CN111694077B - A kind of hemispherical microlens and preparation method thereof - Google Patents
A kind of hemispherical microlens and preparation method thereof Download PDFInfo
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- 238000002360 preparation method Methods 0.000 title claims abstract description 7
- 239000000463 material Substances 0.000 claims abstract description 82
- 239000004005 microsphere Substances 0.000 claims abstract description 70
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- 239000000758 substrate Substances 0.000 claims description 54
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- 238000000034 method Methods 0.000 claims description 22
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- ORUIBWPALBXDOA-UHFFFAOYSA-L magnesium fluoride Chemical compound [F-].[F-].[Mg+2] ORUIBWPALBXDOA-UHFFFAOYSA-L 0.000 description 10
- 229910001635 magnesium fluoride Inorganic materials 0.000 description 10
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 8
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- 238000010438 heat treatment Methods 0.000 description 5
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- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 4
- 238000001259 photo etching Methods 0.000 description 4
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- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 2
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Images
Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0012—Arrays characterised by the manufacturing method
- G02B3/0025—Machining, e.g. grinding, polishing, diamond turning, manufacturing of mould parts
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
- G02B3/0006—Arrays
- G02B3/0037—Arrays characterized by the distribution or form of lenses
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- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
Abstract
本发明公开了一种半球状微透镜及其制备方法，该透镜包括至少一个透镜镜体（2），所述透镜镜体(2)为：选定标准微球透镜(2′)一个经过球心的面，在所述经过球心的面的两侧分别平行切割掉部分球面。制备方法分别在标准的微球透镜两侧平行切割掉部分球面，随后浸泡在第二材料膜层(4)内，当平行于光轴的入射光从半球状微透镜被部分切割的球面测入射时，通过被切割的球面的光线将不参与形成光斑，这有益于改善光斑的半高宽；通过未被切割的球面的光线因离光轴更远，形成具有更长工作距的焦斑，可应用在远场平行成像/光刻方面，提高特征尺寸接近或大于300nm的图案平行成像/光刻的效率。
The invention discloses a hemispherical microlens and a preparation method thereof. The lens comprises at least one lens body (2), wherein the lens body (2) is as follows: a standard microsphere lens (2') is selected and one passes through a sphere. For the surface of the center, part of the spherical surface is cut in parallel on both sides of the surface passing through the center of the sphere. The preparation method is to cut off part of the spherical surface in parallel on both sides of the standard microsphere lens, and then soak in the second material film layer (4), when the incident light parallel to the optical axis is measured from the partially cut spherical surface of the hemispherical microlens. When , the light passing through the cut spherical surface will not participate in the formation of the light spot, which is beneficial to improve the half-height width of the light spot; the light passing through the uncut spherical surface is farther from the optical axis, forming a focal spot with a longer working distance, It can be applied in far-field parallel imaging/lithography to improve the efficiency of pattern parallel imaging/lithography with feature size close to or greater than 300nm.
Description
Technical Field
The invention relates to the technical field of optics and electronics, in particular to a hemispherical microlens and a preparation method thereof.
Background
With the increase of the integration level of semiconductor devices, the sizes of components on the semiconductor devices tend to be in the micro-nanometer level, and imaging systems or photoetching systems with the resolution of 200nm-400nm are needed in more scenes. Because the traditional optical lens is limited by the limit of optical diffraction, and influenced by the quality of a light source, the light path of a system and the like, the particles with the size of 300nm are difficult to be seen clearly by a metallographic microscope. In addition, the conventional lens has a large size, and it is difficult to make a lens array to perform parallel work to improve work efficiency. Other high-resolution imaging systems, such as atomic force microscopes and scanning electron microscopes, have high equipment cost and low working efficiency. In the field of chip preparation, the light spot is compressed by adopting a mode of immersing a traditional lens in liquid, and the conditions are severe; electron beam lithography and ion beam etching are hardly used in the field of chips because of their low output efficiency.
