mentioned technical effect only by making a fixed structure, which not only has a simple process, but also does not have adverse effects on the subsequent manufacturing process of the display substrate, and does not cause any display defects.

Description of drawings

The accompanying drawings described here are used to provide a further understanding of the present invention, and constitute a part of the present invention. The schematic embodiments of the present invention and their descriptions are used to explain the present invention, and do not constitute improper limitations to the present invention. In the attached picture:

Fig. 1 is a schematic diagram of the production process of a conductive pattern provided by an embodiment of the present invention;

FIG. 2 is a schematic diagram of a manufacturing process of a display substrate provided by an embodiment of the present invention;

FIG. 3 is a schematic cross-sectional view of a display substrate provided by an embodiment of the present invention.

Reference signs:

1-substrate, 20-film layer of conductive material,

21-conductive pattern, 3-fixed structure,

4-photoresist, 5-pixel definition layer,

6-spacer, 7-pixel circuit layer,

8- Flat layer.

Detailed ways

In order to further illustrate the display substrate, the manufacturing method thereof, and the display device provided by the embodiments of the present invention, a detailed description will be given below in conjunction with the accompanying drawings.

In the related art, the specific structure of an AMOLED display device generally includes: a substrate, a pixel circuit layer arranged on the substrate, and a plurality of light-emitting units arranged on the side of the pixel circuit layer facing away from the substrate; A pixel circuit, each light-emitting unit includes an anode pattern and a cathode pattern oppositely arranged, and an organic light-emitting material layer arranged between the two, the anode pattern corresponds to the pixel circuit one by one, and each anode pattern corresponds to the corresponding pixel The output electrodes of the drive transistors in the circuit are electrically connected. When an AMOLED display device displays a picture, the pixel circuit provides a driving signal for the corresponding anode pattern, and at the same time, the common signal line in the AMOLED display device can provide a cathode signal for the cathode pattern, so that the anode pattern and the cathode pattern can respectively be organic light-emitting materials. The layer provides holes and electrons, and the holes and electrons are recombined in the organic light-emitting material layer, so that the organic light-emitting material layer emits light of a corresponding color.

The inventors of the present invention have found through research that when making the above-mentioned light-emitting unit, the anode pattern is generally made first, and then the organic light-emitting material layer is made on the anode pattern by evaporation process, and finally the organic light-emitting material layer is formed on the side facing away from the anode pattern. Making the cathode pattern; because the thickness of the organic light-emitting material layer is relatively thin, when the organic light-emitting material layer is damaged, it is easy to cause a short circuit between the anode pattern and the cathode pattern on the opposite sides, Further, the pixel corresponding to the light emitting unit is not bright, so that the display device has a dark spot defect when displaying a picture.

The inventors of the present invention have further researched and found that the factors that easily lead to damage to the organic light-emitting material layer are as follows:

In the related art, making an anode pattern generally includes the following steps: firstly forming a film layer for making an anode pattern, and then patterning the film layer to obtain an anode pattern; wherein the patterning process generally includes: first forming an anode pattern on the surface of the film layer Form a photoresist, then use a mask to expose and develop the photoresist to expose the film layer to be removed, then etch the exposed film layer, and finally peel off the remaining photoresist, Form an anode pattern.

Because in the process of stripping the remaining photoresist, it is necessary to use high-pressure water to rinse the surface where the anode pattern is formed, which easily causes the edge part of the anode pattern to be missing or blown up, and the edge part where the anode pattern appears is missing or curled After the phenomenon, the edge part of the anode pattern can easily damage the subsequent pixel defining layer and the organic light-emitting material layer in contact with it, thereby causing a short circuit between the anode pattern and the cathode pattern, affecting the normal display of the display device. Based on the existence of the above problems, the present invention proposes the following technical solutions:

Please refer to FIG. 1, an embodiment of the present invention provides a method for manufacturing a display substrate, including the step of making a conductive pattern 21, which specifically includes:

forming a conductive material film layer 20;

forming a fixed structure 3 on the conductive material film layer 20;

The conductive material film layer 20 is patterned to form a plurality of conductive patterns 21, each of the conductive patterns 21 includes a middle region and an edge region surrounding the middle region, and the fixing structure 3 is placed on the conductive pattern 21. The orthographic projection onto the graphic 21 at least partially overlaps the edge region.

