CN110390233A - Fingerprint imaging mould group and electronic equipment - Google Patents
Fingerprint imaging mould group and electronic equipment Download PDFInfo
- Publication number
- CN110390233A CN110390233A CN201810364195.6A CN201810364195A CN110390233A CN 110390233 A CN110390233 A CN 110390233A CN 201810364195 A CN201810364195 A CN 201810364195A CN 110390233 A CN110390233 A CN 110390233A
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- mould group
- fingerprint imaging
- articulamentum
- fingerprint
- imaging mould
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- G—PHYSICS
- G06—COMPUTING OR CALCULATING; COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Image Input (AREA)
Abstract
A kind of fingerprint imaging mould group and electronic equipment, the fingerprint imaging mould group includes: cover sheet；Fingerprint imaging component, the fingerprint imaging component are fitted on the cover sheet by articulamentum；The material of the articulamentum includes setting expansion material.By adding setting expansion material in the articulamentum, to make up the volume contraction in solidification process, to prevent the appearance of the articulamentum deformation, it advantageously reduces before and after the articulamentum solidifies and the possibility of defect occurs in the fingerprint imaging mould group, be conducive to the manufacturing yield for improving the fingerprint imaging mould group.
Description
Technical field
The present invention relates to fingerprint imaging field, in particular to a kind of fingerprint imaging mould group and electronic equipment.
Background technique
Fingerprint identification technology collects the fingerprint image of human body by fingerprint imaging sensor, then with fingerprint recognition system
In have fingerprint imaging information be compared, to realize identification.It is unique due to the convenience that uses and somatic fingerprint
Property, fingerprint identification technology has been widely used in every field, such as: the field of safety check such as public security bureau, customs, the gate inhibition system of building
System and the consumer product areas such as PC and mobile phone etc..
In fingerprint imaging technique used by fingerprint recognition, one is optically acquire somatic fingerprint image: logical
It crosses light source and generates incident light；Incident light is projected to finger surface layer, handles digital reflex and forms the reflected light for having finger print information；By scheming
As sensor receives the reflected light, acquisition fingerprint image.
The assembling process of fingerprint imaging mould group tends to defect occur, thus the problem of causing yield loss.
Summary of the invention
Problems solved by the invention is to provide a kind of fingerprint imaging mould group and electronic equipment, to reduce defect, improves manufacture
Yield.
To solve the above problems, the present invention provides a kind of fingerprint imaging mould group, comprising:
Cover sheet；Fingerprint imaging component, the fingerprint imaging component are fitted on the cover sheet by articulamentum；
The material of the articulamentum includes setting expansion material.
Optionally, the setting expansion material before curing after cubical expansivity within 10%.
Optionally, the material of the articulamentum further include: adhesive；Described adhesive is UV glue.
Optionally, the setting expansion material mixes with UV glue.
Optionally, the setting expansion material is irradiated by UV realizes solidification.
Optionally, the setting expansion material is triphenylmenthane five colors derivative.
Optionally, by percent by volume, accounting of the setting expansion material in the articulamentum is 0.1% to 10%
In range.
Optionally, the curing time of the articulamentum is within 1 minute.
Optionally, the fingerprint imaging mould group is optical fingerprint imaging modules.
Optionally, the fingerprint imaging component includes: light source, and light caused by the light source, which is suitable for being formed, to be carried
The imaging of finger print information；Imaging sensor, described image sensor are suitable for acquiring the imaging to obtain fingerprint image；
Described image sensor and the light source are fixed on the cover sheet by the articulamentum.
Correspondingly, the present invention also provides a kind of electronic equipment, comprising:
Fingerprint imaging mould group, the fingerprint imaging mould group are fingerprint imaging mould group of the present invention.
Optionally, the cover sheet is the cover-plate glass of the electronic equipment.
