CN111447814A - a heat sink - Google Patents

Abstract

The invention discloses a heat dissipation device, comprising: a heat absorber, a first pipeline, a radiator and a second pipeline; the heat absorber is used for accommodating a fluid and for receiving heat from a heat source, so that the fluid and the heat source can conduct heat. One end of the first pipe is connected to one side of the heat absorber to accommodate the fluid output from the heat absorber; the other end of the radiator is connected to the other end of the first pipe to receive the fluid from the first The fluid in the pipeline enables the fluid to exchange heat with the radiator for output; one end of the second pipeline is connected to the radiator, and the other end of the second pipeline is connected to the other side of the heat sink. Therefore, it is realized by a heat dissipation device, which utilizes material and structural characteristics, and has better efficiency to drive the working fluid, forms a drainage effect, and has better efficacy to drive the fluid, which has better heat absorption and heat dissipation efficiency.

Description

a heat sink

technical field

The invention relates to the field of cooling devices, in particular to a cooling device.

Background technique

The 21st century has been an era of advanced electronic information. Due to the characteristics of semiconductors, all kinds of notebook computers, personal digital assistants (PDAs), servers, smart mobile phones and smart electrical appliances are not available. At the same time, some products are also designed to be light, thin, short, and small, so that people can easily carry them with them, so that they can be used at any time and obtain information in real time. The characteristics of semiconductors are also used in many intelligent machines. Control equipment; the aforementioned electronic information-based products and automatic control equipment all need to be controlled and operated by means of a central processing unit (CPU) and its peripheral electronic components. The central processing unit and the electronic components will generate high temperature during operation, which will affect the operation. Efficiency and product service life, so how to effectively cool the central processing unit and the electronic components has always been one of the main issues to be solved by the industry.

In addition to the heat dissipation requirements of the above-mentioned information industry and automatic control equipment, there are also heat dissipation requirements for engines, motors and batteries in the automotive industry, which all require cooling systems to achieve the purpose of cooling.

The architecture of the cooling system will affect the heat dissipation efficiency of the cooling system. How to further reduce the thermal resistance value of the heat source is the goal of the industry. For the cooling system, how to effectively guide the flow direction of the fluid inside the cooling system. Or/and improve the heat exchange efficiency between the fluid and the suction radiator of the cooling system, and also improve the heat dissipation efficiency of the cooling system.

SUMMARY OF THE INVENTION

The purpose of the present invention is to overcome the deficiencies in the prior art, and provide a heat dissipation device, which, on the one hand, realizes the problem of driving the working fluid with better efficacy; question.

In order to achieve the above purpose, the present invention provides a heat sink, which has a better effect to drive the working fluid. The secondary purpose of the present invention is to provide a heat sink, which has better heat absorption and heat dissipation efficiency. The following specific technology achieved by means of:

In the present invention, in order to achieve the aforementioned purpose, the present invention provides a heat sink, which at least includes a heat sink, a first pipeline, a radiator and a second pipeline; the heat sink is used to accommodate fluid and is used to receive the heat from the heat source, so that the fluid and the heat source exchange heat for output; one end of the first pipeline is connected to one side of the heat absorber to accommodate the fluid output from the heat absorber; the radiator The other end of the first pipeline is connected to the other end of the first pipeline for receiving the fluid from the first pipeline, so that the fluid exchanges heat with the radiator and is output; one end of the second pipeline is connected to the radiator to receive the fluid from the For the fluid output by the radiator, the other end of the second pipeline is connected to the other side of the heat sink for outputting the fluid to the heat sink; wherein the other end of the second pipeline is connected to the other side of the heat sink There is a pore body with a plurality of pores in between, and the two ends of the pore body are respectively connected with the second pipeline and the heat absorber to form a drainage effect and have a better effect to drive the fluid, so as to achieve better performance heat dissipation efficiency.

In one embodiment, the cross-sectional area of the first conduit and the cross-sectional area of the second conduit are selected from the group consisting of the first conduit being equal to the second conduit, and the first conduit being larger than the second conduit. A group of two pipelines.

In one embodiment, the pore body is formed by sintering selected from the group consisting of metal powder and copper powder.

