CN110597356A - a notebook computer - Google Patents

Abstract

The application provides a notebook computer, which is used to improve the cooling effect of the notebook computer. The hinge area of the keyboard case provided by the present application is provided with a first opening area and a second opening area. The first fan is provided with a first air outlet and a second air outlet. The wind blown out of the first air outlet flows out from the first opening area. The second air outlet faces the chip area of the motherboard. At least the base shell, the keyboard shell, the first fan and the air guide form a semi-enclosed structure. The wind blown from the second air outlet of the first fan enters the semi-enclosed structure, flows through the chip area, and flows out from the second opening area. On the one hand, the chip area of the notebook computer is dissipated through the first air outlet, on the other hand, the wind from the second air outlet is blown into the chip area of the semi-enclosed structure, and the chip in the chip area is directly dissipated heat, thus improving the efficiency of the chip. cooling effect of the area.

Description

a notebook computer

technical field

The present application relates to the field of computers, in particular to a notebook computer.

Background technique

With the rapid development of computers, the cooling of notebook computers has become an extremely important design focus. At present, in notebook computers, fans, heat pipes, and cooling fins are used to dissipate heat from the motherboard in notebook computers. Specifically, one end of the heat pipe is in thermal contact with the electronic component through the copper block, and the other end of the heat pipe is in thermal contact with the cooling fins. The heat pipe can transfer the heat generated by the electronic components to the cooling fins. The heat dissipation fins are arranged in the opening area of the connection between the keyboard casing and the screen casing of the notebook computer, and the wind blown by the fan flows through the heat dissipation fins and then flows out of the notebook computer from the opening area, so as to realize the protection of the electronic components in the notebook computer. Heat dissipation.

With the development of electronic industry technology, the transistor density of various chips (especially the central processing unit) is increasing day by day, the speed of data processing is getting faster and faster, and the power consumption and heat generation are also increasing. Existing cooling solutions can no longer meet the demand. Based on this, there is an urgent need for a heat dissipation solution for a notebook computer, which is used to improve the heat dissipation effect of the notebook computer.

Contents of the invention

The application provides a notebook computer, which is used to improve the cooling effect of the notebook computer.

In a first aspect, the present application provides a notebook computer, which includes a keyboard casing, a base casing, a first fan, and an air guide. Wherein, the keyboard housing is provided with a rotating shaft area, and the keyboard housing is connected to the notebook screen through the rotating shaft of the rotating shaft area; the rotating shaft area is provided with a first opening area and a second opening area. A base case, the base case is connected with the keyboard case to form a cavity; a main board, a first fan and an air guide are arranged in the cavity. The first fan is provided with a first air outlet and a second air outlet, the air blown by the first air outlet flows out from the first opening area, and the second air outlet faces the chip area of the motherboard. At least the base case, the keyboard case, the first fan and the air guide form a semi-enclosed structure; the chip area is located inside the semi-enclosed structure, and the opening of the semi-enclosed structure Towards the second opening area; the wind blown from the second air outlet of the first fan enters the semi-enclosed structure, flows through the chip area, and flows out from the second opening area. Since the heat dissipation of the notebook computer is realized through the first air outlet of the first fan, the heat dissipation effect on the chip area is improved by direct blowing to the chip area through the second air outlet.

In a possible implementation manner, the air guide is in contact with the shell of the first fan; the distance between the contact area of the first fan and the air guide and the second air outlet is less than a predetermined distance. Set distance. The semi-enclosed structure is equivalent to setting up air duct isolation in the notebook computer. Since the contact area of the air guide on the first fan is relatively close to the second air outlet, the wind blown out of the second air outlet can be prevented from being sucked back again. Backflow is formed into the first fan.

In a possible implementation manner, a side of the first fan on which the first air outlet is provided is adjacent to a side on which the second air outlet is provided. In this way, on the basis of ensuring that the second air outlet faces the chip area, the first air outlet of the first fan can be more compatible with the structure of the existing notebook computer, and does not hinder the layout of the input and output ports on the side of the notebook computer.

In a possible implementation manner, the second air outlet is located inside the semi-enclosed structure. In this way, all the air blown out from the second air outlet can enter the semi-enclosed structure, further improving the heat dissipation efficiency of the chip area. On the other hand, it also prevents the wind blown from the second air outlet from running around in the area of the notebook computer except the semi-enclosed structure, so as to cause interference to other devices.

In a possible implementation manner, the air output volume of the first air outlet is greater than the air output volume of the second air outlet. Since the second air outlet blows directly to the chip area, a relatively small wind can bring a greater heat dissipation effect. This arrangement can maintain a higher height of the first air outlet on the premise of improving the heat dissipation effect of the chip area. cooling capacity.

In a possible implementation manner, the base case forms the bottom surface of the semi-enclosed structure, the keyboard case forms the top surface of the semi-enclosed structure, and the first fan is provided with the second The side surfaces of the air outlet and the air guide member constitute the side surfaces of the semi-enclosed structure. With the aid of the existing structure of the notebook computer, this layout forms a semi-enclosed structure through the air guide. It can be seen that this solution adds fewer components and is more compatible with the structure of the existing notebook computer.

In a possible implementation manner, it also includes a second fan, the second fan is provided with a third air outlet; the rotating shaft area is also provided with a third opening area; the wind blown out of the third air outlet is Outflow from the third opening area. The heat dissipation effect of the notebook computer is further increased through the third air outlet of the second fan.

In a possible implementation manner, the second fan further includes a fourth air outlet. The fourth air outlet faces the chip area of the motherboard. The base case, the keyboard case, the first fan, the second fan and the air guide form a semi-enclosed structure; the air blown from the fourth air outlet of the second fan enters the semi-enclosed structure, flows through the chip area, and flows out from the second opening area. Both the fourth air outlet and the second air outlet blow air to the chip area in the semi-enclosed structure, which further increases the heat dissipation effect of the notebook computer chip area.

