CN111341220B - Single-color LED display screen module with laminated circuit - Google Patents
Single-color LED display screen module with laminated circuit Download PDFInfo
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- CN111341220B CN111341220B CN202010209444.1A CN202010209444A CN111341220B CN 111341220 B CN111341220 B CN 111341220B CN 202010209444 A CN202010209444 A CN 202010209444A CN 111341220 B CN111341220 B CN 111341220B
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000003466 welding Methods 0.000 claims abstract description 10
- 239000011889 copper foil Substances 0.000 claims abstract description 9
- 230000003321 amplification Effects 0.000 claims description 6
- 238000003199 nucleic acid amplification method Methods 0.000 claims description 6
- HEFNNWSXXWATRW-UHFFFAOYSA-N Ibuprofen Chemical compound CC(C)CC1=CC=C(C(C)C(O)=O)C=C1 HEFNNWSXXWATRW-UHFFFAOYSA-N 0.000 claims description 3
- 238000003491 array Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 16
- 238000000034 method Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 11
- 230000008901 benefit Effects 0.000 description 4
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- 101150093676 HUB2 gene Proteins 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000002910 solid waste Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Classifications
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
- G09G3/22—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources
- G09G3/30—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels
- G09G3/32—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters using controlled light sources using electroluminescent panels semiconductive, e.g. using light-emitting diodes [LED]
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Computer Hardware Design (AREA)
- Control Of Indicators Other Than Cathode Ray Tubes (AREA)
Abstract
The invention discloses a monochromatic LED display screen module with laminated lines, which comprises a circuit board, a drive integrated chip and an LED array group, wherein: the circuit board adopts a single-sided copper foil circuit board, the driving integrated chip and the LED array group are arranged on the same side of the circuit board, and the driving integrated chip drives the LED array group to work; the driving integrated chip comprises a first signal interface chip, an interface control chip, a column driving chip and a row driving chip, wherein the first signal interface chip is used for being connected with an external MCU, and the interface control chip receives a first control signal of the external MCU through being connected with the first signal interface chip; the column driving chip is connected with the interface control chip; the row driving chip is connected with the interface control chip; the invention realizes one-step assembly and welding by the single-sided copper foil circuit, reduces complex procedures, simplifies connecting circuits by using laminated circuits, improves system reliability, improves production efficiency and reduces production cost.
Description
Technical Field
The invention relates to the technical field of LED display screens, in particular to a monochromatic LED display screen module with a laminated circuit.
Background
The LED display screen is a device which consists of small LED module panels and is used for displaying information such as characters, images and videos. The LED display screen is divided into a single-color LED display screen and a color LED display screen, and the single-color LED display screen is widely used in markets, shops and squares because of low cost and low power consumption, and the main stream LED display screen in the current market is mainly assembled on a multi-layer circuit board by adopting direct-insert LED lamps, patch LED lamps or constant current/constant voltage chips to realize the display function.
The design and production of the circuit board mainly remove redundant copper on the copper-clad plate and form a circuit, the multilayer printed board also needs to be connected and conducted with each layer, and as the circuit board is more and more complex, the production process is complex, each process has chemical substances entering wastewater or generating solid waste, and serious pollution is caused to the environment due to improper treatment; with the continuous expansion of market demands, competition is more and more intense, and products lose competitiveness due to poor system reliability, low production efficiency and high cost.