Compared with prior art, technical solution of the present invention has the advantage that
In technical solution of the present invention, setting expansion material is added in the material of the articulamentum.The setting expansion material
Volume expansion can occur in the curing process for material, can make up for it the volume contraction of the articulamentum in the curing process, so that institute
The shape invariance and constancy of volume that articulamentum maintains after hardening are stated, prevents the appearance of the articulamentum deformation, therefore described solid
The addition for changing expanding material, can effectively prevent the articulamentum change in shape occur, advantageously reduce the articulamentum solidification
There is the possibility of defect in the fingerprint imaging mould group of front and back, is conducive to the manufacturing yield for improving the fingerprint imaging mould group.
In optinal plan of the present invention, the setting expansion material before curing after cubical expansivity within 10%.Choosing
Solidification front and back cubical expansivity suitable material is selected as the setting expansion material, was solidifying the setting expansion material
Volume expansion in journey can make up for it the volume contraction of the articulamentum, to prevent the appearance of the articulamentum deformation, favorably
There is the possibility of defect in the fingerprint imaging mould group before and after reducing the articulamentum and solidify, be conducive to improve the fingerprint at
As the manufacturing yield of mould group.
In optinal plan of the present invention, the material of the articulamentum further include: adhesive, described adhesive are UV glue.UV glue
Solidification, and the advantage that curing time is shorter can be realized with irradiating by UV.Therefore UV glue is set by described adhesive
Way, can reduce the articulamentum and solidify influence to other hardware devices, additionally it is possible to guarantee higher production efficiency, from
And realize taking into account for production efficiency and device stability.
In optinal plan of the present invention, when the connection layer material also has UV glue as adhesive, the setting expansion
Material mixes with UV glue, to improve the uniformity that the setting expansion material is distributed in the articulamentum, makes the solidification
The even inflation in the articulamentum is conducive to drop expanding material to prevent the appearance of the articulamentum deformation after hardening
The low articulamentum, which solidifies in the fingerprint imaging mould group of front and back, there is the possibility of defect, is conducive to improve the fingerprint imaging mould
The manufacturing yield of group.
In optinal plan of the present invention, when the connection layer material also has UV glue as adhesive, the setting expansion
Material is irradiated by UV realizes solidification, so that the setting expansion material is solidified simultaneously with described adhesive, without increasing
Add additional technical steps that the solidification of the articulamentum can be realized, can be effectively reduced and the setting expansion material is added to described
The influence of articulamentum formation process is conducive to the simplification of processing step and the reduction of process costs.
In optinal plan of the present invention, the fingerprint imaging component is optical fingerprint image-forming assembly, including light source and image
Sensor is fixedly linked between described image sensor and the light source and the cover sheet by articulamentum realization.
Be added with the setting expansion material in the articulamentum, thus the articulamentum occur afterwards before curing the probability of deformation compared with
It is low, it can effectively ensure that relative position and distance are not between the light source, the cover sheet and described image sensor
Become, to guarantee the optical path of the fingerprint imaging component, is conducive to the precision of the fingerprint imaging mould group optical path, advantageously reduces
The articulamentum solidifies the generation of defect in the fingerprint imaging mould group of front and back, is conducive to the improvement of device performance and proposing for manufacturing yield
It is high.
Detailed description of the invention
Fig. 1 is a kind of the schematic diagram of the section structure of fingerprint imaging mould group；
Fig. 2 is the schematic diagram of the section structure of one embodiment of fingerprint imaging mould group of the present invention.
Specific embodiment
It can be seen from background technology that existing fingerprint imaging mould group is easy to appear defect after adhesive curing, and there are yields
The problem of loss.Now in conjunction with a kind of fingerprint imaging mould group structural analysis its there is the reason of defect, yield loss problem:
This is illustrated for sentencing optical fingerprint imaging modules.Optical fingerprint imaging modules are to pass through photoelectric conversion
Principle realizes fingerprint imaging, specifically includes that cover sheet, optical sensor, integrated chip (IC), flexible circuit board (FPC)
With the main portion such as electronic device (including light source led), light guide plate, upper protection shell and lower protection shell on flexible circuit board
Part.Wherein optical sensor is to utilize amorphous silicon film transistor (a-Si TFT), low-temperature polysilicon film transistor (LTPS
TFT) or the semiconductor process techniques such as oxide semiconductor thin-film transistor (OS TFT), make on the glass substrate；Later
It realizes and encapsulates by processes such as cutting, dispensing, bondings.