In a possible implementation manner, the air guide member is in contact with a casing of the second fan. The distance between the contact area of the second fan and the air guide member and the fourth air outlet is less than a preset distance. The semi-enclosed structure is equivalent to setting up air duct isolation in the notebook computer. Since the contact area between the second fan and the air guide is relatively close to the fourth air outlet, it can prevent the air blown out of the fourth air outlet from being sucked again. Return to the second fan to form a return flow.

In a possible implementation manner, a side of the second fan on which the third air outlet is provided is adjacent to a side on which the fourth air outlet is provided. In this way, on the basis of ensuring that the fourth air outlet faces the chip area, the third air outlet of the second fan can be more compatible with the structure of the existing notebook computer without hindering the layout of the input and output ports on the side of the notebook computer.

In a possible implementation manner, the fourth air outlet is located inside the semi-enclosed structure. In this way, all the air blown out of the fourth air outlet can enter the semi-enclosed structure, further improving the heat dissipation efficiency of the chip area. On the other hand, it also prevents the wind blown out of the fourth air outlet from running around in the area of the notebook computer except the semi-enclosed structure, so as to cause interference to other devices.

In a possible implementation manner, the air output volume of the third air outlet is greater than the air output volume of the fourth air outlet. Since the fourth air outlet blows directly to the chip area, a relatively small wind can bring a greater heat dissipation effect. This arrangement can maintain a higher height of the third air outlet on the premise of improving the heat dissipation effect of the chip area. cooling capacity.

In a possible implementation manner, the base case forms the bottom surface of the semi-enclosed structure, the keyboard case forms the top surface of the semi-enclosed structure, and the first fan is provided with the second The side of the air outlet, the side of the second fan on which the fourth air outlet is provided, and the air guiding member constitute the side of the semi-enclosed structure. With the aid of the existing structure of the notebook computer, this layout forms a semi-enclosed structure through the air guide. It can be seen that this solution adds fewer components and is more compatible with the structure of the existing notebook computer.

In a possible implementation manner, the second air outlet is located between the first air outlet and the second air outlet. In a notebook computer, the chip area is usually located in the middle of the base of the notebook computer, and the second air outlet is arranged in the middle, which can be closer to the chip area, thus further improving the heat dissipation effect of the chip area.

In a second aspect, the present application provides a notebook computer, which includes a keyboard casing, a base casing, a first fan, a second fan, a first heat dissipation fin, a second heat dissipation fin, and an air guide. Wherein, the keyboard housing is provided with a rotating shaft area, and the keyboard housing is connected to the notebook screen through the rotating shaft of the rotating shaft area; the rotating shaft area is provided with a first opening area, a second opening area and a second opening area. Three opening areas, the second air outlet is located between the first air outlet and the second air outlet. The base shell, the base shell is connected with the keyboard shell to form a cavity; the cavity is provided with a main board, a first fan, a first heat dissipation fin, a second fan, a second heat dissipation fin and a guide wind parts. The first fan is provided with a first air outlet and a second air outlet, the side on which the first air outlet is provided on the first fan is adjacent to the side on which the second air outlet is provided, and the first The air outlet faces the first heat dissipation fin, and the wind blown out of the first air outlet flows through the first heat dissipation fin and then flows out from the first opening area; the second air outlet faces the chip of the main board Area. The second fan is provided with a third air outlet and a fourth air outlet, the side on which the third air outlet is provided on the second fan is adjacent to the side on which the fourth air outlet is provided, and the third The air outlet faces the second heat dissipation fin, and the air blown out of the third air outlet flows out from the third opening area after passing through the second heat dissipation fin; the fourth air outlet faces the chip of the motherboard. Area. One end of the air guide is in contact with the shell of the first fan, and the other end of the air guide is in contact with the shell of the second fan. The base shell, the keyboard shell, the first fan, the second fan, and the air guide form a semi-enclosed structure; the base shell forms the bottom surface of the semi-enclosed structure, The keyboard case constitutes the top surface of the semi-enclosed structure, the first fan is provided with the side of the second air outlet, the second fan is provided with the side of the fourth air outlet and the The air guiding element constitutes a side surface of the semi-enveloping structure. The wind blown from the second air outlet of the first fan enters the semi-enclosed structure, flows through the chip area, and flows out from the second opening area; blows out from the fourth air outlet of the second fan The wind enters the semi-enclosed structure, flows through the chip area, and flows out from the second opening area. In this way, on the one hand, the airflow discharged from the first air outlet is used to cool the first heat dissipation fins, and the airflow discharged from the third air outlet is used to cool the second heat dissipation fins, thereby achieving heat dissipation for cooling electronic components inside the notebook computer. On the other hand, the wind from the second air outlet of the first fan cools the chip area, and the wind from the fourth air outlet of the second fan also cools the chip area, which improves the heat dissipation effect on the chip area.

Description of drawings

FIG. 1 is a schematic structural diagram of a notebook computer provided by an embodiment of the present application;

Fig. 2a is a schematic structural diagram of a notebook base provided by an embodiment of the present application;

Fig. 2b is a partially enlarged view of area A of the notebook base shown in Fig. 2a;

Fig. 2c is an enlarged view of the first fan shown in Fig. 2a;

Fig. 3 is an exploded view of the notebook base shown in Fig. 2a;

Figure 4a is a plan view of the notebook base shown in Figure 2a;

Fig. 4b is a schematic diagram of the air outlet effect of the first air outlet and the second air outlet of the first fan in the plane of the notebook base shown in Fig. 4a;

Fig. 5a is a schematic structural diagram of another notebook base provided by the embodiment of the present application;

Fig. 5b is a partially enlarged view of area B of the notebook base shown in Fig. 5a;

