CN110764598A - Radiator, circuit board assembly and computing device - Google Patents

Abstract

The present disclosure provides a heat sink, a circuit board assembly, and a computing device. The heat sink includes a first thermally conductive base and a plurality of first fins disposed on the first thermally conductive base; the first thermally conductive base The seat has at least one first sealing cavity, and the first sealing cavity is filled with a liquid phase change medium; the first heat conducting base includes a first surface, and the first sealing cavity extends from the second surface of the first surface. one side extends to an opposite second side; the heat sink further includes at least one boss disposed on the first surface of the first thermally conductive base, the boss extending from the first side extending to the second side; the boss has at least one second sealing cavity, and the second sealing cavity is filled with a liquid phase change medium; the second sealing cavity extends from the first side to the second side.

Description

Heat sinks, circuit board assemblies and computing equipment

technical field

The present disclosure relates to the technical field of heat dissipation, and in particular, to a heat sink, a circuit board assembly, and a computing device for heat dissipation of a circuit board.

Background technique

Electronic devices will generate heat during operation, and if the temperature is not cooled in time, the normal operation of electronic devices will be affected. For integrated electronic devices, multiple chips are integrated on them, and if the heat dissipation is uneven, the normal operation of the chips will be affected.

The approaches described in this section are not necessarily approaches that have been previously conceived or employed. Unless otherwise indicated, it should not be assumed that any of the approaches described in this section qualify as prior art merely by virtue of their inclusion in this section. Similarly, unless otherwise indicated, the issues raised in this section should not be considered to be recognized in any prior art.

SUMMARY OF THE INVENTION

According to an aspect of the present disclosure, a heat sink is provided, the heat sink includes a first thermally conductive base and a plurality of first fins disposed on the first thermally conductive base; in the first thermally conductive base There is at least one first sealing cavity, the first sealing cavity is filled with a liquid phase change medium; the first thermal conductive base includes a first surface, and the first sealing cavity extends from the first side of the first surface extending to a second side of the first surface opposite to the first side; the heat sink further includes at least one boss, the boss is disposed on the first surface of the first thermally conductive base, The boss extends from the first side to the second side; the boss has at least one second sealing cavity, and the second sealing cavity is filled with a liquid phase change medium; the second sealing cavity extends from the The first side extends to the second side.

Optionally, the surface of the boss includes a plurality of bonding regions, and the plurality of bonding regions have at least two different heights relative to the first surface of the first thermally conductive base.

Optionally, the first thermally conductive base has a plurality of first sealing cavities, and a region corresponding to the boss in the first thermally conductive base is provided with the first sealing cavities, and the The first sealing cavity is also provided in a region of the first thermally conductive base corresponding to the region between two adjacent bosses.

Optionally, the plurality of first sealing cavities are distributed at equal intervals.

According to another aspect of the present disclosure, a circuit board assembly with at least one heat sink is provided, comprising a circuit board and a heat sink fixedly attached to the circuit board, at least one of the at least one heat sink adopts The aforementioned heat sink.

Optionally, the heat sink includes:

at least one first heat sink fixedly attached to the chip on the circuit board, the above-mentioned heat sink for the first heat sink;

a second heat sink fixedly attached to the bottom surface of the circuit board away from the chip, the second heat sink includes a second heat conduction base and a plurality of second fins arranged on the second heat conduction base The second thermally conductive base has a plurality of third sealing cavities therein.

Optionally, there is at least one chip set on the circuit board, and each chip set in the at least one chip set includes a plurality of chips connected in series;

A plurality of serially connected chips in each chip set are spaced and distributed on a straight line, and the bosses of the first heat sink are arranged in parallel with the straight line.

Optionally, the bosses of the first heat sink are in one-to-one correspondence with the chip set, and each boss of the first heat sink is bonded to a plurality of series-connected chips in a corresponding chip set. .

Optionally, a surface of each of the bosses has a plurality of bonding regions, and the plurality of bonding regions are closely bonded to the chips on the circuit board in a one-to-one correspondence.

According to another aspect of the present disclosure, there is provided a computing device, comprising: a chassis; and at least one set of circuit board assemblies as described above, fixed in the chassis.

Further features and advantages of the present disclosure will become apparent from the exemplary embodiments described below in conjunction with the accompanying drawings.

