CN110277720A - A kind of package assembling, laser assembly, laser light source and laser projection device - Google Patents
A kind of package assembling, laser assembly, laser light source and laser projection device Download PDFInfo
- Publication number
- CN110277720A CN110277720A CN201810219402.9A CN201810219402A CN110277720A CN 110277720 A CN110277720 A CN 110277720A CN 201810219402 A CN201810219402 A CN 201810219402A CN 110277720 A CN110277720 A CN 110277720A
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- laser
- groove
- laser array
- sealing ring
- light
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- 238000007789 sealing Methods 0.000 claims abstract description 132
- 230000003287 optical effect Effects 0.000 claims abstract description 18
- 229910000679 solder Inorganic materials 0.000 claims description 9
- 238000009413 insulation Methods 0.000 claims description 7
- 125000006850 spacer group Chemical group 0.000 claims description 7
- 238000003384 imaging method Methods 0.000 claims description 3
- 230000017525 heat dissipation Effects 0.000 claims 1
- 238000003466 welding Methods 0.000 claims 1
- 238000009434 installation Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000007514 turning Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2013—Plural light sources
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
- G03B21/00—Projectors or projection-type viewers; Accessories therefor
- G03B21/14—Details
- G03B21/20—Lamp housings
- G03B21/2006—Lamp housings characterised by the light source
- G03B21/2033—LED or laser light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/023—Mount members, e.g. sub-mount members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0233—Mounting configuration of laser chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0235—Method for mounting laser chips
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Semiconductor Lasers (AREA)
Abstract
The present invention discloses a kind of package assembling, laser assembly, laser light source and laser projection device, is related to projection device technical field.For solving the problems, such as how to realize small size or out optical path sealing of the light end end surface side between the laser array and main casing of out-of-flatness.Package assembling of the invention includes fixed bracket and the first sealing ring, fixed bracket includes the first end and second end being oppositely arranged, open up fluted on support bracket fastened first end end face, fixed bracket further includes light admission port, the bottom surface of light admission port through-going recess and support bracket fastened second end end face；Groove makes the light-emitting surface of laser array towards light admission port for accommodating simultaneously fixed laser array, and support bracket fastened second end is used to fix with the main casing of laser light source；First sealing ring is used for the side wall one week gap between the inner wall of groove of sealed laser array.Package assembling of the invention is used for encapsulated laser array.
Description
Technical field
The present invention relates to projection device technical field more particularly to a kind of package assembling, laser assembly, laser light source and
Laser projection device.
Background technique
Currently, the junction in laser light source between each optical path component (especially between laser array and main casing)
To optical path sealing it is more demanding, if optical path sealing it is bad, the impurity such as water, dust in external environment be easy by joint gap into
The transmission path for entering to change in optical path inside laser light source internal optical path, reduces the intensity of light.
In the prior art, sealing ring is generallyd use between laser array and main casing carries out optical path sealing.But in order to
Meet user and design requirement is minimized to the volume of laser array, the design volume of laser array is smaller and smaller, laser
The space for going out on the end face of light end to can be used in installing sealing ring of array is also smaller and smaller, and the light end end out of laser array
The edge in face may be equipped with protrusion or groove with specific function, prevent sealing ring is from going out light end in laser array
End face is installed, so that laser array and main casing cannot be tightly connected using sealing ring, and then can not achieve laser
Optical path sealing between array and main casing.
Summary of the invention
The present invention provides a kind of package assembling, laser assembly, laser light source and laser projection device, for solve how
The problem of optical path of realization small size or out light end end surface side between the laser array and main casing of out-of-flatness seals.
In order to achieve the above objectives, the present invention adopts the following technical scheme:
In a first aspect, the present invention provides a kind of package assembling, it to be used for encapsulated laser array, including fixed bracket, the
One sealing ring, the fixed bracket include the first end and second end being oppositely arranged, on the support bracket fastened first end end face
Open up fluted, the fixed bracket further includes light admission port, bottom surface and the fixed branch of the light admission port through the groove
The second end end face of frame；The groove makes the laser array for accommodating and fixing the laser array
Towards the light admission port, the support bracket fastened second end is used to fix with the main casing of laser light source light-emitting surface；Described first
Sealing ring is used to seal the side wall one week gap between the inner wall of the groove of the laser array.