In one embodiment, the fluid output from the heat sink is selected from the group consisting of liquid phase, gas phase and a combination of gas phase and liquid phase.

In one embodiment, the fluid output by the radiator is selected from the group consisting of a liquid phase and a mixture of liquid and gas phases.

In one embodiment, the liquid phase boiling point of the fluid is selected from the group consisting of less than 100 degrees Celsius and less than 50 degrees Celsius.

In one embodiment, a cooling fin and/or a fan is connected to the outside of the heat sink.

Due to the application of the above technical solutions, the technical effects and advantages of the present invention are as follows: it has a better effect to drive the working fluid, forms a drainage effect and has a better effect to drive the fluid, has better heat absorption and heat dissipation efficiency, and also realizes even the entire When the device is placed horizontally, the fluid can also achieve the effect that the fluid can only be placed vertically as in the prior art, which solves the problem of insufficient pressure when placed horizontally.

Description of drawings

In order to illustrate the technical solutions of the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the embodiments. It should be understood that the following drawings only show some embodiments of the present invention, and therefore do not It should be regarded as a limitation of the scope, and for those of ordinary skill in the art, other related drawings can also be obtained according to these drawings without any creative effort.

1 is a schematic structural diagram of Embodiment 1 of a heat dissipation device;

FIG. 2 is a schematic structural diagram of Embodiment 2 of a heat dissipation device.

In the figure: heat absorber 12, first pipeline 14, radiator 16, second pipeline 18, first inner space 22, liquid 24, first inlet 42, first outlet 44, second inner space 62, first Two inlets 82 , a second outlet 84 , and the pore body 19 .

Detailed ways

In order to facilitate understanding of the present invention, the present invention will be described more fully hereinafter with reference to the related drawings. The preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention may be embodied in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that a thorough and complete understanding of the present disclosure is provided.

It should be noted that, in the description of the present invention, unless otherwise specified, "a plurality" means two or more; the terms "upper", "lower", "left", "right", "inside" ", "outside", "front end", "rear end", "head", "tail", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, only for the convenience of describing the present invention and The description is simplified rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the invention.

Meanwhile, in the description of the present invention, unless otherwise expressly specified and limited, the terms "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection, a detachable connection, or an integral connection; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood in specific situations.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terms used herein in the description of the present invention are for the purpose of describing specific embodiments only, and are not intended to limit the present invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

The following is a preferred embodiment of the present invention, and is further described in detail in conjunction with the accompanying drawings as follows:

Example 1

Referring to FIG. 1 , the present invention provides a technical solution: a heat dissipation device.

Below, the specific structure of a heat dissipation device and the connection relationship of each component are described:

The heat dissipation device of the present invention at least includes a heat sink 12, a first pipeline 14, a radiator 16 and a second pipeline 18, wherein the heat sink 12, the first pipeline 14, The radiator 16 and the second pipeline 18 are connected in series to form a closed circuit.

The heat absorber 12 is provided with a first inner space 22 for containing the liquid 24. The heat absorber 12 is used to receive heat from a heat source (not shown in the figure) in a conductive manner, so that the liquid 24 exchanges heat with the heat source. When outputting high temperature liquid phase fluid, gas phase fluid or fluid mixed with liquid phase and gas phase, the boiling point of the liquid 24 can be less than 100 degrees Celsius or less than 50 degrees Celsius, and the heat source can be a central processing unit (CPU), a chip (IC), a servo Generally speaking, the low boiling point of the liquid 24 allows the liquid 24 to exchange heat with the heat source more quickly.

Two ends of the first pipeline 14 are respectively provided with a first inlet 42 and a first outlet 44. The first inlet 42 communicates with one side of the heat absorber 12 and the first inner space 22 of the heat absorber 12. To accommodate the fluid output from the heat sink 12 .

The radiator 16 is provided with a second inner space 62 connected to the first outlet 44 for accommodating the fluid from the first pipeline 14 so that the fluid exchanges heat with the radiator 16 and outputs a low temperature liquid phase Fluid or a fluid mixed with liquid and gas, wherein the outside of the radiator 16 can be connected with cooling fins (not shown in the figure) and/or fans (not shown in the figure) for better heat dissipation efficiency.

