CN110653514A - High-temperature-resistant soldering tin bar - Google Patents

Abstract

The invention discloses a high-temperature-resistant solder bar, comprising a solder bar body, a top groove is formed on the upper surface of the solder bar body, a first positioning groove is formed inside the top groove, and a top wall of the solder bar is provided at the top of the solder bar body The upper surface of the top wall of the solder strip is provided with a second positioning groove, the outer surface of one end of the solder strip body away from the top wall of the solder strip is fixedly connected with a clamping groove, and one end of the clamping groove away from the body of the solder strip is fixedly connected with the bottom wall of the solder strip. There are zigzag grooves on both sides of the body, both sides of the top wall of the solder strip, and both sides of the bottom wall of the solder strip. Beneficial effects: The solder strip with this structural design has better safety in use and can effectively reduce liquid metal splashing. , while reducing potential safety hazards, it has good usability, and has good high temperature resistance. It will not be de-soldered under high temperature environment. It has good performance, simple structure and reasonable layout. It is suitable for manufacturing promotion and use.

Description

A high temperature resistant solder bar

technical field

The invention relates to a solder bar, in particular to a high temperature resistant solder bar, and belongs to the technical field of solder bars.

Background technique

Soldering rods are used for soldering. Soldering can be used for sealed metal welding without requiring high temperature and high pressure. According to the critical point of liquidus temperature, soldering rods include high-temperature soldering rods and low-temperature soldering rods. Among them, liquidus The temperature is higher than the melting point of the tin-lead eutectic - the solder bar with a temperature of 183 degrees is a high-temperature solder bar. Component assembly that does not change when the board is assembled, however, the existing solder bars cannot be subjected to high temperature resistance treatment during soldering use, which easily leads to the phenomenon of falling off and poor performance.

SUMMARY OF THE INVENTION

The present invention provides a high-temperature-resistant solder bar for solving the problems raised in the background art.

In order to solve the above-mentioned technical problems, the present invention provides the following technical solutions:

The present invention is a high-temperature-resistant solder bar, comprising a solder bar body, a top groove is formed on the upper surface of the solder bar body, a first positioning groove is formed on the inside of the top groove, and the top of the solder bar body is provided with a top groove. The top wall of the solder strip, the upper surface of the top wall of the solder strip is provided with a second positioning groove, the outer surface of one end of the solder strip body away from the top wall of the solder strip is fixedly connected with a clamping groove, and the clamping groove is away from the end of the solder strip body. The bottom wall of the solder bar is fixedly connected, the center of the upper surface of the bottom wall of the solder bar is provided with a third positioning groove, and the two sides of the body of the solder bar, both sides of the top wall of the solder bar and both sides of the bottom wall of the solder bar are provided with serrations shaped groove.

As a preferred technical solution of the present invention, a solder core is provided at the inner center of the solder bar body, an outer surface of the solder core is wrapped with a soldering flux layer, and a solder flux core is provided inside the solder flux layer.

As a preferred technical solution of the present invention, a high temperature resistant layer is fixedly installed on the outer surface of one end of the soldering flux layer away from the solder core, and an outer surface of one end of the high temperature resistant layer away from the soldering flux layer is wrapped with an anti-oxidation layer.

As a preferred technical solution of the present invention, the high temperature resistant layer is a high melting point lead-free solder metal layer, and its composition and weight percentage are: tin: 58-68%, zinc: 30-40%, aluminum: 1- 6%.

As a preferred technical solution of the present invention, the top groove is a square groove, and the first positioning groove, the second positioning groove and the third positioning groove are all circular through grooves.

The beneficial effects achieved by the present invention are:

1. There are zigzag grooves on both sides of the solder strip body, both sides of the top wall of the solder strip, and both sides of the bottom wall of the solder strip. The set zigzag grooves can reduce the cracking that occurs during the dissolution of the solder strip body. phenomenon, thereby improving the use quality and performance of the solder bar body, and at the same time, through the set top groove, it is convenient to print the tin bar logo during the production of the solder bar body, so that the printing efficiency can be greatly improved, thereby improving production efficiency. The use performance is good, and a solder core is provided inside the solder bar body, and the solder bar body can complete the tin welding work through the provided solder core, which is convenient to use.