Second aspect, the present invention provides a kind of laser assembly, including package assembling, laser array, the encapsulation
Component is package assembling described in technical solution as above；The laser array is accommodated and is fixed in the package assembling fixed
In groove on bracket, and the light-emitting surface of the laser array, towards the light admission port, first in the package assembling is close
Seal is sealed in the side wall one week gap between the groove inner wall of the laser array.
The third aspect, it is described the present invention provides a kind of laser light source, including laser assembly, main casing and sealing element
Laser assembly is laser assembly described in technical solution as above；The main casing is connected in the laser assembly fixed
The second end of bracket, the main casing is for sealing optical path component, and the main casing is equipped with light inlet, the light inlet with
Light admission port on the fixed bracket is opposite；The sealing element is used to seal the main casing edge at the light inlet one week
With the gap between the support bracket fastened second end end face.
Fourth aspect, the present invention provides a kind of laser projection devices, including sequentially connected laser light source, ray machine and mirror
Head；The laser light source is laser light source described in technical solution as above；The ray machine is for receiving the laser light source outgoing
Light beam and be emitted to the camera lens after being modulated；The camera lens is used to receive the modulation light beam of the ray machine outgoing and carries out
Projection imaging.
A kind of package assembling, laser assembly, laser light source and laser projection device provided by the invention, by laser
It, can be specific to seal by package assembling encapsulated laser array to form laser assembly before array is connected on main casing
Dress process are as follows: the first sealing ring is socketed on side wall one week of laser array, the laser of the first sealing ring then will be carried
Array, which is installed on, to be fixed in package assembling in the groove on bracket, and makes the light-emitting surface of laser array towards light admission port, together
When make the first sealing ring be sealed in the side wall one week gap between groove inner wall of laser array.By this laser group
When part is installed in laser light source, it can be connect by support bracket fastened second end with main casing, and in support bracket fastened second end
Sealing element is set between end face and the outer wall of main casing, and stimulated light device array does not go out light to support bracket fastened second end end face size
Hold the limitation of end face size and flatness, therefore can be made to larger and flatness higher for support bracket fastened second end end face,
In order to install this sealing element, so as to realize small size or out laser array and main casing of the light end end surface side along out-of-flatness
Optical path sealing between body.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the installation diagram of laser assembly of the embodiment of the present invention；
Fig. 2 is the explosive view of laser assembly of the embodiment of the present invention；
Fig. 3 is the installation diagram of package assembling of the embodiment of the present invention and laser array；
Fig. 4 is the structural schematic diagram of laser light source of the embodiment of the present invention；
Fig. 5 is laser array in laser assembly of the embodiment of the present invention and the cross-sectional view after the assembly of the first sealing ring；
Fig. 6 is laser array in laser assembly of the embodiment of the present invention and the perspective view after the assembly of the first sealing ring；
Fig. 7 is the perspective view of laser array in laser assembly of the embodiment of the present invention；
Fig. 8 is the left view of laser array in laser assembly of the embodiment of the present invention；
Fig. 9 is the perspective view of the first sealing ring in package assembling of the embodiment of the present invention；
Figure 10 is the main view of the first sealing ring in package assembling of the embodiment of the present invention；
Figure 11 is cross section structure schematic diagram of the first sealing ring shown in Figure 10 along A-A；
Figure 12 is cross section structure schematic diagram of the first sealing ring shown in Figure 10 along B-B；
Figure 13 is support bracket fastened main view in package assembling of the embodiment of the present invention；
Figure 14 is support bracket fastened left view shown in Figure 13；
Figure 15 is to fix cross section structure schematic diagram of the bracket along C-C shown in Figure 13.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " center ", "upper", "lower", "front", "rear", " left side ",
The orientation or positional relationship of the instructions such as " right side ", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on the figure
Orientation or positional relationship is merely for convenience of description of the present invention and simplification of the description, rather than the device of indication or suggestion meaning or
Element must have a particular orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.?
In description of the invention, unless otherwise indicated, the meaning of " plurality " is two or more.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected；It can
To be mechanical connection；It can be directly connected, the company inside two elements can also be can be indirectly connected through an intermediary
It is logical.For the ordinary skill in the art, the concrete meaning of above-mentioned term in the present invention can be understood with concrete condition.
