CN111522207B - Scanning Mura detection method and device of digital exposure machine - Google Patents

Abstract

The invention provides a method and a device for detecting scanning Mura of a digital exposure machine, wherein the method comprises the following steps: acquiring point coordinates of automatic focusing measurement data at a measurement area j of an exposure substrate scanned for the ith time by an exposure device of the digital exposure machine, and converting the point coordinates into a focusing plane measurement data matrix of M x N, wherein M is the number of micromirrors of the digital micromirror device of the exposure device in a first direction, and N is the number of micromirrors in a second direction; acquiring a difference value matrix of automatic focusing measurement data of each micromirror, which is caused by the angle of the digital micromirror device in a first direction and the angle of the digital micromirror device in a second direction; acquiring the exposure times of the graph of the ith scanning in the measurement area j; according to the focusing plane measurement data matrix, the difference value matrix and the exposure times, determining equivalent automatic focusing measurement data of the ith scanning in the measurement area j; and determining the scanning Mura according to the equivalent automatic focusing measurement data, thereby monitoring the scanning Mura.

Description

Scanning Mura detection method and device of digital exposure machine

technical field

Embodiments of the present invention relate to the technical field of digital exposure, and in particular, to a scanning Mura detection method and device for a digital exposure machine.

Background technique

The digital exposure machine has the advantages of high resolution and no need to make a mask. It is the future direction of exposure technology development. However, due to the structure and exposure principle, Scan Mura (uneven scanning) will be caused, and the scanning Mura will be in different exposures. There is no obvious pattern between the substrates (glass), which makes the scanning Mura difficult to monitor and directly affects the product quality.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide a method and device for detecting scanning Mura of a digital exposure machine, which are used to solve the problem that the scanning Mura of a digital exposure machine is difficult to monitor.

In order to solve the above-mentioned technical problems, the present invention is achieved in this way:

In a first aspect, an embodiment of the present invention provides a scanning Mura detection method for a digital exposure machine, including:

Obtain the point coordinates H _ij of the autofocus measurement data at the measurement area j of the exposure substrate in the i-th scan of an exposure device of the digital exposure machine, and convert the point coordinates into an M*N focus plane measurement data matrix, so Each numerical value in the focal plane measurement data matrix is H _ij , M is the number of micromirrors in the first direction of the digital micromirror device of the exposure equipment, and N is the digital micromirror device in the second direction. the number of micromirrors on;

Obtain the autofocus measurement data of the i-th scan of each micromirror at the measurement area j of the exposure substrate due to the angle α in the first direction and the angle β in the second direction of the digital micromirror device The difference value matrix of ;

Obtain the exposure times of the pattern at the measurement area j of the exposure substrate in the i-th scan;

According to the focal plane measurement data matrix, the difference value matrix and the exposure times, determine the equivalent autofocus measurement data received by the i-th scan of the pattern at the measurement area j of the exposed substrate;

The scan Mura of the digital exposure machine is determined from the equivalent autofocus measurement data.

Optionally, the difference value matrix B _ij is:

Wherein, D _α is the height difference of two adjacent micromirrors in the first direction caused by the angle α of the digital micromirror device in the first direction, D _β is the height difference of the digital micromirror device in the second direction The height difference of two adjacent micromirrors in the second direction caused by the angle β of the direction, p1 is the usage rate of the micromirrors in the first direction of the digital micromirror device, and p2 is the digital micromirror device. The usage rate of the micromirror in the second direction, L is the length of the digital micromirror device in the first direction, L=M*d, W is the length of the digital micromirror device in the second direction, W =N*d, the size of each micromirror is d*d.

Optionally, the exposure times f(l) is:

Optionally, the equivalent autofocus measurement data C _ij (k) received by the i-th scan of the pattern at the measurement area j of the exposed substrate is:

B _i,j (k,l)=l*D _α +k*D _β

Wherein, B _ij (k, l) is the autofocus measurement data of the i-th scan of the micromirror of the kth row and the 1st column of the micromirror and the micromirror of the 1st row and the 1st column at the measurement area j of the exposure substrate. difference value.

Optionally, after determining the equivalent autofocus measurement data received by the i-th scan of the pattern at the measurement area j of the exposed substrate, the method further includes:

Draw at least one of the following graphs:

Draw a two-dimensional equivalent autofocus measurement data map according to the equivalent autofocus measurement data in at least one exposure area of the digital exposure machine, wherein the first coordinate axis of the two-dimensional equivalent autofocus measurement data map is The serial number of the scan, the second coordinate axis is the measurement area;

Draw a 3D equivalent AF measurement data map according to the equivalent AF measurement data in at least one exposure area of the digital exposure machine, wherein the first coordinate axis of the 3D equivalent AF measurement data map is scanned Serial number, the second coordinate axis is the measurement area, and the third coordinate axis is the equivalent autofocus measurement data;

Draw a comparison diagram of the equivalent autofocus measurement data received by the i-th scan and the i+1-th scan of an exposure device of the digital exposure machine at the measurement area j of the exposure substrate, wherein, The number of exposures of the digital micromirror device in the first direction during the i-th scan is M times, and the number of exposures of the digital micromirror device in the first direction during the i+1th scan is 1 time;

Draw a comparison diagram of the equivalent autofocus measurement data of two adjacent micromirrors received by the i-th scan of an exposure device of the digital exposure machine at the measurement area j of the exposure substrate.