Two ends of the second pipeline 18 are respectively provided with a second inlet 82 and a second outlet 84 . The second inlet 82 communicates with the second inner space 62 of the radiator 16 for receiving the fluid output from the radiator 16 , the second outlet 84 communicates with the other side of the heat absorber 12 and the first inner space 22 of the heat absorber 12 for outputting the fluid to the first inner space 22 of the heat absorber 12 .

A pore body 19 with a plurality of pores is disposed between the second outlet 84 and the other side of the heat absorber 12 . The inner space 22 is used by the pores of the pore body 19 to form a pressure difference to generate a drainage effect, which is used to drive the fluid of the closed circuit with better efficiency; wherein, the pore body 19 can be formed by sintering stainless steel powder or copper powder , wherein, the cross-sectional area of the first pipeline 14 and the second pipeline 18 can take the same cross-sectional area, and the drainage effect can be produced by the pores of the pore body 19 .

Example 2

Referring to FIG. 2, the present invention provides a technical solution: a heat dissipation device, wherein the heat absorber 12, the first pipeline 14, the radiator 16 and the second pipeline 18 are connected in series to form a closed loop.

The heat absorber 12 is provided with a first inner space 22 for containing the liquid 24, and the heat absorber 12 is used to receive heat from a heat source (not shown in the figure) in an innovative manner, so that the liquid 24 and the heat are heated Exchange and output high-temperature liquid-phase fluid, gas-phase fluid or fluid-liquid-phase mixed fluid, the boiling point of the liquid 24 can be less than 100 degrees Celsius or less than 50 degrees Celsius, etc. The heat source can be a central processing unit (CPU), a chip (IC), Servers, engines, motors, batteries, etc., generally speaking, the low boiling point of the liquid 24 allows the liquid 24 to exchange heat with the heat more quickly.

Two ends of the first pipeline 14 are respectively provided with a first inlet 42 and a first outlet 44. The first inlet 42 communicates with one side of the heat absorber 12 and the first inner space 22 of the heat absorber 12. To accommodate the fluid output from the heat sink 12 .

The radiator 16 is provided with a second inner space 62 connected to the first outlet 44 for accommodating the fluid from the first pipeline 14 so that the fluid exchanges heat with the radiator 16 and outputs a low temperature liquid phase Fluid or a fluid mixed with liquid and gas, wherein the outside of the radiator 16 can be connected with cooling fins (not shown in the figure) and/or fans (not shown in the figure) for better heat dissipation efficiency.

Two ends of the second pipeline 18 are respectively provided with a second inlet 82 and a second outlet 84 . The second inlet 82 communicates with the second inner space 62 of the radiator 16 for receiving the fluid output from the radiator 16 , the second outlet 84 communicates with the other side of the heat absorber 12 and the first inner space 22 of the heat absorber 12 for outputting the fluid to the first inner space 22 of the heat absorber 12 .

A pore body 19 with a plurality of pores is disposed between the second outlet 84 and the other side of the heat absorber 12 . The inner space 22 is used by the pores of the pore body 19 to form a pressure difference to generate a drainage effect, which is used to drive the fluid of the closed circuit with better efficiency; wherein, the pore body 19 can be formed by sintering stainless steel powder or copper powder , wherein the cross-sectional area of the first pipeline 14 is larger than the cross-sectional area of the second pipeline 18 , and also has a drainage effect to drive the fluid.

The arrow marks shown in FIGS. 1 and 2 indicate the fluid flow direction.

