CN111501103A - Boiling and bonding method of tool for bonding silicon rods - Google Patents
Boiling and bonding method of tool for bonding silicon rods Download PDFInfo
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- CN111501103A CN111501103A CN202010320456.1A CN202010320456A CN111501103A CN 111501103 A CN111501103 A CN 111501103A CN 202010320456 A CN202010320456 A CN 202010320456A CN 111501103 A CN111501103 A CN 111501103A
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- 238000009835 boiling Methods 0.000 title claims abstract description 78
- 238000000034 method Methods 0.000 title claims abstract description 53
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 26
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 26
- 239000010703 silicon Substances 0.000 title claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 383
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 153
- 239000003292 glue Substances 0.000 claims description 90
- 238000001816 cooling Methods 0.000 claims description 52
- 238000001035 drying Methods 0.000 claims description 29
- 238000004026 adhesive bonding Methods 0.000 claims description 9
- 239000008399 tap water Substances 0.000 claims description 5
- 235000020679 tap water Nutrition 0.000 claims description 5
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 230000014759 maintenance of location Effects 0.000 claims 2
- 230000000694 effects Effects 0.000 description 34
- 238000000926 separation method Methods 0.000 description 19
- 238000004140 cleaning Methods 0.000 description 18
- 239000007788 liquid Substances 0.000 description 16
- 238000005520 cutting process Methods 0.000 description 15
- 239000010410 layer Substances 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 10
- 238000005406 washing Methods 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 238000002360 preparation method Methods 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 5
- 238000012544 monitoring process Methods 0.000 description 5
- 238000011084 recovery Methods 0.000 description 5
- 238000004064 recycling Methods 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000010411 cooking Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 239000003814 drug Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 230000035939 shock Effects 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 206010022998 Irritability Diseases 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B33/00—After-treatment of single crystals or homogeneous polycrystalline material with defined structure
- C30B33/06—Joining of crystals
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a boiling and bonding method of a silicon rod bonding tool, which comprises the following steps: s1: providing a first tool which comprises a first material plate and a first material seat which are bonded into a whole; separating the first material plate from the first material seat in the first tooling; s2: providing a second material plate; and executing the automatic bonding of the second material plate on the separated first material seat to form a second tool. The boiling and bonding method provided by the invention has the advantages that the first material seat and the first material plate which are bonded in the integrated first tool are separated, and then the second material plate is bonded on the first material seat to form a second tool and then put into use.
Description
Technical Field
The invention belongs to the technical field of single crystal silicon rod bonding, and particularly relates to a boiling bonding method of a tool for bonding silicon rods.
Background
In the existing separation and bonding method of the material plate and the material seat in the production flow, the material seat adhered with the old resin plate is boiled at high temperature through a single boiling box, the degummed old resin plate is separated from the material seat by an operator, the residual glue on the surface of the material seat is cleaned and then sequentially cooled and air-dried to complete the separation of the material plate and the material seat, and finally, a new plate is adhered to the cleaned material seat by the operator for later use. The boiling and heating process belongs to high-temperature operation, has higher requirements on labor protection of personnel, is easy to cause fatigue and irritability when the personnel operate at high temperature, and has low production efficiency; meanwhile, in the whole process, manual operation is adopted, the labor intensity of operators is high, the working efficiency is low, the bonding quality is unstable due to different operation proficiency of the operators, the rework rate is high, and the production cost is high.
Disclosure of Invention
The invention provides a boiling and bonding method of a tool for bonding silicon rods, which is particularly suitable for separating and bonding material seats and material plates with various sizes and solves the technical problems of unstable manual separation and bonding quality and low working efficiency in the prior art.
In order to solve the technical problems, the invention adopts the technical scheme that:
a boiling and bonding method of a silicon rod bonding tool comprises the following steps:
s1: providing a first tool which comprises a first material plate and a first material seat which are bonded into a whole; separating the first material plate from the first material seat in the first tooling;
s2: providing a second material plate; and executing the automatic bonding of the second material plate on the separated first material seat to form a second tool.
Further, the S1 specifically includes:
s11: the first tooling is arranged in the water boiling grooves and is kept for a set time at a set water temperature, so that a glue layer between the first material plate and the first material seat is softened;
s12: the first tooling is executed on the first plate disassembling table, and a scraper knife arranged on the first plate disassembling table is executed to push the first material plate to be separated from the first material seat;
s13: including removing the platform of gluing, carry out a material seat in remove the bench of gluing to the execution sets up remove the epaxial scraper of gluing and get rid of No. a material seat is gone up remaining glue film, and the reuse setting is in remove the epaxial squirt of gluing and right a material seat washes.
Further, the temperature of the water in the S11 is 80-100 ℃, and the holding time is 350-500S.
Further, the temperature of the water in the S11 is 85-95 ℃, and the holding time is 400-450S.
Further, still be equipped with the vibrating plate in the poaching groove, the vibrating plate is arranged in a frock below.
Further, the S2 specifically includes:
s21: the material receiving device comprises a plurality of water tanks, wherein the material receiving device is used for receiving a material to be separated;
s23: the adhesive dispensing device comprises a dispensing table, wherein the first material seat is executed on the dispensing table, and the adhesive to be adhered of the first material seat is dispensed automatically;
s24: and providing a second material plate right above the first material seat, performing bonding of the second material plate and the first material seat, and curing for a certain time to form the second tool.
Further, the step S21 includes cold water cooling and/or normal temperature cooling, and the water used in the step S21 is tap water.
Further, before S23, S22 is further included, and S22 includes performing a step of drying the cooled material seat in a drying chamber, so that moisture on the surface of the material seat is evaporated.
Furthermore, the bonding curing time of the first material seat and the second material plate is not less than 450 s.
Further, in S24, the method further includes the step of arranging a weight on a side of the second material plate away from the first material seat; the area of one side of the balancing weight, which is close to the second material plate, is larger than the contact area of the second material plate and the first material seat.
Compared with the prior art, the boiling and bonding method of the tool for bonding the silicon rods, disclosed by the invention, has the advantages that the first material seat and the first material plate in the first tool are separated, and then the second material plate is bonded on the first material seat to form the second tool, and then the second tool is put into use.