Fig. 5c is an enlarged view of the first fan and the second fan shown in Fig. 5a;

Fig. 6 is an exploded view of the notebook base shown in Fig. 5a;

Figure 7 is a plan view of the notebook base shown in Figure 5a;

Fig. 8a exemplarily shows a schematic structural view of another notebook base provided by an embodiment of the present application;

Fig. 8b is a partially enlarged view of area C of the notebook base shown in Fig. 8a;

Fig. 8c is an enlarged view of the first fan and the second fan shown in Fig. 8a;

Fig. 9 is an exploded view of the notebook base shown in Fig. 8a;

Figure 10 is a plan view of the notebook base shown in Figure 8a;

Fig. 11 is a plan view of another notebook base provided by the embodiment of the present application;

Fig. 12 is a schematic diagram of the temperature in each area of the notebook base in the prior art;

FIG. 13 is a schematic diagram of temperatures in various regions of the notebook base when the embodiment shown in FIG. 2a is applied according to the embodiment of the present application.

The reference signs in the accompanying drawings of the embodiments of the present application are as follows:

10——notebook screen;

20——notebook base;

201—keyboard casing;

202——base shell;

2011 - the axis area;

2012 - the first opening area;

2013 - the second opening area;

2014 - the third opening area;

203 - main board;

2031 - chip area;

2032—Central Processing Unit (CPU);

2033——Graphics Processing Unit (GPU);

2034 - other devices;

30 - the first fan;

301—the first air outlet;

302——the second air outlet;

303——the first cooling fin;

304 - uniform temperature plate;

40 - the second fan;

401—the third air outlet;

402——the fourth air outlet;

403——the second cooling fin;

50——wind guide;

501 - the first distance;

502 - the second distance.

Detailed ways

FIG. 1 exemplarily shows a schematic structural diagram of a notebook computer provided by an embodiment of the present application. As shown in FIG. 1 , a notebook computer includes a notebook screen 10 and a notebook base 20 . A rotating shaft area 2011 is provided on the side of the notebook base 20 close to the notebook screen 10 , and the notebook screen 10 and the notebook base 20 are connected through the rotating shaft disposed in the rotating shaft area 2011 .

In the embodiment of the present application, one or two fans for heat dissipation are provided on the notebook base 20. When one fan is provided on the notebook base 20, the fan is provided with two air outlets, and the fan can be provided on one side of the motherboard. When the notebook base 20 is provided with two fans, one of the fans is provided with two air outlets, and the other fan can be provided with one air outlet or two air outlets; and the two fans can be arranged on two sides of the motherboard. side.

2a, 2b, 2c, 3, 4a and 4b in the embodiment of the present application, the notebook computer includes a first fan 30, and the first fan 30 is provided with a first air outlet 301 and a second air outlet 302 Take an example as an example;

Figure 5a, Figure 5b, Figure 5c, Figure 6, and Figure 7 in the embodiment of the present application show that the notebook computer includes a first fan 30 and a second fan 40, and the first fan 30 is provided with a first air outlet 301 and a second air outlet The air outlet 302, the second fan 40 is provided with the third air outlet 401 as an example for an exemplary introduction;

Figure 8a, Figure 8b, Figure 8c, Figure 9, and Figure 10 in the embodiment of the present application include a first fan 30 and a second fan 40 in a notebook computer, and the first fan 30 is provided with a first air outlet 301 and a second air outlet 302, the second fan 40 is provided with a third air outlet 401 and a fourth air outlet 402 as an example for an example introduction.

The implementation of the notebook computer including the first fan 30 shown in FIG. 2 a , FIG. 2 b , FIG. 2 c , FIG. 3 , FIG. 4 a and FIG. 4 b will be described below.

Fig. 2a exemplarily shows a schematic structural diagram of the notebook base 20 in Fig. 1, Fig. 2b is a partially enlarged view of area A of the notebook base shown in Fig. 2a, Fig. 2c is a schematic structural diagram of the first fan in Fig. 2a, Fig. 3 It is an exploded view of the notebook base shown in FIG. 2a. As shown in FIGS. 2031, CPU2032, GPU2033, the first fan 30, the first cooling fin 303 and the uniform temperature plate 304; the shaft area 2011 is provided with the first opening area 2012, the second opening area 2013, and the first fan 30 is provided with the first air outlet 301 and the second air outlet 302.

As shown in FIG. 2 a , FIG. 2 b and FIG. 3 , a cavity is formed after the keyboard housing 201 and the base housing 202 are engaged. A main board 203 is disposed between the keyboard case 201 and the base case 202 . Various electronic components, such as CPU2032, GPU2033 and other chips, can be arranged on the main board 203 . The main board 203 is provided with a chip area 2031 , and the chip area 2031 may include one or more chips provided on the main board 203 , for example, the chip area 2031 includes a CPU 2032 and a GPU 2033 . In an optional implementation manner, the chip area 2031 may also include other electronic components disposed on the main board 203 except the chip.

The chips on the motherboard 203 can be arranged on the uniform temperature plate 304 , and other electronic components except the chips can also be arranged on the uniform temperature plate 304 . The vapor chamber 304 is connected to the first cooling fins 303 . The electronic components disposed on the vapor chamber 304 will generate heat during operation, and the vapor chamber 304 can transfer the heat generated by the electronic components disposed thereon to the first heat dissipation fins 303 . In another optional embodiment, the temperature chamber 304 can also be replaced by a heat pipe, one end of the heat pipe can be thermally connected to the electronic component, and the other end can be connected to the first heat dissipation fin 303, and the heat pipe can be used to connect the connected electronic component The heat is transferred to the first heat dissipation fins 303 .

As shown in Figure 2a, Figure 2b and Figure 3, the first fan 30 includes a first side and a second side, the first side and the second side are adjacent to each other, the first air outlet 301 is located on the first side, and the second air outlet The tuyere 302 is located on the second side. It can also be described as: the first air outlet 301 and the second air outlet 302 are respectively located on two adjacent sides of the first fan 30 .

