CN110738968A - Chip on film and display device - Google Patents

Abstract

The present invention provides a chip-on-chip film and a display device. The chip-on-chip film includes: a film substrate; and a source driver, wherein the source driver is arranged on the film substrate and has a first direction opposite to each other in the first direction. One side and the second side; a light-emitting voltage transmission circuit, the light-emitting voltage transmission circuit is arranged on the thin film substrate, and is located on the same side of the thin film substrate as the source driver, including an anode voltage input circuit, The anode voltage input circuit includes at least one first input line on a first side of the source driver and a plurality of second input lines on the source driver the second side, and each of the first input lines is electrically connected to a plurality of the second input lines. Therefore, the anode voltage input through one first input line is dispersed to a plurality of second input lines, so that the concentration of current is avoided, and the problem of COF heating and burning can be effectively avoided.

Description

Chip-on-Film and Display Device

technical field

The present invention relates to the field of display technology, in particular to a chip-on-film and a display device.

Background technique

OLED display devices are widely accepted by people because of their excellent functions of wide color gamut, wide viewing angle, thinning, light weight, low energy consumption, high contrast ratio, and flexibility, and gradually become the development direction of future display technology. In the related art, the PCB (printed circuit board) and the display panel (Panel) are usually connected by COF (chip on film), but in the actual use process, the COF is prone to generate heat, and the COF is used in the display panel film substrate. Edges or PCB (printed circuit board) edges are easily burnt due to heat.

Therefore, the related technology of the current OLED display device still needs to be improved.

SUMMARY OF THE INVENTION

The present invention aims to solve one of the technical problems in the related art at least to a certain extent. Therefore, an object of the present invention is to provide a chip-on-film that can effectively avoid the problem of heat generation and burnout.

In one aspect of the present invention, the present invention provides a chip on film. According to an embodiment of the present invention, the chip-on-film includes: a film substrate; a source driver, wherein the source driver is disposed on the film substrate and has a first side and a second side opposite to each other in a first direction. Two sides; a light-emitting voltage transmission circuit, the light-emitting voltage transmission circuit is arranged on the thin film substrate, and is located on the same side of the thin film substrate as the source driver, including an anode voltage input circuit, the anode voltage The input circuit includes at least one first input line on a first side of the source driver and a plurality of second input lines on a second side of the source driver , and each of the first input lines is electrically connected to a plurality of the second input lines. Therefore, the anode voltage input through one first input line is dispersed to a plurality of second input lines, so that the concentration of current is avoided, and the problem of COF heating and burning can be effectively avoided.

According to an embodiment of the present invention, a plurality of the second input lines are uniformly distributed in the second direction, and the second direction is perpendicular to the first direction.

According to an embodiment of the present invention, the first input line and the second input line are provided on the surface of the film substrate, and the light-emitting voltage transmission circuit further includes A first connection line between the second input lines and electrically connected with the first input line and the second input line, the first connection line is provided inside the source driver.

According to an embodiment of the present invention, the light-emitting voltage transmission circuit further includes: a first input connection terminal, the first input connection terminal is provided between the first input line and the first connection line, located in the between the source driver and the film substrate, and electrically connected with the first input line and the first connection line; a second input connection terminal, the second input connection terminal is provided on the second input The line and the first connection line are located between the source driver and the thin film substrate, and are electrically connected to the second input line and the first connection line.

According to an embodiment of the present invention, the light-emitting voltage transmission circuit is provided on the surface of the thin film substrate, and further includes a circuit located between the first input line and the second input line and connected to the first input line. The input line and the second input line are electrically connected to a second connection line, and the second connection line is provided between the thin film substrate and the source driver.

According to an embodiment of the present invention, the second connection line is integrally formed with the first input line and the second input line.

According to an embodiment of the present invention, the light-emitting voltage transmission circuit further includes: a cathode voltage output circuit, the cathode voltage output circuit is provided on the thin film substrate, and is located opposite the source driver in the second direction sides.

According to an embodiment of the present invention, the chip-on-film further includes a plurality of data signal lines, the plurality of data signal lines are arranged on the film substrate, are electrically connected to the source driver, and are located in the source driver. the second side and alternately arranged with a plurality of the second input lines.

In another aspect of the present invention, the present invention provides a display device. According to an embodiment of the present invention, the display device includes: a display panel; at least one of the aforementioned chip-on-film, the second input line in the chip-on-film is electrically connected to the display panel; a printed circuit board, the The printed circuit board is electrically connected to the first input line in the chip on film. The light-emitting voltage passing through the chip-on-chip film in the display panel can be uniformly transmitted, which greatly reduces the phenomenon of heating and burning caused by current concentration.

