CN110690337B - A flashlight structure and electronic equipment - Google Patents
A flashlight structure and electronic equipment Download PDFInfo
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- CN110690337B CN110690337B CN201910932500.1A CN201910932500A CN110690337B CN 110690337 B CN110690337 B CN 110690337B CN 201910932500 A CN201910932500 A CN 201910932500A CN 110690337 B CN110690337 B CN 110690337B
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- flash
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
- H10H20/856—Reflecting means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/562—Protection against mechanical damage
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
本发明提供了一种闪光灯结构及电子设备，解决现有芯片级封装的闪光灯结构容易发生漏光现象，进而影响闪光灯光效的问题。本发明的闪光灯结构包括：闪光灯芯片，所述闪光灯芯片包括第一端面、第二端面以及设置于所述第一端面和所述第二端面之间的侧面；金属层，所述金属层围设于所述闪光灯芯片的侧面；绝缘层，所述绝缘层设置于所述闪光灯芯片与所述金属层之间。本发明实施例通过在闪光灯的侧面围设金属层，可以有效防止闪光灯结构漏光，提升光效，且该金属层能够提高闪光灯结构的抗机械应力能力以及抗静电能力。
The present invention provides a flashlight structure and electronic equipment, and solves the problem that the flashlight structure of the existing chip level package is prone to light leakage, thereby affecting the light efficiency of the flashlight. The flashlight structure of the present invention includes: a flashlight chip, the flashlight chip includes a first end face, a second end face, and a side surface disposed between the first end face and the second end face; a metal layer, the metal layer surrounds on the side of the flash lamp chip; an insulating layer, the insulating layer is arranged between the flash lamp chip and the metal layer. In the embodiment of the present invention, by surrounding the side surface of the flash lamp with a metal layer, the light leakage of the flash lamp structure can be effectively prevented, the light efficiency can be improved, and the metal layer can improve the mechanical stress resistance and antistatic ability of the flash lamp structure.
Description
Technical Field
The invention relates to the technical field of electronics, in particular to a flash lamp structure and electronic equipment.
Background
In a conventional Chip Scale Package (CSP) flash lamp, in order to ensure that light emitted from a flash lamp Chip is emitted only from the front side and reduce loss of light emitted from the periphery, titanium dioxide TiO is disposed around the flash lamp Chip2The ceramic material is used for blocking the light emitted by the flash lamp chip to the periphery and reflecting the light to the front side to be emitted, so that the effect of an enclosing wall is achieved, and the lighting effect is improved.
But due to TiO2The ceramic material is brittle, so TiO is often caused when a production line is used for mounting a flash lamp2The wall is damaged, the phenomenon of light leakage is generated, and the lighting effect of the flash lamp is influenced; in addition, due to TiO2The enclosing wall structure is generally combined with the chip through glue, and the binding force is weaker, so that the TiO2 enclosing wall is easy to fall off during production line production, the light leakage phenomenon is generated, and the lighting effect of the flash lamp is influenced.
Disclosure of Invention
The invention aims to provide a flash lamp structure and electronic equipment, and aims to solve the problem that the light leakage phenomenon is easy to occur in the existing chip-scale packaged flash lamp structure, so that the light efficiency of the flash lamp is influenced.
In order to solve the technical problem, the invention is realized as follows:
in a first aspect, an embodiment of the present invention provides a flash structure, including:
the flashlight chip comprises a first end face, a second end face and a side face arranged between the first end face and the second end face;
the metal layer is arranged on the side surface of the flash lamp chip in a surrounding mode;
the insulating layer is arranged between the flash lamp chip and the metal layer.
In a second aspect, the embodiment of the present invention further provides an electronic device, which is characterized by including the flash lamp structure as described above.
The embodiment of the invention has the following beneficial effects:
according to the technical scheme of the embodiment of the invention, the metal layer is arranged on the side surface of the flash lamp in an enclosing manner, so that light leakage of the flash lamp structure can be effectively prevented, the lighting effect is improved, and the metal layer can improve the mechanical stress resistance and the antistatic property of the flash lamp structure.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive exercise.