Specifically, when forming the above-mentioned conductive material film layer 20 , a metal material or indium tin oxide can be specifically selected, and deposited to form the conductive material film layer 20 , but it is not limited thereto.

After forming the conductive material film layer 20, a fixed structure 3 is formed on the conductive material film layer 20. The specific formation position of the fixed structure 3 depends on the position of the conductive pattern 21 to be made. In more detail, the above-mentioned formed The conductive material film layer 20 is used to make the conductive pattern 21, and the specific formation position of the conductive pattern 21 can be determined in advance, therefore, the fixed structure 3 can be formed on the position corresponding to the edge area of the conductive pattern 21, and the fixed structure 3 and the conductive pattern 21 The specific positional relationship includes: the orthographic projection of the fixing structure 3 on the conductive pattern 21 at least partially overlaps the edge area of the conductive pattern 21, or the orthographic projection of the fixing structure 3 on the conductive pattern 21 coincides with the edge area of the conductive pattern 21.

After making the fixed structure 3, the conductive material film layer 20 can be continued to be patterned to form a conductive pattern 21, since the fixed structure 3 is formed on the conductive material film layer 20 in advance corresponding to the edge region of the conductive pattern 21, so In the process of forming the conductive pattern 21, the fixing structure 3 can protect the edge area of the conductive pattern 21 to be produced, so that the edge area of the conductive pattern 21 is not easy to be missing or curled during the patterning process.

In the manufacturing method of the display substrate provided by the embodiment of the present invention, the conductive material film layer 20 for making the conductive pattern 21 is formed first, and then the fixed structure 3 is formed on the conductive material film layer 20 corresponding to the edge area of the conductive pattern 21 , and then the conductive material film layer 20 is patterned to form a conductive pattern 21, so that in the process of patterning and forming the conductive pattern 21, the pre-formed fixing structure 3 can cover the edge area of the conductive pattern 21, so that the conductive pattern The edge area of 21 forms a protection, so that even if the conductive pattern 21 is washed with high-pressure water in the process of making the conductive pattern 21, it will not cause the edge part of the conductive pattern 21 to be missing or curled, thereby ensuring a good conductive pattern. 21 production yield.

Therefore, when using the manufacturing method provided by the embodiment of the present invention to manufacture the display substrate, when the fabricated conductive pattern 21 is used for the anode pattern, it can be ensured that the edge area of the anode pattern will not be missing or curled, thereby ensuring that the anode pattern The yield rate of the organic light-emitting material layer fabricated on the upper layer is very good, and the probability of short circuit between the anode pattern and the cathode pattern is greatly reduced.

In addition, the manufacturing method of the display substrate provided by the embodiment of the present invention achieves the above-mentioned technical effects only by making the fixing structure 3, which not only has a simple process, but also does not adversely affect the subsequent manufacturing process of the display substrate, nor does it cause any Bad display.

In some embodiments, the step of forming the fixed structure 3 on the conductive material film layer 20 specifically includes:

forming a fixed film layer on the conductive material film layer 20;

The fixed film layer is patterned to form the fixed structure 3 .

Specifically, the above-mentioned fixing structure 3 can be made of various materials, for example, a resin material or an inorganic insulating material can be used to make the fixing structure 3 . In more detail, the fixed film layer for making the fixed structure 3 can be formed on the conductive material film layer 20 first, and then according to the material of the fixed film layer, an appropriate method is selected to pattern the fixed film layer, so that The fixed structure 3 is formed on the conductive material film layer 20 corresponding to the edge area of the conductive pattern 21 .

When the fixing structure 3 is manufactured by the manufacturing method provided in the above embodiment, not only the manufacturing method is simple, but also the fixing structure 3 can be formed at a designated position, thereby well protecting the edge area of the conductive pattern 21 .

