CN111554598B - Portable chip removing device capable of being screened - Google Patents
Portable chip removing device capable of being screened Download PDFInfo
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- CN111554598B CN111554598B CN202010439796.6A CN202010439796A CN111554598B CN 111554598 B CN111554598 B CN 111554598B CN 202010439796 A CN202010439796 A CN 202010439796A CN 111554598 B CN111554598 B CN 111554598B
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- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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Abstract
Description
技术领域technical field
本发明涉及芯片生产技术领域,具体为一种可筛选的便捷式芯片去除装置。The invention relates to the technical field of chip production, in particular to a screenable and convenient chip removal device.
背景技术Background technique
半导体芯片在加工过程中,为节约空间,也便于储存运输,通常将半导体芯片均匀分布在一芯片条上,由于加工出来的半导体芯片有不良品,当检测出不良品后,需要对不良品进行去除,传统的不良半导体芯片是通过人工裁剪,效率低下,为此,中国专利公开了一种不良半导体芯片去除装置,其申请号为201510019865.7,其有益效果为刀具在弹簧力和齿轮的作用下上行,不需将芯片条裁剪成多段就可完成不良芯片的去除,提高了生产效率;During the processing of semiconductor chips, in order to save space and facilitate storage and transportation, the semiconductor chips are usually evenly distributed on a chip strip. Since the processed semiconductor chips have defective products, when the defective products are detected, the defective products need to be checked. Removal, traditional bad semiconductor chips are cut manually, which is inefficient. For this reason, a Chinese patent discloses a device for removing bad semiconductor chips. Its application number is 201510019865.7. , the removal of bad chips can be completed without cutting the chip strip into multiple sections, which improves the production efficiency;
但是该装置还有以下缺点,不能对芯片条表面安装的芯片进行检测和筛选,且裁剪仍需工作人员摇动摇杆完成,需要消耗工作人员较多的精力。However, this device also has the following disadvantages. It cannot detect and screen the chips mounted on the surface of the chip strip, and the cutting still needs the staff to shake the rocker to complete, which requires more energy of the staff.
发明内容Contents of the invention
本发明提供一种可筛选的便捷式芯片去除装置,可以有效解决上述背景技术中提出的不能对芯片条表面安装的芯片进行检测和筛选,且裁剪仍需工作人员摇动摇杆完成,需要消耗工作人员较多的精力的问题。The present invention provides a screenable and convenient chip removal device, which can effectively solve the problem that the chips mounted on the surface of the chip strip cannot be detected and screened in the above background technology, and the cutting still needs to be completed by the staff shaking the rocker, which requires a lot of work. The problem of the energy of more people.
为实现上述目的,本发明提供如下技术方案:一种可筛选的便捷式芯片去除装置,包括固定底座,所述固定底座顶端边部焊接有H型支撑框,所述固定底座顶端中部开设有送料槽,所述送料槽内部安装有传送皮带,所述H型支撑框内壁底端中部开设有限位卡槽,所述H型支撑框内壁一侧设置有筛选机构;In order to achieve the above object, the present invention provides the following technical solutions: a screenable and convenient chip removal device, including a fixed base, an H-shaped support frame is welded to the top edge of the fixed base, and a feeding device is provided in the middle of the top top of the fixed base A conveyor belt is installed inside the feeding trough, a limited card slot is set in the middle of the bottom end of the inner wall of the H-shaped support frame, and a screening mechanism is provided on one side of the inner wall of the H-shaped support frame;