Parallel light passes through a wavelength-order microsphere lens, a long focal spot with a super-diffraction limit size can be formed near the shadow side of the microsphere lens, meanwhile, a large-area lens array is easy to obtain through self-assembly of a colloid microsphere lens, and due to the characteristics of excellent focusing characteristic and easiness in self-assembly of the microsphere lens on incident light, existing researchers combine the microsphere lens with a traditional optical microscope system to realize imaging of 150 nm-width characteristic size, or directly assemble a single-layer microsphere lens array on a photoresist film layer, and a hole array with a minimum characteristic size of about 100nm can be obtained after exposure and development. However, the microsphere lens has the defects that the working distance is short and is within about 2 mu m, and the parallel imaging or the parallel photoetching of the microsphere lens array is not easy to be carried out under the far field condition; the current method for trying to extend the working distance of the microsphere lens is a double-layer/multi-layer concentric microsphere lens, but for the double-layer/multi-layer concentric microsphere with the outer diameter of about 10 μm, the working distance is generally less than 6 μm, and the beam waist half width of the focused light beam is greater than the working wavelength; the standard single-layer/double-layer hemispherical lens also has a longer working distance, but compared with the corresponding double-layer concentric microsphere lens, the half width of a focused light beam is obviously increased, and the light intensity is reduced.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a micro-ball lens, which can solve the problems of short working distance, large beam waist half width of focused light beam and low light intensity of the micro-ball lens in the prior art, and therefore it is urgently needed to design a micro-lens with long working distance, narrow sub-wavelength light beam half width and high light intensity, which can be applied to optical far-field sub-wavelength imaging or lithography, and can also be applied to parallel imaging or parallel lithography.
In order to solve the technical problems, the invention adopts a technical scheme that: a hemispherical microlens and a method for manufacturing the same are provided.
Wherein, hemispherical microlens, includes at least one lens mirror 2, lens mirror 2 is: a surface of the standard microsphere lens 2' passing through the sphere center is selected, and partial spherical surfaces are cut off on two sides of the surface passing through the sphere center in parallel respectively.
Preferably, the lens body 2 is soaked in the second material film layer 4, one section of the lens body 2 is positioned on the surface of the second material film layer 4, and the surface of the second material film layer (4) can also be higher than the section of the lens body (2).
Preferably, the adhesive film further comprises a third substrate 8 and a second adhesive film layer 7, wherein two sides of the second adhesive film layer 7 are respectively connected with the third substrate 8 and the second material film layer 4.
Preferably, the third substrate 8, the second adhesive film layer 7, and the second material film layer 4 are all made of transparent and light-transmitting materials.
Preferably, the lens body 2 comprises a single lens or a plurality of lenses arranged in a single layer side by side.
A method for preparing a hemispherical microlens comprises a lens body cutting step: selecting a surface of the standard microsphere lens 2' passing through the center of a sphere, and respectively cutting off part of spherical surfaces on two sides of the surface passing through the center of the sphere in parallel;
the cutting includes a first cutting and a second cutting, the first cutting including: removing the first material film layer 3 ' and the second material film layer 4 ' covering the top end of the microsphere lens 2 ', and then removing the plane part of the microsphere lens 2 ' higher than the rest of the second material film 4 ' to obtain a first sample;
the second cutting includes: removing the part of the other side of the microsphere lens 2 'higher than the remaining second material film layer 4' and completely soaking the microsphere lens 2 'in the remaining second material film layer 4' to obtain a third sample;
the cutting is carried out in an etching mode.
Preferably, said dissolving the remaining first film layer of material 3 "in the first sample and peeling off the first substrate 1 comprises: and soaking the first sample in a solution which can only dissolve the residual first material film layer 3 ", and stripping the first substrate 1 after the residual first material film layer 3" is completely dissolved.
Preferably, said completely immersing the microsphere lenses 2' in the remaining second material film layer 4 ″ comprises: and continuously vertically growing a second material film 4 with a certain thickness on the other side of the microsphere lens 2' in the second sample after the removal treatment by the physical vapor deposition method.
Preferably, the removal of the first material film layer 3 ' and the second material film layer 4 ' covering the top of the microsphere lens 2 ' is achieved by one or more of ultrasonic removal, adhesive tape or adhesive film adhesion removal.