Disclosure of Invention
The invention aims to provide a single-color LED display screen module with a laminated circuit, which realizes one-time assembly and welding through a single-sided copper foil circuit, reduces complex procedures, simplifies connecting circuits by using the laminated circuit, improves system reliability, improves production efficiency and reduces production cost.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
a monochromatic LED display screen module with laminated lines comprises a circuit board, a drive integrated chip and an LED array group, wherein:
The circuit board adopts a single-sided copper foil circuit board, the driving integrated chip and the LED array group are arranged on the same side of the circuit board, and the driving integrated chip drives the LED array group to work;
The driving integrated chip comprises a first signal interface chip, an interface control chip, a column driving chip and a row driving chip, wherein the first signal interface chip is used for being connected with an external MCU, and the interface control chip receives a first control signal of the external MCU through being connected with the first signal interface chip; the first control signal includes an enable signal OEIN, a row signal AIN, a row signal BIN, a clock signal CLKIN, a latch signal LATIN, and a shift signal DRIN; the first control signal is amplified by the interface control chip and then outputs a second control signal and a row decoding signal, the first control signal comprises an enabling signal OEOUT, a row signal AOUT, a row signal BOUT, a clock signal CLKOUT, a latch signal LATOUT, a shift signal SDIOUT and a data negation signal, and the row decoding signal comprises Y1, Y2, Y3 and Y4;
The column driving chip is connected with the interface control chip, and receives the clock signal CLKOUT, the latch signal LATOUT and the data inverting signal, and outputs a column driving signal after the amplification processing of the column driving chip; the LED array group is connected with the column driving chip and receives column driving signals;
The row driving chip is connected with the interface control chip, receives row decoding signals Y1, Y2, Y3 and Y4, and outputs row driving signals after the amplification treatment of the row driving chip; the LED array group is connected with the row driving chip and receives a row driving signal;
The LED array group is formed by sequentially connecting a plurality of LED lamps, and the LED lamps are connected through row lines and column lines; the circuit board is provided with a plurality of bonding pad groups for welding the LED lamps, each bonding pad group is provided with 4 bonding pads which are respectively a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad, and the 4 bonding pads are arranged at intervals; the first bonding pad is connected with the first bonding pad of the next bonding pad group through a row line, the third bonding pad is connected with the third bonding pad of the next bonding pad group through a row line, and the row line passes through the interval between the second bonding pad and the fourth bonding pad; the second pad is connected with a fourth pad of the next pad group through a column line.
Further, the column driving chip is provided with 8 column driving chips in total, namely UR1, UR2, UR3, UR4, UR5, UR6, UR7 and UR8, which are sequentially connected, wherein the column driving chip comprises a CLK pin and an LE pin, the CLK pin of the 8 column driving chips is connected and receives a clock signal CLKOUT of the interface control chip, and the LE pin of the 8 column driving chips is connected and receives a latch signal LATOUT of the interface control chip; the second signal interface chip is respectively connected with the CLK pin and the LE pin of the column driving chip.
Further, the column driving chips further include an SDI pin for receiving data and an SDO pin for outputting data, and the SDO pin of each column driving chip is connected with the SDI pin of the next column driving chip.
Further, the column driving chip also comprises an OE pin for controlling the output end to output an enabling signal and an R-EXT pin for setting the constant value of the output end; the R-EXT pins of the UR1, the UR2, the UR3, the UR4, the UR5, the UR6, the UR7 and the UR8 are externally connected with a resistor which is connected with the OE pin and is grounded.
Further, the row driving chip is provided with 4 row driving chips H1, H2, H3 and H4, and each driving chip controls 2 rows of LED arrays.
Further, the patch LED lamp adopts a monochromatic patch LED lamp comprising single red, single green, single blue, single white and single purple.
Further, the driving integrated chip further includes a second signal interface chip, which is connected to the interface control chip and receives the enable signal OEOUT, the row signal AOUT, the row signal BOUT, and the shift signal SDIOUT.
After the technical scheme is adopted, compared with the background technology, the invention has the following advantages:
1. The invention drives the LED array group to work on the single-sided copper foil circuit board through driving the integrated chip, utilizes the first signal interface chip to receive the first control signal of the external MCU and transmit to the interface control chip, converts the first control signal into the second control signal through the interface control chip and transmits to the row driving chip and the column driving chip, and controls the LED array group to work through the row driving chip and the column driving chip; the LED lamp is welded through the bonding pad group, the connecting circuit is reduced by using the laminated circuit, the reliability of the system is improved, the production efficiency is improved, and the production cost is reduced.
2. According to the invention, the bonding pad groups on the circuit board are used for welding the patch LED lamps, each bonding pad group is provided with 4 bonding pads, the LED lamps are connected through the row lines and the column lines, the row lines penetrate through the second bonding pad and the fourth bonding pad at intervals, the column lines are connected with the second bonding pad and the fourth bonding pad of two adjacent bonding pad groups, the self-carried welding spots of the patch LED lamps are fully utilized, the bonding pads are convenient to assemble, the connecting lines are reduced, and the production efficiency is improved.
Drawings
FIG. 1 is a circuit diagram of a driver integrated chip according to the present invention;
FIG. 2 is a circuit block diagram of an LED array set of the present invention;
FIG. 3 is a circuit diagram of a first signal interface chip according to the present invention;
FIG. 4 is a circuit diagram of an interface control chip of the present invention;
FIG. 5 is a circuit diagram of a column driver chip of the present invention;
FIG. 6 is a circuit configuration diagram of column driver chips UR1 through UR3 of the present invention;
FIG. 7 is a circuit diagram of a column driver chip UR2 according to the present invention;
FIG. 8 is a circuit block diagram of a row driver chip of the present invention;
FIG. 9 is a circuit diagram of a second signal interface chip of the present invention;
FIG. 10 is an enlarged view of FIG. 2A;
FIG. 11 is a circuit diagram of a row line, column line and pad set of the present invention.
