CN110649973A - Optical Transmitting Assemblies, Optical Transceivers, and Optical Communication Systems - Google Patents

Abstract

The present application relates to a light emitting component, an optical transceiver and an optical communication system, wherein a light emitting component includes: a control circuit; a substrate body; a first metal layer and a second metal layer are arranged on the substrate body at intervals; A laser on a metal layer; the laser is electrically connected to the control circuit through the first metal layer; the heating device is arranged on the second metal layer; the heating device is arranged close to the laser, and one end of the heating device is electrically connected to the control circuit through the second metal layer. In this application, the laser can be electrically connected to the control circuit through the first metal layer, the heating device can be electrically connected to the control circuit through the second metal layer, and the heating device can switch the working state according to the control of the control circuit, so that the laser can work in Above a certain temperature, and ensure the working performance of the laser, the yield of the light emitting component can be improved, and the cost of the light emitting component can be reduced.

Description

Optical Transmitting Assemblies, Optical Transceivers, and Optical Communication Systems

technical field

The present application relates to the technical field of optical communication, and in particular, to an optical emission component, an optical transceiver and an optical communication system.

Background technique

With the development of communication technology, 5G (5th Generation Mobile Networks, fifth generation mobile communication technology) communication technology has emerged. Because 5G communication has the characteristics of high bandwidth and low delay, 5G communication can be applied in the fields of Internet of Things, unmanned driving and AI (Artificial Intelligence, artificial intelligence) that require a lot of information communication.

The 5G signal has the characteristics of high frequency. During the transmission process, the loss of the signal is very large. Based on this, the general 25Gbps (gigabit per second) WDM (Wavelength Division Multiplexer, wavelength division multiplexer) color light module adopts wavelength can be used. Adjustment scheme, its frame schematic diagram can be shown in Figure 1.

However, during the implementation process, the inventor found that there are at least the following problems in the conventional technology: the current light emitting components have the problem of high overall cost.

SUMMARY OF THE INVENTION

Based on this, it is necessary to provide an optical emitting component, an optical transceiver and an optical communication system with low cost in view of the above technical problems.

In order to achieve the above purpose, an embodiment of the present application provides a light emitting component, including a control circuit and a substrate body; the substrate body is provided with a first metal layer and a second metal layer at intervals;

It also includes a laser set on the first metal layer, and a heating device set on the second metal layer; the laser is electrically connected to the control circuit through the first metal layer; the heating device is set close to the laser, and one end of the heating device passes through the second metal layer. The layer is electrically connected to the control circuit;

The control circuit obtains the current working temperature of the laser, and transmits a working state control signal to the heating device according to the current working temperature; the heating device switches the working state according to the received working state control signal to adjust the working temperature of the laser.

In one of the embodiments, it further comprises a base, a heat sink and pins penetrating both sides of the base; the other end of the heating device is electrically connected to the base;

The heat sink is installed on the base; the substrate body is arranged in contact with the heat sink, and the side of the substrate body provided with the first metal layer faces the pins.

In one embodiment, the second metal layer is provided with through holes penetrating both sides of the substrate body; the other end of the heating device is electrically connected to the heat sink through the through holes.

In one of the embodiments, it further includes a monitoring diode disposed between the substrate body and the pins;

The negative electrode of the monitoring diode is electrically connected to the control circuit, and the positive electrode is electrically connected to the base.

In one of the embodiments, a spacer block is further included; the spacer block includes a first contact surface and a second contact surface opposite to the first contact surface; a conductive layer is formed on the first contact surface;

The negative electrode of the monitoring diode is attached and arranged on the conductive layer, and the conductive layer is electrically connected to the control circuit; the second contact surface is attached and arranged on the base.

In one of the embodiments, it also includes a laser driving circuit and a first clock data recovery circuit for connecting to an external electrical signal processing circuit;

The laser driving circuit is respectively connected with the laser, the monitoring diode, the control circuit and the first clock data recovery circuit; the first clock data recovery circuit is connected with the control circuit.