Description of drawings

The accompanying drawings illustrate the embodiments by way of example and constitute a part of the specification, and together with the written description of the specification serve to explain exemplary implementations of the embodiments. The shown embodiments are for illustrative purposes only and do not limit the scope of the claims. Throughout the drawings, the same reference numbers refer to similar but not necessarily identical elements.

FIG. 1 is a schematic structural diagram illustrating a circuit board assembly according to an exemplary embodiment of the present disclosure;

FIG. 2 is a cross-sectional view showing the direction A-A of FIG. 1;

3 and 4 are partial schematic views of FIG. 2;

FIG. 5 is a cross-sectional view showing the direction B-B of FIG. 1;

6 is a schematic structural diagram illustrating a second heat sink according to an exemplary embodiment of the present disclosure;

Fig. 7a is a simulation schematic diagram illustrating heat dissipation of a circuit board by using a heat sink according to an exemplary embodiment of the present disclosure;

FIG. 7b is a schematic diagram of a simulation showing heat dissipation of a circuit board by using a heat sink.

Detailed ways

In the present disclosure, unless otherwise specified, the use of the terms "first", "second", etc. to describe various elements is not intended to limit the positional relationship, timing relationship or importance relationship of these elements, and such terms are only used for Distinguish one element from another. In some examples, the first element and the second element may refer to the same instance of the element, while in some cases they may refer to different instances based on the context of the description.

The terminology used in the description of the various described examples in this disclosure is for the purpose of describing particular examples only and is not intended to be limiting. Unless the context clearly dictates otherwise, if the number of an element is not expressly limited, the element may be one or more. Furthermore, as used in this disclosure, the term "and/or" covers any and all possible combinations of the listed items.

A heat sink is a device that can dissipate heat from heat-prone electronic components (such as chips on circuit boards) in electronic devices. According to the related art, the main structure of the heat sink may be a heat sink. The heat sink is usually a plate, sheet or multi-sheet structure made of aluminum alloy, brass or bronze. The heat sink is in contact with the electronic components, so that the heat generated by the electronic components is conducted to the heat sink, and then dissipated through the heat sink.

There are usually multiple chips on a circuit board, and the heat generated by the circuit board mainly comes from the chips. The chips on the circuit board may include, for example, at least one of the following chips: GPU, CPU, FPGA, DSP, ASIC, and SOC.

The chip will generate heat during operation, and if it is not cooled in time, it will affect the normal operation of the chip. According to the related art, one of the main heat dissipation methods of the circuit board is to install a heat sink on the circuit board, and the heat sink is in contact with the chips on the circuit board for heat dissipation and cooling. Different chips on the circuit board generate different heat, and some chips with high power consumption generate more heat. Due to the low thermal conductivity of the heat sink, the heat sink cannot lower the temperature of the high-temperature chip, and the heat dissipation between different chips is uneven, thereby affecting the normal operation of the chip. For example: for multiple chips connected in series, if the heat dissipation of multiple chips connected in series is not uniform, the temperature will affect the internal resistance of the chip, and then affect the voltage division of multiple chips, resulting in differences in the working states of different chips, which may reach serious less than the minimum operating voltage of the chip.

In order to solve the above technical problems, the present disclosure adopts a phase change heat sink to cool the chips on the circuit board, and uses two-stage phase change heat dissipation to improve the heat dissipation effect, so that the temperature of the high temperature chips on the circuit board can be lowered to achieve uniform heat dissipation , to solve the problem that high temperature and uneven heat dissipation affect the normal operation of the chip.

The principle of phase change heat dissipation can be: using the phase change medium to absorb heat during the phase change process to achieve the purpose of heat dissipation. The heat absorbed by the phase change medium can be conducted to the fins, and after the heat is released, the phase state of the phase change medium undergoes inverse transformation, which can absorb heat again and circulate for heat dissipation. The heat on the fins can be carried away by air convection. A fan can be used to speed up the air convection to remove the heat from the fins faster. Taking the liquid phase change medium as an example, the liquid phase change medium at the bottom of the sealed cavity absorbs heat and turns into a gas. The evaporated gas diffuses in the sealed cavity and conducts the heat to the fins to release the heat, which greatly improves the utilization of the fins. Rate. The heat of the fins can be carried away by the air convection. After the vaporized gas releases heat, it becomes liquid again, and the cycle proceeds to absorb heat > dissipate heat.