Reference numerals illustrate:
Pad group.1, first pad.11, second pad.12, third pad.13, fourth pad.14, row line.2, column line.3.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
It should be noted that, in the present invention, terms "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are all based on the orientation or positional relationship shown in the drawings, and are merely for convenience of describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or element of the present invention must have a specific orientation, and thus should not be construed as limiting the present invention.
Examples
The invention discloses a monochromatic LED display screen module with laminated lines, which is shown in the drawings from 1 to 11, and comprises a circuit board, a driving integrated chip and an LED array group, wherein:
With reference to fig. 1 and 2, the circuit board is a single-sided copper foil circuit board, the driving integrated chip and the LED array group are arranged on the same side of the circuit board, and the driving integrated chip drives the LED array group to work; the level of the same quality: the production cost of the single-sided circuit board is less than 60% of that of the double-sided circuit board or the multi-layer circuit board, the social benefit is good, and the environmental protection contribution value to the industry is also large, so that the production cost is consistent with the national aim of reducing the carbon dioxide emission in Paris climate agreement.
With reference to fig. 1, 3 and 4, the driving integrated chip includes a first signal interface chip, an interface control chip, a column driving chip and a row driving chip, where the first signal interface chip is used to connect with an external MCU, and the interface control chip receives a first control signal of the external MCU by connecting with the first signal interface chip; the first control signal includes an enable signal OEIN, a row signal AIN, a row signal BIN, a clock signal CLKIN, a latch signal LATIN, and a shift signal DRIN; the first control signal is amplified by the interface control chip and then outputs a second control signal and a row decoding signal, wherein the first control signal comprises an enabling signal OEOUT, a row signal AOUT, a row signal BOUT, a clock signal CLKOUT, a latch signal LATOUT, a shift signal SDIOUT and a data inverting signal, and the row decoding signal comprises Y1, Y2, Y3 and Y4; the interface control chip of the embodiment is preferably a 16-bit constant current source DP4536, and DP4536 is not limited to the interface control chip of the embodiment, and DP4536 has the advantages of low power consumption and high performance, and the pin diagram of DP4536 is shown in table 1.
Table 1 shows a pin map of DP4536
With reference to fig. 1, 3, 4, 5, 6 and 7, the column driving chip is connected to the interface control chip, and receives the clock signal CLKOUT, the latch signal LATOUT and the data inversion signal, and outputs a column driving signal after the amplification of the column driving chip; the LED array group is connected with the column driving chip and receives column driving signals.
The column driving chip is provided with 8 column driving chips in total, namely UR1, UR2, UR3, UR4, UR5, UR6, UR7 and UR8, wherein the column driving chip comprises a CLK pin and an LE pin, the CLK pin of the 8 column driving chips is connected with and receives a clock signal CLKOUT of the interface control chip, and the LE pin of the 8 column driving chips is connected with and receives a latch signal LATOUT of the interface control chip; the second signal interface chip is respectively connected with the CLK pin and the LE pin of the column driving chip.
The column driving chips further include an SDI pin for receiving data and an SDO pin for outputting data, and the SDO pin of each column driving chip is connected with the SDI pin of the next column driving chip.
The column driving chip also comprises an OE pin for controlling the output end to output an enabling signal and an R-EXT pin for setting the constant value of the output end; the R-EXT pins of UR1, UR2, UR3, UR4, UR5, UR6, UR7 and UR8 are externally connected with a resistor which is connected with the OE pin and is grounded at the same time; the column driving chip reduces connecting lines through the laminated design lines, reduces wiring area of a circuit board, such as column driving chip UR2, reduces cost and improves system reliability; the column driver chip of the present embodiment is preferably DP5020, and DP5020 is not limited to the column driver chip of the present embodiment.
With reference to fig. 1, 2 and 8, the row driving chip is connected to the interface control chip, receives the row decoding signals Y1, Y2, Y3 and Y4, and outputs a row driving signal after the amplification of the row driving chip; the LED array group is connected with the row driving chip and receives the row driving signals.
The row driving chip is provided with 4 row driving chips H1, H2, H3 and H4, and each driving chip controls 2 rows of LED arrays; the row driver chip of the present embodiment is preferably 74HC4953, and 74HC4953 is not limited to the row driver chip of the present embodiment.