In one of the embodiments, the laser is arranged on a side of the substrate body away from the base;

The heating device is arranged between the laser and the base with the smallest distance between the center of the heating device and the center of the laser.

In one of the embodiments, further comprising a solder layer disposed between the first metal layer and the laser;

The laser is electrically connected to the control circuit through the solder layer and the first metal layer in sequence.

In one of the embodiments, the heating device is a thin film resistor;

The laser is an FP laser with a rate greater than or equal to 25 Gbps, or a DFB laser with a rate greater than or equal to 25 Gbps.

Embodiments of the present application further provide an optical transceiver, including a photodetector, a second clock data recovery circuit, and the light emitting component in any of the above embodiments; the second clock data recovery circuit is used to connect to an external electrical signal processing circuit ;

The photodetector is respectively connected to the control circuit and the second clock data recovery circuit; the second clock data recovery circuit is connected to the control circuit.

Embodiments of the present application further provide an optical communication system, including an optical fiber and a plurality of optical transceivers as in any of the foregoing embodiments; the optical fibers are respectively connected to the optical transceivers.

A technical scheme in the above-mentioned technical scheme has the following advantages and beneficial effects

The first metal layer and the second metal layer are arranged at intervals on the substrate body, the laser is arranged on the first metal layer, the heating device is arranged on the second metal layer, and the heating device is arranged close to the laser, so that the laser can pass through the first metal layer It is electrically connected to the control circuit, and the heating device can be electrically connected to the control circuit through the second metal layer. The working performance of the light emitting component can be improved, and the yield of the light emitting component can be improved, and the cost of the light emitting component can be reduced.

Description of drawings

The above and other objects, features and advantages of the present application will become more apparent from a more detailed description of the preferred embodiments of the present application shown in the accompanying drawings. The same reference numerals refer to the same parts throughout the drawings, and the drawings are not intentionally drawn to scale, the emphasis being placed on illustrating the subject matter of the present application.

Figure 1 is a schematic diagram of the framework of a traditional color light module;

Fig. 2 is a schematic diagram of the structure of a light emitting assembly packaged in a gold box;

3 is a schematic diagram of a first structure of a light emitting assembly in one embodiment;

4 is a schematic diagram of a second structure of a light emitting assembly in one embodiment;

Figure 5 is a schematic block diagram of a light emitting assembly in one embodiment;

6 is a schematic structural diagram of an optical transceiver in an embodiment;

FIG. 7 is a schematic structural diagram of an optical communication system in an embodiment.

Detailed ways

In order to facilitate understanding of the present application, the present application will be described more fully below with reference to the related drawings. Preferred embodiments of the present application are shown in the accompanying drawings. However, the application may be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It should be noted that when an element is referred to as being "connected" to another element, it can be directly connected to and integrated with the other element, or intervening elements may also be present. The terms "disposed on," "disposed against," "one side," "first side," "second side," and similar expressions used herein are for the purpose of illustration only.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which this application belongs. The terms used herein in the specification of the application are for the purpose of describing specific embodiments only, and are not intended to limit the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

At present, most of the lasers used to achieve tuning use a Bragg reflector (SampledGrating Distributed Bragg Reflector, SG-DBR) based on grating distribution. The tunable laser needs to be packaged on the TEC (ThermoElectric Cooler, semiconductor cooler), and the wavelength can be adjusted by controlling the operating temperature of the tunable laser. In order to improve the reliability of the light emitting component, TEC, laser chip, monitoring diode, focusing lens , optical isolators and other components need to be packaged in a gold box (Gold Box), the packaging process of the gold box is quite complex, the precision of the patch is high, and special equipment is required for the coupling between the laser, the lens and the optical fiber. The structure of the light emitting component packaged in the gold box can be shown in FIG. 2 , wherein a TEC control chip and a corresponding circuit need to be added to the light emitting component. Compared with DFB (Distributed Feedback Laser) laser and FP (Fabry-Perot) laser, the fabrication process of SG-DBR laser is more complicated. At the same time, the low temperature working temperature of 25Gbps laser is difficult. Reaching the true industrial-grade extreme temperature of -40°C (setting degree), resulting in low yield and increasing the cost of optical transceiver components. Further, the overall power consumption of the SG-DBR laser is large, and the hardware design is complicated.