Optionally, after determining the scanning Mura of the digital exposure machine according to the equivalent autofocus measurement data, the method further includes:

Alarm for certain scan Mura.

In a second aspect, an embodiment of the present invention provides a scanning Mura detection device for a digital exposure machine, including:

The first acquisition module is used to acquire the point coordinates H _ij of the autofocus measurement data at the measurement area j of the exposure substrate in the i-th scan of an exposure device of the digital exposure machine, and convert the point coordinates into M*N coordinates. Focus plane measurement data matrix, each value in the focus plane measurement data matrix is H _ij , M is the number of micromirrors in the first direction of the digital micromirror device of the exposure device, and N is the number the number of micromirrors of the micromirror device in the second direction;

The second acquisition module is configured to acquire the measurement area of the exposure substrate for the i-th scan of each micromirror caused by the angle α in the first direction and the angle β in the second direction of the digital micromirror device A matrix of disparity values for the autofocus measurement data at j;

a third acquisition module, configured to acquire the exposure times of the image in the i-th scan of the pattern at the measurement area j of the exposure substrate;

The first determination module is configured to determine, according to the focal plane measurement data matrix, the difference value matrix and the number of exposures, the equivalent automatic image received by the i-th scan of the pattern at the measurement area j of the exposed substrate. Focus measurement data;

The second determining module is configured to determine the scanning Mura of the digital exposure machine according to the equivalent autofocus measurement data.

Optionally, the difference value matrix B _ij is:

Wherein, D _α is the height difference of two adjacent micromirrors in the first direction caused by the angle α of the digital micromirror device in the first direction, D _β is the height difference of the digital micromirror device in the second direction The height difference of two adjacent micromirrors in the second direction caused by the angle β of the direction, p1 is the usage rate of the micromirrors in the first direction of the digital micromirror device, and p2 is the digital micromirror device. The usage rate of the micromirror in the second direction, L is the length of the digital micromirror device in the first direction, L=M*d, W is the length of the digital micromirror device in the second direction, W =N*d, the size of each micromirror is d*d.

Optionally, the number of exposures satisfies:

Wherein, m is the number of exposures, f(l) is the number of micromirrors selected for exposure, and M is the number of micromirrors of the digital micromirror device in the first direction.

Optionally, the equivalent autofocus measurement data C _ij (k) received by the i-th scan of the pattern at the measurement area j of the exposed substrate is:

B _i,j (k,l)=l*D _α +k*D _β

Wherein, B _ij (k, l) is the autofocus measurement data of the i-th scan of the micromirror of the kth row and the 1st column of the micromirror and the micromirror of the 1st row and the 1st column at the measurement area j of the exposure substrate. difference value.

Optionally, the scanning Mura detection device of the digital exposure machine also includes:

A plotting module for plotting at least one of the following:

Draw a two-dimensional equivalent autofocus measurement data map according to the equivalent autofocus measurement data in at least one exposure area of the digital exposure machine, wherein the first coordinate axis of the two-dimensional equivalent autofocus measurement data map is The serial number of the scan, the second coordinate axis is the measurement area;

Draw a 3D equivalent AF measurement data map according to the equivalent AF measurement data in at least one exposure area of the digital exposure machine, wherein the first coordinate axis of the 3D equivalent AF measurement data map is scanned Serial number, the second coordinate axis is the measurement area, and the third coordinate axis is the equivalent autofocus measurement data;

Draw a comparison diagram of the equivalent autofocus measurement data received by the i-th scan and the i+1-th scan of an exposure device of the digital exposure machine at the measurement area j of the exposure substrate, wherein, The number of exposures of the digital micromirror device in the first direction during the i-th scan is M times, and the number of exposures of the digital micromirror device in the first direction during the i+1th scan is 1 time;

Draw a comparison diagram of the equivalent autofocus measurement data of two adjacent micromirrors received by the i-th scan of an exposure device of the digital exposure machine at the measurement area j of the exposure substrate.

Optionally, the scanning Mura detection device of the digital exposure machine also includes:

The alarm module is used to alarm the determined scanning Mura.

