CN111205457B - Manufacturing method of polyimide film - Google Patents
Manufacturing method of polyimide film Download PDFInfo
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- CN111205457B CN111205457B CN201811400504.7A CN201811400504A CN111205457B CN 111205457 B CN111205457 B CN 111205457B CN 201811400504 A CN201811400504 A CN 201811400504A CN 111205457 B CN111205457 B CN 111205457B
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- Prior art keywords
- bis
- acid
- polyamic acid
- aromatic
- trifluoromethyl
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- 229920001721 polyimide Polymers 0.000 title claims abstract description 41
- 238000004519 manufacturing process Methods 0.000 title claims description 27
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 59
- 238000000034 method Methods 0.000 claims abstract description 32
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims abstract description 23
- 238000007363 ring formation reaction Methods 0.000 claims abstract description 21
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000003054 catalyst Substances 0.000 claims abstract description 15
- 239000000126 substance Substances 0.000 claims abstract description 15
- 239000002253 acid Substances 0.000 claims abstract description 14
- 238000006243 chemical reaction Methods 0.000 claims abstract description 14
- -1 aromatic ring diamine Chemical class 0.000 claims abstract description 13
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000012024 dehydrating agents Substances 0.000 claims abstract description 9
- 125000001424 substituent group Chemical group 0.000 claims abstract description 3
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 claims description 42
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 claims description 26
- ITQTTZVARXURQS-UHFFFAOYSA-N 3-methylpyridine Chemical compound CC1=CC=CN=C1 ITQTTZVARXURQS-UHFFFAOYSA-N 0.000 claims description 24
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical group CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 claims description 24
- 239000007787 solid Substances 0.000 claims description 14
- WVOLTBSCXRRQFR-SJORKVTESA-N Cannabidiolic acid Natural products OC1=C(C(O)=O)C(CCCCC)=CC(O)=C1[C@@H]1[C@@H](C(C)=C)CCC(C)=C1 WVOLTBSCXRRQFR-SJORKVTESA-N 0.000 claims description 13
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 claims description 13
- WVOLTBSCXRRQFR-DLBZAZTESA-M cannabidiolate Chemical compound OC1=C(C([O-])=O)C(CCCCC)=CC(O)=C1[C@H]1[C@H](C(C)=C)CCC(C)=C1 WVOLTBSCXRRQFR-DLBZAZTESA-M 0.000 claims description 13
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 12
- ZPSUIVIDQHHIFH-UHFFFAOYSA-N 3-(trifluoromethyl)-4-[2-(trifluoromethyl)phenyl]benzene-1,2-diamine Chemical group FC(F)(F)C1=C(N)C(N)=CC=C1C1=CC=CC=C1C(F)(F)F ZPSUIVIDQHHIFH-UHFFFAOYSA-N 0.000 claims description 12
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 12
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 claims description 12
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 12
- 238000003756 stirring Methods 0.000 claims description 12
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical group NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 claims description 11
- 150000003222 pyridines Chemical class 0.000 claims description 10
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 claims description 9
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 claims description 9
- 150000008064 anhydrides Chemical class 0.000 claims description 9
- SMWDFEZZVXVKRB-UHFFFAOYSA-N Quinoline Chemical compound N1=CC=CC2=CC=CC=C21 SMWDFEZZVXVKRB-UHFFFAOYSA-N 0.000 claims description 8
- 125000003118 aryl group Chemical group 0.000 claims description 8
- 150000007524 organic acids Chemical class 0.000 claims description 8
- UMGYJGHIMRFYSP-UHFFFAOYSA-N 2-(4-aminophenyl)-1,3-benzoxazol-5-amine Chemical compound C1=CC(N)=CC=C1C1=NC2=CC(N)=CC=C2O1 UMGYJGHIMRFYSP-UHFFFAOYSA-N 0.000 claims description 6
- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 claims description 6
- UENRXLSRMCSUSN-UHFFFAOYSA-N 3,5-diaminobenzoic acid Chemical compound NC1=CC(N)=CC(C(O)=O)=C1 UENRXLSRMCSUSN-UHFFFAOYSA-N 0.000 claims description 6
- VIUDTWATMPPKEL-UHFFFAOYSA-N 3-(trifluoromethyl)aniline Chemical compound NC1=CC=CC(C(F)(F)F)=C1 VIUDTWATMPPKEL-UHFFFAOYSA-N 0.000 claims description 6
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 claims description 6
- HYDATEKARGDBKU-UHFFFAOYSA-N 4-[4-[4-(4-aminophenoxy)phenyl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)C=C1 HYDATEKARGDBKU-UHFFFAOYSA-N 0.000 claims description 6
- KIFDSGGWDIVQGN-UHFFFAOYSA-N 4-[9-(4-aminophenyl)fluoren-9-yl]aniline Chemical compound C1=CC(N)=CC=C1C1(C=2C=CC(N)=CC=2)C2=CC=CC=C2C2=CC=CC=C21 KIFDSGGWDIVQGN-UHFFFAOYSA-N 0.000 claims description 6
- FKNQCJSGGFJEIZ-UHFFFAOYSA-N 4-methylpyridine Chemical compound CC1=CC=NC=C1 FKNQCJSGGFJEIZ-UHFFFAOYSA-N 0.000 claims description 6
- 102100031503 Barrier-to-autointegration factor-like protein Human genes 0.000 claims description 6
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 claims description 6
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Chemical compound CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 claims description 6
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims description 6
- 101000729827 Homo sapiens Barrier-to-autointegration factor-like protein Proteins 0.000 claims description 6
- 150000004984 aromatic diamines Chemical class 0.000 claims description 6
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 claims description 6
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 claims description 6
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 claims description 6
- 239000001294 propane Substances 0.000 claims description 6