2. By wrapping a flux layer on the outer surface of the solder core, and at the same time setting a flux core inside the flux layer, the set flux layer and flux core can reduce the amount of tin when the solder bar body is melted. The effect of liquid metal splashing when the strip is melted, so it has a certain safety in use. The high temperature resistance layer provided makes the solder strip body have a certain high temperature resistance, so that there will be no de-soldering phenomenon, and the performance is good. Finally, by setting The anti-oxidation layer can improve the anti-oxidation effect of the solder bar body and improve the performance. To sum up, the solder bar with this structural design has better safety in use, can effectively reduce the splash of liquid metal, and reduce potential safety hazards At the same time, it has good usability, and has good high temperature resistance performance. It will not be de-soldered under high temperature environment. It has good performance, simple structure and reasonable layout.

Description of drawings

The accompanying drawings are used to provide a further understanding of the present invention, and constitute a part of the specification, and are used to explain the present invention together with the embodiments of the present invention, and do not constitute a limitation to the present invention. In the attached image:

Fig. 1 is the overall structure schematic diagram of the present invention;

2 is a schematic view of the bottom wall structure of the solder bar of the present invention;

Fig. 3 is the enlarged structure schematic diagram of A area of the present invention;

4 is a schematic diagram of the internal structure of the solder bar body of the present invention.

In the figure 1, the body of the solder bar; 2, the top groove; 3, the first positioning slot; 4, the second positioning slot; 5, the clamping slot; 6, the bottom wall of the solder bar; 7, the third positioning slot; 8, Zigzag groove; 9. Soldering core; 10. Soldering flux layer; 11. Fluxing core; 12. High temperature resistant layer; 13. Antioxidation layer; 14. Solder bar top wall.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

Example: As shown in Figures 1-4, a high temperature resistant solder bar includes a solder bar body 1, and a top groove 2 is opened on the upper surface of the solder bar body 1, and the top groove 2 can be used in the solder bar. When the main body 1 is produced, it is convenient to print the tin bar logo, which can greatly improve the printing efficiency, thereby improving the production efficiency and good performance. The top wall 14, the upper surface of the top wall 14 of the solder strip is provided with a second positioning groove 4, the outer surface of one end of the solder strip body 1 away from the top wall 14 of the solder strip is fixedly connected with a clamping groove 5, and the clamping groove 5 is away from one end of the solder strip body 1 The bottom wall 6 of the solder bar is fixedly connected, the center position of the upper surface of the bottom wall of the solder bar 6 is provided with a third positioning groove 7, both sides of the solder bar body 1, both sides of the top wall of the solder bar 14 and both sides of the bottom wall of the solder bar 6 are opened. There are zigzag grooves 8, and the zigzag grooves 8 can reduce the cracking phenomenon during the dissolving process of the solder strip body 1, thereby improving the use quality and performance of the solder strip body 1.

The soldering tin body 1 is provided with a soldering core 9 at the inner center position, and the soldering tin body 1 can complete the soldering work through the provided soldering core 9, which is convenient to use. There is a flux core 11 inside, and the set flux layer 10 and flux core 11 can reduce the effect of liquid metal splashing when the tin bar melts when the solder bar body 1 is melted, so that it has a certain safety in use. A high temperature resistant layer 12 is fixedly installed on the outer surface of one end of the soldering flux layer 10 away from the solder core 9, and the outer surface of one end of the high temperature resistant layer 12 away from the soldering flux layer 10 is wrapped with an anti-oxidation layer 13. The anti-oxidation effect of the solder bar body 1 improves the performance. The high temperature resistant layer 12 is a high melting point lead-free solder metal layer, and its composition and weight percentage are: tin: 58-68%, zinc: 30-40%, aluminum: 1-6%, the solder bar body 1 has a certain high temperature resistance through the set high temperature resistant layer 12, so that the phenomenon of desoldering will not occur, and the use performance is good. Finally, the set antioxidation layer 13 can improve the solder bar body 1. The anti-oxidation effect of the main body 1 improves the usability. The top groove 2 is a square groove, and the first positioning groove 3, the second positioning groove 4 and the third positioning groove 7 are all circular through grooves.