In the embodiment of the present invention, since the three-dimensional characteristics of the focus surface and the number of exposures (Multiple) are considered, more accurate autofocus measurement data can be determined, thereby determining the scanning Mura of the data exposure machine, and the digital exposure machine can be analyzed according to the scanning Mura. The difference between each scan caused by autofocus plays an important role in finding the real machine factor that causes the scanning Mura and solving the scanning Mura solution, and monitoring the autofocus measurement data of the machine in real time, which may cause the scanning Mura. The automatic focus measurement data alarm, so that the appearance of the scanning Mura can be monitored, which is also of great significance for the feasibility of mass production.

Description of drawings

Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are for the purpose of illustrating preferred embodiments only and are not to be considered limiting of the invention. Also, the same components are denoted by the same reference numerals throughout the drawings. In the attached image:

Fig. 1 is the exposure process schematic diagram of digital exposure machine;

2 is a schematic diagram of a method for measuring the height of an exposed substrate in an autofocusing process;

Figure 3 is an autofocus measurement data map;

4 is a schematic diagram of a focus plane in an autofocus process;

5 is a schematic flowchart of a scanning Mura detection method of a digital exposure machine in an embodiment of the present invention;

6 is a schematic diagram of a scanning sequence and a measurement area of a digital exposure machine;

7 is a schematic diagram of an acquisition process of equivalent automatic diagonal data of a digital exposure machine according to an embodiment of the present invention;

FIG. 8 and FIG. 9 are schematic diagrams of exposure times in one scanning process of the digital exposure machine according to the embodiment of the present invention;

10 and 11 are schematic diagrams comparing the autofocus measurement data map drawn for C _ij according to the equivalent autofocus data and the lighting effect map of the actual display module;

12 and 13 are schematic diagrams of a two-dimensional autofocus measurement data map according to an embodiment of the present invention;

14 is a schematic diagram of a three-dimensional autofocus measurement data map according to an embodiment of the present invention;

15 and 16 are schematic diagrams showing the difference between the equivalent autofocus measurement data received by the i-th scan and the i+1-th scan of the pattern at the measurement area j of the exposed substrate;

17 is a schematic diagram of the comparison of the equivalent autofocus measurement data of two adjacent micromirrors received by the i-th scan of the pattern at the measurement area j of the exposed substrate;

18 is a schematic interface diagram of a software for drawing an autofocus measurement data map in an embodiment of the present invention;

19 is a schematic structural diagram of a scanning Mura detection device of a digital exposure machine in an embodiment of the present invention.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

The scanning Mura of a digital exposure machine is an urgent problem to be solved at present. From the lit display products, it can be observed that the overall law of scanning Mura is randomly distributed on the entire substrate (glass). Figure 1 is a schematic diagram of the exposure process of the digital exposure machine. The main factors affecting the exposure quality are as follows: 1. TTZ, that is, the angle of the DMD (Digital Micromirror Device); 2. Dose (exposure energy) 3. Fade (exposure energy blur area); 4. LensAberration (lens phase difference); 5. Focus (focus) plane; 6. Stage Movement (machine movement); 7. Pattern Indensity (graphic density). The above factors are compared with the randomness of the results of scanning Mura. The factors with randomness are the Focus plane and Stage Movement during the exposure process.

In order to transfer the pattern on the virtual mask to the photoresist completely and accurately, the pattern projected by the digital exposure machine on the photoresist layer must have a certain depth of focus (DOF), so that the entire photoresist layer, whether near the surface of the photoresist layer or the ground, has the same focusing effect. Generally speaking, DOF is used to represent the depth of focus provided by the digital exposure machine, DOF=K2λ/(NA)^2, where K is a constant related to the photoresist material and process parameters, and NA is the lens system of the digital exposure machine The value of the numerical aperture (Numerical Aperture, NA), λ is the light source wavelength of the digital exposure machine. Among them, in order to increase the depth of focus of the digital exposure machine, the wavelength of the light source should be as long as possible, and the NA value of the lens system of the digital exposure machine should be as small as possible.

However, the relationship between the resolution of the digital exposure machine and the wavelength of the light source of the digital exposure machine is R=Kλ/NA, where K is a constant related to the photoresist material and process parameters, and NA is the numerical aperture of the lens system of the digital exposure machine. value, λ is the wavelength of the light source of the digital exposure machine. It can be known from the above relationship that when the wavelength λ of the light source of the digital exposure machine is shorter, the resolution of the digital exposure machine is also smaller. And when the NA of the lens system of the digital exposure machine is larger, the resolution provided by the same digital exposure machine is smaller.

It can be seen that if the digital exposure machine has a higher resolution, the DOF is lower.

In order to keep the focus plane always in the DOF during the exposure process, during the exposure process, a detection sensor is set to measure the height change of the exposure substrate and the machine, and the height of the digital micromirror device is adjusted according to the measured height change. , to ensure that the focus plane is always within the DOF range during exposure. As shown in Figure 2, the figure includes three detection sensors for measuring the height of the exposure substrate. According to the measurement data of the three sensors, a height (ie, the autofocus measurement data) is obtained, and the digital micromirror device and the exposure substrate are adjusted according to the height. The distance between them keeps the focus plane in the DOF all the time, and this function is called Autofocus.

