CN110401005A - Encapsulated antenna, preparation method thereof, and mobile communication terminal - Google Patents

Abstract

The embodiment of the invention discloses a packaged antenna, a preparation method thereof, and a mobile communication terminal. The antenna package includes a first substrate and a second substrate, the first substrate and the second substrate are in contact with each other and connected by an adhesive material; the cavity wall of the first substrate is provided with a glue overflow hole, and the glue overflow hole penetrates the first substrate ; The connection between the welding surface of the second substrate and the cavity surface is provided with a solder resist structure; the adhesive material is arranged on the welding surface, and the adhesive material is connected with the second surface of the first substrate and extends into the glue overflow hole. Use the glue overflow hole to absorb excess adhesive material to avoid the impact of the adhesive material on the abutment and distance between the first substrate and the second substrate; the solder resist structure prevents the adhesive material from flowing into the cavity to ensure the reliability of the antenna sex. Using the glue overflow hole combined with the solder resist structure effectively solves the process problems of redundant adhesive material polluting the antenna area and difficult control of the thickness of the adhesive material. The adhesive material forms a rivet structure, which makes the connection between the first substrate and the second substrate firm and reliable.

Description

Encapsulated antenna, preparation method thereof, and mobile communication terminal

technical field

The invention relates to the field of antenna structures, in particular to a packaged antenna, a preparation method thereof, and a mobile communication terminal.

Background technique

With the advent of the high-speed communication era such as 5G and VR, millimeter wave communication has gradually become the mainstream, and the design and application requirements of millimeter wave antennas are becoming more and more vigorous. Since the length of the transmission path in the millimeter-wave frequency band has a great impact on the signal amplitude loss, the traditional IC+PCB+antenna architecture model has gradually been unable to meet the high-performance requirements. The IC+package antenna architecture has become the mainstream, which is AiP (Antenna in Package, package antenna integration) technology. Generally, high antenna gain is not obtained, and an antenna array is generally used. In the AiP architecture, the antenna feeder path is extremely short, so that the EIRP (Equivalent Isotropic Radiated Power, equivalent isotropic radiated power) value of the wireless system can be maximized, which is conducive to wider coverage. In addition, the wavelength of the millimeter-wave frequency band is extremely short, and the electrical performance is very sensitive to processing errors. If the manufacturing accuracy is not good, there will be impedance mismatch and signal reflection. The traditional PCB processing technology can no longer meet the requirements of millimeter-wave processing accuracy. Therefore, the packaging processing technology with higher processing precision has played a greater value.

AiP antenna array technology will gradually become the mainstream antenna technology for 5G and millimeter wave high-speed communication systems, with broad application space and market space prospects. In the existing AIP technology, the dual-substrate packaging structure that realizes the 10G-40GHz band millimeter-wave antenna and antenna array in the package is mainly composed of an upper substrate and a lower substrate. The distance between the upper substrate and the lower substrate varies with the frequency of the antenna. Different, the lower the antenna frequency, the greater the distance between the two antenna radiation pieces, so how to control the height between the upper substrate and the lower substrate is a key technical point. In the prior art, the upper substrate and the lower substrate are soldered using solder balls or other viscous materials. After soldering, the solder balls or other viscous materials are located between the upper substrate and the lower substrate, and there is thermal instability in bonding with solder balls, resulting in The distance between the upper and lower substrates is unstable; in addition, the viscous material is easy to enter the cavity, forming overflow pollution, so that there is both gas and bonding material in the cavity, which will change the cavity and be affected by the dielectric constant of the bonding material , thereby affecting the performance of the antenna, and it is difficult to control the thickness of the adhesive layer, and the process cost is high.

Contents of the invention

The technical problem to be solved by the embodiments of the present invention is to provide a packaged antenna and its preparation method, and a mobile communication terminal, which can ensure the reliability of the antenna and avoid the problem of glue overflow pollution of the adhesive material.

In a first aspect, an embodiment of the present invention provides a packaged antenna, including a first substrate and a second substrate, the first substrate and the second substrate are stacked, and the two are in contact and connected by an adhesive material;

The first substrate has a first plate surface and a second plate surface arranged opposite to each other, the second plate surface is arranged facing the second substrate, a cavity is provided on the first substrate, and a cavity of the cavity The opening is located on the second board surface and faces the second substrate, and a glue overflow hole is provided on the cavity wall of the cavity, and the glue overflow hole runs through the first board surface and the second board surface;

The second substrate has a third plate surface facing the first substrate, the third plate surface includes a cavity surface and a welding surface, the cavity surface is arranged opposite to the cavity, and the welding surface is opposite to the cavity. The cavity walls of the cavity are arranged oppositely, and a solder resist structure is provided at the connection between the welding surface and the cavity surface;

The adhesive material is arranged on the welding surface, the adhesive material is arranged opposite to the glue overflow hole, the adhesive material is connected with the second board surface and extends into the glue overflow hole.

