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CN110794287A - A tool for detecting pressure injuries on circuit boards - Google Patents

A tool for detecting pressure injuries on circuit boards Download PDF

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CN110794287A
CN110794287A CN201911048903.6A CN201911048903A CN110794287A CN 110794287 A CN110794287 A CN 110794287A CN 201911048903 A CN201911048903 A CN 201911048903A CN 110794287 A CN110794287 A CN 110794287A
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layer
tool
conducting
circuit board
conductive layer
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CN110794287B (en
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程文君
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Aoshikang Technology Co Ltd
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    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2813Checking the presence, location, orientation or value, e.g. resistance, of components or conductors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing
    • G01R31/2812Checking for open circuits or shorts, e.g. solder bridges; Testing conductivity, resistivity or impedance

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
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  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
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Abstract

一种用于电路板的检测压伤工具,包括主体区,主体区包括由上到下依次叠压的保护膜层、布线层、第一基材层、上导电层、支撑隔离层、下导电层和第二基材层,所述上导电层被划分为多个导电单元,任意两个导电单元之间不导电,所述布线层中设有多个导线,所述第一基材层开有多个导通孔,所述导线和导通孔分别与导电单元一一对应设置,所述导线沿导通孔与导电单元电连接;所述主体区的一侧设有观察区,所述观察区安装有电源和多个指示灯,指示灯与导线电连接,且一一对应设置,所述电源分别与多个指示灯电连接,所述电源还和下导电层电连接。与现有技术相比,本发明相对于人工检测,能准确且高效的检测出电路板的压伤,其次,检测的精度高。

Figure 201911048903

A pressure-wound detection tool for a circuit board, comprising a main body area, the main body area including a protective film layer, a wiring layer, a first base material layer, an upper conductive layer, a support isolation layer, a lower conductive layer that are stacked in sequence from top to bottom layer and the second substrate layer, the upper conductive layer is divided into a plurality of conductive units, and there is no conduction between any two conductive units, a plurality of wires are arranged in the wiring layer, and the first substrate layer is open There are a plurality of through holes, the wires and the through holes are respectively arranged in a one-to-one correspondence with the conductive units, and the wires are electrically connected with the conductive units along the through holes; one side of the main body area is provided with an observation area, and the A power supply and a plurality of indicator lights are installed in the observation area. The indicator lights are electrically connected to the wires and are arranged in one-to-one correspondence. The power supply is electrically connected to the plurality of indicator lights respectively, and the power supply is also electrically connected to the lower conductive layer. Compared with the prior art, compared with manual detection, the present invention can accurately and efficiently detect the pressure injury of the circuit board, and secondly, the detection accuracy is high.

Figure 201911048903

Description

一种用于电路板的检测压伤工具A tool for detecting pressure injuries on circuit boards

技术领域technical field

本发明涉及PCB板制造技术领域,尤其是涉及一种用于电路板的检测压伤工具。The invention relates to the technical field of PCB board manufacturing, in particular to a pressure-wound detection tool for circuit boards.

背景技术Background technique

在电路板生产ET测试过程中,需要用到特殊的夹具配套测试机给电路板做开短路测试,具体流程是:将电路板套在下夹具的PIN上→启动测试机→测试机压床下压→带动固定在压床下的夹具下压→夹具上的测试针与对应的测点焊盘接触→连通电信号→测试机测试完成后输出结果→压床回升→取板→继续下一个循环。In the ET test process of circuit board production, a special fixture supporting test machine needs to be used to test the circuit board for open and short circuit. The specific process is: put the circuit board on the PIN of the lower fixture → start the test machine → press the test machine press → Drive the fixture fixed under the press to press down → the test pin on the fixture is in contact with the corresponding measuring point pad → connect the electrical signal → the tester outputs the result after the test is completed → the press rises → takes the board → continues to the next cycle.