The hinge area 2011 provided with the first opening area 2012 and the second opening area 2013 can be disposed on the keyboard casing 201 on the side of the keyboard casing 201 close to the notebook screen 10 . The first air outlet 301 of the first fan 30 faces the first opening area 2012 of the rotating shaft area 2011 . The first cooling fins 303 can be disposed between the first air outlet 301 and the first opening area 2012 .

As shown in FIG. 2 a , the air guide 50 is disposed on the base shell, and the second air outlet 302 of the first fan 30 faces the chip area 2031 of the motherboard 203 . The base case 202 , the keyboard case 201 , the first fan 30 and the air guide 50 form a semi-enclosed structure. Specifically, the base housing 202 is the top surface of the semi-enclosed structure, the keyboard housing 201 is the bottom surface of the semi-enclosed structure, the side of the second air outlet 302 provided on the first fan, and the air guide 50 form the semi-enclosed structure. The side of the structure that has a surrounding effect, the opening in the semi-enclosing structure faces the second opening area, the opening in the semi-enclosing structure can also be referred to as an unenclosed side of the enclosing structure, and can also be described as the enclosing structure The unsurrounded side is the position of the second opening area 2013 of the rotating shaft area 2011 . The electronic components of the chip area 2031 are included inside the semi-surrounding structure. The second air outlet 302 faces the interior of the semi-enclosed structure.

Fig. 4a is a plan view of the notebook base shown in Fig. 2a. Fig. 4a schematically shows the trend of the wind blown from the first air outlet 301 by the first fan 30 in the notebook computer shown in Fig. 2a, and the direction of the wind blown from the second outlet A schematic diagram of the direction of the wind blown out by the tuyere 302 . As shown in Figure 4a, on the one hand, the heat generated by the CPU 2032 and the GPU 2033 is transferred to the first cooling fin 303 through the temperature chamber 304, and the airflow discharged by the first fan 30 through the first air outlet 301 flows through the first cooling fin After 303, it is discharged through the first opening area 2012. During this process, the airflow discharged from the first air outlet 301 is used to cool the first heat dissipation fins 303 , so as to achieve heat dissipation for cooling the electronic components inside the notebook computer. On the other hand, the air blown from the second air outlet 302 of the first fan 30 enters the semi-enclosed structure, flows through the chip area 2031 , and flows out from the second opening area 2013 . It can be seen that the wind from the first air outlet 301 of the first fan 30 cools the chip area 2031, and the wind from the second air outlet 302 of the first fan 301 also cools the chip area 2031, which improves the heat dissipation of the chip area 2031 Effect. Secondly, since the base case 202, the keyboard case 201, the first fan 30 and the air guide 50 form a semi-enclosed structure, it is equivalent to setting an air duct in the keyboard of a notebook computer. In this way, the air blown out by the second air outlet 302 can flow through the chip area 2031 as much as possible and then flow out from the second opening area 2013, which improves the heat dissipation effect. Again, the first distance 501 between the contact area and the second air outlet 302 at the end of the air guide 50 in contact with the shell of the first fan 30 is within a preset distance range, and the preset distance can be set to a relatively short distance. For example, the contact area can be set at the edge of the second air outlet 302, or it can be set at a few millimeters away from the edge of the second air outlet 302, because the air guide 50 is in contact with the first fan 30. The location is relatively close to the second air outlet 302 , and the notebook computer is provided with air duct isolation, so the wind blown out by the second air outlet 302 can be prevented from being sucked back into the first fan 30 again to form backflow. In the fourth aspect, the second air outlet 302 faces the chip area 2031, and the chip area 2031 is arranged in the middle of the notebook computer. In this case, the setting of the second air outlet 302 will not affect the input of the two side layouts of the notebook computer. The output port is affected, which can be better compatible with existing notebook computers.

The shape of the air guide 50 in the embodiment of the present application can be adjusted according to the position and layout of specific components on the motherboard 203 of the notebook computer. As shown in FIG. 2 a , the air guiding member 50 may be an L-shaped structural member. Optionally, the air guiding member 50 may also be in other shapes, such as an inclined plane. The wind guide 50 may be a flexible structure. There are many kinds of specific materials, such as foam, flexible plastic parts, flexible metal parts and so on.

In an optional implementation, the size of the first air outlet 301 may be larger than the size of the second air outlet 302, so that the air discharged from the first fan 30 can be mainly discharged through the first air outlet 301, and the second The air outlet 302 can assist the exhaust to meet the heat dissipation requirement of the notebook computer. Figure 4b is a schematic diagram of the air outlet effect of the first air outlet and the second air outlet of the first fan in the plane of the notebook base shown in Figure 4a, as shown in Figure 4b, the second air outlet 302 is compared with the first air outlet 301 , the size of the second air outlet 302 is smaller than that of the first air outlet 301 , and the air volume of the second air outlet 302 is also smaller than that of the first air outlet 301 .

The implementation of the notebook computer shown in Fig. 5a, Fig. 5b, Fig. 6 and Fig. 7 including the first fan 30 and the second fan 40 is described below, and the first fan 30 includes the first air outlet 301 and the second air outlet 302. The second fan 40 includes a third air outlet 401.

Fig. 5a exemplarily shows a schematic structural view of the notebook base 20 in Fig. 1, Fig. 5b is a partial enlarged view of area B of the notebook base shown in Fig. 5a, and Fig. 5c is an enlarged view of the first fan and the second fan in Fig. 5a Figure 6 is an exploded view of the notebook base shown in Figure 5a, as shown in Figure 5a, Figure 5b, Figure 5c and Figure 6, the notebook base 20 includes a keyboard housing 201, a base housing 202, a shaft area 2011, a main board 203, chip area 2031, CPU2032, GPU2033, first fan 30, second fan 40, first heat dissipation fin 303, second heat dissipation fin 403 and uniform temperature plate 304; the shaft area 2011 is provided with a first opening area 2012, In the second opening area 2013 and the third opening area 2014 , the first fan 30 is provided with a first air outlet 301 and a second air outlet 302 , and the second fan 40 is provided with a third air outlet 401 .