In order to make the purpose, technical solutions and advantages of the present application more clearly understood, the present application will be described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application.

In one embodiment, as shown in FIG. 3 , a light emitting component is provided, which includes a control circuit and a substrate body 110; the substrate body 110 is provided with a first metal layer 120 and a second metal layer 130 at intervals;

It also includes a laser 140 arranged on the first metal layer 120, and a heating device 150 arranged on the second metal layer 130; the laser 140 is electrically connected to the control circuit through the first metal layer 120; the heating device 150 is arranged close to the laser 140, and One end of the heating device 150 is electrically connected to the control circuit through the second metal layer 130;

The control circuit acquires the current working temperature of the laser 140, and transmits a working state control signal to the heating device 150 according to the current working temperature; the heating device 150 switches the working state according to the received working state control signal to adjust the working temperature of the laser 140.

Specifically, the substrate body 110 may have good insulation, for example, the substrate body 110 may be an aluminum nitride ceramic substrate. A first metal layer 120 and a second metal layer 130 are arranged on the outer surface of the substrate body 110 at intervals, and the first metal layer 120 and the second metal layer 130 are arranged on the same outer surface of the substrate body 110 . Wherein, the interval setting may be such that there is no conduction between the first metal layer 120 and the second metal layer 130 , that is, there is no direct contact area between the first metal layer 120 and the second metal layer 130 , and the first metal layer 120 and the second metal layer 130 do not have direct contact. Substances with better insulating properties may be filled between the second metal layers 130 .

For example, the first metal layer 120 partially covers the substrate body 110 and is completely surrounded by the substrate body 110 ; the second metal layer 130 partially covers the substrate body 110 and is completely surrounded by the substrate body 110 , wherein the coverage area of the first metal layer 120 is the same as the The coverage areas of the second metal layer 130 are independent of each other, and there is no intersection area.

The pattern of the first metal layer 120 may be an “n” shape and its deformation, or the pattern shown in FIGS. 3-4 and its deformation. Further, the pattern of the first metal layer 120 may be determined according to actual conditions and design requirements. The pattern of the second metal layer 130 may be an “n” shape or the pattern shown in FIGS. 3-4 . In one example, the coverage area of the second metal layer 130 may be smaller than that of the first metal layer 120 . Further, the pattern of the second metal layer 130 may be determined according to actual conditions and design requirements.

The laser 140 is arranged on the first metal layer 120, and is connected to the control circuit through the first metal layer 120, so that the laser 140 can form a laser circuit with the control circuit, and the control circuit can obtain the temperature signal, working voltage signal, DC bias of the laser 140. Set current signal, transmit optical power signal and receive optical power.

Further, the first metal layer 120 may include a first connection area and a second connection area that are independent of each other, wherein the laser may be arranged in the first connection area, so that one end of the laser can be connected to the control circuit through the first connection area, and The laser and the second connection area are connected by conductive lines, so that the other end of the laser can be connected to the control circuit through the second connection area.

The heating device 150 is arranged on the second metal layer 130 , and the heating device 150 is arranged close to the laser 140 . The arrangement of the heating device 150 close to the laser 140 includes but is not limited to: the distance between the center of the heating device 150 and the center of the laser 140 is less than or equal to a preset threshold; or in the second metal layer 130, the distance between the center of the laser 140 and the The coverage area whose distance is less than or equal to the preset threshold. Further, the setting area of the heating apparatus 150 may be determined according to the distance between the center of the heating apparatus 150 and the center of the laser 140 being less than or equal to a preset threshold, and the coverage of the second metal layer 130 may be determined according to the setting area of the heating apparatus 150 or after determining the coverage area of the second metal layer 130, the setting area of the heating device 150 is determined according to the coverage area of the second metal layer 130 whose distance from the center of the laser 140 is less than or equal to a preset threshold.