在测试针接触电路板焊盘的过程中,正常情况测试针有弹性,不会对焊盘铜面造成压伤,异常情况下如测试针撞弯、锈死,或者板面和夹具接触面有异物铜渣,则会造成电路板被压伤,针对该情况,目前业内一般靠抽检,用眼睛借助放大镜直接看,但效率非常低,且电路板因表面油墨、文字、线路而变得凹凸不平,其颜色也不一样,光靠目视检查有很大的漏失的风险。In the process of the test needle contacting the circuit board pad, the test needle is elastic under normal conditions and will not cause pressure damage to the copper surface of the pad. Foreign copper slag will cause the circuit board to be crushed. In view of this situation, the industry generally relies on random inspection and direct viewing with the eyes through a magnifying glass, but the efficiency is very low, and the circuit board becomes uneven due to surface ink, text and lines. , its color is also different, there is a great risk of omission by visual inspection alone.

因此,有必要提供一种新的用于电路板的检测压伤工具解决上述技术问题。Therefore, it is necessary to provide a new tool for detecting pressure damage on circuit boards to solve the above-mentioned technical problems.

发明内容SUMMARY OF THE INVENTION

本发明所要解决的技术问题是,提供一种能准确检测,精度高和效率高的用于电路板的检测压伤工具。The technical problem to be solved by the present invention is to provide a pressure-wound detection tool for circuit boards that can accurately detect, has high precision and high efficiency.

本发明解决其技术问题所采用的技术方案,一种用于电路板的检测压伤工具,包括主体区,主体区包括由上到下依次叠压的保护膜层、布线层、第一基材层、上导电层、支撑隔离层、下导电层和第二基材层,所述上导电层被划分为多个导电单元,任意两个导电单元之间不导电,所述布线层中设有多个导线,所述第一基材层开有多个导通孔,所述导线和导通孔分别与导电单元一一对应设置,所述导线沿导通孔与导电单元电连接;The technical solution adopted by the present invention to solve the technical problem is a pressure-wound detection tool for a circuit board, which includes a main body area, and the main body area includes a protective film layer, a wiring layer, and a first substrate that are stacked in sequence from top to bottom. layer, an upper conductive layer, a support isolation layer, a lower conductive layer and a second substrate layer, the upper conductive layer is divided into a plurality of conductive units, and there is no conduction between any two conductive units, and the wiring layer is provided with a plurality of conducting wires, the first base material layer is provided with a plurality of conducting holes, the conducting wires and the conducting holes are respectively arranged in a one-to-one correspondence with the conducting units, and the conducting wires are electrically connected with the conducting units along the conducting holes;

所述主体区的一侧设有观察区,所述观察区安装有电源和多个指示灯,指示灯与导线电连接,且一一对应设置,所述电源分别与多个指示灯电连接,所述电源还和下导电层电连接。One side of the main body area is provided with an observation area, the observation area is provided with a power supply and a plurality of indicator lights, the indicator lights are electrically connected with the wires, and are arranged in a one-to-one correspondence, and the power supply is respectively electrically connected with the plurality of indicator lights, The power source is also electrically connected to the lower conductive layer.

优选的,所述支撑隔离层设有压敏胶和多个陶瓷微珠,多个陶瓷微珠嵌入在压敏胶中。Preferably, the support and isolation layer is provided with a pressure-sensitive adhesive and a plurality of ceramic microbeads, and the plurality of ceramic microbeads are embedded in the pressure-sensitive adhesive.

优选的,所述导线的两侧设有支撑物。Preferably, supports are provided on both sides of the wire.

优选的,所述上导电层和下导电层的厚度均为15-21um。Preferably, the thicknesses of the upper conductive layer and the lower conductive layer are both 15-21um.

优选的,所述陶瓷微珠的直径为10-20um。Preferably, the diameter of the ceramic microbeads is 10-20um.

优选的,所述保护膜层的厚度为20-30um。Preferably, the thickness of the protective film layer is 20-30um.

优选的,所述上导电层和下导电层均由铜制成。Preferably, both the upper conductive layer and the lower conductive layer are made of copper.