Drawings
Fig. 1 is a schematic structural diagram of a tooling boiling-bonding apparatus according to an embodiment of the present invention;
FIG. 2 is a flow chart of a tooling boiling and bonding method according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a water boiling device according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of a separation device according to an embodiment of the present invention;
FIG. 5 is a side view of a separation device according to one embodiment of the invention;
FIG. 6 is a schematic structural diagram of a glue removing device according to an embodiment of the invention;
FIG. 7 is a schematic structural diagram of a cold water cooling device according to an embodiment of the present invention;
FIG. 8 is a schematic structural diagram of an ambient temperature cooling apparatus according to a second embodiment of the present invention;
FIG. 9 is a schematic structural diagram of a combined cooling device according to three embodiments of the present invention;
FIG. 10 is a schematic view of a dispensing route of a material seat according to an embodiment of the present invention;
fig. 11 is a schematic structural diagram of a plate bonding device according to an embodiment of the present invention.
In the figure:
10. first tool 11, first material seat 12 and first material plate
20. No. two frocks 21, No. two flitch 30, poaching groove
31. Heater 32, temperature sensor 33, vibrating plate
34. Elastic piece 35, liquid level sensor 40, tear pallet open
41. Scraper knife 42, recovery tank 50 and degumming table
51. Scraper 52, high-pressure water gun 60 and cooling table
61. A cold water tank 62, a normal temperature water tank 63, and a thermometer
70. Dispensing table 71, dispensing track 711 and dispensing line
712. Dispensing line 713, dispensing line 714, dispensing line
72. Balancing weight
Detailed Description
The invention is described in detail below with reference to the figures and specific embodiments.
After the silicon wafer is cut, the surface of one side of a flitch connected with the silicon wafer is seriously damaged due to the high cutting speed of the diamond wire; meanwhile, when the silicon wafer and the tool are degummed, although the silicon wafer and the flitch can be degummed and separated, the bonding effect between the flitch and the material seat is also influenced, so that in the next using process, the used flitch needs to be removed firstly, and the unused flitch is bonded on the material seat to form a new tool for use, so that the bonding flatness and the bonding quality of the next group of silicon rods are ensured, the consistency of the subsequent diamond wire cutting can be ensured, and the qualified monocrystalline silicon wafer can be obtained.
In this embodiment, as shown in fig. 1-2, a first material seat 11 and a first material plate 12 in a used first tooling 10 are automatically separated, and a new second material plate 21 is automatically bonded on the first material seat 11 to form a new second tooling 20, so as to provide preparation for bonding a silicon rod on the second tooling 20 in the next process.
A boiling and bonding device of a silicon rod bonding tool is structurally shown in figure 1 and comprises a separation unit and a bonding unit, wherein the separation unit sequentially comprises a boiling device for softening a first material plate 12 and a first material seat 11, a plate detaching device for separating the first material plate 12 from the first material seat 11 and a glue removing device for removing residual glue solution on the first material seat 11; the bonding unit sequentially comprises a cooling device for cooling the clean first material seat 11 after glue removal, a drying device for drying the first material seat 11 and a glue dispensing and plate bonding device for bonding the second material plate 21 with the first material seat 11.
Specifically, the poaching device includes a plurality of poaching tanks 30, and the number and arrangement of the poaching tanks 30 may be determined according to the structure of the apparatus, and is not particularly limited herein. A first tool 10 is placed in each water boiling tank 30, the water boiling tanks 30 are identical in size, and the structure is shown in figure 3. Firstly, a first tool 10 is placed on a logistics line formed by a moving belt pulley, the first tool 10 is moved for a certain distance on the logistics line automatically conveyed and then stops moving when reaching a material taking position, a carrying manipulator grabs the first tool 10 and transfers the first tool 10 to a water boiling tank 30, the manipulator is any grabbing device in the field, the structure is not particularly limited, the following manipulator is not detailed, the drawing is omitted, and the grabbing operation of the first tool 10 can be realized as long as the grabbing operation is satisfied.
A tool 10 is placed in a water boiling groove 30 through a carrying manipulator, water boiling is kept for a set time at a set water temperature, and a glue layer between a material plate 12 and a material seat 11 can be softened. The water in the water boiling tank 30 is pure water, the height of the pure water needs to exceed the whole height of the first tool 10, the heater 31 is arranged at the bottom of the water boiling tank 30 and used for heating the pure water in the tank, and the temperature sensor 32 is further arranged in the water boiling tank 30 and used for monitoring the temperature in the water boiling tank 30 so as to ensure that the temperature in the water boiling tank 30 is always kept within the range of 80-100 ℃, and the water boiling time is 350 plus 500 s. When the boiling temperature is higher than 95 ℃ and the boiling time is longer than 450s, the glue layer can be hardened, and the subsequent separation quality is seriously influenced; when the boiling temperature is less than 85 ℃ and the boiling time is less than 400s, the glue layer can be softened only by needing longer boiling time, more water resources are wasted, the burning expense and the manpower are wasted to be matched and completed, and the production efficiency is low. Therefore, preferably, when the temperature in the water boiling tank 30 is between 85 ℃ and 95 ℃, and after the water boiling is maintained for 400-.
Further, still be equipped with the supersound board 33 that shakes that is driven by the ultrasonic wave in poaching groove 30, be located a frock 10 under, the board 33 that shakes is connected with poaching groove 30's bottom through elastic component 34, the board 33 that shakes is on a parallel with poaching groove 30's bottom setting, the board 33 that shakes passes through its amplitude of ultrasonic wave control, help the poaching effect, further accelerate the softening of glue film, the ultrasonic wave can set up according to a frock 10's of difference size and the thickness of glue film, do not specifically restrict here. After the first tool 10 is placed on the manipulator, the first tool 10 is boiled in the water boiling tank 30 at the temperature of 85-95 ℃ for 400 plus 450s, so that the adhesive layer between the first material seat 11 and the first material plate 12 can be quickly softened, and the softening effect is good. Meanwhile, a liquid level sensor 35 is further arranged in the water boiling tank 30 and used for monitoring the water level condition in the tank, so that the first tool 10 is completely arranged in the range of the warning line water level in the water boiling tank 30, and the softening consistency of the first tool 10 is promoted.