In some embodiments, the step of forming a fixed film layer on the conductive material film layer 20 specifically includes:

Forming the fixed film layer on the conductive material film layer 20 by using a photosensitive resin material;

The step of patterning the fixed film layer to form the fixed structure 3 specifically includes:

Utilize the mask plate that comprises light-transmitting area and light-shielding area to expose described fixed film layer, form fixed film layer reserved area and fixed film layer removal area, wherein described fixed film layer reserved area and described fixed structure 3 are located Corresponding to the area, the fixed film layer removal area corresponds to other areas except the area where the fixed structure 3 is located;

The exposed fixed film layer is developed with a developing solution, and the fixed film layer located in the fixed film layer removal region is removed to form the fixed structure 3 .

Specifically, a photosensitive resin material can be used to form a fixed film layer on the conductive material film layer 20 first, and then the mask plate including the light-transmitting area and the light-shielding area is aligned with the fixed film layer, and then the fixed film layer is fixed through the mask plate. The film layer is exposed to form a fixed film layer retention area and a fixed film layer removal area, wherein the fixed film layer retention area corresponds to the area where the fixed structure 3 is located, and the fixed film layer removal area corresponds to the fixed film layer removal area except for the fixed film layer. Other regions other than the region where the structure 3 is located correspond to; finally, the exposed fixed film layer is developed with a developing solution, and the fixed film layer located in the fixed film layer removal region is removed to form the fixed structure 3 .

It should be noted that, as shown in FIG. 3, the above-mentioned photosensitive resin material can also be used to make the flat layer 8 or the pixel defining layer 5 in the display substrate. When the material used for the fixed structure 3 is the same as that of the flat layer 8 or the pixel defining layer 5, In the process of making the display substrate, the equipment for making the flat layer 8 or the equipment for making the pixel defining layer 5 can be used to make the fixed structure 3, thereby avoiding the introduction of additional equipment for making the fixed structure 3, and better reducing the display substrate. production cost.

In some embodiments, the step of forming a fixed film layer on the conductive material film layer 20 specifically includes:

forming the fixed film layer on the conductive material film layer 20 by using an inorganic insulating material;

The step of patterning the fixed film layer to form the fixed structure 3 specifically includes:

forming a photoresist on the fixed film layer;

Expose the photoresist by using a mask plate including a light-transmitting area and a light-shielding area to form a photoresist reserved area and a photoresist removed area, wherein the photoresist reserved area and the fixed structure 3 are located Corresponding to the area, the photoresist removal area corresponds to other areas except the area where the fixing structure 3 is located;

Developing the exposed photoresist with a developer to remove the photoresist located in the photoresist removal region;

Using the photoresist located in the photoresist reserved area as a mask, etching the fixed film layer located in the photoresist removed area, so as to remove the fixed film layer located in the photoresist removed area;

The photoresist located in the photoresist reserved area is stripped to form the fixed structure 3 .

Specifically, when an inorganic insulating material is used to form the fixed film layer, the inorganic insulating material may be specifically selected from silicon oxide or silicon nitride, but not limited thereto.

After forming the fixed film layer, a photoresist can be formed on the surface of the fixed film layer facing away from the conductive material film layer 20, and then the mask plate including the light-transmitting area and the light-shielding area is aligned with the photoresist, and The film plate exposes the photoresist to form a photoresist reserved area and a photoresist removed area, wherein the photoresist reserved area corresponds to the area where the fixed structure 3 is located, and the photoresist removed area corresponds to the area where the fixed structure 3 is located. Other areas except the area where the fixing structure 3 is located correspond.

After the photoresist is exposed, the photoresist after exposure can be developed by using a developer, and the photoresist located in the photoresist removal area is removed to remove the fixed film layer located in the photoresist removal area. Expose; Then use the photoresist located in the photoresist reserved area as a mask, etch the fixed film layer located in the photoresist removed area by an etching process, so that the fixed film layer located in the photoresist removed area The film layer is removed; finally, the remaining photoresist located in the photoresist reserved area is peeled off to form the fixed structure 3 .

When the fixing structure 3 is fabricated using the manufacturing method provided in the above embodiments, the fixing structure 3 can be accurately formed at a designated position, so that the fixing structure 3 can better play a protective role.

