CN110660529A - Manufacturing method of conductive circuit and conductive circuit - Google Patents
Manufacturing method of conductive circuit and conductive circuit Download PDFInfo
- Publication number
- CN110660529A CN110660529A CN201910871725.0A CN201910871725A CN110660529A CN 110660529 A CN110660529 A CN 110660529A CN 201910871725 A CN201910871725 A CN 201910871725A CN 110660529 A CN110660529 A CN 110660529A
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- pattern
- activatable ink
- conductive circuit
- activatable
- ink pattern
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 13
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims abstract description 14
- 125000002524 organometallic group Chemical group 0.000 claims abstract description 13
- 230000001678 irradiating effect Effects 0.000 claims abstract description 7
- 238000007747 plating Methods 0.000 claims abstract description 6
- 229920002120 photoresistant polymer Polymers 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 19
- 238000007650 screen-printing Methods 0.000 claims description 13
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000002923 metal particle Substances 0.000 claims description 6
- 229910052804 chromium Inorganic materials 0.000 claims description 5
- 229910052748 manganese Inorganic materials 0.000 claims description 5
- 229910052750 molybdenum Inorganic materials 0.000 claims description 5
- 229910052725 zinc Inorganic materials 0.000 claims description 5
- 150000004696 coordination complex Chemical group 0.000 claims description 4
- 238000005530 etching Methods 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 4
- 238000007790 scraping Methods 0.000 claims description 3
- 238000002834 transmittance Methods 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 14
- 150000002736 metal compounds Chemical class 0.000 description 12
- 239000010949 copper Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 229910021645 metal ion Inorganic materials 0.000 description 2
- 238000000059 patterning Methods 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000008139 complexing agent Substances 0.000 description 1
- 229910001431 copper ion Inorganic materials 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 150000002500 ions Chemical group 0.000 description 1
- -1 metal complex compound Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
- H01B13/0026—Apparatus for manufacturing conducting or semi-conducting layers, e.g. deposition of metal
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
- H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1208—Pretreatment of the circuit board, e.g. modifying wetting properties; Patterning by using affinity patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/052—Magnetographic patterning
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/12—Using specific substances
- H05K2203/121—Metallo-organic compounds
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Electric Cables (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
The invention discloses a manufacturing method of a conductive circuit, which comprises the following steps: step 1: making an activatable ink pattern on a surface of a substrate according to a desired circuit pattern, the activatable ink pattern being doped with an organometallic complex; step 2: irradiating the activatable ink pattern with a laser to activate the activatable ink pattern; and step 3: and chemically plating a metal pattern on the activated activatable ink pattern to form the desired conductive circuit. The manufacturing method can improve the light transmittance of the product, has low requirement on the precision of laser irradiation, and has smaller circuit line width and line spacing. The invention also provides a conductive circuit.
Description
Technical Field
The present invention relates to circuit manufacturing technologies, and in particular, to a method for manufacturing a conductive circuit and a conductive circuit.
Background
The Laser Direct Structuring (Laser Direct Structuring) process is a technology for manufacturing a conductive circuit on the surface of a base material, and comprises the steps of firstly spraying an activatable ink layer doped with an organic metal compound on the surface of the base material, then locally irradiating the activatable ink layer by Laser according to a required circuit pattern to enable the organic metal compound in the irradiated local area to release metal particles to form an activated pattern, wherein the activated pattern is consistent with the required circuit pattern, and finally, chemically plating a metal pattern on the activated pattern to finally obtain the required conductive circuit.
The existing Laser Direct Structuring process is limited by the light transmittance of an ink base material and an organic metal compound, cannot be applied to display products such as a touch screen and a display screen, and the application range of the technology is limited.
Disclosure of Invention
In order to solve the defects of the prior art, the invention provides a manufacturing method of a conductive circuit, which can improve the light transmittance of a product, has low requirement on the precision of laser irradiation and has smaller circuit line width and line spacing.