Adopt automatic temperature control's poaching groove 30 to cook a frock 10 in poaching device, increase supersound vibrating plate 33 in poaching groove 30 simultaneously to accelerate the softening progress of a material seat 11 and a flitch 12, remaining liquid medicine and particle impurity on this device still can wash a flitch 12 and a material seat 11 with higher speed simultaneously, in order to guarantee the holistic cleanliness factor of a frock 10. And the water boiling temperature and the water boiling time are further optimized, particularly the softening effect of the first material seat 11 and the first material plate 12 is best after the water boiling is performed for 400-450s within the range of 85-95 ℃, and the separation quality in the next working procedure is more favorable.
As shown in fig. 4 to 5, the plate removing device includes a plate removing table 40, the softened first tool 10 is taken out of the poaching tank 30 by an automatic robot and moved to the plate removing table 40 adjacent to the poaching tank 30, and after the first tool 10 is fixed on the plate removing table 40, the robot is separated from the first tool 30 and is retracted. The scraper knife 41 fixedly arranged on the plate detaching table 40 starts to work, in the separation process, the first material base 11 is fixed, the scraper knife 41 moves along the length direction of the first material base 11 and enters the knife from the width direction of the end part of the first material plate 12, the first material plate 12 in the fixed first tooling 10 is detached, the scraper knife 41 pushes the first material plate 12, and meanwhile, the first material plate 12 is accelerated to be separated from the first material base 11 along with the inertia force of the forward movement of the scraper knife 12, so that the scraper knife 41 can separate the first material plate 12 from the first material base 11 by the minimum thrust, and the separation of the first material base 11 and the first material plate 12 is completed. The scraper knife 41 pushes the first material plate 12 to be quickly separated from the first material seat 11, and the rejected first material plate 12 automatically falls into a recovery tank 42 arranged on the side surface of the plate detaching table 40 to wait for recovery and reuse. The separated first material seat 11 is grabbed away by a mechanical arm and moves to a next glue removing device along an automatic conveying belt to perform glue removing operation.
Through adopting spiller 41 to go into the sword from the width direction of No. one flitch 12 tip and move along the direction of No. one material seat 11 length in tearing the board device open, No. one flitch 12 of usable minimum thrust of spiller 41 is separated with No. one material seat 11 fast and safely, simple structure and easily control, and separation effect is good, and only a small amount of cull still adheres on the surface of No. one material seat 11. The rejected first material plate 12 is good in integrity, can be automatically fallen into the recycling groove 42 arranged on the side surface, can be cleaned again and reused, is high in recycling rate, and can further reduce the production cost. To remain the glue film on a material seat 11, need in time to remove it, stay on a material seat 11 for a long time, it is more difficult when the subsequent clearance again. A certain temperature is left in the first material seat 11, and the first material seat is cleaned in time, so that the cleaning efficiency is improved.
As shown in fig. 6, the glue removing device includes a glue removing table 50, a scraper 51 and a high pressure water gun 52 are disposed on the glue removing table 50, and the high pressure water gun 52 is located behind the scraper 51. In this embodiment, scraper 51 and high-pressure squirt 52 all are located the oblique top of a material seat 11 and are fixed motionless, and a material seat 11 is just corresponding the direction reverse movement of scraper 51 cutting edge, and this setting can make a material seat 11 move forward after a length, and also the cull is cleared up completely, and then a material seat 11 can be directly by flowing to next process in, need not to make a material seat 11 move back again, and save time improves work efficiency. Scraper 51 and high-pressure squirt 52 clear up the cull along the length direction of a material seat 11 in step, clear up remaining glue film on a material seat 11 with scraper 51 earlier promptly, and the glue film after the clearance is washed to reuse high-pressure squirt 52 afterwards to guarantee the cleanness of a material seat 11 by the face that bonds. The manipulator moves the first material seat 11 to the glue removing table 50, and the manipulator moves away after the first material seat 11 is clamped and fixed on the glue removing table 50; the scraper 51 and the high-pressure water gun 52 are ready to be in place, and the cleaning of the residual glue layer on the first material seat 11 is started.
Specifically, the cutting edge of the scraper 51 is arranged along the width direction of the first material seat 11 and is perpendicular to the length direction of the first material seat 11, the included angle theta between the cutting edge of the scraper 51 and the upper end surface of the first material seat 11 is 10-15 degrees, if the included angle theta is larger than 15 degrees, the force on the cutting edge is pressed on the upper end surface of the first material seat 11, the forward movement resistance of the scraper 51 is increased, and the cutting edge is damaged by collision; if contained angle theta is less than 10 degrees, the effect of clearance can be reduced, some residual glue is omitted, and the cleaning can not be completely realized. Preferably, the included angle θ between the blade edge of the scraper 51 and the upper end surface of the first material seat 11 is 10 to 15 °, which is more beneficial for the scraper 51 to horizontally move on the upper end surface of the first material seat 11 to clean the residual glue, and the residual glue cleaning effect is the best.
The high-pressure water gun 52 is arranged behind the scraper 51 and obliquely arranged downwards, the high-pressure water gun 52 sprays cleaning liquid towards the upper end face of the first material seat 11, the cleaning liquid is pure water, the rated pressure of the high-pressure water gun 52 is 2-12MP, the flow rate is 5-15L/min, preferably, the included angle α between the gun mouth of the high-pressure water gun 52 and the upper end face of the first material seat 11 is 45 degrees, the downward spraying pressure is maximum, namely the impact force for washing the first material seat 11 is maximum, the washing effect is best, the cleaned adhesive layer is favorably washed away, and the cleaned first material seat 11 is grabbed away by a manipulator and moved to a cooling device in the next working procedure for cooling.
The glue removing device adopts a combined mode of the scraper 51 and the high-pressure water gun 52 to clean residual glue on the first material seat 11, and especially when the included angle between the cutting edge of the scraper 51 and the upper end surface of the first material seat 11 is 10-15 degrees, the residual glue cleaning effect is best; when the included angle between the muzzle of the high-pressure water gun 52 and the upper end surface of the first material seat 11 is 45 degrees, the impact force for washing the first material seat is the largest, and the washing effect is the best.
