CN110572562B - VCM cell-phone camera module production water line - Google Patents
VCM cell-phone camera module production water line Download PDFInfo
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- CN110572562B CN110572562B CN201911040837.8A CN201911040837A CN110572562B CN 110572562 B CN110572562 B CN 110572562B CN 201911040837 A CN201911040837 A CN 201911040837A CN 110572562 B CN110572562 B CN 110572562B
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- riser
- flexible circuit
- assembly
- circuit board
- connecting block
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 40
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 64
- 239000010959 steel Substances 0.000 claims abstract description 64
- 239000000758 substrate Substances 0.000 claims abstract description 53
- 238000005476 soldering Methods 0.000 claims abstract description 25
- 238000001514 detection method Methods 0.000 claims abstract description 21
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910000679 solder Inorganic materials 0.000 claims abstract description 13
- 238000012360 testing method Methods 0.000 claims abstract description 12
- 238000007650 screen-printing Methods 0.000 claims abstract description 6
- 230000003287 optical effect Effects 0.000 claims description 11
- 239000011159 matrix material Substances 0.000 claims description 10
- 238000007639 printing Methods 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 239000003990 capacitor Substances 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- -1 surface mounting Substances 0.000 claims 1
- 230000002950 deficient Effects 0.000 description 14
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 7
- 230000008569 process Effects 0.000 description 6
- 239000002699 waste material Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 230000011218 segmentation Effects 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
- H04M1/0264—Details of the structure or mounting of specific components for a camera module assembly
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/54—Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
Landscapes
- Engineering & Computer Science (AREA)
- Signal Processing (AREA)
- Multimedia (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a VCM mobile phone camera module production line which comprises a flexible circuit board production device, a first assembly device, a second assembly device, a third assembly device, a fourth assembly device and a fifth assembly device, wherein the flexible circuit board production device sequentially comprises an attaching device, a steel screen printing device, an SPI detection device, a part mounting device, a reflow soldering device, an AOI detection device, a dispensing device, a curing device, an electrical testing device, a substrate dividing device, a board taking device and an appearance detection device from front to back. The production line of the VCM mobile phone camera module has the advantages of reducing the thickness deviation range of empty solder pad soldering tin, reducing labor cost, reducing production difficulty and improving production efficiency.
Description
Technical Field
The invention relates to a production line of a VCM mobile phone camera module.
Background
As camera phones move to high pixels, it is beginning to require auto-focus functionality. In general, a user desires a camera phone of 200 ten thousand pixels or more to have an auto focus function. However, in the conventional manner, the focusing function greatly increases the size of the circuit board and the thickness of the mobile phone, and the pursuit of the electronic products for being small, light and thin is more and more severe in the current age. Thus, VCM is the best choice for cell phone camera modules. VCM (Voice Coil Moto), commonly known as a voice coil motor or a voice coil motor, is used for adjusting the position of a lens to enable the camera to be in the clearest state, has the advantages of small occupied circuit board area, high reliability and capability of supporting high power, can reduce the cost and the volume of a system, and is currently applied to automatic focusing of a mobile phone camera in a large number. At present, the production technology of VCM cell-phone camera module input cost is higher, and soldering tin thickness in the conventional SMT production line depends on steel mesh thickness and solder paste printing equipment parameter, and empty pad soldering tin thickness deviation can only be controlled within 40um, and to the flexible line way board of small, irregularly shaped, because the shape size of empty pad is inconsistent, it has a great deal of defects such as empty pad soldering tin thickness deviation scope is big, soldering tin thickness is inhomogeneous, the production degree of difficulty is high, production efficiency is low, can't satisfy special customer group's demand.
Disclosure of Invention
The invention aims to overcome the defects and provide the VCM mobile phone camera module production line which reduces the thickness deviation range of empty soldering tin, reduces the production difficulty, reduces the labor cost and improves the production efficiency.
The purpose of the invention is realized in the following way: the VCM mobile phone camera module production line sequentially comprises a flexible circuit board production device, a first assembly device, a second assembly device, a third assembly device, a fourth assembly device and a fifth assembly device from front to back, wherein the VCM mobile phone camera module is manufactured by the flexible circuit board production device, the first assembly device, the second assembly device, the third assembly device, the fourth assembly device and the fifth assembly device, and comprises a lens, a voice coil motor, a base, an optical filter, an image sensor, a flexible circuit board, a base plate and a connector, wherein the lens is arranged in the voice coil motor, the voice coil motor is arranged on the base, the optical filter and the image sensor are arranged between the base and the flexible circuit board, and the flexible circuit board is embedded on the base plate;
the flexible circuit board production device is used for carrying out operations such as tin coating, surface mounting, dispensing, detection and the like on a flexible circuit board, the first assembling device is used for assembling the image sensor and the flexible circuit board into a first component, the second assembling device is used for assembling the base and the optical filter into a second component, the third assembling device is used for assembling the lens and the voice coil motor into a third component, the fourth assembling device is used for assembling the second component and the third component into a fourth component, and the fifth assembling device is used for assembling the fourth component and the first component into a finished product module.
