CN110988653B

CN110988653B - DDR test equipment and press-fit components

Info

Publication number: CN110988653B
Application number: CN201911206237.4A
Authority: CN
Inventors: 刘冲; 李振华; 杨元明
Original assignee: Biwin Storage Technology Co Ltd
Current assignee: Biwin Storage Technology Co Ltd
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2025-05-06
Anticipated expiration: 2039-11-29
Also published as: CN110988653A

Abstract

The present invention discloses a pressing component of a DDR test device, which includes a mounting seat and a plurality of pressure heads arranged on the mounting seat at intervals, the pressure head includes a groove, a plurality of elastic members arranged in the groove, and a protrusion arranged at the open end of the groove, one end of the elastic member is arranged at the bottom of the groove, and the other end of the elastic member is arranged on the inner end surface of the protrusion, and the protrusion can move toward the inside of the groove and compress the elastic member under the action of external pressure. The pressing component of the DDR test device of the present invention presses the DDR chip to be tested by a plurality of flexible pressure heads, which can reduce the damage to the mobile phone motherboard during the pressing process, avoid excessive device loss, and thus achieve the purpose of reducing the test cost. In addition, the present invention also discloses a DDR test device.

Description

DDR test equipment and pressfitting part

Technical Field

The invention relates to the technical field of DDR (double data rate) testing, in particular to DDR testing equipment and a pressing component.

Background

A Double Data Rate (DDR) is a SDRAM (Synchronous Dynamic Random Access Memory) with a Double Data Rate, and the Data Rate is twice the system clock frequency, so that the transfer performance is better than that of the conventional SDRAM.

It is known that after mass production, DDR needs to be tested for its function to ensure the factory quality of DDR products. The existing DDR test equipment generally comprises an organic table, a plurality of test seats arranged on the organic table, a baffle plate positioned above the test seats, a spring arranged between the test seats and the baffle plate and a pressure head positioned above the test seats, when a DDR chip is required to be tested, the pressure head is driven by a cylinder to be pressed down on one side of the baffle plate, the opposite side of the baffle plate is lifted upwards to open the test seats, then the DDR chip is placed in, after the DDR chip is placed in, the pressure head is withdrawn from the surface of the baffle plate, and the baffle plate is reset and covered above the test seats.

However, in the process of pressing the surface of the baffle by the pressing head to open the test seat, the spring is subjected to a larger pressure, so that the spring is easy to damage and needs to be replaced frequently, and the test cost is increased. In addition, because the bottom of spring is with the cell-phone mainboard direct contact in the test seat, under the circumstances that the spring received great pressure, cause the damage to the cell-phone mainboard easily, also can increase its testing cost.

Disclosure of Invention

The invention mainly aims to provide a press-fit component of DDR test equipment, which aims to solve the technical problem that the existing DDR test equipment has relatively high test cost.

In order to solve the technical problems, the invention provides a press-fit component of DDR (double data rate) testing equipment, which comprises a mounting seat and a plurality of press heads arranged on the mounting seat at intervals, wherein each press head comprises a groove, a plurality of elastic pieces arranged in the groove and a convex block arranged at the opening end of the groove, one end of each elastic piece is arranged at the bottom of the groove, the other end of each elastic piece is arranged on the inner end face of each convex block, and the convex blocks can move towards the inside of the groove under the action of external pressure and compress the elastic pieces.

Preferably, the mounting seat comprises two mounting blocks arranged at intervals and a mounting plate arranged between the two mounting blocks, a plurality of mounting holes are formed in the mounting blocks, and the pressure head is arranged on the mounting plate.

Preferably, a plurality of horizontal bosses are arranged on the left side and/or the right side of the mounting plate at intervals, and the grooves are arranged on the horizontal bosses.

Preferably, a plurality of positioning holes are formed in the mounting plate at intervals.

Preferably, the pressure head further comprises a cover plate arranged at the opening end of the groove, and a first through hole through which the protruding block can pass is formed in the middle of the cover plate.

Preferably, the pressure head further comprises a first buffer pad arranged on the bump, and the first buffer pad can be pressed on the surface of the DDR chip.

