CN110923797A - Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning - Google Patents
Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning Download PDFInfo
- Publication number
- CN110923797A CN110923797A CN201911087693.1A CN201911087693A CN110923797A CN 110923797 A CN110923797 A CN 110923797A CN 201911087693 A CN201911087693 A CN 201911087693A CN 110923797 A CN110923797 A CN 110923797A
- Authority
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- China
- Prior art keywords
- cleaning
- ceramic substrate
- electrolytic
- electroplating
- percent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004140 cleaning Methods 0.000 title claims abstract description 45
- 238000009713 electroplating Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 title claims abstract description 15
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 239000000919 ceramic Substances 0.000 claims abstract description 27
- 230000002378 acidificating effect Effects 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000007788 liquid Substances 0.000 claims abstract description 14
- 238000005238 degreasing Methods 0.000 claims abstract description 11
- 238000007598 dipping method Methods 0.000 claims abstract description 4
- 229910001220 stainless steel Inorganic materials 0.000 claims abstract description 4
- 239000010935 stainless steel Substances 0.000 claims abstract description 4
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 18
- 238000003756 stirring Methods 0.000 claims description 12
- 239000008367 deionised water Substances 0.000 claims description 9
- 229910021641 deionized water Inorganic materials 0.000 claims description 9
- AEQDJSLRWYMAQI-UHFFFAOYSA-N 2,3,9,10-tetramethoxy-6,8,13,13a-tetrahydro-5H-isoquinolino[2,1-b]isoquinoline Chemical compound C1CN2CC(C(=C(OC)C=C3)OC)=C3CC2C2=C1C=C(OC)C(OC)=C2 AEQDJSLRWYMAQI-UHFFFAOYSA-N 0.000 claims description 6
- 239000002131 composite material Substances 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 6
- 239000001509 sodium citrate Substances 0.000 claims description 6
- NLJMYIDDQXHKNR-UHFFFAOYSA-K sodium citrate Chemical compound O.O.[Na+].[Na+].[Na+].[O-]C(=O)CC(O)(CC([O-])=O)C([O-])=O NLJMYIDDQXHKNR-UHFFFAOYSA-K 0.000 claims description 6
- 239000000176 sodium gluconate Substances 0.000 claims description 6
- 229940005574 sodium gluconate Drugs 0.000 claims description 6
- 235000012207 sodium gluconate Nutrition 0.000 claims description 6
- 239000004094 surface-active agent Substances 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 238000007654 immersion Methods 0.000 claims description 3
- 239000012530 fluid Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- SWPMTVXRLXPNDP-UHFFFAOYSA-N 4-hydroxy-2,6,6-trimethylcyclohexene-1-carbaldehyde Chemical compound CC1=C(C=O)C(C)(C)CC(O)C1 SWPMTVXRLXPNDP-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005429 filling process Methods 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F1/00—Electrolytic cleaning, degreasing, pickling or descaling
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The invention discloses a process for improving the uniformity of DPC electroplating filling hole by electrolytic cleaning, which comprises placing the developed ceramic substrate into acidic electrolytic degreasing liquid heated to 40-60 deg.C, electrolytic cleaning for 3-5min with the ceramic substrate as cathode and stainless steel plate as anode, and current density of 5-10A/m2And then quickly taking out the product to be washed clean by water, then entering a pre-dipping cylinder, and finally directly electroplating. The electrolytic degreasing liquid in the invention is acidic, can not attack and destroy dry films, and is suitable for cleaning fine circuitsAnd (4) a hole.
Description
Technical Field
The invention relates to the technology of the field of ceramic substrate manufacturing, in particular to a process for improving the uniformity of DPC electroplating hole filling by utilizing electrolytic cleaning and cleaning.
Background
The DPC is also called as a direct copper-plated substrate, the ceramic substrate is drilled, scribed and the like by laser, the ceramic substrate is plated with copper by a vacuum coating mode after being cleaned, then the circuit manufacturing is finished by yellow lithography or laser development, the thickness of the circuit is increased by an electroplating/chemical plating deposition mode, and finally the manufacturing of a metallized circuit is finished. Compared with the traditional LTCC, HTCC, DBC and other thick film processes, the DPC has the advantages of higher heat conductivity, no deformation of materials, stable process, controllable thickness of a metal layer and high line resolution.