In the first possible implementation manner of the first aspect, a pad is provided at a position corresponding to the glue overflow hole on the welding surface, and the adhesive material is provided on the pad; A pad is provided on the surface, which can enhance the connection strength between the adhesive material and the second substrate;

The solder resist structure and the pad are arranged at intervals, so that there is a gap between the two, so as to increase the flow range of the adhesive material, increase the connection area between the adhesive material and the pad, improve the connection strength, and reduce the impact of the adhesive material on the pad. The effect of the spacing between the first substrate and the second substrate;

Alternatively, the solder resist structure covers the edge of the pad; to prevent the adhesive material from flowing out of the solder resist structure, all excess adhesive material flows into the glue overflow hole.

In the second possible implementation of the first aspect, the adhesive material is directly connected to the welding surface; the adhesive material can be used to directly realize the fixed connection between the first substrate and the second substrate, simplifying the processing technology, Reduce processing costs.

In a third possible implementation manner of the first aspect, the solder resist structure is annular, the solder resist structure is arranged opposite to the glue overflow hole, and the inner diameter of the solder resist structure is larger than the glue overflow hole The inner diameter of the solder mask structure can be used to reduce the flow range of the solder mask structure, so that the bonding material is surrounded by the solder mask structure within a certain range, effectively preventing the bonding material from polluting the cavity;

Alternatively, the solder resist structure is a strip arranged along the cavity wall, and the adhesive material can move along the extension direction of the cavity wall, which can increase the overflow range of the adhesive material, thereby reducing the impact on the first substrate and Influence of the distance between the second substrates.

In the fourth possible implementation of the first aspect, the adhesive material is arranged at intervals from the solder resist structure, which can reduce the amount of adhesive material used, and avoid excessive bonding material causing the adhesive material to pass over the solder resist structure. and affect the performance of the antenna.

In a fifth possible implementation manner of the first aspect, the solder resist structure is made of a solder resist material; the solder resist material can further prevent the adhesive material from entering the cavity.

In combination with any of the foregoing possible implementation manners, in the sixth possible implementation manner of the first aspect, the glue overflow hole is a stepped hole, and the glue overflow hole includes a first segment hole and a second segment hole, the The inner diameter of the first section hole is smaller than the inner diameter of the second section hole, the first section hole is closer to the second substrate relative to the second section hole, the adhesive material is filled in the first section hole and Extending to the second section of hole; using the bonding material can have rivet structures at both ends, further improving the connection strength, and through the second section of hole with a larger diameter, more bonding material can be accommodated.

In a seventh possible implementation manner of the first aspect, the second board surface abuts against the solder resist structure; so that the first substrate and the second substrate abut against each other, so that a height distance between the two remains constant.

In the eighth possible implementation of the first aspect,

The second substrate has a fourth plate surface, and the fourth plate surface is disposed opposite to the third plate surface;

The packaged antenna further includes a chip, and the chip is connected to the fourth board. Through the cooperation of the antenna pattern and the chip, the packaged antenna can reach the preset frequency band.

In a second aspect, the present invention provides a mobile communication terminal, the mobile communication terminal having the aforementioned packaged antenna.

In a third aspect, the present invention provides a method for preparing a packaged antenna, which is used to prepare the aforementioned packaged antenna, and the method for preparing the packaged antenna includes:

A first substrate is provided, the first substrate has a first plate surface and a second plate surface arranged opposite to each other, a cavity is provided on the first substrate, and the opening of the cavity is located on the second plate surface , the cavity wall of the cavity is provided with a glue overflow hole, and the glue overflow hole runs through the first board surface and the second board surface;

A second substrate is provided, the second substrate has a third plate surface, the third plate surface includes a cavity surface and a welding surface, and a solder resist structure is provided at the connection between the welding surface and the cavity surface;

providing an adhesive material on the welding surface;

The opening of the cavity faces the second substrate, the glue overflow hole of the first substrate is aligned with the adhesive material, and then the first substrate is pasted on the second substrate so that the two abutting against each other, the adhesive material is connected with the second board surface and extends into the glue overflow hole.

In a first possible implementation manner of the third aspect, the step of providing a first substrate further includes the following substeps:

providing a copper clad laminate, the copper clad laminate having a first surface and a second surface oppositely disposed;

disposing an antenna pattern on the first surface;

screen printing a resin layer on the second surface, and baking to form a cavity wall, and the cavity wall is surrounded to form a cavity;

A glue overflow hole is drilled at the position of the cavity wall, and the glue overflow hole penetrates the copper clad laminate and the resin layer. By screen printing the resin layer, the problems of low production efficiency and high cost of the first substrate can be solved.