所述筛选机构包括第一气缸、工型筛选安装板、第一液压推杆、筛选板、筛选槽和指示灯;The screening mechanism includes a first cylinder, an I-type screening mounting plate, a first hydraulic push rod, a screening plate, a screening slot and an indicator light;
所述H型支撑框内壁一侧安装有第一气缸,所述第一气缸推杆端安装有工型筛选安装板,所述工型筛选安装板底端中部安装有第一液压推杆,所述第一液压推杆推杆端安装有筛选板,所述筛选板底端中部开设有筛选槽,所述筛选板顶端边部设置有指示灯,所述指示灯的输入端和外部电源的输出端电性连接;A first cylinder is installed on one side of the inner wall of the H-shaped support frame, and an I-type screening installation plate is installed on the push rod end of the first cylinder, and a first hydraulic push rod is installed in the middle of the bottom end of the I-type screening installation plate. The push rod end of the first hydraulic push rod is equipped with a screening plate, the middle part of the bottom end of the screening plate is provided with a screening slot, the top edge of the screening plate is provided with an indicator light, the input end of the indicator light and the output of the external power supply terminal electrical connection;
所述H型支撑框内壁另一侧设置有切割机构,所述切割机构包括第二气缸、工型除杂安装板、第二液压推杆、除杂板、切割刀片和限位挡板;A cutting mechanism is provided on the other side of the inner wall of the H-shaped support frame, and the cutting mechanism includes a second cylinder, an I-shaped impurity removal installation plate, a second hydraulic push rod, an impurity removal plate, a cutting blade and a limit baffle;
所述H型支撑框内壁另一侧安装有第二气缸,所述第二气缸推杆端安装有工型除杂安装板,所述工型除杂安装板底端中部安装有第二液压推杆,所述第二液压推杆推杆端安装有除杂板,所述除杂板底端两侧边部均安装有切割刀片,所述除杂板底端靠近切割刀片处焊接有限位挡板。A second cylinder is installed on the other side of the inner wall of the H-shaped support frame, and the push rod end of the second cylinder is installed with an I-type impurity removal installation plate, and a second hydraulic pusher is installed in the middle of the bottom end of the I-type impurity removal installation plate. Rod, the push rod end of the second hydraulic push rod is equipped with an impurity removal plate, both sides of the bottom end of the impurity removal plate are equipped with cutting blades, and the bottom end of the impurity removal plate is welded with a limit stop near the cutting blade plate.
优选的,所述传送皮带顶端中部设置有芯片条,芯片条顶端等距安装有待检测芯片,所述待检测芯片的横截面尺寸和筛选槽的横截面尺寸相同。Preferably, a chip strip is arranged in the middle of the top of the conveyor belt, and the top of the chip strip is equidistantly installed with the chips to be tested, and the cross-sectional size of the chips to be tested is the same as the cross-sectional size of the screening tank.
优选的,所述筛选槽内部设置有检测电路,检测电路的输入端和外部电源的输出端电性连接,所述指示灯和检测电路之间通过串联连接。Preferably, a detection circuit is provided inside the screening tank, the input end of the detection circuit is electrically connected to the output end of the external power supply, and the indicator light and the detection circuit are connected in series.
优选的,所述限位挡板的高度是切割刀片高度的1.1倍,两个所述限位挡板之间的距离和待检测芯片的长度相同。Preferably, the height of the limiting baffles is 1.1 times the height of the cutting blade, and the distance between the two limiting baffles is the same as the length of the chip to be detected.
优选的,所述工型除杂安装板和工型筛选安装板的纵截面尺寸相同,所述工型除杂安装板和工型筛选安装板位于限位卡槽内部。Preferably, the I-type impurity removal installation plate and the I-type screening installation plate have the same longitudinal section size, and the I-type impurity removal installation plate and the I-type screening installation plate are located inside the limit card slot.