The first tool 10 is automatically disassembled sequentially through the water boiling device, the plate detaching device and the glue removing device, the first material seat 11 is separated from the first material plate 12, residual glue on the bonded surface of the first material seat 11 is cleaned, and preparation is made for bonding the second bonding plate 21 on the next step.
The bonding unit comprises a cooling device, a drying device, a dispensing device and a plate bonding device in sequence, and the cooling device, the drying device, the dispensing device and the plate bonding device are respectively as follows:
since the temperature of the first material seat 11 after the glue removal is very high, the glue can not be directly dispensed on the upper end surface to be bonded, and if the glue is directly dispensed, the bonding effect is seriously affected, so that the first material seat 11 needs to be cooled first. The cooling device comprises a cooling table 60 and a plurality of water tanks arranged above the cooling table 60, cooling water in the water tanks comprises cold water and/or normal-temperature water, all water used in the cooling device is tap water, the manipulator grabs the first material seat 11 onto the cooling table 60, the cooling table 60 sequentially comprises a cold water tank 61 and/or a normal-temperature water tank 62 which are independently arranged, and the cold water tank 61 and/or the normal-temperature water tank 62 are independently arranged water tanks, as shown in fig. 7-9. That is, in the present embodiment, the first material seat 11 can be directly placed into the cold water tank 61 for cooling, so as to meet the requirement of cooling the first material seat 11, as shown in fig. 7; or the first material seat 11 is directly placed into the normal-temperature water tank 62 for cooling until the temperature of the first material seat 11 meets the requirement of cooling to room temperature, as shown in fig. 8; or the first material seat 11 enters the cold water tank 61 to be cooled and then enters the normal temperature water tank 62 to be cooled, and finally the required first material seat 11 is obtained, as shown in fig. 9.
Specifically, as shown in fig. 7, when the first material holder 11 is directly cooled in the cold water tank 61, a thermometer 63 for monitoring the temperature of the cold water is provided in the cold water tank 61. When the temperature of the tap water in the cold water tank 61 is not too low or too high, the waste of electrical resources is increased, and the service life of the first material seat 11 is shortened due to the change of the quenching shock. Preferably, the temperature in the cold water tank 61 is 10-15 ℃, and the cooling time of the material seat I11 in the cold water tank 61 is 20-30 s. After the temperature is reduced, the first material seat 11 is taken out by the manipulator and transferred to a drying device in the next procedure for drying.
As shown in fig. 8, when the first material seat 11 is directly cooled in the normal temperature water tank 62, the temperature in the water tank is always normal temperature, and the first material seat 11 stands still in the normal temperature water tank 62 for 30-50s, so that the temperature of the first material seat 11 can be slowly reduced, and the purpose of reducing the temperature is achieved.
As shown in fig. 9, when the first material holder 11 is first cooled by cold water and then cooled by normal temperature water, that is, the first material holder 11 is grabbed by a manipulator and first placed into the cold water tank 61 for cooling, the temperature of the cold water tank 61 is 10-15 ℃, and the cooling time is 2-5 s; after the cold water is cooled, the first material seat 11 is operated by the manipulator to enter the normal-temperature water tank 62 for cooling, the temperature of the water in the normal-temperature water tank 62 is 21-25 ℃, and the cooling time is 10-15 s. The cooling efficiency can be improved fast to the cooling methods of two kinds of combinations, practices thrift the cooling time, strives for the time for other process steps, and the while is cooled off fast earlier slowly and is not influenced greatly to a material seat 11 performance itself, can also shorten the cooling time under the condition that does not influence a material seat 11 quality itself, improves work efficiency. After the first material seat 11 is sequentially cooled by the cold water tank 61 and the normal temperature water tank 62, the temperature of the first material seat reaches the standard requirement, and then the first material seat is grabbed by the manipulator to the next procedure drying device for drying.
In this embodiment, the drying device is a drying chamber, and is used for drying the material seat No. 11 with water drops after cooling, so that the water on the surface of the material seat No. 11 is evaporated. The drying chamber is any one of the drying structures commonly used in the art, and is omitted, after the first material seat 11 is moved into the drying chamber, hot air flow is arranged around the drying chamber, and the hot air flow directly blows the periphery of the first material seat 11, so that the moisture on the upper end surface of the first material seat 11 can be quickly and completely evaporated. And cleaning preparation is carried out for the next step of dispensing on the bonded surface of the first material seat 11, so that the bonding quality of the second bonding plate is ensured.
The glue dispensing device and the plate sticking device share a working table, namely a glue dispensing table 70, which is mainly used for dispensing dried first material seat 11, then sticking second material plate 21 in a glue dispensing area and forming second tooling 20 with the first material seat 11.
Specifically, the first material seat 11 is taken away from the drying chamber by a manipulator, moved to the dispensing table 70 and fixed on the dispensing table 70; and then, any dispensing machine used in the field is used for dispensing the upper end surface of the first material seat 11, namely, a certain amount of glue solution is dispensed on the upper end surface of the first material seat 11, so that the glue solution completely covers all areas of the bonded surface of the first material seat 11, and the bonding effect is ensured. The dispensing trajectory 71 is as shown in fig. 10, and includes a plurality of dispensing lines, which are straight dispensing lines 711 and dispensing lines 712, and broken dispensing lines 713 and dispensing lines 714, the dispensing lines 711, dispensing lines 712, dispensing lines 713, and dispensing lines 714 are cross-connected to each other and completely distributed on the bonding surface of the first material holder 11, all the dispensing lines have the same width, so that the dispensing trajectory 71 is continuous, uniform, and smooth, the glue is uniformly distributed on the bonding surface of the first material holder 11, no bubbles are generated in the whole process after dispensing, the uniformity is good, preparation is made for stable bonding of the second material plate 21 and the first material holder 11, and the bonding strength can be further ensured. Meanwhile, the distance between the two points is the shortest, so that the dispensing track 71 formed by the dispensing line formed by combining the straight line and the broken line, which is designed by the application, can save the using amount of the dispensing liquid to the maximum extent, and the shortest dispensing route is obtained, so that the utilization rate of the dispensing liquid is high, the bonding area is enlarged, the bonding force can be ensured, and the bonding efficiency is improved; the glue dispensing time can be saved to the maximum extent, the glue dispensing amount is reduced, the glue dispensing efficiency is improved, and the production cost is saved.