Description of drawings

FIG. 1 is a schematic plan view of a chip on film according to an embodiment of the present invention.

FIG. 2 is a schematic plan view of a chip on film according to another embodiment of the present invention.

FIG. 3 is a schematic plan view of a chip on film according to another embodiment of the present invention.

FIG. 4 is a schematic diagram of a cross-sectional structure along the line A-A in FIG. 1 .

FIG. 5 is a schematic cross-sectional structure diagram of a chip on film in an embodiment of the present invention.

FIG. 6 is a schematic plan view of a chip on film according to another embodiment of the present invention.

FIG. 7 is a schematic diagram of a cross-sectional structure along the line B-B in FIG. 6 .

FIG. 8 is a schematic cross-sectional structure diagram of a chip on film in another embodiment of the present invention.

FIG. 9 is a schematic plan view of a chip on film according to another embodiment of the present invention.

FIG. 10 is a schematic plan view of a display device according to an embodiment of the present invention.

Detailed ways

Embodiments of the present invention are described in detail below. The embodiments described below are exemplary, only for explaining the present invention, and should not be construed as limiting the present invention. If no specific technique or condition is indicated in the examples, the technique or condition described in the literature in the field or the product specification is used. The reagents or instruments used without the manufacturer's indication are conventional products that can be obtained from the market.

The present invention is accomplished based on the following findings and understandings of the inventors:

The inventor found through research that the main reason why COF is easy to generate heat is that the COF also needs to transmit the light-emitting voltage while transmitting the data signal. The input circuit is transmitted to the inside of the display panel (Panel), and the cathode voltage (ELVSS) of the light-emitting voltage is transmitted to the PCB board through the cathode voltage output circuit inside the Panel, thereby forming a current loop. At present, the ELVDD voltage and ELVSS voltage transmission lines are generally arranged at the edges of both sides of the film substrate, and the source driver is arranged in the middle of the film substrate. Since the ELVDD voltage and the ELVSS voltage are simultaneously transmitted at the edge of the COF, it is easy to cause current concentration. , and the COF has a certain resistance value at the edge of the display panel substrate, which is prone to heat generation, making the COF easy to burn at the edge of the display panel substrate or the edge of the PCB. In view of the above problems, the inventor proposes a method of dispersing and transmitting the light-emitting voltage, and dispersing the concentrated current, so as to avoid the current concentration and the heat generation and burning.

In view of this, in one aspect of the present invention, the present invention provides a chip on film. According to an embodiment of the present invention, referring to FIG. 1 , the chip-on-film 100 includes: a film substrate 10 ; a source driver 20 , the source driver 10 is disposed on the film substrate 10 and has a The first side and the second side arranged opposite to each other; the light-emitting voltage transmission circuit 30, the light-emitting voltage transmission circuit 30 is arranged on the thin film substrate 10, and is located on the thin film substrate 10 with the source driver 20 On the same side, including the anode voltage input circuit 32, the anode voltage input circuit 32 includes at least one first input line 321 and a plurality of second input lines 322, the first input line 321 is located in the source driver 20 On the first side, the second input lines 322 are located on the second side of the source driver 20 , and each of the first input lines 321 is electrically connected to a plurality of the second input lines 322 . Therefore, the current input through one first input line is dispersed to a plurality of second input lines, so that the light-emitting voltage can pass through the chip-on film uniformly, avoiding the current concentration caused by the concentrated transmission of the light-emitting voltage, thereby effectively preventing the chip-on-film film from heating due to heat. Concentration causes the film material to be burned, and then the chip-on-chip film is burned, which improves the display quality of the OLED display device containing the chip-on-chip film, better meets the needs of customers, and improves product competitiveness.

According to an embodiment of the present invention, in order to further disperse the current in the anode voltage input circuit, a plurality of the second input lines 322 are uniformly distributed in the second direction, and the second direction is perpendicular to the first direction. Specifically, in some specific embodiments, referring to FIG. 2 , the uniform distribution of the plurality of second input lines 322 in the second direction may refer to the distance d1 between any two adjacent second input lines 322 In other embodiments, the uniform distribution of the plurality of second input lines 322 in the second direction may also mean that the distance d1 between any two adjacent second input lines 322 is equal, And the distance d1 is determined according to the length L of the source driver in the second direction, so that the plurality of second input lines 322 make full use of the length L, and the distance d1 is increased as much as possible, so that the current dispersion effect is better, and the heat burn may be as low as possible. .