After exposing a complete substrate, the digital exposure machine records the autofocus measurement data of all SCANs in the same measurement position in different exposure areas (EYE) of the exposed substrate, and draws an autofocus measurement data map (autofocusheight map), and analyzes the exposure substrate and deformation of the machine.

As shown in Figure 3, the autofocus measurement data map (autofocus height map) is shown. In Figure 3, the abscissa is the scan number (Scan NO.), which represents the Nth scan (Scan), and the ordinate is the measurement area (Scan position). ) (the length from the scanning start point), and the data in the two-dimensional graph represents the change value of the autofocus measurement data of the Nth scan. However, this graph can only analyze the height change of the entire exposure substrate and the machine, and cannot analyze the difference between scan and scan caused by autofocus, because the measured autofocus measurement data ), the angle of the digital micromirror device, and the times of Multiple (representing the same position of the exposure substrate, how many micromirrors are exposed) are all ignored, and are completely abstracted into a point coordinate. As shown in Figure 4, the actual focus plane is an angled three-dimensional plane (that is, the hourglass-shaped figure in Figure 4). In the actual processing process, all the focus planes are treated as one value, which is different from the actual observation that the scanning Mura is in the There is no obvious pattern matching between different exposed substrates, indicating that analyzing the autofocus measurement data has an important influence on the generation of scanning mura.

Therefore, how to establish a method for analyzing the scanning Mura from the autofocus measurement data is of great importance to find the real machine factors that cause the scanning Mura and solve the scanning Mura solution, and monitor the autofocus measurement data of the machine in real time, which may cause the scanning Mura. The Mura's autofocus measurement data alarms, so that the scanning Mura as it occurs can be monitored, which also has significant implications for mass production feasibility.

In order to solve the above problems, please refer to FIG. 5, an embodiment of the present invention provides a scanning Mura detection method of a digital exposure machine, including:

Step 51: Obtain the point coordinates H _ij of the autofocus measurement data at the measurement area j of the exposure substrate in the i-th scan of an exposure device of the digital exposure machine, and convert the point coordinates into M*N focus plane measurement data matrix, each value in the focal plane measurement data matrix is H _ij , M is the number of micromirrors in the first direction of the digital micromirror device of the exposure equipment, and N is the digital micromirror device in the the number of micromirrors in the second direction;

It should be noted that a digital exposure machine includes a plurality of exposure devices, each exposure device includes a digital micromirror device, and each exposure device corresponds to an exposure area (EYE) on the exposure substrate.

This step is to convert the measurement point (that is, the point coordinates H _ij of the autofocus measurement data) into the measurement plane (that is, the focus plane measurement data matrix A _ij ). The point coordinates H _ij of the autofocus measurement data are assigned to each micromirror of the digital micromirror device, forming a matrix with the same number of micromirrors as the digital micromirror device, and the autofocus measurement data of each micromirror in the matrix is the same. is H _ij , and the measurement point data of the micromirror in the k-th row and the l-th column is A _i,j (k,l)=H _ij . The focal plane measurement data matrix A _ij can be expressed as:

As shown in Figure 6, the exposure substrate can be divided into multiple exposure areas (EYEs), each exposure area corresponds to an exposure device of the digital exposure machine. In Figure 6, the exposure substrate is divided into 18 EYEs, each EYE carries out N Scans (Scan), each scan corresponds to N measurement areas.

In the embodiment of the present invention, optionally, the first direction is the X-axis direction, that is, the horizontal direction, and the second direction is the Y-axis direction, that is, the vertical direction.

Step 52: Obtain the automatic scanning of the i-th scanning of each micromirror at the measurement area j of the exposure substrate due to the angle α of the digital micromirror device in the first direction and the angle β in the second direction. Difference value matrix of focus measurement data;

This step is to convert the focus plane into a solid plane.

As shown in FIG. 7, at the time of exposure, the DMD may have focal plane angles α and β in the horizontal and vertical directions.

Wherein, when the angle of the digital micromirror device in the first direction is α, the height difference of the micromirrors at the two edges of the digital micromirror device in the first direction is H _α :

When the angle of the digital micromirror device in the second direction is β, the height difference of the micromirrors of the two edges of the digital micromirror device in the second direction is H _β :

When the angle of the digital micromirror device in the first direction is α, the height difference between two adjacent micromirrors of the digital micromirror device in the first direction is D _α :

Wherein, p1 is the usage rate of the micromirror in the first direction of the digital micromirror device, L is the length of the digital micromirror device in the first direction, L=M*d, W is the digital micromirror device The length of the mirror device in the second direction, W=N*d, and the size of each micromirror is d*d.