In the manufacturing process of the DPC, oxidation layers and oil stains which are not cleaned completely after development exist in small holes of the ceramic substrate, and the substances cannot be deeply cleaned only by using a pure oil removing cleaning solution, so that when a subsequent electroplating hole filling process is carried out, the inner holes are not plated locally, and the phenomenon of uneven electroplating is caused. Therefore, there is a need to develop a solution to the above problems.
Disclosure of Invention
In view of the above, the present invention is directed to the defects of the prior art, and the main objective of the present invention is to provide a process for improving the uniformity of DPC electroplating via filling by electrolytic cleaning and cleaning, which can effectively solve the problem of uniform copper plating caused by the incomplete cleaning of inner holes in the existing DPC manufacturing process.
In order to achieve the purpose, the invention adopts the following technical scheme:
a process for improving the uniformity of filling holes in DPC electroplating by electrolytic cleaning includes such steps as putting the developed ceramic substrate in the acidic electrolytic deoiling liquid heated to 40-60 deg.C, electrolytic cleaning by using ceramic substrate as cathode and stainless steel plate as anode for 3-5min at current density of 5-10A/m2And then quickly taking out the product to be washed clean by water, then entering a pre-dipping cylinder, and finally directly electroplating.
As a preferable scheme, the acidic electrolysis deoiling liquid comprises the following components in percentage by mass: 3 to 35 percent of citric acid, 5 to 30 percent of sodium citrate, 1 to 5 percent of composite surfactant, 0.5 to 10 percent of sodium gluconate and the balance of deionized water.
As a preferred scheme, the method specifically comprises the following steps:
(1) preparing an acidic electrolytic degreasing liquid:
(1.1) adding 200L of deionized water into an electrolytic cleaning cylinder with the volume of 800L, and heating to 40 ℃;
(1.2) adding 15% of citric acid, stirring and dissolving;
(1.3) adding 20 percent of sodium citrate, stirring and dissolving;
(1.4) adding 1.5 percent of composite surfactant, stirring and dissolving;
(1.5) adding 2.5 percent of sodium gluconate, stirring and dissolving;
(1.6) continuously adding deionized water to reach the liquid level of 800L, and heating to 60 ℃;
(2) calculating the current according to the area of copper by using a hanger on the developed ceramic substrate;
(3) the hanger is sent into an electrolytic cleaning cylinder, a power supply is turned on, cathode electrolytic cleaning is firstly carried out for 4 minutes, and anode electrolytic cleaning is switched to 2 minutes;
(4) lifting the cleaned ceramic substrate out of the electrolytic cleaning cylinder, and then putting the ceramic substrate into two overflow water cylinders to be cleaned for 2 minutes respectively;
(5) and after cleaning, hoisting the ceramic substrate into an acidic pre-immersion cylinder, and finally, putting the ceramic substrate into an electroplating cylinder for electroplating.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and specifically, the technical scheme includes that:
the electrolytic degreasing liquid in the invention is acidic, can not attack and destroy a dry film, and is suitable for cleaning a fine circuit.
Detailed Description
The invention discloses a process for improving the uniformity of DPC electroplating hole filling by electrolytic cleaning, which comprises placing the developed ceramic substrate into acidic electrolytic degreasing liquid heated to 40-60 deg.C, electrolytic cleaning for 3-5min with the ceramic substrate as cathode and stainless steel plate as anode, and current density of 5-10A/m2And then quickly taking out the product to be washed clean by water, then entering a pre-dipping cylinder, and finally directly electroplating. The acidic electrolytic degreasing fluid comprises the following components in percentage by mass: 3 to 35 percent of citric acid, 5 to 30 percent of sodium citrate, 1 to 5 percent of composite surfactant, 0.5 to 10 percent of sodium gluconate and the balance of deionized water.