Still further, flexible circuit board apparatus for producing is from preceding to back including attaching device, steel mesh printing device, SPI detection device, part product mounting device, reflow soldering device, AOI detection device, some glue device, solidification equipment, electrical test device, base plate segmentation device, get board device, outward appearance detection device in proper order, attaching device is used for fixing the base plate location, steel mesh printing device is used for carrying out solder paste printing operation to the base plate surface, the base plate includes the base plate body, be provided with a plurality of flexible circuit boards that are the matrix and arrange on the base plate body, the flexible circuit board includes horizontal segment and vertical segment, the medial side of horizontal segment is provided with the arc limit of indent, the front of horizontal segment is provided with reserved area, be provided with a plurality of not equal preparation pads in the reserved area, a plurality of not equal preparation pads are along the interior border interval arrangement of arc limit, the front of vertical segment is provided with electric capacity subsides dress area and chip and reserves regional department and is provided with the recess corresponding to the regional department of area.
Furthermore, the attaching device comprises a positioning jig, a carrier plate and a positioning steel sheet in a back-shaped structure, wherein the carrier plate is arranged on the positioning jig, and the carrier plate adsorbs the positioning steel sheet by utilizing magnetic attraction to position the substrate in the middle of the carrier plate;
the positioning jig comprises a base, positioning blocks are respectively arranged at four corners of the base, and a plurality of upright positioning columns are arranged on the base;
the support plate comprises a support plate body, a plurality of support plate positioning holes are formed in the support plate body, a magnet is arranged on the back face of the support plate body, a bottom lining steel sheet is arranged in the middle of the front face of the support plate body, a layer of high-temperature-resistant steel silica gel is arranged between the bottom lining steel sheet and the support plate body, a plurality of first bosses which are arranged in a matrix are arranged on the front face of the bottom lining steel sheet, the first bosses are respectively corresponding to a plurality of flexible circuit boards on a substrate, and the shape of each first boss is matched with the shape of a groove on the back face of the flexible circuit board.
Still further, steel mesh printing device includes the steel mesh, the back of steel mesh is provided with a plurality of second bosss that are the matrix arrangement, the shape of second boss and flexible circuit board's appearance profile phase-match, a plurality of soldering tin holes have been seted up on the steel mesh, the aperture in soldering tin hole is from the front to the back taper of steel mesh.
Still further, the adhesive deposite device includes the removal seat of vertical arrangement, remove and be provided with the backup pad on the seat, the front side of backup pad is provided with fixed grip slipper, be connected with the fixed plate between fixed grip slipper and the backup pad, the left and right sides of fixed grip slipper all is provided with movable grip slipper, be provided with adjusting part between movable grip slipper and the backup pad, adjusting part is used for carrying out horizontal, vertical and fore-and-aft position control to movable grip slipper, all be provided with the adhesive deposite barrel in fixed grip slipper and the movable grip slipper.
Still further, the adjusting part is from the back to preceding including first riser, second riser, the third riser that connects gradually, through a plurality of bolt fixed connection between first riser and the backup pad, second riser and first riser sliding connection, the second riser can carry out vertical slip or carry out horizontal slip along the length direction of first riser along the direction of height of first riser, second riser and third riser sliding connection, the third riser can carry out horizontal slip or carry out vertical slip along the direction of height of second riser along the length direction of second riser, be provided with first connecting block and second connecting block between third riser and the movable grip slipper, first connecting block and third riser fixed connection, second connecting block and movable grip slipper fixed connection, first connecting block and second connecting block sliding connection, the second connecting block can carry out vertical slip along the width direction of first connecting block.
Further, a first fixing block is arranged on one side face of the first vertical plate, a first adjusting bolt which is vertically arranged is arranged on the first fixing block, a first top block is arranged below the first adjusting bolt, the first top block is fixedly connected with the side face of the second vertical plate, and the head end of the first adjusting bolt is in contact with the top face of the first top block;
the bottom surface of the second vertical plate is provided with a second fixed block, the second fixed block is provided with a second adjusting bolt which is transversely arranged, the head end of the second adjusting bolt is provided with a second top block, and the second top block is fixedly connected with the bottom surface of the third vertical plate;
one side of first connecting block is provided with the third fixed block, be provided with the third adjusting bolt of vertical arrangement on the third fixed block, third adjusting bolt's below is provided with the rotation ejector pad, the rotation ejector pad passes through the bolt axle of horizontal arrangement and sets up on the lateral wall of first connecting block, the below of rotation ejector pad is provided with the ejector pin of vertical arrangement, the rear side fixed connection of one end and the second connecting block of ejector pin, the both ends of rotation ejector pad contact with the head end of third adjusting bolt and the other end of ejector pin respectively.