优选的,所述保护膜层由PI膜制成。Preferably, the protective film layer is made of PI film.

优选的,所述支撑物为填充胶。Preferably, the support is a filler.

优选的,所述基材层的材质为FR-4。Preferably, the material of the base material layer is FR-4.

与现有技术相比,本发明相对于人工检测,通过检测压伤工具能迅速地检测出电路板是否有压伤,有压伤则指示灯亮,无压伤则指示灯不亮,该检测方式即准确且高效。电路板有压伤时,相对应的导电单元上连接的指示灯亮,该设计能够准确的反应出压伤区域,便于作业员准确查找压伤点,检测的精度高。其次可以反复使用,当上导电层下导电层紧密接触在一起时,只需卸掉压力,上导电层和下导电层即可在陶瓷微珠的弹力作用下分离开,达到重复检测的目的。Compared with the prior art, compared with manual detection, the present invention can quickly detect whether there is a pressure injury on the circuit board through the detection tool for pressure injury. i.e. accurate and efficient. When the circuit board is crushed, the indicator light connected to the corresponding conductive unit is on. The design can accurately reflect the crushed area, which is convenient for the operator to accurately find the crushed point, and the detection accuracy is high. Secondly, it can be used repeatedly. When the upper conductive layer and the lower conductive layer are in close contact with each other, just remove the pressure, and the upper conductive layer and the lower conductive layer can be separated under the elastic force of the ceramic beads to achieve the purpose of repeated detection.

附图说明Description of drawings

图1为本发明的结构示意图;Fig. 1 is the structural representation of the present invention;

图2为本发明的主体区的剖视示意图。FIG. 2 is a schematic cross-sectional view of the main body region of the present invention.

图中:In the picture:

1.主体区,2.观察区,11.保护膜层,12.布线层,13.第一基材层,14.上导电层,15.支撑隔离层,16.下导电层,17.第二基材层,121.导线,122.支撑物,131.导通孔,141.导电单元,151.压敏胶,152.陶瓷微珠,3.电源,4.指示灯。1. Main body area, 2. Observation area, 11. Protective film layer, 12. Wiring layer, 13. First substrate layer, 14. Upper conductive layer, 15. Support isolation layer, 16. Lower conductive layer, 17. Section Two substrate layers, 121. Conductor, 122. Support, 131. Via hole, 141. Conductive unit, 151. Pressure sensitive adhesive, 152. Ceramic beads, 3. Power supply, 4. Indicator light.

具体实施方式Detailed ways

为了使本发明的目的、技术方案及优点更加清楚明白,以下结合附图及实施例,对本发明进行进一步详细说明。应当理解,此处所描述的具体实施例仅仅用以解释本发明,并不用于限定本发明。In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

参照附图1-2,本实施例一种用于电路板的检测压伤工具,包括主体区1,主体区1包括由上到下依次叠压的保护膜层11、布线层12、第一基材层13、上导电层14、支撑隔离层15、下导电层16和第二基材层17,上导电层14被划分为多个导电单元141,任意两个导电单元141之间不导电,布线层12中设有多个导线121,第一基材层13开有多个导通孔131,导线121和导通孔131分别与导电单元141一一对应设置,导线121沿导通孔131与导电单元141电连接;Referring to Figures 1-2, the present embodiment is a pressure injury detection tool for a circuit board, including a main body area 1, and the main body area 1 includes a protective film layer 11, a wiring layer 12, a first The base material layer 13 , the upper conductive layer 14 , the support isolation layer 15 , the lower conductive layer 16 and the second base material layer 17 , the upper conductive layer 14 is divided into a plurality of conductive units 141 , and there is no conduction between any two conductive units 141 , the wiring layer 12 is provided with a plurality of wires 121, the first substrate layer 13 is provided with a plurality of via holes 131, the wires 121 and the via holes 131 are respectively arranged in a one-to-one correspondence with the conductive units 141, and the wires 121 are arranged along the via holes 131 is electrically connected to the conductive unit 141;