One end of the heating device 150 may be connected to the control circuit through the second metal layer 130 . Further, the other end of the heating device 150 may be grounded, so that a heating loop can be formed between the heating device 150 and the control circuit. Further, the size of the second metal layer 130 may be determined according to the size of the first metal layer 120, the optical communication bandwidth and/or the optical communication frequency band. In one example, the control circuit may include an MCU (Microcontroller Unit, micro control unit).

The control circuit acquires the temperature signal of the laser 140 through the laser circuit, and transmits a working state control signal to the heating device 150 according to the temperature signal. The heating state control signal is used to instruct the heating device 150 to switch its working state. For example, the control circuit obtains the current working temperature of the laser 140 according to the temperature signal of the laser 140, and when the current working temperature of the laser 140 reaches the set temperature threshold, it transmits a working state control signal to the laser 140 to execute the heating device 150. startup and shutdown.

The heating device 150 switches the working state according to the received working state control signal, for example, it can be switched from the on state to the off state, or from the off state to the on state, or from the first heating state to the second heating state, The heating power of the first heating state is different from that of the second heating state.

When the heating device 150 is in the activated state, the heat generated by the heating device 150 can be conducted to the laser 140 to adjust the operating temperature of the laser 140 in a subsequent period, so that the laser 140 can work above a certain temperature, for example, the laser 140 can Working at a temperature above 0° C. (degrees Celsius), the laser 140 can be prevented from working at a lower operating temperature (eg -40° C.), so that the performance of the laser 140 can be guaranteed.

In the above-mentioned light emitting assembly, the first metal layer 120 and the second metal layer 130 are arranged on the substrate body 110 at intervals, the laser 140 is arranged on the first metal layer 120, the heating device 150 is arranged on the second metal layer 130, and the heating device 150 is arranged close to the laser 140, so that the laser 140 can be electrically connected to the control circuit through the first metal layer 120, the heating device 150 can be electrically connected to the control circuit through the second metal layer 130, and the heating device 150 can be controlled by the control circuit. Switching the working state enables the laser 140 to work above a certain temperature and ensures the working performance of the laser 140, thereby improving the yield of the light emitting component and reducing the cost of the light emitting component.

In one embodiment, as shown in FIG. 4, a light emitting assembly is provided, comprising:

Control circuit;

The substrate body 110; the substrate body 110 is provided with a first metal layer 120 and a second metal layer 130 at intervals;

the laser 140 disposed on the first metal layer 120; the laser 140 is electrically connected to the control circuit through the first metal layer 120;

A heating device 150 disposed on the second metal layer 130 ; one end of the heating device 150 is electrically connected to the control circuit through the second metal layer 130 .

Wherein, it also includes a base 210, a heat sink 220, and pins 230 penetrating both sides of the base 210; the other end of the heating device 150 is electrically connected to the base 210;

The heat sink 220 is mounted on the base 210 ; the substrate body 110 is disposed in contact with the heat sink 220 , and the side of the substrate body 110 with the first metal layer 120 faces the pins 230 .

Specifically, the base 210 includes a top surface and a bottom surface opposite to the top surface. The pins 230 penetrate from the bottom surface of the base 210 to the top surface of the base 210 , and the pins 230 and the base 210 are not conductive. In one example, the pins 230 can be connected to the base 210 through a material with better insulating properties. For example, a glass layer can be provided between the pins 230 and the base 210 , so that the pins 230 can be fixed on the base 210 and not directly connected to the base 210 . touch. Further, each device module disposed on the base 210, each device module disposed on the heat sink 220, and each device module disposed on the substrate body 110 can be connected to one end of the corresponding pin 230 through a conductive wire, and corresponding to one end of the pin 230. The other end of the pin 230 is connected to the control circuit, so that the control circuit does not need to be disposed on the base 210, which improves the applicability of the light emitting component and reduces the volume of the light emitting component.