The invention has the beneficial effects that: (1) different from the prior art, the invention cuts off partial spherical surfaces of the standard microsphere lens 2' in parallel through two sides of the surface of the spherical center respectively, and soaks the obtained hemispherical microlens in the second material film layer 4, when the incident light parallel to the optical axis is incident from the partially cut spherical surface of the hemispherical microlens, the light rays passing through the cut spherical surface do not participate in forming light spots, which is beneficial to reducing the half-height width of the light spots; the light rays passing through the uncut spherical surface participate in forming light spots, and the corresponding focal distance (working distance) of the formed light spots is longer as the light rays are farther away from the optical axis; (2) when parallel light with different wavelengths is selected for irradiation, the focal length of the hemispherical microlens prepared by the method is almost unchanged, and the half-height width of a focal spot is also slightly changed, so that the hemispherical microlens has compatibility in a larger range to working wavelengths; (3) the method is easy to prepare the hemispherical microlens array, can be used for far-field parallel imaging and parallel photoetching, and has great market prospect.
Drawings
FIG. 1 is a flow chart of a method for fabricating hemispherical microlenses according to the present invention;
FIG. 2 is a schematic view of a hemispherical microlens unit according to the present invention;
FIG. 3 is a schematic cross-sectional view of a substrate of a tiled microsphere lens array;
FIG. 4 is a schematic cross-sectional view of the substrate after deposition of two material films in FIG. 3;
FIG. 5 is a schematic cross-sectional view of a substrate after removal of a material film over a microsphere lens;
FIG. 6 is a schematic cross-sectional view of the substrate of FIG. 5 heated at a high temperature to planarize the exposed microspheres on the film layer and etch the exposed microspheres;
FIG. 7 is a schematic cross-sectional view of another adhesive film coated substrate and the corresponding substrate of FIG. 6 being brought into close proximity and pressed together;
FIG. 8 is a schematic cross-sectional view of the resulting substrate of FIG. 7 after soaking in a solution that dissolves only the first material film deposited in FIG. 4, completely dissolving the film and removing the underlying substrate;
FIG. 9 is a schematic cross-sectional view of the substrate of FIG. 8 heated at a high temperature to planarize the exposed microspheres on the film layer and etch the exposed microsphere surface;
FIG. 10 is a schematic cross-sectional view of the substrate after deposition of the same material film of the first layer deposited in FIG. 9 as in FIG. 4;
FIG. 11 is a schematic cross-sectional view of a third substrate coated with an adhesive film and the corresponding substrate of FIG. 10 being brought close to each other and pressed;
fig. 12 is a schematic cross-sectional view of the substrate under the substrate obtained in fig. 11 removed, that is, a schematic cross-sectional view of a manufactured soaked hemispherical microlens array.
The various numbers in FIGS. 1-12 identify the description: 1. a first substrate; 2. a lens body; 3. a first film layer of material; 4. a second film layer of material; 5. a first adhesive film layer; 6. a second substrate; 7. a second adhesive film layer; 8. a third substrate; the letter O in the figure indicates the center of the microsphere lens.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer and more complete, the present invention is further described with reference to the following embodiments.
Example 1
As shown in fig. 2, a hemispherical microlens includes at least one lens body 2, where the lens body 2 is: a surface of the standard microsphere lens 2' passing through the sphere center is selected, and partial spherical surfaces are cut off on two sides of the surface passing through the sphere center in parallel respectively.
Further, the lens body 2 is soaked in the second material film layer 4, one section of the lens body 2 is positioned on the surface of the second material film layer 4, and the surface of the second material film layer (4) can also be higher than the section of the lens body (2).
The working principle of the hemispherical microlens in the invention is as follows: part of the spherical surface of the semi-spherical micro lens is cut and removed by a plane parallel to the plane of the semi-spherical micro lens and then is soaked in the material film layer, when incident light parallel to the optical axis is incident from the side of the partially cut spherical surface of the semi-spherical micro lens, light rays passing through the cut spherical surface do not participate in forming light spots, and the half-height width of the light spots is favorably improved; rays passing through an uncut sphere will form a focal spot with a longer working distance as they are farther from the optical axis. Therefore, compared with the corresponding standard microsphere lens and the corresponding hemispherical lens, the hemispherical microlens has longer working distance, narrower (sub-wavelength) focal spot center half-height width and higher light intensity when parallel light along the optical axis with a certain range of wavelengths is irradiated.
Further, the adhesive film further comprises a third substrate 8 and a second adhesive film layer 7, wherein two sides of the second adhesive film layer 7 are respectively connected with the third substrate 8 and the second material film layer 4.
