CN110591583A - 一种uv增粘后可高温降粘的制程用的过程膜生产方法及其产品 - Google Patents
一种uv增粘后可高温降粘的制程用的过程膜生产方法及其产品 Download PDFInfo
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Abstract
本发明公开了一种UV增粘后可高温降粘的制程用的过程膜生产方法及其产品，过程膜包括：基材、压敏胶层和离型膜，基材至少一面经过电晕处理后，放置不少于3天；压敏胶层为UV增粘胶层，包含压敏胶层质量0.1%—5%的纳米晶珠和0.1—5%的光引发剂，涂覆于基材的电晕面上，UV后的剥离力为500—5000g/25mm；压敏胶层与离型膜的离型面进行覆合，并进行熟化。本发明生产方法得到的过程膜可以通过高温的方式，在UV增粘后粘力大幅度降低，解决了UV增粘膜在UV增粘后无法撕离的问题，使得生产过程中因贴合不良等原因需要撕离返工的问题得以解决，增加工艺过程的稳定性，同时提高了成品率和效率，应用于模组的制程过程。
Description
技术领域
本发明涉及胶带领域，具体是涉及一种UV增粘后可高温降粘的制程用的过程膜生产方法及其产品。
背景技术
随着电子屏幕生产的高精度和超薄化，开发出制程膜类保护膜，如：
申请号：201810106104.9涉及保护膜技术领域，尤其是涉及一种UV减粘组合物、UV减粘膜及其制备方法。所述UV减粘组合物主要由按重量百分比计的如下原料制成：丙烯酸酯压敏胶树脂20％-50％、多官能度低聚物和/或多官能度单体1％-30％、交联剂0.3％-2％、抗静电剂0.1％-5％、分散剂0-2％、流平剂0.2％-2％、光引发剂0.5％-5％和溶剂25％-60％。所述UV减粘膜包括依次贴合的基材层、UV减粘层和离型膜层，所述UV减粘层是由所述UV减粘组合物涂布于基材层表面，烘干熟化得到的。所述UV减粘组合物，具有优异的粘合力，UV照射前具有高粘合力，剥离力高，UV照射后具有低粘合力，UV剥离力低，抗静电效果好。
实用新型专利号：ZL201420369939.0涉及保护膜领域，尤其涉及一种UV减粘保护膜。该UV减粘保护膜包括PET基材层、设于PET基材层上方的UV减粘粘胶剂层以及设于UV减粘粘胶剂层上方的PET离型膜层。该UV减粘保护膜具有UV光照射前超高粘性，UV光照射后超低粘性的优良性能，降低产品的成本，并且具有较高的制程良率，在半导体晶圆切割、打磨表面保护、触控屏OGS二次强化耐酸膜等产品方面得到广泛应用。
申请号：201810105862.9涉及保护膜技术领域，尤其是涉及一种UV减粘组合物、UV减粘膜及其制备方法。所述UV减粘组合物主要由按重量百分比计的如下原料制成：丙烯酸酯压敏胶树脂20％-50％、多官能度低聚物和/或多官能度单体1％-30％、交联剂0.3％-2％、热引发剂0.1％-5％、光引发剂0.5％-5％和溶剂25％-60％。所述UV减粘膜包括依次贴合的基材层、UV减粘层和离型膜层，其中，所述UV减粘层是由所述UV减粘组合物涂布于基材层表面，烘干熟化得到的。所述UV减粘组合物，具有优异的粘合力，UV照射前具有高粘合力，剥离力高，UV照射后具有低粘合力，UV剥离力低，并且长时间储存后不留残胶。
申请号：201710242271.1提供了一种耐热型UV减粘膜，依次包括基材层、UV光敏胶黏剂层和离型膜层。还提供了一种所述UV光敏胶黏剂层的制备方法，按重量百分比计包括组分：30-50％溶剂型耐高温聚丙烯酸酯压敏胶粘剂、1-25％低分子混合添加剂、0.1-3％双官能团或多官能团特殊添加剂、0.1-1.5％光引发剂、0.5-2％硬化剂、35-60％溶剂。还提供了一种所述耐热型UV减粘膜的制备方法。本发明不仅提高了UV光敏胶黏剂对电晕PET基材的密着性和耐高温性能，且减少了底涂层处理技术，优化了产品结构。
