CN110473857A - Semiconductor element, chip mounter and patch system - Google Patents

Abstract

The present application discloses a semiconductor element, a placement machine and a placement system. The semiconductor element includes a body and an identification point. A plurality of pads are arranged on the front sidewall of the body. The marking points are arranged on the sidewall of the front side where no electronic components are provided, and the marking points are arranged at intervals from the plurality of bonding pads, wherein the marking points on the semiconductor elements of different heights have different colors and/or shapes. According to the semiconductor element of the present application, by arranging identification points on the front side of the body, the identification points can be used to determine the surface on which the pads are located on the body, so that the semiconductor elements can be pasted with the pads, and for different types of semiconductors Components, the shape and/or color of the marking points are different. By identifying the color or shape of the marking points, different types of semiconductor components can be determined, so that the semiconductor components can be accurately mounted on the corresponding motherboard.

Description

Semiconductor components, placement machines and placement systems

technical field

The present application relates to the technical field of electronic equipment, and in particular, to a semiconductor element, a placement machine and a placement system.

Background technique

There are many types of light-sensing ICs (Light ICs, light secondary bodies) installed on the motherboard. Different types of light-sensing ICs only have different heights and the same packaging methods. It is difficult to distinguish the different light-sensing ICs from the appearance. During the placement process of photosensitive ICs, the placement machine cannot distinguish different types of photosensitive ICs. If the photosensitive ICs are mixed when loading, the placement machine is very easy to mount the photosensitive ICs in different places. on the corresponding motherboard, resulting in poor performance of the motherboard. Moreover, the SMT (Surface Mounted Technology, Surface Mount Technology) test cannot be tested, and the test can only be performed after the final assembly is installed, thereby increasing the repair cost of the motherboard.

Application content

The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a semiconductor element, the semiconductor element has the advantage of convenient placement.

The present application also proposes a mounter, which is used for mounting the above-mentioned semiconductor element.

The present application further proposes a placement system, which includes the placement machine as described above.

A semiconductor element according to an embodiment of the present application includes: a body, a front side wall of the body is provided with a plurality of bonding pads; an identification point, the identification point is provided in an area of the front side wall where no electronic components are provided, The identification points are spaced apart from the plurality of bonding pads, wherein the colors and/or shapes of the identification points on semiconductor elements with different heights are different.

According to the semiconductor element of the embodiment of the present application, by setting the identification point on the front side of the body, the identification point can be used to determine the surface on which the pad is located on the body, so that the semiconductor element can be pasted with the pad, and for different types of The shape and/or color of the marking points are different. By identifying the color or shape of the marking points, different types of semiconductor components can be determined, so that the semiconductor components can be accurately mounted on the corresponding motherboard.

According to the mounter according to the embodiment of the present application, the mounter is used for soldering the semiconductor element on the motherboard, and the semiconductor element is the semiconductor element as described above, and the mounter includes: a mark for identifying the identification A point identification device; a control device, the control device is connected to the identification device, the control device determines that the semiconductor element is placed in the forward direction when receiving the identification instruction that the identification device recognizes the identification point, and The control device determines the type of the semiconductor element according to the color and/or shape of the identification point identified by the identification device.

According to the placement machine of the embodiment of the present application, by setting the identification points on the front of the body, the identification points can be used to determine the surface on which the pads are located on the body, so as to use the pads to mount semiconductor components, and for different Types of semiconductor components, the shape and/or color of the marking points are different. By identifying the color or shape of the marking points, different types of semiconductor components can be identified, so that the semiconductor components can be accurately mounted on the corresponding motherboard, so that the patch can be improved. The placement efficiency and accuracy of the machine.

The placement system according to the embodiment of the present application includes: a conveyor belt for conveying the motherboard; and a placement machine, where the placement machine is the placement machine as described above.