主体区1的一侧设有观察区2,观察区2安装有电源3和多个指示灯4,指示灯4与导线121电连接,且一一对应设置,电源3分别与多个指示灯4电连接,电源3还和下导电层16电连接。导电单元141与导线121、指示灯4都是一对一设置的,便于通过指示灯4迅速查找出哪个导电单元141对应的电路板区域出现压伤。One side of the main body area 1 is provided with an observation area 2, the observation area 2 is equipped with a power supply 3 and a plurality of indicator lights 4, the indicator lights 4 are electrically connected with the wires 121, and are arranged in one-to-one correspondence, and the power supply 3 is respectively connected with a plurality of indicator lights 4. Electrically connected, the power supply 3 is also electrically connected to the lower conductive layer 16 . The conductive units 141 are arranged one-to-one with the wires 121 and the indicator lights 4 , so that it is convenient to quickly find out which area of the circuit board corresponding to the conductive units 141 has a pressure injury through the indicator lights 4 .

支撑隔离层15设有压敏胶151和多个陶瓷微珠152,多个陶瓷微珠152嵌入在压敏胶151中。压敏胶151对压力有灵敏的反应,陶瓷微珠152有弹力,能隔开上导电层14和下导电层16,且陶瓷微珠152自润性和流动性好,便于上导电层14和下导电层16对局部过大压力能迅速做出反应。通过设置压敏胶151和陶瓷微珠152,压紧时,如有压伤,当局部压力过大时,上导电层14和下导电层16能紧密接触从而导电,该设计可以迅速查出电路板哪个区域出现压伤。而卸掉压力后,在陶瓷微珠152的弹力下,上导电层14和下导电层16分离恢复原状,又能继续检测电路板的压伤情况。The support isolation layer 15 is provided with a pressure-sensitive adhesive 151 and a plurality of ceramic microbeads 152 , and the plurality of ceramic microbeads 152 are embedded in the pressure-sensitive adhesive 151 . The pressure-sensitive adhesive 151 has a sensitive response to pressure, the ceramic microbeads 152 have elasticity, and can separate the upper conductive layer 14 and the lower conductive layer 16, and the ceramic microbeads 152 have good self-wetting and fluidity, which is convenient for the upper conductive layer 14 and the lower conductive layer 16. The lower conductive layer 16 can respond quickly to localized excessive pressure. By arranging the pressure-sensitive adhesive 151 and the ceramic micro-beads 152, when pressing, if there is a pressure injury, when the local pressure is too large, the upper conductive layer 14 and the lower conductive layer 16 can be in close contact to conduct electricity. This design can quickly detect the circuit. Which area of the plate has the pressure injury. After the pressure is released, under the elastic force of the ceramic microbeads 152, the upper conductive layer 14 and the lower conductive layer 16 are separated and restored to the original state, and the pressure injury of the circuit board can be continuously detected.

导线121的两侧设有支撑物122,支撑物122为填充胶。通过设置填充胶,能使布线层12变得平整,避免影响检测压力工具的使用。Two sides of the wire 121 are provided with supports 122, and the supports 122 are filled with glue. By setting the filling glue, the wiring layer 12 can be made flat, so as to avoid affecting the use of the detection pressure tool.

上导电层14和下导电层16的厚度均为15-21um。通过设置薄的上导电层14和下导电层16,使之容易对局部过大压力做出反应,便于检测出电路板的压伤区域。The thicknesses of the upper conductive layer 14 and the lower conductive layer 16 are both 15-21um. By setting the thin upper conductive layer 14 and the lower conductive layer 16, it is easy to respond to local excessive pressure, and it is convenient to detect the pressure-wound area of the circuit board.

