CN110391324A - Light-emitting elements and electronic devices - Google Patents

Abstract

The invention discloses a kind of light-emitting components comprising a package substrate, one first light-emitting diode chip for backlight unit, an encapsulating material and a photoresist layer.Wherein, light-emitting diode chip for backlight unit is arranged on package substrate, and encapsulating material is set on light-emitting diode chip for backlight unit and package substrate, and photoresist layer is set on encapsulating material and has one first aperture.In overlook direction, the area of the first aperture of photoresist layer is less than the area of light-emitting component.

Description

Light-emitting elements and electronic devices

technical field

The invention relates to a light-emitting element and a related electronic device, in particular to a light-emitting element capable of improving luminous efficiency and a related electronic device.

Background technique

The public information display (PID) is a display device commonly used outdoors. In order to improve the picture contrast reduction caused by reflected sunlight, the light emitting diode (LED) used in general public displays uses Black encapsulation material. However, since the LED chip is covered by the black encapsulation material, a considerable proportion of the light generated by it will be absorbed by the black encapsulation material, thereby reducing the luminous efficiency and making the overall brightness of the public display lower. Therefore, how to improve the light utilization efficiency of the public display is still a direction of research and development in the industry.

Contents of the invention

An embodiment of the present invention provides a light emitting element, which includes a package substrate, a first light emitting diode chip, a package material and a light blocking layer. Wherein, the LED chip is arranged on the packaging substrate, the packaging material is arranged on the LED chip and the packaging substrate, and the light blocking layer is arranged on the packaging material and has a first opening. In the plan view direction, the area of the first opening of the light blocking layer is smaller than the area of the light emitting element.

Another embodiment of the present invention provides an electronic device, which includes a main substrate and at least one light emitting element. The main substrate includes a circuit and a plurality of connection pads, and the circuit and the plurality of connection pads are all arranged on the surface of the main substrate. The light emitting element is disposed on the main substrate and electrically connected to at least one of the plurality of connection pads. The light emitting element includes a package substrate, a light emitting diode chip, a package material and a light blocking layer. Wherein, the LED chip is arranged on the packaging substrate, the packaging material is arranged on the LED chip and the packaging substrate, and the light blocking layer is arranged on the packaging material and has an opening. In the plan view direction, the area of the opening of the light blocking layer is smaller than the area of the light emitting element.

Description of drawings

Fig. 1 is a schematic cross-sectional view of a first embodiment of a light-emitting element of the present invention

FIG. 2 is a schematic top view of the first embodiment of the light-emitting element of the present invention.

FIG. 3 is a schematic cross-sectional view of a second embodiment of the light-emitting element of the present invention.

Fig. 4 is a schematic top view of a variant embodiment of the second embodiment of the light emitting element of the present invention.

FIG. 5 is a schematic top view of another variant embodiment of the second embodiment of the light emitting element of the present invention.

FIG. 6 is a schematic top view of a third embodiment of the light emitting element of the present invention.

FIG. 7 is a schematic cross-sectional view of a fourth embodiment of the light-emitting element of the present invention.

FIG. 8 is a schematic cross-sectional view of a fifth embodiment of the light-emitting element of the present invention.

FIG. 9 is a schematic top view of the electronic device of the present invention.

FIG. 10 is a partially enlarged schematic view of the electronic device of the present invention.

Explanation of reference numerals: 100-light-emitting element; 102-packaging substrate; 102s-upper surface; 104, 104R, 104G, 104B-light-emitting diode chip; 106-packaging material; 106a-microstructure; 108-light blocking layer; 1081- 1082-light-absorbing layer; 108a, 108b, 108c-opening; 108s-inside wall; 110-particles; 200-electronic device; 202-main substrate; 204-circuit; 206-connection pad; A1, A2 , A3-area; L1-forward light; L2-lateral light; Z-direction; θ-inner angle.