The invention also provides a conductive circuit.
The technical problem to be solved by the invention is realized by the following technical scheme:
a method of making a conductive circuit, comprising:
step 1: making an activatable ink pattern on a surface of a substrate according to a desired circuit pattern, the activatable ink pattern being doped with an organometallic complex;
step 2: irradiating the activatable ink pattern with a laser to activate the activatable ink pattern;
and step 3: and chemically plating a metal pattern on the activated activatable ink pattern to form the desired conductive circuit.
Further, step 1 comprises:
step 1.1: covering a layer of silk-screen printing plate on the surface of the substrate base material, wherein the silk-screen printing plate is provided with a plurality of meshes for forming required circuit patterns;
step 1.2: and scraping the activatable ink on the screen printing plate by adopting a scraper, wherein the activatable ink covers the surface of the substrate through the meshes on the screen printing plate to form the activatable ink pattern.
Further, step 1 comprises:
step 1.1: covering an activatable ink layer on the surface of the substrate base material;
step 1.2: covering a layer of photoresist on the activatable ink layer;
step 1.3: exposing and developing the photoresist according to a required circuit pattern;
step 1.4: etching the part of the activatable ink layer which is not covered by the photoresist;
step 1.5: and stripping the residual photoresist to form the activatable ink pattern.
Further, the organometallic complex is a metal complex which releases metal particles upon irradiation with laser light.
Further, the metal element in the organic metal compound is one or more of Zn, Cr, Co, Cu, Mn, Mo or Ni.
Further, an ink substrate is included in the activatable ink pattern.
A conductive circuit comprising a substrate, an activatable ink pattern fabricated on a surface of the substrate, and a metal pattern electrolessly plated on the activatable ink pattern; the activatable ink pattern is doped with an organometallic complex that is in an activated state.
Further, the organometallic complex is a metal complex which releases metal particles upon irradiation with laser light.
Further, the metal element in the organic metal compound is one or more of Zn, Cr, Co, Cu, Mn, Mo or Ni.
Further, an ink substrate is included in the activatable ink pattern.
The invention has the following beneficial effects: the manufacturing method comprises the steps of patterning the activatable ink layer to form the activatable ink pattern, irradiating the activatable ink pattern by Laser to activate the activatable ink pattern, and reducing the line width and the line spacing of the conductive circuit to meet the requirements of precise elements, wherein the substrate does not need to be covered with an ink substrate and an organic metal compound on the whole surface, thereby greatly improving the light transmittance of the product and expanding the application range of the Laser Direct Structuring process.
Drawings
FIG. 1 is a block diagram illustrating the steps of a method for making a conductive circuit according to the present invention;
fig. 2 is a schematic diagram of a conductive circuit provided by the present invention.
Detailed Description
The present invention will be described in detail below with reference to the accompanying drawings and examples.
Example one
As shown in fig. 1 and 2, a method of making a conductive circuit includes:
step 1: an activatable ink pattern 2 is produced on the surface of a substrate 1 in accordance with a desired circuit pattern, the activatable ink pattern 2 being doped with an organometallic complex.
The activatable ink pattern 2 has a hollow area corresponding to a non-wiring area of a desired circuit pattern and a gap between adjacent wirings, the activatable ink used contains the organic metal compound and an ink base material, and the activatable ink may further contain a curing agent, a defoaming agent, and the like to improve the performance thereof according to different requirements. The organic metal compound is a metal complex compound formed by combining metal ions and an organic complexing agent, and the metal elements in the organic metal compound are one or more of Zn, Cr, Co, Cu, Mn, Mo or Ni. The ink base material is one or more of acrylic resin, epoxy resin or polyester resin.