Referring to Fig. 3, Fig. 3 is a kind of embodiment of package assembling of the embodiment of the present invention, and the package assembling of the present embodiment is used for
Encapsulated laser array 1, package assembling include fixed bracket 2, the first sealing ring 3, and fixed bracket 2 includes first be oppositely arranged
A and second end B is held, fluted 20 are opened up on the first end end face of the fixation bracket 2, fixed bracket 2 further includes light admission port 21, should
The second end end face of the bottom surface of 21 through-going recess 20 of light admission port and fixed bracket 2, groove 20 is for accommodating simultaneously fixed laser battle array
Column 1, while making the light-emitting surface of laser array 1 towards light admission port 21, the second end B of fixed bracket 2 is used for and laser light source
Main casing fix；First sealing ring 3 for side wall one week of sealed laser array 1 between the inner wall of groove 20 between
Gap.
A kind of package assembling provided by the invention can pass through encapsulation before laser array 1 is connected on main casing
Component package laser array 1 is to form laser assembly, specific encapsulation process are as follows: as shown in figure 5, by the first sealing ring 3
The side wall of laser array 1 is socketed on one week, as shown in figure 3, then installing the laser array 1 for carrying the first sealing ring 3
It is fixed in package assembling in the groove 20 on bracket 2, and makes the light-emitting surface of laser array 1 towards light admission port 21, simultaneously
So that the first sealing ring 3 is sealed in the side wall one week gap between the inner wall of groove 20 of laser array 1.By this laser
When device assembly is installed in laser light source, as shown in figure 4, can be connect by the second end B of fixed bracket 2 with main casing 4, and
Sealing element 5, the second end end face size of fixed bracket 2 are set between the second end end face of fixed bracket 2 and the outer wall of main casing 4
The not limitation for going out light end end face size and flatness of stimulated light device array 1, therefore the second end end face of fixed bracket 2 can make
Make larger and flatness be higher, in order to install this sealing element 5, so as to realize small size or out light end end surface side along not
Optical path sealing between smooth laser array 1 and main casing 4.
In the above-described embodiments, fixed bracket 2 can be plate structure, or block structure can also be other
The structure of shape, is not specifically limited herein.
In embodiments of the present invention, it should be noted that between laser array 1, the first sealing ring 3 and fixed bracket 2
Assembling process are as follows: as shown in Figure 5 and Figure 6, the first sealing ring 3 is socketed on the side wall of laser array 1 first, such as Fig. 3
It is shown, it then will be in the installation to groove 20 of laser array 1 that carry the first sealing ring 3.
In order to simplify installation operation of first sealing ring 3 in groove 20, it is preferred that as shown in figure 15, along groove 20
The area of section of depth direction, groove 20 is gradually reduced.In this way, groove 20 forms flaring structure, convenient for the first sealing ring 3 with sharp
Light device array 1 is protruded into together in groove 20.
In the above-described embodiments, in order to enable the area of section of groove 20 to be gradually reduced along its depth direction, optionally,
As shown in figure 15, the medial surface of groove 20 is from one end close to 20 bottom surface of groove to one end being open close to groove 20 to separate
The inclined inclined-plane in central axes direction of groove 20, the inclination angle alpha on the inclined-plane can be 1 °, 2 ° or 3 ° etc., not do herein
It is specific to limit, it is preferred that the inclination angle alpha on the inclined-plane is 2 °~3 °.
Referring to Fig. 1 and Fig. 2, Fig. 1 and Fig. 2 is a kind of embodiment of laser assembly of the embodiment of the present invention, the present embodiment
Laser assembly includes package assembling, laser array 1, and package assembling is package assembling described in any technical solution as above；
As shown in figure 3, laser array 1 is accommodated and is fixed in package assembling in the groove 20 fixed on bracket 2, and laser array
1 light-emitting surface towards light admission port 21, the first sealing ring 3 in package assembling be sealed in the side wall one week of laser array 1 with it is recessed
In gap between the inner wall of slot 20.