In a second possible implementation manner of the third aspect, the steps of screen-printing and baking the resin layer on the second surface are repeated multiple times to achieve a preset thickness and to achieve the application frequency and performance of the antenna.

In a third possible implementation manner of the third aspect, in the step of disposing the adhesive material on the concave welding surface, dispensing the adhesive material on the welding surface by dispensing, the adhesive material The diameter is larger than the diameter of the glue overflow hole; so that the adhesive material can be bonded to the second board surface, and the connection strength between the first substrate and the second substrate is improved.

In a fourth possible implementation manner of the third aspect, in the step of providing an adhesive material on the concave welding surface, a gap is provided between the adhesive material and the solder resist structure; Too much will cause the bonding material to cross the solder mask structure during the placement process and cause pollution.

By implementing the embodiment of the present invention, by abutting the first substrate and the second substrate, the distance between the two can be guaranteed to be a fixed value, and the reliability of the antenna can be ensured; Connected, the first substrate and the second substrate can be fixedly connected together, and the excess adhesive material can be absorbed by using the glue overflow hole, so as to avoid the influence of the adhesive material on the direct contact between the first substrate and the second substrate; The welding structure can prevent the adhesive material from flowing to the cavity area, prevent the adhesive material from entering the cavity, so that the dielectric constant in the cavity will not be affected by the adhesive material, and prevent the adhesive material from adhering to the second Radiating sheet, so as to effectively ensure the reliability of the antenna; using the glue overflow hole combined with the solder resist structure, effectively solves the technical problems of the redundant adhesive material polluting the antenna area and the difficult control of the thickness of the adhesive material, and the adhesive material is connected to the second board surface And enter into the glue overflow hole, so that the adhesive material can form a rivet structure, and play a better role in welding the first substrate and the second substrate.

Description of drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the background technology, the following will describe the drawings that need to be used in the embodiments of the present invention or the background technology.

Fig. 1 is a schematic structural diagram of an antenna package provided by a preferred embodiment of the present invention;

Fig. 2 is a schematic enlarged view of the structure at A in Fig. 1;

Fig. 3 is the enlarged schematic diagram of the structure at B place in Fig. 1;

Fig. 4 is the enlarged schematic view of the structure at C in Fig. 1;

Fig. 5 is a schematic structural view of another embodiment of the glue overflow hole of the packaged antenna in the present invention;

6 to 9 are schematic diagrams of the process of the first preparation method of the first substrate for encapsulating the antenna in the present invention;

10 to 13 are process schematic diagrams of the second preparation method of the first substrate for encapsulating the antenna in the present invention;

14 to 18 are schematic diagrams of the process of the third preparation method of the first substrate for encapsulating the antenna in the present invention;

Fig. 19 is a schematic structural diagram of a second substrate with an antenna package in the present invention;

Fig. 20 is a schematic structural view after an adhesive material is disposed on the second substrate;

Fig. 21 is a schematic structural view of the bonding of the first substrate and the second substrate in the present invention;

FIG. 22 is a schematic structural diagram after a chip is disposed on the second substrate in FIG. 21;

FIG. 23 is a schematic diagram of the structure after planting BGA balls on the second substrate in FIG. 22 .

Detailed ways

Embodiments of the present invention will be described below with reference to the drawings in the embodiments of the present invention.

Please refer to FIG. 1. FIG. 1 is a packaged antenna provided by an embodiment of the present invention, which includes a first substrate 100 and a second substrate 200. The first substrate 100 and the second substrate 200 are stacked. The material 300 is connected. By abutting the first substrate 100 and the second substrate 200, the distance between the two can be guaranteed to be a fixed value. reliability.