With reference to Fig. 1, a kind of the schematic diagram of the section structure of fingerprint imaging mould group is shown.
As shown in Figure 1, the fingerprint imaging mould group is optical fingerprint imaging modules, comprising: light source 11 is located at the light
Imaging sensor 12 on source 11 and the sensing face in described image sensor 12 13, wherein the sensing face 13 is
Cover sheet 14 is backwards to the surface of described image sensor 12.
When acquiring fingerprint, finger 10 is pressed in sensing face 13；The incident light that light source 11 generates is projected to sensing face 13
On, reflection and refraction occur at the position that finger 10 is contacted with the sensing face 13, is formed by reflected light projects to image
On sensor 12；Imaging sensor 12 acquires the reflected light, and carries out photoelectric conversion and signal processing, realizes fingerprint image
Acquisition.
In order to realize the fixation of fingerprint imaging mould group position, the especially fixation of described image sensor 12, the protection
Articulamentum (not shown) is additionally provided between cover board 14 and described image sensor 12, described image sensor 12 passes through institute
Articulamentum is stated to be fixed on the cover sheet 14.
The surface of described image sensor 12 is not substantially flat degree, and the surface of described image sensor 12 is also possible to set
It is equipped with the hardware such as integrated chip (not shown), therefore articulamentum between described image sensor 12 and the cover sheet 14
Thickness and inhomogenous.
The photoinitiator (or photosensitizer) of UV glue absorb under uv illumination generate after ultraviolet light living radical or sun from
Son causes monomer polymerization, cross-linking chemistry reaction, adhesive is made to be converted into solid-state by liquid within the several seconds.Therefore UV glue has
Solidification, and the advantage that curing time is shorter can be realized by UV irradiation.So described image sensor 12 and the protection
The material of articulamentum is usually UV glue between cover board 14, with reduce articulamentum solidification to the fingerprint imaging mould group and its
The influence of his hardware device, and guarantee higher production efficiency.
But since curing rate is fast, UV glue can have contraction sharply afterwards before curing, and due to articulamentum
Thickness it is uneven, the contraction of different-thickness UV glue is not also identical, thus the articulamentum before curing after may occur
Deformation；The deformation of the articulamentum may be in the cover sheet 14, described image sensor 12, the integrated chip (figure
In be not shown) and the hardware such as the flexible circuit board (not shown) in cause defect, cause yield loss.
Especially in optical fingerprint imaging modules, between described image sensor 12 and the cover sheet 14 also simultaneously
The structure of spacer column (Photo Spacer, PS) one kind is not provided with to control described image sensor 12 and the cover sheet
Spacing distance between 14, therefore the deformation of the articulamentum is also possible to will cause described image sensor 12 and the protection cap
The variation of spacing distance between plate 14, or even there is gap between described image sensor 12 and the cover sheet 14.Institute
State the variation of spacing distance between imaging sensor 12 and the cover sheet 14, described image sensor 12 and the protection cap
The appearance in gap between plate 14 can all influence the optical path of the fingerprint imaging mould group, influence the quality of obtained fingerprint image, very
To may cause the problem of can not obtaining fingerprint image.
To solve the technical problem, the present invention provides a kind of fingerprint imaging mould group and electronic equipment, by the company
Addition setting expansion material in layer is connect, to make up the volume contraction in solidification process, to prevent going out for the articulamentum deformation
It is existing, it advantageously reduces before and after the articulamentum solidifies and the possibility of defect occurs in the fingerprint imaging mould group, be conducive to improve institute
State the manufacturing yield of fingerprint imaging mould group.
To make the above purposes, features and advantages of the invention more obvious and understandable, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.