Detailed ways

The content of the present invention will be described in detail below in conjunction with specific embodiments and accompanying drawings, and in order to make the content of the present invention clearer and easier to understand, each of the following drawings may be a simplified schematic diagram, and the elements may not be drawn to scale. Moreover, the number and size of each element in the drawings are only for illustration and are not intended to limit the scope of the present invention.

Certain terms will be used throughout the specification and appended claims to refer to particular elements. Those skilled in the art should understand that manufacturers of electronic equipment may refer to the same components with different names, and this document does not intend to distinguish those components with the same function but different names. When the terms "comprising", "comprising" and/or "having" are used in this specification, it specifies the existence of said features, regions, steps, operations and/or elements, but does not exclude one or more other The presence or addition of features, regions, steps, operations, elements, and/or combinations thereof. When an element such as a layer or region is referred to as being "on" or extending "on" another element (or a variation thereof), it can be directly on or extend directly to the other element, Or there may be intervening elements between the two. On the other hand, when an element is referred to as being "directly on" or extending "directly onto" another element (or variations thereof), there are no intervening elements present. Also, when an element is referred to as being "coupled" to another element (or variations thereof), it can be directly connected to the other element or be indirectly connected (eg, electrically connected) to the other element through one or more elements. .

It should be noted that the technical solutions provided in different embodiments below can be replaced, combined or mixed with each other to form another embodiment without violating the spirit of the present invention.

Please refer to FIG. 1 and FIG. 2 , FIG. 1 is a schematic cross-sectional view of the first embodiment of the light emitting device of the present invention, and FIG. 2 is a schematic top view of the first embodiment of the light emitting device of the present invention. The light emitting element 100 of this embodiment is a light emitting diode package, which includes a package substrate 102 , a light emitting diode (LED) chip 104 , a package material 106 and a light blocking layer 108 . The package substrate 102 may include an insulating material layer and a conductive material layer (not shown), wherein the conductive material layer may form wires, electrodes, connection pads or other suitable elements in the package substrate 102 , but is not limited thereto. The surface color of the packaging substrate 102 in this embodiment is, for example, a light color or white color that can increase light reflectivity, or the surface of the packaging substrate 102 is mainly made of high reflective materials, but not limited thereto. The LED chip 104 is disposed on the surface of the packaging substrate 102 , and the bottom thereof can be electrically connected to wires in the packaging substrate 102 by solder or other suitable conductive materials. The encapsulation material 106 covers the surface of the LED chip 104 and the packaging substrate 102 to protect or fix the LED chip 104'. The packaging material 106 may include a transparent or high-transmittance material, where the transparent or high-transmittance material refers to a material that is transparent or high-transmittance in the wavelength range emitted by the corresponding light-emitting diode chip, for example, may include a ring Epoxy based resin, silicon or other suitable materials, the range of its refractive index can be between 1.4 and 1.7 (1.4≤refractive index≤1.7), or between 1.5 and 1.6 (1.5≤refractive index rate≤1.6), but not limited to this. The light blocking layer 108 covers and surrounds the packaging material 106 , and the light blocking layer 108 has an opening 108 a on the upper surface opposite to the packaging material 106 . In the plan view direction, the opening 108a of the light blocking layer 108 in this embodiment overlaps at least a part of the LED chip 104, that is, at least part of the light emitted by the LED chip 104 is directly emitted from the opening 108a without being reflected. In this embodiment, the area of the opening 108a (indicated by symbol A1 in FIG. 1 ) is smaller than the area of the package substrate 102 (indicated by symbol A2 in FIG. 1 ), while in other embodiments, the area of the opening 108a is in the top view direction. The area A1 of is smaller than the area of the package body of the light emitting element 100 . In this embodiment, the opening 108a is circular, but not limited thereto. In other embodiments, the opening 108a may have other suitable geometric shapes, such as a square.