UV增粘后可高温降粘的制程用的过程膜，在UV前粘力较低，UV后具有超高的粘力，可保证模组在加工处理过程中保持稳定、不脱落、不飞边，并保护未加工部分。若因特殊情况需要揭离，只需使其进行高温处理即可降低其粘力，易撕离。
目前市场上使用的UV增粘膜经过UV增粘后粘力很高，若出现UV后贴合缺陷等相关问题需要返工重新贴合的情况，则无法顺利撕离保护膜或撕离后出现残胶，最终导致模组出现质量问题或报废，从而影响生产效率和成本。
发明内容
针对现有技术的不足，本发明目的在于：提供一种UV增粘后可高温降粘的制程用的过程膜生产方法，以有效的解决UV增粘膜经过UV增粘后难以撕离的情况。
本发明的再一目的在于：提供一种上述生产方法获得的产品。
本发明目的通过下述技术方案实现：一种UV增粘后可高温降粘的制程用的过程膜生产方法，包括：基材、压敏胶层、离型膜，其中，
所述基材为厚度25-200μm的PET、PC或COP光学薄膜，至少一面经过电晕处理后，在室温或40-60℃高温放置不少于3天；
所述压敏胶层为UV增粘胶层，包含压敏胶层质量0.1%—5%的纳米晶珠和0.1—5%的光引发剂，涂覆于基材的电晕面之上并覆盖有离型膜，UV前剥离力为30—200g/25mm，UV后的剥离力为500—5000g/25mm；
所述压敏胶层与离型膜的离型面进行覆合，并进行熟化。
其中，所述的纳米晶珠，包括纳米级改性石墨晶珠或纳米级改性玻璃晶珠等，使所述压敏胶层UV增粘后经过50℃—120℃条件下0.5—5h后，其剥离力降低至30—500g/25mm，较优的降低至30—100g/25mm。
该类晶珠在45℃—120℃温度范围内，其体积随温度升高呈线性膨胀，减小胶层与被贴物的接触面积，从而减小剥离力，所述晶珠的添加比例为所述压敏胶层质量的0.1%—5%，确保晶珠能在熟化完成后迁移至压敏胶层表层，随环境温度升高而线性膨胀，减小胶层与被贴物的接触面积，从而达到剥离力降低的目的。
优选的，所述压敏胶层的厚度为3—30μm，针对不同的工艺要求和使用场景可选择不同的胶层厚度。
优选的，所述压敏胶层中所述光引发剂的吸收波长在200—400nm内，可根据客户使用波长及能量的不同，选择不同种类及添加量的光引发剂。
所述离型膜为厚度25—150μm 的PET离型膜，以达到保护压敏胶层的作用。
在上述方案基础上，所述离型膜的背面和基材表面的表面张力≥48dyn。
所述熟化时间为3—10天，放置环境为室温或40-60℃高温，待剥离力稳定后，即熟化完成。
本发明还提供了一种UV增粘后可高温降粘的制程用的过程膜，根据上述生产方法制备得到的。
所述基材为PET、PC或COP等光学薄膜可以根据柔软度、挺度、光学性能的不同有效满足不同工艺环境下不同尺寸、不同外形OLED模组的保护需求。
所述压敏胶层可针对不同工艺环境、不同尺寸和贴覆材料的模组选择不同的剥离力范围，保证制程过程的稳定性。
附图说明
通过下面结合附图对其示例性实施例进行的描述，本发明上述特征和优点将会变得更加清楚和容易理解。
图1是一种UV增粘后可高温降粘的制程用的过程膜的结构示意图。
图2是一种UV增粘后可高温降粘的制程用的过程膜的生产过程示意图。
图中标号说明：
1——基材，2——压敏胶层，3——离型膜。
具体实施方式
下面结合附图对本发明作进一步详细说明。
如图1所示，一种UV增粘后可高温降粘的制程用的过程膜，包括：基材1、压敏胶层2、离型膜3，其按下述方法制备：