The first substrate 100 has a first plate surface 100a and a second plate surface 100b disposed opposite to each other. The first board surface 100 a is disposed away from the second substrate 200 , and the first board surface 100 a may be provided with an antenna pattern, and the antenna pattern includes a first radiation sheet 109 . The second plate surface 100b is arranged towards the second substrate 200, the first substrate 100 is provided with a cavity 10, the cavity 10 is a groove structure arranged at the second plate surface 100b, and the opening of the cavity 10 is located on the second plate surface 100b and facing the second substrate 200 , the cavity wall 101 of the cavity 10 is provided with a glue overflow hole 102 , and the glue overflow hole 102 penetrates the first plate surface 100 a and the second plate surface 100 b. The second substrate 200 has a third plate surface 200a facing the first substrate 100, the third plate surface 200a includes a cavity surface 210a and a welding surface 220a, the cavity surface 210a is provided with a second radiation sheet 209, the cavity surface 210a and The cavities 10 are oppositely disposed, and the cavities 10 are located between the first radiation sheet 109 and the second radiation sheet 209 . The cavity 10 can be filled with air with a low dielectric constant, and the signal radiation can be realized by utilizing the interaction between the first radiating sheet 109 and the second radiating sheet 209 and the cavity 10 . In this embodiment, a first radiating sheet 109 and a second radiating sheet 209 are correspondingly provided at the position of the cavity 10 , of course, in other implementation manners, the corresponding first radiating sheet 109 and the second radiating sheet The number of the two radiating sheets 209 can be specifically determined as required.

The welding surface 220a is disposed opposite to the cavity wall 101 of the cavity 10 , and a solder resist structure 201 is provided at the junction of the weld surface 220a and the cavity surface 210a, and the solder resist structure 201 protrudes from the third board surface. The adhesive material 300 is disposed on the welding surface 220 a, and the adhesive material 300 is disposed opposite to the glue overflow hole 102 . The adhesive material 300 is connected to the second board surface 100 b and extends into the glue overflow hole 102 .

The bonding material 300 is connected to the second board surface 100b and the welding surface 220a, so that the first substrate 100 and the second substrate 200 can be fixedly connected together, and the excess bonding material 300 can be absorbed by the glue overflow hole 102 to avoid bonding. The material 300 influences the direct contact between the first substrate 100 and the second substrate 200 .

The solder resist structure 201 can prevent the adhesive material 300 from flowing to the cavity 10, prevent the adhesive material 300 from entering the cavity 10, so that the dielectric constant in the cavity 10 will not be affected by the adhesive material 300, and make the adhesive The bonding material 300 will not adhere to the second radiation sheet 209, thereby effectively ensuring the reliability of the antenna.

Utilizing the glue overflow hole 102 combined with the solder resist structure 201 effectively solves the technical problems of the redundant adhesive material 300 polluting the antenna area and the difficulty in controlling the thickness of the adhesive material 300. The adhesive material 300 is connected to the second board surface 100b and enters the overflow glue In the hole 102 , the adhesive material 300 can form a rivet structure, which can better weld the first substrate 100 and the second substrate 200 .

In this embodiment, there are multiple cavities 10 on the first substrate 100, and the multiple cavities 10 are arranged at intervals, and two adjacent cavities 10 are separated by a cavity wall 101, and the multiple cavities 10 can be arranged in a matrix , there are four cavities 10 shown in the sectional view shown in FIG. 1 . Here, the number of cavities 10 is not limited to that shown in FIG. 1 , and the number of cavities 10 can be determined according to the performance of the antenna.

At least three cavity walls 101 are formed between the four cavities 10 , and glue overflow holes 102 are provided on the three cavity walls 101 . More specifically, the structures of the corresponding positions of the second substrate 200 corresponding to the three glue overflow holes 102 are different, forming three different implementation manners. In addition, in other embodiments, the structures of the corresponding positions of the second substrate 200 corresponding to the three glue overflow holes 102 may be the same, so as to facilitate processing and preparation and reduce production costs.

As shown in Figure 2, at the position of the first glue overflow hole 102, that is, at A, a welding pad 202 is arranged at a position corresponding to the glue overflow hole 102 on the welding surface 220a, and the bonding material 300 is arranged on the welding pad 202 Above, the solder resist structure 201 is spaced apart from the pad 202 . The connection strength between the adhesive material 300 and the second substrate 200 can be enhanced by disposing the pad 202 on the soldering surface 220a. The solder resist structure 201 and the pad 202 are arranged at intervals, so that there is a gap 203 between them, so as to increase the flow range of the adhesive material 300, increase the connection area between the adhesive material 300 and the pad, improve the connection strength, and reduce the adhesion. Effect of the bonding material 300 on the distance between the first substrate 100 and the second substrate 200 .

As shown in Figure 3, at the position of the second glue overflow hole 102, that is, at B, a welding pad 202 is arranged at a position corresponding to the glue overflow hole 102 on the welding surface 220a, and the bonding material 300 is arranged on the welding pad 202 Above, the solder resist structure 201 covers the edge of the pad 202 to prevent the adhesive material 300 from flowing out of the solder resist structure 201 , and all excess adhesive material 300 flows into the glue overflow hole 102 .

As shown in FIG. 4 , at the position C of the third glue overflow hole 102, the bonding material 300 is directly connected to the welding surface 220a, and the bonding material 300 can be used to directly realize the connection between the first substrate 100 and the second substrate 200. The fixed connection between them simplifies the processing technology and reduces the processing cost.

