CN111308586A - Deep-pattern film and manufacturing method thereof - Google Patents
Deep-pattern film and manufacturing method thereof Download PDFInfo
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- CN111308586A CN111308586A CN202010204824.6A CN202010204824A CN111308586A CN 111308586 A CN111308586 A CN 111308586A CN 202010204824 A CN202010204824 A CN 202010204824A CN 111308586 A CN111308586 A CN 111308586A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 23
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- 238000003848 UV Light-Curing Methods 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- 238000000059 patterning Methods 0.000 claims description 7
- 239000011248 coating agent Substances 0.000 claims description 6
- 239000000126 substance Substances 0.000 claims description 6
- 238000001746 injection moulding Methods 0.000 claims description 5
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000007731 hot pressing Methods 0.000 claims description 4
- 238000011068 loading method Methods 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 abstract description 181
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- 238000010030 laminating Methods 0.000 abstract description 4
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- 239000003292 glue Substances 0.000 description 6
- 238000005034 decoration Methods 0.000 description 4
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- 229920005644 polyethylene terephthalate glycol copolymer Polymers 0.000 description 3
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- 238000009501 film coating Methods 0.000 description 1
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B1/00—Optical elements characterised by the material of which they are made; Optical coatings for optical elements
- G02B1/10—Optical coatings produced by application to, or surface treatment of, optical elements
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
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Abstract
The invention belongs to the technical field of optical lenses, and relates to a deep pattern layer film and a manufacturing method thereof, wherein the manufacturing method of the deep pattern layer film is characterized by comprising the following steps of providing a pattern protective layer; forming a deep pattern layer on the first side surface of the pattern protection layer; forming a dielectric layer on the surface of the deep-texture pattern layer; and forming a base layer on the surface of the dielectric layer. A deep-grained pattern layer film is suitable for the anti-counterfeiting field of identification cards, and the structure of the deep-grained pattern layer film is a multilayer layered structure which is overlapped and arranged from top to bottom according to a fixed sequence. The deep-line pattern layer is printed with deep-line pattern structure information; the dielectric layer can enhance the reflectivity of the deep-grained pattern and can prevent the pattern from cracking in the laminating process; the bonding layer is firmly attached to the lower layer; and the base layer is used as a support of the whole laminated structure and is combined with the card body. The deep-pattern layer film can be firmly connected with the card body.
Description
Technical Field
The invention belongs to the technical field of optical lenses, and relates to a deep-pattern layer film and a manufacturing method thereof.
Background
Compared with the holographic grating structure, the optical structure of the deep-line pattern has larger size and is generally processed by a high-precision machine tool. Depending on the reflection and diffraction principle of light, the three-dimensional light variable effect with bright silvery color can be presented under the light, and the three-dimensional light variable effect is very suitable for product decoration. Common deep-grain patterns comprise Fresnel lenses, white light relief patterns and the like, and are widely applied to the field of anti-counterfeiting packaging. The deep-line pattern has complex structural design, high processing difficulty and high processing cost, so the imitation difficulty is high. The special optical structure can not realize copy by using a scanning mode, plays a role in copy prevention and has a certain anti-counterfeiting function. However, the anti-counterfeiting decoration field of the identification card is limited by various factors and cannot be applied all the time. The main factors are: the optical structure depth of the deep-striped pattern is typically around 5um or even greater. The structure depth of the holographic pattern which is widely applied to the certificate card and processed by the hot pressing process is less than 2um at present, and the deeper structure inevitably has the problems of incomplete pattern transfer or pattern fission; the technology of the deep-line pattern in the field of packaging is difficult to be directly used for the anti-counterfeiting of the identification card. The film coating process generally adopted in the packaging industry mainly aims at paper materials and is not suitable for the application of plastic card body materials.
Disclosure of Invention
In order to solve the problems, the invention develops a deep-grained graphic film suitable for certificate and card decoration and anti-counterfeiting and a manufacturing method thereof. The deep-line pattern layer film enables the deep-line pattern to be well applied to the certificate card by changing the film covering mode, the deep-line transfer process and other methods, so that the deep-line pattern layer film has a decoration effect and a certain anti-counterfeiting function.
The purpose of the invention can be realized by the following technical scheme:
in one aspect, the present invention provides a method for forming a deep pattern layer, comprising,
providing a pattern protection layer;
forming a deep pattern layer on the first side surface of the pattern protection layer;
forming a dielectric layer on the surface of the deep-texture pattern layer;
and forming a base layer on the surface of the dielectric layer.
Preferably, the method for manufacturing a deep pattern layer further includes:
and forming a bonding layer between the dielectric layer and the base layer.
Preferably, the method for manufacturing a deep pattern layer further includes:
and coating the second side surface of the pattern protection layer to form a printing enhancement layer.