With reference to Fig. 2, the schematic diagram of the section structure of one embodiment of fingerprint imaging mould group of the present invention is shown.
As shown in Fig. 2, the fingerprint imaging mould group includes: cover sheet 110；Fingerprint imaging component 120, the fingerprint at
As component 120 is fitted on the cover sheet 110 by articulamentum 130；The material of the articulamentum 130 includes setting expansion
Material.
In technical solution of the present invention, setting expansion material is added in the material of the articulamentum 130.The setting expansion
Volume expansion can occur in the curing process for material, can make up for it the volume contraction of the articulamentum 130 in the curing process, with
130 volume of articulamentum, shape invariance, therefore the addition of the setting expansion material are maintained, the company can be effectively prevent
Connect layer 130 and deformation occur, advantageously reduce the articulamentum 130 solidify occur defect in the fingerprint imaging mould group of front and back can
Can, be conducive to the manufacturing yield for improving the fingerprint imaging mould group.
The cover sheet 110 is used to resist the impact of external environment, and realize the fingerprint fingerprint imaging component 120 etc.
Hardware device is isolated with external environment, to play a protective role.
In order to realize the defencive function of the cover sheet 110, the cover sheet 110 hardness with higher.This reality
It applies in example, the material of the cover sheet 110 is tempered glass.In other embodiments of the invention, the material of the cover sheet
It may be sapphire glass or organic glass etc..
It should be noted that the hiding setting in order to realize fingerprint imaging mould group, improves user experience, it is electric also for simplifying
The internal structure of sub- equipment, in the present embodiment, the cover sheet 110 is the cover-plate glass of the electronic equipment.
The fingerprint imaging component 120 is imaged for treating image member to obtain fingerprint image.
In the present embodiment, the fingerprint imaging mould group is optical fingerprint imaging modules, i.e., the described fingerprint imaging component is
Fingerprint imaging is realized by photoelectricity transformation principle.
Specifically, the fingerprint imaging component 120 includes: light source 121, light caused by the light source 121 is suitable for
Form the imaging for carrying finger print information；Imaging sensor 122, described image sensor 122 are suitable for acquiring the imaging
Light is to obtain fingerprint image.
As shown in Fig. 2, the fingerprint imaging mould group is ultrathin type fingerprint imaging mould group, described image sensor 122 and institute
State the side that light source 121 is located at the cover sheet 110.
In the present embodiment, the cover sheet 110 is the cover-plate glass of the cover sheet 110, the cover sheet 110
Surface backwards to the fingerprint imaging component 120 is to be suitable for receiving the sensing face 123 touched.
Fingerprint imaging is being carried out, when part to be imaged touches the sensing face 123, light caused by the light source 121 exists
Reflection and refraction occur in the sensing face 123, forms the imaging for carrying finger print information；The imaging is projected to described
On imaging sensor 122, acquired by described image sensor 122 to obtain fingerprint image.
The fingerprint imaging mould group further include: articulamentum 130, the articulamentum 130 are located at the fingerprint imaging component 120
Between cover sheet 110；The articulamentum 130 for realizing the fingerprint imaging component 120 and the cover sheet 110 it
Between be fixedly connected.
In the present embodiment, the fingerprint imaging component 120 includes the light source 121 and described image sensor 122, therefore
The light source 121 and described image sensor 122 are fixed on the cover sheet 110 by the articulamentum 130.So institute
Stating articulamentum 130 may also be adapted to realize phase between the light source 121, described image sensor 122 and the cover sheet 110
Fixation to position.
It should be noted that the fingerprint imaging component 120 further includes that integrated chip (is not marked in figure in the present embodiment
Show), the integrated chip is set to described image sensor 122 towards on the surface of the cover sheet 110, i.e., described integrated
Chip is between the cover sheet 110 and described image sensor 1220.Therefore described image sensor 122 and the guarantor
130 thickness of articulamentum between protecting cover plate 110 and the articulamentum between the integrated chip and the cover sheet 110 130 are thick
It spends not identical.So between the articulamentum 130 is filled between full described image sensor 122 and the cover sheet 110
Gap, the thickness of the articulamentum 130 are simultaneously inhomogenous.