As shown in FIG. 5 a , FIG. 5 b , FIG. 5 c and FIG. 6 , the keyboard housing 201 and the base housing 202 are engaged to form a cavity. A main board 203 is disposed between the keyboard case 201 and the base case 202 . For the description about the main board 203 , the chip area 2031 , and the first fan 30 , please refer to the relevant description in FIG. 2 a above, and details will not be repeated here.

As shown in FIG. 5 a , FIG. 5 b , FIG. 5 c and FIG. 6 , the temperature chamber 304 is connected to the first heat dissipation fin 303 and the second heat dissipation fin 403 . The temperature chamber 304 can transfer the heat generated by the electronic components disposed thereon to the first heat dissipation fins 303 and the second heat dissipation fins 403 . In another optional implementation manner, the temperature chamber 304 can also be replaced by a heat pipe, and the heat pipe can be connected to the first heat dissipation fin 303, the electronic component and the second heat dissipation fin 403 in turn, and the heat pipe can be used to connect the connected electronics The heat of the components is transferred to the first heat dissipation fins 303 and the second heat dissipation fins 403 .

As shown in Figure 5a, Figure 5b, Figure 5c and Figure 6, the first fan 30 and the second fan 40 are arranged on both sides of the chip area 2031, and the second opening area 2013 is located in the first opening area 2012 and the third opening area 2014 between. The second fan 40 includes a third side, and the third air outlet 401 is located on the third side. The third side is the side of the third opening area 2014 facing the rotating shaft area 2011 on the second fan 40 . The second cooling fins 403 can be disposed between the third air outlet 401 and the third opening area 2014 .

As shown in Figure 5a, Figure 5b, Figure 5c and Figure 6, the air guide 50 can be arranged between the first fan 30 and the second fan 40, and the air guide 50 can be connected with the first fan 30 and the second fan 40. case contact. As shown in FIG. 5 a , the air guide 50 is disposed on the base case, and the second air outlet 302 of the first fan 30 faces the chip area 2031 of the motherboard 203 . The base case 202 , the keyboard case 201 , the first fan 30 , the second fan 40 and the air guide 50 form a semi-enclosed structure. Specifically, the base housing 202 is the top surface of the semi-enclosed structure, the keyboard housing 201 is the bottom surface of the semi-enclosed structure, and the first fan is provided with the side of the second air outlet 302, the air guide 50, and the second fan. The fourth side constitutes the side with surrounding effect in the semi-enclosed structure, and the unenclosed side in the semi-enclosed structure is the position of the second opening area 2013 of the rotating shaft area 2011 . Wherein, the fourth side of the second fan is the side adjacent to the third side on the second fan, and the fourth side faces the chip area 2031 , and the electronic components of the chip area 2031 are included inside the semi-enclosed structure. The second air outlet 302 faces the interior of the semi-enclosed structure.

Fig. 7 is a plan view of the notebook base shown in Fig. 5a. Fig. 7 schematically shows the trend of the wind blown by the first fan 30 from the first air outlet 301 in the notebook computer shown in Fig. 5a, and from the second air outlet The direction of the wind blown out by 302 and the direction of the wind blown out from the third air outlet 401 of the second fan 40 are schematic diagrams. As shown in Figure 7, on the one hand, the heat generated by the CPU2032 and the GPU2033 is transferred to the first heat dissipation fin 303 and the second heat dissipation fin 403 through the temperature chamber 304, and the airflow discharged by the first fan 30 through the first air outlet 301 After flowing through the first heat dissipation fins 303 , it is discharged through the first opening area 2012 . The airflow discharged from the second fan 40 through the third air outlet 401 flows through the second heat dissipation fins 403 and then is discharged through the third opening area 2014 . In this process, the airflow discharged from the first air outlet 301 is used to cool the first cooling fins 303, and the airflow discharged from the third air outlet 401 is used to cool the second cooling fins 403, thereby realizing the cooling of the internal electronic components of the notebook computer. . On the other hand, the air blown from the second air outlet 302 of the first fan 30 enters the semi-enclosed structure, flows through the chip area 2031 , and flows out from the second opening area 2013 . It can be seen that the wind from the first air outlet 301 of the first fan 30 cools the chip area 2031, and the wind from the second air outlet 302 of the first fan 30 also cools the chip area 2031, which improves the heat dissipation of the chip area 2031 Effect. Secondly, since the base case 202, the keyboard case 201, the first fan 30, the second fan 40 and the air guide 50 form a semi-enclosed structure, it is equivalent to a notebook computer. The keyboard is provided with air duct isolation, so that the wind blown out by the second air outlet 302 can flow through the chip area 2031 as much as possible and then flow out from the second opening area 2013, which improves the heat dissipation effect. Again, the first distance 501 between the contact area and the second air outlet 302 at the end of the air guide 50 in contact with the shell of the first fan 30 is within a preset distance range, and the preset distance can be set to a relatively short distance. For example, the contact area can be set at the edge of the second air outlet 302, or it can be set at a few millimeters away from the edge of the second air outlet 302, because the air guide 50 is in contact with the first fan 30. The location is relatively close to the second air outlet 302 , and the notebook computer is provided with air duct isolation, so the wind blown out by the second air outlet 302 can be prevented from being sucked back into the first fan 30 again to form backflow. In the fourth aspect, the second air outlet 302 faces the chip area 2031, and the chip area 2031 is arranged in the middle of the notebook computer. In this case, the setting of the second air outlet 302 will not affect the input of the two side layouts of the notebook computer. The output port is affected, which can be better compatible with existing notebook computers.