A kind of laser assembly provided by the invention, since laser assembly includes package assembling, laser array 1, such as
Shown in Fig. 3, laser array 1 is accommodated and is fixed in package assembling in the groove 20 fixed on bracket 2, and laser array 1
Light-emitting surface towards light admission port 21, the first sealing ring 3 in package assembling is sealed in the side wall one week and groove of laser array 1
In gap between 20 inner wall, laser array 1 is encapsulated from there through package assembling, is installed on by this laser assembly
When in laser light source, as shown in figure 4, can be connect by the second end B of fixed bracket 2 with main casing 4, and in fixed bracket 2
Sealing element 5 is set between second end end face and the outer wall of main casing 4, the second end end face size of fixed bracket 2 not stimulated light device
The limitation for going out light end end face size and flatness of array 1, thus the second end end face of fixed bracket 2 can be made to it is larger and
Flatness is higher, in order to install this sealing element 5, so as to realize small size or out laser of the light end end surface side along out-of-flatness
Optical path sealing between device array 1 and main casing 4.
In the above-described embodiments, laser array 1 be small size laser array or out light end end surface side along out-of-flatness
Laser array.
In embodiments of the present invention, it should be noted that the dress between laser 1, the first sealing ring 3 and package support 2
With process are as follows: the first sealing ring 3 is socketed on the side wall of laser 1 first, as shown in Figure 5 and Figure 6, then will carry first
In the installation to groove of laser 1 of sealing ring 3, as shown in Figure 3.
In order to fix the first sealing during the first sealing ring 3 is installed with laser array 1 to groove 20
Relative position between circle 3 and laser array 1, prevents the first sealing ring 3 from producing because of the frictional force of the inner wall by groove 20
Raw dislocation, it is preferred that as shown in figure 8, offering limiting slot 11 on the side wall of laser array 1, the first sealing ring 3 is close to laser
The one end fits of device array 1 are embedded in limiting slot 11.In this way, defining the first sealing ring 3 and laser by limiting slot 11
Relative position between array 1, avoid the first sealing ring 3 generated when installing with laser array 1 to groove 20 it is wrong
Position.
Wherein, limiting slot 11 also can may include setting for around the annular groove of setting in side wall one week of laser array 1
The straight-line groove being placed on one or more side walls of laser array 1, is not specifically limited herein.Exemplary, limiting slot 11 wraps
The straight-line groove being set in the two lateral walls of laser array 1 is included, the both ends of the straight-line groove extend through laser array 1
In addition two sidewalls.
In addition, being not specifically limited to the width of limiting slot 11, can specifically be carried out according to the thickness of the first sealing ring 3 true
It is fixed.Exemplary, the width of limiting slot 11 can be 0.7mm~1.5mm, and the present embodiment is preferably 1mm.
In order to during the first sealing ring 3 is installed with laser array 1 to groove 20, simplify the first sealing
The installation operation of circle 3, it is preferred that as shown in fig. 6, surface and the first sealing on the first sealing ring 3 close to the bottom surface of groove 20
Scarf 31 is arranged in corner on circle 3 between the surface of the side of groove 20, passes through the scarf 31 bootable first
Sealing ring 3 is installed with laser array 1 to groove 20, to make installation operation of first sealing ring 3 in groove 20
It is more convenient.
Wherein, as shown in figure 11, the folder on scarf 31 and the first sealing ring 3 between the surface of the bottom surface of groove 20
Angle θ can be 120 °, 130 °, 140 ° etc., be not specifically limited herein.Preferably, it is leaned on scarf 31 and the first sealing ring 3
Angle theta between the surface of the bottom surface of nearly groove 20 is 120 °~140 °, at this point, scarf 31 can play preferably guiding effect
Fruit.
In addition, scarf 31 can be one, scarf 31 is set on the first sealing ring 3 close to the one of 20 side of groove
Corner on a surface and the first sealing ring 3 between the surface of the bottom surface of groove 20, or multiple, multiple bevelings
Face 31 is respectively arranged on the first sealing ring 3 on multiple surfaces of the side of groove 20 and the first sealing ring 3 close to groove
Corner between the surface of 20 bottom surface, is not specifically limited herein.Exemplary, as shown in figures 9 and 11, scarf 31 is
Two, two scarves 31 are respectively arranged at two opposite surfaces and first on the first sealing ring 3 close to 20 side wall of groove
Corner on sealing ring 3 between the surface of the bottom surface of groove 20.
It is pressed into groove 20 for the ease of the first sealing ring 3 with laser array 1, it is preferred that as shown in figure 13, Gu
Escape groove 22 is offered on the first end end face of fixed rack 2, which is arranged close to groove 20 and is connected to groove 20.This
Sample, redundance energy during the first sealing ring is pressed into groove 20 with laser array, on the first sealing ring
It is enough squeezed into so far escape groove 22, to prevent from generating interference between the first sealing ring and the inner wall of groove 20, consequently facilitating the
One sealing ring is pressed into groove 20 with laser array.