- BEKFRNOZJSYWKZ-UHFFFAOYSA-N 4-[2-(4-aminophenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]aniline Chemical compound C1=CC(N)=CC=C1C(C(F)(F)F)(C(F)(F)F)C1=CC=C(N)C=C1 BEKFRNOZJSYWKZ-UHFFFAOYSA-N 0.000 claims description 5
- JCRRFJIVUPSNTA-UHFFFAOYSA-N 4-[4-(4-aminophenoxy)phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC(C=C1)=CC=C1OC1=CC=C(N)C=C1 JCRRFJIVUPSNTA-UHFFFAOYSA-N 0.000 claims description 5
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 claims description 5
- 150000003931 anilides Chemical class 0.000 claims description 5
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 claims description 4
- FYYYKXFEKMGYLZ-UHFFFAOYSA-N 4-(1,3-dioxo-2-benzofuran-5-yl)-2-benzofuran-1,3-dione Chemical compound C=1C=C2C(=O)OC(=O)C2=CC=1C1=CC=CC2=C1C(=O)OC2=O FYYYKXFEKMGYLZ-UHFFFAOYSA-N 0.000 claims description 3
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 claims description 3
- ZHBXLZQQVCDGPA-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)sulfonyl]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(S(=O)(=O)C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 ZHBXLZQQVCDGPA-UHFFFAOYSA-N 0.000 claims description 3
- 239000005711 Benzoic acid Substances 0.000 claims description 3
- 235000010233 benzoic acid Nutrition 0.000 claims description 3
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 claims description 3
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 claims description 3
- 235000006408 oxalic acid Nutrition 0.000 claims description 3
- 235000019260 propionic acid Nutrition 0.000 claims description 3
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 claims description 3
- 235000005985 organic acids Nutrition 0.000 claims description 2
- RHBKJVRQCIRZGE-UHFFFAOYSA-N 2,3,3-trimethyl-1,2-dihydroindene Chemical compound C1=CC=C2C(C)(C)C(C)CC2=C1 RHBKJVRQCIRZGE-UHFFFAOYSA-N 0.000 claims 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 claims 2
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 claims 2
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims 2
- GCAIEATUVJFSMC-UHFFFAOYSA-N benzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1C(O)=O GCAIEATUVJFSMC-UHFFFAOYSA-N 0.000 claims 1
- 125000000951 phenoxy group Chemical group [H]C1=C([H])C([H])=C(O*)C([H])=C1[H] 0.000 claims 1
- 239000011521 glass Substances 0.000 description 6
- 230000003287 optical effect Effects 0.000 description 5
- 239000004642 Polyimide Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 4
- MHRLWUPLSHYLOK-UHFFFAOYSA-N thiomorpholine-3,5-dicarboxylic acid Chemical compound OC(=O)C1CSCC(C(O)=O)N1 MHRLWUPLSHYLOK-UHFFFAOYSA-N 0.000 description 4
- HHLMWQDRYZAENA-UHFFFAOYSA-N 4-[4-[2-[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropan-2-yl]phenoxy]aniline Chemical compound C1=CC(N)=CC=C1OC1=CC=C(C(C=2C=CC(OC=3C=CC(N)=CC=3)=CC=2)(C(F)(F)F)C(F)(F)F)C=C1 HHLMWQDRYZAENA-UHFFFAOYSA-N 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 239000002243 precursor Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- NSGXIBWMJZWTPY-UHFFFAOYSA-N 1,1,1,3,3,3-hexafluoropropane Chemical compound FC(F)(F)CC(F)(F)F NSGXIBWMJZWTPY-UHFFFAOYSA-N 0.000 description 1
- 239000004262 Ethyl gallate Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- CURBACXRQKTCKZ-UHFFFAOYSA-N cyclobutane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1C(C(O)=O)C(C(O)=O)C1C(O)=O CURBACXRQKTCKZ-UHFFFAOYSA-N 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 125000006159 dianhydride group Chemical class 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- HCDGVLDPFQMKDK-UHFFFAOYSA-N hexafluoropropylene Chemical group FC(F)=C(F)C(F)(F)F HCDGVLDPFQMKDK-UHFFFAOYSA-N 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000006798 ring closing metathesis reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1075—Partially aromatic polyimides
- C08G73/1078—Partially aromatic polyimides wholly aromatic in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
- C08G73/105—Polyimides containing oxygen in the form of ether bonds in the main chain with oxygen only in the diamino moiety
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2379/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen, or carbon only, not provided for in groups C08J2361/00 - C08J2377/00
- C08J2379/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08J2379/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
【技术领域】【Technical field】
本发明是关于一种聚酰亚胺膜的制造方法,特别是指以一种具有较佳的机械特性,且生产制造较为简便的聚酰亚胺膜的制造方法。The present invention relates to a manufacturing method of a polyimide film, in particular to a manufacturing method of a polyimide film which has better mechanical properties and is relatively simple to manufacture.
【背景技术】【Background technique】
聚酰亚胺膜的制造是将聚酰亚胺的前驱物聚酰胺酸进行酰亚胺化反应而得,而酰亚胺化反应的方式分为化学环化与热环化两种;热环化是在高温的条件下使聚酰胺酸前驱物酰亚胺化,而化学环化是使用脱水剂与催化剂让聚酰胺酸前驱物能在较低的温度下达成部分酰亚胺化,之后放入高温进行烘烤使其酰亚胺化更为完全。热环化在生产上需花费较多的烘烤时间,且在长时间烘烤下亦会造成聚酰亚胺膜的机械特性下降以及颜色黄变。而化学环化法制作时间快,且能保持良好的机械特性,因此在量产上使用化学环化法为较佳的选择。The manufacture of polyimide film is obtained by imidization reaction of polyimide precursor polyamic acid, and the method of imidization reaction is divided into chemical cyclization and thermal cyclization; thermal cyclization The cyclization is to imidize the polyamic acid precursor under high temperature conditions, while the chemical cyclization is to use a dehydrating agent and a catalyst to allow the polyamic acid precursor to achieve partial imidization at a lower temperature, and then release it. Bake at high temperature to make the imidization more complete. Thermal cyclization requires more baking time in production, and the mechanical properties of the polyimide film will also decrease and the color will turn yellow under long-term baking. The chemical cyclization method has a fast production time and can maintain good mechanical properties, so it is a better choice to use the chemical cyclization method in mass production.