It should also be noted that, the curing time of the articulamentum 130 is within 1 minute in the present embodiment.The connection
The curing time of layer 130 is shorter, and the fingerprint imaging mould group production efficiency is higher, and the manufacturing cost of the fingerprint imaging mould group is got over
It is low.
The material of the articulamentum 130 includes setting expansion material.The setting expansion material rear volume meeting before curing
It expands, so as to make up the volume contraction of articulamentum described in solidification process, to maintain body after the articulamentum solidification
Product is constant.Therefore the addition of the setting expansion material, can effectively prevent articulamentum 130 described in solidification process deformation occur,
It advantageously reduces before and after the articulamentum 130 solidifies and the possibility of defect occurs in the fingerprint imaging mould group, be conducive to improve institute
State the manufacturing yield of fingerprint imaging mould group.
In the present embodiment, the setting expansion material before curing after cubical expansivity within 10%.Selection solidification
Front and back cubical expansivity suitable material makes the setting expansion material in the curing process as the setting expansion material
Volume expansion can make up for it the volume contraction of the articulamentum 130, to prevent the appearance of the articulamentum deformation, be conducive to drop
The low articulamentum 130, which solidifies in the fingerprint imaging mould group of front and back, there is the possibility of defect, be conducive to improve the fingerprint at
As the manufacturing yield of mould group.
In the present embodiment, the material of the articulamentum 130 further includes adhesive.Described adhesive is suitable for realizing the finger
Connection between line image-forming assembly 120 and the cover sheet 110.Specifically, described adhesive is UV glue.UV glue, which has, to be passed through
Solidification, and the advantage that curing time is shorter can be realized in UV irradiation.Therefore described adhesive is set to the way of UV glue, energy
It enough reduces the articulamentum 130 and solidifies influence to other hardware devices, additionally it is possible to guarantee higher production efficiency, to realize
Production efficiency and device stability are taken into account.
Since the articulamentum 130 also has UV glue as adhesive, in the present embodiment, the setting expansion material
It mixes with the UV glue, so as to improve the uniformity that the setting expansion material is distributed in the articulamentum 130, makes solid
Setting expansion material even inflation in the articulamentum during change, so that the appearance of the articulamentum deformation is prevented,
It advantageously reduces before and after the articulamentum solidifies and the possibility of defect occurs in the fingerprint imaging mould group, be conducive to improve the finger
The manufacturing yield of line imaging modules.
In addition, since described adhesive is UV glue, the setting expansion material is irradiated real by UV in the present embodiment
Now solidify.By the setting expansion material and adhesive curing mode having the same, can be realized by a processing step
The articulamentum can be realized without increasing additional processing step in the solidification of described adhesive and the setting expansion material
Solidification can be effectively reduced the influence that the setting expansion material is added to the articulamentum formation process, be conducive to technique step
The reduction of rapid simplification and process costs.
Specifically, the setting expansion material is triphenylmenthane five colors derivative (TLD).Triphenylmenthane five colors derivative exists
It can be solidified rapidly by under UV irradiation, and a degree of volume expansion can occur in solidification process, so as to effective
Guarantee 130 shape of articulamentum and constancy of volume；And triphenylmenthane five colors derivative is organic matter, is had with UV glue preferable
The performance that mixes, can be uniformly dispersed in UV glue, remain unchanged 130 shape of the articulamentum being formed by curing and volume.