Compared with the prior art, the invention has the beneficial effects that:
1. according to the invention, the first boss is arranged on the carrier plate in the attaching device, and the second boss is arranged on the back surface of the steel mesh in the steel mesh printing device, so that the effective area and the waste area on the substrate are respectively subjected to lower compensation and upper compensation, the uniformity of the solder thickness on the preparation bonding pads with different sizes is ensured, the production difficulty is reduced, and the solder height difference among a plurality of preparation bonding pads is ensured to be less than or equal to 0.02 mm.
2. Because the carrier plate adopts the aluminum product to make, if directly process out first boss when the carrier plate shaping, can lead to first boss appearance burr, high uniformity subalternation phenomenon, consequently paste the lining steel sheet on the surface of carrier plate, at the first boss of surface processing of lining steel sheet, ensure the high uniformity of first boss, the lining steel sheet can be changed regularly, avoided influencing the degree of fit of base plate and carrier plate because of the first boss wearing and tearing that leads to for a long time, also improved carrier plate holistic durability simultaneously, reduction in production cost.
3. The traditional dispensing device is only provided with one dispensing head, and because the number of products on a single substrate is large, the dispensing path is long, so that the operation efficiency is extremely low.
4. In the prior art, the plate taking process is classified and placed manually, and because the product is small in size and irregular in shape, the manual taking and placing efficiency of personnel is low, and the risk of taking and placing errors exists.
5. The base and the voice coil motor in the VCM mobile phone camera module are connected in a matched mode through the clamping blocks and the clamping grooves, so that the matching degree between the base and the voice coil motor can be improved, the deflection in the X, Y direction is reduced, the assembly efficiency is improved, and the quality of a finished product is improved.
Drawings
Fig. 1 is a schematic structural diagram of a VCM handset camera module.
Fig. 2 is a component view of the VCM handset camera module after removal of the flexible circuit board.
Fig. 3 is a schematic front view of a flexible circuit board.
Fig. 4 is a schematic back view of a flexible circuit board.
Fig. 5 is a schematic diagram of a production line of a VCM mobile phone camera module according to the present invention.
Fig. 6 is a schematic diagram of a flexible circuit board production apparatus.
Fig. 7 is a schematic front view of the positioning fixture in the attaching device.
Fig. 8 is a schematic front view of a carrier plate in the attaching device.
FIG. 9 is a front schematic view of a substrate
Fig. 10 is a schematic front view of a positioning steel sheet in the attaching device.
Fig. 11 is a schematic view of the back side of a steel screen in a steel screen printing apparatus.
Fig. 12 is a schematic diagram of the relationship between the lower compensation and the upper compensation of the VCM cell phone camera module by the carrier board and the steel mesh.
Fig. 13 is a schematic structural view of the dispensing device.
Fig. 14 is a top view of fig. 13.
Fig. 15 is a side view of fig. 13.
Fig. 16 is a bottom view of fig. 13.
Fig. 17 is a schematic diagram of a plating system.
Fig. 18 is a schematic diagram of the condition of the inspection station in the component mounting process.
Fig. 19 is a schematic diagram of an electrical test procedure inspection station condition.
Fig. 20 is a schematic diagram of good layout in a good placement box.
Wherein:
flexible circuit board production device 100
Attachment device 101, positioning jig 101.1, base 101.1.1, positioning block 101.1.2, positioning column 101.1.3, carrier plate 101.2, carrier plate body 101.2.1, carrier plate positioning hole 101.2.2, bottom lining steel sheet 101.2.3, first boss 101.2.4, first notch 101.2.5, positioning steel sheet 101.3, positioning steel sheet positioning hole 101.3.1, second notch 101.3.2
Steel screen printing device 102, steel screen 102.1 and second boss 102.2
SPI detection device 103
Part mounting device 104
Reflow soldering device 105
AOI detection device 106
Dispensing device 107, moving seat 107.1, support plate 107.2, fixed clamping seat 107.3, movable clamping seat 107.4, fixed plate 107.5, first riser 107.6, second riser 107.7, third riser 107.8, first fixed block 107.9, first top block 107.10, first adjusting bolt 107.11, second fixed block 107.12, second adjusting bolt 107.13, second top block 107.14, first connecting block 107.15, second connecting block 107.16, third fixed block 107.17, third adjusting bolt 107.18, rotary pushing block 107.19, latch shaft 107.20, ejector pin 107.21, bump 107.22, first spacing piece 107.23, first waist-shaped slot 107.24, first spacing post 107.25, second spacing piece 107.26, second waist-shaped slot 107.27, second spacing post 4634, third waist-shaped slot 4635, third spacing post 107.31
Curing device 108
Electrical test device 109
Substrate dividing device 110
Plate taking device 111, plate taking carrier 111.1, feeding mechanism 111.2, automatic sucking manipulator 111.3, feeding defective product waste box 111.4, defective product placing box 111.5 and defective product placing box 111.6
Appearance detecting device 112
VCM cell phone camera module 200, lens 201, voice coil motor 202, base 203, optical filter 204, image sensor 205, flexible circuit board 206, horizontal segment 206.1, vertical segment 206.2, hypotenuse notch 206.3, rectangular notch 206.4, arcuate edge 206.5, preliminary bonding pad 206.6, first bonding pad 206.7, second bonding pad 206.8, groove 206.9, bottom plate 207, fixture block 208, and clamping groove 209
Substrate 300, substrate body 301, substrate positioning hole 302
First assembling device 400
Second assembling device 500
Third assembling device 600