In some specific examples, referring to FIG. 3 , N second input lines 322 are provided on the second side of the source driver 20 , and the two outermost second input lines 322 are respectively connected with the two second input lines 322 of the source driver 20 in the first direction. The edges of the sides are aligned, and the distance d1=L/(N−1) between any two adjacent second input lines 322 . In other specific examples, referring to FIG. 1 , the second side of the source driver 20 is provided with N second input lines 322 , and the edges of the source driver 20 on both sides in the first direction and the adjacent second input lines There are a first distance L1 and a second distance L2 between the 322 respectively, and the distance d1 between any two adjacent second input lines 322 is d1=(L-L1-L2)/(N-1), wherein the first The distances L1 and L2 can be set according to actual needs. For example, they can be set according to the error of the preparation process, as long as the requirements of the process error are met, or they can be set according to other usage requirements, including but not limited to L1+L2=d1, L1= L2=d1, or L1 and L2 can be used together with other components.

According to the embodiment of the present invention, the light-emitting voltage needs to be transmitted through the first input line and the second input line, and during the transmission process, it needs to be transmitted from one first input line to a plurality of second input lines. A connection line is set between the input line and the second input line to better realize the conversion from one transmission to multiple transmission. Specifically, the connection line may be provided inside the source driver, or may be provided outside the source driver. Detailed descriptions are given below.

In some specific embodiments, referring to FIG. 4 , the first input line 321 and the second input line 322 are provided on the surface of the film substrate 10 , and the light-emitting voltage transmission circuit 32 further includes a A first connection line 323 between the first input line 321 and the second input line 322, and electrically connected with the first input line 321 and the second input line 322, the first connection line 323 is provided inside the source driver 20 . Therefore, arranging the first connection circuit inside the source driver can improve the integration degree and facilitate the preparation, and the first input circuit and the second input circuit can be electrically connected while connecting the source driver.

According to the embodiment of the present invention, in order to facilitate the connection between the first connection line and the first input line and the second input line, referring to FIG. 5 , the light-emitting voltage transmission circuit 32 may further include: a first input connection terminal 324, the The first input connection terminal 324 is arranged between the first input line 321 and the first connection line 323, between the source driver 20 and the film substrate 10, and is connected to the first input line 324. The line 321 is electrically connected to the first connection line 323; the second input connection terminal 325 is provided between the second input line 322 and the first connection line 323, and is located at the between the source driver 20 and the film substrate 10 , and electrically connected to the second input line 322 and the first connection line 323 . Thereby, the connection between the first input line, the second input line and the first connection line is firmer, and the contact resistance is smaller.

In other specific embodiments, referring to FIG. 6 and FIG. 7 , the light-emitting voltage transmission circuit 32 is provided on the surface of the film substrate 10 , and further includes the first input line 321 and the second input circuit 32 . A second connection line 326 between the lines 322 and electrically connected to the first input line 321 and the second input line 322, the second connection line 326 is provided between the film substrate 10 and the source between the pole drives 20 .

Further, referring to FIG. 8 , the second connection line 326 is integrally formed with the first input line 321 and the second input line 322 . Thus, the second connection line 326 , the first input line 321 and the second input line 322 can be prepared in one step, which simplifies the preparation steps and reduces the contact resistance.

It should be noted that there is no special restriction on the positional relationship between the orthographic projection of the second connection line on the film substrate and the orthographic projection of the source driver on the film substrate, and the orthographic projection of the second connection line on the film substrate It can cover the orthographic projection of the source driver on the film substrate, the orthographic projection of the second connection line on the film substrate can overlap with the orthographic projection of the source driver on the film substrate, and the second connection line is on the film substrate. The orthographic projection of the source driver can fall within the orthographic projection of the source driver on the film substrate. Figures 6 and 7 are only exemplary to show that the orthographic projection of the second connection line on the film substrate can cover the source driver on the film. The case of orthographic projection on the substrate should not be construed as a limitation of the present invention.

It can be understood that, in order to form a circuit loop, referring to FIG. 1 , the light-emitting voltage transmission circuit 32 may further include: a cathode voltage output circuit 34 , the cathode voltage output circuit 34 is provided on the film substrate 10 and is respectively located in the two opposite sides of the source driver 20 in the second direction. Thereby, the current dispersion effect is better.