优选的,所述固定底座顶端一侧靠近H型支撑框处设置有回收机构,所述回收机构包括安装槽、推料气缸、收集槽、倾斜滑槽和收集桶;Preferably, a recovery mechanism is provided near the H-shaped support frame on the top side of the fixed base, and the recovery mechanism includes a mounting groove, a pushing cylinder, a collecting groove, an inclined chute and a collecting bucket;
所述固定底座顶端一侧靠近H型支撑框处开设有安装槽,所述安装槽内部安装有推料气缸,所述推料气缸推杆端安装有连接推板,所述固定底座顶端另一侧靠近H型支撑框处开设有收集槽,所述收集槽一端顶部开设有倾斜滑槽,所述收集槽内部安装有收集桶。One side of the top of the fixed base is provided with an installation groove close to the H-shaped support frame, and a pushing cylinder is installed inside the installation groove, and a connecting push plate is installed on the push rod end of the pushing cylinder. A collection tank is provided on the side close to the H-shaped support frame, an inclined chute is provided on the top of one end of the collection tank, and a collection bucket is installed inside the collection tank.
优选的,所述固定底座顶端一侧靠近收集槽处设置有限位机构,所述限位机构包括冂型固定框、限位滑槽、限位卡板、限位滑块、限位螺杆、限位圆块、转动槽和限位橡胶块;Preferably, a limit mechanism is provided near the collecting tank on the top side of the fixed base, and the limit mechanism includes a fixed frame, a limit chute, a limit clamp, a limit slider, a limit screw, a limit Position round block, rotating groove and limit rubber block;
所述固定底座顶端一侧靠近收集槽处安装有冂型固定框,所述冂型固定框内壁两侧中部均开设有限位滑槽,所述冂型固定框内部安装有限位卡板,所述限位卡板两侧中部均焊接有限位滑块,所述冂型固定框顶端中部安装有限位螺杆,所述限位螺杆一端焊接有限位圆块,所述限位卡板顶端中部开设有转动槽,所述传送皮带外表面两侧均粘接有限位橡胶块。A side-shaped fixed frame is installed near the collection tank on the top side of the fixed base, and the middle parts of both sides of the inner wall of the fixed frame are provided with limiting chute, and the limited clamping plate is installed inside the fixed frame. Limit sliders are welded in the middle of both sides of the limit clamp, a limit screw is installed in the middle of the top of the fixed frame, one end of the limit screw is welded with a limit round block, and the top middle of the limit clamp is provided with a rotating Grooves, both sides of the outer surface of the conveyor belt are bonded with limited rubber blocks.
优选的,所述冂型固定框的数量总共为两个,两个所述冂型固定框之间的间距是两个相邻待检测芯片之间距离的两倍。Preferably, the number of the vertical fixed frames is two in total, and the distance between the two vertical fixed frames is twice the distance between two adjacent chips to be tested.
优选的,所述冂型固定框顶端中部开设有螺孔,所述限位螺杆位于螺孔内部,所述转动槽的截面为T型,所述限位圆块位于转动槽内部,所述限位滑块位于限位滑槽内部。Preferably, a screw hole is provided in the middle of the top of the fixed frame, the limiting screw is located inside the screw hole, the section of the rotating groove is T-shaped, the limiting round block is located inside the rotating groove, and the limiting screw is located inside the screw hole. The bit slider is located inside the limit chute.
优选的,所述H型支撑框内壁一侧底部设置有清理机构,所述清理机构包括固定板、固定卡块、储气管、喷管和进气管;Preferably, a cleaning mechanism is provided at the bottom of one side of the inner wall of the H-shaped support frame, and the cleaning mechanism includes a fixed plate, a fixed block, an air storage pipe, a nozzle pipe and an air intake pipe;
所述H型支撑框内壁一侧底部焊接有固定板,所述固定板底端两侧均焊接有固定卡块,所述固定卡块侧面中部贯穿安装有储气管,所述储气管外表面中部两侧均安装有喷管,所述储气管一端连接有进气管。The bottom of one side of the inner wall of the H-shaped support frame is welded with a fixed plate, and both sides of the bottom of the fixed plate are welded with fixed blocks, and the middle part of the side of the fixed block is installed with a gas storage pipe. Spray pipes are installed on both sides, and one end of the gas storage pipe is connected with an air intake pipe.
