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CN111484714A - A kind of low temperature molding method of unsaturated bulk molding compound - Google Patents

A kind of low temperature molding method of unsaturated bulk molding compound Download PDF

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Publication number
CN111484714A
CN111484714A CN202010401665.9A CN202010401665A CN111484714A CN 111484714 A CN111484714 A CN 111484714A CN 202010401665 A CN202010401665 A CN 202010401665A CN 111484714 A CN111484714 A CN 111484714A
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peroxide
molding compound
crystalline polyester
bulk molding
temperature
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周权
宋宁
倪礼忠
徐鑫敏
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East China University of Science and Technology
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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06Unsaturated polyesters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/01Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to unsaturated polyesters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20Oxides; Hydroxides
    • C08K3/22Oxides; Hydroxides of metals
    • C08K2003/2227Oxides; Hydroxides of metals of aluminium
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/18Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24Acids; Salts thereof
    • C08K3/26Carbonates; Bicarbonates
    • C08K2003/265Calcium, strontium or barium carbonate

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromonomer-Based Addition Polymer (AREA)

Abstract

The invention relates to a low-temperature forming method of unsaturated bulk molding compound, which is a microcapsule low-temperature initiator prepared by taking peroxide as a core material and crystalline polyester as a wall material and is used for preparing the bulk molding compound. The conventional bulk molding compound has higher molding temperature, generally 150 ℃ and longer complete curing time, and the bulk molding compound prepared by the microcapsule low-temperature initiator can be rapidly cured and molded at low temperature, so that the problems of high molding temperature and short quality guarantee period of the bulk molding compound are effectively solved, the energy is saved, and the quality guarantee period and the production efficiency of the bulk molding compound are improved. The low-temperature forming method of bulk molding compound is suitable for unsaturated polyester bulk molding compound reinforced by glass fiber and fabric thereof, and can be applied to various fields of automobile manufacture, electric appliances, aviation, buildings and the like.

Description

一种不饱和团状模塑料的低温成型方法A kind of low temperature molding method of unsaturated bulk molding compound

技术领域technical field

本发明涉及一种不饱和团状模塑料的低温成型方法,属于团状模塑料及其成型技术领域。The invention relates to a low-temperature molding method of an unsaturated bulk molding compound, and belongs to the technical field of bulk molding compound and its molding.

背景技术Background technique

团状模塑料(BMC)是由短切玻璃纤维、填料、不饱和树脂、引发剂、低收缩剂以及增稠剂等经过捏合机充分混合制备得到。在高温条件下,BMC中的不饱和树脂在引发剂的作用下交联固化,是一种用途广泛的复合材料。常用的引发剂为过氧化苯甲酸叔丁酯,固化温度一般为150℃且固化完全时间较长,即固化时间长且固化温度较高,为了提高BMC的生产效率,降低生产的成本,希望在不改变BMC的优良性能的同时尽可能的缩短固化时间。为了降低BMC成型温度,通常采用过氧化物和促进剂混合使用,但是促进剂的加入使得BMC能够在较低的温度下开始固化,容易在存储熟化过程中发生部分固化而变质,不易存储且保存时间短。Bulk molding compound (BMC) is prepared by fully mixing chopped glass fiber, filler, unsaturated resin, initiator, low shrinkage agent and thickener through a kneader. Under high temperature conditions, the unsaturated resin in BMC is cross-linked and cured under the action of the initiator, which is a composite material with a wide range of uses. The commonly used initiator is tert-butyl peroxybenzoate, the curing temperature is generally 150 ° C and the curing time is long, that is, the curing time is long and the curing temperature is high. In order to improve the production efficiency of BMC and reduce the production cost, it is hoped that The curing time is shortened as much as possible without changing the excellent properties of BMC. In order to reduce the molding temperature of BMC, peroxides and accelerators are usually used in combination, but the addition of accelerators enables BMC to start curing at a lower temperature, which is easy to partially cure and deteriorate during storage and aging, and is not easy to store and preserve. short time.