In the present embodiment, by percent by volume, accounting of the setting expansion material in the articulamentum is arrived 0.1%
In 10% range.Accounting of the setting expansion material in the articulamentum should not it is too high also should not be too low.The solidification is swollen
If accounting of the swollen material in the articulamentum is too low, volume mistake that setting expansion material described in solidification process is expanded
It is small, volume contraction can not be made up, the articulamentum 130 after solidification still the problem of being easy to appear volume contraction, it is difficult to reduce defect
Occurrence probability, it is difficult to improve manufacturing yield of products；If accounting of the setting expansion material in the articulamentum is too high,
The volume that then setting expansion material described in solidification process is expanded is excessive, although compensating for volume contraction, after solidification
The problem of articulamentum 130 is easy to appear volume expansion, so that the appearance of defect may also be will cause, to cause manufacturing yield
Loss.
It should be noted that the fingerprint imaging mould group is optical fingerprint imaging modules, the light source in the present embodiment
121 and described image sensor 122 be fixed on the cover sheet 110 by the articulamentum 130, the articulamentum 130
It is also used to fix the relative position between the light source 121, described image sensor 122 and the cover sheet 110.Institute
State the addition setting expansion material in connection layer material, can effectively maintain solidify the shape of the front and back articulamentum 130 with
Volume can effectively reduce the articulamentum 130 and the probability of deformation occurs；130 volume of articulamentum, effective dimension of shape
It holds, can guarantee consolidating for relative position between the light source 121, described image sensor 122 and the cover sheet 110
It is fixed, so as to guarantee the optical path of the fingerprint imaging component, is conducive to the precision of the fingerprint imaging mould group optical path, is conducive to
The generation that the articulamentum solidifies defect in the fingerprint imaging mould group of front and back is reduced, improvement and the manufacturing yield of device performance are conducive to
Raising.
Correspondingly, the present invention also provides a kind of electronic equipment.
Specifically, the electronic equipment includes fingerprint imaging mould group, the fingerprint imaging mould group is provided by the present invention
Fingerprint imaging mould group.
Due to the fingerprint imaging mould group be fingerprint imaging mould group of the invention, the fingerprint imaging mould group it is specific
Technical solution refers to the specific embodiment of aforementioned fingerprint imaging modules, and details are not described herein by the present invention.
In the present embodiment, the electronic equipment has cover-plate glass, and the cover-plate glass is for constituting the electronic equipment
Part enclosure.Specifically, the electronic equipment has display screen, cover-plate glass is the cover-plate glass of the display screen.
In the present embodiment, the cover sheet of the fingerprint imaging mould group is the cover-plate glass.Therefore the fingerprint imaging
Component joint, to realize the hiding setting of the fingerprint imaging mould group, is conducive to mentioning for user experience on the cover-plate glass
It is high.
Although present disclosure is as above, present invention is not limited to this.Anyone skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (12)
1. a kind of fingerprint imaging mould group characterized by comprising
Cover sheet；
Fingerprint imaging component, the fingerprint imaging component are fitted on the cover sheet by articulamentum；
The material of the articulamentum includes setting expansion material.
2. fingerprint imaging mould group as described in claim 1, which is characterized in that the setting expansion material before curing after body
Product expansion rate is within 10%.
3. fingerprint imaging mould group as described in claim 1, which is characterized in that the material of the articulamentum further include: adhesive；
Described adhesive is UV glue.
4. fingerprint imaging mould group as claimed in claim 3, which is characterized in that the setting expansion material mixes with UV glue.
5. fingerprint imaging mould group as claimed in claim 3, which is characterized in that the setting expansion material is irradiated by UV to be realized
Solidification.
6. fingerprint imaging mould group as claimed in any one of claims 1 to 5, wherein, which is characterized in that the setting expansion material is
Triphenylmenthane five colors derivative.
7. fingerprint imaging mould group as described in claim 1, which is characterized in that press percent by volume, the setting expansion material
In the accounting in the articulamentum in 0.1% to 10% range.
8. fingerprint imaging mould group as described in claim 1, which is characterized in that the curing time of the articulamentum 1 minute with
It is interior.
9. fingerprint imaging mould group as described in claim 1, which is characterized in that the fingerprint imaging mould group be optical fingerprint at
As mould group.
