CN110854668A - Packaging jig and packaging method for laser bars - Google Patents

Abstract

The invention provides a packaging jig and a packaging method for a laser bar. The jig body is provided with two opposite mounting surfaces, the avoiding part is arranged on one mounting surface, the other mounting surface is suitable for placing the bar to be packaged, the light emergent cavity surface of the bar to be packaged is partially abutted against the avoiding part, and at least part of the light emergent area on the light emergent cavity surface is exposed. The light-emitting cavity surface of the bar is not in complete contact with the avoiding part, namely the partial surface contact, the line contact or the multipoint contact of the light-emitting cavity surface is realized, the pollution and damage probability of the light-emitting cavity surface are effectively reduced by reducing the contact area, and the packaging yield is improved.

Description

A packaging jig and packaging method for a laser bar

technical field

The invention belongs to the technical field of semiconductor lasers, and particularly relates to a packaging jig and a packaging method for a laser bar.

Background technique

With the development of semiconductor laser technology, edge-emitting high-power epitaxy and chip technology has become quite mature, and the degree of industrialization is also quite high. However, the development of the packaging technology of the corresponding high-power chips has been relatively lagging behind, and the degree of industrialization is relatively low. Different from epitaxy and chip technology, packaging needs to perform multiple operations on each laser bar (ie chip), which can easily cause various defects of the bar, and the yield is low. Highest.

The light-exiting cavity surface of the laser bar is equipped with a complex multi-layer optical film. The quality of the optical film determines the performance of the entire laser. Contamination and damage will directly lead to the failure of the entire laser.

The heat sink welding package is a basic packaging form of the laser bar. During the packaging process, in order to ensure a good heat dissipation effect, it is necessary to ensure that the heating surface of the laser bar is completely attached to the heat sink. At the same time, the collimation of the semiconductor laser is relatively poor, and the laser has a certain divergence angle after exiting from the cavity surface. In order to avoid the blocking of the laser light by the heat sink, the cavity surface must be flush with the front surface of the heat sink, or slightly beyond the front surface of the heat sink.

Chinese patent document CN 208336807 U discloses a high-power micro-channel structure bar laser sintering fixture, including a positioning base, a heat sink pressing block and a bar pressing block, the positioning base includes a first surface and a second surface, the first surface and The second surface is provided with a slope facing the inside of the positioning base, and the slope of the first surface and the slope of the second surface are perpendicular to each other, the heat sink is placed on the first surface, and the heat sink is pressed by the heat sink pressing block. , the heating surface of the bar is close to the solder layer of the heat sink, adjust the bar in the middle of the heat sink, the light-emitting cavity surface of the bar is in close contact with the surface of the width limit groove of the bar, and the bar is placed on the The second surface is applied to the bar by gravity to realize the positioning of the bar.

The close contact between the surface of the light-emitting cavity of the bar and the surface of the width limit groove of the bar can easily lead to pollution and damage to the surface of the light-emitting cavity of the bar. As a result, the temperature of the surface of the optical cavity rises, and the bars are burned, resulting in the failure of the laser.

SUMMARY OF THE INVENTION

Therefore, the technical problem to be solved by the present invention is that the existing packaging jig easily causes pollution and damage to the surface of the light exit cavity of the bar, which affects the yield and reliability of the bar packaging.

To this end, the present invention provides a packaging jig for a laser bar, comprising:

The fixture body has two opposite mounting surfaces;

an escape part, arranged on one of the installation surfaces;

The other mounting surface is suitable for placing the bar to be packaged; the light-exit cavity surface of the to-be-packaged bar partially abuts on the avoidance part; and the light-exit area on the light-exit cavity surface is at least partially exposed.

Preferably, the packaging jig of the above-mentioned laser bar,

The avoidance part has a avoidance surface;

The edge of the end where the light exit cavity surface of the bar is located is suitable for abutting on the avoidance surface.

Preferably, in the packaging fixture of the laser bar, the avoidance surface is an avoidance plane; the avoidance plane and the light exit cavity surface are arranged at an acute angle.