The invention also provides DDR test equipment, which comprises a machine table, a plurality of test seats arranged on the machine table, a mechanical arm arranged above the test seats, a plurality of air cylinders and a pressing component, wherein the test seats are arranged on the machine table side by side and are spaced apart by a preset distance, the mechanical arm is used for transferring DDR chips to be tested to the test seats or transferring the tested DDR chips from the test seats, the air cylinders are arranged on two opposite sides of the machine table, and output execution ends of the two air cylinders arranged in two opposite directions are respectively connected with two ends of the pressing component so as to drive the pressing component to move towards the test seats, and a plurality of pressure heads on the pressing component are in one-to-one correspondence with the test seats;

The pressing component comprises a mounting seat and a pressing head arranged on the mounting seat at intervals, the pressing head comprises a groove, a plurality of elastic pieces arranged in the groove and a convex block arranged at the opening end of the groove, one end of each elastic piece is arranged at the bottom of the groove, the other end of each elastic piece is arranged on the inner end face of each convex block, and the convex blocks can move towards the inside of the groove under the action of external pressure and compress the elastic pieces.

Preferably, the test seat comprises a base, a bottom plate arranged below the base and a probe arranged on the bottom plate, wherein the middle part of the base is hollowed out to form a test groove for accommodating the DDR chip, and a plurality of second through holes through which the probe can pass are formed in the bottom plate.

Preferably, the test seat further comprises a second buffer pad arranged below the bottom plate, one end of the probe is connected with the second buffer pad, the other end of the probe penetrates through the second through hole, and a third through hole corresponding to the second through hole is formed in the second buffer pad.

Preferably, the DDR test device further includes a plurality of infrared sensors disposed on the test socket, and a fourth through hole through which infrared rays emitted from the infrared sensors pass is formed in a peripheral wall of the test slot.

The embodiment of the invention has the beneficial effects that the DDR chips to be tested placed in the test seat are pressed through the plurality of flexible pressure heads arranged on the mounting seat so as to test the DDR chips. Specifically, the pressing component is arranged above the test seat and can be close to or far away from the test seat under the action of the driving mechanism, after the DDR chip to be tested is placed on the test seat, the pressing component presses down to press the test seat through the flexible pressure head, and after the test is finished, the pressing component moves upwards to open the test seat to take out the DDR chip after the test. Because the pressure head provided by the invention is a flexible pressure head, when the pressure head is pressed on the DDR chip, the pressure applied to the chip can be reduced, and the chip is prevented from being broken due to the action of the pressure, so that the stability of the DDR test is improved. Meanwhile, the DDR chip is directly contacted with the mobile phone main board, so that damage to the mobile phone main board in the pressing process can be reduced, excessive device loss is avoided, and the aim of reducing the testing cost is fulfilled.

Drawings

FIG. 1 is a schematic diagram of a press-fit component of a DDR test device according to an embodiment of the invention;

FIG. 2 is an orthographic view of the press-fit component of the DDR test apparatus of the present invention;

FIG. 3 is another front view of the press-fit component of the DDR test device of the present invention;

FIG. 4 is an enlarged partial schematic view of FIG. 2A;

FIG. 5 is a schematic diagram of the press-fit component and the test seat of the DDR test device of the present invention;

FIG. 6 is a schematic diagram of a test socket of the DDR test device of the present invention.

Detailed Description

Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below are exemplary and intended to illustrate the present invention and should not be construed as limiting the invention, and all other embodiments, based on the embodiments of the present invention, which may be obtained by persons of ordinary skill in the art without inventive effort, are within the scope of the present invention.

In an embodiment, referring to fig. 1, the press-fit component of the DDR test device includes a mounting base 10 and a plurality of press heads 20 disposed on the mounting base 10 at intervals, the press heads 20 include a groove, a plurality of elastic members disposed in the groove, and a bump 21 disposed at an opening end of the groove, one end of the elastic member is disposed at a bottom of the groove, the other end of the elastic member is disposed on an inner end surface of the bump 21, and the bump 21 can move toward an inside of the groove under an external pressure and compress the elastic member.