With reference to fig. 1 and 9, the driving integrated chip further includes a second signal interface chip, where the second signal interface chip is connected to the interface control chip and receives the enable signal OEOUT, the row signal AOUT, the row signal BOUT, and the shift signal SDIOUT; the first signal interface chip and the second signal interface chip of the present embodiment are preferably HUB12, and HUB2 is not limited to the first signal interface chip and the second signal interface chip of the present embodiment.
With reference to fig. 1, 2, 10 and 11, the LED array group is formed by sequentially connecting a plurality of LED lamps, and the plurality of LED lamps are connected by a row line 2 and a column line 3; the circuit board is provided with a plurality of bonding pad groups 1 for welding LED lamps, each bonding pad group 1 is provided with 4 bonding pads which are respectively a first bonding pad 11, a second bonding pad 12, a third bonding pad 13 and a fourth bonding pad 14, and the 4 bonding pads are mutually arranged at intervals; the first bonding pad 11 is connected with the first bonding pad 11 of the next bonding pad group 1 through a row line 2, the third bonding pad 13 is connected with the third bonding pad 13 of the next bonding pad group 1 through the row line 2, and the row line 2 passes through the interval between the second bonding pad 12 and the fourth bonding pad 14; the second pad 12 is connected to the fourth pad 14 of the next pad group 1 through the column line 3; the patch LED lamp adopts a monochromatic patch LED lamp comprising single red, single green, single blue, single white and single purple; the LED array group is driven to display images, animations and text information through the driving integrated chip; according to the embodiment, through the design of the laminated circuit of the linear constant current driving chip, the connecting circuit is simplified, the centralized control of signals is realized, the output circuit is reduced, the driving integrated chip is placed in the row of the column, the circuit is connected with the corresponding row and the corresponding column from inside to outside, the corresponding control signals and signals are output to the row and the column of the LED array group, and the output function of the image, the animation and the text information of the LED display screen is realized; the bonding pad group 1 on the circuit board is used for welding the patch LED lamp, the self-carrying welding spots of the patch LED lamp are fully utilized, the bonding pad is convenient to assemble, the connecting circuit is reduced, and the production efficiency is improved.
In the production process of the module, the existing double-sided board on the market needs to be firstly attached with chips and then is provided with a fixture of a sleeve, and the corresponding machine equipment is placed for attaching the LED lamp on the other side.
In the embodiment, the LED array group is driven to work on the single-sided copper foil circuit board through the driving integrated chip, the first signal interface chip is used for receiving a first control signal of an external MCU and transmitting the first control signal to the interface control chip, the interface control chip is used for converting the first control signal into a second control signal and transmitting the second control signal to the row driving chip, the column driving chip and the second signal interface chip, and the row driving chip, the column driving chip and the second signal interface chip are used for controlling the LED array group to work; the laminated circuit is utilized to reduce redundant circuits, the circuits are simplified, double-sided or multi-layer circuit boards are not needed, bonding pads and devices are on the same surface, the circuit boards are produced by one-step molding, one-step assembly and welding are realized by utilizing a single-sided copper foil circuit, complex procedures are reduced, the production efficiency is improved, the production cost is reduced, and the reliability of the system is improved.
The present invention is not limited to the above-mentioned embodiments, and any changes or substitutions that can be easily understood by those skilled in the art within the technical scope of the present invention are intended to be included in the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the protection scope of the claims.