The shape of the air guide 50 in the embodiment of the present application can be adjusted according to the position and layout of specific components on the motherboard 203 of the notebook computer. As shown in FIG. 7 , the air guide 50 may be a linear structural member, and optionally, the air guide 50 may also be in other shapes, such as an inclined plane. The wind guide 50 may be a flexible structure. There are many kinds of specific materials, such as foam, flexible plastic parts, flexible metal parts and so on.

The implementation of the notebook computer shown in Fig. 8a, Fig. 8b, Fig. 8c, Fig. 9 and Fig. 10 including the first fan 30 and the second fan 40 is described below, and the first fan 30 includes the first air outlet 301 and the second fan 40. The second air outlet 302 , the second fan 40 includes a third air outlet 401 and a fourth air outlet 402 .

Fig. 8a exemplarily shows a schematic structural view of the notebook base 20 in Fig. 1, Fig. 8b is a partially enlarged view of area C of the notebook base shown in Fig. 8a, and Fig. 8c is a structure of the first fan and the second fan in Fig. 8a Schematic diagram, FIG. 9 is an exploded view of the notebook base shown in FIG. 8a. As shown in FIGS. 203, chip area 2031, CPU2032, GPU2033, first fan 30, second fan 40, first heat dissipation fin 303, second heat dissipation fin 403 and uniform temperature plate 304; the shaft area 2011 is provided with a first opening area 2012, In the second opening area 2013 and the third opening area 2014 , the first fan 30 is provided with a first air outlet 301 and a second air outlet 302 , and the second fan 40 is provided with a third air outlet 401 and a fourth air outlet 402 .

As shown in FIG. 8a , FIG. 8b , FIG. 8c and FIG. 9 , a cavity is formed after the keyboard housing 201 and the base housing 202 are engaged. A main board 203 is disposed between the keyboard case 201 and the base case 202 . For the description about the main board 203 , the chip area 2031 , and the first fan 30 , please refer to the relevant description in FIG. 2 a above, and details will not be repeated here. The vapor chamber 304 is connected to the first heat dissipation fin 303 and the second heat dissipation fin 403 . For the description of the vapor chamber 304, the first heat dissipation fin 303 and the second heat dissipation fin 403, the first opening area 2012, the second opening area 2013 and the third opening area 2014, please refer to the above-mentioned description in FIG. Let me repeat.

As shown in Figures 8a, 8b, 8c and 9, the second fan 40 includes a third side and a fourth side, the third air outlet 401 is located on the third side, and the fourth air outlet 402 is located on the fourth side. The third side is the side of the third opening area 2014 facing the rotating shaft area 2011 on the second fan 40 , the fourth side is adjacent to the third side, and the fourth air outlet 402 faces the chip area 2031 . It can also be described as: the third air outlet 401 and the fourth air outlet 402 are respectively located on two adjacent sides of the second fan 40 .

As shown in Figure 8a, Figure 8b, Figure 8c and Figure 9, the air guide 50 can be arranged between the first fan 30 and the second fan 40, and the air guide 50 can be connected with the first fan 30 and the second fan 40. case contact. As shown in Figure 8a, the air guide 50 is arranged on the base shell, the second air outlet 302 of the first fan 30 faces the chip area 2031 of the motherboard 203, and the second air outlet of the second fan 40 302 faces the chip area 2031 of the motherboard 203 . The base case 202 , the keyboard case 201 , the first fan 30 , the second fan 40 and the air guide 50 form a semi-enclosed structure. Specifically, the base housing 202 is the top surface of the semi-enclosed structure, the keyboard housing 201 is the bottom surface of the semi-enclosed structure, the side of the second air outlet 302, the air guide 50, and the second fan are provided on the first fan. The side with the fourth air outlet 402 constitutes the side of the semi-enclosed structure that has an enveloping effect, and the unenclosed side of the semi-enclosed structure is the position of the second opening area 2013 of the rotating shaft area 2011 . The electronic components of the chip area 2031 are included inside the semi-surrounding structure. The second air outlet 302 and the fourth air outlet 402 face the inside of the semi-enclosed structure.