采用微胶囊技术,制备微胶囊型低温引发剂是解决上述问题的一种方案。采用微胶囊技术,结晶性聚酯作为壁材将过氧化物与外界隔离,安全且易于保存,在模压温度下,结晶性聚酯会溶解于不饱和树脂所含的苯乙烯中,释放出过氧化物,在促进剂和过氧化物的作用下引发不饱和聚酯发生交联固化,从而不改变BMC的优良性能,这样就解决了团状模塑料成型温度高和保质期短的问题。Using microcapsule technology to prepare microcapsule type low temperature initiator is a solution to the above problems. Using microcapsule technology, crystalline polyester is used as the wall material to isolate the peroxide from the outside world, which is safe and easy to store. At the molding temperature, the crystalline polyester will dissolve in the styrene contained in the unsaturated resin and release the peroxide. Oxides, under the action of accelerators and peroxides, cause cross-linking and curing of unsaturated polyesters, so as not to change the excellent properties of BMC, thus solving the problems of high molding temperature and short shelf life of bulk molding compounds.

发明内容SUMMARY OF THE INVENTION

为解决上述技术问题,本发明提供了一种不饱和团状模塑料的低温成型方法,采用微胶囊低温引发剂制备的BMC在延长团状模塑料的储存时间的同时使得BMC可以在低温下固化成型,解决了团状模塑料成型温度高和保质期短的问题,适用于玻璃纤维及其织物增强的不饱和聚酯团状模塑料,可应用于汽车制造、电器、航空、建筑等各领域。In order to solve the above-mentioned technical problems, the present invention provides a low-temperature molding method of an unsaturated bulk molding compound, and the BMC prepared by using the microcapsule low-temperature initiator can prolong the storage time of the bulk molding compound and make the BMC can be cured at low temperature. Molding solves the problems of high molding temperature and short shelf life of the bulk molding compound. It is suitable for glass fiber and its fabric-reinforced unsaturated polyester bulk molding compound, which can be used in automobile manufacturing, electrical appliances, aviation, construction and other fields.

本发明是通过以下方案实现的:The present invention is realized through the following scheme:

一种不饱和团状模塑料的低温成型方法,其特征在于:在常规团状模塑料的基础上采用微胶囊低温引发剂替代常规引发剂,捏合制备得到一种能够低温成型的不饱和团状模塑料,使得在保有BMC原有的优异性能的同时降低了其成型温度且延长了BMC的保质期。不饱和团状模塑料的组成配比如下:A low-temperature molding method for an unsaturated bulk molding compound, characterized in that: on the basis of a conventional bulk molding compound, a microcapsule low-temperature initiator is used to replace the conventional initiator, and an unsaturated bulk molding capable of low-temperature molding is prepared by kneading. The molding compound reduces the molding temperature and prolongs the shelf life of BMC while maintaining the original excellent properties of BMC. The composition ratio of the unsaturated bulk molding compound is as follows:

不饱和聚酯树脂:15%-25%;Unsaturated polyester resin: 15%-25%;

低收缩剂:5%-15%;Low shrinkage agent: 5%-15%;

低温引发剂:0.2%-1%;Low temperature initiator: 0.2%-1%;

促进剂:0.1%-0.5%;Accelerator: 0.1%-0.5%;

脱模剂:0.5%-2%;Release agent: 0.5%-2%;

填料:45%-65%;Filler: 45%-65%;

增稠剂:0.3%-0.6%;Thickener: 0.3%-0.6%;

短切玻璃纤维:15%-30%。Chopped glass fiber: 15%-30%.