In this embodiment, the light-blocking layer 108 has a double-layer structure, including a light-reflecting layer 1081 and a light-absorbing layer 1082 , wherein the light-reflecting layer 1081 is disposed between the light-absorbing layer 1082 and the packaging material 106 . The light reflection layer 1081 includes materials with high reflectivity, for example, the reflectivity can be between 70% and 100% (70%≤reflectivity<100%), and in another embodiment, the reflectivity can be between 90% % to 100% (90% ≤ reflectance < 100%). The high-reflectivity material can effectively reflect light traveling on its surface, and its color is, for example, light color or white, but not limited thereto.

The material of the light-absorbing layer 1082 is, for example, a material with low reflectivity, which can effectively absorb the light passing on its surface, and its color is, for example, dark or black, such as vinyl, but not limited thereto. For example, the reflectivity of the light absorbing layer 1082 can be between 0% and 30% (0%<reflectivity≤30%), and in other embodiments, the reflectivity can be between 10% and 0%. Between (0%<reflectance≤10%), but not limited thereto. In some embodiments, the surface of the light absorbing layer 1082 can also be roughened to produce a rough surface that can scatter light, so as to further reduce light reflectivity. The light reflective layer 1081 and the light absorbing layer 1082 can be formed on the surface of the encapsulation material 106 through double injection molding or spraying respectively, but the forming methods of the light reflective layer 1081 and the light absorbing layer 1082 are not limited thereto. It can be known from the above that the double-layer structure of the light blocking layer 108 has an inner layer and an outer layer, wherein the inner layer is the light reflection layer 1081 and the outer layer is the light absorption layer 1082 . Since the light blocking layer 108 has an opening 108a and the inner layer is a light reflecting layer 1081, part of the light L1 emitted by the light emitting diode chip 104 can be directly emitted from the opening 108a of the light blocking layer 108, while the other light emitted by the light emitting diode chip 104 A part of the light L2 can be reflected once, twice or multiple times by the light reflective layer 1081, and then exit through the opening 108a. Therefore, the light reflective layer 1081 disposed in the inner layer of the light blocking layer 108 can improve the light utilization efficiency, and the design of the opening 108a with an area smaller than the packaging substrate 102 can make the light concentrated at the opening 108a to further improve the light utilization efficiency. On the other hand, the outermost light-absorbing layer 1082 of the light-emitting element 100 can absorb the light irradiated on the outer surface of the light-emitting element 100. When the light-emitting element 100 is used in public displays or any outdoor display equipment or electronic devices with strong ambient light sources, The light absorbing layer 1082 can effectively reduce the reflection of ambient light and improve the picture contrast.

The light-emitting diode elements (LED) mentioned in the present invention include inorganic light-emitting diode elements (normal LED), submillimeter inorganic light-emitting diode elements (mini LED), micro-inorganic light-emitting diode elements (micro LED), organic light-emitting diode elements (OLED) , quantum dot light emitting diode (QLED) or a combination thereof, but not limited thereto. In this embodiment, the sub-millimeter inorganic light emitting diode element is taken as an example, and in the following other embodiments and variants, the light-emitting diode element LED is also taken as an example, and details are not repeated here.

The electronic device of the present invention is not limited to the above-mentioned embodiments. The following will continue to disclose other embodiments or variants of the present invention. In order to simplify the description and highlight the differences between the embodiments or variants, the same reference numerals are used to mark the same components, and repeated parts will not be repeated. In addition, the material and thickness of each film layer and the conditions of the process steps in the subsequent embodiments of the present invention can refer to the first embodiment, so details are not repeated here.