Fourth assembling device 700
Fifth assembly device 800.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
Referring to fig. 1-4, the VCM mobile phone camera module 200 according to the present invention includes a lens 201, a voice coil motor 202, a base 203, an optical filter 204, an image sensor 205, a flexible circuit board 206, a base 207, and a connector, wherein the lens 201 is disposed in the voice coil motor 202, the voice coil motor 202 is disposed on the base 203, the optical filter 204 and the image sensor 205 are disposed between the base 203 and the flexible circuit board 206, and the flexible circuit board 206 is embedded on the base 207;
the base 203 and the voice coil motor 202 are connected in a matched manner through a clamping block 208 and a clamping groove 209;
the flexible circuit board 206 is similar to an L-shaped structure, the flexible circuit board 206 comprises a horizontal section 206.1 and a vertical section 206.2, a bevel edge notch 206.3 is arranged at the outer corner where the horizontal section 206.1 and the vertical section 206.2 are connected, a rectangular notch 206.4 is arranged at the inner corner where the horizontal section 206.1 and the vertical section 206.2 are connected, an inward concave arc edge 206.5 is arranged at the inner side edge of the horizontal section 206.1, a reserved area is arranged on the front surface of the horizontal section 206.1, six preparation pads 206.6 with different sizes are arranged in the reserved area at intervals along the inner edge of the arc edge 206.5, a capacitor mounting area and a chip mounting area are arranged on the front surface of the vertical section 206.2, two first pads 206.7 are arranged in the capacitor mounting area, a plurality of second pads 206.8 which are arranged in a matrix are arranged in the chip mounting area, and a groove 3723.04 mm is formed in the back surface area of the horizontal section 206.1.
Referring to fig. 4-20, a production process of a VCM mobile phone camera module adopts a VCM mobile phone camera module production line to manufacture the VCM mobile phone camera module, the VCM mobile phone camera module production line sequentially includes, from front to back, a flexible circuit board production device 100, a first assembling device 400, a second assembling device 500, a third assembling device 600, a fourth assembling device 700, and a fifth assembling device 800, the flexible circuit board production device 100 is used for performing operations of tin plating, pasting, dispensing, detecting, and the like on a flexible circuit board 206, the first assembling device 400 is used for assembling an image sensor 205 and the flexible circuit board 206 into a first component, the second assembling device 500 is used for assembling a base 203 and a filter 204 into a second component, the third assembling device 600 is used for assembling a lens 201 and a voice coil motor 202 into a third component, the fourth assembling device 700 is used for assembling the second component and the third component into a fourth component, and the fifth assembling device 800 is used for assembling the fourth component and the first component into a finished product module;
the flexible circuit board production device 100 sequentially comprises an attaching device 101, a steel screen printing device 102, an SPI detection device 103, a part mounting device 104, a reflow soldering device 105, an AOI detection device 106, a glue dispensing device 107, a curing device 108, an electric testing device 109, a substrate dividing device 110, a board taking device 111 and an appearance detection device 112 from front to back;
the specific production method comprises the following steps:
step one, the attaching device 101 positions and fixes the substrate 300;
in the first step, the attaching device 101 includes a positioning jig 101.1, a carrier plate 101.2, and a positioning steel sheet 101.3 having a zigzag structure, the carrier plate 101.2 is disposed on the positioning jig 101.1, the carrier plate 101.2 adsorbs the positioning steel sheet 101.3 by using magnetic attraction to position the substrate 300 in the middle of the carrier plate 101.2, the substrate 300 includes a substrate body 301, a plurality of flexible circuit boards 206 arranged in a matrix are disposed on the substrate body 301, the front heights of the plurality of flexible circuit boards 206 are lower than the front height of the substrate body 301 by 0.04mm, and a plurality of substrate positioning holes 302 are further formed on the substrate body 301;
the positioning jig 101.1 comprises a base 101.1.1, positioning blocks 101.1.2 with an L-shaped structure are respectively arranged at four corners of the base 101.1.1, and a plurality of upright positioning columns 101.1.3 are arranged on the base 101.1.1;
the carrier plate 101.2 includes a carrier plate body 101.2.1, a plurality of carrier plate positioning holes 101.2.2 are formed in the carrier plate body 101.2.1, a magnet is disposed on the back surface of the carrier plate body 101.2.1, a bottom lining steel sheet 101.2.3 is disposed in the middle of the front surface of the carrier plate body 101.2.1, a layer of high temperature resistant steel silica gel is disposed between the bottom lining steel sheet 101.2.3 and the carrier plate body 101.2.1, a plurality of first bosses 101.2.4 arranged in a matrix are disposed on the front surface of the bottom lining steel sheet 101.2.3, the plurality of first bosses 101.2.4 respectively correspond to the plurality of flexible circuit boards 206 on the substrate 300, the shape of the first bosses 101.2.4 is matched with the shape of the groove 206.9 on the back surface of the flexible circuit board 206, and the thickness of the first bosses 101.2.4 is 0.04mm;
a first notch 101.2.5 is arranged at one end angle of the bottom lining steel sheet 101.2.3;
two positioning steel sheet positioning holes 101.3.1 are formed in the positioning steel sheet 101.3, and a second notch 101.3.2 corresponding to the first notch is formed in one end angle of the positioning steel sheet 101.3.