Please continue to refer to FIG. 1. In some embodiments, the step of patterning the conductive material film layer 20 and forming a plurality of conductive patterns 21 specifically includes:

forming a photoresist that completely covers the conductive material film layer 20 and the fixed structure 3;

The photoresist is exposed using a mask plate comprising a light-transmitting area and a light-shielding area to form a photoresist reserved area and a photoresist removed area, wherein the photoresist reserved area and the conductive pattern 21 are located Corresponding to the area, the photoresist removal area corresponds to other areas except the area where the conductive pattern 21 is located;

removing the photoresist located in the photoresist removal region by using a developing solution;

Using the photoresist located in the photoresist reserved area as a mask, etch the conductive material film layer 20 located in the photoresist removed area, so as to place the conductive material film layer 20 located in the photoresist removed area The material film layer 20 is removed;

The photoresist located in the photoresist reserved area (marked 4 in FIG. 1 ) is stripped to form the conductive pattern 21 .

Specifically, after the fixed structure 3 is manufactured, a photoresist that completely covers the conductive material layer and the fixed structure 3 can be continuously formed, and then the mask plate including the light-transmitting region and the light-shielding region is aligned with the photoresist, The photoresist is exposed through the mask to form a photoresist reserved area and a photoresist removed area, wherein the photoresist reserved area corresponds to the area where the conductive pattern 21 is located, and the photoresist The removal area corresponds to other areas except the area where the conductive pattern 21 is located; The conductive material film layer 20 in the resist removal region is exposed; then using the photoresist in the photoresist remaining region as a mask, the conductive material in the photoresist removal region is etched by an etching process film layer 20, to remove the conductive material film layer 20 located in the photoresist removal area; finally peel off the photoresist located in the photoresist retention area, and simultaneously use high-pressure water to rinse, finally forming the conductive material film layer 20; Figure 21.

Before forming the conductive pattern 21 by the patterning process, the fixed structure 3 is made in the position corresponding to the edge region of the conductive pattern 21 in the conductive material film layer 20, therefore, the conductive material film layer 20 is patterned and formed by the patterning process. When the conductive pattern 21 is formed, the pre-formed fixing structure 3 can cover the edge area of the conductive pattern 21 to be made, thereby forming a protection for the edge area of the conductive pattern 21, so even in the process of making the conductive pattern 21, using high-pressure water to Rinsing the conductive pattern 21 will not cause the edge part of the conductive pattern 21 to be missing or curled, so that the production yield of the conductive pattern 21 is well guaranteed.

Further, as shown in FIG. 2 and FIG. 3, the conductive pattern 21 includes the anode pattern of the display substrate, and the manufacturing method further includes: before the step of making the conductive pattern 21, on the provided substrate Make pixel circuit layer 7 on 1, described pixel circuit layer 7 comprises a plurality of pixel circuits;

The step of making the conductive pattern 21 specifically includes: on the side of the pixel circuit layer 7 facing away from the substrate 1, forming the anode pattern corresponding to the pixel circuit one by one, the anode pattern and the corresponding anode pattern The output electrodes of the drive transistors in the pixel circuit are electrically connected;

The preparation method also includes:

After the step of making the conductive pattern 21, a pixel defining layer 5 for defining a plurality of pixel opening regions is formed on the side of the fixed structure 3 facing away from the conductive pattern 21, and the pixel opening regions are one by one Correspondingly exposing at least part of the anode pattern (as marked 21 in FIG. 2 );

Spacers 6 are formed on the surface of the pixel defining layer 5 facing away from the substrate 1 .