According to the patch system of the embodiment of the present application, by setting the identification point on the front of the body, the identification point can be used to determine the surface on which the pad is located on the body, so that the semiconductor element can be patched by using the pad, and for different Types of semiconductor components, the shape and/or color of the marking points are different. By identifying the color or shape of the marking points, different types of semiconductor components can be identified, so that the semiconductor components can be accurately mounted on the corresponding motherboard, so that the patch can be improved. The placement efficiency and accuracy of the system.

Additional aspects and advantages of the present application will be set forth, in part, from the following description, and in part will become apparent from the following description, or may be learned by practice of the present application.

Description of drawings

The above and additional aspects and advantages of the present application will become apparent and readily understood from the following description of embodiments in conjunction with the accompanying drawings, wherein:

FIG. 1 is a schematic structural diagram of a semiconductor element according to an embodiment of the present application;

2 is a schematic structural diagram of a semiconductor element according to an embodiment of the present application;

3 is a schematic structural diagram of a semiconductor element according to an embodiment of the present application;

FIG. 4 is a schematic structural diagram of a patch system according to an embodiment of the present application.

Reference number:

semiconductor element 100,

Main body 1, positioning groove 11, arc surface 12,

pad 2,

identification point 3,

Mounter 200,

control device 201, identification device 202, pick and place device 203,

Patch System 300,

The transmission track 301 , the fixing device 302 , the stopper device 303 , and the carrying jig 304 .

Detailed ways

The following describes in detail the embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, but should not be construed as a limitation on the present application.

In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Rear, Left, Right, Vertical, Horizontal, Top, Bottom, Inner, Outer, Axial, Radial, Circumferential The orientation or positional relationship indicated by etc. is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, with a specific orientation. The orientation configuration and operation are therefore not to be construed as limitations on the present application. Furthermore, features delimited with "first", "second" may expressly or implicitly include one or more of that feature. In the description of this application, unless stated otherwise, "plurality" means two or more.

In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood in specific situations.

As shown in FIGS. 1-3 , a semiconductor element 100 according to an embodiment of the present application includes a body 1 and an identification point 3 .

Specifically, as shown in FIG. 1 to FIG. 3 , a plurality of pads 2 are provided on the front side wall of the main body 1 . The identification point 3 is provided in the area of the side wall of the front side where no electronic components are provided. The identification points 3 are arranged at intervals from the plurality of bonding pads 2 , wherein the colors and/or shapes of the identification points 3 on the semiconductor elements 100 with different heights are different.

It can be understood that the front surface of the body 1 is provided with a plurality of pads 2, and the plurality of pads 2 are all located at the edge of the front surface. The front side is also provided with electronic components and identification points 3 , the identification points 3 avoid the electronic components, and the identification points 3 are spaced apart from the pads 2 . The semiconductor elements 100 of different thicknesses can be distinguished by setting the color or shape or the combination of the color and the shape of the identification point 3 , so that the semiconductor elements 100 of different models can be identified. For example, the identification points 3 can be set to different colors such as red, green, and yellow, and each color can correspond to one model of the semiconductor element 100 . For another example, as shown in FIG. 1 to FIG. 3 , by setting the shape of the identification point 3 to a shape such as a circle, an ellipse, or a polygon, each shape may correspond to a type of semiconductor element 100 . For another example, the combination of color and shape can be used to distinguish different types of semiconductor elements 100 .

According to the semiconductor element 100 of the embodiment of the present application, by setting the identification point 3 on the front side of the body 1 , the identification point 3 can be used to determine the surface on which the pad 2 is located on the body 1 , so as to facilitate the use of the pad 2 for the semiconductor element 100 SMT is performed, and for different types of semiconductor elements 100, the shapes and/or colors of the marking points 3 are different. Patch to the corresponding motherboard.

According to some embodiments of the present application, the identification point 3 is a boss provided on the body 1 . It can be understood that the identification point 3 can be a boss, and the surface of the boss protrudes from the surface of the body 1 . Thus, the setting and identification of the identification point 3 is facilitated. For example, the identification point 3 may be formed as a cylindrical boss, and one end surface of the cylindrical boss is connected with the body 1 . The identification point 3 can also be formed as a teardrop-shaped boss.