Further, the third substrate 8, the second adhesive film layer 7 and the second material film layer 4 are all transparent and have good light transmission in the visible light and near ultraviolet range, the third substrate can be a substrate made of any material, the surface of the third substrate is flat and is subjected to fine polishing, and the material is softened by heating or the melting point of the material is higher than the softening temperature of the microsphere lens material by heating.
The lens body 2 can be made of any transparent dielectric material, such as polystyrene, silicon dioxide, barium titanate, etc., and the diameter of the lens body can be 300 nm-10 mm.
Further, the lens body 2 includes a single lens or a plurality of lenses, which may be a single hemispherical microlens, or a hemispherical microlens array, and may be a plurality of lenses arranged in a single layer in parallel according to the actual use situation.
Example 2
In this embodiment, there is provided a method for preparing a soaked hemispherical microlens, as shown in fig. 1, the method comprising the steps of:
s1, as shown in figures 3 and 4, self-assembling and tiling a standard microsphere lens 2 'on a first substrate 1, and sequentially growing a first material film layer 3 and a second material film layer 4 on one side, close to the microsphere lens 2', of the obtained first substrate 1;
s2, as shown in FIGS. 5 and 6, removing the first material film layer 3 ' and the second material film layer 4 ' covering the top end of the microsphere lens 2 ', and then removing the plane part of the microsphere lens 2 ' higher than the rest of the second material film 4 ' to obtain a first sample;
s3, as shown in figures 7 and 8, adhering the second substrate 6 and the side, which is removed from the microsphere lens 2 ', of the second substrate together through the first adhesive film layer 5, dissolving the residual first material film layer 3' in the first sample, and peeling off the first substrate 1 to obtain a second sample;
s4, as shown in the figures 9 and 10, removing the part, higher than the remaining second material film layer 4 ", of the other side of the microsphere lens 2 'in the second sample, and completely soaking the microsphere lens 2' in the remaining second material film layer 4" to obtain a third sample;
s5. as shown in fig. 11, 12, the third substrate 8 is bonded to the remaining second material film layer 4 "in the third sample by the second adhesive film layer 7, and the second substrate 6 and the first adhesive film layer 5 in the fourth sample are removed.
Further, said dissolving the remaining first film layer of material 3 "in the first sample and peeling off the first substrate 1 comprises: and soaking the first sample in a solution which can only dissolve the residual first material film layer 3 ", and stripping the first substrate 1 after the residual first material film layer 3" is completely dissolved. The second sample is immersed in a solution that can dissolve only the first material film 3, and does not dissolve the second material film 4, the substrate, the microsphere lens, the hemispherical lens, and the adhesive film.
Further, before the step S1, a first substrate 1 is prepared to be clean, dry and finish-polished, and the total thickness of the first material film layer 3 and the second material film layer 4 in the step S1 is smaller than the diameter of the single-layer microsphere lens.
Further, the first material film 3 and the second material film 4 are grown by physical vapor deposition, which may be one or more of electron beam evaporation, pulsed laser deposition, magnetron sputtering, resistive thermal evaporation, and other thin film growth methods.
Further, said completely immersing the microsphere lenses 2' in the remaining second material film layer 4 ″ comprises: and continuously vertically growing a second material film 4 with a certain thickness on the other side of the microsphere lens 2' in the second sample after the removal treatment by the physical vapor deposition method.
Further, the removing of the first material film layer 3 ' and the second material film layer 4 ' covering the top of the microsphere lens 2 ' is realized by one or more of ultrasonic removing, adhesive tape or adhesive film adhering removing.
Further, the removal of the microsphere lenses 2' in S2 and S4 may be performed by dry etching or wet etching.
Further, the substrate may be a substrate of any material, the surface of which is flat and polished, and the material is softened by heating or has a melting point higher than the softening temperature of the microsphere lens material, and the microsphere lens 2 may be made of any transparent dielectric material, such as polystyrene, silicon dioxide, barium titanate, etc., and the diameter range thereof may be 300 nm-10 mm.
Example 3
In an exemplary embodiment, a method of preparing an impregnated hemispherical microlens includes the steps of:
(1) preparing a clean, dry and double-sided precision polished quartz plate, wherein the size is as follows: 15 mm.
(2) And (2) tiling a certain polished surface of the quartz plate prepared in the step (1) by a gas-liquid interface self-assembly method to obtain a single-layer microsphere lens array, wherein the diameter of the microsphere is 4500nm, and the refractive index of the microsphere material is 1.55 at the wavelength of 365 nm.