Claims (7)
1. The utility model provides a monochromatic LED display screen module with stromatolite circuit which characterized in that includes circuit board, drive integrated chip and LED array group, wherein:
The circuit board adopts a single-sided copper foil circuit board, the driving integrated chip and the LED array group are arranged on the same side of the circuit board, and the driving integrated chip drives the LED array group to work;
The driving integrated chip comprises a first signal interface chip, an interface control chip, a column driving chip and a row driving chip, wherein the first signal interface chip is used for being connected with an external MCU, and the interface control chip receives a first control signal of the external MCU through being connected with the first signal interface chip; the first control signal includes an enable signal OEIN, a row signal AIN, a row signal BIN, a clock signal CLKIN, a latch signal LATIN, and a shift signal DRIN; the first control signal is amplified by the interface control chip and then outputs a second control signal and a row decoding signal, wherein the second control signal comprises an enabling signal OEOUT, a row signal AOUT, a row signal BOUT, a clock signal CLKOUT, a latch signal LATOUT, a shift signal SDIOUT and a data negation signal, and the row decoding signal comprises Y1, Y2, Y3 and Y4;
The column driving chip is connected with the interface control chip, and receives the clock signal CLKOUT, the latch signal LATOUT and the data inverting signal, and outputs a column driving signal after the amplification processing of the column driving chip; the LED array group is connected with the column driving chip and receives column driving signals;
The row driving chip is connected with the interface control chip, receives row decoding signals Y1, Y2, Y3 and Y4, and outputs row driving signals after the amplification treatment of the row driving chip; the LED array group is connected with the row driving chip and receives a row driving signal;
The LED array group is formed by sequentially connecting a plurality of LED lamps, and the LED lamps are connected through row lines and column lines; the circuit board is provided with a plurality of bonding pad groups for welding the LED lamps, each bonding pad group is provided with 4 bonding pads which are respectively a first bonding pad, a second bonding pad, a third bonding pad and a fourth bonding pad, and the 4 bonding pads are arranged at intervals; the first bonding pad is connected with the first bonding pad of the next bonding pad group through a row line, the third bonding pad is connected with the third bonding pad of the next bonding pad group through a row line, and the row line passes through the interval between the second bonding pad and the fourth bonding pad; the second pad is connected with a fourth pad of the next pad group through a column line.
2. A single color LED display module with stacked circuitry as recited in claim 1, wherein: the column driving chip is provided with 8 column driving chips, namely UR1, UR2, UR3, UR4, UR5, UR6, UR7 and UR8, which are sequentially connected, the column driving chip comprises a CLK pin and an LE pin, wherein the CLK pin of the 8 column driving chips is connected and receives a clock signal CLKOUT of the interface control chip, and the LE pin of the 8 column driving chips is connected and receives a latch signal LATOUT of the interface control chip.
3. A single color LED display module with stacked circuitry as recited in claim 2, wherein: the column driving chips further comprise SDI pins for receiving data and SDO pins for outputting data, and the SDO pins of each column driving chip are connected with the SDI pins of the next column driving chip.
4. A single color LED display module with stacked circuitry as recited in claim 2, wherein: the column driving chip also comprises an OE pin for controlling the output end to output an enabling signal and an R-EXT pin for setting the constant value of the output end; the R-EXT pins of the UR1, the UR2, the UR3, the UR4, the UR5, the UR6, the UR7 and the UR8 are externally connected with a resistor which is connected with the OE pin and is grounded.
5. A single color LED display module with stacked circuitry as recited in claim 1, wherein: the row driving chip is provided with 4 row driving chips H1, H2, H3 and H4, and each driving chip controls 2 rows of LED arrays.
6. A single color LED display module with stacked circuitry as defined in claim 5, wherein: the LED lamp adopts a monochromatic patch LED lamp comprising single red, single green, single blue, single white and single purple.
7. A single color LED display module with stacked circuitry as recited in claim 1, wherein: the driving integrated chip further includes a second signal interface chip, which is connected to the interface control chip and receives the enable signal OEOUT, the row signal AOUT, the row signal BOUT, and the shift signal SDIOUT.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010209444.1A CN111341220B (en) | 2020-03-23 | 2020-03-23 | Single-color LED display screen module with laminated circuit |
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| CN202010209444.1A CN111341220B (en) | 2020-03-23 | 2020-03-23 | Single-color LED display screen module with laminated circuit |
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| CN111341220B true CN111341220B (en) | 2024-09-06 |
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| CN211237619U (en) * | 2020-03-23 | 2020-08-11 | 海峡彩亮(漳州)光电有限公司 | Monochromatic LED display screen module with laminated circuit |
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| US7385574B1 (en) * | 1995-12-29 | 2008-06-10 | Cree, Inc. | True color flat panel display module |
| CN203013160U (en) * | 2012-11-05 | 2013-06-19 | 深圳市赫尔诺电子技术有限公司 | Curtain type light-emitting diode (LED) display |
| CN105303983A (en) * | 2015-10-03 | 2016-02-03 | 上海铁歌科技有限公司 | Small-spacing LED full-color display screen achieved by virtue of single-layer PCB board (printed circuit board) |
| CN207233360U (en) * | 2017-08-16 | 2018-04-13 | 深圳市德普微电子有限公司 | A kind of list dual-colored LED display drive circuit |
| KR102173410B1 (en) * | 2019-04-29 | 2020-11-03 | 위인호 | Transparent LED display to display the video content on the transparent LED screen and output digital information |
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