In some embodiments of the present application, the bosses are coated with liquid photoresist, and the shapes of the bosses of the semiconductor element 100 with different heights are different. It can be understood that the liquid photoresist is applied on the surface of the boss to cover at least part of the surface of the boss. For example, a region or regions of the surface of the boss may be coated with liquid photoresist. For another example, the surface of the boss is coated with liquid photoresist, and the liquid photoresist covers the entire surface of the boss. Here, it needs to be explained that liquid photoresist, commonly known as green oil, is an acrylic oligomer. Liquid photoresist is a protective layer. Liquid photoresist is coated on the surface of the boss and can be used to protect the boss. The shape of the bosses may represent semiconductor elements 100 of different heights.

According to some embodiments of the present application, the identification point 3 may be a coating applied on the body 1 . It can be understood that the marking point 3 may be a coating, and the coating is a solid continuous film obtained by applying the coating at one time, and the marking point 3 may be used as the marking point 3 by applying a coating on the front surface of the main body 1 . Therefore, the setting of the marking points 3 can be facilitated, and the thickness of the marking points 3 formed by the coating is small, so that the setting size of the marking points 3 can be reduced.

According to some embodiments of the present application, the value range of the height of the identification point 3 is 20-30um. It can be understood that the height of the marking point 3 needs to be controlled between 20 microns and 30 microns. It should be noted that the “height” mentioned here may correspond to the distance between the two ends of the marking point 3 in the thickness direction of the main body 1 . In other words, in the thickness direction of the main body 1 , the distance between the end of the marking point 3 away from the main body 1 and the main body 1 . Thereby, the setting size of the marking point 3 can be reduced, and the installation space of the marking point 3 can be reduced, so that the influence of the setting of the marking point 3 on the thickness of the semiconductor element 100 can be avoided. The effect of the component's settings.

As shown in FIGS. 1-3 , according to some embodiments of the present application, the main body 1 is provided with a positioning groove 11 . It can be understood that the main body 1 can be configured with a positioning groove 11 . The positioning groove 11 can be used for positioning the mounting position of the semiconductor element 100 . For example, when the semiconductor element 100 is mounted on the motherboard, the positioning groove 11 can avoid the electrical elements on the motherboard, and the electrical elements on the motherboard can be used to locate the mounting position of the semiconductor element 100 . For another example, the main board corresponding to the semiconductor element 100 may be provided with positioning protrusions, and the body 1 may be provided with positioning grooves 11 matched with the positioning protrusions. When the semiconductor element 100 is mounted, fast positioning of the semiconductor element 100 can be achieved by the cooperation between the positioning protrusion and the positioning groove 11 , thereby improving the mounting precision and production efficiency.

As shown in FIGS. 1-3 , in some embodiments of the present application, a part of the side wall of the body 1 is concave toward the center of the body 1 to define a positioning groove 11 . It can be understood that the positioning groove 11 is located on the side wall of the main body 1 , and the positioning groove 11 may be a notch formed on the side wall of the main body 1 . Thereby, the installation of the positioning groove 11 can be facilitated, and the installation process of the positioning groove 11 can be simplified. For example, as shown in FIG. 1 , a part of the right side wall of the body 1 may be recessed to the left to form the positioning groove 11 . It should be noted that the positioning grooves 11 may be provided on any side wall of the main body 1 , and may be selected and arranged according to the distribution of the electrical components on the main body 1 .

Further, as shown in FIG. 1 to FIG. 3 , the plurality of pads 2 are divided into two groups along the width direction of the body 1 , and the extending direction of the length of the positioning groove 11 is parallel to the width direction of the body 1 . It can be understood that in the width direction of the main body 1, that is, in the up-down direction as shown in FIG. 1, the front surface of the main body 1 includes an upper side wall and a lower side wall, and the upper side wall and the lower side wall are arranged opposite to each other. A part of the pads 2 of the pads 2 are arranged on the upper side wall, and the other part of the pads 2 are arranged on the lower side wall. The positioning groove 11 may be formed as a long slot body, and the length direction of the long slot body extends along the width direction of the main body 1 . Thereby, the layout of the pads 2 and the positioning grooves 11 can be optimized, so that the installation size of the semiconductor element 100 can be reduced.