The heat sink in the present disclosure can dissipate heat from a circuit board in any computing device. The computing device may be a server, a blockchain computing device, or other machines with computing functions and high heating power. The computing device may include a chassis and at least one circuit board mounted within the chassis. The circuit board can be, for example, a computing power board in a blockchain computing device. Each chip on the hash board generates a lot of heat in the process of computing. The heat sink of the present disclosure can rapidly cool the chips on the circuit board, and make the heat dissipation between different chips uniform, so as to avoid the problem that the chips cannot work normally due to high temperature and uneven heat dissipation.

It should be noted that the heat sink in the present disclosure can also dissipate heat from heat-generating components (eg, LEDs, etc.) other than the circuit board, which is not limited herein.

The heat sink of the present disclosure will be further described below by taking the heat dissipation of the circuit board as an example and in conjunction with the accompanying drawings.

The heat sink of the present disclosure can be used to dissipate heat from a circuit board. With reference to FIGS. 1 to 3 and FIG. 5 , the heat sink may include a first thermally conductive base 11 and a plurality of first fins 12 disposed on the first thermally conductive base 11 . The first thermally conductive base 11 has at least one first sealing cavity 110, and the first sealing cavity 110 is filled with a liquid phase change medium. The first thermally conductive base 11 includes a first surface 100 , and the first sealing cavity 110 extends from a first side of the first surface 100 to a second side of the first surface 100 opposite to the first side. two sides.

The heat sink further includes at least one boss 13 disposed on the first surface 100 of the first thermally conductive base 11 . The boss 13 extends from the first side to the second side. The boss 13 has at least one second sealing cavity 130, and the second sealing cavity 130 is filled with a liquid phase change medium; at least one second sealing cavity 130 in the at least one second sealing cavity 130 is The first side extends to the second side.

In the case of dissipating heat from the circuit board, the bosses 13 can be used for bonding with chips on the circuit board. Thereby, the heat sink and the chip can be closely attached, the heat conduction efficiency is improved, and the heat dissipation efficiency is improved.

The working principle of the heat sink of the present disclosure is as follows: the liquid phase change medium in the first sealing cavity 110 in the first heat conduction base 11 and the liquid phase change medium in the second sealing cavity 130 in the boss 13 form a two-stage phase Change heat. The boss 13 is attached to the chip 201 on the circuit board 200 . The chip 201 generates heat during operation, and the liquid phase change medium in the second sealed cavity 130 absorbs the heat and turns into a gas. The evaporated gas diffuses in the second sealed cavity 130, and transfers heat to the liquid phase change medium in the first sealed cavity 110, and the phase state of the phase change medium in the second sealed cavity 130 becomes liquid again, which can absorb heat again. The chip is circulated for heat dissipation;

The liquid phase change medium in the first liquid sealing cavity 110 absorbs heat and turns into gas, and the evaporated gas diffuses in the first sealing cavity 110 to conduct heat to the fins 12 , and the phase change medium in the first liquid sealing cavity 110 The phase state becomes liquid again, which can absorb heat again for circulating heat dissipation;

The heat of the fins 12 can be carried away by air convection. While the heat of the fins 12 is carried away by the air convection, the liquid phase change medium in the second sealing cavity 130 in the boss 13 and the liquid in the first liquid sealing cavity 110 in the first heat conducting base 10 undergo a phase change The medium has entered the next heat dissipation cycle, the liquid phase change medium in the second sealing chamber 130 absorbs heat again and turns into gas, the evaporated gas diffuses in the second sealing chamber 130, and transfers heat to the liquid phase change medium in the first liquid sealing chamber 110. Liquid phase change medium.

Therefore, compared with the single-stage phase change radiator, it needs to wait for the heat dissipation of the fins to be completed before absorbing the heat of the evaporating gas again, so that the phase change medium undergoes inverse transformation. In the technical solution of the present disclosure, by arranging the second sealing cavity in the boss, the liquid phase change medium in the second sealing cavity can enter the next cycle of heat dissipation without waiting for the cooling of the fins to be completed, which improves the heat dissipation efficiency and can quickly dissipate heat. Cool down, solve the problem that high temperature affects the normal operation of the chip. In addition, the liquid phase change medium has fluidity, which can make the phase change medium corresponding to the area where the high temperature chip is located absorb heat and become gas, and the liquid phase change medium corresponding to other relatively low temperature areas can quickly flow to the position corresponding to the high temperature area. Continuously absorb the heat in the high-temperature area, so that the temperature of the high-temperature chip can be lowered, the heat dissipation is more uniform, and the problem of uneven heat dissipation affecting the normal operation of the chip is solved.

