CN110239218B - Chip packaging structure of ink-jet printing head and manufacturing method thereof - Google Patents
Chip packaging structure of ink-jet printing head and manufacturing method thereof Download PDFInfo
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- CN110239218B CN110239218B CN201910609526.2A CN201910609526A CN110239218B CN 110239218 B CN110239218 B CN 110239218B CN 201910609526 A CN201910609526 A CN 201910609526A CN 110239218 B CN110239218 B CN 110239218B
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- opening
- manufacturing
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- 238000007641 inkjet printing Methods 0.000 title claims abstract description 26
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 23
- 229920006254 polymer film Polymers 0.000 claims abstract description 104
- 239000000758 substrate Substances 0.000 claims abstract description 103
- 239000002184 metal Substances 0.000 claims abstract description 49
- 239000012530 fluid Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 42
- 238000005530 etching Methods 0.000 claims description 15
- 238000005520 cutting process Methods 0.000 claims description 8
- 238000010030 laminating Methods 0.000 claims description 8
- 238000003825 pressing Methods 0.000 claims description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14016—Structure of bubble jet print heads
- B41J2/14088—Structure of heating means
- B41J2/14112—Resistive element
- B41J2/14129—Layer structure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/16—Production of nozzles
- B41J2/1601—Production of bubble jet print heads
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The invention discloses an ink jet printing head chip packaging structure, which comprises a plurality of chip units, wherein each chip unit comprises a substrate, a first layer of polymer film and a second layer of polymer film, the substrate is provided with a front surface and a back surface, a through hole is arranged on the substrate, a metal circuit is arranged on the front surface of the substrate, the first layer of polymer film is pressed on the front surface of the substrate, the second layer of polymer film is pressed on the first layer of polymer film, a first opening is arranged on the first layer of polymer film, a second opening is arranged on the second layer of polymer film, and the through hole of the substrate, the first opening of the first layer of polymer film and the second opening of the second layer of polymer film are correspondingly conducted to form a fluid channel. The invention also discloses a manufacturing method of the ink-jet printing head chip packaging structure. The ink jet mouth in the ink jet printing head chip packaging structure manufactured by the invention can not collapse, the opening precision is high, the manufacturing cost of the packaging structure is low, the yield of products is high, and the mass production can be realized by manufacturing.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to an ink jet printing head chip packaging structure and a manufacturing method thereof.
Background
Printers have become an essential accessory to computers. The ink-jet printer has the advantages of high resolution, excellent color output effect, convenient consumable replacement, moderate price, easy maintenance and the like, and is always the main stream of the printer market; the quality of the printing of the printer is high, the ink-jet printing head occupies an important factor, and the most important element in the ink-jet printing head is a chip, and the quality of the manufacturing of the chip determines the printing quality of the ink-jet printing head. The fabrication of the inkjet printhead chip may employ semiconductor packaging techniques. In the existing chip structure of the ink-jet printing head, an ink-jet opening is easy to collapse, the manufacturing difficulty is high, the yield is low, the manufacturing cost is high, and the product precision is not ideal.
Disclosure of Invention
In order to solve the technical problems, the invention aims to provide the ink jet printing head chip packaging structure and the manufacturing method thereof, wherein an ink jet opening in the manufactured ink jet printing head chip packaging structure cannot collapse, the opening precision is high, the manufacturing cost of the packaging structure is low, the yield of products is high, and mass production can be realized.
In order to achieve the technical purpose and the technical effect, the invention is realized by the following technical scheme: the chip packaging structure of the ink jet printing head comprises a plurality of chip units formed by cutting, scribing grooves formed by cutting are formed between two adjacent chip units, each chip unit comprises a substrate, a first layer of polymer film and a second layer of polymer film, the substrate is provided with a front surface and a back surface, through holes are formed in the substrate, a metal circuit is arranged on the front surface of the substrate, the first layer of polymer film is pressed on the front surface of the substrate, the second layer of polymer film is pressed on the first layer of polymer film, a first opening corresponding to the position of the through holes of the substrate is formed in the first layer of polymer film, a second opening corresponding to the position of the first opening of the first layer of polymer film is formed in the second layer of polymer film, the first opening of the first layer of polymer film forms a first layer of opening pattern structure on the substrate, the second opening of the second layer of polymer film forms a second layer of opening pattern structure on the substrate, and the through holes of the substrate, the first opening of the first layer of polymer film and the second opening of the second layer of polymer film are correspondingly conducted to form a fluid channel.