Specifically, the conductive pattern 21 produced by the production method provided in the above embodiment can be used as an anode pattern in the display substrate. When the above conductive pattern 21 is an anode pattern, the above method for producing a display substrate may specifically include the following process:

A substrate 1 is provided first, and a pixel circuit layer 7 is fabricated on the provided substrate 1. The pixel circuit layer 7 may include a plurality of pixel circuits distributed in an array, and each pixel circuit may include a plurality of thin film transistors, as in the related art 7T1C circuit (including 7 thin film transistors and 1 capacitor), 13T2C (including 13 thin film transistors and 2 capacitors) circuit, etc., each thin film transistor can include gate, gate insulating layer, active layer, interlayer insulating layer, Source layer and drain layer; one of the source layer and the drain layer of the driving transistor in the pixel circuit is used as the output electrode of the driving transistor, and the other of the source layer and the drain layer of the driving transistor in the pixel circuit is used as The input electrode of the drive transistor; after the pixel circuit layer 7 is made, a flat layer 8 can be formed on the surface of the pixel circuit layer 7 facing away from the substrate 1, and the output electrode of the drive transistor in the pixel circuit is formed on the flat layer 8. Corresponding via holes; then form the anode pattern one-to-one corresponding to the pixel circuit on the surface of the flat layer 8 facing away from the substrate 1, and the fixed structure 3 located at the edge region of the anode pattern, and the anode pattern passes through the corresponding The via hole is electrically connected to the output electrode of the driving transistor in the corresponding pixel circuit.

It should be noted that the above-mentioned anode pattern is electrically connected to the output electrode of the corresponding driving transistor in the pixel circuit through the corresponding via hole, including direct electrical connection and indirect electrical connection; where the direct electrical connection means that the via hole can connect the corresponding driving transistor The output electrode is directly exposed, so that the anode pattern can be in direct contact with it to realize electrical connection; the indirect electrical connection means that the pixel circuit also includes other control transistors electrically connected to the output electrode of the driving transistor, and the via hole corresponding to the driving transistor can connect The output electrode of the control transistor is exposed, so that the anode pattern can be electrically connected to the output electrode of the drive transistor corresponding to the anode pattern by directly contacting the output electrode of the control transistor.

After the anode pattern is made, a photosensitive resin film covering the entire anode pattern and the fixed structure 3 is formed, and then the photosensitive resin film is patterned to obtain a pixel defining layer 5, which defines a plurality of pixel opening regions, The pixel opening area exposes at least part of the anode pattern one by one; then spacers 6 are formed on the surface of the pixel defining layer 5 facing away from the substrate 1; finally, the at least part of the surface facing away from the substrate 1 can be fabricated An organic luminescent material layer, and a cathode pattern is made on the side of the organic luminescent material layer facing away from the substrate 1 . It should be noted that the material selected for the spacer 6 and the specific manufacturing method may be the same as the pixel defining layer 5 , which will not be repeated here. In addition, the above-mentioned pixel defining layer 5 can completely cover the fixed structure 3 , or cover at least part of the fixed structure 3 .

When the anode pattern in the display substrate is fabricated using the fabrication method provided in the above embodiment, it can ensure that the edge area of the anode pattern will not be missing or curled, thereby ensuring the yield rate of the organic light-emitting material layer fabricated on the anode pattern, which is very good. The probability of short circuit between the anode pattern and the cathode pattern is reduced, and a good display effect of the display substrate is guaranteed.

An embodiment of the present invention also provides a display substrate, which is manufactured by using the method for manufacturing a display substrate provided in the above embodiment, and the display substrate includes:

A plurality of conductive patterns 21, each of which includes a middle region and an edge region surrounding the middle region;

For the fixing structure 3 disposed on the conductive pattern 21, the orthographic projection of the fixing structure 3 on the conductive pattern 21 at least partially overlaps with the edge region.

Specifically, the above-mentioned conductive pattern 21 can be made of metal material or indium tin oxide, and can be specifically used to display the anode pattern in the substrate. The above-mentioned fixing structure 3 can be formed in the edge area of the conductive pattern 21 during the process of making the conductive pattern 21 , and the orthographic projection of the fixing structure 3 on the conductive pattern 21 can at least partially overlap with the edge area of the conductive pattern 21 .