The specific operation method of the attaching device 101 is as follows:
a. placing the carrier plate 101.2 in the positioning jig 101.1, so that the positioning columns 101.1.3 penetrate through the carrier plate positioning holes 101.2.2 to position the carrier plate 101.2;
b. placing the substrate 300 on the carrier 101.2, so that the corresponding positioning columns 101.1.3 pass through the substrate positioning holes 302 to perform primary positioning on the substrate 300;
c. the positioning steel sheet 101.3 is adsorbed on the carrier plate 101.2, so that the second notch 101.3.2 coincides with the first notch 101.2.5, and the corresponding positioning column 101.1.3 passes through the positioning steel sheet positioning hole 101.3.1, thereby fixing and attaching the substrate on the carrier plate 101.2.
Step two, the steel mesh printing device 102 performs solder paste printing operation on the surface of the substrate 300 through a steel mesh and a scraping plate, wherein the thickness of solder on each prepared bonding pad 206.6 is 0.06-0.10mm, and the height difference of the thickness of solder on six prepared bonding pads 206.6 is less than or equal to 0.02 mm;
in the second step, a plurality of second bosses 102.2 arranged in a matrix are arranged on the back surface of the steel mesh 102.1, the second bosses 102.2 respectively correspond to a plurality of flexible circuit boards 206 on the substrate 300, the shape of the second bosses 102.2 is matched with the outline of the flexible circuit boards 206, soldering tin holes are formed in the positions of the steel mesh 102.1 corresponding to the prepared soldering pads 206.6, the first soldering pads 206.7 and the second soldering pads 206.8, the aperture of each soldering tin hole is gradually reduced from the front surface to the back surface of the steel mesh 102.1, and solder paste can be prevented from flowing out of the soldering tin holes and overflowing to the area beyond the soldering pads;
the back of the steel mesh 102.1 is etched to obtain a plurality of second bosses 102.2, and the thickness of the second bosses 102.2 is 0.04mm.
The first boss on the front of the carrier plate can compensate the height difference between the back groove of the effective area (flexible circuit board area) of the substrate and other parts on the back of the effective area, so that the substrate is tightly matched with the carrier plate, the substrate is attached and positioned on the carrier plate through the positioning steel sheet, the second boss on the back of the steel mesh can compensate the height difference between the front of the effective part (flexible circuit board area) of the substrate and the front of the abandoned part (substrate body), so that the effective part of the substrate is completely matched with the steel mesh, and the lower compensation and the upper compensation of the substrate are respectively realized through the first boss and the second boss, so that the consistency of the solder thickness is ensured.
Step three, the SPI detecting device 103 performs solder paste detecting operation on the printed substrate 300;
fourthly, the part mounting device 104 performs a mounting operation on the substrate 300 after the solder paste detection;
the component mounting device 104 marks a mark point on the defective position number on the substrate 300, (as shown in fig. 18, a defective product (NG) is supplied at the position A2), the camera in the component mounting device 104 scans the mark on the substrate 300, the system records the NG position, that is, A2 NG, and the rest positions OK, and mounts the capacitor and the chip on the qualified position number at the position OK.
Step five, the reflow soldering device 105 performs reflow soldering operation on the substrate 300 after the bonding;
step six, the AOI detection device 106 performs automatic optical detection on the substrate 300 after reflow soldering, and unqualified records are recorded in a database;
step seven, the dispensing device 107 performs dispensing operation at the dispensing position of the substrate 300;
step eight, the curing device 108 carries out heating curing operation on the substrate 300 after dispensing, so that the glue is coated on the periphery and the bottom of the chip, and the bonding force of the chip is enhanced;
step nine, the electrical testing device 109 performs performance testing on the plurality of flexible circuit boards on the substrate 300;
the electrical testing apparatus 109 tests the plurality of flexible circuit boards on the substrate 300 row by row (i.e. a→b→c→d), a defective product is newly found in the test (i.e. a defective product (NG) is found at the position C3 shown in fig. 19), and the testing system records the NG position, i.e. C3NG, and the rest positions OK.