It can be understood that after the DDR chip is placed on the test socket, downward pressure needs to be applied to the DDR chip, and the probe under the DDR chip will shrink under the pressure to conduct the circuit between the DDR chip and the motherboard of the mobile phone, and then the functional test for the DDR chip is started. In the testing process, pressure is always acted on the DDR chip to avoid poor contact, thereby ensuring stable testing of the DDR chip.

In this embodiment, the mounting base 10 can move in a direction approaching or separating from the test base under the action of the driving mechanism, so as to press or open the test base. Specifically, after the DDR chip to be tested is placed on the test seat, the mounting seat 10 is pressed down to press the test seat through the pressure head 20, after the test is completed, the mounting seat 10 is moved upwards, and the test seat is opened to take out the DDR chip after the test.

The pressure head 20 is mainly used for pressing the DDR chip through the convex block 21 at the front end of the pressure head, the elastic piece contracts under the pressure action of the convex block 21 to perform flexible pressing on the DDR chip, and after the testing is completed, the pressure head 20 moves upwards and resets under the action of the elastic piece. The bump 21 includes a bottom portion flush with the open end of the recess at the time of reset, and a boss provided on the bottom portion, the boss being shaped and sized to match the DDR chip. In a specific embodiment of the invention, the protruding part is four rectangular blocks arranged on the bottom, so that the DDR chip is pressed through the four rectangular blocks, and the circuit between the DDR chip and the mobile phone main board is always conducted, so that the stability of testing the DDR chip is improved.

In addition, the elastic component is the compression spring who sets up in the recess, and this compression spring is preferably four, and four compression springs support respectively and hold in the bottom of lug 21 and the bottom of recess to when making pressure head 20 pressfitting DDR chip, be flexible contact between it and the DDR chip, play the effect of the pressure that reduces the chip and receive, avoid the chip fracture because of the pressure effect leads to, further improve the stability to the DDR test. Of course, the elastic member may be not only a compression spring, but also other members having elastic restoring force, including but not limited to, the compression spring and the number thereof are only exemplary, but not limiting, and may be selected by those skilled in the art according to actual circumstances.

In a preferred embodiment, referring to fig. 2, the mounting base 10 includes two mounting blocks 11 disposed at a distance from each other and a mounting plate 12 disposed between the two mounting blocks 11, a plurality of mounting holes 30 are provided in the mounting blocks 11, and the ram 20 is disposed on the mounting plate 12. In this embodiment, a plurality of mounting holes 30, such as threaded holes and through holes, are provided on the mounting block 11, and the mounting base 10 is connected to the output execution end of the driving mechanism through the mounting holes 30, so that the mounting base 10 can move along the set direction under the action of the driving mechanism to press or open the test base. Meanwhile, the plurality of pressure heads 20 arranged on the mounting plate 12 are respectively pressed on the DDR chip arranged in the test seat, so that a circuit between the DDR chip and the mobile phone main board is conducted.

In a preferred embodiment described above, and referring to FIG. 3, a plurality of horizontal bosses 40 are spaced apart on the left and/or right sides of mounting plate 12, and recesses are provided in horizontal bosses 40. In the present embodiment, the left and right sides of the mounting plate 12 are referred to with respect to the state of the pressing member in actual use, and the indenter 20 is directed downward in actual use, and the left and right directions of the mounting plate 12 are determined with respect to the direction of the indenter 20. It should be noted that when the horizontal bosses 40 are spaced apart on the left or right side of the mounting plate 12, i.e., the indenter 20 is positioned on the left or right side of the mounting plate 12, as shown in fig. 2, and when the horizontal bosses 40 are spaced apart on the left and right sides of the mounting plate 12, two rows of test sockets can be simultaneously pressed by a single pressing member, which is equivalent to increasing the number of indenters 20 of the single pressing member, thereby achieving the purpose of improving the test efficiency.