其中:所述不饱和聚酯树脂为邻苯型或间苯型不饱和聚酯树脂;Wherein: the unsaturated polyester resin is an o-benzene type or an iso-benzene type unsaturated polyester resin;

所述低收缩剂为聚苯乙烯和苯乙烯搅拌熔融混合制得;The low shrinkage agent is prepared by stirring and melting polystyrene and styrene;

所述促进剂为环烷酸钴;The accelerator is cobalt naphthenate;

所述脱模剂为粉末状硬脂酸锌;The release agent is powdered zinc stearate;

所述填料为碳酸钙粉末、氢氧化铝粉末、滑石粉等粉末状填料;The fillers are powdered fillers such as calcium carbonate powder, aluminum hydroxide powder, talc powder, etc.;

所述增稠剂为碱金属氧化物,如氢氧化钙、氧化镁等;The thickener is an alkali metal oxide, such as calcium hydroxide, magnesium oxide, etc.;

所述短切玻璃纤维为短切长度为3mm、6mm、12mm的玻璃纤维。The chopped glass fibers are glass fibers with chopped lengths of 3 mm, 6 mm and 12 mm.

进一步地,所述低温引发剂为采用微胶囊技术制备的微胶囊低温引发剂。Further, the low temperature initiator is a microcapsule low temperature initiator prepared by using the microcapsule technology.

进一步地,所述是微胶囊低温引发剂,其特征在于以过氧化物为芯材,结晶性聚酯为壁材。Further, the microcapsule low temperature initiator is characterized in that the core material is peroxide and the crystalline polyester is the wall material.

进一步地,所述过氧化物为有机过氧化物;Further, the peroxide is an organic peroxide;

优选地,所述过氧化物为过氧化甲乙酮、过氧化环己烷、过氧化苯甲酰。Preferably, the peroxide is methyl ethyl ketone peroxide, cyclohexane peroxide, and benzoyl peroxide.

进一步地,所述结晶性聚酯为能够溶解于有机溶剂的饱和结晶性聚酯;Further, the crystalline polyester is a saturated crystalline polyester that can be dissolved in an organic solvent;

优选地,所述结晶性聚酯为所述结晶性聚酯为聚癸二酸乙二醇酯或聚对苯二甲酸己二醇酯。Preferably, the crystalline polyester is polyethylene sebacate or polyethylene terephthalate.

一种上述不饱和团状模塑料的低温成型方法,其特征在于:采用喷雾干燥法制备微胶囊型低温引发剂,具体步骤如下:A low-temperature molding method for the above-mentioned unsaturated bulk molding compound, characterized in that: a microcapsule-type low-temperature initiator is prepared by a spray drying method, and the concrete steps are as follows:

(1)将过氧化物和结晶性聚酯按一定比例混合后溶于有机溶剂,搅拌至结晶性聚酯充分溶解;(1) Mix peroxide and crystalline polyester in a certain proportion and dissolve in an organic solvent, and stir until the crystalline polyester is fully dissolved;

(2)将步骤(1)中得到得溶液喷射入冷甲苯溶液中;(2) the solution obtained in step (1) is sprayed into cold toluene solution;

(3)将沉淀物进行抽滤,得到的沉淀物置于真空烘箱中干燥,干燥后的沉淀物即为微胶囊低温引发剂。(3) carry out suction filtration on the precipitate, and place the obtained precipitate in a vacuum oven to dry, and the dried precipitate is the microcapsule low-temperature initiator.

进一步地,所述过氧化物与结晶性聚酯的质量比为1:5-1:20。Further, the mass ratio of the peroxide to the crystalline polyester is 1:5-1:20.

进一步地,所述有机溶剂为与有机过氧化物、饱和结晶性聚酯均互溶的有机物;Further, the organic solvent is an organic compound that is mutually soluble with organic peroxide and saturated crystalline polyester;

优选地,所述有机溶剂为苯乙烯、三氯乙烯。Preferably, the organic solvent is styrene and trichloroethylene.