Further, the structures of the first opening and the second opening are holes, grooves or a combination thereof.
Further, the first and second polymer films are both lithographically printable films.
The invention also provides a manufacturing method of the chip packaging structure of the ink-jet printing head, which comprises the following steps:
(1) Preparing a whole substrate comprising a plurality of chip units, wherein the whole substrate is provided with a front surface and a back surface, and the front surface of the whole substrate is provided with a metal circuit;
(2) Forming a layer of surface pattern structure with a plurality of openings on the front surface of the whole substrate, preparing metal columns in the openings of the surface pattern structure, and removing the surface pattern structure of the whole substrate after the metal columns are formed;
(3) Pressing a first layer of polymer film on the front surface of the integral substrate with the metal column, exposing the metal column through exposure and development processes, and forming a first layer of opening pattern structure with a first opening on the first layer of polymer film;
(4) Coating a layer of photoresist on the front surface of the whole substrate treated in the step (3), and etching a required through hole on the whole substrate through exposure, development and etching processes, wherein the through hole is correspondingly conducted with a first opening of a first layer of polymer film;
(5) Pressing a second layer of polymer film on the first layer of polymer film on the whole substrate processed in the step (4), supporting the second layer of polymer film by a metal column, forming a second layer of opening pattern structure with a second opening on the second layer of polymer film through exposure and development processes, and exposing the metal column again after the second layer of opening pattern structure is formed;
(6) Removing the metal columns on the whole substrate through an etching process to enable the through holes on the whole substrate, the first openings in the first layer of opening pattern structures and the second openings in the second layer of opening pattern structures to be conducted so as to form fluid channels;
(7) Cutting the whole substrate processed in the step (6) to form a single substrate and a single chip unit containing the single substrate.
Further, the etching process in step (4) is a dry etching process.
Further, the etching process in step (6) is a wet etching process.
Further, the first layer of polymer film is pressed by adopting a vacuum film pressing mode.
Further, the first layer of polymer film is pressed by adopting a roller film pasting mode.
Further, in step (2), metal posts are prepared on the surface corresponding to the scribe line positions of the whole substrate.
Further, a substrate is arranged at the bottom of the metal column.
The beneficial effects of the invention are as follows: the manufacturing method of the chip packaging structure of the ink jet printing head comprises the steps of firstly arranging a metal column on a substrate before laminating a first layer of polymer film and a second layer of polymer film, then gradually laminating the first layer of polymer film and the second layer of polymer film, forming a first layer of opening pattern structure and a second layer of opening pattern structure through an exposure and development process, forming a through hole structure of the substrate through exposure, development and etching processes, and finally removing the metal column through the etching process to realize the conduction of the first opening of the first layer of polymer film, the second opening of the second layer of polymer film and the through hole of the substrate so as to form a fluid channel. According to the invention, the metal column is manufactured on the substrate, so that the metal column can form a support when the second layer of polymer film is pressed, the second layer of polymer film is prevented from collapsing or breaking, the manufacturing process is easier, and the manufacturing efficiency and the yield are improved. In the packaging structure of the ink-jet printing head chip manufactured by the invention, the first layer of polymer film and the second layer of polymer film are mutually supported and matched, the first layer of opening pattern structure of the first layer of polymer film, the second layer of opening pattern structure of the second layer of polymer film and the through hole structure of the substrate are mutually matched to form the fluid channel of the ink-jet printing head chip, the ink-jet opening of the fluid channel cannot collapse, and the ink-jet precision is high. The chip packaging structure of the ink jet printing head has low manufacturing cost and high product yield, and can realize mass production.
Drawings
FIG. 1 is a schematic diagram of an ink jet printhead chip package structure of the present invention.
Fig. 2 is a schematic structural diagram of a metal pillar fabricated on a whole substrate after step (2) in the method for fabricating a chip package structure of an inkjet printhead according to the present invention.
Fig. 3 is a schematic structural diagram of a monolithic substrate laminated with a first polymer film after step (3) in the method for manufacturing an inkjet printhead chip package structure according to the present invention.