Preferably, in the packaging jig for the laser bar, the avoidance portion is an avoidance groove and is opened on one of the mounting surfaces; the inner surface of the avoidance groove is an avoidance plane.

Preferably, in the packaging jig of the laser bar, the two mounting surfaces are both flat; and the mounting surfaces are arranged in a V-shape; the groove bottom plane of the avoidance groove is parallel to the same side of the mounting surface. Mounting surface.

Preferably, the packaging jig for the laser bar further includes an alignment sheet;

the alignment piece is arranged on the mounting surface on the side opposite to the bar;

The escape groove is opened on the alignment piece.

Preferably, in the packaging jig for the laser bar, the alignment sheet is a silicon wafer, a quartz glass sheet or a sapphire sheet.

The present invention provides a method for packaging a laser bar, using the above-mentioned packaging jig for the laser bar; comprising:

S1: place the heat sink with the solder layer I side up on one of the mounting surfaces of the package jig, so that its lower end abuts on the other opposite mounting surface;

S2: Place the bar on the solder layer I, and the end where the light-emitting cavity surface is located partially abuts on the avoidance part of the other mounting surface;

S3: Place a bar pressing block above the bar to make the bar fit with the heat sink;

S4: Put the assembled heat sink, bar and bar compact together with the jig into a reflow oven as a whole for reflow soldering.

Preferably, the packaging method of the above-mentioned laser bar,

Between steps S2 and S3, it also includes

S20: Place the insulating sheet with metal layers on the upper and lower surfaces respectively on the heat sink on the same side as the bar;

S21: Cover the side of the negative electrode sheet with the solder layer II on the bar and the insulating sheet at the same time;

S22: Place the pressure plate on the negative electrode sheet, so that the negative electrode sheet, the insulating sheet and the heat sink are bonded together;

The corresponding S3 step becomes: place a bar pressing block on the negative electrode sheet above the bar to make the negative electrode sheet, bar and heat sink fit together;

The corresponding S4 step becomes: put the assembled heat sink, bar, insulating sheet, negative electrode sheet, bar pressing block and pressing plate together with the fixture into the reflow furnace as a whole for reflow soldering.

Preferably, in the packaging method of the laser bar, the pressing plate in step S22 is an L-shaped plate; the L-shaped vertical part of the pressing plate is pressed against the upper surface of the negative electrode sheet, so that the negative electrode sheet, the insulating sheet and the heat The L-shaped horizontal part of the pressing plate is hung on the upper end of the heat sink, the insulating sheet and the negative electrode sheet, so as to prevent the pressing plate from sliding down toward the bar.

The technical scheme of the present invention has the following advantages:

1. A packaging jig for a laser bar provided by the present invention includes a jig body and an escape portion. The fixture body has two opposite mounting surfaces, the avoidance part is arranged on one mounting surface, and the other mounting surface is suitable for placing the bar to be packaged, and the light exit cavity surface of the bar to be packaged is partially exposed and suitable for local Abut on the avoidance part. There is incomplete contact between the light-emitting cavity surface of the bar and the avoidance part, that is, the partial surface contact of the light-emitting cavity surface, or the line contact, or the multi-point contact. By reducing the contact area, the pollution and pollution of the light-emitting cavity surface are effectively reduced. The probability of damage is increased, and the yield of the package is improved.

2. A packaging fixture for a laser bar provided by the present invention has an avoidance plane on the avoidance portion, and the edge of one end of the light-emitting cavity surface of the bar abuts on the avoidance plane, and the light-emitting cavity surface and the avoidance plane are arranged at an acute angle. , only the edge of the cavity surface is in contact with the avoidance plane line, so that the cavity surface is basically completely exposed during the packaging process, which further reduces the contact between the cavity surface and the surface of the fixture, avoids pollution and damage to the cavity surface, and improves the packaging efficiency. Yield and bar reliability.