For example, as shown in FIG. 1 to FIG. 3 , six pads 2 can be set on the body 1 , and the six pads 2 are divided into two groups, each group of three pads 2 , and the two groups of pads 2 are in the width direction of the body 1 . The three pads 2 in each group are distributed at intervals in the length direction of the body 1 (ie, the left-right direction as shown in FIG. 1 ). Two pads 2 corresponding to the upper and lower sides are arranged in the width direction of the main body 1 facing each other.

Further, as shown in FIGS. 1 to 3 , the length of the positioning groove 11 is greater than the distance between the two groups of pads 2 . Therefore, the size of the positioning slot 11 can be enlarged, and the electrical components on the motherboard can be accommodated in the positioning slot 11 .

As shown in FIGS. 1-3 , in some embodiments of the present application, both ends of the bottom wall of the positioning groove 11 are respectively connected with the remaining side walls of the body 1 through arc surfaces 12 . It can be understood that the positioning groove 11 includes a peripheral wall and a bottom wall, one end of the peripheral wall is connected to the bottom wall, the other end of the peripheral wall is connected to the side wall of the main body 1, and the peripheral wall and the bottom wall smoothly transition. Thereby, the space size of the positioning groove 11 can be enlarged, so that the accommodating space of the positioning groove 11 can be improved.

As shown in FIG. 4 , according to the mounter 200 of the embodiment of the present application, the mounter 200 is used for soldering the semiconductor element 100 on the motherboard, and the semiconductor element 100 is the semiconductor element 100 described above. The mounter 200 includes an identification device 202 and a control device 201 . The identification means 202 can be used to identify the identification point 3 . The control device 201 is connected to the identification device 202. When the control device 201 receives the identification instruction that the identification device 202 identifies the identification point 3, the control device 201 can determine that the semiconductor element 100 is placed in the forward direction, and the control device 201 is based on the identification device 202. The color and/or shape determine the model of the semiconductor element 100 .

According to the placement machine 200 of the embodiment of the present application, by setting the identification point 3 on the front of the body 1, the identification point 3 can be used to determine the surface on which the pad 2 is located on the body 1, so as to facilitate the use of the pad 2 for semiconductor components. 100 for patching, and for different types of semiconductor elements 100, the shapes and/or colors of the marking points 3 are different. By identifying the color or shape of the marking points 3, different types of semiconductor elements 100 can be determined, so as to accurately The ground patch is mounted on the corresponding motherboard, so that the patching efficiency and accuracy of the mounter 200 can be improved.

As shown in FIG. 4 , in an embodiment of the present application, the placement machine 200 may include a pick-and-place device 203 , and the pick-and-place device 203 is connected to the control device 201 in communication. When the placement machine 200 is working, the identification device 202 can identify the model and the front and back of the semiconductor element 100 through the position of the marking point 3, if the model of the semiconductor element 100 does not match the corresponding motherboard and/or the reverse side of the semiconductor element 100 is facing up At this time, the identification device 202 can send an error signal to the control device 201, and the control device 201 can control the pick-and-place device 203 to throw the semiconductor element 100 to a specific position, and can continue to identify the next semiconductor element 100. When the identification device 202 recognizes that the model of the semiconductor element 100 corresponds to the motherboard and the front side is facing up, the identification device 202 can send a correct signal to the control device 201, and the control device 201 can control the pick-and-place device 203 to place the semiconductor element 100 on the motherboard on the corresponding position, thus completing the patch. In some embodiments of the present application, the identification device 202 may be an optical camera, and the pick-and-place device 203 may be a suction nozzle, a suction cup or a friction disc.

As shown in FIG. 4 , a placement system 300 according to an embodiment of the present application includes a conveyor belt 301 and a placement machine 200 . The conveyor belt 301 is used for conveying the motherboard. The mounter 200 is the mounter 200 as described above.