Fig. 4 is a schematic structural diagram of a whole substrate etched with a through hole after step (4) in the method for manufacturing an inkjet printhead chip package structure of the present invention.
Fig. 5 is a schematic structural diagram of a monolithic substrate laminated with a second polymer film after step (5) in the method for manufacturing an inkjet printhead chip package structure according to the present invention.
Fig. 6 is a schematic structural diagram of a whole substrate with metal pillars removed after step (6) in the method for manufacturing an inkjet printhead chip package structure of the present invention.
Detailed Description
The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings so that the advantages and features of the present invention can be more easily understood by those skilled in the art, thereby making clear and defining the scope of the present invention.
As shown in fig. 1, an inkjet printhead chip package structure includes a plurality of chip units formed by dicing, and dicing grooves 16 formed by dicing are provided between two adjacent chip units, each chip unit including a substrate 11, a first polymer film 13 and a second polymer film 14, the first polymer film 13 and the second polymer film 14 being lithographically printable films. The substrate 11 has a front surface and a back surface, the substrate 11 is provided with a through hole 15, the front surface of the substrate 11 is provided with a metal circuit 12, the first polymer film 13 is pressed on the front surface of the substrate 11, the second polymer film 14 is pressed on the first polymer film 13, the first polymer film 13 is provided with a first opening corresponding to the position of the through hole of the substrate 11, the second polymer film 14 is provided with a second opening corresponding to the position of the first opening of the first polymer film 13, the first opening of the first polymer film 13 forms a first layer opening pattern structure on the substrate 11, the second opening of the second polymer film 14 forms a second layer opening pattern structure on the substrate 11, and the through hole 15 of the substrate 11, the first opening of the first polymer film 13 and the second opening of the second polymer film 14 are correspondingly conducted to form a fluid channel.
Further, the structures of the first opening and the second opening are holes, grooves or a combination thereof.
The invention also provides a manufacturing method of the chip packaging structure of the ink-jet printing head, which comprises the following steps:
(1) Preparing a whole substrate 1 comprising a plurality of chip units, wherein the whole substrate 1 is provided with a front surface and a back surface, and the front surface of the whole substrate 1 is provided with a metal circuit 12;
(2) As shown in fig. 2, a surface pattern structure having a plurality of openings is formed on the front surface of the above monolithic substrate 1; specifically, the surface pattern structure may be formed by coating photoresist on the whole substrate and performing photolithography; the layout of the openings in the surface pattern structure is the same as that of the openings on the second polymer film to be attached, openings are also arranged on the surface pattern structure corresponding to the positions to be cut (cutting channel positions) of the whole substrate, metal columns 17 with certain height are prepared in the openings of the surface pattern structure, metal columns are also prepared on the surfaces corresponding to the cutting positions of the whole substrate, meanwhile, a substrate is arranged at the bottom of the metal columns 17, and after the metal columns 17 are formed, the surface pattern structure of the whole substrate 1 is removed; in each chip unit, the part of the whole substrate between two adjacent metal columns is a part needing to be provided with a through hole;
(3) As shown in fig. 3, a first layer of polymer film 13 is pressed on the front surface of the whole substrate 1 with the metal posts 17 by adopting a vacuum film pressing mode, the metal posts 17 are exposed through an exposure and development process according to the required opening layout of the first layer of opening pattern structure on the first layer of polymer film 13, and a first layer of opening pattern structure with first openings 131 is formed on the first layer of polymer film 13, wherein the first openings 131 are holes, grooves or a combination thereof;
(4) As shown in fig. 4, a layer of photoresist is coated on the front surface of the whole substrate 1 processed in the step (3), the position of the whole substrate, which needs to be provided with a through hole, is exposed through exposure and development processes, and then the required through hole 15 is etched on the whole substrate 1 through a dry etching process, wherein the through hole 15 is correspondingly conducted with the first opening of the first layer of polymer film 13;
(5) As shown in fig. 5, a roller film pasting mode is adopted to press a second layer of polymer film 14 on the first layer of polymer film 13 on the whole substrate 1 processed in the step (4), the height of the metal column 17 is slightly higher than that of the first layer of polymer film 13, the metal column 17 can support the second layer of polymer film 14, a second layer of opening pattern structure with a second opening 141 is formed on the second layer of polymer film 14 through an exposure and development process, after the second layer of opening pattern structure is formed, the metal column 17 is exposed again, and the structure of the second opening 141 is a hole, a groove or a combination thereof;
(6) As shown in fig. 6, the metal pillars 17 on the whole substrate 1 are removed by a wet etching process (specifically, etching with an acidic liquid), the substrate can protect the whole substrate and the metal circuit from corrosion, and after the metal pillars 17 are removed, the through holes 15 on the whole substrate, the first openings 131 in the first layer of opening pattern structure and the second openings 141 in the second layer of opening pattern structure are conducted to form fluid channels;
(7) As shown in fig. 1, the whole substrate 1 processed in step (6) is cut along dicing streets on the whole substrate to form individual substrates 11 and individual chip units including the individual substrates 11.