FIG. 1 is a first structural schematic diagram of a flash lamp structure according to an embodiment of the invention;
FIG. 2 is a schematic diagram of light reflection in a flash lamp structure according to an embodiment of the present invention;
FIG. 3 is a schematic diagram of the connection between the flash structure and the PCB according to the embodiment of the invention;
fig. 4 is an equivalent circuit diagram of the flash structure and the ground of the PCB according to the embodiment of the invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
An embodiment of the present invention provides a flash lamp structure, as shown in fig. 1, including:
the flash lamp chip comprises a first end face, a second end face and a side face arranged between the first end face and the second end face. The flash chip includes a light emitting cell 10 and a substrate 20. The first end surface may be specifically an upper surface of the flash chip, and the second end surface may be specifically a lower surface of the flash chip.
And the metal layer 30 is arranged on the side surface of the flash lamp chip in a surrounding mode.
The metal layer may be embodied as a metal ion layer, such as silver ions. And the metal layer is combined with the flash lamp chip by adopting a chemical mode of depositing ions, and the combination mode is firmer, so that the flash lamp cannot be damaged when the flash lamp is pasted.
The light emitted by the light-emitting unit is ensured to be emitted out of the first end face of the flash lamp chip after passing through the substrate through the light reflecting effect of the metal layer.
An insulating layer 40, the insulating layer 40 being disposed between the flash chip and the metal layer 30.
According to the flashlight structure provided by the embodiment of the invention, the metal layer is arranged on the side surface of the flashlight in an enclosing manner, so that light leakage of the flashlight structure can be effectively prevented, the lighting effect is improved, and the metal layer can improve the mechanical stress resistance and the antistatic capability of the flashlight structure.
Further, as shown in fig. 1, the flash chip includes:
a light emitting unit 10; the light emitting unit 10 is for emitting blue light.
A substrate 20, a first surface of the substrate 20 being connected to a first surface of the light emitting unit 10; that is, the substrate 20 is disposed on the surface of the light emitting unit 10.
Wherein the second surface of the substrate 20 is a first end surface of the flash chip, and the second surface of the light emitting unit 10 is a second end surface of the flash chip. The substrate 20 may be a sapphire substrate, and is used for growing the light emitting unit, and light emitted by the light emitting unit can pass through the substrate to emit to all directions, and then is shielded by the metal layer, so that the light emitted by the light emitting unit can be emitted only from the first end face of the flash lamp chip.
In addition, as shown in fig. 2, since metal has a better light reflection effect than ceramic material, light emitted by the light emitting unit can be reflected by the metal layer, so that light loss is effectively reduced, and light efficiency is effectively improved.
Further, the thickness of the insulating layer 40 is greater than or equal to the thickness of the light emitting unit 10. That is, the overall layer height of the insulating layer 40 is greater than or equal to the overall layer height of the light emitting cells.
Since the light emitting unit 10 can be electrically connected, the side surface of the light emitting unit may leak electricity, and therefore, in the embodiment of the invention, an insulating layer, such as SiO, is deposited between the light emitting unit 10 and the metal layer 302The insulating layer, and through setting up the thickness of insulating layer to be more than or equal to the thickness of luminescence unit, can effectively prevent the luminescence unit electric leakage.
Further, as shown in fig. 1, in the flash lamp structure according to the embodiment of the present invention, the flash lamp chip further includes:
and a pad 50, wherein the pad 50 is disposed on the second surface of the light emitting unit 10.
In an embodiment of the present invention, a predetermined number, for example, two pads, may be disposed on the second surface of the light emitting unit, so that the connection of the flash lamp structure and the PCB is achieved through the pads.
Further, as shown in fig. 3, the pad is connected to the ground of the printed circuit board 60 of the electronic device.
Optionally, the pad is connected to the ground of the PCB by solder.
In the embodiment of the invention, when the flash lamp is mounted, the metal layer is connected with the ground GND of the PCB through the soldering tin, a static protection circuit can be generated, an equivalent circuit diagram is shown in fig. 4, wherein the flash lamp chip is equivalent to a diode, and because the metal layer is directly connected with the GND, the impedance between the metal layer and the GND is very low, so that when static electricity is generated, the metal layer is preferentially discharged from the metal layer and the GND, thereby protecting the flash lamp chip.
In addition, because the metal ion layer of the embodiment of the invention is generally about 5um, and the thickness of the ceramic material in the prior art is generally about 150um, the size of the flash lamp can be effectively reduced, so that the flash lamp is easier to mount.
According to the flashlight structure provided by the embodiment of the invention, the metal layer is arranged on the side surface of the flashlight in an enclosing manner, so that light leakage of the flashlight structure can be effectively prevented, the lighting effect is improved, the mechanical stress resistance and the antistatic capability of the flashlight structure can be improved by the metal layer, and the size of the flashlight is reduced.