In the preferred embodiment, the mounting plate 12 is provided with a plurality of positioning holes 50 at intervals. In this embodiment, the positioning hole 50 is matched with the infrared sensor, so as to perform a positioning function on the pressing member. Specifically, when infrared light from the infrared sensor passes through the locating hole 50, it indicates that the bonding element is directly above the test socket and that each of the pressure heads 20 of the bonding element is aligned with each of the test sockets below, and when infrared light from the infrared sensor is blocked by the mounting plate 12, it indicates that each of the pressure heads 20 on the bonding element is not aligned with each of the test sockets below. When infrared light emitted by the infrared sensor passes through the positioning hole 50, the pressing component can be pressed down and pressed on the test seat, and when infrared light emitted by the infrared sensor does not pass through the positioning hole 50, the position of the pressing component needs to be adjusted until infrared light emitted by the infrared sensor passes through the positioning hole 50, and the pressing component can be pressed down. In one embodiment of the present invention, the alignment holes 50 are spaced apart on the mounting plate 12 between adjacent ones of the horizontal bosses 40.

In another preferred embodiment, the ram 20 further includes a cover plate 60 disposed at the open end of the recess, and a first through hole for the protrusion 21 to pass through is provided at the middle of the cover plate 60. In this embodiment, a cover plate 60 is disposed at the open end of the groove, the cover plate 60 is fixed by a screw, and a first through hole through which the bump 21 can pass is formed in the middle of the cover plate 60. Preferably, the first through hole is rectangular, and the rectangular through hole is communicated with the inside of the groove.

In yet another preferred embodiment, referring to fig. 4, the indenter 20 further includes a first buffer pad 70 disposed on the bump 21, and the first buffer pad 70 can be pressed against the surface of the DDR chip. In this embodiment, in the process of pressing down the pressure head 20, the first buffer pad 70 is in direct contact with the DDR chip, so that the pressure applied to the DDR chip can be reduced, so as to play a role in buffering the DDR chip, thereby ensuring the integrity of the DDR chip and the mobile phone motherboard.

The invention further provides DDR test equipment which comprises a machine table, a plurality of test seats arranged on the machine table, a manipulator arranged above the test seats, a plurality of air cylinders and a pressing component, wherein the specific structure of the pressing component refers to the embodiment.

Wherein the plurality of test seats are arranged side by side on the machine table and are spaced apart according to a preset distance, the mechanical arm is used for transferring the DDR chips to be tested to the test seats or transferring the DDR chips after being tested from the test seats, the plurality of air cylinders are arranged on the two opposite sides of the machine table, the output execution ends of the two oppositely arranged cylinders are respectively connected with two ends of the pressing component so as to drive the pressing component to move towards the test seats, and a plurality of pressing heads on the pressing component are in one-to-one correspondence with the plurality of test seats, and particularly, the pressing component can be seen in fig. 5.

In a preferred embodiment, referring to fig. 6, the test socket includes a base 1, a bottom plate 2 disposed below the base 1, and a probe 3 disposed on the bottom plate 2, the middle of the base 1 is hollowed out to form a test slot 4 for accommodating the DDR chip, and a plurality of second through holes 5 through which the probe 3 can pass are disposed on the bottom plate 2. In this embodiment, the main function of the test socket is to place the DDR chip and conduct the DDR chip with the motherboard of the mobile phone, so as to implement a functional test on the DDR chip. The test seat comprises a base 1 with a hollowed-out middle part, and a test groove 4 for accommodating the DDR chip is formed in the hollowed-out space of the base 1, that is, when the DDR chip needs to be tested, the DDR chip is firstly placed in the test groove 4. The bottom of base 1 is provided with bottom plate 2, and bottom plate 2 corresponds on base 1 and is provided with fixed screw to through screw fixed bottom plate 2 and base 1, and in order to switch on DDR chip and mobile phone motherboard, be provided with probe 3 on bottom plate 2, probe 3's bottom and mobile phone motherboard electricity are connected, and probe 3's top can be connected with the DDR chip electricity of placing in test slot 4.