Step ten, the substrate dividing device 110 performs punching and dividing on the plurality of flexible circuit boards on the substrate 300 into independent products, and the plurality of independent products are sequentially arranged in the board taking carrier 111.1 according to an original sequence;
step eleven, the board taking device 111 sorts and places a plurality of independent products;
in the eleventh step, an automatic board taking system is adopted, the feeding mechanism 111.2 is controlled to convey the board taking carrier 111.1 into the board taking device 111, the board taking device 111 collects information such as the A2 position and the C3 position of NG according to system data in the two process devices of the transferred ' part product actual mounting process ' and the electric test process ', then the automatic sucking manipulator 111.3 firstly sucks defective products in the A2 position according to the data information and then transfers the defective products in the A2 position into the feeding defective product waste box 111.4, and then transfers defective products in the C3 position into the performance defective product placing box 111.5, so that the subsequent quality improvement is facilitated for engineering personnel analysis reasons, and finally all residual defective products are sucked and sequentially arranged in the defective product placing box 111.6, as shown in fig. 20.
Step twelve, the appearance detection device 112 performs appearance detection on the good products;
step thirteen, the first assembling device 400 assembles the image sensor 205, the flexible circuit board 206 and the bottom board 207 into a first assembly;
fourteen, the second assembling device 500 assembles the base 203 and the optical filter 204 into a second assembly;
fifteen, the third assembling device 600 assembles the lens 201 and the voice coil motor 202 into a third assembly;
sixteenth, the fourth assembling device 700 assembles the second component in the fourteenth step and the third component in the fifteenth step into a fourth component, and the clamping block 208 on the top surface of the base 203 is matched and connected with the clamping groove 209 on the bottom surface of the voice coil motor 202, so that the precise matching between the base 203 and the voice coil motor 202 is ensured, and the deflection in the X, Y direction is reduced;
seventeenth, the fifth assembling apparatus 800 assembles the fourth component in sixteenth and the first component in thirteenth to form a finished module.
Referring to fig. 13-16, in the seventh step, the dispensing device 107 includes a vertically arranged moving seat 107.1, a laterally arranged supporting plate 107.2 is provided on a front side surface of the moving seat 107.1, a fixed clamping seat 107.3 is provided on a front side of the supporting plate 107.2, a fixed plate 107.5 is connected between the fixed clamping seat 107.3 and a middle portion of the supporting plate 107.2, movable clamping seats 107.4 are provided on left and right sides of the fixed clamping seat 107.3, an adjusting component is provided between the movable clamping seat 107.4 and the supporting plate 107.2, and the adjusting component is used for adjusting positions of the movable clamping seat 107.4 in a lateral, vertical and longitudinal direction, so that the movable clamping seat 107.4 and the fixed clamping seat 107.3 are located on the same straight line, and dispensing cylinders are provided in the fixed clamping seat 107.3 and the movable clamping seat 107.4;
the adjusting assembly comprises a first vertical plate 107.6, a second vertical plate 107.7 and a third vertical plate 107.8 which are sequentially connected from back to front, wherein the first vertical plate 107.6 and the supporting plate 107.2 are fixedly connected through a plurality of bolts, the rear side surface of the second vertical plate 107.7 is in sliding connection with the front side surface of the first vertical plate 107.6, the second vertical plate 107.7 can vertically slide along the height direction of the first vertical plate 107.6 or transversely slide along the length direction of the first vertical plate 107.6, the front side surface of the second vertical plate 107.7 is in sliding connection with the rear side surface of the third vertical plate 107.8, the third vertical plate 107.8 can horizontally slide along the length direction of the second vertical plate 107.7 or vertically slide along the height direction of the second vertical plate 107.7, a first connecting block 107.15 and a second 107.16 are arranged between the third vertical plate 107.8 and a movable clamping seat 107.4, the rear side surface of the first connecting block 107.15 can be fixedly connected with the front side surface of the second connecting block 107.8 along the longitudinal direction of the first connecting block 107.16, and the front side surface of the second connecting block 107.8 can be fixedly connected with the front side surface of the first connecting block 107.8;
preferably, a first fixing block 107.9 is disposed on a side surface of the first riser 107.6, a first adjusting bolt 107.11 vertically disposed is disposed on the first fixing block 107.9, a first top block 107.10 is disposed below the first adjusting bolt 107.11, the first top block 107.10 is fixedly connected with a side surface of the second riser 107.7, a head end of the first adjusting bolt 107.11 contacts with a top surface of the first top block 107.10, and the first adjusting bolt 107.11 cooperates with the first top block 107.10 to control the second riser 107.7 to vertically slide along a height direction of the first riser 107.6;
a first limiting piece 107.23 is arranged on the side face of the first vertical plate 107.6, a first kidney-shaped groove 107.24 which is vertically arranged is formed in the first limiting piece 107.23, a first limiting column 107.25 is arranged in the first kidney-shaped groove 107.24, the inner end of the first limiting column 107.25 is fixedly connected with the side face of the second vertical plate 107.7, and the first limiting column 107.25 and the first limiting piece 107.23 are matched for use to limit the position of the second vertical plate 107.7 in a vertical movement manner;