含有1,2,3,4-环丁四羧二酐(CBDA)成分的聚酰亚胺膜能有好的光学特性以及热稳定性,因此常应用于液晶元件的液晶配向处理剂,半导体元件,或使用于保护膜、绝缘膜、以及光通讯用的光导波路材料等中。专利号US5053480A中提到使用CBDA与二胺反应形成聚酰胺酸,通过热闭环方式进行环化,可制作出有良好光学穿透具与耐热性的聚酰亚胺膜。专利号US6489431B1使用CBDA再搭配具有六氟亚丙基的构成二胺,通过热闭环方式进行环化,可制作出光学性质更为良好的聚酰亚胺膜。上述文章皆使用热闭环的方式进行制膜,但由于热闭环的方式会花费大量的烘烤时间,并且产生的聚酰亚胺膜的机械性质较化学环化的制膜方法来的差,因此有许多的研究学者尝试以化学环化的方式进行制膜,但Hasegawa在期刊High Perform.Polym.2001,13,S93–S106中提到使用具CBDA成分的聚酰胺酸经由化学环化时会产生溶解度问题造成析出。以至现今在化学环化法制膜技术领域中,并未发现有以此种二酐为基底的产品。The polyimide film containing 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA) has good optical properties and thermal stability, so it is often used in liquid crystal alignment treatment agents for liquid crystal elements, semiconductor elements , or used in protective films, insulating films, and optical waveguide materials for optical communications. Patent No. US5053480A mentions that CBDA is reacted with diamine to form polyamic acid, and cyclization is carried out in a thermally closed loop method, and a polyimide film with good optical penetration and heat resistance can be produced. Patent No. US6489431B1 uses CBDA and a constituent diamine with hexafluoropropylene, and performs cyclization through thermal ring closure to produce a polyimide film with better optical properties. The above articles all use the thermal closed loop method for film formation, but because the thermal closed loop method will take a lot of baking time, and the mechanical properties of the resulting polyimide film are worse than those produced by the chemical cyclization method, so There are many researchers trying to make membranes by chemical cyclization, but Hasegawa mentioned in the journal High Perform.Polym.2001, 13, S93–S106 that the use of polyamic acid with CBDA component will produce chemical cyclization. Solubility problems cause precipitation. Up to now, in the technical field of chemical cyclization method, no product based on this dianhydride has been found.
因此本发明提供了一种方法能使具1,2,3,4-环丁四羧二酐(CBDA)成分的聚酰亚胺膜使用化学环化的方法制膜,且此方法制作出的聚酰亚胺膜能有较佳的机械性质。Therefore, the present invention provides a method to make a polyimide film with 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA) component into a film by chemical cyclization, and the method produced by this method Polyimide films can have better mechanical properties.
【发明内容】[Content of the invention]
本发明提供一种聚酰亚胺膜的制造方法,其特征在于,该方法包括:提供聚酰胺酸共聚物,其包括半芳香族聚酰胺酸,该半芳香族聚酰胺酸由1,2,3,4-环丁四羧二酐(CBDA)与芳香环二胺反应而得;向该聚酰胺酸共聚物添加脱水剂、邻位无取代基的吡啶类催化剂及酸,以化学环化法进行酰亚胺化反应,而制成聚酰亚胺膜。The present invention provides a method for manufacturing a polyimide film, which is characterized in that the method comprises: providing a polyamic acid copolymer, which includes a semi-aromatic polyamic acid, the semi-aromatic polyamic acid is composed of 1, 2, It is obtained by reacting 3,4-cyclobutanetetracarboxylic dianhydride (CBDA) with aromatic ring diamine; adding a dehydrating agent, an ortho-position unsubstituted pyridine catalyst and an acid to the polyamic acid copolymer, and using a chemical cyclization method The imidization reaction was performed to prepare a polyimide film.
具体地,所述芳香环二胺选自对苯二胺(PDA)、4,4'-二氨基二苯醚(ODA)、2,2'-双[4-(4-氨基苯氧基苯基)]丙烷(BAPP)、2,2'-二(三氟甲基)二氨基联苯(TFMB)、3,5-二氨基苯甲酸(35DABA)、4,4'-二氨基苯酰替苯胺(44DABA)、5(6)-氨基-1-(4-氨基苯基)-1,3,3-三甲基茚满(TMDA)、4,4'-双(4-氨基苯氧基)二苯砜(BAPS)、4,4'-二(4-氨基苯氧基)联苯(BAPB)、1,4-双(4-氨基苯氧基)苯(TPEQ)、2,2'-双(三氟甲基)-4,4'-二氨基苯基醚(6FODA)、2,2-双[4-(4-氨基苯氧基)苯基]-1,1,1,3,3,3-六氟丙烷(HFBAPP)、9,9-双(4-氨基苯基)芴(BAFL)、2-(4-氨基苯基)-5-氨基苯并恶唑(5BPOA)、间苯二胺(mPDA)、4,4'-二氨基二苯砜(44DDS)、2,2-双(4-氨基苯基)六氟丙烷(Bis-A-AF)、2,2-双(3-氨基-4-羟基苯基)六氟丙烷(6FAP)、4,4'-[1,4-苯基双(氧)]双[3-(三氟甲基)苯胺](FAPB)。Specifically, the aromatic ring diamine is selected from p-phenylenediamine (PDA), 4,4'-diaminodiphenyl ether (ODA), 2,2'-bis[4-(4-aminophenoxybenzene) base)] propane (BAPP), 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFMB), 3,5-diaminobenzoic acid (35DABA), 4,4'-diaminobenzoic acid Aniline (44DABA), 5(6)-amino-1-(4-aminophenyl)-1,3,3-trimethylindane (TMDA), 4,4'-bis(4-aminophenoxy) ) Diphenylsulfone (BAPS), 4,4'-bis(4-aminophenoxy)biphenyl (BAPB), 1,4-bis(4-aminophenoxy)benzene (TPEQ), 2,2' -Bis(trifluoromethyl)-4,4'-diaminophenyl ether (6FODA), 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3 , 3,3-hexafluoropropane (HFBAPP), 9,9-bis(4-aminophenyl)fluorene (BAFL), 2-(4-aminophenyl)-5-aminobenzoxazole (5BPOA), m-phenylenediamine (mPDA), 4,4'-diaminodiphenylsulfone (44DDS), 2,2-bis(4-aminophenyl)hexafluoropropane (Bis-A-AF), 2,2-bis (3-Amino-4-hydroxyphenyl)hexafluoropropane (6FAP), 4,4'-[1,4-phenylbis(oxy)]bis[3-(trifluoromethyl)aniline](FAPB) .
进一步地,所述聚酰胺酸共聚物还包括有芳香族聚酰胺酸,该芳香族聚酰胺酸是由芳香族二胺与芳香族二酐反应而得。Further, the polyamic acid copolymer also includes an aromatic polyamic acid, which is obtained by reacting an aromatic diamine with an aromatic dianhydride.