与现有技术相比,本发明的有益效果:Compared with prior art, the beneficial effect of the present invention:
1、通过第一气缸、工型筛选安装板、第一液压推杆、筛选板、筛选槽和指示灯,可以对芯片条表面安装的芯片进行检测,通过对芯片条表面安装的芯片进行检测筛选,可以让工作人员发现已损坏芯片,便于工作人员对已损坏芯片的去除。1. Through the first cylinder, I-type screening mounting plate, first hydraulic push rod, screening plate, screening groove and indicator light, the chips mounted on the surface of the chip strip can be detected, and the chips mounted on the surface of the chip strip can be detected and screened , allowing the staff to find the damaged chip, which is convenient for the staff to remove the damaged chip.
2、通过第二气缸、工型除杂安装板、第二液压推杆、除杂板、切割刀片和限位挡板,可以对已损坏芯片进行切割,使得已损坏芯片与芯片条分离,通过限位挡板,可以对切割刀片的切割距离进行限位,可以防止切割刀片出现切断芯片条的现象,便于工作人员对切割刀片的使用。2. The damaged chip can be cut through the second cylinder, the I-type impurity removal mounting plate, the second hydraulic push rod, the impurity removal plate, the cutting blade and the limit baffle, so that the damaged chip is separated from the chip strip, and the The limit baffle can limit the cutting distance of the cutting blade, prevent the cutting blade from cutting off the chip strip, and facilitate the use of the cutting blade by staff.
3、通过推料气缸、收集槽、倾斜滑槽、收集桶和连接推板,工作人员可以对已损坏芯片进行回收,通过回收已损坏芯片,可以降低工作人员对已损坏芯片的后续处理难度。3. Through the push cylinder, collection tank, inclined chute, collection bucket and connecting push plate, the staff can recycle the damaged chip. By recycling the damaged chip, the difficulty of the subsequent processing of the damaged chip can be reduced.
4、通过传送皮带两侧安装的限位橡胶块,可以对芯片条进行横向限位,通过冂型固定框、限位滑槽、限位卡板、限位滑块、限位螺杆和限位圆块,可以对芯片进行纵向限位,通过对芯片进行双重限位,可以防止芯片条在移动的过程中出现偏移的现象,便于工作人员对芯片的回收。4. Through the limit rubber blocks installed on both sides of the conveyor belt, the chip strip can be limited laterally, through the 冂-shaped fixed frame, limit chute, limit card plate, limit slider, limit screw and limit The round block can limit the chip vertically. By double limiting the chip, it can prevent the chip strip from shifting during the moving process, and it is convenient for the staff to recycle the chip.
5、通过固定板和固定卡块,可以对储气管进行固定,通过储气管、喷管和进气管,可以引入外部加压气流,使得外部加压气流通过喷管喷出,对切割刀片携带的碎屑进行清理,通过清理碎屑,可以防止碎屑接触到未检测的芯片,便于工作人员对芯片的检测。5. The gas storage pipe can be fixed through the fixed plate and the fixed block, and the external pressurized airflow can be introduced through the air storage pipe, nozzle pipe and air intake pipe, so that the external pressurized airflow is ejected through the nozzle pipe, and the airflow carried by the cutting blade is Clean up the debris. By cleaning the debris, it can prevent the debris from touching the undetected chip, which is convenient for the staff to detect the chip.
6、通过使用装置,可以对芯片条表面安装的芯片进行筛选检测并能对已损坏的芯片进行去除,可以降低芯片的检测和去除难度,有利于提高工作人员的工作效率。6. By using the device, the chips mounted on the surface of the chip bar can be screened and detected and the damaged chips can be removed, which can reduce the difficulty of chip detection and removal, and is conducive to improving the work efficiency of the staff.
附图说明Description of drawings
附图用来提供对本发明的进一步理解,并且构成说明书的一部分,与本发明的实施例一起用于解释本发明,并不构成对本发明的限制。The accompanying drawings are used to provide a further understanding of the present invention, and constitute a part of the description, and are used together with the embodiments of the present invention to explain the present invention, and do not constitute a limitation to the present invention.