The heat sink 220 is installed on the top surface of the base 210 , and the side of the heat sink 220 facing the pins 230 is attached to the substrate body 110 . The substrate body 110 may include a first surface of the substrate and a second surface of the substrate opposite to the first surface of the substrate. The first surface of the substrate is formed with a first metal layer 120 and a second metal layer 130 at intervals. In this case, the first surface of the substrate faces the tube. feet 230 , and the second surface of the substrate is attached to the heat sink 220 . Further, the heat sink 220 and the base 210 may be an integrated structure.

The voltage of the base 210 or the heat sink 220 can be used as a reference voltage. When one end of the device is connected to the base 210 or the heat sink 220, one end of the device can be regarded as grounding. The other end of the heating device 150 is electrically connected to the base 210 , that is, the other end of the heating device 150 is grounded.

Further, the number of pins 230 may be four, that is, the light emitting component includes a first pin 231 , a second pin 232 , a third pin 233 and a fourth pin 234 , each of which is connected from the base 210 The bottom surface of the base 210 runs through to the top surface of the base 210 . The first metal layer 120 includes a first electrode region and a second electrode region.

The first pin 231 can be electrically connected to the first electrode region, so that it can be connected to the anode of the laser 140 through the first metal layer 120, and the second pin 232 can be electrically connected to the second electrode region, so that it can be connected through the first metal layer 120. or the first pin 231 can be connected to the negative electrode of the laser 140 through the first metal layer 120 , and the second pin 232 can be connected to the positive electrode of the laser 140 through the first metal layer 120 . In one example, the first pin 231 can be fixed on the first electrode area by conductive adhesive, and the second pin 232 can be fixed on the second electrode area by conductive adhesive, so as to avoid the gap between the pin 230 and the electrode area. Poor contact occurs, improving the stability of signal transmission and the reliability of light emitting components.

In a specific embodiment, through holes 240 penetrating both sides of the substrate body 110 are formed on the second metal layer 130 ; the other end of the heating device 150 is electrically connected to the heat sink 220 through the through holes 240 .

Specifically, the second metal layer 130 is formed with through holes 240 penetrating both sides of the substrate body 110 , that is, the through holes 240 penetrate from the first surface of the substrate to the second surface of the substrate, so that the other end of the heating device 150 can pass through the through holes 240 . The hole 240 is connected to the heat sink 220 and is grounded.

Further, the second metal layer 130 may include a third electrode region and a fourth electrode region. The third pin 233 can be electrically connected to the fourth electrode region, so that it can be connected to one end of the heating device through the second metal layer 130, and the through hole 240 can be opened in the third electrode region, so that the other end of the heating device 150 can be connected to the heating device. Shen 220.

In a specific embodiment, it further includes a monitoring diode 250 disposed between the substrate body 110 and the pin 230;

The negative electrode of the monitoring diode 250 is electrically connected to the control circuit, and the positive electrode is electrically connected to the base 210 .

Specifically, the first surface of the substrate of the substrate body 110 is disposed toward the pins 230 , and the monitoring diode 250 is fixed on the base 210 and disposed between the first surface of the substrate and the pins 230 . The negative electrode of the monitoring diode 250 is electrically connected to the control circuit, and the positive electrode is electrically connected to the base 210, so that the monitoring diode 250 can form a monitoring loop with the control circuit. At the same time, the negative electrode of the monitoring diode 250 can also be connected to the laser driving circuit, so that the monitoring diode 250 and the laser driving circuit can form a feedback loop of the emitted light power.

Further, the negative electrode of the monitoring diode 250 can be connected to one end of the fourth pin 234 through a conductive wire, and the other end of the fourth pin 234 is connected to the control circuit, so as to realize the electrical connection between the negative electrode of the monitoring diode 250 and the control circuit. At the same time, the other end of the fourth pin 234 can also be electrically connected to the laser driving circuit; the anode of the monitoring diode 250 can be connected to the base 210 through a conductive wire, so that the anode of the monitoring diode 250 can be grounded.