In the above-mentioned embodiment at the position of the three solder resist structures 201, the shape of the solder resist structure 201 can be annular, the solder resist structure 201 is arranged opposite to the glue overflow hole 102, and the inner diameter of the solder resist structure 201 is larger than the glue overflow hole 102 In order to facilitate the connection of the bonding material 300 with the second board surface 100b, the flow range of the solder resisting structure 201 can be reduced by using the annular solder resisting structure 201, so that the bonding material 300 is surrounded by the solder resisting structure 201 Within a certain range, the cavity 10 is effectively prevented from being polluted by the bonding material 300 . Here, in other embodiments, the solder resist structure 201 can also be strips arranged along the cavity wall 101 of the cavity 10, and the adhesive material 300 can move along the extending direction of the cavity wall 10, which can increase the overflow of the adhesive material. glue range, thereby reducing the impact on the distance between the first substrate and the second substrate; it is only necessary to use the solder resist structure 201 to prevent the adhesive material 300 from flowing to the cavity 10 .

In this embodiment, the solder resist structure 201 is made of solder resist material. The solder resist material can be solder resist ink or solder resist such as green oil used for circuit boards, and the solder resist material can be directly coated on the third board surface 200a. A solder resist structure is formed; alternatively, the solder resist structure 201 is a protrusion provided on the third board surface 200a, and a solder resist material is coated on the surface of the protrusion. Using a solder resist material can further prevent the adhesive material 300 from entering the cavity 10 .

The adhesive material 300 and the solder resist structure 201 are arranged at intervals, which can reduce the amount of the adhesive material 300 , and prevent the excessive adhesive material 300 from causing the adhesive material 300 to pass over the solder resist structure 201 and affect the performance of the antenna.

In this embodiment, as shown in FIG. 2 to FIG. 4 , the second board surface 100b abuts against the solder resist structure 201, so that the first substrate 100 and the second substrate 200 abut against each other, so that the height distance between them remains fixed. Here, in other embodiments, a protrusion may be provided on the second plate surface 100b, and the protrusion abuts against the third plate surface 200a of the second substrate 200, or a protrusion may be provided on the third plate surface 200a, and the protrusion may It is only necessary to abut against the second surface on the first substrate 100 to ensure that the first substrate 100 and the second substrate 200 are in contact with each other; or, the second surface is also provided with a solder resist structure at the edge of the cavity. , the solder resist structure on the second board is in contact with the solder resist structure on the third board, so that the first substrate and the second substrate are in contact with each other, and the solder resist structure on the second board can further prevent sticking The material flows into the cavity.

The second substrate 200 has a fourth board surface 200b, which is disposed opposite to the third board surface 200a; the packaged antenna further includes a chip 400, and the chip 400 is connected to the fourth board surface 200b. Through the cooperation of the first radiating sheet 109 , the cavity 10 , the second radiating sheet 209 and the chip 400 , the packaged antenna can reach a preset frequency band and exert its performance.

In the above embodiment, the glue overflow hole 102 is a straight through hole. In addition, in other embodiments, as shown in FIG. The second section hole 102b, the inner diameter of the first section hole 102a is smaller than the inner diameter of the second section hole 102b, the first section hole 102a is closer to the second substrate 200 relative to the second section hole 102b, the bonding material 300 is filled in the first section hole 102a and Extending to the second section of hole 102b, the bonding material 300 can be riveted at both ends to further improve the connection strength, and more bonding material 300 can be accommodated through the second section of hole 102b with a larger diameter. Here, a chamfer may also be provided at the edge of the glue overflow hole 102 facing the second substrate 200 to facilitate the adhesive material 300 entering into the glue overflow hole 102 .

The present invention provides a mobile communication terminal, which has the aforementioned packaged antenna.

The present invention also provides a preparation method for the aforementioned packaged antenna, the preparation method comprising:

Step 10, providing a first substrate, the first substrate has a first plate surface and a second plate surface arranged opposite to each other, an antenna pattern is provided on the first substrate, and the antenna pattern includes a first radiation sheet; the first A cavity is provided on the substrate, the opening of the cavity is located on the second plate surface, the cavity is a groove structure provided on the second plate surface, and the position of the cavity and the first radiation sheet Correspondingly, a glue overflow hole is provided on the wall of the cavity, and the glue overflow hole runs through the first board surface and the second board surface. Here, it can be understood that the position corresponding to the cavity and the first radiation sheet means that the cavity and the first radiation sheet are arranged along the thickness direction of the first substrate.