Wherein, it is preferred that the quantity of escape groove 22 is four, four turnings of four escape groove 22 respectively close to groove 20
Setting can will be on the first sealing ring in this way, during the first sealing ring is pressed into groove 20 with laser array
Redundance is uniformly squeezed into four escape groove 22, to prevent from producing between the first sealing ring and the inner wall of groove 20 as much as possible
Raw interference, is pressed into groove 20 convenient for the first sealing ring with laser array.
In order to further during the first sealing ring 3 is installed with laser array 1 to groove 20, limit first
Relative position between sealing ring 3 and laser array 1, it is preferred that as shown in Figure 7 and Figure 8, laser array 1 includes support
Plate 12 and the laser array main body 13 being set in support plate 12, as shown in figure 3, support plate 12 is supported in fixed bracket 2
First end end face on, and support plate 12 is fixedly connected with fixed bracket 2, and laser array main body 13 is located in groove 20, the
One sealing ring 3 is set to side wall one week of laser array main body 13 between the inner wall of groove 20, and such as Fig. 9, Figure 10 and figure
Shown in 12, the first sealing ring 3 is connected with support arm 32 close to one end of support plate 12, as shown in Figure 5 and Figure 6, support arm 32 to
Extend close to the direction of support plate 12 and is abutted with support plate 12.In this way, pacifying in the first sealing ring 3 with laser array 1
During being filled to groove 20, support arm 32 can apply certain support force to the first sealing ring 3, to avoid the first sealing ring
3 generate dislocation or deformation because of the frictional force of the inner wall by groove 20.
Wherein, the quantity of support arm 32 can be one, two, three etc., be not specifically limited herein.But it is
Effective support the first sealing ring 3, while in order to reduce the structure complexity of laser assembly, it is preferred that such as Fig. 9 and Figure 12 institute
Show, the quantity of support arm 32 is two, and two support arms 32 are connected on the opposite both sides of the first sealing ring 3.In this way, logical
It crosses two support arms 32 and effectively supports the first sealing ring 3, while compared to the support arm 32 for being arranged three and three or more
Scheme, when the setting quantity of support arm 32 is two, the structure complexity of laser assembly is smaller.
In addition, the width of support arm 32 can be 2mm, 3mm, 4mm etc., it is not specifically limited herein.
Furthermore in order to limit installation site of the laser array 1 on fixed bracket 2, guarantees laser array 1 and fix
Assembly precision between bracket 2, it is preferred that as shown in figure 13, the first end end face of fixed bracket 2 is equipped with the first limited post
23, as shown in fig. 7, support plate 12 is equipped with the first limit hole 14, as shown in figure 3, when the laser for being arranged with the first sealing ring 3
When array body 13 is protruded into groove 20,14 engagement sleeves of the first limit hole are set to outside the first limited post 23, to accurately define laser
1 installation site of device array guarantees the assembly precision between laser array 1 and fixed bracket 2.
Further, in order to make during the first sealing ring 3 is installed with laser array 1 to groove 20
It is more easily compressed to be bonded with the inner wall of groove 20, preferably first one end of sealing ring 3 far from laser array main body 13
, as shown in figure 5, defining the side of support arm 32 is set for reference edge, then far from laser on support arm 32 on first sealing ring 3
One end of array body 13 is located at one end on reference edge far from laser array main body 13 close to laser array main body 13
Side, in this way, only first is close during the first sealing ring 3 is installed with laser array main body 13 to groove 20
The inner wall of the one end of seal 3 far from laser array main body 13 and groove 20 generates extruding, it is smaller to squeeze contact surface, it is easier to quilt
It compresses and is bonded with the inner wall of groove 20.
In the above-described embodiments, as shown in figure 12, to one end end face of laser array main body 13 separate on support arm 32
The distance between one end end face of laser array main body 13 separate on reference edge d is not specifically limited.It is exemplary, the distance
D can be 0.2mm~0.6mm, and the present embodiment is preferably 0.4mm.