As shown in fig. 11, after dispensing, the first material seat 11 is still fixed on the dispensing table 70, the manipulator picks up a new intact second material plate 21 matched with the first material seat 11 and places the new intact second material plate 21 on the first material seat 11, the second material plate 21 is vertically corresponding to the first material seat 11, the second material plate 21 is completely attached to the first material seat 11, and then a balancing weight 72 is arranged on one side of the second material plate 21 away from the first material seat 11, so that the bonding strength between the second material plate 21 and the first material seat 11 is better. Preferably, the area of the counterweight block 72 close to the side of the second flitch 21 is larger than the area of the second flitch 21 far away from the side of the first flitch 11, that is, the area of the counterweight block 72 close to the side of the second flitch 21 is larger than the contact area between the second flitch 21 and the first flitch 11, and the weight of the counterweight block 72 is not smaller than the weight of the second flitch 21. The balancing weight 72 is arranged right above the second flitch 21 and is coincided with the central axis of the second flitch 21, so that the stress of the second flitch 21 is uniform, a downward pressure is given to the second flitch 21 to enable the second flitch 21 not to move on the first flitch seat 11, the bonding effect is ensured, the bonding force between the second flitch 21 and the first flitch seat 11 is stronger, and the bonding effect is better. The bonding curing time of the first material seat 11 and the second material plate 21 is not less than 450s, so that the second material plate 21 can be completely bonded with the first material seat 11, and then the workpiece 20 is moved to a workbench of the next procedure by a manipulator for the next operation.
In the bonding curing process, one side of keeping away from No. 11 material seat through No. two flitches 21 sets up balancing weight 72, and balancing weight 72 is close to the area of No. two flitch 21 one sides and is greater than the area that No. two flitch 21 kept away from No. 11 material seat one side, can further guarantee the steadiness that No. two flitch 21 bonded on No. 11 material seat, guarantees the bonding effect, makes No. two flitch 21 stronger with the bonding force of a material seat 11, and the bonding effect is better.
The invention also provides a boiling and bonding method of the silicon rod bonding tool, a flow chart is shown in fig. 2, and the boiling and bonding method comprises the following steps:
s1: providing a first work 10, and automatically separating a first material plate 12 from a first material seat 11 in the first tooling 10;
s2: providing a second material plate 21, and automatically bonding the second material plate 21 on the separated first material seat 11 to form a second tool 20. The method comprises the following specific steps:
s1: the separation process comprises the following steps:
s11: boiling in water: the first tooling 10 is arranged in the water boiling tank 30 and is kept for a period of time at a certain temperature, so that the glue layer of the first material plate 12 and the first material seat 11 which are bonded in the first tooling 10 is softened.
Specifically, as shown in fig. 3, the first tool 10 is first placed on a logistics line formed by a moving belt pulley, the first tool 10 stops moving when reaching a material taking position after moving for a certain distance on the logistics line for automatic conveying, the carrying manipulator grabs the first tool 10 and puts the first tool 10 into the water boiling tank 30, and water boiling is kept for a set time at a set water temperature, so that a glue layer between the first material plate 12 and the first material seat 11 can be softened. The water in the boiling tank 30 is pure water, the liquid level of the water passes through the first tool 10, the heater 31 arranged at the bottom of the boiling tank 30 heats the pure water in the boiling tank, and the temperature sensor 32 monitors the temperature in the boiling tank 30 so as to ensure that the temperature in the boiling tank 30 is always kept within the range of 80-100 ℃, and the boiling time is 350-500 s. When the boiling temperature is higher than 95 ℃ and the boiling time is longer than 450s, the glue layer can be hardened, and the subsequent separation quality is seriously influenced; when the boiling temperature is less than 85 ℃ and the boiling time is less than 400s, the glue layer can be softened only by needing longer boiling time, more water resources are wasted, the burning expense and the manpower are wasted to be matched and completed, and the production efficiency is low. Therefore, preferably, when the temperature in the water boiling tank 30 is between 85 ℃ and 95 ℃, and after the water boiling is maintained for 400-.
Further, for further accelerate the glue film and soften, still be equipped with the supersound shake plate 33 that is driven by the ultrasonic wave in poaching groove 30, be located a frock 10 under, shake the plate 33 and be connected through elastic component 34 and poaching groove 30's bottom to through its amplitude of ultrasonic wave control, help the poaching effect. The ultrasonic wave may be set according to the size of the first tool 10 and the thickness of the adhesive layer, which is not particularly limited herein. After the first tool 10 is placed on the manipulator, the first tool 10 is boiled in the water boiling tank 30 at the temperature of 85-95 ℃ for 400 plus 450s, so that the adhesive layer between the first material seat 11 and the first material plate 12 can be quickly softened, and the softening effect is good. Meanwhile, a liquid level sensor 35 is further arranged in the water boiling tank 30 and used for monitoring the water level condition in the tank, so that the first tool 10 is completely arranged in the range of the warning line water level in the water boiling tank 30, and the softening consistency of the first tool 10 is promoted.
S12: disassembling the plate: the softened first tooling 10 is arranged on the plate detaching table 40, and the first material plate 12 is pushed to be separated from the first material seat 11 by using a scraper knife 41.
Specifically, as shown in fig. 4 to 5, the softened first tool 10 is taken out of the poaching tank 30 by an automatic robot and moved to a plate removing table 40 adjacent to the poaching tank 30, and after the first tool 10 is fixed to the plate removing table 40, the robot is separated from the first tool 30 and retracted. The scraper knife 41 fixedly arranged on the plate detaching table 40 starts to work, in the separation process, the first material base 11 is fixed, the scraper knife 41 moves along the length direction of the first material base 11 and enters the knife from the width direction of the end part of the first material plate 12, the first material plate 12 in the fixed first tooling 10 is detached, the scraper knife 41 pushes the first material plate 12, and meanwhile, the first material plate 12 is accelerated to be separated from the first material base 11 along with the inertia force of the forward movement of the scraper knife 12, so that the scraper knife 41 can separate the first material plate 12 from the first material base 11 by the minimum thrust, and the separation of the first material base 11 and the first material plate 12 is completed. The scraper knife 41 pushes the first material plate 12 to be quickly separated from the first material seat 11, and the rejected first material plate 12 automatically falls into a recovery tank 42 arranged on the side surface of the plate detaching table 40 to wait for recovery and reuse. The separated first material seat 11 is grabbed away by a mechanical arm and moves to a next glue removing device along an automatic conveying belt to perform glue removing operation.