The first sealing cavity and the second sealing cavity may be substantially parallel, that is, the axes of the first sealing cavity and the second sealing cavity may be substantially parallel. It should be noted that substantially parallel means that the angle between the two axes is smaller than the set value. The set value may be, for example, 10° to 30°.

The first heat-conducting base 11 can be, but is not limited to, an aluminum profile product made by an aluminum extrusion molding process. The aluminum extrusion molding process can be as follows: the aluminum ingot softened at high temperature flows through the aluminum extrusion die under the strong extrusion of the aluminum extruder to form an aluminum profile product conforming to the required shape. In the first thermally conductive base 11 manufactured by the aluminum extrusion molding process, one end of the first sealed cavity 110 may be an open end, and the other end may be a closed end. A vacuum can be performed from the open end of the first sealed cavity 110 , and a liquid phase change medium can be injected into the first sealed cavity 110 . Finally, the open end of the first sealing cavity 110 may be sealed by a welding process.

According to some embodiments, the first thermally conductive base 11 , the fins 12 and the bosses 13 may be integrally formed. The liquid phase change medium can be fluorinated liquid or alcohol or the like.

According to some embodiments, the extending directions of the first sealing cavity 110 and the second sealing cavity 130 may be parallel to the first surface 100 of the first thermally conductive base 11 . That is, the axes of the first sealing cavity 110 and the second sealing cavity 130 are both parallel to the first surface 100 of the first thermally conductive base 10 , so that it is convenient to set the first sealing cavity 110 and the second sealing cavity 110 and the second sealing cavity 110 to realize the two-stage phase change heat dissipation. The cavity 130 is sealed to reduce the volume of the heat sink.

According to some embodiments, the surface of the boss may include a plurality of abutment regions, and the plurality of abutment regions may have at least two different heights relative to the first surface of the first thermally conductive base. Therefore, in the case of heat dissipation of the circuit board, it can be achieved that each bonding area can be closely attached to the corresponding chip on the circuit board, thereby improving the heat dissipation effect on the chip and preventing heat dissipation caused by different heights of the chips. the problem of extruding the chip. The height of the corresponding bonding area can be set according to the height of the chip on the circuit board, so that each bonding area can be closely bonded to the corresponding chip.

It should be noted that the heights of the plurality of bonding regions of the bosses may also be set to be the same. In this case, according to the height of the chip, thermal conductive layers of different thicknesses can be filled between the chip and the corresponding bonding area, so that the bonding area can be closely bonded to the corresponding chip on the circuit board through the thermal conductive layer . According to some embodiments, the material of the thermally conductive layer may be thermally conductive materials such as thermally conductive gel, thermally conductive silicone grease, and thermally conductive silicone pad.

According to some embodiments, the first thermally conductive base 11 may have a plurality of first sealing cavities 110 therein. The first sealing cavity 110 may be provided in the region corresponding to the boss 13 in the first thermally conductive base 11 , so that the liquid phase change medium in the first sealing cavity 110 can absorb the second sealing more quickly The heat of the gas evaporated in the cavity 130 improves the heat dissipation effect.

According to some embodiments, the first sealing cavity 20 may also be provided in a region of the first thermally conductive base 11 corresponding to the region between two adjacent bosses 13 , so that the first sealing cavity 20 is The liquid phase change medium in the sealed cavity 20 can absorb the heat in the gap between the two adjacent bosses 12 , prevent the diffused heat from accumulating in the gap between the two adjacent bosses 13 , and improve the heat dissipation efficiency.

According to some embodiments, when the first thermally conductive base 11 has a plurality of first sealing cavities 110 , the plurality of first sealing cavities 110 may be arranged to be distributed at equal intervals, so as to make the heat dissipation more uniform.