The substrate base material 1 can be made of plastic materials or glass materials, if the conductive circuit is a display circuit or a touch sensing circuit, the substrate base material 1 is a transparent substrate, and if the conductive circuit is an antenna circuit, a wireless charging circuit or a fingerprint sensing circuit, the substrate base material 1 can be a non-transparent substrate; of course, the substrate base material 1 may also be a circuit board substrate, and the conductive circuit is a circuit board circuit, and is used to replace a circuit board manufactured by a conventional copper plating etching process.
Specifically, the activatable ink pattern 2 may be manufactured by a screen printing process, and then the step 1 includes:
step 1.1: and covering a layer of silk-screen printing plate on the surface of the substrate base material 1, wherein the silk-screen printing plate is provided with a plurality of meshes for forming the required circuit patterns.
Step 1.2: and scraping the activatable ink on the screen printing plate by adopting a scraper, wherein the activatable ink covers the surface of the substrate through the meshes on the screen printing plate to form the activatable ink pattern 2.
In addition, the activatable ink pattern 2 may also be produced by a yellow light process, and then the step 1 includes:
step 1.1: and covering an activatable ink layer on the surface of the substrate base material 1.
Step 1.2: and covering a layer of photoresist on the activatable ink layer.
Step 1.3: and exposing and developing the photoresist according to a required circuit pattern.
Step 1.4: and etching the part of the activatable ink layer which is not covered by the photoresist.
Step 1.5: the remaining photoresist is stripped to form the activatable ink pattern 2.
In the yellow light process, the photoresist can be a positive photoresist or a negative photoresist. If the photoresist is positive photoresist, the exposed part of the photoresist can be removed by developing solution, and the shading pattern on the mask plate which is correspondingly exposed is the same as the required circuit pattern; if the photoresist is negative photoresist, the unexposed part of the photoresist can be removed by the developing solution, and the light-transmitting pattern on the mask plate which is correspondingly exposed is the same as the required circuit pattern.
Step 2: the activatable ink pattern 2 is activated by irradiating the activatable ink pattern 2 with a laser.
After the organic metal compound is irradiated by laser, metal particles of which metal ions form an activated state are released, so that the activatable ink pattern 2 has a metal property, can realize a conductive function and can perform chemical plating with other metals.
And step 3: a metal pattern 3 is chemically plated on the activated activatable ink pattern 2 to form the desired conductive circuit.
Preferably, the metallic element contained in the metallic pattern 3 should correspond to the metallic element contained in the activatable ink pattern 2, i.e. if the activatable ink pattern 2 contains copper ions, copper atoms should also be contained in the metallic pattern 3 to enhance the bonding strength between the metallic pattern 3 and the activated ink pattern 2.
The manufacturing method comprises the steps of firstly patterning the activatable ink layer to form the activatable ink pattern 2, then irradiating the activatable ink pattern 2 by using laser to activate the activatable ink pattern 2, wherein the laser only needs to irradiate the whole activatable ink pattern 2 at the same time, the laser does not need to perform local irradiation according to a required circuit pattern, the precision requirement of laser irradiation is low, even no precision requirement exists, the line width and the line spacing of the activatable ink pattern 2 are controlled by a silk-screen process or a yellow-light process, the line width and the line spacing of the conductive circuit can be reduced to meet the requirement of a precision element, particularly the yellow-light process can enable the line width and the line spacing of the activatable ink pattern 2 to reach the micron level, and most importantly, the substrate 1 is covered with the ink substrate and the organic metal compound only on the required circuit pattern, the whole surface is not required to be covered with an ink base material and an organic metal compound, the light transmittance of the product is greatly improved, the line width is controlled to be about 8-10 mu m, the light transmittance of the product can reach more than 80% by matching with a transparent base material, the product can be applied to a display product, and the application range of the Laser Direct Structuring process is expanded.
Example two
As shown in fig. 2, a conductive circuit, not limited to the method of the first embodiment, includes a substrate 1, an activatable ink pattern 2 formed on the surface of the substrate 1, and a metal pattern 3 electroless-plated on the activatable ink pattern 2; the activatable ink pattern 2 is doped with an organometallic complex, which is in an activated state.