In the first specific implementation manner of this step 10, as shown in FIG. 6 to FIG. 9 , the following sub-steps are further included.

Step 111 , as shown in FIG. 6 , provides a copper clad laminate 11 having a first surface 11 a and a second surface 11 b opposite to each other.

In step 112 , as shown in FIG. 6 , an antenna pattern is arranged on the first surface 11 a of the copper clad laminate 11 , and a first radiation sheet 109 is formed. In this step, the antenna pattern can be set on the first surface 11 a of the copper clad laminate 11 through the existing equipment and conditions of the substrate factory or the printed circuit board factory.

Step 113 , as shown in FIG. 7 , screen-prints the resin layer 12 on the second surface 11 b of the copper clad laminate 11 and bakes it to form the cavity wall 101 , and the cavity 10 is surrounded by the cavity wall 101 . The positions of the cavity wall 101 and the cavity 10 can be determined according to the position of the first radiation sheet 109 . In this step, the resin layer may be formed by silk screen printing or stencil printing. As shown in Figure 8, a single printing may not be able to reach the preset thickness, and this step can be repeated, printing and baking multiple times until the preset thickness is reached. The preset thickness can be determined according to the application frequency and performance of the antenna.

Step 114 , drilling a glue overflow hole 102 at the position of the cavity wall 101 , and the glue overflow hole 102 penetrates the copper clad laminate 11 and the resin layer 12 .

Through the above steps, the first substrate 100 can be processed and formed, and the problem of low production efficiency and high cost of the first substrate 100 can be solved by screen printing the resin layer.

In the second specific implementation manner of step 10, as shown in FIG. 10 to FIG. 13 , the following sub-steps may also be included.

Step 121 , as shown in FIG. 10 , provides a copper clad laminate 11 having a first surface 11 a and a second surface 11 b opposite to each other.

Step 122, as shown in FIG. 10 , arrange antenna patterns on the first surface 11a. In this step, the antenna pattern can be set on the first surface 11a of the copper clad laminate 11 through the existing equipment and conditions of the substrate factory or the printed circuit board factory, and the first radiation sheet 109 can be formed.

Step 123, as shown in FIG. 11 , prepares a photosensitive dielectric material, and uses a vacuum film laminating machine to attach the photosensitive dielectric material to the second surface 11b of the copper clad laminate 11 to form a photosensitive dielectric material layer 13. The photosensitive dielectric material layer 13 The thickness depends on the application frequency and performance of the antenna.

Step 124 , as shown in FIG. 12 , uses exposure and development equipment to remove the photosensitive dielectric material layer 13 in the area corresponding to the first radiation sheet 109 of the antenna pattern to form the cavity 10 and its cavity wall 101 .

Step 125 , as shown in FIG. 13 , drills a glue overflow hole 102 at the position of the cavity wall 101 , and the glue overflow hole 102 penetrates the photosensitive dielectric material layer 13 and the copper clad laminate 11 .

In a third specific implementation manner of step 10, as shown in FIG. 14 to FIG. 18 , the following sub-steps may also be included.

Step 131 , as shown in FIG. 14 , provides two thicknesses of copper clad laminates, the first copper clad laminate CCL1 and the second copper clad laminate CCL2 , and the low fluidity adhesive prepreg PPG. The thicknesses of the three depend on the performance of the antenna to be manufactured.

In step 132, the following conventional process is performed on the first copper-clad laminate CCL1 and the second copper-clad laminate CCL2 of the three materials, as well as the low-fluidity pasted prepreg PPG.

As shown in FIG. 15, an antenna pattern is formed on the first surface CCL1a of the first copper clad laminate CCL1.

As shown in FIG. 16 , the antenna area of the second copper clad laminate CCL2 corresponding to the first copper clad laminate CCL1 is hollowed out by mechanical drilling and edge milling equipment to form a cavity 10 and its cavity wall 101 .

Step 133, as shown in FIG. 17 , use the prepreg PPG to bond the first copper clad laminate CCL1 and the second copper clad laminate CCL2 together through lamination, and the second copper clad laminate CCL2 is bonded to the second surface CCL1b of the first copper clad laminate CCL1 place.

Step 134 , as shown in FIG. 18 , drills a glue overflow hole 102 at the position of the cavity wall 101 , and the glue overflow hole 102 penetrates the first copper clad laminate CCL1 , the prepreg PPG and the second copper clad laminate CCL2 .

In the above embodiments, the antenna pattern can be prepared first to form the first radiation sheet, and then the cavity and its cavity wall can be prepared and formed according to the position of the first radiation sheet; of course, in other embodiments, it is also possible to prepare The cavity and its cavity wall are formed, and the first radiation sheet is prepared and formed according to the position of the cavity.