In the process, the scraper knife 41 is used for feeding the scraper knife from the width direction of the end part of the first flitch 12 and moving along the length direction of the first material seat 11, the scraper knife 41 can quickly and safely separate the first flitch 12 from the first material seat 11 by using the minimum thrust, the structure is simple and easy to control, the separation effect is good, and only a small amount of residual glue is still adhered to the surface of the first material seat 11. The rejected first material plate 12 is good in integrity, can be automatically fallen into the recycling groove 42 arranged on the side surface, can be cleaned again and reused, is high in recycling rate, and can further reduce the production cost. To remain the glue film on a material seat 11, need in time to remove it, stay on a material seat 11 for a long time, it is more difficult when the subsequent clearance again. A certain temperature is left in the first material seat 11, and the first material seat is cleaned in time, so that the cleaning efficiency is improved.
S13: removing glue: the first material seat 11 is placed on the glue removing table 50, and the residual glue layer on the first material seat 11 is removed by the scraper 51.
In this embodiment, as shown in fig. 6, the scraper 51 and the high-pressure water gun 52 are both located the oblique upper side of the material seat 11 and are fixed, the material seat 11 is just opposite to the direction corresponding to the cutting edge of the scraper 51, and this setting enables the material seat 11 to move forward by a length, that is, the residual glue is completely cleaned, and then the material seat 11 can be directly flowed into the next process, and the material seat 11 does not need to be moved back again, so that the time is saved, and the working efficiency is improved. Scraper 51 and high-pressure squirt 52 clear up the cull along the length direction of a material seat 11 in step, clear up remaining glue film on a material seat 11 with scraper 51 earlier promptly, and the glue film after the clearance is washed to reuse high-pressure squirt 52 afterwards to guarantee the cleanness of a material seat 11 by the face that bonds. The manipulator moves the first material seat 11 to the glue removing table 50, and the manipulator moves away after the first material seat 11 is clamped and fixed on the glue removing table 50; the scraper 51 and the high-pressure water gun 52 are ready to be in place, and the cleaning of the residual glue layer on the first material seat 11 is started.
Specifically, the cutting edge of the scraper 51 is arranged along the width direction of the first material seat 11 and is perpendicular to the length direction of the first material seat 11, the included angle theta between the cutting edge of the scraper 51 and the upper end surface of the first material seat 11 is 10-15 degrees, if the included angle theta is larger than 15 degrees, the force on the cutting edge is pressed on the upper end surface of the first material seat 11, the forward movement resistance of the scraper 51 is increased, and the cutting edge is damaged by collision; if contained angle theta is less than 10 degrees, the effect of clearance can be reduced, some residual glue is omitted, and the cleaning can not be completely realized. Preferably, the included angle θ between the blade edge of the scraper 51 and the upper end surface of the first material seat 11 is 10 to 15 °, which is more beneficial for the scraper 51 to horizontally move on the upper end surface of the first material seat 11 to clean the residual glue, and the residual glue cleaning effect is the best.
The high-pressure water gun 52 is arranged behind the scraper 51 and obliquely arranged downwards, the high-pressure water gun 52 sprays cleaning liquid towards the upper end face of the first material seat 11, the cleaning liquid is pure water, the rated pressure of the high-pressure water gun 52 is 2-12MP, the flow rate is 5-15L/min, preferably, the included angle between the muzzle of the high-pressure water gun 52 and the upper end face of the first material seat 11 is 45 degrees, the downward spraying pressure is the maximum, namely, the impact force for washing the first material seat 11 is the maximum, the washing effect is the best, the cleaned adhesive layer is favorably washed away, and the cleaned first material seat 11 is grabbed away by a manipulator and moved to a cooling device in the next working procedure for cooling.
In the glue removing process, the residual glue on the first material seat 11 is cleaned in a combined mode of the scraper 51 and the high-pressure water gun 52, and especially when the included angle between the cutting edge of the scraper 51 and the upper end surface of the first material seat 11 is 10-15 degrees, the residual glue cleaning effect is best; when the included angle between the muzzle of the high-pressure water gun 52 and the upper end surface of the first material seat 11 is 45 degrees, the impact force for washing the first material seat is the largest, and the washing effect is the best.
S2: with No. two flitch 21 automatic bonding on a material seat 11, form No. two frocks 20, the bonding process includes:
s21: and (3) cooling: the separated material seat I11 is placed in a cold water tank and/or a normal-temperature water tank, and the material seat I is cooled.
Since the temperature of the first material seat 11 after the glue removal is very high, the glue can not be directly dispensed on the upper end surface thereof, and if the glue is directly dispensed, the bonding effect is seriously affected, so the material seat needs to be cooled. The manipulator grabs the first material seat 11 onto the cooling table 60, and the cooling table 60 sequentially comprises a cold water tank 61 and/or a normal temperature water tank 62 which are independently arranged, as shown in fig. 7-9. That is, in the present embodiment, the first material seat 11 can be directly placed into the cold water tank 61 for cooling, so as to meet the requirement of cooling the first material seat 11, as shown in fig. 7; or the first material seat 11 is directly placed into the normal-temperature water tank 62 for cooling until the temperature of the first material seat 11 meets the requirement of cooling to room temperature, as shown in fig. 8; or the first material seat 11 enters the cold water tank 61 to be cooled and then enters the normal temperature water tank 62 to be cooled, and finally the required first material seat 11 is obtained, as shown in fig. 9.