具体地,所述芳香族二酐选自1,2,4,5-苯四甲酸酐(PMDA)、3,3',4,4'-联苯四羧酸二酐(BPDA)、4,4'-氧双邻苯二甲酸酐(ODPA)、3,3',4,4'-二苯甲酮四甲酸二酐(BTDA)、3,3,4,4-二苯基砜四羧酸二酸酐(DSDA)、2,3,3',4'-联苯四甲酸二酐(α-BPDA)、4,4-六氟异丙基邻苯二甲酸酐(6FDA)、4,4'-(4,4'-异丙基二苯氧基)二酞酸酐(BPADA);所述芳香族二胺选自2,2'-二(三氟甲基)二氨基联苯(TFMB)、2,2'-双[4-(4-氨基苯氧基苯基)]丙烷(BAPP)、2,2-双[4-(4-氨基苯氧基)苯基]-1,1,1,3,3,3-六氟丙烷(HFBAPP)、5(6)-氨基-1-(4-氨基苯基)-1,3,3-三甲基茚满(TMDA)、对苯二胺(PDA)、4,4'-二(4-氨基苯氧基)联苯(BAPB)、2,2'-双(三氟甲基)-4,4'-二氨基苯基醚(6FODA)、4,4'-双(4-氨基苯氧基)二苯砜(BAPS)、9,9-双(4-氨基苯基)芴(BAFL)、4,4'-二氨基二苯砜(44DDS)、4,4'-二氨基二苯醚(ODA)、4,4'-二氨基苯酰替苯胺(44DABA)、2,2-双(4-氨基苯基)六氟丙烷(Bis-A-AF)、间苯二胺(mPDA)、2,2-双(3-氨基-4-羟基苯基)六氟丙烷(6FAP)、3,5-二氨基苯甲酸(35DABA)、2-(4-氨基苯基)-5-氨基苯并恶唑(5BPOA)、1,4-双(4-氨基苯氧基)苯(TPEQ)、4,4'-[1,4-苯基双(氧)]双[3-(三氟甲基)苯胺](FAPB)。Specifically, the aromatic dianhydride is selected from 1,2,4,5-mellitic anhydride (PMDA), 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), 4, 4'-Oxydiphthalic anhydride (ODPA), 3,3',4,4'-benzophenone tetracarboxylic dianhydride (BTDA), 3,3,4,4-diphenylsulfone tetracarboxylate Acid dianhydride (DSDA), 2,3,3',4'-biphenyltetracarboxylic dianhydride (α-BPDA), 4,4-hexafluoroisopropylphthalic anhydride (6FDA), 4,4 '-(4,4'-isopropyldiphenoxy)diphthalic anhydride (BPADA); the aromatic diamine is selected from 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFMB) , 2,2'-bis[4-(4-aminophenoxyphenyl)]propane (BAPP), 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1, 1,3,3,3-Hexafluoropropane (HFBAPP), 5(6)-amino-1-(4-aminophenyl)-1,3,3-trimethylindane (TMDA), terephthalic acid Amine (PDA), 4,4'-bis(4-aminophenoxy)biphenyl (BAPB), 2,2'-bis(trifluoromethyl)-4,4'-diaminophenyl ether (6FODA ), 4,4'-bis(4-aminophenoxy)diphenylsulfone (BAPS), 9,9-bis(4-aminophenyl)fluorene (BAFL), 4,4'-diaminodiphenylsulfone (44DDS), 4,4'-diaminodiphenyl ether (ODA), 4,4'-diaminobenzoic anilide (44DABA), 2,2-bis(4-aminophenyl)hexafluoropropane (Bis -A-AF), m-phenylenediamine (mPDA), 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP), 3,5-diaminobenzoic acid (35DABA), 2 -(4-Aminophenyl)-5-aminobenzoxazole (5BPOA), 1,4-bis(4-aminophenoxy)benzene (TPEQ), 4,4'-[1,4-phenyl Bis(oxy)]bis[3-(trifluoromethyl)aniline](FAPB).
进一步地,所述邻位无取代基的吡啶类催化剂选自吡啶、3-甲基吡啶、4-甲基吡啶、异苯骈吡啶、苯骈吡啶。Further, the ortho-position unsubstituted pyridine-based catalyst is selected from pyridine, 3-picoline, 4-picoline, isobenzopyridine, and benzopyridine.
具体地,所述酸选自有机酸;优选为醋酸、丙酸、丁酸、草酸、苯甲酸、对苯甲酸、对苯二酸或邻苯二酸。Specifically, the acid is selected from organic acids; preferably acetic acid, propionic acid, butyric acid, oxalic acid, benzoic acid, terephthalic acid, terephthalic acid or phthalic acid.
优选地,所述有机酸添加的摩尔数大于或等于所述邻位无取代基的吡啶类催化剂的添加摩尔数;所述有机酸优选为醋酸,所述具邻位无取代基的吡啶类催化剂优选为3-甲基吡啶,所述脱水剂优选为的醋酸酐;所述半芳香族聚酰胺酸二酐摩尔数可以是占该共聚聚酰胺酸的酸酐总摩尔数的百分比60以上。Preferably, the number of moles added of the organic acid is greater than or equal to the number of moles added of the ortho-position unsubstituted pyridine catalyst; the organic acid is preferably acetic acid, and the ortho-position unsubstituted pyridine catalyst It is preferably 3-picoline, and the dehydrating agent is preferably acetic anhydride; the number of moles of the semi-aromatic polyamic acid dianhydride can be more than 60 percent of the total number of moles of the acid anhydride of the copolymerized polyamic acid.
本发明提供一种具体的实施方式之一为,将0.1675摩尔的2,2'-二(三氟甲基)二氨基联苯,加入412.5克的N,N-二甲基乙酰胺,待全部溶解后加入0.134摩尔的1,2,3,4-环丁四羧二酐,搅拌反应,然后添加0.0558摩尔的2,2'-二(三氟甲基)二氨基联苯搅拌至完全溶解后再加入0.1074摩尔的4,4-六氟异丙基邻苯二甲酸酐,搅拌溶解及反应,得到固体含量为25%的聚酰胺酸共聚物;取54.4克所述聚酰胺酸共聚物,用N,N-二甲基乙酰胺(DMAc)将固体含量稀释至为17%,之后添加8毫升的醋酸,4.3毫升的3-甲基吡啶与12.5毫升的醋酸酐,均匀搅拌后涂布干燥即得。One of the specific embodiments provided by the present invention is to add 412.5 grams of N,N-dimethylacetamide to 0.1675 moles of 2,2'-bis(trifluoromethyl)diaminobiphenyl, and wait until all the After dissolving, add 0.134 moles of 1,2,3,4-cyclobutanetetracarboxylic dianhydride, stir the reaction, then add 0.0558 moles of 2,2'-bis(trifluoromethyl)diaminobiphenyl and stir until completely dissolved Then add 0.1074 moles of 4,4-hexafluoroisopropylphthalic anhydride, stir, dissolve and react to obtain a polyamic acid copolymer with a solid content of 25%; take 54.4 grams of the polyamic acid copolymer, use N,N-Dimethylacetamide (DMAc) diluted the solid content to 17%, then added 8 ml of acetic acid, 4.3 ml of 3-methylpyridine and 12.5 ml of acetic anhydride, stirred evenly, and coated and dried. have to.