When manufacturing the display substrate provided by the embodiment of the present invention by using the manufacturing method of the display substrate provided in the above embodiment, the conductive material film layer 20 for making the conductive pattern 21 is formed first, and then the conductive material film layer 20 is combined with the conductive pattern 21. The fixed structure 3 is formed at the corresponding position of the edge area of the edge area, and then the conductive material film layer 20 is patterned to form a conductive pattern 21, so that in the process of patterning and forming the conductive pattern 21, the pre-formed fixed structure 3 can integrate the conductive pattern 21 The edge area is covered to protect the edge area of the conductive pattern 21, so that even if the conductive pattern 21 is washed with high-pressure water in the process of making the conductive pattern 21, the edge portion of the conductive pattern 21 will not be missing or curled , so that the production yield of the conductive pattern 21 is well guaranteed. Therefore, when the conductive pattern 21 in the display substrate provided by the embodiment of the present invention is used for the anode pattern, it can ensure that the edge area of the anode pattern will not be missing or curled, thereby ensuring that the organic light-emitting material layer fabricated on the anode pattern The yield rate is very good, and the probability of short circuit between the anode pattern and the cathode pattern is greatly reduced.

Further, it may be set that the orthographic projection of the fixing structure 3 on the conductive pattern 21 coincides with the edge area.

The orthographic projection of the fixed structure 3 on the conductive pattern 21 is set to coincide with the edge area, so that the fixed structure 3 can protect the entire edge area of the conductive pattern 21, thereby better ensuring the entire edge area of the conductive pattern 21 Neither will be missing or curled.

In some embodiments, the fixing structure 3 can be made of photosensitive resin material or inorganic insulating material.

Specifically, when the fixed structure 3 is made of a photosensitive resin material, there is no need to additionally form a photoresist, and the fixed structure 3 can be formed by directly exposing and developing the fixed film layer formed by the photosensitive resin material, avoiding the introduction of an etching process, This makes the manufacturing process of the fixed structure 3 simpler. Moreover, the above-mentioned photosensitive resin material can also be used to make the flat layer 8 or the pixel defining layer 5 in the display substrate. The fixed structure 3 can be made by using the equipment for making the flat layer 8 or the device for making the pixel defining layer 5, thereby avoiding the introduction of additional equipment for making the fixed structure 3, and better reducing the manufacturing cost of the display substrate.

When using inorganic insulating materials to make the fixed structure 3, although it is necessary to form a photoresist and increase the etching process, the fixed structure 3 can be accurately formed at the designated position, so that the fixed structure 3 can better protect effect.

As shown in FIG. 3, in some embodiments, the conductive pattern 21 includes an anode pattern; the display substrate further includes: a substrate 1, a pixel circuit layer 7 disposed on the substrate 1, and the pixel circuit layer 7 Including a plurality of pixel circuits; the anode electrical pattern is located on the side of the pixel circuit layer 7 facing away from the substrate 1, and the anode pattern corresponds to the output electrodes of the drive transistors in the plurality of pixel circuits one by one Electrical connection; the pixel defining layer 5 arranged on the side of the fixed structure 3 facing away from the substrate 1, the pixel defining layer 5 defines a plurality of pixel opening regions, and the pixel opening regions expose the At least part of the anode pattern; a spacer 6 disposed on the surface of the pixel defining layer 5 facing away from the substrate 1 .

Specifically, the display substrate provided in the above embodiments specifically includes: a substrate 1, a pixel circuit layer 7 disposed on the substrate 1, the pixel circuit layer 7 may include a plurality of pixel circuits distributed in an array, and each pixel circuit may Including a plurality of thin film transistors, each thin film transistor may include a gate, a gate insulating layer, an active layer, an interlayer insulating layer, a source layer and a drain layer; the source layer and the drain layer of the driving transistor in the pixel circuit One of them is used as the output electrode of the driving transistor, and the other of the source layer and the drain layer of the driving transistor in the pixel circuit is used as the input electrode of the driving transistor; A flat layer 8 on the surface of the substrate 1, on which via holes corresponding to the output electrodes in the drive transistors are formed; side, and the anode pattern is electrically connected (including direct electrical connection and indirect electrical connection) to the output electrode of the driving transistor in the corresponding pixel circuit through the corresponding via hole. A pixel defining layer 5 is also provided on the side of the fixed structure 3 facing away from the base 1. The pixel defining layer 5 can be made of a photosensitive resin material. The pixel defining layer 5 defines a plurality of pixel opening areas, and the pixel opening areas are one by one. Correspondingly exposing at least part of the anode pattern. The above-mentioned display substrate also includes an organic luminescent material layer disposed at least partially on the surface facing away from the substrate 1, a cathode pattern disposed on the side of the organic luminescent material layer facing away from the substrate 1, and a cathode pattern disposed on the pixel defining layer 5 facing away from the substrate 1. Spacers 6 are formed on the surface of the substrate 1 .