陶瓷微珠152的直径为10-20um。保证了即不影响上导电层14和下导电层16在局部过大压力的影响下紧密接触,也不影响卸掉压力后上导电层14和下导电层16在陶瓷微珠152的弹力下分离而恢复到原状。The diameter of the ceramic microbeads 152 is 10-20um. It is ensured that the upper conductive layer 14 and the lower conductive layer 16 are not in close contact under the influence of local excessive pressure, and the separation of the upper conductive layer 14 and the lower conductive layer 16 under the elastic force of the ceramic microbeads 152 is not affected after the pressure is released. and restored to its original state.

保护膜层11的厚度为20-30um。通过设置薄的保护膜层11容易对压力做出反应,便于检测出电路板的压伤区域。The thickness of the protective film layer 11 is 20-30um. By providing a thin protective film layer 11, it is easy to respond to pressure, and it is convenient to detect the pressure-wound area of the circuit board.

上导电层14和下导电层16均由铜制成。铜的导电性好,不易被腐蚀,硬度不高,容易对压力做出反应。Both the upper conductive layer 14 and the lower conductive layer 16 are made of copper. Copper has good electrical conductivity, is not easily corroded, has low hardness, and is easy to respond to pressure.

保护膜层11由PI膜制成。The protective film layer 11 is made of a PI film.

基材层的材质为FR-4。The material of the base material layer is FR-4.

本发明提供的用于电路板的检测压伤工具的工作步骤如下:The working steps of the tool for detecting pressure injury on a circuit board provided by the present invention are as follows:

(1)当抽检的电路板全部完成测试后,暂停电路板测试,将测试好的电路板套在下夹具的PIN上;(1) When all the circuit boards that have been sampled have been tested, suspend the circuit board test, and put the tested circuit board on the PIN of the lower fixture;

(2)将检测压伤工具的电源3通电,在使用之前,用笔尖或测试针尖按压任意区域模拟压伤情况测试其能否准确测出压伤,如果不能,则检查和修复好检测压伤工具使其能准确检测出压伤。(2) Power on the power supply 3 of the pressure injury detection tool. Before use, press any area with the tip of a pen or a test needle to simulate the pressure injury to test whether it can accurately measure the pressure injury. If not, check and repair the pressure injury. Tools allow it to accurately detect crush injuries.

(3)将检测压伤工具平整放入电路板测试区域内;(3) Flatten the detection tool for crush injury into the circuit board test area;

(4)操作测试机,压床下降,压床上的夹具压紧检测压伤工具;(4) Operate the testing machine, the press is lowered, and the fixture on the press is pressed to detect the crushing tool;

(5)如果电路板有压伤,则相应的指示灯4亮:(5) If the circuit board is crushed, the corresponding indicator light 4 is on:

(6)如果指示灯4不亮,则松开压床,稍微移动一下检测压伤工具,再次复测;导电单元之间有一个小小的缝隙,以保证导电单元之间不导电。稍微移动检测压伤工具,进行复测,能避免电路板压伤区域刚好对应导电单元之间的缝隙处而出现检测不到。(6) If the indicator light 4 does not light up, release the press, move the tool to detect the pressure injury a little, and repeat the test again; there is a small gap between the conductive units to ensure that the conductive units are not conductive. Slightly move the detection tool for crushing and perform re-testing, which can avoid the failure of detection due to the fact that the crushed area of the circuit board just corresponds to the gap between the conductive units.

(7)复测过后若指示灯4不亮,则表示电路板无压伤;(7) If the indicator light 4 does not light up after the retest, it means that the circuit board is not crushed;

(8)按上述步骤检测其它测试好的电路板。(8) Test other tested circuit boards according to the above steps.