Compared with the prior art, the manufacturing method of the chip packaging structure of the ink jet printing head comprises the steps of firstly arranging metal columns on a substrate before laminating a first layer of polymer film 13 and a second layer of polymer film 14, then gradually laminating the first layer of polymer film 13 and the second layer of polymer film 14, forming a first layer of opening pattern structure and a second layer of opening pattern structure through an exposure and development process, forming a through hole structure of the substrate through exposure, development and etching process, and finally removing the metal columns through the etching process to realize the conduction of the first opening of the first layer of polymer film, the second opening of the second layer of polymer film and the through hole of the substrate so as to form a fluid channel. According to the invention, the metal column is manufactured on the substrate, so that the metal column can form a support when the second layer of polymer film is pressed, the second layer of polymer film is prevented from collapsing or breaking, the manufacturing process is easier, and the manufacturing efficiency and the product yield are improved. In the packaging structure of the ink-jet printing head chip manufactured by the invention, the first layer of polymer film and the second layer of polymer film are mutually supported and matched, the first layer of opening pattern structure of the first layer of polymer film, the second layer of opening pattern structure of the second layer of polymer film and the through hole structure of the substrate are mutually matched to form the fluid channel of the ink-jet printing head chip, the ink-jet opening of the fluid channel cannot collapse, and the ink-jet precision is high. The ink jet printing head chip has low manufacturing cost and high product yield, and can realize mass production.
The foregoing description is only illustrative of the present invention and is not intended to limit the scope of the invention, and all equivalent structures or equivalent processes or direct or indirect application in other related technical fields are included in the scope of the present invention.
Claims (9)
1. A manufacturing method of an ink jet printing head chip packaging structure is characterized by comprising the following steps: the chip packaging structure of the ink-jet printing head comprises a plurality of chip units formed by cutting, wherein a scribing groove formed by cutting is formed between every two adjacent chip units, each chip unit comprises a substrate, a first layer of polymer film and a second layer of polymer film, the substrate is provided with a front surface and a back surface, through holes are formed in the substrate, a metal circuit is arranged on the front surface of the substrate, the first layer of polymer film is pressed on the front surface of the substrate, the second layer of polymer film is pressed on the first layer of polymer film, a first opening corresponding to the position of the through holes of the substrate is formed in the first layer of polymer film, a second opening corresponding to the position of the first opening of the first layer of polymer film is formed in the second layer of polymer film, the first opening of the first layer of polymer film forms a first layer of opening pattern structure on the substrate, the second opening of the second layer of polymer film forms a second layer of opening pattern structure on the substrate, and the through holes of the substrate, the first opening of the first layer of polymer film and the second opening of the second layer of polymer film are correspondingly conducted to form a fluid channel;
The manufacturing method of the ink jet printing head chip packaging structure comprises the following steps:
(1) Preparing a whole substrate comprising a plurality of chip units, wherein the whole substrate is provided with a front surface and a back surface, and the front surface of the whole substrate is provided with a metal circuit;
(2) Forming a layer of surface pattern structure with a plurality of openings on the front surface of the whole substrate, preparing metal columns in the openings of the surface pattern structure, and removing the surface pattern structure of the whole substrate after the metal columns are formed;
(3) Pressing a first layer of polymer film on the front surface of the integral substrate with the metal column, exposing the metal column through exposure and development processes, and forming a first layer of opening pattern structure with a first opening on the first layer of polymer film;
(4) Coating a layer of photoresist on the front surface of the whole substrate treated in the step (3), and etching a required through hole on the whole substrate through exposure, development and etching processes, wherein the through hole is correspondingly conducted with a first opening of a first layer of polymer film;
(5) Pressing a second layer of polymer film on the first layer of polymer film on the whole substrate processed in the step (4), wherein the height of the metal column is slightly higher than that of the first layer of polymer film, the metal column can support the second layer of polymer film, a second layer of opening pattern structure with a second opening is formed on the second layer of polymer film through exposure and development processes, and the metal column is exposed again after the second layer of opening pattern structure is formed;
(6) Removing the metal columns on the whole substrate through an etching process to enable the through holes on the whole substrate, the first openings in the first layer of opening pattern structures and the second openings in the second layer of opening pattern structures to be conducted so as to form fluid channels;
(7) Cutting the whole substrate processed in the step (6) to form a single substrate and a single chip unit containing the single substrate.