According to an embodiment of the present invention, referring to FIG. 9 , the chip-on-film may further include a plurality of data signal lines 40 , and the plurality of data signal lines 40 are arranged on the film substrate 10 and are connected to the source driver. 20 is electrically connected, located on the second side of the source driver 20 , and alternately arranged with a plurality of the second input lines 324 . As a result, the data signal lines (ie, the data lines) and the light-emitting voltage lines (ie, the second input lines) are evenly arranged to minimize the transmission resistance of the light-emitting voltage (minimum vias), which is beneficial to reduce the voltage drop (IR-Drop) of the light-emitting voltage. Phenomenon.

It should be noted that a large-sized display device has a higher luminous voltage, a higher current, and a serious heat generation phenomenon. The use of the chip on film of the present invention can effectively solve the problem of burning the chip on film caused by the heat concentration. The film is particularly suitable for use in large-sized display devices such as televisions, stage screens, advertising screens, and the like.

In another aspect of the present invention, referring to FIG. 10 , the present invention provides a display device. According to an embodiment of the present invention, the display device includes: a display panel 200; at least one chip-on-film 100 described above, the second input line 322 in the chip-on-film 100 is electrically connected to the display panel 100; printing A circuit board 300, the printed circuit board 300 is electrically connected to the first input circuit 321 in the chip on film. The light-emitting voltage passing through the chip-on-chip film in the display panel can be uniformly transmitted, which greatly reduces the phenomenon of heating and burning caused by current concentration.

According to the embodiment of the present invention, the specific type of the display device is not particularly limited, and can specifically be a mobile phone, a TV, a game console, a stage display screen, an advertisement display screen, a wearable device, etc. In addition to the display panel, the chip-on-film and the printed circuit board, it can also include the necessary structures and components of a conventional display device. Taking a TV as an example, it can also include a casing, a sound system, a Bluetooth component, etc., which will not be described here. Repeat.

In the description of the present invention, it should be understood that the terms "first" and "second" are only used for description purposes, and cannot be interpreted as indicating or implying relative importance or the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the description of this specification, description with reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples", etc., mean specific features described in connection with the embodiment or example , structure, material or feature is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine the different embodiments or examples described in this specification, as well as the features of the different embodiments or examples, without conflicting each other.

Although the embodiments of the present invention have been shown and described above, it should be understood that the above-mentioned embodiments are exemplary and should not be construed as limiting the present invention. Embodiments are subject to variations, modifications, substitutions and variations.

Claims (9)

1, kinds of chip on films, comprising:

a film substrate;

a source driver disposed on the film substrate having opposing and second sides in an direction;

the light-emitting voltage transmission circuit is arranged on the film substrate and is positioned on the same side of the film substrate as the source driver, the light-emitting voltage transmission circuit comprises an anode voltage input circuit, the anode voltage input circuit comprises at least th input lines and a plurality of second input lines, the th input line is positioned on the th side of the source driver, the second input line is positioned on the second side of the source driver, and each th input line is electrically connected with the plurality of second input lines.

2. The chip on film of claim 1, wherein the plurality of second input lines are uniformly distributed in the second direction, and the second direction is perpendicular to the th direction.

3. The chip on film of claim 1, wherein the th input line and the second input line are disposed on the surface of the film substrate, and the light emitting voltage transmitting circuit further comprises a th connection line disposed between the th input line and the second input line and electrically connected to the th input line and the second input line, and the th connection line is disposed inside the source driver.

4. The chip on film of claim 3, wherein the light emitting voltage transmitting circuit further comprises:

an th input connection terminal, wherein the th input connection terminal is arranged between the th input line and the th connection line, is positioned between the source driver and the film substrate, and is electrically connected with the th input line and the th connection line;

a second input connection terminal provided between the second input line and the th connection line, between the source driver and the film substrate, and electrically connected to the second input line and the th connection line.

5. The chip on film of claim 1, wherein the light emitting voltage transmitting circuit is disposed on the surface of the film substrate, and further comprising a second connection line disposed between the th input line and the second input line and electrically connected to the th input line and the second input line, the second connection line being disposed between the film substrate and the source driver.

6. The COF of claim 5, wherein the second connection line is integrally formed with the th input line and the second input line.

7. The chip on film according to any of claims 1-6, wherein the light emitting voltage transmitting circuit further comprises:

and the cathode voltage output circuit is arranged on the film base material and is positioned at two opposite sides of the source electrode driver in the second direction.

8. The chip on film of any of claims 1-6, further comprising a plurality of data signal lines disposed on the film substrate, electrically connected to the source driver, disposed on a second side of the source driver, and alternately disposed with the plurality of second input lines.

A display device of , comprising:

a display panel;

at least flip chips as defined in any of claims 1-8 , wherein the second input trace is electrically connected to the display panel;

the printed circuit board is electrically connected with the th input line in the chip on film.

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