Specifically, as shown in fig. 7, when the first material holder 11 is directly cooled in the cold water tank 61, a thermometer 63 for monitoring the temperature of the cold water is provided in the cold water tank 61. When the temperature of the tap water in the cold water tank 61 is not too low or too high, the waste of electrical resources is increased, and the service life of the first material seat 11 is shortened due to the change of the quenching shock. Preferably, the temperature in the cold water tank 61 is 10-15 ℃, and the cooling time of the material seat I11 in the cold water tank 61 is 20-30 s. After the temperature is reduced, the first material seat 11 is taken out by the manipulator and transferred to a drying device in the next procedure for drying.
As shown in fig. 8, when the first material seat 11 is directly cooled in the normal temperature water tank 62, the temperature in the water tank is always normal temperature, and the first material seat 11 stands still in the normal temperature water tank 62 for 30-50s, so that the temperature of the first material seat 11 can be slowly reduced, and the purpose of reducing the temperature is achieved.
As shown in fig. 9, when the first material holder 11 is first cooled by cold water and then cooled by normal temperature water, that is, the first material holder 11 is grabbed by a manipulator and first placed into the cold water tank 61 for cooling, the temperature of the cold water tank 61 is 10-15 ℃, and the cooling time is 2-5 s; after the cold water is cooled, the first material seat 11 is operated by the manipulator to enter the normal-temperature water tank 62 for cooling, the temperature of the water in the normal-temperature water tank 62 is 21-25 ℃, and the cooling time is 10-15 s. The cooling efficiency can be improved fast to the cooling methods of two kinds of combinations, practices thrift the cooling time, strives for the time for other process steps, and the while is cooled off fast earlier slowly and is not influenced greatly to a material seat 11 performance itself, can also shorten the cooling time under the condition that does not influence a material seat 11 quality itself, improves work efficiency. After the first material seat 11 is sequentially cooled by the cold water tank 61 and the normal temperature water tank 62, the temperature of the first material seat reaches the standard requirement, and then the first material seat is grabbed by the manipulator to the next procedure drying device for drying.
S22: and (3) drying: and drying the cooled first material seat 11 to evaporate the water on the surface of the first material seat 11.
After the first material seat 11 is moved into the drying chamber, hot air flow is arranged around the drying chamber, and the periphery of the first material seat 11 is directly dried and blown, so that the moisture on the upper end surface of the first material seat 11 can be quickly and completely evaporated. And cleaning preparation is carried out for the next step of dispensing on the bonded surface of the first material seat 11, so that the bonding quality of the second bonding plate is ensured.
S23: dispensing: the first material seat 11 is fixedly arranged on the dispensing table 70, and the dispensing is automatically performed on the bonded surface of the first material seat 11.
Specifically, the first material seat 11 is taken away from the drying chamber by a manipulator, moved to the dispensing table 70 and fixed on the dispensing table 70; and then, any dispensing machine used in the field is used for dispensing the upper end surface of the first material seat 11, namely, a certain amount of glue solution is dispensed on the upper end surface of the first material seat 11, so that the glue solution completely covers all areas of the bonded surface of the first material seat 11, and the bonding effect is ensured. The dispensing trajectory 71 is as shown in fig. 10, and includes a plurality of dispensing lines, which are straight dispensing lines 711 and dispensing lines 712, and broken dispensing lines 713 and dispensing lines 714, the dispensing lines 711, dispensing lines 712, dispensing lines 713, and dispensing lines 714 are cross-connected to each other and completely distributed on the bonding surface of the first material holder 11, all the dispensing lines have the same width, so that the dispensing trajectory 71 is continuous, uniform, and smooth, the glue is uniformly distributed on the bonding surface of the first material holder 11, no bubbles are generated in the whole process after dispensing, the uniformity is good, preparation is made for stable bonding of the second material plate 21 and the first material holder 11, and the bonding strength can be further ensured. Meanwhile, the distance between the two points is the shortest, so that the dispensing track 71 formed by the dispensing line formed by combining the straight line and the broken line, which is designed by the application, can save the using amount of the dispensing liquid to the maximum extent, and the shortest dispensing route is obtained, so that the utilization rate of the dispensing liquid is high, the bonding area is enlarged, the bonding force can be ensured, and the bonding efficiency is improved; the glue dispensing time can be saved to the maximum extent, the glue dispensing amount is reduced, the glue dispensing efficiency is improved, and the production cost is saved.
S24: plate bonding: and placing a second flitch 21 on the glue layer of the first material seat 11, bonding the second flitch with the first material seat 11, and curing for a certain time to form a second tool 20.
As shown in fig. 11, after dispensing, the first material seat 11 is still fixed on the dispensing table 70, the manipulator picks up a new intact second material plate 21 matched with the first material seat 11 and places the new intact second material plate 21 on the first material seat 11, the second material plate 21 is vertically corresponding to the first material seat 11, the second material plate 21 is completely attached to the first material seat 11, and then a balancing weight 72 is arranged on one side of the second material plate 21 away from the first material seat 11, so that the bonding strength between the second material plate 21 and the first material seat 11 is better. Preferably, the area of the counterweight block 72 close to the side of the second flitch 21 is larger than the area of the second flitch 21 far away from the side of the first flitch 11, that is, the area of the counterweight block 72 close to the side of the second flitch 21 is larger than the contact area between the second flitch 21 and the first flitch 11, and the weight of the counterweight block 72 is not smaller than the weight of the second flitch 21. The balancing weight 72 is arranged right above the second flitch 21 and is coincided with the central axis of the second flitch 21, so that the stress of the second flitch 21 is uniform, a downward pressure is given to the second flitch 21 to enable the second flitch 21 not to move on the first flitch seat 11, the bonding effect is ensured, the bonding force between the second flitch 21 and the first flitch seat 11 is stronger, and the bonding effect is better. The bonding curing time of the first material seat 11 and the second material plate 21 is not less than 450s, so that the second material plate 21 can be completely bonded with the first material seat 11, and then the workpiece 20 is moved to a workbench of the next procedure by a manipulator for the next operation.
The invention has the beneficial effects that:
1. according to the boiling and sticking method of the tool for sticking the silicon rods, the first material seat and the first material plate in the first tool are separated, and the second material plate is stuck on the first material seat to form the second tool and then put into use.