2. The method for manufacturing the inkjet printhead chip package structure according to claim 1, wherein: the structures of the first opening and the second opening are holes, grooves or a combination thereof.
3. The method for manufacturing the inkjet printhead chip package structure according to claim 1, wherein: the first and second polymer films are both lithographically printable films.
4. The method for manufacturing the inkjet printhead chip package structure according to claim 1, wherein: the etching process in step (4) is a dry etching process.
5. The method for manufacturing the inkjet printhead chip package structure according to claim 1, wherein: the etching process in step (6) is a wet etching process.
6. The method for manufacturing the inkjet printhead chip package structure according to claim 1, wherein: and laminating the first layer of polymer film by adopting a vacuum film laminating mode.
7. The method for manufacturing the inkjet printhead chip package structure according to claim 1, wherein: and laminating the second layer of polymer film by adopting a roller film laminating mode.
8. The method for manufacturing the inkjet printhead chip package structure according to claim 1, wherein: in step (2), metal posts are prepared on the surface corresponding to the scribe line positions of the whole substrate.
9. The method for manufacturing the inkjet printhead chip package structure according to claim 1, wherein: a substrate is also arranged at the bottom of the metal column.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910609526.2A CN110239218B (en) | 2019-07-08 | 2019-07-08 | Chip packaging structure of ink-jet printing head and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910609526.2A CN110239218B (en) | 2019-07-08 | 2019-07-08 | Chip packaging structure of ink-jet printing head and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN110239218A CN110239218A (en) | 2019-09-17 |
| CN110239218B true CN110239218B (en) | 2024-08-16 |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1408552A (en) * | 2001-09-29 | 2003-04-09 | 飞赫科技股份有限公司 | Reverse Development Method of Thermal Bubble Jet Printing Head and Its Nozzle Plate |
| CN210617608U (en) * | 2019-07-08 | 2020-05-26 | 华天科技（昆山）电子有限公司 | An inkjet print head chip packaging structure |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11348288A (en) * | 1998-06-03 | 1999-12-21 | Canon Inc | Substrate for inkjet head and inkjet head |
| JP3743883B2 (en) * | 2000-11-28 | 2006-02-08 | カシオ計算機株式会社 | Inkjet printer head forming method |
| US6942320B2 (en) * | 2002-01-24 | 2005-09-13 | Industrial Technology Research Institute | Integrated micro-droplet generator |
| US7293359B2 (en) * | 2004-04-29 | 2007-11-13 | Hewlett-Packard Development Company, L.P. | Method for manufacturing a fluid ejection device |
| KR20080060003A (en) * | 2006-12-26 | 2008-07-01 | 삼성전자주식회사 | Manufacturing method of inkjet print head |
| JP5328542B2 (en) * | 2009-07-27 | 2013-10-30 | キヤノン株式会社 | Recording element substrate, ink jet head, and manufacturing method thereof |
| JP2012210757A (en) * | 2011-03-31 | 2012-11-01 | Brother Industries Ltd | Ink discharge head, and method for manufacturing inkjet head |
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2019
- 2019-07-08 CN CN201910609526.2A patent/CN110239218B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1408552A (en) * | 2001-09-29 | 2003-04-09 | 飞赫科技股份有限公司 | Reverse Development Method of Thermal Bubble Jet Printing Head and Its Nozzle Plate |
| CN210617608U (en) * | 2019-07-08 | 2020-05-26 | 华天科技（昆山）电子有限公司 | An inkjet print head chip packaging structure |
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| CN110239218A (en) | 2019-09-17 |
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