In a specific embodiment, the spacer block 260 is further included; the spacer block 260 includes a first contact surface and a second contact surface opposite to the first contact surface; a conductive layer is formed on the first contact surface;

The negative electrode of the monitoring diode 250 is attached to the conductive layer, and the conductive layer is electrically connected to the control circuit; the second contact surface is attached to the base 210 .

Specifically, the spacer 260 includes a first contact surface and a second contact surface, and the first contact surface and the second contact surface are opposite to each other. A conductive layer is formed on the first contact surface, and the conductive layer may partially or completely cover the first contact surface. The negative electrode of the monitoring diode 250 is attached to the conductive layer, and the conductive layer is electrically connected to the control circuit and/or the laser driving circuit, so that the negative electrode of the monitoring diode 250 can be connected to the control circuit and/or the laser driving circuit through the conductive layer. . In one example, the conductive layer may be connected to one end of the fourth pin 234 through a conductive wire, and the anode of the monitoring diode 250 may be electrically connected to the base 210 through a conductive wire.

The second contact surface of the spacer 260 is in close contact with the base 210 , so that the monitoring diode 250 can be fixedly arranged. The monitoring diode 250 is disposed on the spacer 260 , so that the distance between the center of the monitoring diode 250 and the center of the laser 140 can be reduced, thereby increasing the transmitted light power received by the monitoring diode 250 .

In a specific embodiment, as shown in FIG. 5 , it also includes a laser driving circuit and a first clock data recovery circuit for connecting to an external electrical signal processing circuit;

The laser driving circuit is respectively connected to the laser 140, the monitoring diode 250, the control circuit and the first clock data recovery circuit; the first clock data recovery circuit is connected to the control circuit.

Specifically, the first clock data recovery circuit is used for connecting to an external electrical signal processing circuit. In one example, both the first clock and data recovery circuits can be used to connect to a 25G (gigabit) electrical port.

The external electrical signal processing circuit is connected to the first clock data recovery circuit, the first clock data recovery circuit is connected to the driving circuit of the laser 140, the driving circuit of the laser 140 is connected to the laser 140, and the first clock data recovery circuit is connected to the first electrical signal transmitted by the external electrical signal processing circuit. The signal is extracted, the phase relationship between the clock signal and the data signal in the first electrical signal is determined, and the processed signal is transmitted to the laser driving circuit. The laser driving circuit drives the laser 140 to convert the first electrical signal into a first optical signal, and output the first optical signal. In one example, the first optical signal may be output through a 25G optical port.

The monitoring diode 250 is connected to the laser driving circuit, so that the laser driving circuit can adjust the emitted light power according to the signal fed back by the monitoring diode 250 .

Further, the control circuit includes a controller and a digital diagnostic monitoring circuit connected to the controller, the controller is connected to the laser through the first metal layer 120 and the heating device 150 through the second metal layer 130, and the controller is also connected to the laser drive circuit and the first metal layer 130. Clock data recovery circuit. The digital diagnostic monitoring circuit can be used to monitor the characteristic parameters of the optical emitting component in real time, such as the operating temperature of the laser 140, the operating voltage of the laser 140, the DC bias current, the transmitted optical power and the received optical power, etc. The working temperature of the laser 140 fed back by the diagnostic monitoring circuit is used to control the working state of the heating device 150 .

In a specific embodiment, the laser 140 is disposed on the side of the substrate body 110 away from the base 210;

The heating device 150 is disposed between the laser 140 and the base 210 , and the distance between the center of the heating device 150 and the center of the laser 140 is the smallest.

Specifically, the first surface of the substrate of the substrate body 110 may be disposed perpendicular to the top surface of the base 210, or the first surface of the substrate of the substrate body 110 may be disposed on the top surface of the base 210 in a nearly vertical manner, and the near vertical may be at a certain Vertical within the angular deviation range.

The laser 140 is located on the substrate body 110 and is disposed on a side away from the base 210 . The heating device 150 is located on the substrate body 110 and is arranged between the laser 140 and the base, and the setting area of the heating device 150 can be determined according to the distance between the center of the heating device 150 and the center of the laser 140, and the heating device 150 can be set In the area closest to the center of the laser 140 . At this time, the first metal layer 120 and the second metal layer 130 are spaced apart.