The above-mentioned embodiments only express the embodiments of the present invention, and the description is more specific and detailed, but not understood as the limitation of the patent scope of the present invention, but all the technical solutions obtained by using the equivalent substitution or the equivalent transformation should fall within the protection scope of the present invention.
Claims (10)
1. A method of making a conductive circuit, comprising:
step 1: making an activatable ink pattern on a surface of a substrate according to a desired circuit pattern, the activatable ink pattern being doped with an organometallic complex;
step 2: irradiating the activatable ink pattern with a laser to activate the activatable ink pattern;
and step 3: and chemically plating a metal pattern on the activated activatable ink pattern to form the desired conductive circuit.
2. The conductive circuit of claim 1, wherein step 1 comprises:
step 1.1: covering a layer of silk-screen printing plate on the surface of the substrate base material, wherein the silk-screen printing plate is provided with a plurality of meshes for forming required circuit patterns;
step 1.2: and scraping the activatable ink on the screen printing plate by adopting a scraper, wherein the activatable ink covers the surface of the substrate through the meshes on the screen printing plate to form the activatable ink pattern.
3. The conductive circuit of claim 1, wherein step 1 comprises:
step 1.1: covering an activatable ink layer on the surface of the substrate base material;
step 1.2: covering a layer of photoresist on the activatable ink layer;
step 1.3: exposing and developing the photoresist according to a required circuit pattern;
step 1.4: etching the part of the activatable ink layer which is not covered by the photoresist;
step 1.5: and stripping the residual photoresist to form the activatable ink pattern.
4. The conductive circuit of claim 1, wherein the organometallic complex is a metal complex that releases metal particles upon irradiation with laser light.
5. The conductive circuit of claim 1 or 4, wherein the metal element in the organometallic complex is one or more of Zn, Cr, Co, Cu, Mn, Mo or Ni.
6. The conductive circuit of claim 1, wherein the activatable ink pattern further comprises an ink substrate.
7. A conductive circuit comprising a substrate, an activatable ink pattern formed on a surface of the substrate, and a metal pattern electrolessly plated onto the activatable ink pattern; the activatable ink pattern is doped with an organometallic complex that is in an activated state.
8. The conductive circuit of claim 7, wherein the organometallic complex is a metal complex that releases metal particles upon irradiation with laser light.
9. The conductive circuit of claim 7 or 8, wherein the metal element in the organometallic complex is one or more of Zn, Cr, Co, Cu, Mn, Mo, or Ni.
10. The conductive circuit of claim 7, wherein the activatable ink pattern further comprises an ink substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910871725.0A CN110660529A (en) | 2019-09-16 | 2019-09-16 | Manufacturing method of conductive circuit and conductive circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910871725.0A CN110660529A (en) | 2019-09-16 | 2019-09-16 | Manufacturing method of conductive circuit and conductive circuit |
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| CN110660529A true CN110660529A (en) | 2020-01-07 |
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| CN201910871725.0A Pending CN110660529A (en) | 2019-09-16 | 2019-09-16 | Manufacturing method of conductive circuit and conductive circuit |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111244150A (en) * | 2020-03-24 | 2020-06-05 | 福唐激光(苏州)科技有限公司 | Laser processing method of flexible display panel |
| WO2021232817A1 (en) * | 2020-05-18 | 2021-11-25 | 广东小天才科技有限公司 | Circuit manufacturing method and lds antenna |
| CN114976605A (en) * | 2021-02-23 | 2022-08-30 | 北京京东方技术开发有限公司 | Thin film sensor, thin film sensor array, and electronic device |
| CN115243463A (en) * | 2022-08-13 | 2022-10-25 | 电子科技大学中山学院 | A method for preparing a single-sided circuit board by laser direct writing full addition |
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