在附图中:In the attached picture:
图1是本发明的结构示意图;Fig. 1 is a structural representation of the present invention;
图2是本发明限位卡槽的开设结构示意图;Fig. 2 is a schematic diagram of the opening structure of the limit card slot of the present invention;
图3是本发明推料气缸的安装结构示意图;Fig. 3 is a schematic diagram of the installation structure of the pusher cylinder of the present invention;
图4是本发明的剖视图;Fig. 4 is a sectional view of the present invention;
图5是本发明筛选槽的开设结构示意图;Fig. 5 is a schematic diagram of the opening structure of the screening tank of the present invention;
图6是本发明切割刀片的安装结构示意图;Fig. 6 is a schematic diagram of the installation structure of the cutting blade of the present invention;
图7是本发明喷管的安装结构示意图;Fig. 7 is the installation structure schematic diagram of nozzle of the present invention;
图8是本发明限位圆块的安装结构示意图;Fig. 8 is a schematic diagram of the installation structure of the limiting round block of the present invention;
图中标号:1、固定底座;2、H型支撑框;3、送料槽;4、传送皮带;5、限位卡槽;Labels in the figure: 1. Fixed base; 2. H-shaped support frame; 3. Feeding trough; 4. Conveyor belt; 5. Limiting card slot;
6、筛选机构;601、第一气缸;602、工型筛选安装板;603、第一液压推杆;604、筛选板;605、筛选槽;606、指示灯;6. Screening mechanism; 601, first cylinder; 602, type screening mounting plate; 603, first hydraulic push rod; 604, screening plate; 605, screening tank; 606, indicator light;
7、切割机构;701、第二气缸;702、工型除杂安装板;703、第二液压推杆;704、除杂板;705、切割刀片;706、限位挡板;7. Cutting mechanism; 701, second cylinder; 702, I-type impurity removal installation plate; 703, second hydraulic push rod; 704, impurity removal plate; 705, cutting blade; 706, limit baffle;
8、回收机构;801、安装槽;802、推料气缸;803、收集槽;804、倾斜滑槽;805、收集桶;806、连接推板;8. Recovery mechanism; 801, installation groove; 802, push cylinder; 803, collection groove; 804, inclined chute; 805, collection bucket; 806, connecting push plate;
9、限位机构;901、冂型固定框;902、限位滑槽;903、限位卡板;904、限位滑块;905、限位螺杆;906、限位圆块;907、转动槽;908、限位橡胶块;9, limit mechanism; 901, 冂 type fixed frame; 902, limit chute; 903, limit clamp; 904, limit slider; 905, limit screw; 906, limit round block; 907, rotation Groove; 908, limit rubber block;
10、清理机构;1001、固定板;1002、固定卡块;1003、储气管;1004、喷管;1005、进气管。10. Cleaning mechanism; 1001, fixed plate; 1002, fixed block; 1003, gas storage pipe; 1004, nozzle pipe; 1005, air intake pipe.
具体实施方式Detailed ways
以下结合附图对本发明的优选实施例进行说明,应当理解,此处所描述的优选实施例仅用于说明和解释本发明,并不用于限定本发明。The preferred embodiments of the present invention will be described below in conjunction with the accompanying drawings. It should be understood that the preferred embodiments described here are only used to illustrate and explain the present invention, and are not intended to limit the present invention.