In the present application, the heating device 150 is arranged between the laser 140 and the base 210, and the distance between the center of the heating device 150 and the center of the laser 140 is minimized, so that the wiring of the light emitting assembly is simpler, avoiding the use of transition blocks, reducing cost of light-emitting components.

In one embodiment, a light emitting assembly is provided, comprising:

Control circuit;

The substrate body 110; the substrate body 110 is provided with a first metal layer 120 and a second metal layer 130 at intervals;

the laser 140 disposed on the first metal layer 120; the laser 140 is electrically connected to the control circuit through the first metal layer 120;

A heating device 150 disposed on the second metal layer 130 ; one end of the heating device 150 is electrically connected to the control circuit through the second metal layer 130 .

Wherein, it also includes a solder layer disposed between the first metal layer 120 and the laser 140;

The laser 140 is electrically connected to the control circuit through the solder layer and the first metal layer 120 in sequence.

Specifically, a first metal layer 120 is formed on the substrate body 110 , a solder layer is formed on the first metal layer 120 , and the solder layer may be covered with gold tin. The laser 140 is soldered on the solder layer, and is sequentially connected to the control circuit through the solder layer and the first metal layer 120 .

Further, the size of the solder layer may be determined according to the size of the laser 140 .

In a specific embodiment, the heating device 150 is a thin film resistor;

The laser 140 is an FP laser with a rate greater than or equal to 25 Gbps, or a DFB laser with a rate greater than or equal to 25 Gbps.

Specifically, the heating device 150 can be a heating resistor. Further, the heating device 150 includes but is not limited to a thin film resistor, a chip resistor or a wire-bonding resistor. The heating device 150 can be selected according to actual conditions and design requirements.

The rate of the FP laser is greater than or equal to 25Gbps, that is, the rate of the FP laser can be 25Gbps or more, wherein the FP laser includes uncooled FP laser, commercial grade FP laser and non-industrial grade FP laser. The rate of the DFB laser is greater than or equal to 25Gbps, that is, the rate of the DFB laser can be 25Gbps or more, wherein the DFB laser includes uncooled DFB laser, commercial grade DFB laser and non-industrial grade DFB laser.

In one embodiment, as shown in FIG. 6 , an optical transceiver is provided, including a photodetector, a second clock data recovery circuit, and the light emitting component in any of the above embodiments; the second clock data recovery circuit uses For connecting to external electrical signal processing circuit;

The photodetector is respectively connected to the control circuit and the second clock data recovery circuit; the second clock data recovery circuit is connected to the control circuit.

Specifically, the second clock data recovery circuit is used for connecting to an external electrical signal processing circuit. The photodetector is connected to the second clock data recovery circuit. After the photodetector receives the second optical signal, the photodetector can convert the second optical signal into a second electrical signal and transmit the second electrical signal to the second optical signal. The clock data recovery circuit, the second clock data recovery circuit can extract the second electrical signal and determine the phase relationship between the clock signal and the data signal in the second electrical signal.

Further, the light detector may be a PIN receiver.

In a specific embodiment, the circuit board may further include a power supply circuit;

The power supply circuit is respectively connected to the controller, the digital diagnosis monitoring circuit, the laser driving circuit, the first clock data recovery circuit and the second clock data recovery circuit.

Specifically, the power supply circuit is used to provide working voltages for each device and each circuit in the light emitting assembly.

In a specific embodiment, a transimpedance amplifier and a limiting amplifier are also included.

Specifically, the second clock data recovery circuit is connected to the photodetector through the limiting amplifier and the transimpedance amplifier in sequence.

In one embodiment, as shown in FIG. 7 , an optical communication system is provided, which includes an optical fiber and a plurality of optical transceivers in any of the foregoing embodiments; the optical fibers are respectively connected to the optical transceivers.