Please refer to FIG. 3 . FIG. 3 is a schematic cross-sectional view of a second embodiment of the light-emitting element of the present invention. The main difference between this embodiment and the first embodiment is that the light-emitting element 100 of this embodiment includes three light-emitting diode chips 104R, 104G, and 104B arranged on the surface of the package substrate 102, and the light-emitting diode chips 104R, 104G, and 104B can be produced respectively. Light emitting diode chips of different colors, for example, can respectively generate red light, green light and blue light, but not limited thereto. When the light-emitting element 100 of this embodiment is applied to an electronic device, the light-emitting diode chips 104R, 104G, and 104B can be electrically connected to an external circuit through the conductive material layer in the packaging substrate 102, and the light-emitting diode chips 104R, 104G, and 104B can be controlled by the external circuit. Simultaneously or differently emit light, for example, make the light emitting element 100 generate red light, green light or blue light at different times, or make two or three of the light emitting diode chips 104R, 104G, 104B emit light simultaneously. In this embodiment, in the plan view direction, the area A1 of the opening 108a of the light blocking layer 108 is smaller than the area of the light-emitting element 100 (represented by the area A2 of the packaging substrate 102), and the combination of the light reflecting layer 1081 and the packaging material 106 It is set that when two or three of the light emitting diode chips 104R, 104G, and 104B emit light at the same time, the emitted light can be reflected back to the packaging material 106 through the light reflection layer 1081, and then emitted through the opening 108a with a smaller area, so The light can be mixed before being emitted from the light emitting element 100 to improve color performance. The area A1 of the opening 108a in this embodiment is designed to be larger than the area A3 of the light-emitting diode chip 104R, 104G or 104B in the plan view direction, but in other embodiments, the area A1 of the opening 108a can also be smaller than the light-emitting diode chip 104R, 104R, or 104B. Area A3 of 104G or 104B. In addition, the positions of the LED chips 104R, 104G, 104B relative to the opening 108a can be designed according to the luminous efficiency, color performance or human perception effect of the LED chips 104R, 104G, 104B. For example, if the luminous efficiency of the LED chip 104G is lower than that of the LED chips 104R and 104B, or the human eye has a lower perception of the color of the light emitted by the LED chip 104G, the LED chip can be designed to 104G has a large area overlapping with the opening 108a, while the area of the LED chip 104R, 104B overlapping with the opening 108a in the direction of top view is small, so that most of the light emitted by the LED chip 104G can be directly passed through the opening. The hole 108a emits, and most of the light emitted by the LED chip 104R, 104B is reflected by the light reflection layer 1082 before being emitted from the hole 108a, so that the color performance of different colors can be uniformed.

Please refer to FIG. 4 . FIG. 4 is a schematic top view of a variant embodiment of the second embodiment of the light emitting element of the present invention. In this variant embodiment, the opening 108 a overlaps with at least a part of projections of the LED chips 104R, 104G, and 104B. Please refer to FIG. 5 , which is a schematic top view of another variant embodiment of the second embodiment of the light emitting element of the present invention. The opening 108a of the light-emitting element 100 in FIG. 5 may be larger than the sum of the areas of the LED chips 104R, 104G, and 104B, and the LED chips 104R, 104G, and 104B are all located in the opening 108a in a plan view direction. This design allows most of the light emitted by the LED chips 104R, 104G, and 104B to be emitted directly through the opening 108a, thus improving the brightness of the emitted light.

Please refer to FIG. 6 , which is a schematic top view of a third embodiment of the light-emitting element of the present invention. The difference between this embodiment and the embodiment shown in FIG. 3, FIG. 4 and FIG. correspond. Moreover, in this embodiment, the areas of the openings 108a, 108b, 108c in the plan view direction are larger than the areas of the LED chips 104G, 104B, 104R, and the openings 108a, 108b, 108c are closely connected to the LED chips 104G, 104B, 104R at least partially overlaps. Therefore, most of the light emitted by the LED chips 104G, 104B, and 104R can be directly emitted through the openings 108a, 108b, and 108c, and a small part of the light will first be reflected by the light reflection layer 1081 of the light blocking layer 108 and then pass through the opening 108a. , 108b, 108c shoot out, this design can improve the overall light brightness. In a variation of this embodiment, the areas of the openings 108a, 108b, 108c may be smaller than the projected areas of the LED chips 104G, 104B, 104R. When the openings 108a, 108b, and 108c occupy a small area on the top of the light emitting element 100, it means that the light absorbing layer 1082 occupies a large area on the top of the light emitting element 100. This design can reduce the chance of reflecting ambient light and improve the contrast of the picture. .