实施例:如图1-8所示,本发明提供技术方案,一种可筛选的便捷式芯片去除装置,包括固定底座1,固定底座1顶端边部焊接有H型支撑框2,固定底座1顶端中部开设有送料槽3,送料槽3内部安装有传送皮带4,传送皮带4顶端中部设置有芯片条,芯片条顶端等距安装有待检测芯片,待检测芯片的横截面尺寸和筛选槽605的横截面尺寸相同,便于筛选板604的使用,H型支撑框2内壁底端中部开设有限位卡槽5,H型支撑框2内壁一侧设置有筛选机构6;Embodiment: As shown in Figures 1-8, the present invention provides a technical solution, a screenable and convenient chip removal device, including a fixed
筛选机构6包括第一气缸601、工型筛选安装板602、第一液压推杆603、筛选板604、筛选槽605和指示灯606;The
H型支撑框2内壁一侧安装有第一气缸601,第一气缸601推杆端安装有工型筛选安装板602,工型筛选安装板602底端中部安装有第一液压推杆603,第一液压推杆603推杆端安装有筛选板604,筛选板604底端中部开设有筛选槽605,筛选板604顶端边部设置有指示灯606,筛选槽605内部设置有检测电路,检测电路的输入端和外部电源的输出端电性连接,指示灯606和检测电路之间通过串联连接,通过指示灯606,可以对筛选板604的筛选状况进行观察,便于工作人员对筛选板604的使用;The
H型支撑框2内壁另一侧设置有切割机构7,切割机构7包括第二气缸701、工型除杂安装板702、第二液压推杆703、除杂板704、切割刀片705和限位挡板706;The other side of the inner wall of the H-shaped
H型支撑框2内壁另一侧安装有第二气缸701,第二气缸701推杆端安装有工型除杂安装板702,工型除杂安装板702和工型筛选安装板602的纵截面尺寸相同,工型除杂安装板702和工型筛选安装板602位于限位卡槽5内部,可以对工型除杂安装板702和工型筛选安装板602进行限位,便于工型除杂安装板702和工型筛选安装板602的使用,工型除杂安装板702底端中部安装有第二液压推杆703,第二液压推杆703推杆端安装有除杂板704,除杂板704底端两侧边部均安装有切割刀片705,除杂板704底端靠近切割刀片705处焊接有限位挡板706,限位挡板706的高度是切割刀片705高度的1.1倍,两个限位挡板706之间的距离和待检测芯片的长度相同,可以对切割刀片705的切割长度进行限位,便于切割刀片705的使用。The other side of the inner wall of the H-shaped
固定底座1顶端一侧靠近H型支撑框2处设置有回收机构8,回收机构8包括安装槽801、推料气缸802、收集槽803、倾斜滑槽804和收集桶805;A
固定底座1顶端一侧靠近H型支撑框2处开设有安装槽801,安装槽801内部安装有推料气缸802,推料气缸802推杆端安装有连接推板806,固定底座1顶端另一侧靠近H型支撑框2处开设有收集槽803,收集槽803一端顶部开设有倾斜滑槽804,收集槽803内部安装有收集桶805。One side of the top of the fixed
固定底座1顶端一侧靠近收集槽803处设置有限位机构9,限位机构9包括冂型固定框901、限位滑槽902、限位卡板903、限位滑块904、限位螺杆905、限位圆块906、转动槽907和限位橡胶块908;One side of the top of the fixed
固定底座1顶端一侧靠近收集槽803处安装有冂型固定框901,冂型固定框901的数量总共为两个,两个冂型固定框901之间的间距是两个相邻待检测芯片之间距离的两倍,可以降低限位卡板903接触到待检测芯片的难度,便于限位卡板903的使用,冂型固定框901内壁两侧中部均开设有限位滑槽902,冂型固定框901内部安装有限位卡板903,限位卡板903两侧中部均焊接有限位滑块904,冂型固定框901顶端中部安装有限位螺杆905,限位螺杆905一端焊接有限位圆块906,限位卡板903顶端中部开设有转动槽907,冂型固定框901顶端中部开设有螺孔,限位螺杆905位于螺孔内部,转动槽907的截面为T型,限位圆块906位于转动槽907内部,限位滑块904位于限位滑槽902内部,可以推动限位卡板903移动并对限位卡板903进行限位,便于限位卡板903的使用,传送皮带4外表面两侧均粘接有限位橡胶块908。On one side of the top of the fixed
H型支撑框2内壁一侧底部设置有清理机构10,清理机构10包括固定板1001、固定卡块1002、储气管1003、喷管1004和进气管1005;The bottom of one side of the inner wall of the H-shaped
H型支撑框2内壁一侧底部焊接有固定板1001,固定板1001底端两侧均焊接有固定卡块1002,固定卡块1002侧面中部贯穿安装有储气管1003,储气管1003外表面中部两侧均安装有喷管1004,储气管1003一端连接有进气管1005。The bottom of one side of the inner wall of the H-shaped