3. The packaging jig for laser bars provided by the present invention is also provided with an alignment piece, the alignment piece is fixed on one side of the mounting surface of the packaging fixture, and the avoidance groove is opened on the alignment piece, which is more convenient for processing and is conducive to the The alignment sheet is removed from the inspection and avoidance groove; the alignment sheet is made of silicon wafer, quartz glass sheet or sapphire sheet.

Description of drawings

In order to illustrate the specific embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the specific embodiments or the prior art. Obviously, the accompanying drawings in the following description The drawings are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can also be obtained based on these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a packaging jig for a laser bar according to the present invention;

Fig. 2 is the partial enlarged structural schematic diagram in Fig. 1;

3 is a schematic structural diagram of a bar package in the present invention;

FIG. 4 is a schematic structural diagram of the light-exiting cavity surface of the bar according to the present invention.

Description of reference numbers:

1- Fixture body; 2- Alignment piece; 20- Avoidance groove; 3- Heat sink; 30- Solder layer I; 31- Side wall surface A; 32- Side wall surface B; 33- Side wall surface C; 4- Bar; 40-light-emitting cavity surface; 400-light-emitting area; 5-insulating sheet; 6-negative electrode sheet; 60-solder layer II; 7-pressing plate; 8-bar pressing block; 9-counterweight.

Detailed ways

The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the indicated device or element must have a specific orientation or a specific orientation. construction and operation, and therefore should not be construed as limiting the invention. Furthermore, the terms "first", "second", and "third" are used for descriptive purposes only and should not be construed to indicate or imply relative importance.

In the description of the present invention, it should be noted that the terms "installed", "connected" and "connected" should be understood in a broad sense, unless otherwise expressly specified and limited, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be internal communication between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

Example 1

This embodiment provides a packaging jig for a laser bar, as shown in FIG. 1 , including a jig body 1 , an alignment piece 2 and an escape portion. In this embodiment, the material of the fixture body 1 is made of aluminum, copper or stainless steel with surface passivation treatment, and the fixture body 1 has two opposite mounting surfaces. In this embodiment, the two mounting surfaces are flat. A V-shaped arrangement is formed between the two mounting surfaces, an acute angle is formed between any mounting surface and the horizontal plane, and the included angle of the V-shaped is also an acute angle. In this embodiment, both the heat sink 3 and the alignment sheet 2 have the same cuboid structure as the overall structure of the bar 4. The alignment sheet 2 can be made of silicon wafer, quartz glass sheet or sapphire sheet. In this embodiment, the alignment sheet 2 using silicon wafers.

As shown in Figure 1, the alignment piece 2 is closely attached to the left mounting surface of the fixture body 1, and is located at the bottom of the mounting surface, and an angle α is formed between the alignment piece 2 and the opposite right mounting surface. In the embodiment, the angle α is 45°˜85°. The wall surface of the alignment sheet 2 facing the opposite right mounting surface is provided with an escape portion, and the light exit cavity surface 40 of the bar 4 partially abuts on the escape portion. As shown in FIG. 4 , the light exit cavity surface 40 of the bar 4 is close to the The positive surface has a light-emitting area 400, and the avoidance part can completely or partially avoid the light-emitting area 400, the avoidance part has a certain supporting force on the light-emitting cavity surface 40 of the bar 4, and the avoidance part has an avoidance surface. In this embodiment, The avoidance surface is an avoidance plane, and the avoidance part is an avoidance groove 20 with an indented cross-section. The avoidance groove 20 is formed on the alignment sheet 2 by wet etching or plasma dry etching, and the inner surface of the avoidance groove 20 is used as the avoidance plane. The avoidance plane is polished, and the surface flatness is very high.

As shown in FIG. 1 , the opposite side wall surfaces A31 and B32 of the heat sink 3 are parallel to each other, the thickness of the heat sink 3, that is, the conventional distance d1 between the side wall surface A31 and the side wall surface B32 is 1-3 mm, and the side wall surface A31 is close The heat sink 3 is located at the bottom of the mounting surface, and the side wall surface C33 adjacent to the side wall surface A31 and the side wall surface B32 is abutted against the lower part of the escape groove 20. On the groove edge, in this embodiment, as shown in FIG. 2 , the side wall surface C33 partially protrudes into the inner cavity of the escape groove 20 , and the protruding end is spaced a certain distance from the inner surface of the escape groove 20 .