本发明还提出了前述任一所述方法制得的聚酰亚胺膜,其特征在于,所述聚酰亚胺膜厚度为22-50um时,色度b*小于1.5。The present invention also provides the polyimide film prepared by any of the aforementioned methods, characterized in that, when the thickness of the polyimide film is 22-50um, the chromaticity b* is less than 1.5.
本发明还提出了一种聚酰亚胺膜,其是由共聚聚酰胺酸制备而来,其特征在于,该共聚聚酰胺酸包括半芳香族聚酰胺酸,该半芳香族聚酰胺酸由1,2,3,4-环丁四羧二酐(CBDA)与芳香环二胺反应而得;所述聚酰亚胺膜厚度为22-50um,色度b*0.9-1.5。The present invention also provides a polyimide film prepared from copolyamic acid, characterized in that the copolyamic acid includes semi-aromatic polyamic acid, and the semi-aromatic polyamic acid is composed of 1 ,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA) is obtained by reacting with aromatic ring diamine; the thickness of the polyimide film is 22-50um, and the chromaticity is b*0.9-1.5.
【附图说明】【Description of drawings】
图1为本发明聚酰亚胺膜的制造方法流程图。FIG. 1 is a flow chart of the manufacturing method of the polyimide film of the present invention.
其中,各符号说明如下:Among them, the description of each symbol is as follows:
提供一聚酰胺酸共聚物 (S1)Provide a polyamic acid copolymer (S1)
添加脱水剂、邻位无取代基的吡啶类催化剂及酸 (S2)Add dehydrating agent, ortho-unsubstituted pyridine catalyst and acid (S2)
以化学环化法进行酰亚胺化反应 (S3)。The imidization reaction (S3) is carried out by chemical cyclization.
【具体实施方式】【Detailed ways】
请参阅第1图,本发明为一种聚酰亚胺膜的制造方法,其包括有;提供一聚酰胺酸共聚物(S1),其须至少包含半芳香族聚酰胺酸,该半芳香族聚酰胺酸是经由1,2,3,4-环丁四羧二酐(CBDA)与芳香环二胺反应而得;将该聚酰胺酸共聚物添加脱水剂、邻位无取代基的吡啶类催化剂及酸(S2),以将聚酰胺酸共聚物以化学环化法进行酰亚胺化反应(S3),而制成聚酰亚胺膜。Please refer to FIG. 1, the present invention is a method of manufacturing a polyimide film, which includes: providing a polyamic acid copolymer (S1), which must contain at least a semi-aromatic polyamic acid, the semi-aromatic polyamic acid The polyamic acid is obtained through the reaction of 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA) with aromatic ring diamine; the polyamic acid copolymer is added with a dehydrating agent, ortho-position unsubstituted pyridines The catalyst and the acid (S2) are used to carry out the imidization reaction (S3) of the polyamic acid copolymer by the chemical cyclization method, thereby producing a polyimide film.
其中,该半芳香族聚酰胺酸是经由1,2,3,4-环丁四羧二酐(CBDA)与芳香环二胺反应而得,其中芳香环二胺可为对苯二胺(PDA)、4,4'-二氨基二苯醚(ODA)、2,2'-双[4-(4-氨基苯氧基苯基)]丙烷(BAPP)、2,2'-二(三氟甲基)二氨基联苯(TFMB)、3,5-二氨基苯甲酸(35DABA)、4,4'-二氨基苯酰替苯胺(44DABA)、5(6)-氨基-1-(4-氨基苯基)-1,3,3-三甲基茚满(TMDA)、4,4'-双(4-氨基苯氧基)二苯砜(BAPS)、4,4'-二(4-氨基苯氧基)联苯(BAPB)、1,4-双(4-氨基苯氧基)苯(TPEQ)、2,2'-双(三氟甲基)-4,4'-二氨基苯基醚(6FODA)、2,2-双[4-(4-氨基苯氧基)苯基]-1,1,1,3,3,3-六氟丙烷(HFBAPP)、9,9-双(4-氨基苯基)芴(BAFL)、2-(4-氨基苯基)-5-氨基苯并恶唑(5BPOA)、间苯二胺(mPDA)、4,4'-二氨基二苯砜(44DDS)、2,2-双(4-氨基苯基)六氟丙烷(Bis-A-AF)、2,2-双(3-氨基-4-羟基苯基)六氟丙烷(6FAP)、4,4'-[1,4-苯基双(氧)]双[3-(三氟甲基)苯胺](FAPB)的一种或多种。Wherein, the semi-aromatic polyamic acid is obtained by reacting 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA) with an aromatic ring diamine, wherein the aromatic ring diamine can be p-phenylenediamine (PDA). ), 4,4'-diaminodiphenyl ether (ODA), 2,2'-bis[4-(4-aminophenoxyphenyl)]propane (BAPP), 2,2'-bis(trifluoro) Methyl)diaminobiphenyl (TFMB), 3,5-diaminobenzoic acid (35DABA), 4,4'-diaminobenzoic anilide (44DABA), 5(6)-amino-1-(4- Aminophenyl)-1,3,3-trimethylindane (TMDA), 4,4'-bis(4-aminophenoxy)diphenylsulfone (BAPS), 4,4'-bis(4- Aminophenoxy)biphenyl (BAPB), 1,4-bis(4-aminophenoxy)benzene (TPEQ), 2,2'-bis(trifluoromethyl)-4,4'-diaminobenzene Base ether (6FODA), 2,2-bis[4-(4-aminophenoxy)phenyl]-1,1,1,3,3,3-hexafluoropropane (HFBAPP), 9,9-bis (4-Aminophenyl)fluorene (BAFL), 2-(4-aminophenyl)-5-aminobenzoxazole (5BPOA), m-phenylenediamine (mPDA), 4,4'-diaminodiphenyl Sulfone (44DDS), 2,2-bis(4-aminophenyl)hexafluoropropane (Bis-A-AF), 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP) , one or more of 4,4'-[1,4-phenylbis(oxy)]bis[3-(trifluoromethyl)aniline](FAPB).
该聚酰胺酸共聚物更可包括有芳香族聚酰胺酸,该芳香族聚酰胺酸是由芳香族二胺与芳香族二酐反应而得。The polyamic acid copolymer may further include an aromatic polyamic acid, which is obtained by reacting an aromatic diamine with an aromatic dianhydride.