As an exemplary embodiment, the first thermal conductive base 11 may be provided with the first heat conducting base 11 in both the region corresponding to the boss 13 and the region corresponding to the region between two adjacent bosses 13 . A sealed cavity 110 . According to some embodiments, a plurality of first sealing cavities 110 may be arranged to be distributed at equal intervals, so as to improve the heat dissipation efficiency and make the heat dissipation more uniform.

According to some embodiments, opposite ends of the first thermally conductive base may have flanges for fitting a heat sink into a chassis of a computing device. Correspondingly, a matching chute can be provided in the chassis, and the radiator can be assembled into the chassis by pushing the radiator to make the flange slide in the chute, and the assembly is simple and quick. It should be noted that, this is only an example to illustrate how to assemble the radiator into the chassis, and it is not a limitation. The heat sink can also be assembled into the chassis by other means (eg: screws, snaps, etc.).

According to another aspect of the present disclosure, there is also provided a circuit board assembly having at least one heat sink, including a circuit board and a heat sink fixedly attached to the circuit board. At least one of the at least one heat sink may adopt the above-mentioned heat sink. Therefore, the circuit board can be rapidly cooled, and the heat dissipation is uniform, so as to avoid the problem that the chips on the circuit board cannot work normally due to high temperature and uneven heat dissipation.

According to some embodiments, the first heat-conducting base of the heat sink can be matched with the surface size of the circuit board, so that a heat sink can be set to be fixedly attached to the surface of the circuit board with chips, so that the circuit The chip on the board dissipates heat. The number of chips on the circuit board can be set according to actual requirements.

According to other embodiments, the size of the first thermally conductive base of the heat sink may also be smaller than the surface size of the circuit board. Correspondingly, a plurality of heat sinks may be arranged to be fixedly attached to the surface of the circuit board with chips, respectively, so as to dissipate heat from the chips on the circuit board. The number of heat sinks can be set according to the size of the first heat conducting base and the size of the surface of the circuit board, as long as all chips of the circuit board can be attached to the bosses of the heat sink.

According to some embodiments, thermal conductive glue may be filled between the boss of the heat sink and the chip on the circuit board, and the heat sink is fixedly attached to the circuit board through the thermal conductive glue. At the same time, the thermally conductive adhesive can also efficiently conduct the heat generated by the circuit board to the heat sink.

According to some embodiments, the heat sink can also be fixedly attached to the circuit board by means of mechanical connection, which facilitates the installation and removal of the heat sink, and the fixing is more firm. For example, mechanical structures such as screws or snaps can be used to fix the heat sink on the circuit board. According to some embodiments, as shown in FIG. 4 , spring screws 30 can be used to fix the first heat conducting base 11 of the heat sink on the circuit board 200 , which is easy to install. In addition, the elastic restoring force of the spring can be used for pressing, so that the heat sink and the circuit board are closely attached, and the heat conduction efficiency is improved.

The heat sink and the circuit board can also be fixedly attached by combining the above two embodiments. That is to say, thermal conductive glue is filled between the boss of the heat sink and the chip on the circuit board, and the heat sink is fixed on the circuit board through a mechanical structure, so as to ensure the firmness of the fixation and improve the heat conduction efficiency .

In order to further improve the heat dissipation effect, heat sinks can also be arranged on both sides of the circuit board. According to some embodiments, with reference to FIGS. 2 to 5 , the at least one heat sink may include: at least one first heat sink 10 fixedly attached to the chip 201 on the circuit board 200 , the first heat sink 10 . The device 10 adopts the above-mentioned heat sink; and a second heat sink 20 fixedly attached to the bottom surface of the circuit board 200 away from the chip 201, the second heat sink 20 includes a second heat conduction base 21 and a A plurality of second fins 22 on the second thermally conductive base 21 . The second thermally conductive base 21 has a plurality of third sealing cavities 210, so that when the circuit board is in operation, part of the heat generated by the chip is conducted to the first heat sink 10 in direct contact with the chip 201, while the other part is conducted to the second heat sink 20 attached to the bottom surface of the circuit board 200 . The first radiator uses two-stage phase change heat dissipation to dissipate heat quickly and uniformly on the chips on the circuit board, and the second heat sink uses single-stage phase change heat dissipation to assist in dissipating heat from the circuit board, which can achieve faster heat dissipation efficiency, especially Suitable for heat dissipation of high power consumption circuit boards.