Next, the working principle and usage method of the above-mentioned cooling device will be described:

The heat absorber 12 is contacted with the heat source to exchange heat, that is, the fluid and the heat are exchanged for heat output; then the two ends of the first pipeline 14 are respectively connected with a first inlet 42 and a first outlet 44, and the first An inlet 42 communicates with one side of the heat absorber 12 and the first inner space 22 of the heat absorber 12, so as to accommodate the fluid output from the heat absorber 12; and then the second inner space 62 of the radiator 16 is communicated with the first outlet 44 , to accommodate the fluid from the first pipeline 14, so that the fluid exchanges heat with the radiator 16 for output; the two ends of the second pipeline 18 are respectively provided with a second inlet 82 and a second outlet 84, and the second inlet 82 is connected The second inner space 62 of the radiator 16 can accommodate the fluid output from the radiator 16, and the second outlet 84 is connected to the other side of the heat absorber 16 and the first inner space 22 of the heat absorber 12 to realize the output of the fluid to the The first inner space 22 of the heat sink 12; the connection of the heat sink 12, the first pipeline 14, the radiator 16 and the second pipeline 18 forms a closed loop; and the second outlet 84 is connected to the heat sink 12 A pore body 19 is provided between the other side, and the two ends of the pore body 19 are respectively connected to the second outlet 84 and the first inner space 22 of the heat absorber 12. The outer side of the radiator 16 is connected with heat dissipation fins and/or fans to improve the fan performance. Thermal efficiency.

The above-mentioned embodiments only represent several embodiments of the present invention, and the descriptions thereof are specific and detailed, but should not be construed as a limitation on the scope of the invention patent. It should be pointed out that for those of ordinary skill in the art, without departing from the concept of the present invention, several modifications and improvements can also be made, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention should be subject to the appended claims.

Claims (10)

1. A heat dissipation device, comprising: a heat sink, provided with an internal space to accommodate a fluid, and the heat sink is used to receive heat from a heat source, so that the fluid exchanges heat with the heat source and outputs; A first pipeline, two ends of which are respectively provided with a first inlet and a first outlet, and the first inlet is connected to one side of the heat absorber and the first inner space of the heat absorber, and is used to accommodate the the fluid output by the heat sink; a radiator, which is provided with a second inner space and communicated with the first outlet for receiving the fluid from the first pipeline, so that the fluid exchanges heat with the radiator for output; A second pipeline, two ends of which are respectively provided with a second inlet and a second outlet, the second inlet is connected to the second inner space of the radiator, used to accommodate the fluid output from the radiator, the first The two outlets are connected to the other side of the heat absorber and the first inner space of the heat absorber for outputting the fluid to the first inner space of the heat absorber; Wherein, the connection of the heat absorber, the first pipeline, the radiator and the second pipeline forms a closed loop; Wherein, a pore body with two or more pores is arranged between the second outlet and the other side of the heat absorber, and the two ends of the pore body are respectively connected to the second outlet and the first end of the heat absorber. interior space. 2 . The heat dissipation device of claim 1 , wherein the cross-sectional area of the first pipeline and the cross-sectional area of the second pipeline are selected from the group consisting of the first pipeline equal to the second pipeline. 3 . road, and the first pipeline is larger than the group formed by the second pipeline. 3 . The heat dissipation device of claim 1 , wherein the pore body is formed by sintering from the group consisting of metal powder and copper powder. 4 . 4 . The heat dissipation device of claim 2 , wherein the pore body is formed by sintering selected from the group consisting of metal powder and copper powder. 5 . 5 . The heat dissipation device according to claim 1 , wherein the fluid output from the heat absorber is selected from the group consisting of liquid phase, gas phase, and combination of gas phase and liquid phase. 6 . 6 . The heat sink according to claim 1 , wherein the fluid output from the radiator is selected from the group consisting of a liquid phase and a liquid phase mixture. 7 . 7 . The heat dissipation device according to claim 1 , wherein the liquid-phase boiling point of the fluid is selected from the group consisting of less than 100 degrees Celsius and less than 50 degrees Celsius. 8 . 8 . The heat dissipation device of claim 5 , wherein the liquid-phase boiling point of the fluid is selected from the group consisting of less than 100 degrees Celsius and less than 50 degrees Celsius. 9 . 9 . The heat dissipation device of claim 6 , wherein the liquid-phase boiling point of the fluid is selected from the group consisting of less than 100 degrees Celsius and less than 50 degrees Celsius. 10 . 10 . The heat dissipation device according to claim 2 , wherein a heat dissipation fin and/or a fan are connected to the outside of the heat sink. 11 .

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