该芳香族二胺包含了2,2'-二(三氟甲基)二氨基联苯(TFMB)、2,2'-双[4-(4-氨基苯氧基苯基)]丙烷(BAPP)、2,2-双[4-(4-氨基苯氧基)苯The aromatic diamine contains 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFMB), 2,2'-bis[4-(4-aminophenoxyphenyl)]propane (BAPP) ), 2,2-bis[4-(4-aminophenoxy)benzene
基]-1,1,1,3,3,3-六氟丙烷(HFBAPP)、5(6)-氨基-1-(4-氨基苯基)-1,3,3-三甲基茚满(TMDA)、对苯二胺(PDA)、4,4'-二(4-氨基苯氧基)联苯(BAPB)、2,2'-双(三氟甲基)-4,4'-二氨基苯基醚(6FODA)、4,4'-双(4-氨基苯氧基)二苯砜(BAPS)、9,9-双(4-氨基苯基)芴(BAFL)、4,4'-二氨基二苯砜(44DDS)、4,4'-二氨基二苯醚(ODA)、4,4'-二氨基苯酰替苯胺(44DABA)、2,2-双(4-氨基苯基)六氟丙烷(Bis-A-AF)、间苯二胺(mPDA)、2,2-双(3-氨基-4-羟基苯基)六氟丙烷(6FAP)、3,5-二氨基苯甲酸(35DABA)、2-(4-氨基苯基)-5-氨基苯并恶唑(5BPOA)、1,4-双(4-氨基苯氧基)苯(TPEQ)、4,4'-[1,4-苯基双(氧)]双[3-(三氟甲基)苯胺](FAPB)的一种或多种。其中芳香族二酐包含了1,2,4,5-苯四甲酸酐(PMDA)、3,3',4,4'-联苯四羧酸二酐(BPDA)、4,4'-氧双邻苯二甲酸酐(ODPA)、3,3',4,4'-二苯甲酮四甲酸二酐(BTDA)、3,3,4,4-二苯基砜四羧酸二酸酐(DSDA)、2,3,3',4'-联苯四甲酸二酐(α-BPDA)、4,4-六氟异丙基邻苯二甲酸酐(6FDA)、4,4'-(4,4'-异丙基二苯氧基)二酞酸酐(BPADA)的一种或多种。base]-1,1,1,3,3,3-hexafluoropropane (HFBAPP), 5(6)-amino-1-(4-aminophenyl)-1,3,3-trimethylindan (TMDA), p-phenylenediamine (PDA), 4,4'-bis(4-aminophenoxy)biphenyl (BAPB), 2,2'-bis(trifluoromethyl)-4,4'- Diaminophenyl ether (6FODA), 4,4'-bis(4-aminophenoxy)diphenylsulfone (BAPS), 9,9-bis(4-aminophenyl)fluorene (BAFL), 4,4 '-Diaminodiphenylsulfone (44DDS), 4,4'-diaminodiphenyl ether (ODA), 4,4'-diaminobenzyl anilide (44DABA), 2,2-bis(4-aminobenzene) base) hexafluoropropane (Bis-A-AF), m-phenylenediamine (mPDA), 2,2-bis(3-amino-4-hydroxyphenyl)hexafluoropropane (6FAP), 3,5-diamino Benzoic acid (35DABA), 2-(4-aminophenyl)-5-aminobenzoxazole (5BPOA), 1,4-bis(4-aminophenoxy)benzene (TPEQ), 4,4'- One or more of [1,4-phenylbis(oxy)]bis[3-(trifluoromethyl)aniline](FAPB). Among them, aromatic dianhydrides include 1,2,4,5-mellitic anhydride (PMDA), 3,3',4,4'-biphenyltetracarboxylic dianhydride (BPDA), 4,4'-oxygen Diphthalic anhydride (ODPA), 3,3',4,4'-benzophenone tetracarboxylic dianhydride (BTDA), 3,3,4,4-diphenylsulfone tetracarboxylic dianhydride ( DSDA), 2,3,3',4'-biphenyltetracarboxylic dianhydride (α-BPDA), 4,4-hexafluoroisopropylphthalic anhydride (6FDA), 4,4'-(4 One or more of ,4'-isopropyldiphenoxy)diphthalic anhydride (BPADA).
该聚酰胺酸共聚物使用化学环化法进行酰亚胺化反应,添加脱水剂、邻位无取代基的吡啶类催化剂以及酸,其中邻位无取代基的吡啶类催化剂可为吡啶、3-甲基吡啶、4-甲基吡啶、异苯骈吡啶、苯骈吡啶。该酸为有机酸,可为醋酸、丙酸、丁酸、草酸、苯甲酸、对苯甲酸、对苯二酸、邻苯二酸。其中,该酸添加的摩尔数优选大于或等于该邻位无取代基的吡啶类催化剂的添加摩尔数。The polyamic acid copolymer uses a chemical cyclization method to carry out imidization reaction, and adds a dehydrating agent, an unsubstituted pyridine catalyst at the ortho position and an acid, wherein the pyridine catalyst without a substituent at the ortho position can be pyridine, 3- Methyl pyridine, 4-picoline, benzopyridine, benzopyridine. The acid is an organic acid, and can be acetic acid, propionic acid, butyric acid, oxalic acid, benzoic acid, terephthalic acid, terephthalic acid, or phthalic acid. The number of moles of the acid added is preferably greater than or equal to the number of moles of the ortho-position unsubstituted pyridine-based catalyst added.
实施例Example
<检测方法><Detection method>
色度b*:依照ASTM E313规范使用Nippon Denshoku公司出品型号为NE-4000仪器量测。Chromaticity b*: Measured according to ASTM E313 using a model NE-4000 instrument produced by Nippon Denshoku.
<实施例1><Example 1>
聚酰胺酸共聚物的制造Manufacture of polyamic acid copolymers
将53.645克的2,2'-二(三氟甲基)二氨基联苯(TFMB,0.167553.645 grams of 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFMB, 0.1675
摩尔,占总二胺摩尔数比率0.75),加入412.5克的N,N-二甲基乙酰胺(DMAc),待全部溶解后加入26.282克的1,2,3,4-环丁四羧二酐(CBDA,0.134摩尔,占总酸酐摩尔百分比60%),搅拌反应六小时且温度持续维持在25℃,以形成半芳香族聚酰胺酸溶液。待六小时后将上述半芳香族聚酰胺酸溶液添加17.882克的2,2'-二(三氟甲基)二氨基联苯(TFMB,0.0558摩尔)搅拌至完全溶解后再加入38.698克的4,4-六氟异丙基邻苯二甲酸酐(6FDA,0.1074摩尔),搅拌一定时间而进行溶解及反应,并且溶液的温度维持为25℃,最终得到固体含量为25%的聚酰胺酸共聚物。moles, the ratio of moles to the total diamine is 0.75), add 412.5 grams of N,N-dimethylacetamide (DMAc), and add 26.282 grams of 1,2,3,4-cyclobutanetetracarboxylate after all dissolved Anhydride (CBDA, 0.134 moles, accounting for 60% of the total acid anhydride moles), stirred and reacted for six hours and the temperature was maintained at 25° C. to form a semi-aromatic polyamic acid solution. After six hours, add 17.882 g of 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFMB, 0.0558 mol) to the above-mentioned semi-aromatic polyamic acid solution, stir until completely dissolved, and then add 38.698 g of 4 ,4-hexafluoroisopropylphthalic anhydride (6FDA, 0.1074 mol), stir for a certain period of time to dissolve and react, and the temperature of the solution is maintained at 25 ° C, and finally a polyamic acid copolymer with a solid content of 25% is obtained. thing.