According to some embodiments, the third sealing cavity 210 may be disposed in parallel with the first sealing cavity 110 . According to some embodiments, the plurality of third sealing cavities 210 may be arranged to be distributed at equal intervals to improve the uniformity of heat dissipation.

According to some embodiments, in the case where the bottom surface of the circuit board does not have chips, the surface of the second heat sink 20 that is adhered to the bottom surface of the circuit board 200 may be set to be flat. Therefore, the contact area between the second heat sink and the circuit board can be increased, and the heat dissipation efficiency can be improved.

According to some embodiments, in the case that the bottom surface of the circuit board has chips, the second heat sink can also use the above-mentioned heat sink, so that the chips on the bottom surface of the circuit board can be radiated by two-stage phase change heat dissipation. heat dissipation.

According to some embodiments, the circuit board has at least one chipset. Each of the at least one chipset includes a plurality of chips connected in series (eg, a plurality of chips located in the same row as shown in FIG. 7a). A plurality of serially connected chips in each chip set are spaced in a straight line. The boss of the first heat sink may be arranged in parallel with the straight line. Therefore, the second sealing cavity in the boss can dissipate heat for the plurality of chips connected in series, so as to reduce the temperature difference of the plurality of chips connected in series. Thereby, the problem of large temperature difference caused by uneven heat dissipation, resulting in different internal resistances and thus different voltage divisions of multiple series-connected chips, makes the working states of multiple series-connected chips vary or even fail to work normally.

According to some embodiments, the bosses of the first heat sink may be in a one-to-one correspondence with the chip set, and each boss of the first heat sink may be attached to a plurality of serially connected chips in a corresponding chip set combined to improve the heat dissipation effect of multiple serially connected chips in each chip set. According to some embodiments, at least two second sealing cavities can also be provided in each boss, so as to further improve the heat dissipation effect on a plurality of chips connected in series in each chip set.

7a and 7b, by using the heat sink of the present disclosure, the temperature difference between multiple chips located in the same row can be reduced, and the large temperature difference can cause different internal resistances and different partial pressures of the chips, so that the chips cannot work normally. question.

According to some embodiments, the surface of each of the bosses may have a plurality of bonding regions, and the plurality of bonding regions are closely bonded to the chips on the circuit board in a one-to-one correspondence. By arranging a one-to-one correspondence between a plurality of bonding regions and a plurality of chips, the bonding regions can be closely bonded to the corresponding chips on the circuit board.

In an exemplary embodiment, in the case that the plurality of bonding regions correspond to chips on the circuit board one-to-one, the relative position of each bonding region in the plurality of bonding regions may be set relative to The sum of the height of the first surface of the first thermally conductive base and the height of the corresponding bonded chip is equal to the distance between the first surface of the first thermally conductive base and the surface with the chip of the circuit board, so that Each bonding area is closely bonded with the corresponding chip. Therefore, the height of the corresponding bonding area can be set according to the thickness of the corresponding chip. While the chip and the boss are closely bonded to ensure the heat dissipation effect, the chip is not squeezed to prevent damage to the chip.

It should be noted that the heights of the multiple bonding regions of each boss can also be set to be the same. In this case, thermal conductive layers of different thicknesses can be filled between the chip and the corresponding bonding region according to the height of the chip. So that the bonding area is closely bonded with the corresponding chip. According to some embodiments, the material of the thermally conductive layer may be thermally conductive materials such as thermally conductive gel, thermally conductive silicone grease, and thermally conductive silicone pad.

According to some embodiments, opposite ends of the second thermally conductive base 21 of the second heat sink 20 may be provided with flanges 23 for assembling the heat sink into the chassis of the computing device, as shown in FIG. 6 . It should be noted that, this is only an example to illustrate how to assemble the radiator into the chassis, and it is not a limitation. The heat sink can also be assembled into the chassis by other means (eg: screws, snaps, etc.).

According to another aspect of the present disclosure, there is also provided a computing device, comprising: a chassis; and at least one group of circuit board assemblies as described above, fixed in the chassis. The circuit board assembly includes a circuit board and at least one heat sink, and at least one of the at least one heat sink adopts the heat sink described above. Since the heat sink can rapidly cool down the circuit board and dissipate heat evenly, the chips on the circuit board can work normally, and the overall performance of the computing device is improved.