In another preferred embodiment, the test socket further comprises a second buffer pad 6 disposed below the bottom plate 2, one end of the probe is connected to the second buffer pad 6, the other end passes through the second through hole 5, and a third through hole 7 corresponding to the second through hole 5 is disposed on the second buffer pad 6. In this embodiment, the second buffer gasket 6 is disposed below the bottom plate 2, that is, the second buffer gasket 6 is disposed between the mobile phone motherboard and the bottom plate 2, so as to reduce the pressure of the pressing component on the mobile phone motherboard by the second buffer gasket 6, and play a role in force buffering on the mobile phone motherboard, so as to avoid damage to the mobile phone motherboard caused by the pressure of the pressing component.

In a further preferred embodiment, the DDR test apparatus further comprises a plurality of infrared sensors disposed on the test socket, and the peripheral wall of the test slot 4 is provided with a fourth through hole 8 through which infrared rays emitted from the infrared sensors pass. In this embodiment, if two DDR chips are placed in one test seat, the infrared light emitted by the infrared sensor will be blocked by the DDR chips and cannot pass through the fourth through hole 8, so that it can be determined that the abnormal test condition exists, and the test needs to be stopped.

The above description of the preferred embodiments of the present invention should not be taken as limiting the scope of the invention, but rather should be understood to cover all modifications, variations and adaptations of the present invention using its general principles and the following detailed description and the accompanying drawings, or the direct/indirect application of the present invention to other relevant arts and technologies.

Claims

1. A pressing component of a DDR test device, characterized in that it comprises a mounting seat and a plurality of pressing heads arranged on the mounting seat at intervals, the pressing head comprises a groove, a plurality of elastic members arranged in the groove and a convex block arranged at an open end of the groove, one end of the elastic member is arranged at the bottom of the groove, the other end of the elastic member is arranged on the inner end surface of the convex block, and the convex block can move toward the inside of the groove and compress the elastic member under the action of external pressure;

The mounting seat comprises two mounting blocks arranged at intervals and a mounting plate arranged between the two mounting blocks, the mounting blocks are provided with a plurality of mounting holes, and the pressure head is arranged on the mounting plate;

A plurality of horizontal bosses are arranged at intervals on the left side and/or the right side of the mounting plate, the grooves are arranged on the horizontal bosses, and a plurality of positioning holes are arranged at intervals on the mounting plate;

The pressure head also includes a cover plate arranged at the open end of the groove, and a first through hole for the projection to pass through is arranged in the middle of the cover plate.

2 . The pressing component according to claim 1 , wherein the pressing head further comprises a first buffer pad disposed on the bump, and the first buffer pad can be pressed on the surface of the DDR chip.

3. A DDR testing device, characterized in that it comprises a machine platform, a plurality of test sockets arranged on the machine platform, a manipulator arranged above the test sockets, a plurality of cylinders and a pressing component according to any one of claims 1 to 2, wherein the plurality of test sockets are arranged side by side on the machine platform and spaced apart by a preset distance, the manipulator is used to transfer the DDR chip to be tested to the test sockets or to transfer the tested DDR chip from the test sockets, the plurality of cylinders are arranged on opposite sides of the machine platform, the output execution ends of the two oppositely arranged cylinders are respectively connected to the two ends of the pressing component to drive the pressing component to move toward the test sockets, and the plurality of pressure heads on the pressing component correspond one-to-one to the plurality of test sockets.

4. The DDR test device according to claim 3 is characterized in that the test seat includes a base, a bottom plate arranged under the base and a probe arranged on the bottom plate, the middle part of the base is hollowed out to form a test slot for accommodating the DDR chip, and the bottom plate is provided with a plurality of second through holes for the probe to pass through.

5. The DDR test device according to claim 4 is characterized in that the test socket also includes a second buffer pad arranged under the base plate, one end of the probe is connected to the second buffer pad, and the other end passes through the second through hole, and the second buffer pad is provided with a third through hole corresponding to the second through hole.

6. The DDR test device according to claim 4, further comprising a plurality of infrared sensors arranged on the test seat, and a fourth through hole for infrared rays emitted by the infrared sensors to pass through is arranged on the peripheral wall of the test slot.