2. The first tool is cooked by adopting an automatically controlled water cooking tank, and an ultrasonic vibrating plate is added in the water cooking tank to accelerate the softening progress of the first material seat and the first material plate and accelerate the cleaning of residual liquid medicine and particle impurities on the first material plate and the first material seat so as to ensure the cleanness of the first tool; the water boiling temperature and the water boiling time are optimized, particularly, after the water boiling is maintained for 350-500s at the temperature of 85-95 ℃, the softening effect of the first material seat and the first material plate is the best, and the separation quality in the next working procedure is better facilitated.
3. In the course of the separation, the scraper knife goes into the sword along a material seat length direction and from a material board width direction, detaches a material board in a fixed frock, and the scraper knife can make a flitch and a material seat part with minimum thrust, and the scraper knife promotes a material board and separates away a flitch from a material seat fast, and a material board of being rejected falls into the accumulator that the side set up automatically, waits for recycling.
4. The residual glue on a material seat is cleaned in a mode of combining a scraper and a high-pressure water gun, and especially when the included angle between the cutting edge of the scraper and the upper end surface of the material seat is 10-15 degrees, the residual glue cleaning effect is best; when the included angle between the muzzle of the high-pressure water gun and the upper end surface of a material seat is 45 degrees, the impact force for washing the material seat is the largest, and the washing effect is the best.
5. In the glue dispensing process, glue is dispensed by adopting a glue dispensing track formed by cross connection of a plurality of glue dispensing straight lines and broken lines, the glue dispensing track is uniform, smooth and consistent, so that glue solution is uniformly distributed on the bonding surface of the first material seat, no bubbles are generated after the glue dispensing is performed in the whole process, the glue dispensing process is continuous, uniform and good in consistency, the second material plate and the first material seat are bonded stably, and the strength and the effect are high; meanwhile, the distance between the two points is the shortest, so that the dispensing track formed by the dispensing line designed by the application saves the using amount of the dispensing liquid to the maximum extent, and the shortest dispensing route is obtained, so that the utilization rate of the dispensing liquid is high, the bonding area is enlarged, the bonding force can be ensured, and the bonding efficiency is improved; meanwhile, the dispensing time can be saved to the maximum extent, the dispensing amount is reduced, the dispensing efficiency is improved, and the production cost is saved.
6. In the bonding curing process, one side of keeping away from a material seat at No. two flitches sets up the balancing weight, and the area that the balancing weight is close to No. two flitch one side is greater than the area of No. two flitches and the contact of a material seat, can further guarantee the steadiness of No. two flitches on a material seat, guarantees the bonding effect, makes No. two flitches stronger with the bonding force of a material seat, and the bonding effect is better.
The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention and should not be construed as limiting the scope of the present invention. All equivalent changes and modifications made within the scope of the present invention shall fall within the scope of the present invention.
Claims (10)
1. A boiling and bonding method of a tool for bonding silicon rods is characterized by comprising the following steps:
s1: providing a first tool which comprises a first material plate and a first material seat which are bonded into a whole; separating the first material plate from the first material seat in the first tooling;
s2: providing a second material plate; and executing the automatic bonding of the second material plate on the separated first material seat to form a second tool.
2. The boiling and bonding method of the silicon rod bonding tool according to claim 1, wherein the step S1 specifically comprises:
s11: the first tooling is arranged in the water boiling grooves and is kept for a set time at a set water temperature, so that a glue layer between the first material plate and the first material seat is softened;
s12: the first tooling is executed on the first plate disassembling table, and a scraper knife arranged on the first plate disassembling table is executed to push the first material plate to be separated from the first material seat;
s13: including removing the platform of gluing, carry out a material seat in remove the bench of gluing to the execution sets up remove the epaxial scraper of gluing and get rid of No. a material seat is gone up remaining glue film, and the reuse setting is in remove the epaxial squirt of gluing and right a material seat washes.
3. The boiling and bonding method of the silicon rod bonding tool as claimed in claim 2, wherein the temperature of the water in the step S11 is 80-100 ℃, and the retention time is 350-500S.
4. The boiling and bonding method of the silicon rod bonding tool as claimed in claim 3, wherein the temperature of the water in the S11 is 85-95 ℃, and the retention time is 400-450S.
5. The boiling and bonding method of the silicon rod bonding tool according to any one of claims 2 to 4, wherein a vibrating plate is further arranged in the boiling tank, and the vibrating plate is arranged below the first tool.
6. The boiling and bonding method of the silicon rod bonding tool according to claim 1, wherein the step S2 specifically comprises:
s21: the material receiving device comprises a plurality of water tanks, wherein the material receiving device is used for receiving a material to be separated;
s23: the adhesive dispensing device comprises a dispensing table, wherein the first material seat is executed on the dispensing table, and the adhesive to be adhered of the first material seat is dispensed automatically;
s24: and providing a second material plate right above the first material seat, performing bonding of the second material plate and the first material seat, and curing for a certain time to form the second tool.
7. The boiling and sticking method for the silicon rod bonding tool according to claim 6, wherein the step S21 comprises cold water cooling and/or normal temperature cooling, and the water used in the step S21 is tap water.
8. The boiling and gluing method of the silicon rod bonding tool according to claim 6 or 7, further comprising a step S22 before the step S23, wherein the step S22 comprises a step of drying the cooled first material seat in a drying chamber, so that moisture on the surface of the first material seat is evaporated to dryness.
9. The boiling and bonding method of the silicon rod bonding tool according to claim 8, wherein the bonding curing time of the first material seat and the second material plate is not less than 450 s.
10. The boiling and bonding method for the silicon rod bonding tool according to any one of claims 6 to 7 and 9, wherein in S24, the method further comprises the step of arranging a weight on a side of the second material plate away from the first material seat; the area of one side of the balancing weight, which is close to the second material plate, is larger than the contact area of the second material plate and the first material seat.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010320456.1A CN111501103A (en) | 2020-04-22 | 2020-04-22 | Boiling and bonding method of tool for bonding silicon rods |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010320456.1A CN111501103A (en) | 2020-04-22 | 2020-04-22 | Boiling and bonding method of tool for bonding silicon rods |
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