In order to provide power supply to the laser array 1 in groove 20 or transmit signal to laser array 1, optionally, swash
Light device assembly can be made as structure shown in Fig. 1 and Fig. 2, that is, the side wall of laser array 1 is equipped with solder terminal 15, groove
The position that solder terminal 15 is corresponded on 20 side wall offers evacuation notch 26, when laser array 1 is installed in groove 20,
Solder terminal 15 protrudes into evacuation notch 26, as shown in Fig. 2, the corresponding position for avoiding notch 26 on the outer surface of the side wall of groove 20
It sets and is connected with circuit board 6, the position that solder terminal 15 is corresponded on circuit board 6 offers through-hole 61, and solder terminal 15 passes through through-hole
61 stretch out the surface of side wall of the circuit board 6 far from groove 20, and are welded on the surface of side wall of the circuit board 6 far from groove 20.
In this way, can be powered by circuit board 6 to laser array 1 or transmit signal to laser array 1.
In the above-described embodiments, in order to avoid generating electromagnetic interference between circuit board 6 and the side wall of groove, it is preferred that such as
It further include insulation spacer 7 shown in shown in Fig. 1 and Fig. 2, insulation spacer pad 7 is set between circuit board 6 and the side wall of groove.In this way,
The side wall of circuit board 6 and groove is obstructed by insulation spacer 7, it is therefore prevented that generate electromagnetism between circuit board 6 and the side wall of groove
Interference.
Wherein, insulation spacer 7 can be fixed on by clamping force between circuit board 6 and the side wall of groove circuit board 6 with
Between the side wall of groove, the fixation that insulation spacer 7 is realized on the side wall or circuit board 6 of groove can also be connected to by gluing,
It is not specifically limited herein.
As shown in figure 4, the embodiment of the invention also provides a kind of laser light source, including laser assembly, main casing 4 and close
Sealing 5, laser assembly are laser assembly described in any technical solution as above；Main casing 4 is connected in laser assembly
The second end B of fixed bracket 2, main casing 4 is for sealing optical path component, and main casing 4 is equipped with light inlet 41, light inlet 41 with
Light admission port 21 on fixed bracket 2 is opposite；Sealing element 5 is used to seal 4 edge of main casing at light inlet 41 one week and fixed branch
Gap between the second end end face of frame 2.
A kind of laser light source provided in an embodiment of the present invention, since laser light source includes laser assembly, main casing 4 and close
Sealing 5, the laser assembly are laser assembly described in any technical solution as above, and main casing 4 is connected to laser assembly
The second end B of middle fixed bracket 2, main casing 4 is for sealing optical path component, and main casing 4 is equipped with light inlet 41, light inlet 41
Opposite with the light admission port 21 on fixed bracket 2, sealing element 5 is used to seal 4 edge of main casing at light inlet 41 one week and fixes
Gap between the second end end face of bracket 2, in this way, between being sealed between fixed bracket 2 and main casing 4 by sealing element 5
Gap realizes the optical path sealing between laser assembly and main casing 4.
In the above-described embodiments, in order to guarantee the assembly precision between laser assembly and main casing 4, it is preferred that such as Fig. 4
Shown, the second end end face that bracket 2 is fixed in laser assembly is equipped with the second limited post 24, corresponding second limit on main casing 4
The position of position column 24 offers the second limit hole 42, when fixed bracket 2 is close to main casing 4 and is connected on main casing 4, the
The cooperation of two limited posts 24 is protruded into the second limit hole 42, to limit the rigging position of fixed bracket 2, guarantees laser assembly and master
Assembly precision between shell 4.
Wherein, it there are many structure types of sealing element 5, is not specifically limited herein.Optionally, as shown in figure 4, sealing element
5 be the second sealing ring, and the second sealing ring is located between 4 outer wall of second end end face and main casing of fixed bracket 2, and second is close
Seal is arranged for one week around light admission port 21 and light inlet 41.
When sealing element 5 is the second sealing ring, in order to limit the position of sealing element 5, prevents sealing element 5 from misplacing, can adopt
It is realized with following two specific embodiment:
Embodiment one: as shown in figure 4, offering annular seal groove, annular seal groove on the second end end face of fixed bracket 2
It is arranged within one week around light admission port 21, sealing element 5 is embedded in annular seal groove close to the one end fits of fixed bracket 2.In this way,
The relative position between sealing element 5 and fixed bracket 2 is defined by annular seal groove, it is therefore prevented that sealing element 5 misplaces.