Specifically, the laser 140 in the light emitting assembly is a DFB laser. Further, the number of optical transceivers can be determined according to the optical communication wavelength, the number of wavelength channels, and the number of terminals. For example, in an optical communication system, the wavelength is 1270 nm (nanometer) to 1610 nm, and every 20 nm can be a wavelength channel, with a total of 18 wavelengths. wavelength.

In the above optical communication system, a 25Gbps CWDM (Coarse Wavelength Division Multiplexer, Coarse Wavelength Division Multiplexer) system can be formed, and communication is carried out through the CWDM system. cost,

The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brevity, all possible combinations of the technical features in the above-described embodiments are not described. However, as long as there is no contradiction between the combinations of these technical features, All should be regarded as the scope described in this specification.

The above-mentioned embodiments only represent several embodiments of the present application, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which all belong to the protection scope of the present application. Therefore, the scope of protection of the patent of the present application shall be subject to the appended claims.

Claims (11)

1. A light emitting assembly, comprising a control circuit and a substrate body; a first metal layer and a second metal layer are arranged on the substrate body at intervals; It also includes a laser arranged on the first metal layer, and a heating device arranged on the second metal layer; the laser is electrically connected to the control circuit through the first metal layer; the heating device is close to the The laser is provided, and one end of the heating device is electrically connected to the control circuit through the second metal layer; The control circuit acquires the current working temperature of the laser, and transmits a working state control signal to the heating device according to the current working temperature; the heating device switches the working state according to the received working state control signal , to adjust the operating temperature of the laser. 2. The light emitting assembly according to claim 1, further comprising a base, a heat sink and pins penetrating both sides of the base; the other end of the heating device is electrically connected to the base; The heat sink is mounted on the base; the substrate body is disposed in contact with the heat sink, and the side of the substrate body with the first metal layer faces the pins. 3 . The light emitting component according to claim 2 , wherein the second metal layer is provided with through holes penetrating both sides of the substrate body; the other end of the heating device passes through the through holes. 4 . The heat sink is electrically connected. 4 . The light emitting component according to claim 2 , further comprising a monitoring diode disposed between the substrate body and the pins; 4 . The negative electrode of the monitoring diode is electrically connected to the control circuit, and the positive electrode is electrically connected to the base. 5. The light emitting assembly according to claim 4, further comprising a spacer; the spacer comprises a first contact surface and a second contact surface opposite to the first contact surface; the first contact surface A conductive layer is formed on the contact surface; The negative electrode of the monitoring diode is attached and arranged on the conductive layer, and the conductive layer is electrically connected to the control circuit; the second contact surface is attached and arranged on the base. 6. The light emitting assembly according to claim 4, further comprising a laser driving circuit and a first clock data recovery circuit for connecting to an external electrical signal processing circuit; The laser driving circuit is respectively connected to the laser, the monitoring diode, the control circuit and the first clock data recovery circuit; the first clock data recovery circuit is connected to the control circuit. 7. The light emitting assembly according to any one of claims 2 to 6, wherein the laser is disposed on a side of the substrate body away from the base; The heating device is arranged between the laser and the base with the smallest distance between the center of the heating device and the center of the laser. 8. The light emitting assembly according to any one of claims 1 to 6, further comprising a solder layer disposed between the first metal layer and the laser; The laser is electrically connected to the control circuit through the solder layer and the first metal layer in sequence. 9. The light emitting assembly according to any one of claims 1 to 6, wherein the heating device is a thin film resistor; The laser is an FP laser with a rate greater than or equal to 25 Gbps, or a DFB laser with a rate greater than or equal to 25 Gbps. 10. An optical transceiver, characterized by comprising a photodetector, a second clock data recovery circuit, and the light emitting component according to any one of claims 1 to 9; the second clock data recovery circuit is used for Connect external electrical signal processing circuit; The photodetector is respectively connected to the control circuit and the second clock data recovery circuit; the second clock data recovery circuit is connected to the control circuit. 11. An optical communication system, comprising an optical fiber and a plurality of optical transceivers according to claim 10; the optical fiber is respectively connected to each of the optical transceivers.

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