The solder layer I30 is evenly arranged on the side wall surface B32 of the heat sink 3. The conventional thickness d2 of the solder layer I30 is 3-10 μm. , the opposite to the P surface on the bar 4 is the negative surface, also known as the N surface, the distance between the P surface and the N surface, that is, the thickness d3 of the bar 4 is 50 ~ 200μm, the thickness is a conventional thickness, it can also be Other thicknesses are determined according to specific needs. As shown in Figure 2, the bar 4 slides down by its own gravity and one end protrudes from the bottom of the side wall surface B32 where the solder layer I30 is located, that is, the light exit cavity surface 40 exceeds the side wall surface C33 by a certain distance, In this embodiment, the optimal length of the distance d4 is 5-20 μm. Of course, when the side wall surface C33 protrudes into the cavity of the avoidance groove 20 for a certain length, the length of d4 can be less than 5 μm. When the length of d4 is zero, light is emitted at this time. The cavity surface 40 and the side wall surface C33 are located on the same plane, and the light exit cavity surface 40 extends a certain distance to avoid the problem of blocking the light exit cavity surface 40 caused by the solder climbing to the light exit cavity surface 40 when the bar 4 is put into the furnace for reflow. At the same time, it also avoids the problem of shielding the laser device due to electromigration of the solder climbing to the light-exiting cavity surface 40 during long-term operation, which greatly improves the packaging yield and product reliability. The lower edge of the light exit cavity surface 40 is suspended in the inner cavity of the avoidance groove 20, and the upper edge abuts on the groove bottom plane of the avoidance groove 20. The light exit cavity surface 40 is in line contact with the groove bottom plane, and an acute angle is formed between the two planes, reducing the The contact between the light-exiting cavity surface 40 and the alignment sheet 2 is prevented, pollution and damage of the light-exiting cavity surface 40 are avoided, and the packaging yield and the reliability of the bar 4 are improved.

As shown in Figure 2, in this embodiment, the width L2 of the avoidance groove 20, the distance L1 between the groove wall below the avoidance groove 20 and a side wall surface of the adjacent alignment sheet 2, and the depth L3 of the avoidance groove 20 satisfy the formula:

L1<d1/sinα;

L2>(d1+d2+d3)/sinα-L1;

L3=(d1+d2+d3-L1Sinα-d4Cotα)Cosα+d4/Sinα.

As the first alternative embodiment of Example 1, the two mounting surfaces of the fixture body 1 may not be flat, as long as the side wall surface A31 of the heat sink 3 can be fixed on the corresponding mounting surface, and the heat sink 3 When placed on the mounting surface, the included angle formed by the plane where the side wall surface B32 is located and the avoidance plane of the avoidance portion may be an acute angle.

As a second alternative implementation of Example 1, the avoidance groove 20 may not be provided, and the surface of the alignment sheet 2 is used as the avoidance plane. 40 and the surface of the alignment sheet 2 are arranged at an acute angle; further, the alignment sheet 2 may not be provided, the fixture body 1 is made of silicon or quartz glass, etc., and the avoidance plane is directly arranged on one side of the fixture body 1. Mounting surface .

As a third alternative implementation of Embodiment 1, the avoidance surface may be a avoidance curved surface, as long as it has a local support force for the light exit cavity surface and can completely or partially avoid the light exit area.

Example 2

This embodiment provides a packaging jig for laser bars. Compared with the structure of the packaging jig for laser bars provided in Embodiment 1, the difference is that the avoidance part is one of the mounting surfaces of the packaging jig or the alignment piece 2 At least two protrusions on the surface of the light-emitting cavity, the apex of the protrusions is in point contact with the light-exiting cavity surface 40 and abuts on the light-exiting cavity surface 40, and supports at least two points on the light-exiting cavity surface 40, and the protruding parts that play a supporting role The plane where the vertex is located is parallel to the light exit cavity surface 40 , and the remaining surfaces of the light exit cavity surface 40 are exposed.