Embodiment two: offering annular seal groove on the outer surface of main casing 4, annular seal groove surrounds the one of light inlet 41
Week setting, sealing element 5 are embedded in annular seal groove close to the one end fits of main casing 4.In this way, being limited by annular seal groove
Relative position between sealing element 5 and main casing 4, it is therefore prevented that sealing element 5 misplaces.
In the embodiment shown in fig. 4, excellent in order to effectively disperse the heat that laser array 1 generates in laser assembly
Choosing, the first end A of fixed bracket 2 is connected with heat sink (not shown), and heat sink is covered in laser array 1 far from logical
On the surface of optical port 21, in this way, the heat of the generation of laser array 1 can effectively be dispersed by heat sink.
In the above-described embodiments, in order to guarantee the assembly precision between heat sink and fixed bracket 2, it is preferred that such as Fig. 4 institute
Show, the first end end face of fixed bracket 2 is equipped with third limited post 25, and heat sink is equipped with third limit hole and (does not show in figure
Out), close to fixed bracket 2 when heat sink and when being connected on fixed bracket 2, third limit hole engagement sleeves are set to third limit
On column 25, the installation site of heat sink is thus defined, ensure that the assembly precision between heat sink and fixed bracket 2.
The embodiment of the invention also provides a kind of laser projection devices, including sequentially connected laser light source, ray machine and mirror
Head；Wherein, laser light source is laser light source described in any technical solution as above；Ray machine is used to receive the light of laser light source outgoing
Beam is simultaneously emitted to camera lens after being modulated；Camera lens is used to receive the modulation light beam of ray machine outgoing and carries out projection imaging.
Each embodiment of the laser light source as used in the laser projection device in the present embodiment and above-mentioned laser light source
The laser light source of middle offer is identical, therefore the two is able to solve identical technical problem, and reaches identical desired effect.
Other compositions of laser projection device about the embodiment of the present invention etc. have been well known to those skilled in the art,
It is no longer described in detail herein.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
In the technical scope disclosed by the present invention, any changes or substitutions that can be easily thought of by those familiar with the art, all answers
It is included within the scope of the present invention.Therefore, protection scope of the present invention should be with the scope of protection of the claims
It is quasi-.
Claims (13)
1. a kind of package assembling is used for encapsulated laser array, which is characterized in that including fixing bracket, the first sealing ring,
The fixed bracket includes the first end and second end being oppositely arranged, and is offered on the support bracket fastened first end end face
Groove, the fixed bracket further includes light admission port, and the light admission port is through the bottom surface of the groove and described support bracket fastened the
Two ends end face；
The groove makes the light-emitting surface of the laser array towards institute for accommodating and fixing the laser array
Light admission port is stated, the support bracket fastened second end is used to fix with the main casing of laser light source；
First sealing ring is used to seal the side wall one week gap between the inner wall of the groove of the laser array.
2. package assembling according to claim 1, which is characterized in that along the depth direction of the groove, the groove
Area of section is gradually reduced.
3. a kind of laser assembly, which is characterized in that including package assembling, laser array,
The package assembling is package assembling of any of claims 1 or 2；
The laser array is accommodated and is fixed in the package assembling and fixes in the groove on bracket, and the laser battle array
For the light-emitting surface of column towards the light admission port, the first sealing ring in the package assembling is sealed in the side wall of the laser array
In gap between one week and the groove inner wall.
4. laser assembly according to claim 3, which is characterized in that opened up on the side wall of the laser array limited
Position slot, first sealing ring are embedded in the limiting slot close to the one end fits of the laser array.
5. laser assembly according to claim 3, which is characterized in that close to the groove on first sealing ring
Scarf is arranged in corner on the surface of bottom surface and first sealing ring between the surface of the side of the groove.
6. laser assembly according to claim 3, which is characterized in that the laser array includes support plate and sets
The laser array main body being placed in the support plate,
The support plate is supported on the support bracket fastened first end end face, and the support plate is fixed with the fixed bracket
Connection, the laser array main body are located in the groove, and first sealing ring is set to the laser array main body
Side wall one week between the inner wall of the groove, and first sealing ring is connected with support close to one end of the support plate
Arm, the support arm extend to the direction close to the support plate and abut with the support plate.