本发明的工作原理及使用流程:一种可筛选的便捷式芯片去除装置,在实际使用过程中,工作人员将芯片条放到传送皮带4上,通过传送皮带4两侧安装的限位橡胶块908,可以对芯片条进行横向限位,芯片条随着传送皮带4移动,当芯片条顶端安装的待检测芯片到达固定底座1底端中部时,传送皮带4停止运转,工型筛选安装板602底端安装的第一液压推杆603工作,使得第一液压推杆603安装的筛选板604接触到待检测芯片,使得待检测芯片进入到筛选槽605内部,工作人员将筛选槽605内部的检测电路接入外部电源,当指示灯606发出荧光时,说明芯片无损坏,当指示灯606无反应时,说明芯片已损坏,检测结束后,工作人员启动第一液压推杆603,使得筛选板604复位,通过对芯片条表面安装的芯片进行检测,可以对芯片条表面安装的芯片进行筛选,便于工作人员对已损坏芯片的去除;The working principle and application process of the present invention: a portable chip removal device that can be screened. In the actual use process, the staff puts the chip strip on the conveyor belt 4, and passes through the limit rubber blocks installed on both sides of the conveyor belt 4. 908, the chip strip can be laterally limited, and the chip strip moves with the conveyor belt 4. When the chip to be detected installed on the top of the chip strip reaches the middle of the bottom of the fixed
当筛选板604检测到芯片已损坏时,工作人员启动第一气缸601,第一气缸601工作带动工型筛选安装板602向靠近第一气缸601的方向移动,使得筛选板604远离已损坏芯片,之后工作人员启动第二气缸701,第二气缸701工作推动工型除杂安装板702移动,工型除杂安装板702移动带动第二液压推杆703移动,使得第二液压推杆703安装的除杂板704位于已损坏芯片顶部,工作人员启动第二液压推杆703,第二液压推杆703工作带动除杂板704向下移动,使得除杂板704安装的切割刀片705对已损坏芯片进行切割,使得已损坏芯片与芯片条分离,通过限位挡板706,可以对切割刀片705的切割距离进行限位,可以防止切割刀片705出现切断芯片条的现象,便于工作人员对切割刀片705的使用,对已损坏芯片进行切断后,工作人员启动第二气缸701,使得切割刀片705回到原来的位置,然后,工作人员启动第一气缸601,使得筛选板604复位并重新对传送皮带4上安装的芯片条进行检测;When the
当芯片条移动到冂型固定框901底端时,工作人员转动限位螺杆905,限位螺杆905转动带动限位圆块906在转动槽907内部转动,随着限位螺杆905向下移动,限位圆块906推动限位卡板903向下移动,使得限位卡板903靠近芯片条表面安装的芯片,对芯片进行纵向限位,当已损坏芯片移动到两个冂型固定框901之间时,工作人员启动推料气缸802,推料气缸802工作使得连接推板806移动,随着连接推板806移动,连接推板806逐渐接近已损坏芯片并推动已损坏芯片移动,使得已损坏芯片通过倾斜滑槽804进入到收集桶805内部,可以降低已损坏芯片的回收难度,便于工作人员对已损坏芯片的后续处理;When the chip strip moves to the bottom of the fixed
在对已损坏芯片进行切割的过程中,切割芯片时产生的碎屑容易随切割刀片705的向上移动而移动,工作人员将进气管1005接入外部加压气流,使得外部加压气流通过进气管1005进入到储气管1003内部,并通过喷管1004喷出,通过喷出加压气体,可以对切割刀片705携带的碎屑进行清理,可以防止碎屑接触到未检测的芯片,便于工作人员对芯片的检测,通过固定板1001和固定卡块1002,可以对储气管1003进行固定,可以降低储气管1003的使用难度;In the process of cutting the damaged chip, the debris generated when cutting the chip is easy to move with the upward movement of the
在工作人员回收已损坏芯片的过程中,通过对芯片进行纵向限位和横向限位,通过双重限位,可以防止芯片条在移动的出现偏移的现象,便于工作人员对芯片的回收;In the process of staff recovering the damaged chip, through vertical and horizontal limiting of the chip, through double limiting, it can prevent the deviation of the chip strip when moving, and facilitate the recovery of the chip by the staff;