Example 3

This embodiment provides a packaging method for a laser bar, using the packaging jig for the laser bar provided in Embodiment 1 or Embodiment 2, and the packaging steps are:

S1: Place the heat sink 3 with the solder layer I30 side up on one of the mounting surfaces of the package jig, so that its lower end abuts on the other opposite mounting surface;

S2: Place the bar 4 on the solder layer I30, and one end of the light exit cavity surface 40 partially abuts on the avoidance part of the other mounting surface;

S20: place the insulating sheet 5 with the metal layer on the upper and lower surfaces respectively on the heat sink 3 on the same side as the bar 4;

S21: Cover the side of the negative electrode sheet 6 with the solder layer II 60 on the bar 4 and the insulating sheet 5 at the same time;

S22: Place the pressing plate 7 on the negative electrode sheet 6, so that the negative electrode sheet 6, the insulating sheet 5 and the heat sink 3 are closely attached.

S3: Place the bar pressing block 8 on the negative electrode sheet 6 above the bar bar 4, so that the negative electrode sheet 6, the bar bar 4 and the heat sink 3 are closely attached;

S4: Put the assembled heat sink 3, bar 4, insulating sheet 5, negative electrode 6, bar pressing block 8 and pressing plate 7 together with the fixture into the reflow furnace as a whole for reflow soldering.

When using the packaging fixture in Embodiment 1, the corresponding step S2 is: placing the bar 4 on the solder layer I30, and the upper edge of one end of the light exit cavity surface 40 abuts on the groove bottom plane of the avoidance groove 20;

When the packaging jig in Embodiment 2 is used, the corresponding step S2 is: placing the bar 4 on the solder layer I30, and a partial surface of the light-exiting cavity surface 40 abuts on the upper top surface of the boss;

When the packaging fixture in Embodiment 3 is used, the corresponding step S2 is: placing the bar 4 on the solder layer I30, and the light exit cavity surface 40 abuts on the apex of the protrusion;

As shown in FIG. 3 , in this embodiment, the pressing plate 7 is an L-shaped plate, and the L-shaped vertical part of the pressing plate 7 is pressed against the upper surface of the negative electrode sheet 6 , so that the negative electrode sheet 6 , the insulating sheet 5 and the heat sink 3 are Closely fit; the L-shaped horizontal part of the pressing plate 7 is hung on the upper end surfaces of the heat sink 3 , the insulating sheet 5 and the negative electrode sheet 6 to prevent the pressing plate 7 from sliding down towards the bar 4 .

In this embodiment, the negative electrode plate 6 is usually made of copper foil gold-plated material, with a thickness of 0.05-0.2 mm; the bar pressure block 8 and the pressure plate 7 can be made of glass, ceramic, sapphire, metal and other materials, depending on specific needs.

In the above steps, the bar pressing block 8 can also be provided with a counterweight 9, and the counterweight 9 is against the mounting surface of the packaging fixture on the same side as the avoidance portion, and the front end of the counterweight 9 is provided with a rib, and the top of the rib is pressed against The middle position of the bar pressing block 8 makes the bar 4 more firmly fixed.

As the first alternative implementation of Example 4, when the avoidance portion is arranged on the alignment sheet 2, a step S0 needs to be added before step S1: place the avoidance portion of the alignment sheet 2 on one of the packaging jigs toward the outside. The corresponding step S1 is: placing the heat sink 3 with the solder layer I30 side up on the other mounting surface of the package jig so that its lower end abuts on the alignment sheet 2 .

Obviously, the above-mentioned embodiments are only examples for clear description, and are not intended to limit the implementation manner. For those of ordinary skill in the art, changes or modifications in other different forms can also be made on the basis of the above description. There is no need and cannot be exhaustive of all implementations here. And the obvious changes or changes derived from this are still within the protection scope of the present invention.