When the angle of the digital micromirror device in the second direction is β, the height difference between two adjacent micromirrors of the digital micromirror device in the second direction is D _β :

Wherein, p2 is the usage rate of the micromirror in the second direction of the digital micromirror device, L is the length of the digital micromirror device in the first direction, L=M*d, W is the digital micromirror device The length of the mirror device in the second direction, W=N*d, and the size of each micromirror is d*d.

In the embodiment of the present invention, when calculating the height difference of the micromirror in the first direction, the micromirror on one edge of the digital micromirror device in the first direction is used as a reference, and the difference between the micromirror of other micromirrors and the micromirror is calculated. The height difference, similarly, when calculating the height difference of the micromirror in the second direction, take the micromirror on one edge of the digital micromirror device in the second direction as the benchmark, calculate the difference between other micromirrors and this micromirror. height difference.

B _ij is the auto focus of the i-th scan of each micromirror at the measurement area j of the exposure substrate due to the angle α in the first direction and the angle β in the second direction of the digital micromirror device A matrix of variance values for the measurement data. The difference value of the autofocus measurement data of the micromirror at the kth row and the lth column is B _i,j (k,l)=l*D _α +k*D _β .

B _ij can be expressed as follows:

Step 53 : obtaining the exposure times of the pattern at the measurement area j of the exposure substrate in the i-th scan;

The number of exposures (Multiple value) refers to how many micromirrors are exposed in one scan for the pattern at the same position of the exposure substrate. As shown in Figure 8, the black dotted line represents the exposure substrate, the grid-shaped pattern is a digital micromirror device, each grid represents a micromirror, the rectangular pattern (Pattern) on the exposure substrate represents a fixed position pattern on the exposure substrate, and the elliptical pattern The flip angle of the micromirror representing the digital micromirror device is the exposure.

As shown in FIG. 9 , in the actual exposure process, the digital micromirror device performs three exposures on the same pattern (Pattern), that is, three micromirrors are used for exposure, and the number of exposures is three. In the actual exposure process, the position of the digital micromirror device is fixed, the exposure substrate moves along the exposure direction, and the micromirror exposure is selected at equal intervals during the process from t1 to t3.

The number of exposures satisfies:

Wherein, m is the number of exposures, f(l) is the number of micromirrors selected for exposure, and M is the number of micromirrors of the digital micromirror device in the first direction.

Step 54: According to the focus plane measurement data matrix, the difference value matrix and the exposure times, determine the equivalent autofocus measurement data received by the i-th scan of the pattern at the measurement area j of the exposed substrate.

Wherein, the equivalent autofocus measurement data C _ij (k) received by the i-th scan of the pattern at the measurement area j of the exposed substrate can be expressed as:

B _i,j (k,l)=l*D _α +k*D _β

Wherein, B _ij (k, l) is the autofocus measurement data of the i-th scan of the micromirror of the kth row and the 1st column of the micromirror and the micromirror of the 1st row and the 1st column at the measurement area j of the exposure substrate. difference value.

Step 55: Determine the scanning Mura of the digital exposure machine according to the equivalent AF measurement data.

In the embodiment of the present invention, since the three-dimensional characteristics of the focus surface and the number of exposures (Multiple) are considered, more accurate autofocus measurement data can be determined, thereby determining the scanning Mura of the data exposure machine, and the digital exposure machine can be analyzed according to the scanning Mura. The difference between each scan caused by autofocus plays an important role in finding the real machine factor that causes the scanning Mura and solving the scanning Mura solution, and monitoring the autofocus measurement data of the machine in real time, which may cause the scanning Mura. The automatic focus measurement data alarm, so that the appearance of the scanning Mura can be monitored, which is also of great significance for the feasibility of mass production.

Referring to FIG. 7 again, the detection method of the scanning mura of the above-mentioned digital exposure machine will be described. In FIG. 7 (a) is the point coordinates of the autofocus data obtained by measurement, and (b) is the point coordinates H _ij → focus plane measurement data matrix A _ij , (c) is considering the angles α and β of the digital micro-mirror device in the first and second directions, the size of the digital micro-mirror device is W*L, and the number of exposures of the digital micro-mirror device in one scan , the above factors work together to cause the equivalent AF data received by the image in the position area j in the i-th scan to be C _ij , and C _ij can be used to analyze the difference between SCAN and SCAN caused by changes in AF data.

Comparing the autofocus measurement data map drawn for C _ij according to the equivalent autofocus data with the lighting effect map of the actual display module, please refer to accompanying drawings 10 and 11, it can be seen that the autofocus measurement data map The Mura distribution of the actual display module can be accurately simulated.