Embodiments of the present invention also provide an electronic device including the flash structure as described above.
Further, the electronic device further includes: the PCB is connected with the flash lamp structure.
The electronic device can realize all the implementation manners in the flash lamp structure embodiment, and can achieve the same technical effect, which is not described herein again.
The electronic equipment comprises a mobile terminal which is composed of a radio frequency unit, a network module, an audio output unit, an input unit, a sensor, a display unit, a user input unit, an interface unit, a memory, a processor, a power supply and the like.
The electronic device in the embodiment of the invention may be a mobile phone, a tablet computer, a personal digital assistant, a vehicle-mounted computer, a music player, a portable computer or a navigator.
The embodiments in the present specification are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
While preferred embodiments of the present invention have been described, additional variations and modifications of these embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the embodiments of the invention.
Finally, it should also be noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or terminal that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or terminal. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or terminal that comprises the element.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (10)
1. A flash structure, comprising:
the flashlight chip comprises a first end face, a second end face and a side face arranged between the first end face and the second end face;
the metal layer (30) is arranged on the side face of the flash lamp chip in a surrounding mode;
an insulating layer (40), the insulating layer (40) disposed between the flash chip and the metal layer (30);
wherein the metal layer (30) is connected with the ground of a Printed Circuit Board (PCB) of the electronic equipment through soldering tin;
the metal layer adopts the chemical mode of deposit ion with the flash lamp chip combines, the thickness of metal layer is 5 um.
2. The flash structure of claim 1, wherein the flash chip comprises:
a light emitting unit (10);
a substrate (20), a first surface of the substrate (20) being connected with a first surface of the light emitting unit (10);
wherein the second surface of the substrate (20) is a first end surface of the flash chip, and the second surface of the light-emitting unit (10) is a second end surface of the flash chip.
3. The flash structure according to claim 2, wherein the thickness of the insulating layer (40) is greater than or equal to the thickness of the light emitting cell (10).
4. The flash structure of claim 2, wherein the flash chip further comprises:
a pad (50), the pad (50) being disposed on a second surface of the light emitting unit (10).
5. Flash lamp structure according to claim 4, characterized in that the pad (50) is connected to the ground of a printed circuit board PCB of the electronic device.
6. Flash lamp structure according to claim 5, characterized in that the pad (50) is connected with the ground of the PCB by solder.
7. A flash lamp structure according to claim 1, wherein the metal layer (30) is a silver ion layer.
8. The flash lamp structure of claim 1 wherein the material of the insulating layer (40) is silicon dioxide, SiO 2.
9. An electronic device comprising the flash structure of any one of claims 1 to 8.
10. The electronic device of claim 9, further comprising: the PCB is connected with the flash lamp structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910932500.1A CN110690337B (en) | 2019-09-29 | 2019-09-29 | A flashlight structure and electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201910932500.1A CN110690337B (en) | 2019-09-29 | 2019-09-29 | A flashlight structure and electronic equipment |
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| CN110690337A CN110690337A (en) | 2020-01-14 |
| CN110690337B true CN110690337B (en) | 2021-07-09 |
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| CN201910932500.1A Active CN110690337B (en) | 2019-09-29 | 2019-09-29 | A flashlight structure and electronic equipment |
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| JP5956167B2 (en) * | 2012-01-23 | 2016-07-27 | スタンレー電気株式会社 | LIGHT EMITTING DEVICE, VEHICLE LIGHT, AND METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE |
| CN104201114A (en) * | 2014-08-26 | 2014-12-10 | 江阴长电先进封装有限公司 | Packaging method and packaging structure of chip with sidewall in insulating protection |
| CN207425927U (en) * | 2018-01-15 | 2018-05-29 | 襄阳市产品质量监督检验所 | Anticreep casing of lithium ion battery |
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| CN101378103A (en) * | 2007-08-28 | 2009-03-04 | 富士迈半导体精密工业（上海）有限公司 | White light light-emitting device and manufacturing method thereof |
| CN101255971A (en) * | 2008-04-07 | 2008-09-03 | 友达光电股份有限公司 | Shade structure and backlight module |
| CN203218312U (en) * | 2011-09-20 | 2013-09-25 | 昭和电工株式会社 | led |
| CN204678257U (en) * | 2015-06-01 | 2015-09-30 | 东莞市钜欣电子有限公司 | The flashlight lens producing light leak can be avoided |
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| CN110690337A (en) | 2020-01-14 |
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