Preferably, the above method for manufacturing a deep pattern layer, wherein the forming a deep pattern layer on the first side of the pattern protection layer specifically includes:
loading UV curing resin on the first side of the pattern protection layer through a silk-screen or coating process;
carrying out hot-pressing treatment on the UV curing resin so as to enable the UV curing resin to be attached to a preset metal material to form a deep-grain pattern bearing layer;
and hardening the deep pattern bearing layer, and demolding after the hardening treatment is finished to form the deep pattern layer.
Preferably, the above method for manufacturing a deep pattern layer film, wherein forming a dielectric layer on the surface of the deep pattern layer specifically includes:
and carrying out chemical or electromagnetic coating on the surface of the deep-grain pattern layer to form the dielectric layer.
Preferably, the above method for manufacturing a deep pattern layer, wherein forming the deep pattern layer on the first side of the pattern protection layer specifically includes:
and performing injection molding and heating and pressurizing on the first side surface of the pattern protection layer to form the deep pattern layer.
In another aspect, the present invention further provides a deep pattern layer, which includes:
a pattern protection layer;
the deep pattern layer is arranged on the first side surface of the pattern protection layer;
the dielectric layer is arranged on the surface of the deep-grain pattern layer;
and the base layer is arranged on the surface of the medium layer.
Preferably, the above deep pattern layer film further comprises:
and the bonding layer is arranged between the dielectric layer and the base layer.
Preferably, the above deep pattern layer film further comprises:
and the printing enhancement layer is arranged on the second side surface of the pattern protection layer.
Preferably, the deep pattern layer film is a tooth-shaped, rectangular, sinusoidal or polygonal film.
In another aspect, the present invention further provides a deep pattern layer, which includes:
a pattern protection layer;
the deep pattern layer is arranged on the first side surface of the pattern protection layer; patterning the deep pattern layer to form deep pattern information;
the dielectric layer is arranged on the surface of the deep-grain pattern layer;
and the base layer is arranged on the surface of the medium layer.
The deep-pattern graphic layer film formed by the invention is suitable for the anti-counterfeiting field of the certificate card, and the structure of the deep-pattern graphic layer film is a multilayer layered structure which is overlapped and arranged from top to bottom according to a fixed sequence. The deep-line pattern layer is printed with deep-line pattern structure information; the dielectric layer can enhance the reflectivity of the deep-grained pattern and can prevent the pattern from cracking in the laminating process; the bonding layer is firmly attached to the lower layer; and the base layer is used as a support of the whole laminated structure and is combined with the card body. The deep-pattern layer film can be firmly connected with the card body.
Drawings
FIG. 1 is a schematic flow chart illustrating a method for fabricating a deep pattern layer film according to an embodiment of the present invention;
FIG. 2 is a schematic view of a deep pattern layer according to an embodiment of the present invention;
FIG. 3 is a schematic view of a deep pattern layer according to an embodiment of the present invention.
Detailed Description
The following are specific embodiments of the present invention and are further described with reference to the drawings, but the present invention is not limited to these embodiments.
In one aspect, as shown in fig. 1, the present invention provides a method for fabricating a deep pattern layer, which includes,
step S110, providing a pattern protection layer; the pattern protection layer is a high-light-transmittance film, and can be made of any one of materials such as PET, PVC, PETG or PC. The film is used as a bearing film layer of the deep pattern layer in the preparation process and plays a role in protecting pattern information at the later stage, and the thickness of the pattern protective layer is preferably between 12um and 25 um.
And S120, forming a deep pattern layer on the first side surface of the pattern protection layer, wherein the deep pattern layer is an optical variable device different from a holographic pattern, and the depth range of the deep pattern layer is 2 um-50 um. The deep texture structure can be tooth-shaped, rectangular and sinusoidal. The deep-line pattern can present a white light relief pattern or a Fresnel lens under visible light, the visual effect of the deep-line pattern is represented as a three-dimensional or motion state, and the deep-line pattern has a good appearance decorative effect and an anti-counterfeiting function.
The deep texture pattern layer can be directly formed on the surface of the pattern protection layer, or can be formed separately.
Step S130, forming a dielectric layer on the surface of the deep-texture pattern layer; the dielectric layer can be a film formed by metal simple substances or compound substances, the material of the dielectric layer can be simple substances such as Cr, Al, Ni, Zn and the like or oxides or sulfides thereof, and the thickness of the dielectric layer can be 200-500 angstroms. Meanwhile, the dielectric layer can effectively avoid the problem of pattern loading layer fracture in the later lamination process, and further plays a role in lamination protection.