(3) And (3) sequentially and vertically growing copper and magnesium fluoride on the side, provided with the microsphere lens, of the quartz plate in the step (2) by an electron beam evaporation coating method, wherein the growth rate is about 0.5nm/s, the thickness of the copper film is 2000nm, the thickness of the magnesium fluoride is 2500nm, and the total thickness is 4500 nm.
(4) And (3) removing the magnesium fluoride above the microspheres of the sample wafer obtained in the step (3) by combining ultrasonic cleaning and mechanical stripping (blue film tape stripping).
(5) And (4) horizontally placing the sample wafer obtained in the step (4) into an oven, setting the temperature in the oven to be 120 ℃, continuously heating for 24 hours, and heating and melting the part of the microsphere lens higher than the magnesium fluoride film layer and flatly spreading the part on the surface of magnesium fluoride.
(6) Etching the microsphere through reactive ion beams, wherein the gas introduced into the cavity is O2, the oxygen flow is 10cm3/min, the power is 30W, and when the planar part of the microsphere lens in the step (5) which is higher than the magnesium fluoride is just etched, the etching is stopped. The PS ball etching condition is that the etching time is 6min,
(7) preparing a PDMS film on the polishing surface of another clean dry fine polishing silicon wafer, wherein the PDMS film is adhered to the magnesium fluoride and the hemisphere array film in the step (6).
(8) Soaking the sample in dilute hydrochloric acid to dissolve the copper film and remove the quartz plate, washing the sample with deionized water, and drying.
(9) And (3) etching the microspheres by reactive ion beams, wherein the etching conditions are the same as those in the step (6), and the etching is stopped when the planar part of the microsphere lens in the step (8) higher than the magnesium fluoride is just etched away.
(10) And (3) vertically growing magnesium fluoride on the sample wafer in the step (9) by an electron beam evaporation coating method, wherein the growth rate is about 0.5nm/s, and the thickness is 2000 nm.
(11) Preparing a PDMS film on the polishing surface of another clean dry fine polishing silicon wafer, wherein the PDMS film is adhered to the magnesium fluoride and the hemisphere array film in the step (6).
Under the irradiation of parallel laser with the wavelength of 365nm transmitted along the optical axis direction, the working distance (namely focal length)/half-height width of the formed long focal spot is respectively about 8697nm and 362nm, and the effective length of the long focal spot is about 6070 nm; when the soaked hemispherical microlens liquid is soaked in deionized water without changing the illumination light, the working distance/full width at half maximum of the formed long focal spot is about 11452nm and 362nm respectively. The light intensity at the center of the focal spot was 80 times the incident light intensity for both conditions. When parallel light with the wavelength of 400nm or 325nm is selected (the soaked hemispherical micro-lens is still soaked in deionized water), the working distances of the formed long focal spots are 11439nm and 11837nm respectively, the half-height widths of the focal spots are 383nm and 333nm respectively, the focal distance is hardly changed, and the half-height width of the focal spot is also slightly changed. The soaked hemispherical microlens has the advantages of long working distance and narrow light spot half-height width, and has greater compatibility to the working wavelength, so that the hemispherical microlens has great potential to be applied to the field of far-field submicron parallel imaging and photoetching.
The above description is only an embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the specification and the drawings of the present invention, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (8)
1. Hemispherical microlens, comprising at least one lens body (2), characterized in that: the lens body (2) is as follows: selecting a surface of the standard microsphere lens (2') passing through the center of a sphere, and cutting off partial spherical surfaces on two sides of the surface passing through the center of the sphere in parallel respectively;
the hemispherical micro lens further comprises a second material film layer (4), and the lens body (2) is soaked in the second material film layer (4);
the adhesive film further comprises a third substrate (8) and a second adhesive film layer (7), wherein two sides of the second adhesive film layer (7) are respectively connected with the third substrate (8) and the second material film layer (4).
2. The hemispherical microlens as claimed in claim 1, wherein: the third substrate (8), the second adhesive film layer (7) and the second material film layer (4) are all made of transparent materials with good light transmittance.
3. The hemispherical microlens as claimed in claim 1, wherein: the lens body (2) comprises a single lens or a plurality of lenses, and the lenses are arranged in a single layer in parallel.