本发明的技术效果:现有技术用于低温成型的BMC,容易在存储熟化过程中发生部分固化而变质,不易存储且保存时间短,不利于生产应用,造成大量的成本浪费。本发明制备的一种微胶囊型低温引发剂用于制备团状模塑料,是一种BMC的低温成型方法,可以有效避免上述问题的出现。Technical effect of the present invention: The BMC used for low-temperature molding in the prior art is prone to partial curing and deterioration during storage and aging, is not easy to store and has a short storage time, is not conducive to production and application, and causes a lot of cost waste. The microcapsule-type low-temperature initiator prepared by the present invention is used for preparing a mass molding compound, and is a low-temperature molding method of BMC, which can effectively avoid the occurrence of the above problems.

具体实施方式Detailed ways

下面结合具体实施例和说明书对本发明的一种不饱和团状模塑料的低温成型方法作进一步阐述,但本发明的保护内容并不限于以下实施例。The low-temperature molding method of an unsaturated bulk molding compound of the present invention will be further described below with reference to specific examples and descriptions, but the protection content of the present invention is not limited to the following examples.

一种不饱和团状模塑料的低温成型方法,主要是通过采用微胶囊低温引发剂替代常规引发剂来实现。微胶囊型低温引发剂是以过氧化物为芯材,结晶性聚酯为壁材,采用微胶囊技术制备获得。过氧化物为有机过氧化物,如:过氧化甲乙酮、过氧化环己烷、过氧化苯甲酰。结晶性聚酯为饱和结晶性聚酯,如聚对苯二甲酸己二醇酯或聚癸二酸乙二醇酯。芯材和壁材的质量比为1: (5-20)。在制备过程中,采用的有机溶剂为与有机过氧化物、饱和结晶性聚酯均互溶的有机物,如苯乙烯、三氯乙烯。A low-temperature molding method of unsaturated bulk molding compound is mainly realized by using microcapsule low-temperature initiator instead of conventional initiator. Microcapsule type low temperature initiator is prepared by microcapsule technology with peroxide as core material and crystalline polyester as wall material. Peroxides are organic peroxides, such as methyl ethyl ketone peroxide, cyclohexane peroxide, and benzoyl peroxide. The crystalline polyester is a saturated crystalline polyester such as polyethylene terephthalate or polyethylene sebacate. The mass ratio of core material and wall material is 1: (5-20). In the preparation process, the organic solvent used is an organic compound that is mutually soluble with organic peroxide and saturated crystalline polyester, such as styrene and trichloroethylene.

实施例1Example 1

以过氧化甲乙酮为芯材,聚对苯二甲酸己二醇酯为壁材。将过氧化甲乙酮和聚对苯二甲酸己二醇酯以1:10配比溶解于苯乙烯中,搅拌使其充分溶解。采用喷头将溶解后的混合液喷射进入冷的甲苯溶液中,将沉淀物抽滤,置入真空烘箱中,45℃烘干处理24小时,即得到微胶囊低温引发剂。将制得的微胶囊低温引发剂及其他组成按照以下质量分数进行捏合制备得到不饱和团状模塑料,可以用于低温成型,且保质期较长。With methyl ethyl ketone peroxide as the core material and polyethylene terephthalate as the wall material. Methyl ethyl ketone peroxide and polyethylene terephthalate were dissolved in styrene at a ratio of 1:10, and stirred to fully dissolve. The dissolved mixed solution was sprayed into a cold toluene solution by a spray nozzle, the precipitate was suction filtered, placed in a vacuum oven, and dried at 45°C for 24 hours to obtain a microcapsule low-temperature initiator. The obtained microcapsule low-temperature initiator and other components are kneaded according to the following mass fractions to prepare an unsaturated bulk molding compound, which can be used for low-temperature molding and has a long shelf life.