Step S140, forming a base layer on the surface of the dielectric layer. The base layer is generally made of common materials such as PVC, PETG, PC or ABS, and the thickness is preferably 75-250 um, and the base layer and the card body can be combined by using a laminating mode.
As a further preferable aspect, the method for manufacturing a deep pattern layer film described above further includes:
step S150, a bonding layer is formed between the dielectric layer and the base layer. The bonding layer is any one of aqueous polyurethane system glue, solvent-free composite glue, epoxy resin glue, polypropylene glue, UV composite glue and hot melt glue, and the thickness of the bonding layer is 0.5-10 um.
As a further preferable aspect, the method for manufacturing a deep pattern layer film described above further includes:
and step S160, coating and forming a printing enhancement layer on the second side surface of the pattern protection layer. The printing enhancement layer is mainly used for enhancing the adhesive force of printing ink so that the surface of the printing enhancement layer can be subjected to printing or printing operation. The printing enhancement layer can be made of acrylic or polyurethane, and the thickness range of the printing enhancement layer is 0.1-1 um.
As a further preferable aspect, in the above method for manufacturing a deep pattern layer, the step S120 of forming the deep pattern layer on the first side of the pattern protection layer specifically includes:
s12011, loading UV curing resin on the first side surface of the pattern protection layer through a silk-screen printing or coating process;
s12012, carrying out hot-pressing treatment on the UV curing resin so that the UV curing resin is attached to a preset metal material to form a deep-pattern bearing layer;
s12013, hardening the deep pattern bearing layer, and demolding after the hardening is finished to form the deep pattern layer.
As a further preferred embodiment, the above method for manufacturing a deep-texture patterned layer film, wherein the forming of a dielectric layer on the surface of the deep-texture patterned layer specifically includes:
and carrying out chemical or electromagnetic coating on the surface of the deep-grain pattern layer to form the dielectric layer.
As a further preferred embodiment, in the above method for manufacturing a deep pattern layer film, when PVC, PE, PC, PETG, ABS, OPP, and the like are used as the pattern protecting layer material, the step of forming the deep pattern layer on the first side of the pattern protecting layer specifically includes:
and patterning the first side surface of the pattern protection layer to form the deep pattern layer, wherein the patterning at least comprises injection molding and heating and pressurizing modes. Because the pattern protective layer material has good thermoplastic performance, the deep pattern can be directly transferred onto the pattern protective layer in a heating and pressurizing mode by using an injection molding mode, and thus, the pattern transfer is completed. The injection molding process does not need to coat or screen print the pattern protection layer), the number of structural layers is reduced, and the material cost is reduced.
The deep-pattern graphic layer film formed by the invention is suitable for the anti-counterfeiting field of the certificate card, and the structure of the deep-pattern graphic layer film is a multilayer layered structure which is overlapped and arranged from top to bottom according to a fixed sequence. The deep-line pattern layer is printed with deep-line pattern structure information; the dielectric layer can enhance the reflectivity of the deep-grained pattern and can prevent the pattern from cracking in the laminating process; the bonding layer is firmly attached to the lower layer; and the base layer is used as a support of the whole laminated structure and is combined with the card body. The deep-pattern layer film can be firmly connected with the card body.
Example two
As shown in fig. 2, in another aspect, the present invention further provides a deep pattern layer, which includes:
the pattern protection layer 1 is subjected to patterning treatment to form a deep-texture pattern layer; wherein, the shape of the deep pattern layer 2 is tooth-shaped, and/or rectangular, and/or sinusoidal, and/or polygonal.
The dielectric layer 3 is arranged on the surface of the deep-grain pattern layer;
and the base layer 6 is arranged on the surface of the dielectric layer 3.
As a further preferred embodiment, the above deep pattern layer film further comprises:
and the bonding layer 5 is arranged between the dielectric layer 3 and the base layer 6.
As a further preferred embodiment, the above deep pattern layer film further comprises:
and the printing enhancement layer 4 is arranged on the second side surface of the pattern protection layer 1.
The deep pattern layer film is formed by the deep pattern layer film manufacturing method, and the technical effects of the deep pattern layer film are not described herein.
EXAMPLE III
As shown in FIG. 3, in another aspect, the present invention further provides a deep pattern layer, which comprises
A deep-line graphic layer film, comprising:
a pattern protection layer 1;
the deep pattern layer 2 is arranged on the first side surface of the pattern protection layer and is subjected to patterning treatment to form deep pattern information, wherein the shape of the deep pattern layer 2 is tooth shape, and/or rectangular shape, and/or sinusoidal shape, and/or broken line shape;
the dielectric layer 3 is arranged on the surface of the deep pattern layer 2;
and the base layer 6 is arranged on the surface of the dielectric layer 3.
The deep pattern layer film is formed by the deep pattern layer film manufacturing method, and the technical effects of the deep pattern layer film are not described herein.