聚酰亚胺膜制作Polyimide film production
在上述聚酰胺酸共聚物中取出54.4克,并使用N,N-二甲基乙酰胺(DMAc)将固体含量稀释至为17%,之后依序添加8毫升的醋酸(0.14摩尔),4.3毫升的3-甲基吡啶(0.044摩尔)与12.5毫升的醋酸酐,在均匀搅拌后将溶液涂布到玻璃板后使用900μm间隙的刮刀进行涂布。将涂布完成的样品置放于50℃烘箱烘烤20分钟,再缓慢升温至170℃烘烤20分钟后,再将烘箱升温至260℃烘烤20分钟作为最终处理。54.4 g was taken out of the above polyamic acid copolymer, and the solid content was diluted to 17% with N,N-dimethylacetamide (DMAc), after which 8 ml of acetic acid (0.14 mol), 4.3 ml of acetic acid were added sequentially of 3-picoline (0.044 mol) and 12.5 mL of acetic anhydride, after uniform stirring, the solution was applied to a glass plate and then applied using a doctor blade with a 900 μm gap. The coated samples were placed in a 50°C oven for 20 minutes, then slowly heated to 170°C for 20 minutes, and then the oven was heated to 260°C for 20 minutes as the final treatment.
上述所制成的聚酰亚胺膜为较低色度b*为1.5的聚酰亚胺膜。The polyimide film prepared above is a polyimide film with a lower chromaticity b* of 1.5.
<实施例2><Example 2>
聚酰胺酸共聚物的制造Manufacture of polyamic acid copolymers
将18.606克的2,2'-二(三氟甲基)二氨基联苯(TFMB,0.058118.606 g of 2,2'-bis(trifluoromethyl)diaminobiphenyl (TFMB, 0.0581
摩尔),加入90克的N,N-二甲基乙酰胺(DMAc),待全部溶解后加入11.394克的1,2,3,4-环丁四羧二酐(CBDA,0.0581摩尔),添加时温度控制为25℃,搅拌反应二十四小时且温度持续维持在25℃,最终得到固体含量为25%的聚酰胺酸溶液。mol), add 90 g of N,N-dimethylacetamide (DMAc), add 11.394 g of 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA, 0.0581 mol) after all dissolved, add The temperature is controlled to be 25° C., the reaction is stirred for 24 hours and the temperature is continuously maintained at 25° C. to finally obtain a polyamic acid solution with a solid content of 25%.
聚酰亚胺膜的制作Production of polyimide film
将上述聚酰胺酸共聚物中取出20.2克,并使用N,N-二甲基乙酰胺(DMAc)将固体含量稀释至为15.8%,之后分别添加1.2克(0.02摩尔)的醋酸与0.9克的3-甲基吡啶(0.0097摩尔),在均匀搅拌后再加入2.0克的醋酸酐,将溶液涂布到玻璃板后使用400μm间隙的刮刀进行涂布。将涂布完成的样品置放于50℃烘箱烘烤20分钟,再缓慢升温至170℃烘烤20分钟后,再将烘箱升温至260℃烘烤20分钟作为最终处理。20.2 g of the above polyamic acid copolymer was taken out, and the solid content was diluted to 15.8% with N,N-dimethylacetamide (DMAc), after which 1.2 g (0.02 mol) of acetic acid and 0.9 g of acetic acid were added respectively. 3-methylpyridine (0.0097 mol), 2.0 g of acetic anhydride was added after uniform stirring, and the solution was applied to a glass plate using a doctor blade with a gap of 400 μm. The coated samples were placed in a 50°C oven for 20 minutes, then slowly heated to 170°C for 20 minutes, and then the oven was heated to 260°C for 20 minutes as the final treatment.
上述所制成的聚酰亚胺可成膜及较低的色度b*为0.9。The polyimide prepared above can be formed into a film and has a lower chromaticity b* of 0.9.
<实施例3><Example 3>
聚酰胺酸共聚物的制作Production of polyamic acid copolymer
将18.948克的2,2'-双(三氟甲基)-4,4'-二氨基苯基醚(6FODA,18.948 g of 2,2'-bis(trifluoromethyl)-4,4'-diaminophenyl ether (6FODA,
0.0564摩尔),加入90克的N,N-二甲基乙酰胺(DMAc),待全部溶解后加入11.052克的1,2,3,4-环丁四羧二酐(CBDA,0.0564摩尔),添加时温度控制为25℃,搅拌反应二十四小时且温度持续维持在25℃,最终得到固体含量为25%的聚酰胺酸共聚物。0.0564 mol), add 90 g of N,N-dimethylacetamide (DMAc), and after all dissolved, add 11.052 g of 1,2,3,4-cyclobutanetetracarboxylic dianhydride (CBDA, 0.0564 mol), When adding, the temperature is controlled to be 25° C., the reaction is stirred for 24 hours and the temperature is continuously maintained at 25° C. to finally obtain a polyamic acid copolymer with a solid content of 25%.
聚酰亚胺膜的制作Production of polyimide film
在上述聚酰胺酸共聚物中取出20.2克,并使用N,N-二甲基乙酰胺(DMAc)将固体含量稀释至为15.8%,之后分别添加1.1克的醋酸(0.018摩尔)与0.9克的3-甲基吡啶(0.0097摩尔),在均匀搅拌后再加入1.9克的醋酸酐,将溶液涂布到玻璃板后使用600μm间隙的刮刀进行涂布。将涂布完成的样品置放于50℃烘箱烘烤20分钟,再缓慢升温至170℃烘烤20分钟后,再将烘箱升温至260℃烘烤20分钟作为最终处理。20.2 g of the above polyamic acid copolymer was taken out, and the solid content was diluted to 15.8% with N,N-dimethylacetamide (DMAc), after which 1.1 g of acetic acid (0.018 mol) and 0.9 g of acetic acid were added, respectively. 3-methylpyridine (0.0097 mol), 1.9 g of acetic anhydride was added after uniform stirring, and the solution was applied to a glass plate using a doctor blade with a gap of 600 μm. The coated samples were placed in a 50°C oven for 20 minutes, then slowly heated to 170°C for 20 minutes, and then the oven was heated to 260°C for 20 minutes as the final treatment.