In the display substrate provided by the above embodiment, in the process of making the anode pattern, the fixed structure 3 is set in the edge area of the anode pattern, and the edge area of the anode pattern is protected by the fixed structure 3, ensuring that the edge area of the anode pattern does not It will be missing or curled, thereby ensuring the yield rate of the organic light-emitting material layer fabricated on the anode pattern, reducing the probability of short circuit between the anode pattern and the cathode pattern, and ensuring a good display effect of the display substrate.

An embodiment of the present invention also provides a display device, including the display substrate provided in the above embodiment.

In the display substrate provided by the above embodiment, the edge area of the included conductive pattern 21 will not be missing or curled, so that when the conductive pattern 21 is used for the anode pattern, it can be ensured that the edge area of the anode pattern will not be missing or curled. Curl, thereby ensuring the yield rate of the organic light-emitting material layer fabricated on the anode pattern, and reducing the probability of short circuit between the anode pattern and the cathode pattern, so that the display substrate has a higher display yield rate. Therefore, this When the display device provided by the embodiment of the invention includes the above-mentioned display substrate, it also has the above-mentioned beneficial effects, which will not be repeated here.

It should be noted that the display device may be any product or component with a display function such as a TV, a monitor, a digital photo frame, a mobile phone, and a tablet computer.

It should be noted that each embodiment in this specification is described in a progressive manner, the same and similar parts of each embodiment can be referred to each other, and each embodiment focuses on the differences from other embodiments. In particular, for the product embodiment, since it is basically similar to the method embodiment, the description is relatively simple, and for related parts, please refer to the part of the description of the product embodiment.

Unless otherwise defined, the technical terms or scientific terms used in the present disclosure shall have the usual meanings understood by those skilled in the art to which the present invention belongs. "First", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. "Comprising" or "comprising" and similar words mean that the elements or items appearing before the word include the elements or items listed after the word and their equivalents, without excluding other elements or items. Words such as "connected" or "connected" are not limited to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "Up", "Down", "Left", "Right" and so on are only used to indicate the relative positional relationship. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element, Or intervening elements may be present.

In the description of the above embodiments, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in an appropriate manner.

The above is only a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Anyone skilled in the art can easily think of changes or substitutions within the technical scope disclosed in the present invention. Should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention should be determined by the protection scope of the claims.

Claims (11)