When the placement system 300 is working, the motherboard can be placed on the conveyor belt 301, the conveyor belt 301 can transport the motherboard to a specific position, and the mounter 200 can mount the semiconductor components 100 to the motherboard.

According to the patch system 300 of the embodiment of the present application, by setting the identification point 3 on the front surface of the body 1, the identification point 3 can be used to determine the surface on which the pad 2 is located on the body 1, so as to facilitate the use of the pad 2 for semiconductor components. 100 for patching, and for different types of semiconductor elements 100, the shapes and/or colors of the marking points 3 are different. By identifying the color or shape of the marking points 3, different types of semiconductor elements 100 can be determined, so as to accurately The ground patch is mounted on the corresponding motherboard, so that the patching efficiency and accuracy of the patching system 300 can be improved.

The semiconductor element 100 and the chip mount system 300 according to a specific embodiment of the present application will be described in detail below with reference to FIGS. 1 to 4 . The chip mount system 300 can cover the semiconductor element 100 on a corresponding motherboard. It should be understood that the following description is only exemplary, rather than a specific limitation of the present application.

As shown in FIGS. 1-3 , the semiconductor element 100 is a photosensitive IC, and the semiconductor element 100 includes a body 1 and an identification point 3 . The front surface of the body 1 is provided with six solder pads 2 , and the six solder pads 2 are divided into two groups with three solder pads 2 in each group. The two groups of pads 2 are distributed at intervals in the width direction of the body 1 , the three pads 2 in each group are distributed at intervals in the length direction of the body 1 , and the corresponding two pads 2 in the two groups are in the width direction of the body 1 . Right to the setting.

As shown in FIGS. 1-3 , the marking point 3 is arranged on the front of the main body 1 , and the front side of the main body 1 is also provided with electronic components. The marking point 3 avoids the electronic components, and the marking point 3 is spaced from the pad 2 . The semiconductor elements 100 of different thicknesses can be distinguished by setting the color or shape or the combination of the color and the shape of the identification point 3 , so that the semiconductor elements 100 of different models can be identified.

As shown in FIG. 1 to FIG. 3 , the identification point 3 is a boss provided on the body 1 , and the shape of the boss is different for different types of semiconductor elements 100 . The bosses are coated with liquid photoresist. The value range of the height of the identification point 3 is 20-30um. A part of the right side wall of the main body 1 is recessed toward the left side wall of the main body 1 to form a positioning groove 11 . The positioning groove 11 may be formed in a "C" shape. In the width direction of the body 1 , the length of the positioning groove 11 is greater than the distance between the two groups of pads 2 .

According to the semiconductor element 100 of the embodiment of the present application, by setting the identification point 3 on the front side of the body 1 , the identification point 3 can be used to determine the surface on which the pad 2 is located on the body 1 , so as to facilitate the use of the pad 2 for the semiconductor element 100 SMT is performed, and for different types of semiconductor elements 100, the shapes and/or colors of the marking points 3 are different. Patch to the corresponding motherboard.

As shown in FIG. 2 , the placement system 300 includes a placement machine 200 , a conveyor belt 301 , a fixing device 302 and a stopper device 303 . The placement machine 200 includes a control device 201 , an identification device 202 and a pick-and-place device 203 . The placement machine 200 is connected to the conveyor belt 301 , the fixing device 302 and the stopper device 303 in communication respectively.