the bottom surface of the second vertical plate 107.7 is provided with a second fixed block 107.12, the second fixed block 107.12 is provided with a second adjusting bolt 107.13 transversely arranged, the head end of the second adjusting bolt 107.13 is provided with a second top block 107.14, the second top block 107.14 is fixedly connected with the bottom surface of the third vertical plate 107.8, and the second adjusting bolt 107.13 is matched with the second top block 107.14 to control the third vertical plate 107.8 to transversely slide along the length direction of the second vertical plate 107.7;
the top surface of the second vertical plate 107.7 is provided with a second limiting plate 107.26, the second limiting plate 107.26 is provided with a second kidney-shaped groove 107.27 which is transversely arranged, a second limiting column 107.28 is arranged in the second kidney-shaped groove 107.27, the bottom end of the second limiting column 107.28 is fixedly connected with the top surface of the third vertical plate 107.8, and the second limiting column 107.28 is matched with the second limiting plate 107.26 to limit the position of the third vertical plate 107.8 in a transverse movement manner;
a third fixed block 107.17 is arranged on one side of the first connecting block 107.15, a third adjusting bolt 107.18 which is vertically arranged is arranged on the third fixed block 107.17, a rotating push block 107.19 which is similar to a V-shaped structure is arranged below the third adjusting bolt 107.18, the rotating push block 107.19 is arranged on the side wall of the first connecting block 107.15 through a bolt shaft 107.20 which is transversely arranged, a push rod 107.21 which is longitudinally arranged is arranged below the rotating push block 107.19, the front end of the push rod 107.21 is fixedly connected with the rear side of the second connecting block 107.16, the rotating push block 107.19 comprises two rotating arms which are connected with the inner ends, the two rotating arms are respectively contacted with the head end of the third adjusting bolt 107.18 and the rear end of the push rod 107.21 through a protruding block 107.22, and the second connecting block 107.16 can be controlled to longitudinally slide along the width direction of the first connecting block 107.15 through the cooperation of the third adjusting bolt 107.18 and the rotating push block 107.19 and the push rod 107.21;
the top surface of first connecting block 107.15 is provided with third spacing piece 107.29, set up the third kidney-shaped groove 107.30 of vertical arrangement on the third spacing piece 107.29, be provided with third spacing post 107.31 in the third kidney-shaped groove 107.30, the bottom of third spacing post 107.31 and the top surface fixed connection of second connecting block 107.16, the cooperation of third spacing post 107.31 and third spacing piece 107.29 is used in order to carry out longitudinal movement's position to second connecting block 107.16 and is prescribe a limit to.
The foregoing is merely a specific application example of the present invention, and the protection scope of the present invention is not limited in any way. All technical schemes formed by equivalent transformation or equivalent substitution fall within the protection scope of the invention.
Claims (4)
1. The utility model provides a VCM cell-phone camera module production water line which characterized in that: the VCM mobile phone camera module is manufactured by adopting the flexible circuit board production device, the first assembly device, the second assembly device, the third assembly device, the fourth assembly device and the fifth assembly device, and comprises a lens, a voice coil motor, a base, an optical filter, an image sensor, a flexible circuit board, a bottom plate and a connector, wherein the lens is arranged in the voice coil motor, the voice coil motor is arranged on the base, the optical filter and the image sensor are arranged between the base and the flexible circuit board, and the flexible circuit board is embedded on the bottom plate;
the flexible circuit board production device is used for carrying out tin coating, surface mounting, glue dispensing and detection operation on the flexible circuit board, the first assembly device is used for assembling the image sensor and the flexible circuit board into a first assembly, the second assembly device is used for assembling the base and the optical filter into a second assembly, the third assembly device is used for assembling the lens and the voice coil motor into a third assembly, the fourth assembly device is used for assembling the second assembly and the third assembly into a fourth assembly, and the fifth assembly device is used for assembling the fourth assembly and the first assembly into a finished module;
the flexible circuit board production device sequentially comprises an attaching device, a steel screen printing device, an SPI detection device, a part product mounting device, a reflow soldering device, an AOI detection device, a dispensing device, a curing device, an electric test device, a substrate dividing device, a board taking device and an appearance detection device from front to back, wherein the attaching device is used for positioning and fixing a substrate, the steel screen printing device is used for conducting solder paste printing operation on the surface of the substrate, the substrate comprises a substrate body, a plurality of flexible circuit boards which are arranged in a matrix are arranged on the substrate body, the flexible circuit board comprises a transverse section and a vertical section, the inner side of the transverse section is provided with an inward concave arc edge, the front surface of the transverse section is provided with a reserved area, a plurality of preparation bonding pads with different sizes are arranged at intervals along the inner edge of the arc edge, the front surface of the vertical section is provided with a capacitor attaching area and a chip attaching area, and the back surface of the transverse section is provided with grooves corresponding to the reserved area;