上述所制成的透明聚酰亚胺可成膜及较低的色度b*为1.0。The transparent polyimide prepared above can be formed into a film and has a lower chromaticity b* of 1.0.
<比较例1><Comparative Example 1>
聚酰胺酸共聚物的制作Production of polyamic acid copolymer
其制作方法与实施例1相同。The preparation method is the same as that of Example 1.
聚酰亚胺膜的制作Production of polyimide film
在上述共聚聚酰胺酸溶液中取出54.4克,并使用N,N-二甲基乙酰胺(DMAc)将固体含量稀释至为17%,将溶液涂布到玻璃板后使用900μm间隙的刮刀进行涂布。将涂布完成的样品置放于50℃烘箱烘烤20分钟,再缓慢升温至170℃烘烤20分钟后,再将烘箱升温至260℃烘烤20分钟作为最终处理。54.4 g of the above copolyamic acid solution was taken out, and the solid content was diluted to 17% with N,N-dimethylacetamide (DMAc), and the solution was applied to a glass plate using a doctor blade with a gap of 900 μm. cloth. The coated samples were placed in a 50°C oven for 20 minutes, then slowly heated to 170°C for 20 minutes, and then the oven was heated to 260°C for 20 minutes as the final treatment.
上述所制成的透明聚酰亚胺可成膜及较高的色度b*为3.6.。The transparent polyimide prepared above can be formed into a film and has a higher chromaticity b* of 3.6.
<比较例2><Comparative Example 2>
聚酰胺酸共聚物的制作Production of polyamic acid copolymer
其制作方法与实施例2相同。The preparation method is the same as that of Example 2.
聚酰亚胺膜的制作Production of polyimide film
在上述聚酰胺酸共聚物中取出20.2克,并使用N,N-二甲基乙酰胺(DMAc)将固体含量稀释至为15.8%,将溶液涂布到玻璃板后使用400μm间隙的刮刀进行涂布。将涂布完成的样品置放于50℃烘箱烘烤20分钟,再缓慢升温至170℃烘烤20分钟后,再将烘箱升温至260℃烘烤20分钟作为最终处理。20.2 g of the above polyamic acid copolymer was taken out, and the solid content was diluted to 15.8% with N,N-dimethylacetamide (DMAc), and the solution was applied to a glass plate using a doctor blade with a gap of 400 μm. cloth. The coated samples were placed in a 50°C oven for 20 minutes, then slowly heated to 170°C for 20 minutes, and then the oven was heated to 260°C for 20 minutes as the final treatment.
上述的制作方法无法成膜。The above-mentioned production method cannot form a film.
<比较例3><Comparative Example 3>
聚酰胺酸共聚物的制作Production of polyamic acid copolymer
其制作方法与实施例3相同。The preparation method is the same as that of Example 3.
聚酰亚胺膜的制作Production of polyimide film
在上述聚酰胺酸共聚物中取出54.4克,并使用N,N-二甲基乙酰胺(DMAc)将固体含量稀释至为17%,之后依序添加4.3毫升的3-甲基吡啶与12.5毫升的醋酸酐,在搅拌后快速凝胶化,因此无法成膜。In the above polyamic acid copolymer, 54.4 g was taken out, and the solid content was diluted to 17% with N,N-dimethylacetamide (DMAc), and then 4.3 ml of 3-picoline and 12.5 ml of 3-picoline were added sequentially. acetic anhydride rapidly gels after stirring, so it cannot form a film.
<比较例4><Comparative Example 4>
聚酰胺酸共聚物的制作Production of polyamic acid copolymer
其制作方法与实施例3相同。The preparation method is the same as that of Example 3.
聚酰亚胺膜的制作Production of polyimide film
在上述聚酰胺酸共聚物中取出20.2克,并使用N,N-二甲基乙酰胺(DMAc)将固体含量稀释至为15.8%,将溶液涂布到玻璃板后使用600μm间隙的刮刀进行涂布。将涂布完成的样品置放于50℃烘箱烘烤20分钟,再缓慢升温至170℃烘烤20分钟后,再将烘箱升温至260℃烘烤20分钟作为最终处理。20.2 g of the above polyamic acid copolymer was taken out, and the solid content was diluted to 15.8% with N,N-dimethylacetamide (DMAc), and the solution was applied to a glass plate using a doctor blade with a gap of 600 μm. cloth. The coated samples were placed in a 50°C oven for 20 minutes, then slowly heated to 170°C for 20 minutes, and then the oven was heated to 260°C for 20 minutes as the final treatment.
可制成色度b*为3.8的聚酰亚胺膜。It can be made into a polyimide film with a chromaticity b* of 3.8.
实验比较表Experimental comparison table
X:无法成膜;O:可以成膜X: Can not form film; O: Can form film
上述特定实施例的内容是为了详细说明本发明,然而,该等实施例仅用于说明,并非意欲限制本发明。熟习本领域的技艺者可理解,在不悖离后附申请专利范围所界定的范畴下针对本发明。所进行的各种变化或修改均落入本发明的一部分。The contents of the above-mentioned specific embodiments are intended to illustrate the present invention in detail, however, these embodiments are only for illustration and are not intended to limit the present invention. It will be understood by those skilled in the art that the present invention is directed to the present invention without departing from the scope defined by the appended claims. Various changes or modifications made are part of the present invention.
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5053480A (en) * | 1983-06-25 | 1991-10-01 | Nissan Chemical Industries, Ltd. | Polyimide resin from cyclobutane tetracarboxylic acid dianhydride |
| US6489431B1 (en) * | 1998-10-13 | 2002-12-03 | Nissan Chemical Industries, Ltd. | Polyimide precursors and polyimides |
| WO2010131442A1 (en) * | 2009-05-12 | 2010-11-18 | 株式会社カネカ | Process for producing polyamic acid solution, and polyimide film |
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-
2018
- 2018-11-22 CN CN201811400504.7A patent/CN111205457B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5053480A (en) * | 1983-06-25 | 1991-10-01 | Nissan Chemical Industries, Ltd. | Polyimide resin from cyclobutane tetracarboxylic acid dianhydride |
| US6489431B1 (en) * | 1998-10-13 | 2002-12-03 | Nissan Chemical Industries, Ltd. | Polyimide precursors and polyimides |
| WO2010131442A1 (en) * | 2009-05-12 | 2010-11-18 | 株式会社カネカ | Process for producing polyamic acid solution, and polyimide film |
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