According to some embodiments, the heat sink can be fixedly mounted on the circuit board by using thermal conductive glue and/or mechanical structure (the specific implementation has been described in the above content and will not be described in detail here) to dissipate heat from the circuit board. In this case, the heat sink and the circuit board can be secured in the chassis of the computing device after the heat sink and the circuit board are assembled. According to some embodiments, opposite ends of the thermally conductive base of the heat sink may be provided with flanges. Correspondingly, a chute matching the flange can be provided on the cabinet of the chassis, and by pushing the radiator to make the flange slide in the chute, the radiator can be assembled into the chassis, and the assembly is simple and quick. It should be noted that, this is only an example to illustrate how to assemble the circuit board assembly into the chassis, and it is not a limitation. The circuit board assembly can also be assembled into the chassis by other means (eg, screws, snaps, etc.).

According to some embodiments, in the case where the first heat sink and the second heat sink as described above are respectively provided on both sides of the circuit board, the first heat conduction base of the first heat sink and/or the second heat sink may be provided. Opposite ends of the second thermally conductive base have flanges. Correspondingly, a chute matched with the flanges of the first heat conduction base and/or the second heat conduction base may be provided on the cabinet of the chassis, and by pushing the radiator to make the flange slide in the chute, the The radiator fits into the chassis. Flanges may be provided at opposite ends of the first thermally conductive base and/or the second thermally conductive base according to actual requirements.

According to some embodiments, the circuit board assembly may be fixed vertically in the chassis, ie the circuit board is substantially perpendicular to the horizontal plane. Therefore, the heat generated by the chip during operation of the circuit board can be conducted to the liquid phase change medium in the first sealing cavity and the second sealing cavity of the first heat sink, and the liquid phase change medium in the third sealing cavity of the second heat sink. The medium enables the first heat sink and the second heat sink to dissipate heat on the circuit board by utilizing the phase change heat dissipation technology.

Although the embodiments or examples of the present disclosure have been described with reference to the accompanying drawings, it should be understood that the above-described methods, systems and devices are merely exemplary embodiments or examples, and the scope of the present disclosure is not limited by these embodiments or examples, but is limited only by the appended claims and their equivalents. Various elements of the embodiments or examples may be omitted or replaced by equivalents thereof. Furthermore, the steps may be performed in an order different from that described in this disclosure. Further, various elements of the embodiments or examples may be combined in various ways. Importantly, as technology evolves, many of the elements described herein may be replaced by equivalent elements that appear later in this disclosure.

Some exemplary aspects of the present disclosure are described below.

Aspect 1. A heat sink, the heat sink comprising a first thermally conductive base and a plurality of first fins disposed on the first thermally conductive base;

The first heat-conducting base has at least one first sealing cavity, and the first sealing cavity is filled with a liquid phase change medium; the first heat-conducting base includes a first surface, and the first sealing cavity is a first side of the first surface extends to a second side of the first surface opposite the first side;

The heat sink further includes at least one boss disposed on the first surface of the first thermally conductive base, the boss extending from the first side to the second side;

The boss has at least one second sealing cavity, and the second sealing cavity is filled with a liquid phase change medium; the second sealing cavity extends from the first side to the second side.

Aspect 2. The heat sink of aspect 1, wherein the surface of the boss includes a plurality of abutting regions, and the plurality of abutting regions has at least two different heights.

Aspect 3. The heat sink according to Aspect 1 or 2, wherein the first thermally conductive base has a plurality of first sealing cavities, and regions in the first thermally conductive base corresponding to the bosses are provided The first sealing cavity is provided, and the first sealing cavity is also provided in the region corresponding to the region between two adjacent bosses in the first heat conducting base.

Aspect 4. The heat sink of Aspect 3, wherein the plurality of first sealing cavities are equally spaced.

Aspect 5. The heat sink of any of aspects 1-4, wherein opposite ends of the first thermally conductive base have flanges for fitting the heat sink into a chassis of a computing device.

Aspect 6. A circuit board assembly with at least one heat sink, comprising a circuit board and a heat sink fixedly attached to the circuit board, wherein at least one heat sink in the at least one heat sink adopts any one of aspects 1 to 5 A radiator as described.