7. laser assembly according to claim 3, which is characterized in that the side wall of the laser array is equipped with welding
Terminal, the position that the solder terminal is corresponded on the side wall of the groove offer evacuation notch, when the laser array is pacified
When loaded in groove, the solder terminal is protruded into the evacuation notch, on the outer surface of the side wall of the groove described in correspondence
The position of evacuation notch is connected with circuit board, and the position that the solder terminal is corresponded on the circuit board offers through-hole, described
Solder terminal passes through the through-hole and stretches out the surface of side wall of the circuit board far from the groove, and is welded in the circuit board
On the surface of side wall far from the groove.
8. laser assembly according to claim 7, which is characterized in that it further include insulation spacer, the insulation spacer pad
Between the circuit board and the side wall of the groove.
9. a kind of laser light source, which is characterized in that including laser assembly, main casing and sealing element,
The laser assembly is laser assembly described in any one of claim 3~8；
The main casing is connected to support bracket fastened second end in the laser assembly, and the main casing is for sealing optical path group
Part, and the main casing is equipped with light inlet, the light inlet is opposite with the light admission port on the fixed bracket；
The sealing element is used to seal the main casing edge at the light inlet one week and the support bracket fastened second end
Gap between end face.
10. laser light source according to claim 9, which is characterized in that the sealing element be the second sealing ring, described second
Sealing ring is located between the support bracket fastened second end end face and the main casing outer wall, and second sealing ring surrounds
Setting in one week of the light admission port and the light inlet.
11. laser light source according to claim 10, which is characterized in that opened up on the support bracket fastened second end end face
There is annular seal groove, the annular seal groove is arranged for one week around the light admission port, and the sealing element is close to the fixed branch
The one end fits of frame are embedded in the annular seal groove.
12. laser light source according to claim 9, which is characterized in that the support bracket fastened first end is connected with heat dissipation
Plate, the heat sink are covered on surface of the laser array in the laser assembly far from the light admission port.
13. a kind of laser projection device, which is characterized in that including sequentially connected laser light source, ray machine and camera lens；
The laser light source is laser light source described in any one of claim 9~12；
The ray machine is used to receive the light beam of the laser light source outgoing and is emitted to the camera lens after being modulated；
The camera lens is used to receive the modulation light beam of the ray machine outgoing and carries out projection imaging.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810219402.9A CN110277720A (en) | 2018-03-16 | 2018-03-16 | A kind of package assembling, laser assembly, laser light source and laser projection device |
| PCT/CN2018/091141 WO2019174143A1 (en) | 2018-03-16 | 2018-06-13 | Laser assembly and laser projection device |
| PCT/CN2018/094899 WO2019174162A1 (en) | 2018-03-16 | 2018-07-06 | Laser projection device |
| US16/029,272 US10389968B1 (en) | 2018-03-16 | 2018-07-06 | Laser projection device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810219402.9A CN110277720A (en) | 2018-03-16 | 2018-03-16 | A kind of package assembling, laser assembly, laser light source and laser projection device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110277720A true CN110277720A (en) | 2019-09-24 |
Family
ID=67957848
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810219402.9A Pending CN110277720A (en) | 2018-03-16 | 2018-03-16 | A kind of package assembling, laser assembly, laser light source and laser projection device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110277720A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204592279U (en) * | 2015-04-10 | 2015-08-26 | 艾维新能源科技南京有限公司 | A special-shaped sealing ring |
| JP2016057609A (en) * | 2014-09-11 | 2016-04-21 | パナソニックＩｐマネジメント株式会社 | Light source device and video display device |
| CN205811265U (en) * | 2016-06-22 | 2016-12-14 | 海信集团有限公司 | A kind of LASER Light Source |
| US9628184B2 (en) * | 2013-11-05 | 2017-04-18 | Cisco Technology, Inc. | Efficient optical communication device |
-
2018
- 2018-03-16 CN CN201810219402.9A patent/CN110277720A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9628184B2 (en) * | 2013-11-05 | 2017-04-18 | Cisco Technology, Inc. | Efficient optical communication device |
| JP2016057609A (en) * | 2014-09-11 | 2016-04-21 | パナソニックＩｐマネジメント株式会社 | Light source device and video display device |
| CN204592279U (en) * | 2015-04-10 | 2015-08-26 | 艾维新能源科技南京有限公司 | A special-shaped sealing ring |
| CN205811265U (en) * | 2016-06-22 | 2016-12-14 | 海信集团有限公司 | A kind of LASER Light Source |
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Application publication date: 20190924 |