Step 20, as shown in Figure 19, provides a second substrate 200, the second substrate 200 has a third plate surface 200a, the third plate surface 200a includes a cavity surface 210a and a welding surface 220a, the cavity surface 210a is provided with a first For the second radiation sheet, a solder resist structure 201 is provided at the joint between the solder surface 220a and the cavity surface 210a, and the solder resist structure 201 protrudes from the third plate surface 200a. The position of the cavity surface 210a and the welding surface 220a can be determined and designed in combination with the position of the antenna pattern, the position of the cavity and its cavity wall, and the position of the glue overflow hole and the position of the solder resist structure can be determined according to the position to be welded.

The main part of the second substrate 200 can be manufactured using a conventional process. In this embodiment, the second substrate 200 has a multi-layer structure. Specifically, it can be a six-layer structure substrate. It can be adjusted according to wiring and performance requirements. The number is not limited to the six-layer structure, and the number of layers can be reduced or increased. After the main part of the second substrate 200 is prepared, a solder resist structure is provided on the third surface of the second substrate 200 according to the position of the glue overflow hole. The solder resist structure can be prepared and formed by coating a solder resist material.

The order of the above step 10 and step 20 can be in no particular order.

Step 30, as shown in FIG. 20 , disposing an adhesive material 300 on the welding surface 220a. The adhesive material 300 may be disposed on the welding surface 220a by dispensing. Here, in other embodiments, the stencil printing process can also be used to apply the glue, and the viscous material can be: copper paste, solder paste, silver glue, low fluidity viscous resin glue, and the like.

Preferably, the diameter of the adhesive material 300 is larger than the diameter of the glue overflow hole 102, so that the adhesive material 300 can be bonded to the second board surface 100b, and the connection strength between the first substrate and the second substrate is improved.

In this step, a gap may be provided between the adhesive material 300 and the solder resist structure 201 , so as to prevent the adhesive material 300 from passing over the solder resist structure 201 to cause pollution due to too much adhesive material 300 during the placement process.

Step 40, as shown in FIG. 21 , orient the opening of the cavity 10 toward the second substrate 200 , align the glue overflow hole 102 of the first substrate 100 with the adhesive material 300 , and then attach the first substrate 100 to the second substrate 200 and make the two abut against each other, the adhesive material 300 is connected with the second board surface and extends into the glue overflow hole 102 . Here, the first substrate 100 can be aligned and bonded to the second substrate 200 by using a chip-on-chip device.

Step 50 , as shown in FIG. 22 , attaches the chip 400 on the fourth surface 200 b of the second substrate 200 using a conventional flip-chip process.

Step 60, as shown in FIG. 23 , implants BGA (BallGrid Array, Ball Grid Array) balls 500 on the fourth surface 200b of the second substrate 200 using conventional technology, so as to facilitate the connection of the entire antenna package to components such as circuit boards.

In the packaged antenna provided by the present invention and the preparation method thereof, the first substrate 100 and the second substrate 200 are bonded with an adhesive material. The pressure when connecting the second substrate 200 squeezes the adhesive material 300 into the glue overflow hole 102 , and then forms a rivet-like structure, which plays a good role in bonding the first substrate 100 and the second substrate 200 . Chips and BGA balls are packaged and mounted according to conventional processes. The cavity 10 between the first substrate 100 and the second substrate 200 is highly stable, and can still maintain good stability even after multiple high-temperature thermal cycles. The glue overflow hole 102 of the first substrate 100 effectively absorbs the excess adhesive material 300 , effectively solving the technical problems of the glue overflow polluting the antenna area and the difficulty in controlling the thickness of the viscous substance. At the same time, the overflowing glue and the glue on the second board surface 100 b together form a rivet structure, which plays a good role in welding the first substrate 100 and the second substrate 200 .

The above embodiments do not limit the protection scope of the technical solution. Any modifications, equivalent replacements and improvements made within the spirit and principles of the above implementation methods shall be included in the protection scope of the technical solution.