Aspect 7. The circuit board assembly of aspect 6, wherein the at least one heat sink comprises:

at least one first heat sink fixedly attached to the chip on the circuit board, the first heat sink adopts the heat sink according to any one of aspects 1 to 5;

a second heat sink fixedly attached to the bottom surface of the circuit board away from the chip, the second heat sink includes a second heat conduction base and a plurality of second fins arranged on the second heat conduction base The second thermally conductive base has a plurality of third sealing cavities therein.

Aspect 8. The circuit board assembly of aspect 6, wherein the circuit board has at least one chipset, each of the at least one chipset comprising a plurality of chips connected in series;

A plurality of serially connected chips in each chip set are spaced and distributed on a straight line, and the bosses of the first heat sink are arranged in parallel with the straight line.

Aspect 9. The circuit board assembly of Aspect 8, wherein the bosses of the first heat sink correspond to the chipset one-to-one, and each boss of the first heat sink corresponds to a corresponding one of the chipsets A plurality of chips in series are attached.

Aspect 10. The circuit board assembly according to Aspect 6 or 7, wherein a surface of each of the bosses has a plurality of bonding regions, and the plurality of bonding regions correspond one-to-one with the chips on the circuit board Tight fit.

Aspect 11. The circuit board assembly of claim 10, wherein a height of each of the plurality of abutment regions relative to the first surface of the first thermally conductive base corresponds to a corresponding The sum of the heights of the chips is equal to the distance between the first surface of the first thermally conductive base and the surface of the circuit board with the chips.

Aspect 12. The circuit board assembly of Aspect 7, wherein a surface of the second heat sink that adheres to the bottom surface of the circuit board is a plane.

Aspect 13. A computing device, comprising:

chassis; and

At least one group of circuit board assemblies according to any one of aspects 6 to 12 is fixed in the chassis.

Claims (10)

1. A heat sink comprising a first thermally conductive base and a plurality of first fins disposed on the first thermally conductive base;

the first heat conduction base is provided with at least one first sealed cavity, and a liquid phase-change medium is filled in the first sealed cavity; the first thermally conductive base includes a first surface, the first sealed cavity extending from a first side of the first surface to a second side of the first surface opposite the first side;

the heat sink further comprises at least one boss disposed on a first surface of the first thermally conductive base, the boss extending from the first side to a second side;

the boss is internally provided with at least one second sealing cavity, and liquid phase-change media are filled in the second sealing cavity; the second capsule extends from the first side to a second side.

2. The heat sink of claim 1, wherein the surface of the boss comprises a plurality of conforming regions having at least two different heights relative to the first surface of the first thermally conductive base.

3. The heat sink as claimed in claim 1 or 2, wherein the first heat conducting base has a plurality of first sealed cavities therein, the first sealed cavities are provided in regions of the first heat conducting base corresponding to the bosses, and the first sealed cavities are also provided in regions of the first heat conducting base corresponding to regions between two adjacent bosses.

4. The heat sink of claim 3, wherein the plurality of first sealed cavities are equally spaced.

5. A circuit board assembly with at least one heat sink comprises a circuit board and a heat sink fixedly attached to the circuit board, wherein the heat sink of any one of claims 1-4 is adopted as at least one of the at least one heat sink.

6. The circuit board assembly of claim 5, wherein the at least one heat sink comprises:

at least one first radiator fixedly attached to a chip on the circuit board, wherein the radiator of any one of claims 1-4 is adopted as the first radiator;

with what the circuit board deviated from the fixed second radiator of laminating of bottom surface of chip, the second radiator includes second heat conduction base and sets up a plurality of second fins on the second heat conduction base, a plurality of third seal chamber have in the second heat conduction base.

7. The circuit board assembly of claim 5, wherein the circuit board has at least one chipset thereon, each of the at least one chipset comprising a plurality of chips connected in series;

a plurality of chips connected in series in each chip set are distributed on a straight line at intervals, and the bosses of the first radiator are arranged in parallel with the straight line.

8. The circuit board assembly of claim 7, wherein the bosses of the first heat spreader are in one-to-one correspondence with the chip sets, each boss of the first heat spreader engaging a plurality of serially connected chips in a corresponding one of the chip sets.

9. The circuit board assembly of claim 5 or 6, wherein the surface of each boss has a plurality of attachment regions that are in close proximity to a one-to-one correspondence with chips on the circuit board.

10. A computing device, comprising:

a chassis; and

at least one set of circuit board assemblies as claimed in any one of claims 5 to 9 secured in the chassis.

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