In the embodiment of the present invention, optionally, after determining the equivalent autofocus measurement data received by the i-th scan of the pattern at the measurement area j of the exposed substrate, the method further includes:

Draw at least one of the following graphs:

1) according to the equivalent autofocus measurement data in at least one exposure area of the digital exposure machine, draw a two-dimensional equivalent autofocus measurement data map, wherein the first coordinate of the two-dimensional equivalent autofocus measurement data map The axis is the serial number of the scan, and the second axis is the measurement area;

Please refer to FIG. 12 and FIG. 13 . FIG. 12 and FIG. 13 are two-dimensional equivalent autofocus measurement data maps according to the embodiment of the present invention. The difference between FIG. 12 and FIG. 13 is that in FIG. 13 , the digital micromirror device (DMD) has A certain focus angle (0.7 degrees). 12 and 13 , the first coordinate axis of the two-dimensional equivalent autofocus measurement data map is the serial number of the scan (Scan NO.), and the second coordinate axis is the measurement area (Scan Position).

2) according to the equivalent autofocus measurement data in at least one exposure area of the digital exposure machine, draw a three-dimensional equivalent autofocus measurement data map, wherein the first coordinate axis of the three-dimensional equivalent autofocus measurement data map is The serial number of the scan, the second coordinate axis is the measurement area, and the third coordinate axis is the equivalent autofocus measurement data;

Please refer to FIG. 14. FIG. 14 is a three-dimensional equivalent autofocus measurement data map according to an embodiment of the present invention. In FIG. 14, the first coordinate axis of the three-dimensional equivalent autofocus measurement data map is the sequence number of the scan (Scan NO.) , the second coordinate axis is the measurement area (Scan Position), and the third coordinate axis is the equivalent autofocus measurement data (Autofocus Height).

The height h on the third coordinate axis can be expressed as:

h=f(i, _j ,Cij(k))

3) Please refer to FIG. 15 and FIG. 16 , draw the i-th scan and the i+1-th scan of an exposure device of the digital exposure machine at the measurement area j of the exposure substrate. The equivalent automatic The comparison chart of the focus measurement data, wherein, the exposure times of the digital micromirror device in the first direction during the i-th scan are M times, and the digital micromirror device is in the first direction during the i+1th scan. The number of exposures is 1 to find the difference between different scans.

The difference between the equivalent AF measurement data received by the pattern at the measurement area j of the exposed substrate in the i-th scan and the i+1-th scan can be expressed as:

DH=C _ij (M)-C _i+1j (1)

4) Please refer to Fig. 17, the equivalent autofocus measurement data of the adjacent two micromirrors received by the i-th scan of an exposure device of the digital exposure machine at the measurement area j of the exposure substrate received The comparison chart of , the difference of the equivalent AF measurement data of two adjacent adjacent micromirrors can be expressed as:

D _R =C _ij (j+1)-C _i+1j (j),j=1,2....,N

In the embodiment of the present invention, optionally, after determining the equivalent autofocus measurement data received by the i-th scan of the pattern at the measurement area j of the exposed substrate, the method further includes:

Scan Mura is alerted based on equivalent AF measurement data for each scan within an exposure area.

In the embodiment of the present invention, the autofocus measurement data map can be drawn through the software interface shown in FIG. 18 , under the software interface:

1. Mode can choose between Scan to Scan and Eye to Eye in one EYE.

2. Including the parameter values of the digital micromirror device (DMD): angle (Angle), ratio (Ratio) (that is, the usage rate of the micromirror), (resolution) Resolution, for example, if the resolution is 1600*2560, it means that the digital micromirror The mirror arrangement has 1600 micromirrors in the first direction and 2560 micromirrors in the second direction.

3. Analyze the specified Eye.

4. Specify and analyze any SCAN and any measurement area.

Please refer to FIG. 19, an embodiment of the present invention also provides a scanning Mura detection device of a digital exposure machine, including:

The first acquisition module is used to acquire the point coordinates H _ij of the autofocus measurement data at the measurement area j of the exposure substrate in the i-th scan of an exposure device of the digital exposure machine, and convert the point coordinates into M*N coordinates. Focus plane measurement data matrix, each value in the focus plane measurement data matrix is H _ij , M is the number of micromirrors in the first direction of the digital micromirror device of the exposure device, and N is the number the number of micromirrors of the micromirror device in the second direction;

The second acquisition module is configured to acquire the measurement area of the exposure substrate for the i-th scan of each micromirror caused by the angle α in the first direction and the angle β in the second direction of the digital micromirror device A matrix of disparity values for the autofocus measurement data at j;

a third acquisition module, configured to acquire the exposure times of the image in the i-th scan of the pattern at the measurement area j of the exposure substrate;

The first determination module is configured to determine, according to the focal plane measurement data matrix, the difference value matrix and the number of exposures, the equivalent automatic image received by the i-th scan of the pattern at the measurement area j of the exposed substrate. Focus measurement data;

The second determining module is configured to determine the scanning Mura of the digital exposure machine according to the equivalent autofocus measurement data.