Fig. 10 is a plan view of the notebook base shown in Fig. 8a. Fig. 10 schematically shows the trend of the wind blown by the first fan 30 from the first air outlet 301 in the notebook computer shown in Fig. 8a, and from the second air outlet 302 , the direction of the wind blown from the third air outlet 401 of the second fan 40 , and the direction of the wind blown from the fourth air outlet 402 of the second fan 40 are schematic diagrams. As shown in Figure 10, on the one hand, the heat generated by the CPU2032 and the GPU2033 is transferred to the first heat dissipation fin 303 and the second heat dissipation fin 403 through the temperature chamber 304, and the airflow discharged by the first fan 30 through the first air outlet 301 After flowing through the first heat dissipation fins 303 , it is discharged through the first opening area 2012 . The airflow discharged from the second fan 40 through the third air outlet 401 flows through the second heat dissipation fins 403 and then is discharged through the third opening area 2014 . In this process, the airflow discharged from the first air outlet 301 is used to cool the first cooling fins 303, and the airflow discharged from the third air outlet 401 is used to cool the second cooling fins 403, thereby realizing the cooling of the internal electronic components of the notebook computer. . On the other hand, the air blown from the second air outlet 302 of the first fan 30 enters the semi-enclosed structure, flows through the chip area 2031 , and flows out from the second opening area 2013 . It can be seen that the wind from the first air outlet 301 of the first fan 30 cools the chip area 2031, and the wind from the second air outlet 302 of the first fan 30 also cools the chip area 2031, which improves the heat dissipation of the chip area 2031 Effect. And the air blown from the fourth air outlet 402 of the second fan 40 enters the semi-enclosed structure, flows through the chip area 2031 , and flows out from the second opening area 2013 . It can be seen that the wind of the third air outlet 401 of the second fan 40 cools the chip area 2031, and the wind of the fourth air outlet 402 of the second fan 40 also cools the chip area 2031, which improves the heat dissipation of the chip area 2031 Effect. Secondly, since the base case 202, the keyboard case 201, the first fan 30, the second fan 40 and the air guide 50 form a semi-enclosed structure, it is equivalent to a notebook computer. Air duct isolation is set in the keyboard, so that the wind blown by the second air outlet 302 can flow through the chip area 2031 as much as possible and then flow out from the second opening area 2013, and the wind blown by the fourth air outlet 402 can be as far as possible The heat flows out from the second opening area 2013 after passing through the chip area 2031, which improves the heat dissipation effect. Again, the first distance 501 between the contact area and the second air outlet 302 at the end of the air guide 50 in contact with the shell of the first fan 30 is within a preset distance range, and the preset distance can be set to a relatively short distance. For a small value, for example, the contact area can be set at the edge of the second air outlet 302 , or at a position a few millimeters away from the edge of the second air outlet 302 . And at one end of the air guiding member 50 in contact with the casing of the second fan 40, the second distance 502 between the contact area and the fourth air outlet 402 is within a preset distance range, and the preset distance can be set to a smaller value. For example, the contact area can be set at the edge of the fourth air outlet 402, or at a position a few millimeters away from the edge of the fourth air outlet 402, because the position where the air guide 50 contacts the first fan 30 It is closer to the second air outlet 302, and the position where the air guide 50 contacts the second fan 40 is closer to the fourth air outlet 402. Air duct isolation is set in the notebook computer, so the second air outlet 302 can be avoided. The air blown out is sucked back into the first fan 30 again to form backflow, and the wind blown out from the fourth air outlet 402 can also be prevented from being sucked back into the second fan 40 again to form backflow. In the fourth aspect, the second air outlet 302 faces the chip area 2031, and the chip area 2031 is arranged in the middle of the notebook computer, and the fourth air outlet 402 faces the chip area 2031, and the chip area 2031 is arranged in the middle of the notebook computer. , the setting of the second air outlet 302 and the fourth air outlet 402 will not affect the input and output ports of the two side layouts of the notebook computer, which can be better compatible with existing notebook computers.

In an optional implementation, the size of the third air outlet 401 can be larger than the size of the fourth air outlet 402, so that the air discharged from the second fan 40 can be mainly discharged through the third air outlet 401, and the fourth The air outlet 402 can assist the exhaust to meet the heat dissipation requirement of the notebook computer.

The shape of the air guide 50 in the embodiment of the present application can be adjusted according to the position and layout of specific components on the motherboard 203 of the notebook computer. As shown in FIG. 10 , the air guide 50 may be a linear structural member, and optionally, the air guide 50 may also be in other shapes.

Fig. 11 is a plan view of another notebook base provided by the embodiment of the present application. As shown in Fig. 11, Fig. 11 shows an exemplary schematic diagram of another air guide 50 that may exist in Fig. 10, as shown in Fig. As shown in FIG. 11 , other devices 2034 may also be included in the semi-enclosed structure shown in FIG. 11 . The air guide is a flexible part, and the shape of the air guide can be set according to the actual distribution of the devices included in the semi-enclosed structure, for example, the air guide can be bent into the structure shown in FIG. 11 .

For the heat dissipation requirements of notebook computers, there are still several situations. One situation is that two fans are arranged on both sides of the chip area of notebook computers, but the two fans are only provided with one air outlet, and the outlets of the two fans The air outlets all face the cooling fins. The heat dissipation effect of this embodiment is worse than that of the solutions shown in FIGS. 2 a to 11 above.

In another case, two fans are arranged on both sides of the chip area of the notebook computer, but the two fans are only provided with one air outlet, and the air outlets of the two fans are all facing the cooling fins, and the notebook computer A new fan is added to the base of the chip, and the fan is provided with an air outlet, and the air outlet faces the chip area. The newly added fan in this solution will increase the weight and noise of the notebook computer, and the wind blown by the fan will scatter in the base shell and the keyboard shell of the notebook computer, and also form backflow.

In another case, two fans are arranged on both sides of the chip area of the notebook computer, but the two fans are all provided with two air outlets, the main air outlets of the two fans are all facing the cooling fins, and the two fans are provided with two air outlets. The secondary air outlets of the two fans face the direction opposite to the chip area, that is, the secondary air outlets of the two fans face the side of the notebook computer. But generally speaking, some input and output interfaces are arranged on the two sides of the notebook computer. If the air outlet is set on the side of the notebook computer, it will no longer be suitable for the layout of the input and output interfaces, which will have a great impact on the layout of the internal parts of the overall notebook computer, and the air blown by the secondary air outlets of the two fans in this layout will directly The outside flows out from the side of the notebook computer and does not flow through the chip area, so this solution has a relatively small heat dissipation effect on the chip area.

Figure 12 is a schematic diagram of the temperature in each area of the notebook base in the prior art, and Figure 13 is a schematic diagram of the temperature in each area of the notebook base when applying the embodiment shown in Figure 2a provided by the embodiment of the present application. It can be seen that the current application When there is a technical heat dissipation solution, as shown in Figure 12, the temperatures of several positions on the keyboard casing of the notebook computer are respectively: 43.5 degrees Celsius (degC), 51.2degC, 52.3degC and 44.9degC. When the embodiment provided in FIG. 2 a of the embodiment of the present application is applied, the temperatures of several corresponding positions on the keyboard casing of the notebook computer are respectively: 40.5 degC, 44 degC, 46.3 degC and 42.5 degC. And it can be seen from Figure 12 and Figure 13 as a whole that the grayscale of the keyboard case shown in Figure 12 is darker, the darker the grayscale, the higher the temperature, and the grayscale of the keyboard case shown in Figure 13 is lighter , the lighter the gray scale, the lower the temperature. Based on FIG. 12 and FIG. 13 , it can be seen that the solution provided by the embodiment of the present application has a better cooling effect on the notebook computer.