检测压伤工具的工作原理为:将检测压伤工具放入电路板测试区域,压紧检测压伤工具,如果电路板有压伤则会导致局部压力过大,相对应的导电单元141与下导电层16被压紧接触从而导通,而该导电单元141相对应的指示灯4会点亮;反之电路板无压伤,整体压力平衡,上导电层14与下导电层16因被陶瓷微珠152隔离开,不导通,指示灯4不亮。The working principle of the pressure injury detection tool is as follows: put the pressure detection tool into the test area of the circuit board, and press the pressure detection tool. The conductive layer 16 is pressed and contacted to conduct, and the indicator light 4 corresponding to the conductive unit 141 will light up; otherwise, the circuit board has no pressure damage, and the overall pressure is balanced. The upper conductive layer 14 and the lower conductive layer 16 The beads 152 are isolated, not conducting, and the indicator light 4 is not on.

本发明相对于人工检测,通过检测压伤工具能迅速地检测出电路板是否有压伤,有压伤则指示灯4亮,无压伤则指示灯4不亮,该检测方式即准确且高效,电路板有压伤时,相对应的导电单元141上连接的指示灯4亮,该设计能够准确的反应出压伤区域,便于作业员准确查找压伤点,检测的精度高。其次可以反复使用,当上导电层14下导电层16紧密接触在一起时,只需卸掉压力,上导电层14和下导电层16即可在陶瓷微珠152的弹力作用下分离开,达到重复检测的目的。Compared with manual detection, the present invention can quickly detect whether there is a pressure injury on the circuit board through the detection tool for pressure injury. If there is a pressure injury, the indicator light 4 will be on, and if there is no pressure injury, the indicator light 4 will not be on. The detection method is accurate and efficient. , When the circuit board is crushed, the indicator light 4 connected to the corresponding conductive unit 141 is on. This design can accurately reflect the crushed area, which is convenient for the operator to accurately find the crushed point, and the detection accuracy is high. Secondly, it can be used repeatedly. When the upper conductive layer 14 and the lower conductive layer 16 are in close contact with each other, the upper conductive layer 14 and the lower conductive layer 16 can be separated under the elastic force of the ceramic microbeads 152 simply by removing the pressure, so as to achieve Purpose of repeat testing.

以上所述仅为本发明的较佳实施例而已,并不用以限制本发明,凡在本发明的精神和原则之内所作的任何修改、等同替换和改进等,均应包含在本发明的保护范围之内。The above descriptions are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements and improvements made within the spirit and principles of the present invention shall be included in the protection of the present invention. within the range.

Claims (10)

1. The tool for detecting the crush injury of the circuit board is characterized by comprising a main body area, wherein the main body area comprises a protective film layer, a wiring layer, a first base material layer, an upper conducting layer, a supporting isolation layer, a lower conducting layer and a second base material layer which are sequentially laminated from top to bottom, the upper conducting layer is divided into a plurality of conducting units, any two conducting units are not conducting, a plurality of conducting wires are arranged in the wiring layer, a plurality of via holes are formed in the first base material layer, the conducting wires and the via holes are respectively arranged in one-to-one correspondence with the conducting units, and the conducting wires are electrically connected with the conducting units along the via holes;
one side in main part district is equipped with the observation district, power and a plurality of pilot lamp are installed to the observation district, and the pilot lamp is connected with the wire electricity, and the one-to-one setting, the power is connected with a plurality of pilot lamp electricity respectively, the power still with down the conducting layer electricity be connected.
2. The tool for detecting crush damage of a circuit board as claimed in claim 1, wherein the support spacer layer is provided with a pressure sensitive adhesive and a plurality of ceramic micro beads embedded in the pressure sensitive adhesive.
3. The tool of claim 2, wherein the wire is supported on both sides of the wire.
4. The tool of claim 3, wherein the upper and lower conductive layers are each 15-21um thick.
5. The tool for detecting crush damage of circuit board according to claim 4, wherein the ceramic micro beads have a diameter of 10-20 um.
6. The tool of claim 5, wherein the thickness of the protective film layer is 20-30 um.
7. The tool of claim 6, wherein the upper and lower conductive layers are each made of copper.
8. The tool of claim 7, wherein the protective film is made of PI film.
9. The tool of claim 8, wherein the support is an underfill.
10. The tool of claim 9, wherein the substrate layer is made of FR-4.
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