Please refer to FIG. 7 , which is a schematic cross-sectional view of a fourth embodiment of the light-emitting element of the present invention. Refer to FIG. 4 for the relative arrangement positions of the LED chips 104G, 104B, and 104R in the top view direction of this embodiment. The main difference between this embodiment and the previous embodiments is that the packaging material 106 can be doped with particles 110 to further improve the light mixing effect of light in the packaging material 106. The particles 110 can include scattering particles, diffusing particles, and reflecting particles. , refracting particles, other particles that can adjust the light type, or a combination of the above particles, but not limited thereto. In some embodiments, the encapsulation material 106 may also be doped with quantum dots, fluorescent powder or phosphorescent powder and other materials that can adjust the color of light. In addition, the encapsulation material 106 of this embodiment may have a microstructure 106a on a part of the surface exposed by the opening 108a, such as regular or irregular embossing or a concave-convex pattern. The microstructure 106a can increase the scattering effect, so that the opening 108a is less likely to reflect ambient light. The particles 110 and microstructures 106a of this embodiment can be applied to other embodiments and variants of the present invention individually or simultaneously. In other embodiments, the surface of the encapsulation material 106 of the light-emitting element 100 may have microstructures 106a, but no doped particles 110 are present.

Please refer to FIG. 8 , which is a schematic cross-sectional view of a fifth embodiment of the light-emitting element of the present invention. Compared with the previous embodiments, the main difference of this embodiment is that the inner wall 108s of the light blocking layer 108 of the light emitting element 100 has an inclination angle relative to the upper surface 102s of the packaging substrate, and in some embodiments, the surface of the packaging substrate 102 The inner angle θ between the upper surface 102s and the inner sidewall 108s of the light blocking layer 108 may be greater than 90 degrees and less than 180 degrees. This design can reduce the number of reflections of light in the packaging material 106 , and the light can be emitted from the opening 108 a through fewer reflections, thereby improving the luminous efficiency. In another embodiment, the inner angle θ between the upper surface 102s of the package substrate 102 and the inner sidewall 108s of the light blocking layer 108 can be between 0 degrees and 90 degrees (0 degrees<inner angle θ≤90 Spend).

Please refer to FIG. 9 and FIG. 10 , FIG. 9 is a schematic top view of the electronic device of the present invention, and FIG. 10 is a partially enlarged schematic view of the electronic device of the present invention. The aforementioned light-emitting element 100 of the present invention can be applied in various electronic devices 200 . The electronic device 200 can be a display, such as a spliced display or a flexible display, but not limited thereto. In some embodiments, the electronic device 200 of the present invention can be an LED display panel, such as a public display. In some embodiments, the electronic device 200 can be a light emitting device, for example, can be used as a backlight or a backlight module of a non-self-luminous display panel. However, the electronic device 200 of the present invention is not limited to the above examples. This embodiment takes the electronic device 200 as a public display as an example. The electronic device 200 of the present invention includes a main substrate 202 and at least one light emitting element 100 . The main substrate 202 includes at least one circuit 204 and a plurality of connection pads 206 , and the circuit 204 and the plurality of connection pads 206 are both disposed on the surface of the main substrate 202 . The circuit 204 may include thin film transistors, wires, capacitors or other suitable electronic components. The circuit 204 is represented by a transistor symbol in FIG. 9 . In FIG. 10, the connection pads 206 may be composed of a metallic material or any suitable conductive material. The light emitting element 100 is disposed on the main substrate 202 and electrically connected to the circuit 204 through the connection pad 206 . The light-emitting element 100 in FIG. 9 and FIG. 10 is shown in FIG. 1 and FIG. 2 as an example, but it is not limited thereto. For the electronic device 200 of the present invention, the detailed structure of the light emitting element 100 will not be repeated here. In this embodiment, the electronic device 200 may include a plurality of light emitting elements 100 arranged in groups on the surface of the main substrate 202 . The connection pads at the bottom of the light emitting device 100 can be electrically connected to the connection pads 206 below it via solder or other connection methods. According to the present invention, the setting range of the connection pads 206 is smaller than the projected area of the corresponding light-emitting element 100 on the main substrate 202. The connection pads 206 are mostly hidden by the light emitting device 100 and are not exposed in the top view direction because they are covered by the light emitting device 100 . This design can reduce the unshielded portion of the connection pad 206 including the metal material to reduce the possibility of reflecting ambient light and improve the image contrast.