The specific embodiments described herein are merely illustrative of the spirit of the invention. Various modifications or additions may be made to the described embodiments or alternatives may be employed by those skilled in the art without departing from the spirit or ambit of the invention as defined in the appended claims.
Claims (10)
1. A method for manufacturing a deep-pattern layer film is characterized by comprising the following steps,
providing a pattern protection layer;
forming a deep pattern layer on the first side surface of the pattern protection layer;
forming a dielectric layer on the surface of the deep-texture pattern layer;
and forming a base layer on the surface of the dielectric layer.
2. The method for producing a deep texture pattern layer film according to claim 1, further comprising:
and forming a bonding layer between the dielectric layer and the base layer.
3. The method for producing a deep texture pattern layer film according to claim 1, further comprising:
and coating the second side surface of the pattern protection layer to form a printing enhancement layer.
4. The method of claim 2, wherein forming the deep pattern layer on the first side of the pattern protection layer specifically comprises:
loading UV curing resin on the first side of the pattern protection layer through a silk-screen or coating process;
carrying out hot-pressing treatment on the UV curing resin so as to enable the UV curing resin to be attached to a preset metal material to form a deep-grain pattern bearing layer;
and hardening the deep pattern bearing layer, and demolding after the hardening treatment is finished to form the deep pattern layer.
5. The method for producing a deep-groove patterned layer film according to claim 1, wherein forming a dielectric layer on the surface of the deep-groove patterned layer specifically comprises:
and carrying out chemical or electromagnetic coating on the surface of the deep-grain pattern layer to form the dielectric layer.
6. The method for producing a deep texture pattern layer film as defined in claim 1, wherein,
forming a deep pattern layer on the first side of the pattern protection layer specifically comprises:
and performing injection molding and heating and pressurizing on the first side surface of the pattern protection layer to form the deep pattern layer.
7. A deep-line graphic layer comprising:
a pattern protection layer; patterning the first side surface of the pattern protection layer to form a deep pattern layer;
the dielectric layer is arranged on the surface of the deep-grain pattern layer;
and the base layer is arranged on the surface of the medium layer.
8. The deep texture pattern layer film as set forth in claim 7, further comprising:
and the bonding layer is arranged between the dielectric layer and the base layer.
9. The deep texture pattern layer film as set forth in claim 7, further comprising:
and the printing enhancement layer is arranged on the second side surface of the pattern protection layer.
10. A deep-line graphic layer comprising:
a pattern protection layer;
the deep pattern layer is arranged on the first side surface of the pattern protection layer and is subjected to patterning treatment to form deep pattern information;
the dielectric layer is arranged on the surface of the deep-grain pattern layer;
and the base layer is arranged on the surface of the medium layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010204824.6A CN111308586A (en) | 2020-03-25 | 2020-03-25 | Deep-pattern film and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010204824.6A CN111308586A (en) | 2020-03-25 | 2020-03-25 | Deep-pattern film and manufacturing method thereof |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005014482A (en) * | 2003-06-27 | 2005-01-20 | Toppan Printing Co Ltd | Anti-counterfeit medium, verification method thereof, and transfer sheet for anti-counterfeit medium |
| CN101120139A (en) * | 2005-02-18 | 2008-02-06 | 捷德有限公司 | Security element and method of manufacturing the same |
| JP2012144010A (en) * | 2011-01-14 | 2012-08-02 | Toppan Printing Co Ltd | Forgery preventing medium, and printed matter |
| CN104395097A (en) * | 2012-06-27 | 2015-03-04 | 联邦印刷有限公司 | Safety element having microstructures having diffractive structures, and a method for manufacture and verification |
| CN211402798U (en) * | 2020-03-25 | 2020-09-01 | 上海宏盾防伪材料有限公司 | Deep-line pattern layer film |
-
2020
- 2020-03-25 CN CN202010204824.6A patent/CN111308586A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2005014482A (en) * | 2003-06-27 | 2005-01-20 | Toppan Printing Co Ltd | Anti-counterfeit medium, verification method thereof, and transfer sheet for anti-counterfeit medium |
| CN101120139A (en) * | 2005-02-18 | 2008-02-06 | 捷德有限公司 | Security element and method of manufacturing the same |
| JP2012144010A (en) * | 2011-01-14 | 2012-08-02 | Toppan Printing Co Ltd | Forgery preventing medium, and printed matter |
| CN104395097A (en) * | 2012-06-27 | 2015-03-04 | 联邦印刷有限公司 | Safety element having microstructures having diffractive structures, and a method for manufacture and verification |
| CN211402798U (en) * | 2020-03-25 | 2020-09-01 | 上海宏盾防伪材料有限公司 | Deep-line pattern layer film |
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