Claims (15)

1. A packaged antenna, characterized in that it includes a first substrate and a second substrate, the first substrate and the second substrate are stacked, and the two are in contact and connected by an adhesive material; The first substrate has a first board surface and a second board surface arranged opposite to each other, an antenna pattern is arranged on the first substrate, and the antenna pattern includes a first radiation sheet; the second board surface faces the The second substrate is provided, the first substrate is provided with a cavity, the cavity is a groove structure arranged at the second plate surface, the opening of the cavity is located on the second plate surface and faces For the second substrate, a glue overflow hole is provided on the wall of the cavity, and the glue overflow hole runs through the first board surface and the second board surface; The second substrate has a third plate surface facing the first substrate, the third plate surface includes a cavity surface and a welding surface, the cavity surface is provided with a second radiation sheet; the cavity surface Set opposite to the cavity, the cavity is located between the first radiating sheet and the second radiating sheet; the welding surface is set opposite to the cavity wall of the cavity, the welding surface and the A solder resist structure is provided at the joint of the cavity surface, and the solder resist structure protrudes from the third board surface; The adhesive material is arranged on the welding surface, the adhesive material is arranged opposite to the glue overflow hole, the adhesive material is connected with the second board surface and extends into the glue overflow hole. 2. The packaged antenna according to claim 1, wherein a pad is provided at a position corresponding to the glue overflow hole on the welding surface, and the bonding material is provided on the pad; The solder resist structure is spaced apart from the pad, or the solder resist structure covers the edge of the pad. 3. The packaged antenna according to claim 1, wherein the adhesive material is directly connected to the soldering surface. 4. The packaged antenna according to claim 1, wherein the solder resist structure is annular, the solder resist structure is arranged opposite to the glue overflow hole, and the inner diameter of the solder resist structure is larger than the The inside diameter of the overflow hole; or, The solder resist structure is strip-shaped along the cavity wall of the cavity. 5 . The packaged antenna according to claim 1 , wherein the adhesive material is spaced apart from the solder resist structure. 5 . 6. The packaged antenna according to any one of claims 1-5, wherein the solder resist structure is made of a solder resist material. 7. The packaged antenna according to claim 1, wherein the glue overflow hole is a stepped hole, the glue overflow hole includes a first section hole and a second section hole, and the inner diameter of the first section hole is less than The inner diameter of the second section hole, the first section hole is closer to the second substrate relative to the second section hole, the adhesive material is filled in the first section hole and extends into the second section hole . 8 . The antenna in package according to claim 1 , wherein the second board surface abuts against the solder resist structure. 9 . 9. The packaged antenna according to any one of claims 1, wherein the second substrate has a fourth board, and the fourth board is arranged opposite to the third board; The packaged antenna further includes a chip, and the chip is connected to the fourth board. 10. A mobile communication terminal, characterized in that the mobile communication terminal has the packaged antenna according to any one of claims 1-8. 11. A method for preparing a packaged antenna, characterized in that it is used to prepare the packaged antenna according to any one of claims 1-9, the method for preparing the packaged antenna comprising: A first substrate is provided, the first substrate has a first plate surface and a second plate surface arranged opposite to each other, an antenna pattern is provided on the first substrate, and the antenna pattern includes a first radiation sheet; the first substrate A cavity is provided on a substrate, the cavity is a groove structure provided on the second plate surface, and the cavity corresponds to the position of the first radiation sheet, and the opening of the cavity Located on the second board surface, a glue overflow hole is provided on the cavity wall of the cavity, and the glue overflow hole runs through the first board surface and the second board surface; A second substrate is provided, the second substrate has a third plate surface, the third plate surface includes a cavity surface and a welding surface, the cavity surface is provided with a second radiation sheet; the welding surface and the welding surface A solder resist structure is provided at the joint of the cavity surface; the solder resist structure protrudes from the third plate surface; providing an adhesive material on the welding surface; The opening of the cavity faces the second substrate, the glue overflow hole of the first substrate is aligned with the adhesive material, and then the first substrate is pasted on the second substrate so that the two abutting against each other, the adhesive material is connected with the second board surface and extends into the glue overflow hole. 12. The preparation method of packaged antenna according to claim 11, characterized in that, in the step of providing a first substrate, further comprising the following sub-steps: providing a copper clad laminate, the copper clad laminate having a first surface and a second surface oppositely disposed; disposing an antenna pattern on the first surface; screen printing a resin layer on the second surface, and baking to form a cavity wall, and the cavity wall surrounds to form a cavity; A glue overflow hole is drilled at the position of the cavity wall, and the glue overflow hole penetrates the copper clad laminate and the resin layer. 13 . The method for manufacturing an antenna package according to claim 12 , wherein the steps of silk-screen printing a resin layer on the first board and baking are repeated multiple times to reach a preset thickness. 14 . 14. The preparation method of packaged antenna according to claim 11, characterized in that, in the step of arranging an adhesive material on the welding surface, the adhesive material is arranged on the welding surface by dispensing, so that The diameter of the bonding material is larger than the diameter of the glue overflow hole. 15 . The method for preparing a packaged antenna according to claim 11 , wherein, in the step of disposing an adhesive material on the soldering surface, a gap is provided between the adhesive material and the solder resist structure. 16 .