Specifically, when the present invention is used, zigzag grooves 8 are provided on both sides of the solder strip body 1, both sides of the top wall 14 of the solder strip, and both sides of the bottom wall 6 of the solder strip. The cracking phenomenon that occurs during the dissolving process of the solder bar body 1 is reduced, thereby improving the use quality of the solder bar body 1 and improving the usability. At the same time, the top groove 2 provided can facilitate the solder bar body 1 during production. Logo printing can greatly improve the printing efficiency, thereby improving the production efficiency, and the use performance is good. By setting the solder core 9 inside the solder bar body 1, the solder bar body 1 can complete the soldering work through the provided solder core 9. It is convenient to use. By wrapping the soldering flux layer 10 on the outer surface of the soldering core 9, and at the same time setting the soldering flux core 11 inside the soldering flux layer 10, the soldering flux layer 10 and the soldering flux core 11 can be placed on the solder bar body 1. When the solder is melted, the effect of liquid metal splashing when the tin strip is melted is reduced, so that it has a certain safety in use. Soldering phenomenon, good use performance, and finally, the anti-oxidation layer 13 provided can improve the anti-oxidation effect of the solder bar body 1 and improve the use performance. In summary, the solder bar with this structural design has better use safety. It can effectively reduce the splash of liquid metal, reduce potential safety hazards, and at the same time have good usability, and has good high temperature resistance, no desoldering in high temperature environment, good performance and simple structure , reasonable layout, suitable for manufacturing promotion and use.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, and substitutions can be made in these embodiments without departing from the principle and spirit of the invention and modifications, the scope of the present invention is defined by the appended claims and their equivalents.

Claims (5)

1. A high temperature resistant solder bar, characterized in that it comprises a solder bar body (1), a top groove (2) is opened on the upper surface of the solder bar body (1), and the inside of the top groove (2) is A first positioning slot (3) is opened above, the top of the solder strip body (1) is provided with a solder strip top wall (14), and the upper surface of the solder strip top wall (14) is provided with a second positioning slot (4) The outer surface of one end of the solder strip body (1) away from the top wall (14) of the solder strip is fixedly connected with a clamping groove (5), and one end of the clamping groove (5) away from the solder strip body (1) is fixedly connected with solder The bottom wall (6) of the strip, a third positioning groove (7) is provided at the center of the upper surface of the bottom wall (6) of the solder strip, both sides of the body (1) of the solder strip and both sides of the top wall (14) of the solder strip Both sides of the bottom wall (6) of the solder strip are provided with zigzag grooves (8). 2 . The high-temperature-resistant solder bar according to claim 1 , wherein a solder core ( 9 ) is provided at the inner center of the solder bar body ( 1 ), and the outer surface of the solder core ( 9 ) is wrapped around the outer surface. 3 . A soldering flux layer (10) is provided, and a soldering flux core (11) is arranged inside the soldering flux layer (10). 3. A high temperature resistant solder bar according to claim 2, characterized in that: a high temperature resistant layer (12) is fixedly installed on the outer surface of one end of the solder flux layer (10) away from the solder core (9), and the An anti-oxidation layer (13) is wrapped on the outer surface of one end of the high temperature resistant layer (12) away from the soldering flux layer (10). 4. A high temperature resistant solder bar according to claim 3, characterized in that: the high temperature resistant layer (12) is a high melting point lead-free tin soldering metal layer, and its composition and weight percentage are: tin: 58- 68%, Zinc: 30-40%, Aluminum: 1-6%. 5. A high temperature resistant solder bar according to claim 1, characterized in that: the top groove (2) is a square groove, and the first positioning groove (3) and the second positioning groove (4) ) and the third positioning groove (7) are circular through grooves.

Images