It can be seen from the above that the light-emitting element of the present invention has a light-blocking layer disposed on the periphery of the high-transmittance encapsulation material, and the light-blocking layer has openings to allow light to pass through, so that the light from the light-emitting element can be concentrated and emitted through the openings. The inner layer of the light-blocking layer is a light-reflecting layer, which can increase the probability of light emitting from the opening to improve light utilization efficiency, and promote light mixing when the light-emitting element includes multiple light-emitting diode chips that can emit light of different colors. The outer layer of the light-blocking layer is a light-absorbing layer, which can reduce the reflectivity of ambient light, thereby reducing the interference of ambient light on the light emitted by the light-emitting element to improve contrast. When the light-emitting element of the present invention is applied in an electronic device, it can reduce the reflection of ambient light, improve the utilization rate of light, or improve the contrast of the picture. In addition, since the connection pads located on the surface of the main substrate of the electronic device are shielded by the light-emitting elements, the reflection of ambient light can also be reduced to improve image performance.

The above description is only an embodiment of the present invention, and is not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and changes. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.

Claims (10)

1. A light-emitting element, characterized in that, comprising: a packaging substrate; A first light emitting diode chip arranged on the packaging substrate; an encapsulation material disposed on the LED chip and the encapsulation substrate; and a light blocking layer disposed on the encapsulation material, the light blocking layer has a first opening; Wherein in a plan view direction, the area of the first opening is smaller than the area of the light emitting element. 2. The light-emitting element according to claim 1, wherein the light-blocking layer comprises a light-reflecting layer and a light-absorbing layer, wherein the light-reflecting layer is arranged between the light-absorbing layer and the packaging material between. 3. The light emitting element according to claim 1, wherein the position of the first opening corresponds to the position of the first light emitting diode chip. 4. The light-emitting element according to claim 1, further comprising a second light-emitting diode chip disposed on the packaging substrate, in a plan view direction, the first opening and the first light-emitting The diode chip overlaps with at least a part of the second LED chip. 5. The light-emitting element according to claim 1, further comprising a second light-emitting diode chip disposed on the package substrate, the light-blocking layer comprising a second opening, and the second The opening is arranged corresponding to the second LED chip. 6 . The light emitting device according to claim 1 , further comprising a plurality of scattering particles, diffusing particles, reflecting particles, refracting particles, other light-adjustable particles or combinations thereof disposed in the encapsulating material. 7 . The light emitting element according to claim 1 , wherein the first opening exposes a part of the encapsulation material, and the surface of the part of the encapsulation material has a microstructure. 8 . The light emitting element according to claim 1 , wherein an inner angle between the packaging substrate and the light blocking layer is greater than 90 degrees. 9. An electronic device, characterized in that it comprises: a main substrate, including a circuit and a plurality of connection pads, the circuit and the plurality of connection pads are disposed on the surface of the main substrate; and A light-emitting element, disposed on the main substrate and electrically connected to at least one of the plurality of connection pads, the light-emitting element includes: a packaging substrate; A light emitting diode chip, arranged on the packaging substrate; an encapsulation material disposed on the LED chip and the encapsulation substrate; and a light blocking layer, disposed on the encapsulation material and having an opening; Wherein in a plan view direction, the area of the opening is smaller than the area of the light emitting element. 10 . The electronic device according to claim 9 , wherein, in a plan view direction, the light emitting element overlaps with the plurality of connection pads to which it is electrically connected. 11 .