一种UV增粘后可高温降粘的制程用的过程膜的生产方法，包括以下步骤：
（a）选择厚度25-200μm的PET、PC或COP光学薄膜为基材1，在基材一面经过电晕处理；
（b）将电晕好的基材在室温或40-60℃高温放置不少于3天，以便电晕产生的臭氧分解，防止对后段生产产生影响；
（c）在基材的电晕面上涂覆厚度为3—30μm的压敏胶层，所述压敏胶层2为UV增粘胶层，包含压敏胶层质量0.1%—5%的纳米晶珠和0.1—5%的光引发剂，涂覆完成后覆盖厚度为25—150um的PET离型膜3，得料膜，本发明UV增粘胶层UV前剥离力为30—200g/25mm，UV后的剥离力为500—5000g/25mm；
（d）将生产完成的料膜进行熟化处理，在室温或40-60℃高温熟化3—10天，待剥离力稳定后，即熟化完成。
所述的纳米晶珠，包括纳米级改性石墨晶珠或纳米级改性玻璃晶珠，使所述的压敏胶层UV增粘后经过50℃—120℃条件下0.5—5h后，其剥离力降低至30—500g/25mm。
所述光引发剂的吸收波长在200—400nm内。
所述离型膜3的背面和基材1表面的表面张力≥48dyn。
本发明所提供的UV增粘后可高温降粘的制程用的过程膜，UV前剥离力较低，UV后剥离力很高，可保证模组在有加工过程中研磨、切割过程中保持稳定、不脱落、不飞边，并保护未加工部分，满足不同用途的需求。针对生产过程中因贴合不良等原因需要撕离重工的问题，只需将其进行高温处理，即可降低其粘力，轻易撕下保护膜且无残胶，大幅度提高产品良率和效率。
Claims (8)
1.一种UV增粘后可高温降粘的制程用的过程膜生产方法，包括：基材（1）、压敏胶层（2）、离型膜（3），其特征在于，
所述基材（1）为厚度25-200μm的PET、PC或COP光学薄膜，至少一面经过电晕处理后，在室温或40-60℃高温放置不少于3天；
所述压敏胶层（2）为UV增粘胶层，包含压敏胶层质量0.1%—5%的纳米晶珠和0.1—5%的光引发剂，涂覆于基材（1）的电晕面之上并覆盖有离型膜（3），UV前剥离力为30—200g/25mm，UV后的剥离力为500—5000g/25mm；
所述压敏胶层（2）与离型膜（3）的离型面进行覆合，并进行熟化。
2.如权利要求1所述的UV增粘后可高温降粘的制程用的过程膜生产方法，其特征在于：所述的纳米晶珠，包括纳米级改性石墨晶珠或纳米级改性玻璃晶珠，使所述的压敏胶层UV增粘后经过50℃—120℃条件下0.5—5h后，其剥离力降低至30—500g/25mm。
3.如权利要求1或2所述的UV增粘后可高温降粘的制程用的过程膜生产方法，其特征在于：所述压敏胶层（2）的厚度为3—30μm。
4.如权利要求1所述的UV增粘后可高温降粘的制程用的过程膜生产方法，其特征在于：所述光引发剂的吸收波长在200—400nm内。
5.如权利要求1所述的UV增粘后可高温降粘的制程用的过程膜生产方法，其特征在于：所述离型膜（3）为PET离型膜，厚度为25—150um。
6.如权利要求1或5所述的UV增粘后可高温降粘的制程用的过程膜生产方法，其特征在于：所述离型膜（3）的背面和基材（1）表面的表面张力≥48dyn。
7.如权利要求1所述的UV增粘后可高温降粘的制程用的过程膜生产方法，其特征在于：所述熟化时间为3—10天，放置环境为室温或40-60℃高温，待剥离力稳定后，即熟化完成。
8.一种UV增粘后可高温降粘的制程用的过程膜，根据权利要求1至7任一项所述生产方法制备得到的。
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