Specifically, when the patch system 300 is working, the motherboard can be placed in the carrier jig 304 , and then the carrier jig 304 can be placed on the conveyor belt 301 . The conveyor belt 301 can transport the carrier jig 304 to a specific position, the carrier jig 304 is in contact with the stopper device 303, the stopper device 303 can control the conveyor belt 301 to stop running and the stopper device 303 moves to the bottom of the conveyor belt 301 to avoid the patch Machine 200. The fixing device 302 can clamp the carrier jig 304 and transmit the placement signal to the placement machine 200 . After the placement machine 200 receives the placement signal, it can control the identification device 202 to identify the semiconductor element 100 . If the identification device 202 recognizes that the model of the semiconductor element 100 does not match the corresponding motherboard and/or the reverse side of the semiconductor element 100 is facing up, the identification device 202 can send an error signal to the control device 201, and the control device 201 can control the pick-and-place device 203 The semiconductor element 100 is thrown to a specific position, and the next semiconductor element 100 can be identified. When the identification device 202 recognizes that the model of the semiconductor element 100 corresponds to the motherboard and the front side is facing up, the identification device 202 can send a correct signal to the control device 201, and the control device 201 can control the pick-and-place device 203 to place the semiconductor element 100 on the motherboard on the corresponding position, thus completing the patch. After the motherboard placement is completed, the fixing device 302 can be separated from the carrier jig 304, and the conveyor belt 301 resumes operation and transfers the carrier jig 304 to the set position.

According to the patch system 300 of the embodiment of the present application, by setting the identification point 3 on the front surface of the body 1, the identification point 3 can be used to determine the surface on which the pad 2 is located on the body 1, so as to facilitate the use of the pad 2 for semiconductor components. 100 for patching, and for different types of semiconductor elements 100, the shapes and/or colors of the marking points 3 are different. By identifying the color or shape of the marking points 3, different types of semiconductor elements 100 can be determined, so as to accurately The ground patch is mounted on the corresponding motherboard, so that the patching efficiency and accuracy of the patching system 300 can be improved.

In the description of this specification, reference to the terms "one embodiment," "some embodiments," "exemplary embodiment," "example," "specific example," or "some examples", etc., is meant to incorporate the embodiments A particular feature, structure, material, or characteristic described by an example or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the present application, The scope of the application is defined by the claims and their equivalents.

Claims (12)

1. a kind of semiconductor element characterized by comprising

The front side wall of ontology, the ontology is equipped with multiple pads；

Identification point, the identification point are located at the region for not setting electronic component of the front side wall, the identification point and described more A pad interval setting, wherein the color and/or shape of the identification point on the semiconductor element of different height are different.

2. semiconductor element according to claim 1, which is characterized in that the identification point is to set on the body convex Platform.

3. semiconductor element according to claim 2, which is characterized in that the boss is coated with liquid photopolymerizable solder resist, The shape of the boss of the semiconductor element of different height is different.

4. semiconductor element according to claim 1, which is characterized in that the identification point is to coat on the body Coating.

5. semiconductor element according to claim 1, which is characterized in that the value range of the height of the identification point is 20-30um。

6. semiconductor element according to claim 1, which is characterized in that the ontology is equipped with locating slot.

7. semiconductor element according to claim 6, which is characterized in that a part of the side wall of the ontology is described in The center of ontology is recessed to limit the locating slot.

8. semiconductor element according to claim 7, which is characterized in that the multiple pad is along the width side of the ontology To being divided into two groups, the extending direction of the length of the locating slot is parallel with the width direction of the body part.

9. semiconductor element according to claim 8, which is characterized in that the length of the locating slot is welded greater than described in two groups The spacing distance of disk.

10. semiconductor element according to claim 7, which is characterized in that the both ends of the bottom wall of the locating slot lead to respectively Arcwall face is crossed to be connected with remaining side wall of the ontology.

11. a kind of chip mounter, which is characterized in that the chip mounter is used to semiconductor element being welded on mainboard, described partly to lead Volume elements part is according to semiconductor element of any of claims 1-10, and the chip mounter includes:

The identification device of the identification point for identification；

Control device, the control device are connected with the identification device, and the control device is receiving the identification device Determine that the semiconductor element forward direction is placed when recognizing the identification instruction of the identification point, and the control device is according to The model of semiconductor element described in the color and/or shape decision of the identification point of identification device identification.

12. a kind of patch system characterized by comprising

For transmitting the conveyer belt of mainboard；

Chip mounter, the chip mounter are the chip mounter according to claim 11.