1. A method for manufacturing a display substrate, characterized in that it comprises the step of making a conductive pattern, which step specifically includes: Form a film layer of conductive material; forming a fixed structure on the conductive material film layer; Patterning the conductive material film layer to form a plurality of conductive patterns, each of the conductive patterns includes a middle area and an edge area surrounding the middle area, and the fixed structure is positively positioned on the conductive pattern The projection at least partially overlaps the edge region. 2. The method for manufacturing a display substrate according to claim 1, wherein the step of forming a fixed structure on the conductive material film layer specifically comprises: forming a fixed film layer on the conductive material film layer; Patterning the fixed film layer to form the fixed structure. 3. The method for manufacturing a display substrate according to claim 2, wherein the step of forming a fixed film layer on the conductive material film layer specifically comprises: forming the fixed film layer on the conductive material film layer by using a photosensitive resin material; The step of patterning the fixed film layer to form the fixed structure specifically includes: Utilize the mask plate that comprises light-transmitting area and light-shielding area to expose described fixed film layer, form fixed film layer reserved area and fixed film layer removal area, wherein described fixed film layer reserved area and the area where described fixed structure are located Correspondingly, the region where the fixed film layer is removed corresponds to other regions except the region where the fixed structure is located; developing the exposed fixed film layer with a developing solution, and removing the fixed film layer located in the fixed film layer removal region to form the fixed structure. 4. The method for manufacturing a display substrate according to claim 2, wherein the step of forming a fixed film layer on the conductive material film layer specifically comprises: forming the fixed film layer on the conductive material film layer by using an inorganic insulating material; The step of patterning the fixed film layer to form the fixed structure specifically includes: forming a photoresist on the fixed film layer; Expose the photoresist by using a mask plate including a light-transmitting area and a light-shielding area to form a photoresist reserved area and a photoresist removed area, wherein the photoresist reserved area and the area where the fixed structure is located Correspondingly, the photoresist removal area corresponds to other areas except the area where the fixed structure is located; Developing the exposed photoresist with a developer to remove the photoresist located in the photoresist removal region; Using the photoresist located in the photoresist reserved area as a mask, etching the fixed film layer located in the photoresist removed area, so as to remove the fixed film layer located in the photoresist removed area; The photoresist located in the photoresist reserved area is stripped to form the fixed structure. 5. The method for manufacturing a display substrate according to claim 1, wherein the step of patterning the conductive material film layer to form a plurality of conductive patterns specifically comprises: forming a photoresist that completely covers the conductive material film layer and the fixed structure; Expose the photoresist by using a mask plate including a light-transmitting area and a light-shielding area to form a photoresist retention area and a photoresist removal area, wherein the photoresist retention area and the area where the conductive pattern is located Correspondingly, the photoresist removal area corresponds to other areas except the area where the conductive pattern is located; removing the photoresist located in the photoresist removal region by using a developing solution; Using the photoresist located in the photoresist reserved area as a mask, etching the conductive material film layer located in the photoresist removed area, so that the conductive material located in the photoresist removed area film removal; The photoresist located in the photoresist reserved area is stripped to form the conductive pattern. 6. The method for manufacturing a display substrate according to any one of claims 1 to 5, wherein the conductive pattern includes an anode pattern of the display substrate, and the method further includes: Before the step of making a conductive pattern, a pixel circuit layer is made on the provided substrate, and the pixel circuit layer includes a plurality of pixel circuits; The step of making the conductive pattern specifically includes: On the side of the pixel circuit layer facing away from the substrate, the anode patterns corresponding to the pixel circuits are formed one by one, and the anode patterns are electrically connected to the output electrodes of the driving transistors in the corresponding pixel circuits ; The preparation method also includes: After the step of making a conductive pattern, a pixel defining layer for defining a plurality of pixel opening regions is formed on the side of the fixed structure facing away from the anode pattern, and the pixel opening regions expose the pixel opening regions one by one. at least part of the anode pattern; A spacer is formed on the surface of the pixel defining layer facing away from the substrate. 7. A display substrate, characterized in that it is produced by the method for producing a display substrate according to any one of claims 1 to 6, and the display substrate comprises: a plurality of conductive patterns, each of which includes a middle region and an edge region surrounding the middle region; A fixing structure disposed on the conductive pattern, the orthographic projection of the fixing structure on the conductive pattern at least partially overlaps with the edge region. 8. The display substrate according to claim 7, wherein the orthographic projection of the fixing structure on the conductive pattern coincides with the edge area. 9. The display substrate according to claim 7 or 8, wherein the fixing structure is made of a photosensitive resin material or an inorganic insulating material. 10. The display substrate according to claim 7 or 8, wherein the conductive pattern comprises an anode pattern; The display substrate also includes: base, a pixel circuit layer disposed on the substrate, the pixel circuit layer including a plurality of pixel circuits; The anode electrical pattern is located on the side of the pixel circuit layer facing away from the substrate, and the anode pattern is electrically connected to the output electrodes of the driving transistors in the plurality of pixel circuits in one-to-one correspondence; A pixel defining layer disposed on the side of the fixed structure facing away from the substrate, the pixel defining layer defines a plurality of pixel opening regions, and the pixel opening regions expose at least part of the anode pattern in one-to-one correspondence; A spacer disposed on the surface of the pixel defining layer facing away from the substrate. 11. A display device, comprising the display substrate according to any one of claims 7-10.