实施例2Example 2

以过氧化环己烷为芯材,聚癸二酸乙二醇酯为壁材。将过氧化环己烷和聚癸二酸乙二醇酯以1:15配比溶解于苯乙烯中,搅拌使其充分溶解。采用喷头将溶解后的混合液喷射进入冷的甲苯溶液中,将沉淀物抽滤,置入真空烘箱中,45℃烘干处理24小时,即得到微胶囊低温引发剂。将制得的微胶囊低温引发剂及其他组成按照以下质量分数进行捏合制备得到不饱和团状模塑料,可以用于低温成型,且保质期较长。The core material is cyclohexane peroxide and the wall material is polyethylene sebacate. Cyclohexane peroxide and polyethylene sebacate were dissolved in styrene at a ratio of 1:15, and stirred to fully dissolve. The dissolved mixed solution was sprayed into a cold toluene solution by a spray nozzle, the precipitate was suction filtered, placed in a vacuum oven, and dried at 45°C for 24 hours to obtain a microcapsule low-temperature initiator. The obtained microcapsule low-temperature initiator and other components are kneaded according to the following mass fractions to prepare an unsaturated bulk molding compound, which can be used for low-temperature molding and has a long shelf life.

实施例3Example 3

以过氧化苯甲酰为芯材,聚癸二酸乙二醇酯为壁材。将过氧化苯甲酰和聚癸二酸乙二醇酯以1:20配比溶解于苯乙烯中,搅拌使其充分溶解。采用喷头将溶解后的混合液喷射进入冷的甲苯溶液中,将沉淀物抽滤,置入真空烘箱中,45℃烘干处理24小时,即得到微胶囊低温引发剂。将制得的微胶囊低温引发剂及其他组成按照以下质量分数进行捏合制备得到不饱和团状模塑料,可以用于低温成型,且保质期较长。With benzoyl peroxide as the core material and polyethylene sebacate as the wall material. Benzoyl peroxide and polyethylene sebacate were dissolved in styrene at a ratio of 1:20, and stirred to fully dissolve. The dissolved mixed solution was sprayed into a cold toluene solution by a spray nozzle, the precipitate was suction filtered, placed in a vacuum oven, and dried at 45°C for 24 hours to obtain a microcapsule low-temperature initiator. The obtained microcapsule low-temperature initiator and other components are kneaded according to the following mass fractions to prepare an unsaturated bulk molding compound, which can be used for low-temperature molding and has a long shelf life.

Claims (7)

1. The low temperature forming process of unsaturated bulk molding compound features that the initiator of the unsaturated bulk molding compound is microcapsule type low temperature initiator.
2. A microencapsulated low temperature initiator as defined in claim 1 wherein: peroxide is used as a core material, and crystalline polyester is used as a wall material.
3. A microencapsulated low temperature initiator as defined in claim 2 wherein: the peroxide is an organic peroxide;
preferably, the peroxide is methyl ethyl ketone peroxide, cyclohexane peroxide, benzoyl peroxide.
4. A microencapsulated low temperature initiator as defined in claim 2 wherein: the crystalline polyester is a saturated crystalline polyester capable of being dissolved in an organic solvent;
preferably, the crystalline polyester is polyethylene sebacate or polyhexamethylene terephthalate.
5. A low temperature molding process for preparing an unsaturated bulk molding compound according to claim 1, wherein: the microcapsule type low-temperature initiator is prepared by a spray drying method and comprises the following specific steps:
(1) mixing peroxide and crystalline polyester according to a certain proportion, dissolving in an organic solvent, and stirring until the crystalline polyester is fully dissolved;
(2) spraying the solution obtained in the step (1) into a cold toluene solution;
(3) and (3) carrying out suction filtration on the precipitate, drying the obtained precipitate in a vacuum oven, and obtaining the dried precipitate which is the microcapsule low-temperature initiator.
6. The method of claim 7, wherein: the mass ratio of the peroxide to the crystalline polyester is 1: 5-1: 20.
7. the method of claim 7, wherein: the organic solvent is an organic matter which is mutually soluble with the organic peroxide and the saturated crystalline polyester;
preferably, the organic solvent is styrene or trichloroethylene.
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Application publication date: 20200804