4. A preparation method of a hemispherical microlens is characterized in that: the method comprises a lens body cutting step: selecting a surface of the standard microsphere lens (2') passing through the center of a sphere, and cutting off partial spherical surfaces on two sides of the surface passing through the center of the sphere in parallel respectively; the lens body is soaked in a second material film layer (4), a third substrate (8) and a second adhesive film layer (7) are further arranged, and two sides of the second adhesive film layer (7) are respectively connected with the third substrate (8) and the second material film layer (4).
5. The method for manufacturing a hemispherical microlens as claimed in claim 4, wherein:
the cutting includes a first cutting and a second cutting, the first cutting including: removing the first material film layer (3 ') and the second material film layer (4 ') covering the top ends of the microsphere lenses (2 '), and then removing the plane parts of the microsphere lenses (2 ') higher than the rest of the second material film layer (4 ') to obtain a first sample;
the second cutting includes: removing the part of the other side of the microsphere lens (2 ') higher than the rest of the second material film layer (4') and completely soaking the microsphere lens (2 ') in the rest of the second material film layer (4') to obtain a third sample;
the cutting is carried out in an etching mode.
6. The method for manufacturing a hemispherical microlens as claimed in claim 5, wherein: the method further includes a first cut fixation and a second cut fixation, the first cut fixation including: bonding a second substrate (6) and the side of the microsphere lens (2 ') which is cut for the first time through a first adhesive film layer (5), dissolving the residual first material film layer (3') in the first sample, and peeling off the first substrate (1) to obtain a second sample;
the second cutting fixture comprises: bonding a third substrate (8) to the remaining second film layer of material (4 ") of the third sample via a second adhesive film layer (7);
the second cutting is fixed and then comprises an assembling step, and the assembling step comprises: the second substrate (6) and the first adhesive film layer (5) in the fourth sample are removed.
7. The method for manufacturing a hemispherical microlens as claimed in claim 6, wherein:
before the first cutting, the method comprises the steps of self-assembling and tiling a standard microsphere lens (2 ') on a first substrate (1), and sequentially growing a first material film layer (3) and a second material film layer (4) on one side, close to the microsphere lens (2'), of the obtained first substrate (1);
said completely immersing the microsphere lenses (2') in the remaining second material film layer (4 ") comprises: and continuously and vertically growing a second material film layer (4) with a certain thickness on the other side of the microsphere lens (2') in the second sample after the removal treatment by a physical vapor deposition method.
8. The method for manufacturing a hemispherical microlens as claimed in claim 6, wherein:
said dissolving the remaining first film layer of material (3 ") in the first sample and peeling off the first substrate (1) comprises: and soaking the first sample in a solution which can only dissolve the residual first material film layer (3 '), and stripping the first substrate (1) after the residual first material film layer (3') is completely dissolved.
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW500928B (en) * | 2000-03-23 | 2002-09-01 | Tomoegawa Paper Co Ltd | Optical sheet with the product method |
| JP2003053577A (en) * | 2001-08-15 | 2003-02-26 | Sumitomo Heavy Ind Ltd | Method and device for generating top flat beam and method and device for laser beam machining using the top flat beam |
| CN1532564A (en) * | 2003-03-21 | 2004-09-29 | 中国科学院西安光学精密机械研究所 | A method of manufacturing micro solid immersion lens |
| CN1739048A (en) * | 2002-11-27 | 2006-02-22 | 通用电气公司 | Polymeric optical device structures having controlled topographic and refractive index profiles |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| KR101687016B1 (en) * | 2010-01-06 | 2016-12-16 | 삼성전자주식회사 | Method of manufacturing a surface light source device |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW500928B (en) * | 2000-03-23 | 2002-09-01 | Tomoegawa Paper Co Ltd | Optical sheet with the product method |
| JP2003053577A (en) * | 2001-08-15 | 2003-02-26 | Sumitomo Heavy Ind Ltd | Method and device for generating top flat beam and method and device for laser beam machining using the top flat beam |
| CN1739048A (en) * | 2002-11-27 | 2006-02-22 | 通用电气公司 | Polymeric optical device structures having controlled topographic and refractive index profiles |
| CN1532564A (en) * | 2003-03-21 | 2004-09-29 | 中国科学院西安光学精密机械研究所 | A method of manufacturing micro solid immersion lens |
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