10. the fingerprint imaging mould group as described in claim 1 or 9, which is characterized in that the fingerprint imaging component includes:
Light source, light caused by the light source are suitable for forming the imaging for carrying finger print information；
Imaging sensor, described image sensor are suitable for acquiring the imaging to obtain fingerprint image；
Described image sensor and the light source are fixed on the cover sheet by the articulamentum.
11. a kind of electronic equipment characterized by comprising
Fingerprint imaging mould group, the fingerprint imaging mould group is as described in claim 1~10 any one.
12. electronic equipment as claimed in claim 11, which is characterized in that the cover sheet is the cover board of the electronic equipment
Glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810364195.6A CN110390233A (en) | 2018-04-20 | 2018-04-20 | Fingerprint imaging mould group and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810364195.6A CN110390233A (en) | 2018-04-20 | 2018-04-20 | Fingerprint imaging mould group and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110390233A true CN110390233A (en) | 2019-10-29 |
Family
ID=68284310
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810364195.6A Pending CN110390233A (en) | 2018-04-20 | 2018-04-20 | Fingerprint imaging mould group and electronic equipment |
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| Country | Link |
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| CN (1) | CN110390233A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1434323A (en) * | 2002-01-24 | 2003-08-06 | 夏普公司 | Display element and production method thereof |
| CN103182367A (en) * | 2011-12-27 | 2013-07-03 | 比亚迪股份有限公司 | Method for curing ultraviolet (UV) adhesive on back of flexible printed circuit (FPC) of UV adhesive attached touch screen |
| CN103982868A (en) * | 2014-04-30 | 2014-08-13 | 合肥京东方显示光源有限公司 | Self-buffering element and preparation method thereof as well as backlight module and display device |
| CN105322037A (en) * | 2014-06-05 | 2016-02-10 | Tdk株式会社 | Solar cell and manufacturing method thereof |
| CN106407967A (en) * | 2016-12-02 | 2017-02-15 | 信利光电股份有限公司 | Fingerprint module and the applying method and application thereof |
| CN206696863U (en) * | 2017-04-14 | 2017-12-01 | 南昌欧菲生物识别技术有限公司 | Optical finger print module and electronic installation |
| CN107531030A (en) * | 2015-06-02 | 2018-01-02 | 富士胶片株式会社 | Hard coat film, the front panel of image-displaying member, resistive touch panel, capacitive touch panel and image display device |
| CN107798280A (en) * | 2016-09-07 | 2018-03-13 | 上海箩箕技术有限公司 | Imaging modules and forming method thereof, fingerprint identification device |
-
2018
- 2018-04-20 CN CN201810364195.6A patent/CN110390233A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1434323A (en) * | 2002-01-24 | 2003-08-06 | 夏普公司 | Display element and production method thereof |
| CN103182367A (en) * | 2011-12-27 | 2013-07-03 | 比亚迪股份有限公司 | Method for curing ultraviolet (UV) adhesive on back of flexible printed circuit (FPC) of UV adhesive attached touch screen |
| CN103982868A (en) * | 2014-04-30 | 2014-08-13 | 合肥京东方显示光源有限公司 | Self-buffering element and preparation method thereof as well as backlight module and display device |
| CN105322037A (en) * | 2014-06-05 | 2016-02-10 | Tdk株式会社 | Solar cell and manufacturing method thereof |
| CN107531030A (en) * | 2015-06-02 | 2018-01-02 | 富士胶片株式会社 | Hard coat film, the front panel of image-displaying member, resistive touch panel, capacitive touch panel and image display device |
| CN107798280A (en) * | 2016-09-07 | 2018-03-13 | 上海箩箕技术有限公司 | Imaging modules and forming method thereof, fingerprint identification device |
| CN106407967A (en) * | 2016-12-02 | 2017-02-15 | 信利光电股份有限公司 | Fingerprint module and the applying method and application thereof |
| CN206696863U (en) * | 2017-04-14 | 2017-12-01 | 南昌欧菲生物识别技术有限公司 | Optical finger print module and electronic installation |
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Application publication date: 20191029 |