Optionally, the difference value matrix B _ij is:

Wherein, D _α is the height difference of two adjacent micromirrors in the first direction caused by the angle α of the digital micromirror device in the first direction, D _β is the height difference of the digital micromirror device in the second direction The height difference of two adjacent micromirrors in the second direction caused by the angle β of the direction, p1 is the usage rate of the micromirrors in the first direction of the digital micromirror device, and p2 is the digital micromirror device. The usage rate of the micromirror in the second direction, L is the length of the digital micromirror device in the first direction, L=M*d, W is the length of the digital micromirror device in the second direction, W =N*d, the size of each micromirror is d*d.

Optionally, the number of exposures satisfies:

Wherein, m is the number of exposures, f(l) is the number of micromirrors selected for exposure, and M is the number of micromirrors of the digital micromirror device in the first direction.

Optionally, the equivalent autofocus measurement data C _ij (k) received by the i-th scan of the pattern at the measurement area j of the exposed substrate is:

B _i,j (k,l)=l*D _α +k*D _β

Wherein, B _ij (k, l) is the autofocus measurement data of the i-th scan of the micromirror of the kth row and the 1st column of the micromirror and the micromirror of the 1st row and the 1st column at the measurement area j of the exposure substrate. difference value.

Optionally, the scanning Mura detection device of the digital exposure machine also includes:

A plotting module for plotting at least one of the following:

Draw a two-dimensional equivalent autofocus measurement data map according to the equivalent autofocus measurement data in at least one exposure area of the digital exposure machine, wherein the first coordinate axis of the two-dimensional equivalent autofocus measurement data map is The serial number of the scan, the second coordinate axis is the measurement area;

Draw a 3D equivalent AF measurement data map according to the equivalent AF measurement data in at least one exposure area of the digital exposure machine, wherein the first coordinate axis of the 3D equivalent AF measurement data map is scanned Serial number, the second coordinate axis is the measurement area, and the third coordinate axis is the equivalent autofocus measurement data;

Draw a comparison diagram of the equivalent autofocus measurement data received by the i-th scan and the i+1-th scan of an exposure device of the digital exposure machine at the measurement area j of the exposure substrate, wherein, The number of exposures of the digital micromirror device in the first direction during the i-th scan is M times, and the number of exposures of the digital micromirror device in the first direction during the i+1th scan is 1 time;

Draw a comparison diagram of the equivalent autofocus measurement data of two adjacent micromirrors received by the i-th scan of an exposure device of the digital exposure machine at the measurement area j of the exposure substrate.

Optionally, the scanning Mura detection device of the digital exposure machine also includes:

The alarm module is used to alarm the determined scanning Mura.

The embodiments of the present invention have been described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific embodiments, which are merely illustrative rather than restrictive. Under the inspiration of the present invention, without departing from the spirit of the present invention and the scope protected by the claims, many forms can be made, which all belong to the protection of the present invention.

Claims (10)

1. A method for detecting the scanning Mura of a digital exposure machine is characterized by comprising the following steps:

acquiring point coordinates H of autofocus measurement data at measurement region j of an exposure substrate for the ith scan of an exposure apparatus of a digital exposure machine _ij Converting the point coordinates into a focusing plane measurement data matrix of M x N, wherein each numerical value in the focusing plane measurement data matrix is H _ij M is the number of the micromirrors of the digital micromirror device of the exposure equipment in a first direction, and N is the number of the micromirrors of the digital micromirror device in a second direction;

acquiring a difference value matrix of autofocus measurement data of the ith scanning of each micromirror at a measurement area j of the exposure substrate, which is caused by an angle alpha of the digital micromirror device in a first direction and an angle beta of the digital micromirror device in a second direction;

acquiring the exposure times of the graph of the ith scanning in the measurement area j of the exposure substrate;

according to the focusing plane measurement data matrix, the difference value matrix and the exposure times, determining equivalent automatic focusing measurement data received by the graph scanned at the measurement area j of the exposure substrate at the ith time;

and determining the scanning Mura of the digital exposure machine according to the equivalent automatic focusing measurement data.

2. The method of claim 1, wherein the disparity value matrix B _ij Comprises the following steps:

wherein D is _α Is the height difference in the first direction between two adjacent micromirrors due to the angle α of the digital micromirror device in the first direction, D _β The height difference of two adjacent micromirrors in the second direction due to the angle β of the dmd in the second direction is represented by p1, p2, L, M, W, and d, where p is the utilization rate of the micromirrors in the first direction of the dmd, p2 is the utilization rate of the micromirrors in the second direction of the dmd, L is the length of the dmd in the first direction, W is the length of the dmd in the second direction, W is N, and the size of each micromirror is d.