通过使用装置,可以对芯片条表面安装的芯片进行筛选检测并能对已损坏的芯片进行去除,可以降低芯片的检测和去除难度,有利于提高工作人员的工作效率。By using the device, the chips installed on the surface of the chip bar can be screened and detected and the damaged chips can be removed, which can reduce the difficulty of detecting and removing the chips, and is beneficial to improve the work efficiency of staff.
最后应说明的是:以上所述仅为本发明的优选实例而已,并不用于限制本发明,尽管参照前述实施例对本发明进行了详细的说明,对于本领域的技术人员来说,其依然可以对前述各实施例所记载的技术方案进行修改,或者对其中部分技术特征进行等同替换。凡在本发明的精神和原则之内,所作的任何修改、等同替换、改进等,均应包含在本发明的保护范围之内。Finally, it should be noted that: the above is only a preferred example of the present invention, and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it can still The technical solutions recorded in the foregoing embodiments are modified, or some of the technical features are equivalently replaced. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of the present invention shall be included within the protection scope of the present invention.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006063652A1 (en) * | 2004-12-16 | 2006-06-22 | Smart Res S.R.L. | System for multiple removal of microchips from a wafer consisting of a plurality of microchips |
| CN106971966A (en) * | 2017-04-06 | 2017-07-21 | 安徽熙泰智能科技有限公司 | A kind of semiconductor chip cleaning device |
| CN207866971U (en) * | 2017-07-06 | 2018-09-14 | 江苏凯尔生物识别科技有限公司 | For chip performance detection and automatically dotting device |
| CN111146106A (en) * | 2019-12-30 | 2020-05-12 | 上海华岭集成电路技术股份有限公司 | Method for rapidly screening failure risk of chip |
Family Cites Families (2)
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|---|---|---|---|---|
| KR100480628B1 (en) * | 2002-11-11 | 2005-03-31 | 삼성전자주식회사 | Chip pick-up method and device for manufacturing semiconductor device using air blowing |
| SG11201808374TA (en) * | 2016-03-30 | 2018-10-30 | Mitsui Chemicals Tohcello Inc | Method for manufacturing semiconductor device |
-
2020
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006063652A1 (en) * | 2004-12-16 | 2006-06-22 | Smart Res S.R.L. | System for multiple removal of microchips from a wafer consisting of a plurality of microchips |
| CN106971966A (en) * | 2017-04-06 | 2017-07-21 | 安徽熙泰智能科技有限公司 | A kind of semiconductor chip cleaning device |
| CN207866971U (en) * | 2017-07-06 | 2018-09-14 | 江苏凯尔生物识别科技有限公司 | For chip performance detection and automatically dotting device |
| CN111146106A (en) * | 2019-12-30 | 2020-05-12 | 上海华岭集成电路技术股份有限公司 | Method for rapidly screening failure risk of chip |
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