Claims (10)

1. The utility model provides a packaging jig of laser bar which characterized in that includes:

the jig comprises a jig body (1) with two opposite mounting surfaces;

an avoidance portion provided on one of the mounting surfaces;

the other mounting surface is suitable for placing a bar (4) to be packaged; the light emergent cavity surface (40) of the bar (4) to be packaged is partially abutted against the avoiding part; and the light outlet area (400) on the light outlet cavity surface (40) is at least partially exposed.

2. The packaging fixture of laser bar according to claim 1,

the avoidance part is provided with an avoidance surface;

the edge of one end, where the light-emitting cavity surface (40) of the bar (4) is located, is suitable for abutting against the avoidance surface.

3. The packaging jig for the laser bars according to claim 2, wherein the avoiding surface is an avoiding plane; the avoiding plane and the light emergent cavity surface (40) are arranged in an acute angle.

4. The packaging jig for the laser bars as claimed in claim 3, wherein the avoiding portion is an avoiding groove (20) provided on one of the mounting surfaces; the inner surface of the avoidance groove (20) is an avoidance plane.

5. The packaging jig for the laser bar according to claim 4, wherein both of the two mounting surfaces are flat; the installation surfaces are arranged in a V shape; the groove bottom plane of the avoidance groove (20) is parallel to the mounting surface on the same side.

6. The packaging jig for the laser bars as claimed in claim 4 or 5, further comprising an alignment sheet (2);

the aligning sheet (2) is arranged on the mounting surface on the side opposite to the bar (4);

the avoidance groove (20) is formed in the alignment sheet (2).

7. The packaging jig for the laser bars as claimed in claim 6, wherein the alignment sheet (2) is a silicon wafer, a quartz glass sheet or a sapphire sheet.

8. A method for packaging a laser bar, characterized in that a packaging jig for a laser bar according to any one of claims 1 to 7 is used; comprises that

S1: placing the side, provided with the solder layer I (30), of the heat sink (3) upwards on one mounting surface of the packaging jig, and enabling the lower end of the heat sink to abut against the other opposite mounting surface;

s2: the bar (4) is placed on the solder layer I (30), and one end of the light emergent cavity surface (40) is locally abutted against the avoiding part of the other mounting surface;

s3: a batten pressing block (8) is arranged above the batten (4) to ensure that the batten (4) is attached to the heat sink (3);

s4: and putting the assembled heat sink (3), the bar (4) and the bar pressing block (8) together with the packaging jig into a reflow furnace for reflow soldering.

9. The method for packaging a laser bar as claimed in claim 8, further comprising steps S2 and S3

S20: placing an insulating sheet (5) with metal layers on the upper and lower surfaces on the heat sink (3) at the same side as the bar (4);

s21: covering the side of the negative electrode sheet (6) with the solder layer II (60) on the bar (4) and the insulation sheet (5) at the same time;

s22: placing the pressing plate (7) on the negative plate (6) to ensure that the negative plate (6), the insulating sheet (5) and the heat sink (3) are jointed;

the corresponding step S3 becomes: a bar pressing block (8) is arranged on the negative pole piece (6) above the bar (4) to ensure that the negative pole piece (6), the bar (4) and the heat sink (3) are jointed;

the corresponding step S4 becomes: and putting the assembled heat sink (3), the bar (4), the insulating sheet (5), the negative plate (6), the bar pressing block (8) and the pressing plate (7) together with the packaging jig into a reflow furnace for reflow soldering.

10. The packaging method of the laser bar according to claim 9, wherein the pressing plate (7) in the step S22 is an L-shaped plate; the L-shaped vertical part of the pressing plate (7) is buckled and pressed on the upper surface of the negative plate (6) to ensure that the negative plate (6), the insulating plate (5) and the heat sink (3) are attached; the L-shaped horizontal part of the pressing plate (7) is hung on the upper end surfaces of the heat sink (3), the insulating sheet (5) and the negative plate (6), so that the pressing plate (7) is prevented from sliding towards the bar (4).

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