3. The method of claim 2, wherein the number of exposures satisfies:

wherein M is the number of exposure times, f (l) is the number of micromirrors selected for exposure, and M is the number of micromirrors of the digital micromirror device in the first direction.

4. The method of claim 3, wherein the ith scan receives equivalent auto-focus measurement data C for a pattern at measurement zone j of the exposed substrate _ij (k) Comprises the following steps:

B _i,j (k,l)＝l*D _α +k*D _β

wherein, B _ij (k, l) is the difference value of the autofocus measurement data at the measurement area j of the exposed substrate for the ith scan of the micromirror in the kth row and the lth column and the micromirror in the 1 st row and the 1 st column.

5. The method of claim 1, wherein determining the equivalent autofocus measurement data received for the pattern at measurement area j of the exposed substrate for the ith scan further comprises:

plotting at least one of the following graphs:

drawing a two-dimensional equivalent automatic focusing measurement data map according to equivalent automatic focusing measurement data in at least one exposure area of the digital exposure machine, wherein a first coordinate axis of the two-dimensional equivalent automatic focusing measurement data map is a scanning serial number, and a second coordinate axis of the two-dimensional equivalent automatic focusing measurement data map is a measurement area;

drawing a three-dimensional equivalent automatic focusing measurement data map according to equivalent automatic focusing measurement data in at least one exposure area of the digital exposure machine, wherein a first coordinate axis of the three-dimensional equivalent automatic focusing measurement data map is a scanning serial number, a second coordinate axis is a measurement area, and a third coordinate axis is equivalent automatic focusing measurement data;

drawing a comparison graph of equivalent auto-focusing measurement data received by a graph of an exposure device of the digital exposure machine in a measurement area j of the exposure substrate in the ith scanning and the (i + 1) th scanning, wherein the exposure times of the digital micro-mirror device in the first direction in the ith scanning is M times, and the exposure times of the digital micro-mirror device in the first direction in the (i + 1) th scanning is 1 time;

drawing a comparison graph of equivalent auto-focusing measurement data of two adjacent micromirrors received by the graph of the ith scanning of one exposure device of the digital exposure machine at the measurement area j of the exposure substrate.

6. The method of claim 1, wherein said determining the scanning Mura of the digital exposure machine from the equivalent autofocus measurement data further comprises:

and alarming the determined scanning Mura.

7. A scanning Mura detection device of a digital exposure machine is characterized by comprising:

a first acquisition module for acquiring point coordinates H of autofocus measurement data at a measurement area j of an exposure substrate for an ith scan of an exposure apparatus of a digital exposure machine _ij Converting the point coordinates into a focusing plane measurement data matrix of M x N, wherein each numerical value in the focusing plane measurement data matrix is H _ij M is the number of the micromirrors of the digital micromirror device of the exposure equipment in a first direction, and N is the number of the micromirrors of the digital micromirror device in a second direction;

a second obtaining module, configured to obtain a difference value matrix of autofocus measurement data at a measurement area j of the exposure substrate for an ith scan of each micromirror, where the difference value matrix is caused by an angle α of the digital micromirror device in the first direction and an angle β of the digital micromirror device in the second direction;

the third acquisition module is used for acquiring the exposure times of the graph of the ith scanning in the measurement area j of the exposure substrate;

a first determining module, configured to determine, according to the focusing plane measurement data matrix, the difference value matrix, and the exposure times, equivalent auto-focusing measurement data received by an image scanned at a measurement area j of the exposure substrate for the ith time;

and the second determining module is used for determining the scanning Mura of the digital exposure machine according to the equivalent automatic focusing measurement data.

8. The apparatus of claim 7, wherein the disparity value matrix B _ij Comprises the following steps:

wherein D is _α Is the height difference in the first direction between two adjacent micromirrors due to the angle α of the digital micromirror device in the first direction, D _β The height difference of two adjacent micromirrors in the second direction due to the angle β of the dmd in the second direction is represented by p1, p2, L, M, W, and d, where p is the utilization rate of the micromirrors in the first direction of the dmd, p2 is the utilization rate of the micromirrors in the second direction of the dmd, L is the length of the dmd in the first direction, W is the length of the dmd in the second direction, W is N, and the size of each micromirror is d.

9. The apparatus of claim 8, wherein the number of exposures satisfies:

wherein M is the number of exposure times, f (l) is the number of micromirrors selected for exposure, and M is the number of micromirrors of the digital micromirror device in the first direction.

10. The apparatus of claim 9, wherein the ith scan receives equivalent auto-focus measurement data C for a pattern at measurement zone j of the exposed substrate _ij (k) Comprises the following steps:

B _i,j (k,l)＝l*D _α +k*D _β

wherein, B _ij (k, l) is the difference value of the autofocus measurement data at the measurement area j of the exposed substrate for the ith scan of the micromirror in the kth row and the lth column and the micromirror in the 1 st row and the 1 st column.

Images