The method specifically comprises the following steps:
(1) preparing an acidic electrolytic degreasing liquid:
(1.1) adding 200L of deionized water into an electrolytic cleaning cylinder with the volume of 800L, and heating to 40 ℃;
(1.2) adding 15% of citric acid, stirring and dissolving;
(1.3) adding 20 percent of sodium citrate, stirring and dissolving;
(1.4) adding 1.5 percent of composite surfactant, stirring and dissolving;
(1.5) adding 2.5 percent of sodium gluconate, stirring and dissolving;
(1.6) adding deionized water continuously until the liquid level reaches 800L, and heating to 60 ℃.
(2) And calculating the current according to the area of copper by using the developed ceramic substrate on a hanger.
(3) And (3) conveying the hanger into an electrolytic cleaning cylinder, starting a power supply, firstly carrying out cathodic electrolytic cleaning for 4 minutes, and turning to anodic electrolytic cleaning for 2 minutes.
(4) And (4) lifting the cleaned ceramic substrate out of the electrolytic cleaning cylinder, and then putting the ceramic substrate into two overflow water cylinders to be cleaned for 2 minutes respectively.
(5) And after cleaning, hoisting the ceramic substrate into an acidic pre-immersion cylinder, and finally, putting the ceramic substrate into an electroplating cylinder for electroplating.
The electrolytic degreasing liquid in the invention is acidic, can not attack and destroy a dry film, and is suitable for cleaning a fine circuit.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any minor modifications, equivalent changes and modifications made to the above embodiment according to the technical spirit of the present invention are within the technical scope of the present invention.
Claims (3)
1. A process for improving the pore-filling uniformity of DPC electroplating by utilizing electrolytic cleaning and cleaning is characterized in that: putting the developed ceramic substrate into acidic electrolytic degreasing liquid heated to 40-60 ℃ for electrolytic cleaning, and carrying out electrolytic cleaning for 3-5min by taking the ceramic substrate as a cathode and a stainless steel plate as an anode, wherein the current density is 5-10A/m2And then quickly taking out the product to be washed clean by water, then entering a pre-dipping cylinder, and finally directly electroplating.
2. The process for improving DPC electroplating via filling uniformity using electrolytic cleaning, cleaning according to claim 1, wherein: the acidic electrolytic degreasing fluid comprises the following components in percentage by mass: 3 to 35 percent of citric acid, 5 to 30 percent of sodium citrate, 1 to 5 percent of composite surfactant, 0.5 to 10 percent of sodium gluconate and the balance of deionized water.
3. The process for improving DPC electroplating via filling uniformity using electrolytic cleaning, cleaning according to claim 2, wherein: the method specifically comprises the following steps:
(1) preparing an acidic electrolytic degreasing liquid:
(1.1) adding 200L of deionized water into an electrolytic cleaning cylinder with the volume of 800L, and heating to 40 ℃;
(1.2) adding 15% of citric acid, stirring and dissolving;
(1.3) adding 20 percent of sodium citrate, stirring and dissolving;
(1.4) adding 1.5 percent of composite surfactant, stirring and dissolving;
(1.5) adding 2.5 percent of sodium gluconate, stirring and dissolving;
(1.6) continuously adding deionized water to reach the liquid level of 800L, and heating to 60 ℃;
(2) calculating the current according to the area of copper by using a hanger on the developed ceramic substrate;
(3) the hanger is sent into an electrolytic cleaning cylinder, a power supply is turned on, cathode electrolytic cleaning is firstly carried out for 4 minutes, and anode electrolytic cleaning is switched to 2 minutes;
(4) lifting the cleaned ceramic substrate out of the electrolytic cleaning cylinder, and then putting the ceramic substrate into two overflow water cylinders to be cleaned for 2 minutes respectively;
(5) and after cleaning, hoisting the ceramic substrate into an acidic pre-immersion cylinder, and finally, putting the ceramic substrate into an electroplating cylinder for electroplating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911087693.1A CN110923797A (en) | 2019-11-08 | 2019-11-08 | Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911087693.1A CN110923797A (en) | 2019-11-08 | 2019-11-08 | Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110923797A true CN110923797A (en) | 2020-03-27 |
Family
ID=69852597
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911087693.1A Pending CN110923797A (en) | 2019-11-08 | 2019-11-08 | Process for improving DPC electroplating hole filling uniformity by utilizing electrolytic cleaning and cleaning |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110923797A (en) |
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|---|---|---|---|---|
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