Claims (15)

1. A notebook computer, characterized in that, comprising: A keyboard housing, the keyboard housing is provided with a shaft area, and the keyboard housing is connected to the notebook screen through the shaft of the shaft area; the shaft area is provided with a first opening area and a second opening area; A base shell, the base shell is connected to the keyboard shell to form a cavity; a main board, a first fan, and an air guide are arranged in the cavity; The first fan is provided with a first air outlet and a second air outlet, the air blown by the first air outlet flows out from the first opening area, and the second air outlet faces the chip area of the motherboard; At least the base case, the keyboard case, the first fan and the air guide form a semi-enclosed structure; the chip area is located inside the semi-enclosed structure, and the opening of the semi-enclosed structure Towards the second opening area; the wind blown from the second air outlet of the first fan enters the semi-enclosed structure, flows through the chip area, and flows out from the second opening area. 2. The notebook computer according to claim 1, wherein the air guiding member is in contact with the casing of the first fan; The distance between the contact area of the first fan and the air guide member and the second air outlet is less than a preset distance. 3. The notebook computer according to claim 1 or 2, wherein the side of the first fan on which the first air outlet is provided is adjacent to the side on which the second air outlet is provided. 4. The notebook computer according to any one of claims 1 to 3, wherein the second air outlet is located inside the semi-enclosed structure. 5. The notebook computer according to any one of claims 1 to 4, wherein the air output volume of the first air outlet is greater than the air output volume of the second air outlet. 6. The notebook computer according to any one of claims 1 to 5, wherein the base housing forms the bottom surface of the semi-enclosed structure, and the keyboard housing forms the top surface of the semi-enclosed structure, The side of the first fan on which the second air outlet is provided and the air guiding member form the side of the semi-enclosed structure. 7. The notebook computer according to any one of claims 1 to 5, further comprising a second fan provided with a third air outlet; The shaft area is also provided with a third opening area; The air blown out by the third air outlet flows out from the third opening area. 8. The notebook computer according to claim 7, wherein the second fan further comprises a fourth air outlet; The fourth air outlet faces the chip area of the motherboard; The base case, the keyboard case, the first fan, the second fan and the air guide form a semi-enclosed structure; the air blown from the fourth air outlet of the second fan enters the semi-enclosed structure, flows through the chip area, and flows out from the second opening area. 9. The notebook computer according to claim 8, wherein the air guiding member is in contact with the casing of the second fan; The distance between the contact area of the second fan and the air guide member and the fourth air outlet is less than a preset distance. 10. The notebook computer according to claim 8 or 9, wherein the side of the second fan on which the third air outlet is provided is adjacent to the side on which the fourth air outlet is provided. 11. The notebook computer according to any one of claims 8 to 10, wherein the fourth air outlet is located inside the semi-enclosed structure. 12. The notebook computer according to any one of claims 8 to 11, characterized in that, the air output volume of the third air outlet is greater than the air output volume of the fourth air outlet. 13. The notebook computer according to any one of claims 8 to 12, wherein the base housing forms the bottom surface of the semi-enclosed structure, and the keyboard housing forms the top surface of the semi-enclosed structure, The side of the first fan provided with the second air outlet, the side of the second fan provided with the fourth air outlet, and the air guide member constitute the side of the semi-enclosed structure. 14. The notebook computer according to any one of claims 7 to 13, wherein the second air outlet is located between the first air outlet and the second air outlet. 15. A notebook computer, characterized in that it comprises: A keyboard housing, the keyboard housing is provided with a rotating shaft area, and the keyboard housing is connected to the notebook screen through the rotating shaft of the rotating shaft area; the rotating shaft area is provided with a first opening area, a second opening area and a third opening area, the second air outlet is located between the first air outlet and the second air outlet; The base shell, the base shell is connected with the keyboard shell to form a cavity; the cavity is provided with a main board, a first fan, a first heat dissipation fin, a second fan, a second heat dissipation fin and a guide wind parts; The first fan is provided with a first air outlet and a second air outlet, the side on which the first air outlet is provided on the first fan is adjacent to the side on which the second air outlet is provided, and the first The air outlet faces the first heat dissipation fin, and the wind blown out of the first air outlet flows through the first heat dissipation fin and then flows out from the first opening area; the second air outlet faces the chip of the main board Area; The second fan is provided with a third air outlet and a fourth air outlet, the side on which the third air outlet is provided on the second fan is adjacent to the side on which the fourth air outlet is provided, and the third The air outlet faces the second heat dissipation fin, and the air blown out of the third air outlet flows out from the third opening area after passing through the second heat dissipation fin; the fourth air outlet faces the chip of the motherboard. Area; One end of the air guide is in contact with the casing of the first fan, and the other end of the air guide is in contact with the casing of the second fan; The base shell, the keyboard shell, the first fan, the second fan, and the air guide form a semi-enclosed structure; the base shell forms the bottom surface of the semi-enclosed structure, The keyboard case constitutes the top surface of the semi-enclosed structure, the first fan is provided with the side of the second air outlet, the second fan is provided with the side of the fourth air outlet and the The wind guide part constitutes the side of the semi-enclosed structure; The wind blown from the second air outlet of the first fan enters the semi-enclosed structure, flows through the chip area, and flows out from the second opening area; blows out from the fourth air outlet of the second fan The wind enters the semi-enclosed structure, flows through the chip area, and flows out from the second opening area.