the attaching device comprises a positioning jig, a carrier plate and a positioning steel sheet in a back-shaped structure, wherein the carrier plate is arranged on the positioning jig, and the carrier plate adsorbs the positioning steel sheet by utilizing magnetic attraction to position the substrate in the middle of the carrier plate;
the positioning jig comprises a base, positioning blocks are respectively arranged at four corners of the base, and a plurality of upright positioning columns are arranged on the base;
the support plate comprises a support plate body, a plurality of support plate positioning holes are formed in the support plate body, a magnet is arranged on the back surface of the support plate body, a bottom lining steel sheet is arranged in the middle of the front surface of the support plate body, a layer of high-temperature-resistant steel silica gel is arranged between the bottom lining steel sheet and the support plate body, a plurality of first bosses which are arranged in a matrix are arranged on the front surface of the bottom lining steel sheet, the first bosses respectively correspond to a plurality of flexible circuit boards on a substrate, and the shape of each first boss is matched with the shape of a groove on the back surface of the flexible circuit board;
the steel mesh printing device comprises a steel mesh, a plurality of second bosses which are arranged in a matrix are arranged on the back of the steel mesh, the shape of each second boss is matched with the outline of the flexible circuit board, a plurality of soldering tin holes are formed in the steel mesh, and the diameters of the soldering tin holes taper from the front face to the back face of the steel mesh.
2. The VCM handset camera module production line of claim 1, wherein: the glue dispensing device comprises a movable seat which is vertically arranged, a supporting plate is arranged on the movable seat, a fixed clamping seat is arranged on the front side of the supporting plate, a fixed plate is connected between the fixed clamping seat and the supporting plate, movable clamping seats are arranged on the left side and the right side of the fixed clamping seat, an adjusting component is arranged between the movable clamping seat and the supporting plate, and the adjusting component is used for adjusting the positions of the movable clamping seat transversely, vertically and longitudinally, and glue dispensing cylinders are arranged in the fixed clamping seat and the movable clamping seat.
3. The VCM handset camera module production line of claim 2, wherein: the adjusting component comprises a first riser, a second riser and a third riser which are sequentially connected from back to front, the first riser is fixedly connected with the supporting plate through a plurality of bolts, the second riser is in sliding connection with the first riser, the second riser can vertically slide along the height direction of the first riser or transversely slide along the length direction of the first riser, the second riser is in sliding connection with the third riser, the third riser can transversely slide along the length direction of the second riser or vertically slide along the height direction of the second riser, a first connecting block and a second connecting block are arranged between the third riser and the movable clamping seat, the first connecting block is fixedly connected with the third riser, the second connecting block is fixedly connected with the movable clamping seat, the first connecting block is in sliding connection with the second connecting block, and the second connecting block can longitudinally slide along the width direction of the first connecting block.
4. A VCM handset camera module production line according to claim 3, characterized in that: a first fixing block is arranged on one side surface of the first vertical plate, a first adjusting bolt which is vertically arranged is arranged on the first fixing block, a first top block is arranged below the first adjusting bolt, the first top block is fixedly connected with the side surface of the second vertical plate, and the head end of the first adjusting bolt is in contact with the top surface of the first top block;
the bottom surface of the second vertical plate is provided with a second fixed block, the second fixed block is provided with a second adjusting bolt which is transversely arranged, the head end of the second adjusting bolt is provided with a second top block, and the second top block is fixedly connected with the bottom surface of the third vertical plate;
one side of first connecting block is provided with the third fixed block, be provided with the third adjusting bolt of vertical arrangement on the third fixed block, third adjusting bolt's below is provided with the rotation ejector pad, the rotation ejector pad passes through the bolt axle of horizontal arrangement and sets up on the lateral wall of first connecting block, the below of rotation ejector pad is provided with the ejector pin of vertical arrangement, the rear side fixed connection of one end and the second connecting block of ejector pin, the both ends of rotation ejector pad contact with the head end of third adjusting bolt and the other end of ejector pin respectively.
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| CN201911040837.8A CN110572562B (en) | 2019-10-30 | 2019-10-30 | VCM cell-phone camera module production water line |
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| CN119092556A (en) * | 2024-11-05 | 2024-12-06 | 宁波舜宇光电信息有限公司 | Photosensitive component, camera module, preparation method thereof, and electronic device |
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